5330xi

The industry’s productivity

solution
5330xi

Highlights

• Fourth-generation Beam Positioner, providing

2000-points-per-second capability
• High power diode-pumped UV laser for high
productivity
• Repetition frequency of up to 90 kHz
• High quality vias as small as 25 microns
• High accuracy for improved wiring density
• Beam shaping capability
• Automatic mode change
• Open-architecture, roll-to-roll interface matches
to any PLC-based handler

Laser micromachining
UV Laser system
Drilling System

The premier choice for high-quality microvias in flexible circuits

and rigid-flexible printed circuit boards

ESI’s 5330xi UV Laser Drilling System incorporates ESI’s patented, fourth-generation, coordinated motion Beam Positioner,
delivering high speed processing with galvo capability of 2000 points per second.

The 5330xi also incorporates a high power diode pumped laser with pulse repetition frequency of up to 90 kHz. The optical
system is designed to support the various optical configurations required to meet the needs of the Flex and Interconnect
industries. The combination of a high power, high pulse frequency laser with a high speed Beam Positioner enables the
system to cut copper clad dielectrics with excellent quality, with productivity rates of up to 18,000 vias per minute for typical
copper clad material constructions.

The optional shaped beam capability guarantees excellent quality for direct ablation of non-reinforced dielectrics by means of
a highly circular beam of uniform intensity. It produces highly circular vias
with excellent bottom copper quality with no resin residue, with productivity
rates of up to 35,000 vias per minute for typical unclad single layer
materials.

An optional feature, Mode Change, allows the system to automatically

switch between the gaussian beam and the shaped beam, allowing the
system to be dynamically configured to match the material requirements.

The 5330xi incorporates a universal, open architecture, roll-to-roll

interface, allowing the system to be easily integrated with third-party or
customer-built Roll-to-Roll handlers. No external cooling water or gas is
needed, allowing for easy installation and low operating costs.

www.esi.com
 5330xi
Specifications summary

Automatic alignment and illumination

• Camera Field of View: Coarse is 30 mm and Fine is 1.5
mm diagonal
• Detection Device: CCD, monochrome
• Illumination: LED

Laser
• Type: Diode pumped, repetitively Q-switched solid state
laser
• Pulse Rate for Via Formation: 40-90 kHz
• Average Power: > 8 W @ 40 kHz work surface

System control computer

• Type: IBM® PC compatible
• Processor: Pentium® Class
• Monitor: 17” LCD flat panel
Laser beam positioning • Input Devices: Keyboard and trackball
• Type: Cross-axis with galvanometer
• (Laser beam moves in XY, part moves in Y axis) System software
• Panel Size: 533 mm x 635 mm • Operating System: Realtime UNIX (LynxOS)
• Accuracy: ± 20 μm over entire panel area • Operator Interface: X-windows/Motif
• Maximum Average Velocity: 500 mm/s • Network Compatibility:TCP/IP, NFS
• Peak Point-to-Point Move Speed: 2,000 points per • Toolpath Generation Software: esiCAM
second • Drill File Formats: DXF, ASCII, Excellon I and II, Sieb &
• Controller: DSP based, single-board 4 axis Meier and Gerber

Main stage Roll-to-roll capability

• Type: Cross axis • Software, mechanical and electrical modifications
• Motor Type: Brushless linear motors provide the capability to attach and interface web
handlers to the system with very little effort for
Secondary stage continuous roll processing (web handler not provided by
• Type: XY deflection ESI)
• Controller: High-speed digital control
Shaped beam (option)
Programmable z stage • Top Via Roundness: > 90%
• Resolution: ± 5 μm • Top Via Size: > = 25 μm
• Accuracy: ± 25 μm
• Maximum Average Velocity: > 10 mm/s Shaped beam (option)
• Repeatability: ± 25 μm • The system automatically switches between
• Travel: 25 mm the gaussian and shaped beams.This switch is
programmable through the system software giving the
Laser power control versatility to drill blind or through vias in copper clad
• Long Term Stability: ± 2.5% + 50 mW materials using the guassian beam and blind vias in
• Feedback: Closed loop unclad non reinforced materials using the shaped beam.

Zoom beam expander (option)

• The Zoom Beam Expander (ZBE ) allows for automatic
13900 NW Science Park Drive, Portland, OR 972009 changing of a shaped beam spot size without realigning
the optics.Through the system software the user can
U.S.A. China Korea Taiwan, R.O.C. select any spot size (to a ± 2 um resolution) within the
+1.800.547.5746 or +86.21.3392.7070 +82.2.3473.9900 +886.3.552.6788
+1.503.641.4141 40 um-105 um range. For smaller vias, a 25um to 75 um
Japan Singapore United Kingdom/Europe range ZBE is also available.
+81.3.3533.8444 +65.6455.5158 +44.1480.456.566

high accuracy (option)

© 2010 Electro Scientific Industries, Inc. Printed in U.S.A. ESI reserves the right to change specifications and other product information
• ± 10 μm over 300 mm x 300 mm
without notice. Effective January 2010. System and products offered by ESI and its subsidiaries are covered by issued and pending
US and foreign patents. Products mentioned are for identification purposes only and may be trademarks or registered of their respec-
tive companies. ESI, the ESI logo, and Electro Scientific Industries, Inc. are registered trademarks of Electro Scientific Industries, Inc.