Advances in Interconnect Technologies: An International Journal

(AITIJ)
http://airccse.com/aitij/index.html

Scope & Topics

Advances in Interconnect Technologies: An International Journal (AITIJ) invites original and
significant contributions relating to the theory, design, performance and reliability of
interconnect, including materials, analysis, modeling and simulation of interconnect. The
journal proposes to stimulate the development of latest technology in industry and academia.
High quality review papers and short communications are also acceptable.
Research areas suitable for publication include, but are not limited to the following fields:

Topics of interest include, but are not limited to, the following

Emerging Materials
CNT/ Graphene Interconnects
Modeling and Simulation
Testing
RFIC
Optical Interconnects
Wireless Interconnects
Microstrip Lines
Analog and Mixed Signals
Dedicated Software and Systems for Developing Interconnect Technology
On-Chip and Off-Chip Interconnects
EMC/EMI
FPGA/ASICs
Fabrication Techniques
Neural Networks
Parasitics Issues
Optimization Techniques

Paper Submission

Authors are invited to submit papers for this journal through E-mail
aitijjournal@airccse.com. Submissions must be original and should not have been published
previously or be under consideration for publication while being evaluated for this Journal.

Important Dates

Submission Deadline : March 05, 2016

Notification
: April 05, 2016

Final Manuscript Due : April 25, 2016

Publication Date
: Determined by the Editor-in-Chief