SEMiX302KD16s

Absolute Maximum Ratings

Symbol Conditions Values Unit
Recitifier Diode
IFAV Tc = 85 °C 300 A
sin. 180°
Tc = 100 °C 240 A
IFSM Tj = 25 °C 8500 A
10 ms
Tj = 130 °C 7500 A
i2t Tj = 25 °C 361000 A²s
10 ms
Tj = 130 °C 281000 A²s
SEMiX® 2s VRSM 1700 V
VRRM 1600 V
Tj -40 ... 130 °C
Module
Rectifier Diode Module Tstg -40 ... 125 °C
SEMiX302KD16s Visol 1 min 4000 V
AC sinus 50Hz
1s 4800 V

Features Characteristics
Terminal height 17 mm Symbol Conditions min. typ. max. Unit
Chips soldered directly to isolated
Diode
substrate
VF Tj = 25 °C, IF = 900 A 1.6 V
V(TO) Tj = 130 °C 0.85 V
Typical Applications*
rT Tj = 130 °C 1.1 m
• Input Bridge Rectifier for AC/DC motor
IRD Tj = 130 °C, VRD = VRRM 15 mA
control
• Power supply Rth(j-c) per diode K/W
K/W
Rth(j-c) per diode 0.091 K/W
sin. 180
K/W
Module
Rth(c-s) per chip K/W
per module 0.045 K/W
Ms to heat sink (M5) 3 5 Nm
Mt to terminals (M6) 2.5 5 Nm
a 5 * 9,81 m/s²
w 250 g

KD

© by SEMIKRON Rev. 2 – 13.12.2012 1

SEMiX302KD16s

Fig. 1L: Power dissipation per thyristor/diode vs. on-state Fig. 1R: Power dissipation per thyristor/diode vs.
current ambient temperature

Fig. 3L: Power dissipation of two modules vs. direct Fig. 3R: Power dissipation of two modules vs. case
current temperature

Fig. 4L: Power dissipation of three modules vs. direct Fig. 4R: Power dissipation of three modules vs. case
current temperature

2 Rev. 2 – 13.12.2012 © by SEMIKRON

SEMiX302KD16s

Fig. 6: Transient thermal impedance vs. time Fig. 7: On-state characteristics

Fig. 8: Surge overload current vs. time

© by SEMIKRON Rev. 2 – 13.12.2012 3

SEMiX302KD16s

spring configuration

SEMiX 2s

This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX

* The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested
for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is
subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our staff.

4 Rev. 2 – 13.12.2012 © by SEMIKRON