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Influence of Backing and Matching Layers in Ultrasound Transducers Performance
Influence of Backing and Matching Layers in Ultrasound Transducers Performance
Transducers Performance
Valéria M. do Nascimento*a, Vera Lúcia da S. Nantes Button a, Joaquim M. Maiab, Eduardo
T. Costaa and Eduardo J. V. Oliveiraa
a
Ultrasound Laboratory, Dept. of Biomedical Engineering (DEB), Faculty of Electrical and
Computing Engineering (FEEC) and Center of Biomedical Engineering (CEB) of the State
University of Campinas (UNICAMP), SP, Brazil
b
Federal Center of Technology (CEFET), Curitiba, PR, Brazil
ABSTRACT
In this work we have investigated the influence of the backing layer composition and the matching layer
thickness in the performance of ultrasound transducers constructed with piezoelectric ceramic discs. We have
constructed transducers with backing layers of different compositions, using mixtures of epoxy with alumina
powder and/or Tungsten powder and with λ/4 or 3λ/4 thickness epoxy matching layers. The evaluation tests
were performed in pulse-echo mode, with a flat target, and in transmission/reception mode, with a calibrated
PVDF hydrophone. The acoustical field emitted by each transducer was mapped in order to measure the on-
axis and transverse field profiles, the aperture size and the beam spreading. The bandwidths of the transducers
were determined in pulse-echo mode. Comparing the evaluation tests results of two transducers constructed
with the same backing layer, the one constructed with λ/4 thickness epoxy matching layer showed better
performance. The results showed that the transducers constructed with epoxy, alumina and Tungsten powders
backing layers have larger bandwidth. The larger depth of field was measured for transducers constructed
with epoxy and Tungsten powder backing layers. These transducers and those constructed with epoxy,
Tungsten and alumina powders backing layers showed the larger field intensities in the measured transverse
profiles.
Keywords: Ultrasound Transducer, Piezoelectric Ceramic, Backing Layer, Matching Layer, Acoustical field
1. INTRODUCTION
Ultrasound transducer transforms electrical energy into mechanical energy and vice-versa, through its single
or multiple piezoelectric elements. Ultrasound transducers can be constructed in several configurations
according to their applications: non-destructive testing, tissue charcterization, medical images, etc.
Many factors, including the type of piezoelectric element, the mechanical construction, the electrical
matching and the mechanical and electrical loads, influence the performance of the transducer. The
mechanical construction influences important parameters as the aperture size, the bandwidth and mechanical
losses of the transducer [2] [6] [7] [8] [9].
In this work we have studied the influence of electrical matching, the thickness of the acoustical matching and
the utilization of different materials to construct the backing layer, in the performance of a single element
(piezoelectric ceramic disc) ultrasound transducer. We have tested the constructed transducers according to
international standards [1] [3] [4] [5] measuring the electromechanical coupling factor of the thickness mode,
bandwidth, aperture size, beam spread and transverse and on-axis profiles.
This work was developed in two phases: the first one correspoded to the construction of the ultrasound
transducers and the second one, the characterization of these transducers.
f ar2 − f r2
k =
2
ef (1)
f ar2
The impedance module and phase versus frequency curves were also traced after each one of the construction
steps, to verify any change in the radial and thickness frequencies and coupling factors.
The schematic diagram showed in Figure 1 presents the components of the ultrasound transducers constructed
in this work. The active element used in the construction of these transducers was PZT-5A piezoelectric
ceramic discs, 12mm diameter, 1mm thickness and 2MHz central frequency.
Coaxial cable
Figure 1. Schematic diagram showing the components of a single element ultrasound transducer.
We have constructed ultrasound transducers with PZT-5A ceramic discs with 12mm diameter and 1mm
thickness. We have utilized three different backing layer composition, two acoustical matching layer
thickness, and we have also tested the influence of the electrical matching (paralel inductance) in the
electromechanical coupling factor.
Transducers #6, #16 and #19 were constructed with an epoxy and alumina powder backing layer; transducers
#5, #8 and #10 with epoxy and Tungsten powder; and transducers #2, #14 and #15 with epoxy, alu mina and
Tungsten powder. The impedances of the transducers backing layers, showed in Table I, were calculated
according to the acoustical impedance of the components used. The acoustical impedance of the PZT-5A is
33.7MRayls.
Table I. Acoustical impedance of the backing layer of each transducer
Backing layer of Z0 (106kg/m2s Backing layer of epoxy, Z0 (106kg/m2s or Backing layer of epoxy Z0 (106kg/m2s
epoxy and alumina or MRayls) alumina and Tungsten MRayls) and Tungsten or MRayls)
Obs.: All the tables presented in this text, shows the results from the transducers constructed with 3λ/4
acoustic matching layer thickness in gray rows or columns.
c
λ= (2)
fr
Where: c is the propagation speed in the transmission medium (1540m/s for water); and
fr is the resonance frequency
Transducers #2, #5 and #6 were built with 3λ4 matching layer thickness. The other have λ4 matching layer thickness.
1
L0 = (3)
( 2π f r ) 2 C 0
Function Generator
Power amplifier
trigger sinc burst out
RF in RF out
Oscilloscope
GPIB XYZ motor
CH2 CH1 drive micro-
controlled
(pulse/echo)
processing
microcomputer Pre-amplifiers stages hidrophone Transducer
Water tank
Figure 2. Schematic diagram showing the main components of the Acoustical field Mapping System utilized to do the
ultrasound transducers characterization measurements.
The Acoustical field Mapping System consists of a microcomputer controlled XYZ axes displacement unit. In
the transmission/reception method, the ultrasound transducer to be mapped is placed in a fixed support, and a
punctual PVDF hydrophone is displaced, using step motors, to scan the acoustical field produced by the
transducer under test, in transversal or parallel planes to its face. A function generator and a power amplifier
are used to apply the electrical signal in the transducer. The ultrasound pulse received by the hydrophone is
pre-amplified, digitalized in a scope and sent to the microcomputer to be processed.
In the pulse/echo measurements, some changes in the equipments arrangement are necessary: a flat target is
positioned in the far field region of the transducer, and the same transducer acts as the transmitter or the
receiver of ultrasonic waves (dashed line in Figure 2).
During the tests, the transducers were excited by a single negative rectangular (-66V) or sinusoidal pulse
(66Vpp), in the transducers central frequency (2MHz), repeated at 100Hz.
f u − f1
BW = * 100 (4)
fc
3. RESULTS
Table II. Values of the resonance frequency of the thickness mode, intrinsic capacitances measured in a frequency bellow
the resonance, parallel inductors used in the electrical matching of the transducers, and electromechanical coupling
coefficients of the thickness mode, measured before and after the electrical matching of the transducers .
Transducers #6, #16 and #19 were constructed with backing layer of epoxy and alumina powder
Transducers #5, #8 and #10 were constructed with backing layer of epoxy and Tungsten powder
Transducers #2, #14 and #15 were constructed with backing layer of epoxy, Tungsten powder and alumina powder.
Transducers #2, #5 and #6 were constructed with 3 λ4 matching layer thickness. The other transducers have λ4 matching
layer thicknesses.
Table III. Bandwidth of the transducers before and after electrical matching
Epoxy and alumina
Transducer BW% BW % (with L0) Fpeak(MHz) Fcentral(MHz)
#16 23 29.54 2.05 2.02
#19 16.6 18.76 2.16 2.13
#6 21.2 26.13 2.11 2.06
Epoxy, alumina and Tungsten
Transducer BW% BW % Fpeak(MHz) Fcentral(MHz)
#14 33.49 34.45 2.23 2.18
#15 21.98 26.95 1.98 2.07
#2 15.74 18.35 2.09 2.08
Epoxy and Tungsten
Transducer BW% BW % Fpeak(MHz) Fcentral(MHz)
#8 23.74 25.97 2.18 2.14
#10 21.9 23.39 2.10 2.00
#5 15.75 19.03 2.13 2.10
Table IV. Values of Zn , Depth and Width of field and Aperture size
Amplitude (V)
Table VI. Parameters for the Beam Spread (2Ψ) calculation, and the maximum relative on-axis field intensity (measured
at Zn) for each transducer
Relative Intensity
Transducer (V) at Zn Zc = 4Zn (mm) Za = Zn (mm) W(mm) 2ψ (10−3)
#16 0.76 188 47 1.54 21.7
#19 1.46 204 51 1.50 19.6
#6 1.30 192 48 1.43 19.9
Appropriate construction of an ultrasound transducer is decisive for its performance; it allows the available
acoustical energy to be transmitted from the transducer face to the next medium, in an efficient way, with
reduced losses, instead of being reflected and absorbed by the backing layer, or being attenuated in the front
layer. We have constructed transducers with 2 acoustical matching layer thicknesses (λ/4 and 3λ/4) and 3
backing layer compositions (epoxy and alumina powder, epoxy and tungsten powder, and epoxy and alumina
and tungsten powders). Two parameters were evaluated before and after electrical matching of transducers:
electromechanical coupling coefficient of the thickness mode of vibration and bandwidth.
Electrical matching layer was responsible for increasing the electromechanical coupling coefficient (kt) and
the bandwidth of the transducers. Results also showed that λ/4 and 3λ/4 acoustical matching layer thicknesses
limit the transducers bandwidth. Transducers constructed with λ/4 matching layer thickness, compared to the
transducers with 3λ/4 thickness, presented larger bandwidth, except for the transducers with backing layer
composed of epoxy and alumina powder. Transducers which backing layers were composed of epoxy and
Tungsten powder, presented smaller beam spread values than the other compositions. Some of the parameters
evaluated, as aperture size, depth of field and maximum field intensity, could not be related to any of the
construction details.
ACKNOWLEDGEMENTS
CAPES, FAPESP, FINEP (RECOPE) are gratefully acknowledged for the financial support.
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