18CH12 Unit-III Corrosion 9-10-2019

Unit-III : Corrosion Science and control
Teaching hrs = 9hr, Total Marks = 20 marks , Part-A : 4 marks (1mark 2

questions and 2 mark 1 question) Part-B: Q.No: 4 or 5 (a,b,c,d) = 16 marks
Dr. MANJUNATHA. C, M.Sc, Ph.D

Assistant Professor,
Dept. of Chemistry, RVCE
Dr. Manjunatha C, Asst. Prof. CHEMISTRY,

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Corrosion of metals:
It is a spontaneous deterioration or loss of metal due to electrochemical red-ox
Reaction, when it is exposed to corrosive environment. Ex: Rusting of Iron
Need for Control

Corrosion causes a
Global Annual Damage
of $2.2 Trillion USD !!!!!
Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

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Why do metal corrode?
Metals have high free energy content and electropositive in nature than their
respective compounds.
For example:
Iron oxide is more stable than Iron,
Copper sulfate is more stable than copper
Magnesium oxide is more stable than Mg metal
Types of corrosion:
1) Dry corrosion: Corrosion in the absence of moisture/aqueous medium.
It is a direct chemical action of atmosphere gases like CO2, SO2, Cl2,
etc or to strong acids, Alkali. on Metals,
Ex: Most of the Alkali (Li, Na, K, Rb, Cs) and alkaline earth metals( Mg, Ca,
Ba) undergo dry corrosion
 Oxidation by Oxygen in absence of moisture
 Liquid metal corrosion: Molten metal passing through another metal (at
High temperature during metallurgical refining process)
 Metal exposed to strong acids, Alkali.

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2) Wet Corrosion: Corrosion in the presence of moisture.
Ex: Rusting of Iron

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Rusting of Iron: Electrochemical theory of corrosion
1) When Iron is exposed to wet corrosive environment, large number of
tiny Galvanic cells are formed.
2) The more aerated aqueous medium acquires electron accepting
tendency, becomes cathodic area.
H2O + ½ O2 + 2e- 2OH-
3) The metal exposed to less aerated aqueous medium acquires electron
donating tendency, becomes anodic area.
4) These two anodic and cathodic area exists very close to each other,
then spontaneous red-ox reaction take place.

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Rusting Reactions:
At anodic area: Fe Fe2+ + 2e-
At Cathodic area:
H2 Evolution O2 Absorption
(absence of O2) (Presence of O2)
Acidic (pH˂7) 2H+ + 2e H2 2H+ +1/2 O2 + 2e H 2O
Basic/Neutral 2H2O + 2e 2OH- + H2↑ 2H2O + 1/2 O2 + 2e 2OH-

(pH≥7)
Overall Reaction:
Fe2+ + 2OH- Fe(OH)2↓ (it precipitates near cathode)
When it is further exposed to air
4Fe(OH)2 + O2 + 2H2O 2Fe2O3.3H2O or Fe(OH)3
Rust-Reddish brown

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Galvanic series vs Electrochemical series
Galvanic series: It is series of arrangement of metals and alloys in decreasing order of
corrosion tendency, measured in sea water.

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Electrochemical series Galvanic series
Pt Pt
Ag Au
Cu Ti (passivation)
H2 Passive stainless steel
Pb Ag
Sn Cu-Ni alloy
Ni Bronze
Co Cu
Fe Brass
Cr Sn
Zn Pb
Ti Pb-Sn alloy
Al Active stain less steel

Mg Cast Iron
Ca Low C –steel
Al (passivation)
K Zn
Li Mg-alloy
Mg
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Differences between
Electrochemical series and Galvanic series
Reduction tendencies metals/non-metals Corrosion tendency of metals/alloys
measured w.r.t to SHE measured in sea water
It includes metal and non-metals It includes metals and alloys (no non-
metals)
Position of metals are permanently fixed Position of metals and alloys are my
shift at different conditions of corrosion.
Passivation metals is not considered Passivation metals/alloys is considered
No position for alloy Well defined position for alloys
This is measured with respect to reduction This is measured with respect to weight
tendency in solution of its own ions by loss tendency in standard sea water
connecting to SHE
It includes solids (metals/non-metals), Includes only solids (metals/alloys)
liquids (Br2, Hg, H2O, H2O2 etc) and also
gases (Cl2, F2, H2, O2, etc)

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Types of corrosion
1) Galvanic or Differential metal corrosion:
This corrosion take place when two metals or alloys of different position in galvanic
series are in contact.
Metal/alloy with higher corrosion tendency position in galvanic series acts as Anode
Metal/alloy with lower corrosion tendency position in galvanic series acts as Cathode
Metal-1 Metal-2
Metal-1 has higher corrosion tendency than Metal-2

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2) Differential Aeration Corrosion:
This corrosion take place when a metal/alloy is exposed to corrosion environment
having different Oxygen concentration.
a) The area of the Metal/alloy exposed to lower concentration of oxygen acts as

Anodic area.
b) The area of the Metal/alloy exposed to higher concentration of oxygen acts as
cathodic area. There two types a) Waterline b) Pitting corrosion.
(a) Water line corrosion:
When Metal/alloy exposed partially to water, the area which is not exposed to water
is more aerated acts as cathodic area, and the area which immersed in water is
less aerated acts as anodic area.

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(b) Pitting corrosion: A deep narrow corrosive attack.
It is localized and intense corrosion, propagates inside the metal leading to pits, or
small holes.
 When Metal/alloy exposed dirt/dust, the area which is not exposed to dirt/dust is more
aerated acts as cathodic area, and the area which covered by dirt/dust is less aerated
acts as anodic area.
 Small anodic area and large cathodic area results into intense corrosion at
anode.
 Weight loss is marginal but effect is more.

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3) Stress corrosion:
When the metal/alloy under uneven mechanical load or stress, that leads to
formation of Anodic and cathodic area.
The area under stress is anodic area, and the area not under stress is cathodic
area.
 Metal atoms under stress are compressed in their crystal system, to nullify the
stress they reduce their size by undergoing oxidation.
Ex: Bent nails, edges of nails, bent iron rod

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Factors influencing corrosion
1) Nature of metal:
Metal with low reduction potential (highly electropositive) has higher corrosion
tendency and vice versa.
Ex: a Zn Al The SRP values of metals and passivation
Ex: b Fe Cu Mg Ag The difference in SRP values of metals
Ex: c Fe 100% pure Fe 80% pure The percentage purity of metals

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2) Nature of corrosion product
If the corrosion product is
Soluble Insoluble
Volatile Non-volatile
Non-adherent Adherent
Non-stoichiometric Stoichiometric
Porous Non-porous
Conducting Insulator
More CORROSION No/Less CORROSION
Ex: Fe2O3, Ex: Al2O3,

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4) Polarization:
Change in the deviation of SRP values from actual values due to accumulation of
charges on cathodic anodic area non-uniformly.
At anodic area: Due to increase in the accumulation of positive charge at anode, it
suppresses further oxidation of Fe. This is called Anodic polarization.
At cathodic area: Due to decrease in concentration of O2, and H2O, the tendency
to accept electron reduces. This is called Cathodic polarization.
The increase in polarization, corrosion decreases.

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5) pH of the wet corrosion medium:
Lower the pH, higher the acidic, higher the concentration of H+ ion.
2H+ + 2e H2
Exception: Al/Al2O3 (Amphoteric),
if pH<7, Al2O3 film is very stable, no further corrosion.
if pH>7, Al2O3 film is very reactive, (dissolves) so more corrosion.
6) Temperature:
If the temperature increases,
 conductivity of the medium increases
 adherence property of the film decreases
 passivation decreases
 volatility of the corrosion product increases
solubility of the corrosion product increases
Hence corrosion also increases

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Corrosion control:
Creating a barrier between metal surface and corrosion environment.
1) Metallic Coating: coating of metal with another metal
a) Anodic metallic coating: Galvanization
b) Cathodic metallic coating: Tinning
2) Inorganic coating: Chemical Conversion coating

a) Phosphating b) Anodizing
3) Organic Coating:
a) Paints b) Enamels c) Lacquers
Before coating:
1) Cleaning of the Object:
a) Sand blasting, polishing, Grinding : removing dust, making surface uniform.
b) Washing with organic solvents like toluene, CCl4, and CH2Cl2: to remove grease
and other organic dust.
c) Washing with NaOH: to remove acidic impurities
d) PICKLING: it is the process of removing rust from the object using 10% H2SO4 at
75°C.
e) Washing with water and then drying the object for COATING.
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Metallic Coating:
Methods of metallic coating: 1) Hot dipping, 2) Electroplating, 3) Metal cladding 4)
cathodic sputtering 5) Metal Spraying 6) Vacuum coating 7) Cementation;
Hot Dipping method:
a) Anodic metallic coating: It is the process of coating the metal, which is more anodic
nature, on the surface of base metal (cathodic).
Ex: Galvanization: It is the process of coating of Zn layer on Fe/steel objects.
Anodic: Zn, Cathode: Iron/steel.
Process: 1) Cleaning, Drying of iron/steel object to be coated.
2) The cleaned Fe/steel object is made to pass through molten zinc (m.pt=419°C) taken
in a container as shown below. The surface of molten zinc is covered with NH4Cl flux,
which prevents the oxidation of melted Zn. The Fe/steel object coated with Zn is further
passed through rollers to make surface smooth and uniform.

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2) Cathodic metallic coating: It is the process of coating the metal which is
cathodic in nature with respect to base metal.
Ex: Tinning: Coating of molten Tin (Sn) on the surface of Fe/steel object by hot dipping
process.
Step 1) Cleaning of the Fe/steel objects
2) Coating by hot dipping process: The metal objects are made to pass through ZnCl2
tank followed by molten Tin (m.pt = 220°C) in another tank covered by palm oil , which
prevents further oxidation of Tin. The coated abject surface is made uniform, smooth
and dried.
(Caution?? Tinning should be uniform, if any small uncoated dots are
present, which forms small anodic area covered with large cathodic (
coated area) area leads to intensive pitting corrosion.)

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Inorganic Coating OR Chemical conversion coating:
The surface of the Metal is converted into its oxide/phosphate, which acts as protective
barrier of corrosion.
1) Phosphating:
In this process metal surface is converted to metal phosphate using
phosphoric acid, in the presence of catalyst.
Chemicals required:
H3PO4, which reacts with surface Fe, converts to Fe3(PO4)2.
Mn/Zn-phosphates increases adherence property and decreases porosity of
the layer.
Peroxide, nitrates, chromates as Catalyst.
Conditions: temp:35-40°C, pH=3
Fe + 2H3PO4 Fe/ Fe3(PO4)2.
Note: Phosphating cannot be achieved 100% coating/conversion.

It is highly porous. Therefore, it is generally used for primer coat before
painting. It increases adherence of paint.

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2) Anodizing of Aluminium:
The conversion of surface of Al object into Al2O3 by inducing current in the oxidizing
environment, by making it As anode.
Process: Anode: Al object, cathode: Pb/Steel
Oxidising agent: Chromic acid
The Al object is made as anode by connecting to Pb/steel cathode, both are placed in
chromic acid at 40°C. The current of voltage 40-60V from DC source is induced, Al
surface under goes oxidation as follows:
2Al + 3H2O Al/Al2O3 + 3H2
The Al2O3 layer formed on surface of Al is porous in nature, therefore after

anodising, the Al object is subjected to SEALING: The process of filling the
pore by dipping in hot water. During sealing, Al2O3, undergoes hydration
forming non porous Al2O3.H2O.

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Metal finishing:
Metal finishing is the process of deposition of a uniform non-porous layer of one metal on
the surface of substrate.
There are two important techniques of metal finishing
1) Electroplating
2) Electroless plating.
Technological importance of metal finishing:

Metal finishing is carried out to obtain technologically important surface properties.
These properties are:
•A decorative appearance.
•An improved corrosion resistance.
•An improved heat resistance.
•An improved surface hardness.
• An improved resistance to wear and tear.
• An improved resistance to abrasion.
•An improved solderability.
•Good thermal conductivity.
•Good electrical conductivity.
•Good optical reflectivity.

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Electroplating: Introduction, Principle, Factors influencing nature of deposition, Chrome Plating.
Electroplating:
Definition: Electroplating is the process of electrolytic deposition of a metal on the surface of
another metal; the substrate may be another metal, a polymer, a ceramic or a composite
Principal components of an electroplating process: The principal components are shown in

the following figure.
DC power
Supply ne-
ne-
Anode + __ Cathode
__
__
__ Electroplated
__
Metal layer
Electrolyte

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The main components are:
1) Electroplating bath: It contains a suitable salt solution of the metal being plated. It also
contains other additives.
2) Anode: It may be a rod or pellets of the metal being plated. It may be an inert electrode.
It should be electrically conducting.
3) Cathode: It is the article to be plated. It should have an electrically conducting surface.
4) Inert vessel: It contains above mentioned materials. It may be a vessel made of rubber
lined steel, plastic concrete or wood.
5) D.C. power supply: The positive terminal of the power supply is connected to the anode
and the negative terminal is connected to the cathode.

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Effect of plating variables on the property of electrodeposit:
1. Current density: When the current density is low, the metal is deposited
slowly. There is enough time for the metal nuclei to grow, and there is little scope
for the creation of new nuclei. Thus the deposits produced are gross grained.
Within certain limits, an increase in current density increases the rate of
deposition and decreases the crystal size. This results in fine grained uniform
deposit.
When the current density is high (below the limiting value), a bad deposit
with rough and powdery texture results.
When the current density is very high (above the limiting value), hydrogen
evolution also occurs at the cathode. This results in the formation of OH- ions in
the vicinity of cathode. These OH- ions react with the metal ions forming
insoluble metal hydroxides. When these hydroxides are included with in the
electrodeposit, a burnt and spongy deposit results.
In general, for a particular bath, the optimum current density is
experimentally determined and applied.

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2. Metal ion concentration: A decrease in metal ion concentration decreases the
crystal size and results in fine deposit. Therefore, the free metal ion concentration
is kept low.
A low metal ion concentration may be achieved by the addition of a compound
with a common ion (e.g. addition of H2SO4 to CuSO4) or by the addition of a
complexing agent (e.g. addition of NaCN to CuCN to get low concentration of Cu+
3. Other electrolytes: Other electrolytes are added to increase the conductivity

of the solution. With increased conductivity, it is possible to use higher current
densities without adversely affecting the quality of the electrodeposit. A higher
current density means a higher rate of deposition.
(Note: Other electrolytes do not participate in electrode reactions. They are added
to just to increase the conductivity of the electrolytic bath.)
4. Complexing agents: Complexing agents are used to maintain a low metal ion
concentration. (e.g. addition of NaCN to CuCN to get low concentration of Cu+ ).
Low metal ion concentration decreases the crystal size and results in fine deposit.
Complexing agents are also used to improve the throwing power of the bath.
Higher the throwing power, more uniform is the deposit.

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5. Organic additives: To improve the quality of electrodeposit certain organic
compounds are added to the electrolytic bath. These are a) brighteners, b)
levellers, c) structure modifiers and d) wetting agents.
a. Brighteners: Brighteners are added to get bright deposits. e.g. Aromatic
sulphones, sulphonates, thiourea etc. in Ni plating.
Brighteners get adsorbed on the already formed metal nuclei leading to
formation of new nuclei. In this way, more number of smaller crystals are formed
resulting in fine grained deposit.
(Note: When the grain size of the electrodeposit is lower than the wave length of
the incident light, the light gets reflected, but not scattered. Thus the deposit
appears bright.)
b. Levellers: Levellers are added to get a level deposit. e.g. Sodium allyl
sulphonate in Ni plating.
Levellers get preferentially adsorbed at places where rapid deposition is taking
place, thus preventing the excessive growth in those places.
c. Structure modifiers (Stress relievers): Structure modifiers are added to
change the orientation of the crystals with respect to surface of the substrate.
Thus, development of internal stresses is prevented. e.g. Saccharin.
d. Wetting agents: Wetting gents are added to remove any hydrogen
sticking to the cathode surface. Thus they prevent hydrogen embrittlement of the
deposit. e.g. Sodium lauryl sulphate.

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6. pH: At low pH values, liberation of hydrogen occurs at the cathode resulting
in a burnt deposit. On the other hand, at high pH values, the cathode surface
gets coated with insoluble hydroxides. Therefore, for most of the plating
processes, a pH range of 4-8 is optimum. The desired pH is maintained
using suitable buffers. (e.g. borate buffer in Ni plating)
7. Temperature: At higher temperatures, surface diffusion of atoms is higher

and so a good deposit is obtained. However, too high a temperature may
lead to i) evolution of hydrogen at the cathode, ii) corrosion of process
equipment and iii) decomposition of the organic additives. Therefore, a
moderate temperature range of 35 – 60 oC is used for most of the plating
processes.
8. Throwing power of the plating bath: Higher the throwing power of the
plating bath, more uniform is the deposit.
(Note: Throwing power is defined as the degree of uniformity of the metal

deposit on a cathode of irregular shape.)

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Surface preparation:
Importance of surface preparation before electroplating: A good adherent deposit
is obtained only if the substrate surface is free from dirt, grease, oxide scale and
rust. Therefore it is necessary to clean the surface thoroughly before
electrodeposition. If bright deposits are required, the surface must be smooth.
Surface cleaning involves following steps:

1. Removal of organic substances – solvent cleaning, alkali cleaning.
2. Removal of inorganic substances – mechanical cleaning, pickling.
3. Rinsing with water.
1. Removal of organic substances – degreasing process:
a) Organic solvent cleaning: It is used to remove oils, greases etc. from the
surface. For cleaning, organic solvents such as trichloro ethylene (CCl2 =
CHCl), methylene chloride (CH2Cl2 ), carbon tetra chloride (CCl4 )etc. are used.
In vapour phase degreasing method, vapours of the solvent (trichloro
ethylene) are allowed to condense on the metal surface. The condensed liquid
washes away the oil, grease and other organic matter from the surface.
b) Alkali cleaning: Residual oil and grease from the surface is removed by
treatment with alkaline solutions (NaOH, Na2CO3 etc.) Alkali cleaning is made
more effective by making the metal cathodic in a hot alkali solution. The hydrogen
gas liberated at the cathode helps to dislodge the greasy matter.
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2. Removal of inorganic substances – descaling process:
a) Mechanical cleaning: It is used to remove oxide scales and rust from the
metal surface. Simple mechanical cleaning involves hand cleaning using sand
paper, bristle brush etc. Other methods involve polishing the surface i) using
grinding wheels, ii) by sand blasting and iii) by electropolishing.
b) Pickling: It is used to remove oxide scales and rust present on the metal
surface by dissolution. Pickling involves dipping the object in dilute acids (HCl,
HNO3, H2SO4 or a mixture) for considerable period of time.
3) Rinsing with water: The object is finally rinsed with deionized water.

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Electroplating of chromium
The surface of the object is cleaned thoroughly. Organic substances are removed
by solvent cleaning and alkali cleaning. Inorganic substances are removed by
mechanical cleaning and pickling. Finally, the surface is washed with deionized
water. Then, chromium plating is done under the following bath conditions.
1.Plating bath composition Chromic acid (H2CrO4) + H2SO4

in the weight ratio 100 : 1
2.Operating temperature 45-60 oC
3. Current density 100 – 200 mA cm-2
4. Anode Insoluble anode: Pb-Sb or Pb-Sn alloy
coated with PbO2.
5. Cathode Object to be plated
6. Anodic reaction Liberation of oxygen: H2O 1/2 O2 + 2H+ + 2e-
7. Cathodic reaction Cr3+ + 3e- Cr
8. Applications 1. Used in decorative coating.
2. Used in corrosion resistant coating.

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Process: In chromic acid, chromium is present in 6+ oxidation state. It is first
reduced to 3+ state by a complex anodic reaction in the presence of sulphite ions.
The Cr3+ then gets reduced to Cr on the substrate surface. For a good deposit,
the Cr3+ concentration must be low. The PbO2 oxidizes a part of Cr3+ to Cr6+, thus
reducing the concentration of Cr3+.
In chromium plating we do not use chromium metal as anode due to the
following reasons.
•If chromium dissolves at anode, there will be a high concentration of Cr3+ in
solution. In such cases, a black deposit is obtained.
•In acidic solutions, chromium may undergo passivation.

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Electroless plating- Introduction, Principle, Distinction between electro plating and
electroless plating. Application: Electroless plating of Cu-Fabrication of PCB.
ELECTROLESS PLATING
Definition of electroless plating: Electroless plating is a method of depositing a
metal over a substrate by controlled chemical reduction of metal ions by a
suitable reducing agent without using electrical energy.
Composition of an electroless plating bath:

An electroless plating bath contains the following components:
1. A source of electroactive metal in the form of a soluble salt. e.g. NiCl2, CuSO4
2. Reducing agent to reduce metal ions into metal atoms. e.g. Sodium
hypophosphite, formaldehyde.
3. Complexing agents to form complex compounds with metal ions.
4. Exaltant (accelerator) to increase the rate of plating.
5. Stabilizer to give more stability to solution.
6. Addition agents such as brighteners.
7. Buffer to control pH.

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Electroless plating of Copper
Before electroless plating, the surface is cleaned thoroughly. Insulators such as
plastics and printed circuit boards are activated by dipping first in stannous chloride
(SnCl2) and then in palladium chloride (PdCl2). Then, the electroless plating is done
under the following conditions:
1. Plating bath solution : CuSO4
2. Reducing agent : Formaldehyde (HCHO)
3. Complexing agent and exaltant : EDTA
4. Buffer (pH = 11) : Sodium hydroxide and Rochelle salt (Na-K-tartrate)
5. Temperature : 25 oC
6.Anode reaction: 2HCHO + 4OH- 2HCOO- + 2H2O + H2 + 2e-
7.Cathode reaction: Cu2+ + 2e- Cu
8.Overall reaction: 2HCHO + 4OH- + Cu2+ 2HCOO- + 2H2O + H2 + Cu
Formaldehyde and copper sulphate are added to the plating bath periodically.
Applications: 1. Used for metalizing printed circuit boards.

2. Used to produce through-hole connections.
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Through-hole connection is PCB’s:
For PCB’s with double sided circuits, through-hole connection is
required.
The through-hole connection is made by electroless plating

technique.
 To start with, the two sides of a plastic board is electroplated

with copper
 Selected areas are protected and the remaining areas are etched
away.
 Thus two circuits are produced on two sides.
 The connection between two sides is made by drilling hole
followed by plating through-holes by electroless plating.
 The various steps are shown in the following figure.

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Copper foil
Insulting base
Copper foil
Etching of copper to produce
tracking
Drilling of through-holes
Activation of surface, then

electroless copper plating
metalize the through-hole
Copper electroplating to build up

deposits thickness

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Distinction between electroplating and electroless plating:
Property Electroplating Electroless plating

1. Driving force Power supply Autocatalytic redox reaction
M Mn+ + ne- OR Reducing agent  Oxidized
2. Anode reaction product + n e-
H2O 1/2O2 + 2H+ + 2e-
3. Cathode reaction Mn+ + ne- M Mn+ + ne- M
4. Site of anode Separate anode Article to be plated
reaction
5. Site of cathode Article to be plated Article to be plated ( with a
reaction catalytic surface)
6. Anode reactant M or H2O Reducing agent
Usually metal contaminated

7. Nature of deposit Pure metal or definite alloy with reducing agent-derived
species.

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Advantages of electroless plating:
Electrical equipment is not required.
Semiconductors and insulators can also be plated.
Electroless plating baths have better throwing power.
Electroless coatings are harder than the electrodeposited coatings.
Electroless deposits posses unique chemical, mechanical & magnetic
properties.

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18CH12 Unit-III Corrosion 9-10-2019

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Unit-III : Corrosion Science and control

Teaching hrs = 9hr, Total Marks = 20 marks , Part-A : 4 marks (1mark 2

Dr. MANJUNATHA. C, M.Sc, Ph.D

Dr. Manjunatha C, Asst. Prof. CHEMISTRY,

Need for Control

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

Basic/Neutral 2H2O + 2e 2OH- + H2↑ 2H2O + 1/2 O2 + 2e 2OH-

4Fe(OH)2 + O2 + 2H2O 2Fe2O3.3H2O or Fe(OH)3

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

Al Active stain less steel

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

Metal-1 has higher corrosion tendency than Metal-2

a) The area of the Metal/alloy exposed to lower concentration of oxygen acts as

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

Ex: Bent nails, edges of nails, bent iron rod

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

Ex: a Zn Al The SRP values of metals and passivation

Ex: b Fe Cu Mg Ag The difference in SRP values of metals

Ex: c Fe 100% pure Fe 80% pure The percentage purity of metals

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

2) Inorganic coating: Chemical Conversion coating

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

Fe + 2H3PO4 Fe/ Fe3(PO4)2.

Note: Phosphating cannot be achieved 100% coating/conversion.

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

The Al2O3 layer formed on surface of Al is porous in nature, therefore after

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

Technological importance of metal finishing:

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

Principal components of an electroplating process: The principal components are shown in

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

3. Other electrolytes: Other electrolytes are added to increase the conductivity

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

7. Temperature: At higher temperatures, surface diffusion of atoms is higher

(Note: Throwing power is defined as the degree of uniformity of the metal

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

Surface cleaning involves following steps:

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

1.Plating bath composition Chromic acid (H2CrO4) + H2SO4

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

Composition of an electroless plating bath:

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

Applications: 1. Used for metalizing printed circuit boards.

The through-hole connection is made by electroless plating

 To start with, the two sides of a plastic board is electroplated

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

Activation of surface, then

Copper electroplating to build up

Dr. MANJUNATHA.C Asst. Prof CHEMISTRY,

Property Electroplating Electroless plating

Usually metal contaminated