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TPS56220x 4.5-V To 17-V Input, 2-A Synchronous Step-Down Voltage Regulator in 6-Pin SOT-23
TPS56220x 4.5-V To 17-V Input, 2-A Synchronous Step-Down Voltage Regulator in 6-Pin SOT-23
1 Features 3 Description
• TPS562201 and TPS562208 2-A converter The TPS562201 and TPS562208 are simple, easy-to-
integrated 140-mΩ and 84-mΩ FETs use, 2-A synchronous step-down converters in
• D-CAP2™ mode control with fast transient SOT-23 package.
response The devices are optimized to operate with minimum
• Input voltage range: 4.5 V to 17 V external component counts and also optimized to
• Output voltage range: 0.76 V to 7 V achieve low standby current.
• Pulse-skip mode (TPS562201) or continuous
These switch mode power supply (SMPS) devices
current mode (TPS562208)
employ D-CAP2 mode control providing a fast
• 580-kHz Switching frequency transient response and supporting both low equivalent
• Low shutdown current less than 10 µA series resistance (ESR) output capacitors such as
• 2% Feedback voltage accuracy (25°C) specialty polymer and ultra-low ESR ceramic
• Start-up from pre-biased output voltage capacitors with no external compensation
• Cycle-by-cycle overcurrent limit components.
• Hiccup-mode overcurrent protection The TPS562201 operates in pulse skip mode, which
• Non-latch UVP and TSD protections maintains high efficiency during light load operation.
• Fixed soft start: 1.0 ms The TPS562201 and TPS562208 are available in a 6-
pin 1.6 × 2.9 (mm) SOT (DDC) package and specified
2 Applications from –40°C to 125°C of junction temperature.
• Digital TV power supply
Device Information
• High definition Blu-ray™ disc players
PART NUMBER PACKAGE(1) BODY SIZE (NOM)
• Networking home terminal
TPS562201
• Digital set-top box (STB) SOT (6) 1.60 mm × 2.90 mm
TPS562208
• Surveillance
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
100%
90%
TPS562201
80%
1 6
GND VBST
70%
2 5
SW EN 60%
Efficiency
VOUT EN
3 4 50%
COUT VIN VIN VFB VOUT
40%
CIN 30%
VOUT = 1.05 V
20% VOUT = 1.8 V
10% VOUT = 3.3 V
VOUT = 5 V
Simplified Schematic 0
0.001 0.01 0.02 0.05 0.1 0.2 0.5 1 2 3 45
Iload (A) D021
TPS562201 Efficiency
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
Copyright © 2020 Texas
intellectual Instruments
property Incorporated
matters and other important disclaimers. PRODUCTION DATA. Submit Document Feedback 1
Product Folder Links: TPS562201 TPS562208
TPS562201, TPS562208
SLVSD91B – DECEMBER 2015 – REVISED SEPTEMBER 2020 www.ti.com
Table of Contents
1 Features............................................................................1 7.4 Device Functional Modes..........................................10
2 Applications..................................................................... 1 8 Application and Implementation.................................. 12
3 Description.......................................................................1 8.1 Application Information............................................. 12
4 Revision History.............................................................. 2 8.2 Typical Application.................................................... 12
5 Pin Configuration and Functions...................................3 9 Power Supply Recommendations................................18
Pin Functions.................................................................... 3 10 Layout...........................................................................18
6 Specifications.................................................................. 4 10.1 Layout Guidelines................................................... 18
6.1 Absolute Maximum Ratings........................................ 4 10.2 Layout Example...................................................... 18
6.2 ESD Ratings............................................................... 4 11 Device and Documentation Support..........................19
6.3 Recommended Operating Conditions.........................4 11.1 Receiving Notification of Documentation Updates.. 19
6.4 Thermal Information....................................................4 11.2 Support Resources................................................. 19
6.5 Electrical Characteristics.............................................5 11.3 Trademarks............................................................. 19
6.6 Typical Characteristics................................................ 6 11.4 Electrostatic Discharge Caution.............................. 19
7 Detailed Description........................................................9 11.5 Glossary.................................................................. 19
7.1 Overview..................................................................... 9 12 Mechanical, Packaging, and Orderable
7.2 Functional Block Diagram........................................... 9 Information.................................................................... 19
7.3 Feature Description.....................................................9
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (December 2017) to Revision B (September 2020) Page
• Updated the numbering format for tables, figures and cross-references throughout the document. .................1
• Changed to 'TPS562201' from 'TPS563201' in "TPS562201 Efficiency"............................................................1
• Changed 'TPS563201' to 'TPS562201' in "TPS562201 Supply Current vs Junction Temperature"................... 6
• Changed to 'TPS562208' from 'TPS563208' and 'TPS562201' from 'TPS563208' in "Line Regulation".......... 15
• Changed to 'TPS562201' from 'TPS563201' in "TPS562201 Efficiency, VOUT = 1.05 V"................................. 15
1 GND VBST 6
2 SW TPS562201 EN 5
3 VIN VFB 4
Pin Functions
PIN
DESCRIPTION
NAME NO.
Ground pin source terminal of low-side power NFET as well as the ground terminal for controller circuit.
GND 1
Connect sensitive VFB to this GND at a single point.
SW 2 Switch node connection between high-side NFET and low-side NFET
VIN 3 Input voltage supply pin. The drain terminal of high-side power NFET
VFB 4 Converter feedback input. Connect to output voltage with feedback resistor divider.
EN 5 Enable input control. Active high and must be pulled up to enable the device
VBST 6 Supply input for the high-side NFET gate drive circuit. Connect a 0.1-µF capacitor between VBST and SW pins.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VIN, EN –0.3 19 V
VBST –0.3 25 V
VBST (10-ns transient) –0.3 27 V
Input voltage VBST (vs SW) –0.3 6.5 V
VFB –0.3 6.5 V
SW –2 19 V
SW (10 ns transient) –3.5 21 V
Operating junction temperature, TJ –40 150 °C
Storage temperature, Tstg –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
TPS562201 and
TPS562208
THERMAL METRIC(1) UNIT
DDC (SOT)
6 PINS
ψJB Junction-to-board characterization parameter 16.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
0.55 0.770
Buck Quiescent Current (mA)
0.50 0.769
0.45 0.768
FB Voltage (V)
0.40 0.767
0.35 0.766
0.30 0.765
0.25 0.764
±50 ±20 10 40 70 100 130 ±50 ±20 10 40 70 100 130
Junction Temperature (ƒC) C001 Junction Temperature (ƒC) C002
Figure 6-1. TPS562201 Supply Current vs Junction Figure 6-2. VFB Voltage vs Junction Temperature
Temperature
1.23 1.50
1.20
1.47
EN Pin UVLO - High (V)
EN Pin UVLO - Low (V)
1.17
1.44
1.14
1.11
1.41
1.08
1.38
1.05
1.02 1.35
±50 ±20 10 40 70 100 130 ±50 ±20 10 40 70 100 130
Junction Temperature (ƒC) C004 Junction Temperature (ƒC) C003
Figure 6-3. EN Pin UVLO Low Voltage vs Junction Figure 6-4. EN Pin UVLO High Voltage vs Junction
Temperature Temperature
250 130
230 120
210
High Side Rds_on (mŸ)
110
190
100
170
90
150
80
130
70
110
90 60
70 50
±50 ±20 10 40 70 100 130 ±50 ±30 ±10 10 30 50 70 90 110 130
Junction Temperature (ƒC) C005 Junction Temperature (ƒC) C006
Figure 6-5. High-Side Rds-on vs Junction Figure 6-6. Low-Side Rds-on vs Junction
Temperature Temperature
620 600.0
Vout = 1.05 V
Vout = 1.8 V
600 500.0
Vout = 5 V
580 400.0
Fsw (Khz)
Fsw (Khz)
560 300.0
540 200.0
Vout = 1.05 V
520 100.0
Vout = 3.3 V
Vout = 5 V
500 0.0
4 6 8 10 12 14 16 18 0.001 0.010 0.100 1.000
VIN (V) C012 IOUT (A) C013
Iout = 10 mA VIN = 12 V
Figure 6-7. TPS562208 Switching Frequency vs Figure 6-8. TPS562201 Switching Frequency vs
Input Voltage Output Current
1.0 1.0
0.9 0.9
0.8 0.8
0.7 0.7
Efficiency
Efficiency
0.6 0.6
0.5 0.5
0.4 0.4
Vin = 5 V Vin = 5 V
0.3 0.3
Vin = 9 V Vin = 9 V
0.2 Vin = 12 V 0.2 Vin = 12 V
Vin = 15 V Vin = 15 V
0.1 0.1
0.001 0.010 0.100 1.000 0.001 0.010 0.100 1.000
I-load (A) C015 I-load (A) C017
Figure 6-9. TPS562201 VOUT = 1.05 V Efficiency, L = Figure 6-10. TPS562201 VOUT = 1.5 V Efficiency, L =
2.2 µH 2.2 µH
1.0 1.0
0.9 0.9
0.8 0.8
0.7 0.7
Efficiency
Efficiency
0.6 0.6
0.5 0.5
0.4 0.4
Vin = 5 V Vin = 5 V
0.3 Vin = 9 V 0.3
Vin = 9 V
0.2 Vin = 12 V 0.2 Vin = 12 V
Vin = 15 V Vin = 15 V
0.1 0.1
0.001 0.010 0.100 1.000 0.001 0.010 0.100 1.000
I-load (A) C018 I-load (A) C019
Figure 6-11. TPS562201 VOUT = 1.8 V Efficiency, L = Figure 6-12. TPS562201 VOUT = 3.3 V Efficiency, L =
2.2 µH 3.3 µH
1.0 1.0
0.9 0.9
0.8 0.8
0.7
0.7
0.6
Efficiency
Efficiency
0.6
0.5
0.5
0.4
0.4
0.3
0.3 0.2 Vin = 5 V
Vin = 9 V
Vin = 9 V
0.2 Vin = 12 V 0.1 Vin = 12 V
Vin = 15 V Vin = 15 V
0.1 0.0
0.001 0.010 0.100 1.000 0.001 0.010 0.100 1.000
I-load (A) C020 Iload (A) C022
Figure 6-13. TPS562201 VOUT = 5 V Efficiency, L = Figure 6-14. TPS562208 VOUT = 1.05 V Efficiency, L
3.3 µH = 2.2 µH
1.0 1.0
0.9 0.9
0.8 0.8
0.7 0.7
0.6 0.6
Efficiency
Efficiency
0.5 0.5
0.4 0.4
0.3 0.3
0.2 Vin = 5 V 0.2 Vin = 5 V
Vin = 9 V Vin = 9 V
0.1 Vin = 12 V 0.1 Vin = 12 V
Vin = 15 V Vin = 15 V
0.0 0.0
0.001 0.010 0.100 1.000 0.001 0.010 0.100 1.000
Iload (A) C022 Iload (A) C022
Figure 6-15. TPS562208 VOUT = 1.5 V Efficiency, L = Figure 6-16. TPS562208 VOUT = 1.8 V Efficiency, L =
2.2 µH 2.2 µH
1.0 1.0
0.9 0.9
0.8 0.8
0.7 0.7
0.6 0.6
Efficiency
Efficiency
0.5 0.5
0.4 0.4
0.3 0.3
0.2 Vin = 5 V 0.2 Vin = 9 V
Vin = 9 V
0.1 Vin = 12 V 0.1 Vin = 12 V
Vin = 15 V Vin = 15 V
0.0 0.0
0.001 0.010 0.100 1.000 0.001 0.010 0.100 1.000
Iload (A) C022 Iload (A) C022
Figure 6-17. TPS562208 VOUT = 3.3 V Efficiency, L = Figure 6-18. TPS562208 VOUT = 5 V Efficiency, L =
2.2 µH 3.3 µH
7 Detailed Description
7.1 Overview
The TPS562201 and TPS562208 are 2-A synchronous step-down converters. The proprietary D-CAP2 mode
control supports low-ESR output capacitors, such as specialty polymer capacitors and multi-layer ceramic
capacitors, without complex external compensation circuits. The fast transient response of D-CAP2 mode control
can reduce the output capacitance required to meet a specific level of performance.
7.2 Functional Block Diagram
EN 5 3 VIN
VUVP + Hiccup
UVP VREG5
Regulator
UVLO
VFB 4
6 VBST
Voltage Ref PWM
+
Reference +
Control Logic HS
Soft Start SS
2 SW
Ton
One-Shot XCON
VREG5
TSD
LS
OCL
threshold OCL 1 GND
+
+
ZC
comes to point that its rippled valley touches zero level, which is the boundary between continuous conduction
and discontinuous conduction modes. The rectifying MOSFET is turned off when the zero inductor current is
detected. As the load current further decreases, the converter runs into discontinuous conduction mode. The on-
time is kept almost the same as it was in the continuous conduction mode so that it takes longer time to
discharge the output capacitor with smaller load current to the level of the reference voltage. This makes the
switching frequency lower, proportional to the load current, and keeps the light load efficiency high. The
transition point to the light load operation IOUT(LL) current can be calculated in Equation 1.
1 (V - VOUT ) ´ VOUT
IOUT(LL) = ´ IN
2 ´ L ´ fSW VIN (1)
1 6
GND VBST
C1 C2 C3
Not Installed 1
10 uF 10 uF 0.1 uF
VIN
VIN = 4.5 to 17 V 1
æ R1 ö
VOUT = 0.768 ´ ç 1 + ÷
è R2 ø (2)
1
FP =
2p LOUT ´ COUT (3)
At low frequencies, the overall loop gain is set by the output set-point resistor divider network and the internal
gain of the device. The low frequency phase is 180 degrees. At the output filter pole frequency, the gain rolls off
at a –40 dB per decade rate and the phase drops rapidly. D-CAP2 introduces a high frequency zero that reduces
the gain roll off to –20 dB per decade and increases the phase to 90 degrees one decade above the zero
frequency. The inductor and capacitor for the output filter must be selected so that the double pole of Equation 3
is located below the high frequency zero but close enough that the phase boost provided be the high frequency
zero provides adequate phase margin for a stable circuit. To meet this requirement use the values recommended
in Table 8-2.
Table 8-2. Recommended Component Values
OUTPUT VOLTAGE R1 R2 L1 (µH) C8 + C9
(V) (kΩ) (kΩ) MIN TYP MAX (µF)
The inductor peak-to-peak ripple current, peak current, and RMS current are calculated using Equation 4,
Equation 5, and Equation 6. The inductor saturation current rating must be greater than the calculated peak
current and the RMS or heating current rating must be greater than the calculated RMS current.
Use 580 kHz for fSW. Make sure the chosen inductor is rated for the peak current of Equation 5 and the RMS
current of Equation 6.
IlP -P
IlPEAK = IO +
2 (5)
1
ILO(RMS) = IO2 + IlP -P2
12 (6)
For this design example, the calculated peak current is 3.5 A and the calculated RMS current is 3.01 A. The
inductor used is a WE 744311330 with a peak current rating of 11 A and an RMS current rating of 6.5 A.
The capacitor value and ESR determines the amount of output voltage ripple. The TPS562201 and TPS562208
are intended for use with ceramic or other low-ESR capacitors. Recommended values range from 20 µF to 68
µF. Use Equation 7 to determine the required RMS current rating for the output capacitor.
For this design, two TDK C3216X5R0J226M 22-µF output capacitors are used. The typical ESR is 2 mΩ each.
The calculated RMS current is 0.286 A and each output capacitor is rated for 4 A.
8.2.2.3 Input Capacitor Selection
The TPS562201 and TPS562208 require an input decoupling capacitor and a bulk capacitor is needed
depending on the application. TI recommends a ceramic capacitor over 10 µF for the decoupling capacitor. An
additional 0.1-µF capacitor (C3) from pin 3 to ground is optional to provide additional high frequency filtering.
The capacitor voltage rating needs to be greater than the maximum input voltage.
8.2.2.4 Bootstrap Capacitor Selection
A 0.1-µF ceramic capacitor must be connected between the VBST to SW pin for proper operation. TI
recommends to use a ceramic capacitor.
3.00% 3.00%
2.00% 2.00%
1.00% 1.00%
VOUT (V)
VOUT (V)
0.00% 0.00%
-1.00% -1.00%
TPS562208 TPS562208
-3.00% -3.00%
0.0 0.5 1.0 1.5 2.0 2.5 0.0 0.5 1.0 1.5 2.0 2.5
Figure 8-2. Load Regulation, VIN = 5 V Figure 8-3. Load Regulation VIN = 12 V
1.070 1.0
0.9
1.068
0.8
1.066
0.7
Efficiency
VOUT (V)
1.064 0.6
1.062 0.5
0.4
1.060 Vin = 5 V
0.3
Vin = 9 V
1.058 TPS562201
0.2 Vin = 12 V
TPS562208 Vin = 15 V
1.056 0.1
4 6 8 10 12 14 16 18 0.001 0.010 0.100 1.000
Input Voltage (V) C011 I-load (A) C015
TPS562201: Iout = 1 A
TPS562208: Iout = 10 mA
Figure 8-4. Line Regulation Figure 8-5. TPS562201 Efficiency, VOUT = 1.05 V
IO = 2 A/div
IL = 500 mA/div
Figure 8-6. TPS562201 Input Voltage Ripple Figure 8-7. TPS562201 Output Voltage Ripple, IOUT
= 10 mA
VO = 20 mV/div VO = 20 mV/div
IL = 500 mA/div
IL = 500 mA/div
1 µs/div 1 µs/div
Figure 8-8. TPS562201 Output Voltage Ripple, IOUT Figure 8-9. TPS562201 Output Voltage Ripple, IOUT
= 0.25 A =2A
SW = 5V/div
Figure 8-10. TPS562208 Output Voltage Ripple, IOUT Figure 8-11. TPS562201 Transient Response, 0.1 to
=0A 1.5 A
VOUT = 20 mv/div
VO = 20 mv/div
IOUT = 1 A/div
IO = 1 A/div
100 µs/div
100 µs/div
VIN = 5 V/div
VIN = 5 V/div
2 ms/div 1 ms/div
Figure 8-14. TPS562201 Start-Up Relative to VI Figure 8-15. TPS562201 Start-Up Relative to EN
VIN = 5 V/div
VIN = 5 V/div
10 ms/div 10 µs/div
Figure 8-16. TPS562201 Shutdown Relative to VI Figure 8-17. TPS562201 Shutdown Relative to EN
VOUT
GND
Additional
Vias to the Vias to the
OUTPUT
GND plane internal SW
CAPACITOR BOOST
node copper
CAPACITOR
OUTPUT
INDUCTOR
GND VBST
FEEDBACK
TO ENABLE RESISTORS
SW EN CONTROL
SW node copper
pour area on internal
or bottom layer
11.5 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 10-Dec-2020
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
TPS562201DDCR ACTIVE SOT-23-THIN DDC 6 3000 RoHS & Green Call TI | SN Level-1-260C-UNLIM -40 to 125 2201
TPS562201DDCT ACTIVE SOT-23-THIN DDC 6 250 RoHS & Green Call TI | SN Level-1-260C-UNLIM -40 to 125 2201
TPS562208DDCR ACTIVE SOT-23-THIN DDC 6 3000 RoHS & Green Call TI | SN Level-1-260C-UNLIM -40 to 125 2208
TPS562208DDCT ACTIVE SOT-23-THIN DDC 6 250 RoHS & Green Call TI | SN Level-1-260C-UNLIM -40 to 125 2208
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Sep-2021
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Sep-2021
Pack Materials-Page 2
PACKAGE OUTLINE
DDC0006A SCALE 4.000
SOT - 1.1 max height
SOT
3.05 1.100
2.55 0.847
1.75 0.1 C
B A
1.45
PIN 1
INDEX AREA
1
6
4X 0.95
3.05
1.9
2.75
4
3
0.5 0.1
6X TYP
0.3 0.0
0.2 C A B
C
0 -8 TYP
4214841/B 11/2020
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC MO-193.
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EXAMPLE BOARD LAYOUT
DDC0006A SOT - 1.1 max height
SOT
SYMM
6X (1.1)
1
6X (0.6) 6
SYMM
4X (0.95)
4
3
(R0.05) TYP
(2.7)
EXPOSED METAL
EXPOSED METAL
SOLDERMASK DETAILS
4214841/B 11/2020
NOTES: (continued)
www.ti.com
EXAMPLE STENCIL DESIGN
DDC0006A SOT - 1.1 max height
SOT
SYMM
6X (1.1)
1
6X (0.6) 6
SYMM
4X(0.95)
4
3
(R0.05) TYP
(2.7)
4214841/B 11/2020
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
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