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5964-6381E 3-175
Absolute Maximum Ratings
Supply Voltage, VDD to Ground ...................................... -0.5 V to 7.0 V
Input Voltage, Any Pin to Ground ........................ -0.5 V to VDD + 0.5 V
Free Air Operating Temperature Range, TA[1] ............... -40°C to +85°C
Relative Humidity (non-condensing) at 65°C ................................. 90%
Storage Temperature, TS .............................................. -40°C to +85°C
Maximum Solder Temperature, 1.59 mm (0.063 in.)
below Seating Plane, t < 5 sec. ................................................ 260°C
ESD Protection @ 1.5 kΩ, 100 pF ...................... VZ = 2 kV (each Pin)
Package Dimensions
HPDL-1414
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HPDL-2416
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DC Electrical Characteristics over Operating Temperature Range
25°C 25°C
Parameter Sym. Min. Typ. Max. Max.[1] Units Test Conditions
Input Current IIL
HPDL-1414 17 30 50 µA VDD = 5.0 V, BL = 0.8 V
HPDL-2416 17 30 40 µA
IDD Blank IDD (BL)
HPDL-1414 1.2 2.3 4.0 mA VDD = 5.0 V, BL = 0.8 V
HPDL-2416 1.5 3.5 8.0 mA
IDD 4 Digits ON
(10 Segments/digit)[2,3] IDD
HPDL-1414 70 90 130 mA VDD = 5.0 V
HPDL-2416 85 115 170 mA
IDD 4 Digits ON Cursor[4] IDD(CU) 125 165 232 mA VDD = 5.0 V
HPDL-2416
Input Voltage High VIH 2.0 VDD V
Input Voltage Low VIL GND 0.8 V
Power Dissipation[5] PD
HPDL-1414 350 450 715 mW VDD = 5.0 V
HPDL-2416 425 575 910 mW
Notes:
1. VDD = 5.5 V.
2. “%” illuminated in all four characters.
3. Measured at five seconds.
4. Cursor character is sixteen segments and DP ON.
5. Power Dissipation = (VDD)(IDD) for 10 segments ON.
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AC Timing Characteristics over Operating Temperature Range at VCC = 4.5 V
Parameter Symbol -20°C tMIN 25°C tMIN 70°C tMIN Units
Address Setup Time tAS 90 115 150 ns
Write Delay Time tWD 10 15 20 ns
Write Time tW 80 100 130 ns
Data Setup Time tDS 40 60 80 ns
Data Hold Time tDH 40 45 50 ns
Address Hold Time tAH 40 45 50 ns
Chip Enable Hold Time[1] tCEH 40 45 50 ns
Chip Enable Setup Time[1] tCES 90 115 150 ns
Clear Time[1] tCLR 2.4 3.5 4.0 ms
Access Time 130 160 200 ns
Refresh Rate 420-790 310-630 270-550 Hz
Note:
1. HPDL-2416 only.
Timing Diagram
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Character Set
HPDL-1414 HPDL-2416
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Electrical Description operation, the divide-by-four ASCII RAM, the display character
Display Internal Block counter sequentially accesses is blanked.
Diagram HPDL-1414 each of the four RAM locations
Figure 1 shows the internal block and simultaneously enables the Data Entry HPDL-1414
diagram of the HPDL-1414. It appropriate display digit driver. Figure 2 shows a truth table for
consists of two parts: the display The output of the RAM is decoded the HPDL-1414. Data is loaded
LEDs and the CMOS IC. The by the character generator which, into the display through the
CMOS IC consists of a four-word in turn, enables the appropriate DATA inputs (D6-D0), ADDRESS
ASCII memory, a 64-word charac- display segment drivers. Seven- inputs (A1-A0), and WRITE (WR).
ter generator, 17 segment drivers, bit ASCII data is stored in RAM. After a character has been
four digit drivers, and the Since the display uses a 64- written to memory, the IC
scanning circuitry necessary to character decoder, half of the decodes the ASCII data, drives
multiplex the four monolithic possible 128 input combinations the display and refreshes it
LED characters. In normal are invalid. For each display without any external hardware or
location where D5 = D6 in the software.
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If the clear input (CLR) equals
zero for one internal display cycle
(4 ms minimum), the data in the
ASCII RAM will be rewritten with
zeroes and the display will be
blanked. Note that the blanking
input (BL) must be equal to
logical one during this time.
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Figure 3. HPDL-2416 Internal Block Diagram.
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ensure that the correct data is (CUE) is high. Similarly, the Display Clear HPDL-2416
stored in the display. If D0 is in a stored ASCII data words are As shown in Figure 4, the ASCII
low state during the write cycle, displayed, regardless of the data stored in the display will be
then a cursor character will be cursor characters, if the cursor cleared if the clear (CLR) is held
removed at the indicated enable (CUE) is low. The cursor low and the blanking input (BL)
location. If D0 is in a high state enable (CUE) has no effect on the is held high for 4 ms minimum.
during the write cycle, then a storage or removal of the cursor The cursor memory is not
cursor character will be stored at characters within the display. A affected by the clear (CLR) input.
the indicated location. The flashing cursor is displayed by Cursor characters can be stored
presence or absence of a cursor pulsing the cursor enable (CUE). or removed even while the clear
character does not affect the For applications not requiring a (CLR) is low. Note that the
ASCII data stored at that location. cursor, the cursor enable (CUE) display will be cleared regardless
Again, when A1 = A0 = 0, the can be connected to ground and of the state of the chip enables
cursor character is stored in the the cursor select (CU) can be (CE1, CE2). However, to ensure
furthest right-hand display connected to VCC. This inhibits that all four display characters
location. the cursor function and allows are cleared, CLR should be held
only ASCII data to be loaded into low for 4 ms following the last
All stored cursor characters are the display. write cycle.
displayed if the cursor enable
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Display Blank HPDL-2416 1414 and 2 metres (6 feet) for The HPDL-1414/2416 are assem-
As shown in Figure 4, the display the HPDL-2416. bled by die attaching and wire
will be blanked if the blanking bonding the four GaAsP/GaAs
input (BL) is held low. Note that Each HPDL-1414/2416 display is monolithic LED chips and the
the display will be blanked tested for luminous intensity and CMOS IC to a high temperature
regardless of the state of the chip marked with an intensity category printed circuit board. An
enables (CE1, CE2) or write (WR) on the side of the display immersion lens is formed by
inputs. The ASCII data stored in package. To ensure intensity placing the PC board assembly
the display and the cursor matching for multiple package into a nylon lens filled with
memory are not affected by the applications, mixing intensity epoxy. A plastic cap creates an
blanking input. ASCII data and categories for a given panel is not air gap to protect the CMOS IC.
cursor data can be stored even recommended. Backfill epoxy environmentally
while the blanking input (BL) is seals the display package. This
low. Note that while the blanking The HPDL-1414/2416 display is package construction provides
input (BL) is low, the clear (CLR) designed to provide maximum the display with a high tolerance
function is inhibited. A flashing contrast when placed behind an to temperature cycling.
display can be obtained by appropriate contrast enhance-
applying a low frequency square ment filter. For further informa- The inputs to the CMOS IC are
wave to the blanking input (BL). tion on contrast enhancement, protected against static discharge
Because the blanking input (BL) see Hewlett-Packard Application and input current latchup.
also resets the internal display Note 1015. However, for best results
multiplex counter, the frequency standard CMOS handling
applied to the blanking input Mechanical and Electrical precautions should be used. Prior
(BL) should be much slower than Considerations to use, the HPDL-1414/2416
the display multiplex rate. Finally, The HPDL-1414/2416 are dual in- should be stored in anti-static
dimming of the display through line packages that can be stacked tubes or conductive material.
the blanking input (BL) is not horizontally and vertically to During assembly a grounded
recommended. create arrays of any size. These conductive work area should be
displays are designed to operate used, and assembly personnel
For further application informa- continuously between -40°C to should wear conductive wrist
tion please consult Application +85°C with a maximum of 10 straps. Lab coats made of
Note 1026. segments on per digit. synthetic material should be
avoided since they are prone to
Optical Considerations/ During continuous operation of static charge build-up. Input
Contrast Enhancement all four Cursors the operating current latchup is caused when
The HPDL-1414 and HPDL-2416 temperature should be limited to the CMOS inputs are subjected
displays use a precision aspheric -40°C to +55°C. At temperatures either to a voltage below ground
immersion lens to provide above +55°C, the maximum (VIN < ground) or to a voltage
excellent readability and low off- number of Cursors illuminated higher than VDD (VIN > VDD) and
axis distortion. For the HPDL- continuously should be reduced when a high current is forced into
1414, the aspheric lens produces as follows: No Cursors illumin- the input. To prevent input
a magnified character height of ated at operating temperatures current latchup and ESD damage,
2.85 mm (0.112 in.) and a above 75°C. One Cursor can be unused inputs should be
viewing angle of ± 40°. For the illuminated continuously at connected either to ground or to
HPDL-2416, the aspheric lens operating temperatures below VDD. Voltages should not be
produces a magnified character 75°C. Two Cursors can be applied to the inputs until VDD
height of 4.1 mm (0.160 in.) and illuminated continuously at has been applied to the display.
a viewing angle of ± 50°. These operating temperatures below Transient input voltages should
features provide excellent 68°C. Three Cursors can be be eliminated.
readability at distances up to 1.5 illuminated continuously at
metres (4 feet) for the HPDL- operating temperatures below
60°C.
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Soldering and Post Solder 315°C (600°F). For wave For further information on
Cleaning Instructions soldering, a rosin-based RMA flux soldering and post solder
The HPDL-1414/2416 may be can be used. The solder wave cleaning, see Application Note
hand soldered or wave soldered temperature should be 1027, Soldering LED
with SN63 solder. Hand soldering 245°C ± 5°C (473°F ± 9°F), Components.
may be safely performed only and the dwell in the wave should
with an electronically be set at 11/2 to 3 seconds for
temperature-controlled and optimum soldering. Preheat
securely grounded soldering iron. temperature should not exceed
For best results, the iron tip 93°C (200°F) as measured on the
temperature should be set at solder side of the PC board.
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