Professional Documents
Culture Documents
BTA/BTB08 and T8 Series: 8A Triac
BTA/BTB08 and T8 Series: 8A Triac
MAIN FEATURES: A2
A2 A2
Symbol Value Unit
G
IT(RMS) 8 A A1 A2 A1 A2
A1
G G
VDRM/VRRM 600 and 800 V
DPAK D2PAK
IGT (Q1) (T8-B) (T8-G)
5 to 50 mA
A2
DESCRIPTION
Available either in through-hole or surface-mount
packages, the BTA/BTB08 and T8 triac series is A1
suitable for general purpose AC switching. They A2
G IPAK
can be used as an ON/OFF function in (T8-H)
applications such as static relays, heating
regulation, induction motor starting circuits... or for A2
phase control operation in light dimmers, motor
speed controllers,...
The snubberless versions (BTA/BTB...W and T8
series) are specially recommended for use on
inductive loads, thanks to their high commutation A1 A1
performances. By using an internal ceramic pad, A2 A2
G G
the BTA series provides voltage insulated tab
(rated at 2500V RMS) complying with UL TO-220AB Insulated TO-220AB
standards (File ref.: E81734) (BTA08) (BTB08)
IT(RMS) RMS on-state current (full sine wave) DPAK / D²PAK Tc = 110°C
IPAK / TO-220AB 8 A
TO-220AB Ins. Tc = 100°C
ITSM Non repetitive surge peak on-state F = 50 Hz t = 20 ms 80 A
current (full cycle, Tj initial = 25°C)
F = 60 Hz t = 16.7 ms 84
²
It ²
I t Value for fusing tp = 10 ms 36 A² s
■ STANDARD (4 Quadrants)
Symbol Test Conditions Quadrant BTA/BTB08
Unit
C B
IGT (1) I - II - III 25 50 mA
MAX.
VD = 12 V RL = 30 Ω IV 50 100
VGT ALL MAX. 1.3 V
VGD VD = VDRM RL = 3.3 kΩ Tj = 125°C ALL MIN. 0.2 V
IH (2) IT = 500 mA MAX. 25 50 mA
IL IG = 1.2 IGT I - III - IV MAX. 40 50 mA
II 80 100
dV/dt (2) VD = 67 %VDRM gate open Tj = 125°C MIN. 200 400 V/µs
(dV/dt)c (2) (dI/dt)c = 3.5 A/ms Tj = 125°C MIN. 5 10 V/µs
STATIC CHARACTERISTICS
Symbol Test Conditions Value Unit
VTM (2) ITM = 11 A tp = 380 µs Tj = 25°C MAX. 1.55 V
Vto (2) Threshold voltage Tj = 125°C MAX. 0.85 V
Rd (2) Dynamic resistance Tj = 125°C MAX. 50 mΩ
IDRM VDRM = VRRM Tj = 25°C 5 µA
MAX.
IRRM Tj = 125°C 1 mA
2/10
BTA/BTB08 and T8 Series
THERMAL RESISTANCES
Symbol Parameter Value Unit
Rth(j-c) Junction to case (AC) DPAK / D²PAK °C/W
1.6
IPAK / TO-220AB
TO-220AB Insulated 2.5
Rth(j-a) Junction to ambient S = 1 cm ² ²
D PAK 45 °C/W
PRODUCT SELECTOR
Voltage (xxx)
Part Number Sensitivity Type Package
600 V 800 V
BTA/BTB08-xxxB X X 50 mA Standard TO-220AB
BTA/BTB108-xxxBW X X 50 mA Snubberless TO-220AB
BTA/BTB08-xxxC X X 25 mA Standard TO-220AB
BTA/BTB08-xxxCW X X 35 mA Snubberless TO-220AB
BTA/BTB08-xxxSW X X 10 mA Logic level TO-220AB
BTA/BTB08-xxxTW X X 5 mA Logic level TO-220AB
T810-xxxB X X 10 mA Logic level DPAK
T810-xxxH X X 10 mA Logic level IPAK
T835-xxxB X X 35mA Snubberless DPAK
T835-xxxG X X 35 mA Snubberless D²PAK
T835-xxxH X X 35 mA Snubberless IPAK
3/10
BTA/BTB08 and T8 Series
ORDERING INFORMATION
BT A 08 - 600 BW (RG)
TRIAC PACKING MODE
SERIES Bulk: Blank
SENSITIVITY & TYPE RG: Tube
INSULATION: B: 50mA STANDARD
A: insulated VOLTAGE: BW: 50mA SNUBBERLESS
B: non insulated 600: 600V C: 25mA STANDARD
800: 800V CW: 35mA SNUBBERLESS
CURRENT: 8A SW: 10mA LOGIC LEVEL
TW: 5mA LOGIC LEVEL
T 8 10 - 600 B (-TR)
TRIAC
SERIES
PACKAGE:
CURRENT: 8A B: DPAK
VOLTAGE: G: D2PAK
PACKING MODE:
600: 600V H: IPAK
Blank: Tube
800: 800V
-TR: DPAK / D2PAK
SENSITIVITY: Tape & Reel
10: 10mA
35: 35mA
OTHER INFORMATION
Base Packing
Part Number Marking Weight
quantity mode
4/10
BTA/BTB08 and T8 Series
Fig. 1: Maximum power dissipation versus RMS Fig. 2-1: RMS on-state current versus case
on-state current (full cycle). temperature (full cycle).
Fig. 2-2: RMS on-state current versus ambient Fig. 3: Relative variation of thermal impedance
temperature (printed circuit board FR4, copper versus pulse duration.
thickness: 35µm),full cycle.
2.5
DPAK
1E-1
2.0 (S=0.5cm2) TO-220AB/D²PAK
Zth(j-a)
1.5
1E-2
1.0
0.5 Tamb(°C) tp(s)
0.0 1E-3
0 25 50 75 100 125 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
Fig. 4: On-state characteristics (maximum Fig. 5: Surge peak on-state current versus
values). number of cycles.
5/10
BTA/BTB08 and T8 Series
Fig. 6: Non-repetitive surge peak on-state Fig. 7: Relative variation of gate trigger current,
current for a sinusoidal pulse with width holding current and latching current versus
tp < 10ms, and corresponding value of I²t. junction temperature (typical values).
2.0
IGT
dI/dt limitation:
50A/µs ITSM
1.5
100 IH & IL
1.0
I²t
0.5
tp (ms) Tj(°C)
10 0.0
0.01 0.10 1.00 10.00 -40 -20 0 20 40 60 80 100 120 140
Fig. 8-1: Relative variation of critical rate of Fig. 8-2: Relative variation of critical rate of
decrease of main current versus (dV/dt)c (typical decrease of main current versus (dV/dt)c (typical
values). Snubberless & Logic Level Types values). Standard Types
Fig. 9: Relative variation of critical rate of Fig. 10: DPAK and D 2PAK Thermal resistance
decrease of main current versus junction junction to ambient versus copper surface under
temperature. tab (printed circuit board FR4, copper thickness:
35 µm).
40
2 30 D²PAK
20
1
Tj(°C) 10 S(cm²)
0 0
0 25 50 75 100 125 0 4 8 12 16 20 24 28 32 36 40
6/10
BTA/BTB08 and T8 Series
DIMENSIONS
6.7
6.7
1.6 1.6
2.3 2.3
7/10
BTA/BTB08 and T8 Series
DIMENSIONS
A REF. Millimeters Inches
E
C2 Min. Typ. Max. Min. Typ. Max.
L2
A 4.30 4.60 0.169 0.181
A1 2.49 2.69 0.098 0.106
D A2 0.03 0.23 0.001 0.009
L
B 0.70 0.93 0.027 0.037
L3 B2 1.25 1.40 0.048 0.055
A1 C 0.45 0.60 0.017 0.024
C2 1.21 1.36 0.047 0.054
B2 C R
B D 8.95 9.35 0.352 0.368
E 10.00 10.28 0.393 0.405
G G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624
A2
2.0 MIN. L2 1.27 1.40 0.050 0.055
FLAT ZONE L3 1.40 1.75 0.055 0.069
R 0.40 0.016
V2
V2 0° 8° 0° 8°
16.90
10.30 5.08
1.30
3.70
8.90
8/10
BTA/BTB08 and T8 Series
DIMENSIONS
9/10
BTA/BTB08 and T8 Series
DIMENSIONS
B C
b2
REF. Millimeters Inches
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
http://www.st.com
10/10