Philips Semiconductors SL PLL stereo decoder and noise blanker ES FEATURES * Adjustment-free voltage controlled PLL oscillator for ‘ceramic resonator (f = 456 kHz) + Pilot signal dependent mono/stereo switching ‘+ Analog control of mono/stereo change over GENERAL DESCRIPTION ‘The TDA1591 is a monolithic bipolar integrated circuit providing the stereo decoder function and noise blanking for FM car radio applications, Product specification TDA1591 The device operates in a power supply range of Istereo blend, Stereo Noise Controller (SNC)] 7510 12V. ‘* Adjacent channel noise suppression (114 kHz) ‘* Pilot canceller ‘+ Analog control of de-emphasis; High Cut Control (HCC) * Applicable as source selector for AM/FM/cassette switching * Separate interference noise detector ‘+ Integrated input low-pass fiter for delayed noise. blanking ‘+ Noise blanking at MPX-demodulator outputs, ‘+ Internal voltage stabilization. QUICK REFERENCE DATA SYMBOL PARAMETER min. | typ. | Max. | UNIT Ve. ‘supply voltage (pin 5) 75 10 12 v le ‘Supply current - 12 = mA, Votes) ‘audio output signal (RMS value) = 900, = mV, THD total harmonic distortion - Ot 03, % ‘SIN signal-to-noise ratio = 76 = 0B Gs channel separation = 40 = @B Vurigg interference voltage trigger level = 10 = mV ORDERING INFORMATION TYPE PACKAGE. NUMBER | NAME DESCRIPTION VERSION TDA1591 DIP20_[ plastic dual in-line package; 20 leads (300 mil) ‘SOTH46-1 TOAIS91T. ‘$020 _| plastic small outline package; 20 leads; body width 7.5 mm ‘SOT163-1 1996 Sep 02 2 @™ 721082 0108035 2b mmProduct specification Philips Semiconductors TDA1591 PLL stereo decoder and noise blanker BLOCK DIAGRAM "now 180 se pesn ose ‘siueuodwoo jewierXe YM WeIBEIP YOK 1'BIL} DoreMGOUER Hes ei Jo HOO! BA SBIEMUIS (1) wowrw —wooon | aw =e * (Ev OES IVC) uBR eouRsepeIUT md " azo : #) | geen wl oa oma \ [a wn | Sem Lg at stax = ) tla lé : = . — é ay 5 = x muy rad 1 — wre i 3 fear 4V =_[- [oa fae Voratesy [DO offset voltage (pins 10 and 11) after muting = [= [2400 [mv HCC (pin 15) ‘CRasom | control range of de-emphasis 360 Figs 7 and 8 for European standard Ceo = 6.8 NF so |- 150 Jus for USA standard Capon = 10.0F 75 |- [225 |us Viesr [control voltage (pin 18 due to pin 17) in both |iower value CRasen [= JO [= [mv standards upper value CRgcem_ od -300 |- mv Noise interference detector Vera ‘rigger threshold (pin 6) fon = 120 KHZ Vegoc) = 7.7 V Be tory aay Veqoc) = 6.7 V - {100 [- [mv ‘AVe ‘voltage offset as a function of Viigg Vo tigg = 10 mV = [200 |- [mv Vo tig = 100 mV = es _[-_|v Tew "AF suppression time; pulse width = [ao [= [as hase input offset current (pins 13 and 14) during AF suppression |- [20 [- [nd time Vpuse | tigger sensitivity (pin 6) puss = 10 us =o [- [av 1996 Sep 02 7 wm 7320826 0208040 683Philips Semiconductors Product specification PLL stereo decoder and noise blanker TDA1591 Notes 1. Intermodulation suppression [Beat Frequency Components (BFC)}: Vofsignan (at 1 kHz) = Vetsianat IM2 = 7 TAT fo = (2x10 KH) - 19 kHz pious) Vogigny (2t 1 KHZ) Tapay TRS ‘measured with 91% mono signal; mos = 10 kHz of 13 KHz; 9% pilot signal 2. ARI suppression: Vegan (tt kHz) Vopr (a0 KHz 225 Fz) measured with 91% stereo signal: nog = 1 KHZ; 9% pilot signal; 6% ARI subcarrier (fg =57 KHZ; fnoa = 23 Ha; AM m = 0.6) 3. Subsidiary Communication Authorization (SCA): Matouman (OE KH2) (2:98 kez) ~ 67 Kt gy = Hf, = (2x38 kHz) ~67 kHz 87 Taio (OTS RF) measured with 81% mono signal; fnoa = 1 KH2; 9% pilot signal; 10% SCA subcarrier ( 4, Adjacent Chane! interference (ACI) Vegan (1 HE) 184 = Tony CUA RZD | Vetsgray(@t 1 KH2) ot Oe 5 f= 186 kHz ~ (5 «98 kHz) Voputous (4 KHZ) ‘measured with 90% mono signal; Imag = 1 KHZ; 9% pilot signal; 1% spurious signal (fg = 110 kHz or 186 kHz, unmodulated). IMs = f, = (3x1 kHz) ~38 kHz 57ARI = 67 kHz, unmodulated). = 110 kHz ~ (3x38 kHz) 1996 Sep 02 8 mB 7110826 0108041 SIT mmPhilips Semiconductors Product specification PLL stereo decoder and noise blanker TDA1591 A — Minx) | | o 109 200) 19) 00 Fig.3 Input signal as a function of series input resistor RI, - so ne I ey 7 ik Fy 10} - | 0 ~ 40 Fe, Ra 0) 60 =100 0 conto votage Vag_17 (mV) Fig.4 Overall signal gain as a function of feedback resistors R2 and R3 (R1 = 150 kQ). Fig.5. Stereo blend characteristic (SNC). 1996 Sep 02 9 mm 7220825 0108042 4SbPhilips Semiconductors Product specification PLL stereo decoder and noise blanker TDA1591 0 a os ry 1 1 o | 0 + I so | L | | C | {Il | "| [2 | | 10 Ht t | | | ©. - L . ‘0 1a 107 Ope (0) Caupng capactor Cx apn 20= 10. 2) Coupling capaci Cx spn 200.1 HF Fig.6 Channel separation as a function of audio frequency. 2 - 1 7 1 oar | | o o tl e | : ++ co @ | aq 10, 1 - ‘0 1 +e ‘erty “ot (1) Vierr=0 @) Vier =-300mv, Fig.7 HCC as a function of audio frequency (pin 7 connected to GND; without pre-emphasis). 1996 Sep 02 mm 7310825 0108043 392 10Philips Semiconductors Product specification PLL stereo decoder and noise blanker TDA1591 ° sce AV 7 | ey aff aah “ - - | _ | | | | | ee | 60 “200 100 control vetape Vi5-s7(mv)—° Fig.8 HCC with frog = 10 kHz. 1996 Sep 02 7) mm 7120826 0108044 229 mmPhilips Semiconductors. Product specification PLL stereo decoder and noise blanker TDA1591 ‘TEST INFORMATION & bai | “CS aire | WH => | iif DS Co USS? | 7 agit See's b @ - e Fig.9 TDA1591 test board (component side). 1996 Sep 02 12 we 7120826 0308045 16S mMPhilips Semiconductors Product specification PLL stereo decoder and noise blanker TDA1591 PACKAGE OUTLINES. Dipz0: lastic dual in-line package; 20 leads (300 mil) SOT146-4 + seating pane tin ind t p*—-—-—-— 5 10mm toe DIMENSIONS (inch eimensions are derived trom the orginal mm dimensions) a] As | aa | es 20) unt | he, | AR | atk | ® . fe & | me jm | ow t T _ | ¥73 | oso | ass | 2502] 640 | a5, | p—q | 360 | 825 | 100 I 42 | ost | 32 | 150 | 038 | ozs | aes | ez | 25 | 782 | 305 | 700 | 8a | 02] 20 inaes | 017 | 00a | ova | 2088 | 01 | 0014 | 1060] 025 014 | 032 | 039 | 95) aoe 043 | cost | oots | ooo | tas | 24 | 9 | 9 | or2 | o3t | 03a | OO" | 9078 Note 1. Plast or metal provusions of 0.25 mm maximum per sida aro not includes ourune | REFERENCES EUROPEAN ‘ = ISSUE DATE VERSION | eo = imal PROJECTION sorts ‘S080 eae | See | 1996 Sep 02 13 mm 7120826 0108046 OT) mmPhilips Semiconductors Product specification PLL stereo decoder and noise blanker TDA1591 $020: plastic small outline package; 20 leads; body width 7.5 mm ‘SOT163-1 {Oy) THLALALA IB A A Poe ‘a IY HOU El oo co , od gio oS ° 10mm DIMENSIONS (inch dlmensions are derived from the original mm dimensions) ww fata | a fa] ase] e [ome elm lelulel y|w]y|z|e om | bas ova | oa | 120] 7a 108s 71] 4 Toa} ae tmm | 285 | Ono | 226 | 925 | 028 | aaa | ree | ra | *27 [tooo] 4 | oa | v0 | 925] 025| 07 | 4 | ge ‘mows oxo [2012 [0.086 ‘0.019 [0013] 051 | 090 042 ‘0.083 | 0043 oss] °° 0.004 | 0.089 | °°" |o.014 | 0.009] 0.48 | 0.29 | 995°} 9,29 | 9-955] o.016| 0.099] 991 | 201 | 0.008] garg Note 1. Paseo mts potions o 0.15 mm maximum pr sie een Ince ro anon er ; VERSION = = rr) Provection | 'SSUEDATE sories: vseo4 wsorane eso | She 1996 Sep 02 14 mm 7120826 0108047 738 mmPhilips Semiconductors, Product specification PLL stereo decoder and noise blanker TDA1591 SOLDERING Introduction ‘There is no soldering method that is Ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed ‘on one printed:-circuit board. However, wave soldering Is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. in these situations reflow soldering is often used. ‘This text gives a very brief insight toa complex technology. ‘A more in-depth account of soldering ICs can be found in ‘our "IC Package Databook” (order code 9398 652 90011) DIP ‘SOLDERING BY DIPPING OR BY WAVE ‘The maximum permissible temperature of the solder is 260°C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact ime of successive solder waves must not exceed 5 seconds. ‘The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the ‘specified maximum storage temperature (Tig max) W the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit, REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead{s) of the package, below the seating plane or not ‘more than 2 mm above it. f the temperature of the soldering iron bit is less than 300 °C it may remain in ‘contact for up to 10 seconds. I the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds, so REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be appliod to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. 1996 Sep 02 mm 7210826 0108048 974 15 Several techniques exist for retlowing: for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250°C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45°C. WAVE SOLDERING Wave soldering techniques can be used forall SO packages if the following conditions are observed: + A doublo-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. ‘+ The longitudinal axis ofthe package footprint must be parallel tothe solder flow. ‘+ The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. ‘Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. ‘A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS. Fix the component by frst soldering two diagonally- opposite end leads, Use only a low voltage soldering iron (less than 24 V) applied tothe flat part of the lead, Contact, time must be limited to 10 seconds at up to 300 °C, When using a dedicated tool, all other leads can be soldered in ‘one operation within 2 to § seconds between 270 and 320°C.