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May 2011
FDD6685
30V P-Channel PowerTrench MOSFET
General Description Features
This P-Channel MOSFET is a rugged gate version of • –40 A, –30 V. RDS(ON) = 20 mΩ @ VGS = –10 V
Fairchild Semiconductor’s advanced PowerTrench RDS(ON) = 30 mΩ @ VGS = –4.5 V
process. It has been optimized for power management • Fast switching speed
applications requiring a wide range of gave drive • High performance trench technology for extremely
low RDS(ON)
voltage ratings (4.5V – 25V).
• High power and current handling capability
• Qualified to AEC Q101
D
G G
S
TO-252
D
Thermal Characteristics
RθJC Thermal Resistance, Junction-to-Case (Note 1) 2.9 °C/W
RθJA Thermal Resistance, Junction-to-Ambient (Note 1a) 40 °C/W
RθJA Thermal Resistance, Junction-to-Ambient (Note 1b) 96 °C/W
This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry.
For a copy of the requirements, see AEC Q101 at http://www.aecouncil.com/
Reliability data can be found at: http://www.fairchildsemi.com/products/discrete/reliability/index.html.
All Fairchild Semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems
certification.
On Characteristics (Note 2)
VGS(th) Gate Threshold Voltage VDS = VGS, ID = –250 µA –1 –1.8 –3 V
∆VGS(th) Gate Threshold Voltage ID = –250 µA, Referenced to 25°C 5 mV/°C
∆TJ Temperature Coefficient
RDS(on) Static Drain–Source VGS = –10 V, ID = –11 A 14 20 mΩ
On–Resistance VGS = –4.5 V, ID = –9 A 21 30
VGS = –10 V,ID = –11 A,TJ=125°C 20
ID(on) On–State Drain Current VGS = –10 V, VDS = –5 V –20 A
gFS Forward Transconductance VDS = –5 V, ID = –11 A 26 S
Dynamic Characteristics
Ciss Input Capacitance VDS = –15 V, V GS = 0 V, 1715 pF
Coss Output Capacitance f = 1.0 MHz 440 pF
Crss Reverse Transfer Capacitance 225 pF
RG Gate Resistance VGS = 15 mV, f = 1.0 MHz 3.6 Ω
FDD6685 Rev D1
FDD6685
Electrical Characteristics TA = 25°C unless otherwise noted
Notes:
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
PD
3. Maximum current is calculated as: RDS(ON) where PD is maximum power dissipation at TC = 25°C and RDS(on) is at TJ(max) and VGS = 10V.
FDD6685 Rev D1
FDD6685
Typical Characteristics
40 2.4
VGS = -10V -4.5V
-4.0V VGS = -3.5V
2.2
DRAIN-SOURCE ON-RESISTANCE
-6.0V -5.0V
-ID, DRAIN CURRENT (A)
30 2
NORMALIZED
1.8
-4.0V
-3.5V 1.6
20
-4.5V
1.4 -5.0V
-6.0V
10 1.2
-3.0V -8.0V
1 -10V
0 0.8
0 1 2 3 0 2 4 6 8 10
-VDS, DRAIN-SOURCE VOLTAGE (V) -ID, DRAIN CURRENT (A)
1.6 0.08
ID = -11.0A
ID = -5.5A
DRAIN-SOURCE ON-RESISTANCE
VGS = -10V
RDS(ON), ON-RESISTANCE (OHM)
1.4
0.06
NORMALIZED
1.2
0.04
o
TA = 125 C
1
0.02 o
0.8 TA = 25 C
0.6 0
-50 -25 0 25 50 75 100 125 150 175 2 4 6 8 10
TJ, JUNCTION TEMPERATURE (oC) -VGS, GATE TO SOURCE VOLTAGE (V)
40 100
TA = -55oC VGS = 0V
VDS = -5V o
-IS, REVERSE DRAIN CURRENT (A)
125 C
10
-ID, DRAIN CURRENT (A)
30 o
TA = 125 C
o 1
25 C
25oC
20 0.1
-55oC
0.01
10
0.001
0 0.0001
1 2 3 4 5 0 0.2 0.4 0.6 0.8 1 1.2 1.4
-VGS, GATE TO SOURCE VOLTAGE (V) -VSD, BODY DIODE FORWARD VOLTAGE (V)
FDD6685 Rev D1
FDD6685
Typical Characteristics
10 2400
ID = -11.0 A f = 1MHz
-VGS, GATE-SOURCE VOLTAGE (V)
CAPACITANCE (pF)
30V
Ciss
6
20V 1200
4
Coss
600
2
Crss
0 0
0 5 10 15 20 25 30 0 5 10 15 20 25 30
Qg, GATE CHARGE (nC) VDS, DRAIN TO SOURCE VOLTAGE (V)
1000 100
SINGLE PULSE
P(pk), PEAK TRANSIENT POWER (W)
RθJA = 96°C/W
100 80 TA = 25°C
ID, DRAIN CURRENT (A)
100µs
1ms
RDS(ON) LIMIT
10ms
10 100ms 60
1
10s
1 DC 40
VGS = 10V
SINGLE PULSE
0.1 RθJA = 96oC/W 20
TA = 25oC
0.01 0
0.01 0.10 1.00 10.00 100.00 0.01 0.1 1 10 100 1000
VDS, DRAIN-SOURCE VOLTAGE (V) t1, TIME (sec)
Figure 9. Maximum Safe Operating Area. Figure 10. Single Pulse Maximum
Power Dissipation.
1
TRANSIENT THERMAL RESISTANCE
D = 0.5
r(t), NORMALIZED EFFECTIVE
0.001
0.0001 0.001 0.01 0.1 1 10 100 1000
t1, TIME (sec)
FDD6685 Rev D1
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
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FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY
PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY
THEREIN, WHICH COVERS THESE PRODUCTS.
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