 Ion Implantation

 Diffusion
 Unit: FABRICAION OF MOSFET

Integrated Circuits (IC) Technology:

An integrated circuit is a miniaturized low-cost electronic circuit consisting of

active and passive components fabricated together on a substrate.
Why we need this integrated circuit?

 miniaturization,
 Batch Processing Results in cost reduction
 Improved system reliability due to avoid of soldering
 Better functional density
 Matched devices
 Increased operation speed
 Significant reduction in the power consumption

Basically integrated circuits can be divided into two classes:

 Linear integrated circuits: IP/OP characteristics are linear Eg. OP-

Amp

 Digital integrated circuits: The circuit is either in ON state or

OFF state and not in between the 2; that means that either it can be 1 or
it can be 0.

 Hybrid or Multi chip Integrated Circuit:

Monolithic integrated circuits

“Mono” meaning a single one and “lithic” comes from the Lithos meaning
stone. Monolithic comes from the Greek words one is mono and second is
lithos; that means, single and stone; that means, that if you carve a single stone
to a sculpture, it is monolithic.

The monolithic ICs refer to a single stone or a single crystal: ingle crystal in
this monolithic integrated circuit is nothing but a silicon chip as a
semiconductor material and on top of this semiconductor material, we are
using all the passive and active components which are interconnected.

Monolithic ICs are treated as best mode of manufacturing:

 It can be made identical

 Higher reliability
 Low cost
 Manufactured in bulk
Limitations:

 Low power rating

 Isolation on IC is poor
 Inductor can’t be fabricated
 Passive components within IC will have lower values and external
connection is required from the IC PIN to acquire higher values

Thin and thick film integrated circuits:

Thin film technology refers fabrication by depositing thin films of conducting
or semiconducting materials on the surface of glass or ceramic base.

 Larger than monolithic ICs but smaller than discrete circuits.

 It can be used in higher power applications.
 It cannot be integrated with diodes and transistors
 But resistors and capacitors can be integrated.

Thick Film: It’s known as printed film circuits or screen printing or silk
screen printing. It is used to obtain desired patterns on the substrate it can be
ceramic substrate it can be paper as well.

Processes Flow:

1. Oxidation
 Thermal oxidation (physical vapour deposition)
 Plasma Enhanced chemical vapour deposition.
2. Deposition
 PECVD
 Thermal
 E beam evaporation
 Sputtering
 LPCVD
 LPCVD
 PECVD
3. Photolithography
4. Diffusion/Ion Implantation