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ID Number 437106384
Grade
INTRODUCTION:
This experiment contains three main procedures, first, we will measure the
resistance of dry and treated soil, then we will measure the resistance between
two electrodes by using three methods, finally we will test and check the
grounding resistance of the (HV LAB).
OBJECTIVES:
Procedure #1
Comments:
• The wet soil is treated using water and salt etc, to make the
resistance low as possible.
• We can't measure the dry soil resistance due to it high resistance.
Procedure #2
First, we will measure the resistance using two electrodes with same
diameters which is 21 cm
Comments:
Then we will measure the resistance using two electrodes with same
diameters which is 48 cm
Comments:
• If we increase the depth and diameter of the rods, the resistance will
decrease.
Finally, we connect both rods in parallel and we measure the value of the
resistance at 30 cm depth
Table (4): the resistance of both rods in treated soil by using parallel connection.
Comments:
• If we increase the depth and connect the rods in parallel the
resistance, we be very low.
Procedure #3
Measuring the grounding resistance and soil resistivity help to design perfect
grounding network, also to keep the soil resistivity within a limited range to
insure high level of safety.
ꝭ
𝑅= → ꝭ = 𝑅 ∗ ᴨ ∗ 𝑟 = 1420 ∗ ᴨ ∗ 0.03125 = 139.41 𝛺. 𝑚
ᴨ∗𝑟
3) Calculate the sand resistivity using the cylindrical rod equations (Eq –
15.2) for one case
4) Compare the above two values and comment on the reasons for
differences, if any.
There is difference between the two resistivity values due to the type of
electrode used also many factors such as length, depth, radius.
5) ln one figure plot variation of Rg against depth of rod for the three
cases studied. Give your comments on the effect of rod depth, rod
diameter and number of rods on Rs.
From fig(1) we can notice that if we increase the radius the grounding resistance
will decrease, also if we increase the depth of the electrode the resistance will
decrease, moreover if we connect the electrode in parallel the resistance will
decrease.
grounding resistance must be low in case of any fault in the system happen the
high current will go to the ground. In order to keep people and equipment safe
we must have low grounding resistance.
• Discuss and state the problems resulted from bad bonding in grounding
system
Bonding is joining things together such as join two conductors together, wire
and metal plate, and electronic component in motherboard. Bad bonding could
cause serious damage to equipment and human, there are some examples of
good, bad, and poor bonding samples mentioned at procedure #3.
Conclusion: