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The FusionServer E9000 converged-architecture blade server enables convergence of computing, storage, networking, and management.
It provides a powerful platform for high-end carrier or enterprise applications, and is ideal for data centers, virtualization, mission-critical services, and high-performance computing.
Provides 16 slots in a 12U chassis that includes redundant Power Supply Units (PSUs), heat-dissipation modules, management modules, and switch modules.
The Huawei E9000 server can be installed in a standard 19-inch rack at a depth of at least 1m. It is available with AC or DC power setups to suit data center requirements
Hightlight
Supports a variety of services with 48 DIMMs and 15 x 2.5-inch hard disks, 6 x 3.5-inch hard disks, 12 x NVMe SSDs in a full-width slot along with 2- and 4-socket compute nodes and
support for I/O acceleration using GPUs, PCIe SSDs, and GPUs for general-purpose computing (GPGPUs)
Handles a variety of services, with modules including GE, 10 GE, 40 GE, FC, FCoE, and InfiniBand FDR with support for evolution to 100 GE and InfiniBand EDR
Supports liquid cooling system, power saving > 40%, and PUE < 1.2
Dynamic power-management functions and Platinum AC PSUs with higher than 95% power conversion efficiency minimize power consumption and heat dissipation
A passive midplane helps prevent single-point failures, while support for fully redundant function modules enables seamless switchovers
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Specification
4 slots for Huawei CX series switch modules provide a midplane switching capability of 15.6 Tbit/s
CX611 InfiniBand switch module (QDR 40 Gbit/s, FDR 56 Gbit/s): 18 x QDR/FDR uplink, 16 x QDR/FDR downlink
PSU AC/DC PSU: maximum six 3,000W/2,000W AC or six 2,500W DC hot-swappable PSUs in N+N or N+M redundancy mode
Uses HMMs in 1+1 redundancy mode, supports standard management interfaces, such as SNMP and IPMI, manages computing
and switching devices in a unified manner, and provides comprehensive management functions, such as a GUI, remote KVM,
Management virtual media, SOL, remote control, hardware monitoring, intelligent power supply, and historical power consumption
Provides value-added management features, such as multi-frame cascading management, graphic network configuration, and
stateless computing
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Power
110V/220V AC or –48V DC
Supply
Operating
5°C to 40°C
Temperature
Key Competitiveness Key feature HP C7000 G8 IBM FlexSystem Cisco UCS G3 Huawei E9000
heat dissipation for front ,rear slots and
Engineering capability power supply 1200W/100W 1200W/100W 1200W/100W 1400W/280W
Storage capability 12 12 12 15
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External SAN
Computing and storage converged External SAN Internal SAN External SAN Internal DS
40GE Y N Y Y
RoCE N Y N Y
network 16G FC N Y N N
4*PCIe 8x
2*PCIe 8x+2*PCIe
PCIe expansion PCIe resources expansion N 16x N or 2*PCIe 16x
Quantity of CPUs/Chassis 64 32 32 40
Quantity of memory
8 6 6 8
channel
Huawei FusionServer E9000 (E9000 for short) is a new-generation blade server designed for cloud computing and big data applications based on comprehensive analysis of HP's C7000 (launched in 2007),
Cisco's UCS5108 (launched in 2009) and VCE Vblock (launched in 2010).
Huawei
Customer Benefits Competitor' defense and Huawei's HTB Strategy
Advantage
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No. 1 computing
density in the industry. Competitors' defense:
Number of processors HP C7000 servers are transformed from CPU stacking to CPU+GPU heterogeneous computing.
E9000 provides high
in a 1U chassis:
computing density and
● Huawei E9000: Huawei HTB strategy:
performance.
5.3/U ● The number of GPU nodes occupies only 20% in HC cluster. Heterogeneous computing has limited application.
● HP C7000: 3.2/U ● The E9000 server (configured with CH220 IO nodes) supports CPU+GPU.
● HP C3000: 2.7/U
No. 1 storage density
High storage density ensures
in the industry. Competitors' defense: HP D2200sb DAS nodes can be combined with adjacent blades, while Vendor H CH222 nodes cannot.
high concurrent read and
Number of 2.5" hard
write performance. The
disks in a 1U chassis: Huawei's HTB strategy: A D2200sb combined with two adjacent blades provides up to 12 hard disks. However, the D2200sb cannot
concurrent read and write
● Huawei E9000: be combined with E7 4-socket blades. A 2-socket blade of E9000 provides 15 hard disks, and a 4-socket blade provides 8 hard disks.
performance is determined by
12/U Vendor H's C7000 servers do not support PCIe SSD cards, while E9000 storage nodes (except CH140 and CH240) support PCIe
PCIe bandwidth or hard disk
● HP C7000: 9.6/U SSD cards.
IOPS upper limit.
● HP C3000: 8/U
No. 1 switching
capability in the
industry. Design Competitors' defense: The E9000 provides four switch slots, while the HP C7000 provides 8 switch slots.
The E9000 backplane
bandwidth of the
supports 100GE and IB EDR,
backplane: Huawei's HTB strategy: The E9000 provides multi-plane switch modules. Two switch planes are created in a slot. The E9000 supports
maximizing return on
● Huawei E9000: 15.6 hybrid networking of Ethernet +FC SAN, IB, and FCoE modules. Except IB, all E9000 switch modules support layer3 switching, while
investment (ROI).
Tbit/s Vendor H's servers support only layer 2 switching.
●HP C7000 platinum:
6.144 Tbit/s
No. 1 engineering
capability in the Competitors' defense: The temperature of 77% data centers is set to 18°C to 21°C. It is seldom for servers to operate at 40°C. In
industry. Power supply addition, the servers operating at 40°C consume more power. The E9000 servers do not support three-phase power.
and heat dissipation This feature improves system
capability of a full- reliability and availability and Huawei's HTB strategy: ● According to statistics, 7% power consumption is generated to reduce the temperature by 1°C. Nowadays,
width slot: reduces the PUE of data the cooling devices account for more than 40% of the devices in data centers. Overcooling causes waste of energy. If the data center
● Huawei E9000:1400 centers. temperature increases by 5°C in the world, the total carbon dioxide emission will be reduced by 1.7 million tons and electricity of 24.3
W/40°C billion degrees will be saved. The E9000 servers use intelligent power management fan modules and orthogonal air duct design,
●HP C7000:1200 which consumes 5% less power at the same CPU load. ● The E9000 servers support three-phase power supply converted by PDUs.
W/35°C
Claimed
Customer Benefits Competitor' defense and Huawei's HTB Strategy
Advantage
10U chassis
● HP C7000: 4 C7000s in ● The power distribution for a cabinet in 95% data centers is 6 kW to 10 kW, which supports one high-end blade or two to
The high-density design saves
a cabinet three low-end blades.
floor space.
● Huawei E9000: 3 ● A 42U cabinet can hold three 12U E9000 servers, leaving 6U space for other devices.
E9000s in a cabinet
Supports 8
interconnected switch
modules.
The C7000 servers support a wide ● According Gartner statistics, data center converged networking will be the mainstream networking mode in the near future.
● HP C7000: provides 8
variety of switch modules, allowing ● The E9000 servers support FCoE networking as well as multi-plane networking, offering flexible configuration and
slots for switch modules
flexible networking. deployment.
● Huawei E9000:
provides 4 slots for switch
modules
Compatible with the
blade servers of the
same vendor. x86 servers account for 90% in the server market. The market share of non-x86 servers is decreasing.
x86/AMD/work ● The demand for blade tape drivers is less than 1%. If required, the E9000 server can meet customer requirements by using
High compatibility help maximize
station/Unix blades/NAS an external tape drive. The use of SAS switch modules and JBOD causes the similar cost as the IP SAN but offers poorer
ROI of customers.
gateway/blade tape reliability than IP SAN. If NAS gateway blades are used, the servers must have WSS installed on compute blades and connect
drive/SAS switch to vendor H's SAN storage. This configuration causes high costs and low reliability. Customers can achieve the same purpose
modules by using an external storage
● Huawei E9000:
supports only x86 blades.
Provides an LCD on the
front panel. The LCD helps maintenance
● HP C7000: LCD personnel learn about the server The Huawei E9000 server provides a touchscreen.
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OneView implements unified
Implements unified
management of computing, ●Huawei eSight implements unified management of servers.
management.
storage, and network resources, ● Huawei eSight and E9000 internal management modules support stateless computing, implement plug-and-play of E9000
● HP C7000: OneView
simplifying management and servers in site deployment, equipment migration, and parts replacement.
● Huawei E9000: eSight
increasing O&M efficiency.
Provides high power
efficiency and optimal
●If HP C7000 servers use common blades with high power-consuming CPUs, at least 4 to 12 memory modules must be
heat dissipation.
This feature helps reduce power configured.
● Huawei E9000: 1400
costs ● The E9000 servers support 1400 W full-width and 700 W half-width nodes, E5-2600 v2 and E7-4800/8800 v2 series
W/40°C
processors, and K1/K2/K2000/K4000 /Intel Phi PCIe cards.
● HP C7000: 1200
W/35°C
Huawei
Customer Benefits Competitor' defense and Huawei's HTB Strategy
Advantage
Competitors' defense: The CH140 compute node of E9000 provides only 8 memory slots and can be configured with a maximum of
24 memory modules. It offers poor memory performance.
No. 1 computing
computing density and ● The memory performance is determined by the communication bandwidth between the memory and the CPU. The memory
in a 1U chassis:
performance. bandwidth is determined by the maximum number of memory channels and memory frequency. The IvyBridge EP platform supports
● E9000: 5.3/U
up to 8 memory channels. The CH140 provides 8-channel memory and supports memory modules of the highest frequency. It
● UCS: 2.7/U
provides high read and write performance.
● The top two drawbacks of USC servers in clusters are long delay and poor CPU performance.
High storage density allows
No. 1 storage density large local storage space and Competitors' defense: The CH222 storage nodes of E9000 cannot provide shared storage resources to other blades.
● E9000: 12/U performance is determined by architecture allows a cabinet to provide 1000 Gbit/s (SAN 128 Gbit/s) concurrent bandwidth and 96 Gbit/s SSD (SAN 12 Gbit/s SAS)
bandwidth of the
maximizing return on
backplane: Huawei's HTB strategy: The UCS servers build a unified computing, storage, and management network based on FCoE Fabric
investment (ROI).
● E9000: 15.6 Tbit/s Interconnect. However, the networking does not support IB interconnection. The E9000 servers support multi-plane networking as well
● UCS: 1.28 Tbit/s as FCoE networking. Vendor H eSight implements unified management of servers.
Competitors' defense: The temperature of 77% data centers is set to 18°C to 21°C. It is seldom for servers to operate at 40°C. In
No. 1 engineering
addition, the servers operating at 40°C consume more power.
capability in the
reliability and availability and ● According to statistics, 7% power consumption is generated to reduce the temperature by 1°C. Nowadays, the cooling devices
capability of a full-
reduces the PUE of data account for more than 40% of the devices in data centers. Overcooling causes waste of energy. If the data center temperature
width slot:
centers. increases by 5°C in the world, the total carbon dioxide emission will be reduced by 1.7 million tons and electricity of 24.3 billion
● E9000: 1400
degrees will be saved. The E9000 servers use intelligent power management fan modules and orthogonal air duct design, which
W/40°C
consumes 5% less power at the same CPU load.
● UCS: 1200 W/35°C
Claimed Advantage Customer Benefits Competitor' defense and Huawei's HTB Strategy
● The E9000 servers support stateless computing and allow plug-and-play of blades in initial deployment, system
Unified computing Provides migration, and parts replacement.
Plug-and-play servers reduce
● The UCS5108 servers do not support IB interconnection, and the chassis does not support evolution to 100GE.
series FCoE switches to unify LAN of FI switch performs switching
● The E9000 servers offer lower expansion costs than the UCS5108 servers. E9000 servers, CX310 switches, and
FEX 2200 series I/O cards to maximum of 160 blade and
external FCoE switches with an uplink convergence ratio (blades to external switches) of 1:4 to a unified LAN+SAN
replace switch modules rack servers. The subsequent
network.
expansion cost is low.
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Unified management The FI built-in
UCS Manager implements unified
management of servers, LAN, and
SAN. The cost-efficient FEX cards Unified management reduces
Huawei eSight implements unified management of servers, LAN, and SAN device
implement management and I/O O&M costs.
connection of subracks and FI
switches. One set of FI can manage
up to 160 blade and rack servers.
Typical Configuration
•E9000 chassis
•CH121 2-socket compute node (for web, middleware, and application VM deployment)
•CH220 resource expansion 2-socket compute node
•CH222 storage expansion 2-socket compute node
•CH240 4-socket compute node (database physical machine deployment)
•Large-capacity SSD cards with application acceleration for email, ERP, CRM, databases, and BI
•CX110 and CX311 switch modules
•GE, 10GE, FCoE, and FC switching, providing a converged network to improve management convenience, flexibility, and scalability.
VDI (Virtual Desktop Infrastructure) in a box
Typical Configuration
•E9000 chassis
•CH222 storage expansion 2-socket compute node
•CX110 switch module
•PCIe SSD card
Features
•Supports 128 processor cores, 6 TB memory capacity, and up to 128 TB raw storage capacity.
•Supports 500 (heavy) to 1000 (light) virtual desktop infrastructure (VDI) users.
•Supports deployment of an OS and hot applications on PCIe SSD cards, which reduces the VDI startup peak, increases IOPS by 800%, and reduces costs by 20%.
•Supports the disk drawer and hot-swappable disks to reduce the time required to rebuild data during disk replacement.
•Supports the virtual block storage (VBS) distributed harsh table (DHT) ring to protect shared disk storage in cross-server mode.
Typical Configuration
•E9000 chassis
•CH222 storage expansion 2-socket compute node
•CH240 4-socket compute node (1.5 TB memory capacity)
•PCIe SSD card
•CX311 switch module
Features
•Provides 2-socket 24-DIMM computing capability per node. Supports 15 disks per node.
•A 4-socket 48-DIMM analysis node provides 1.5 TB memory capacity to support the memory database and real-time analysis.
•Each node provides service bandwidth of 20GE. The switch latency is in ns, which removes the IO bottleneck during the ETL process.
•The large-capacity PCIe SSD card is used for the index and hot data cache, which greatly improves the IOPS of the parallel database.
Typical Configuration
•E9000 chassis
•CH121 2-socket compute node
•CH222 2-socket storage expansion compute node (for web, middleware, application VM deployment)
•Hadoop hardware compression card
•CX110 switch module
Features
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•A NameNode 2-socket compute node can provide a cost-effective large memory with up to 768 GB memory capacity.
•A DataNode 2-socket compute node supports 15 x 2.5" disks, and provides 40GE service bandwidth (4GE per node).
•The compression card improves Hadoop performance by 20%, and reduces network traffic by more than 60%, CPU usage by over 80%, used disk space by more than 50%,
and disk I/O data read and write operations by over 50%.
Typical Configuration
•E9000 chassis
•CH121 2-socket compute node (for web, middleware, and application VM deployment)
•CH240 4-socket compute node (database physical machine deployment)
•CH280 8-socket compute node (2013)
•PCIe SSD card
•CX110 and CX311 switch modules
Features
•Supports the VM resource pool for web, application, and middleware layers and virtual NICs to increase network throughput, which ensures VM security.
•The OLTP database is deployed on physical machines, which supports stateless computing and migration, and use FC SAN for shared storage.
•Supports a large-capacity cache by using PCIe SSD cards to improve I/O performance for databases.
•Supports highly reliable redundancy for PSMs (N+1/N+N) and fan modules.
Features
•CH140 Twin Computing Node: High-density computing
•Supports 2*2-socket compute nodes in half-width slots
•Supports 64 Intel Xeon E5-2600 processors in a chassis.
•Supports 192 E5-2600 processors in a rack(3 chassises).
•Supports 12 TB memory capacity
•Supports InfiniBand QDR/FDR
•Supports InfiniBand EDR evolution
•Supports GPU and SSD resource expansion
Sample Configuration
Unit
No. Part Number Model Description Qty. Note
Qty.
E9000 Basic Package: 6 CH121v3 10G Nodes with 16*10G Uplink Switch Module
1 E9000 1
1.1 Chassis Basic Configuration
12U standard integrative module with Delivery
02301029 IT1K21E9000 1 1
Accessory
CH121 V3_Site1
2 E9000 6
2.1 Blade Basic Configuration
2.1.1 Blade MotherBoard
03056132 IT11SGCA05 Grantley EP Compute Node,CH121 V3 1 6
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DDR4 RDIMM
06200201 N21DDR432 4 24
Memory,32GB,2133MT/s,2Rank(2G*4bit),1.2V,ECC
module internally,
e.g: CX310 in this case
Huawei E9000 base with 8 compute nodes, 10GE uplink and 8G Fibre Channel connections
Part
No. Model Description Unit Qty. Qty. Note
Number
E9000 6 Compute Node with 10G Ethernet uplink and 8G SAN Package
1 E9000 1
1.1 Chassis Basic Configuration
12U standard integrative module with Delivery
02301029 IT1K21E9000 1 1
Accessory
03054675 IT1DSMMA0000 MM910,Shelf Management Module A 2 2
03030QEJ IT0E01FAN000 OSCA Fan Box 14 14
02310LKL IT1MPOWERM00 3000W platinum AC power supply unit 6 6
1.2 Switch Module
16 x 10GE uplink to switch
OUTSIDE E9000 Chassis; 32
x 10GE downlink to compute
nodes within E9000; e.g:
CX912,16*10GE Port,8*8G FC Port(4-Uplink Port CH121v3 in this case.
03056858 IT11XCUA08 2 2
Activate,Brocade),Multi-Plane Switch Module
CH121 V3_Site1
2 E9000 6
2.1 Blade Basic Configuration
2.1.1 Blade MotherBoard
03056132 IT11SGCA05 Grantley EP Compute Node,CH121 V3 1 6
2.1.2 Haswell EP CPU
Intel Xeon E5-2620 v3(2.4GHz/6-core/15MB/85W)
41020498 EHSE52620 2 12
Processor
2.1.3 DDR4 Memory
DDR4 RDIMM
06200201 N21DDR432 4 24
Memory,32GB,2133MT/s,2Rank(2G*4bit),1.2V,ECC
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Network/SAN Adapter On
Compute Node; 2 Port 10G
connect to switch module
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SOLUTIONS-1
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