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TO IDENTIFY COMPOSITE MATERIAL FOR THERMAL SINK APPLICATION IN

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 TO IDENTIFY COMPOSITE
MATERIAL FOR THERMAL SINK
APPLICATION IN INTEGRATED
CIRCUIT SYSTEMS
MSE-1043: POLYMERS & COMPOSITES ENGINEERING

APRIL 11, 2019

AMIY SRIVASTAVA (1005711561)
SHASHWAT JOSHI (1004657962)
MATERIALS SCIENCE AND ENGINEERING
UNIVERSITY OF TORONTO
 TABLE OF CONTENTS

1. INTRODUCTION………………………………………………………………………………………3
2. LITERATURE SURVEY………………………………………………………………………………3
2.1 Negative thermal Expansion
3. SELECTION OF MATERIALS AND SYNTHESIS PROCESS FOR PROPOSED COMPOSITE….6
3.1 Proposal for composite material and process selection
4. DESIGN OF FINAL COMPOSITE……………………………………………………………………8
4.1 Calculation of Thermal Conductivity and CTE of Cu + Y2W3O12
4.2 Calculation of Thermal Conductivity and CTE of Carbide Coated Diamond Reinforced Cu +
Y2W3O12 composite (New Composite)
4.3 Heat Capacity of New Composite
4.4 Thermal Diffusivity of New Composite
5. APPLICATION OF NEW MATERIAL……………………………………………………………….10
5.1 Numerical Simulation
5.2 Theoretical Calculation
6. RESULTS………………………………………………………………………………………………12
7. IMPORTANT OBSERVATIONS……………………………………………………………………..12
8. REFERENCES…………………………………………………………………………………………13

1
 LIST OF TABLES
Table: 1 Comparison of thermo-physical properties of heat sink materials………………………………………3
Table: 2 Different manufacturing methods for various composites in heat sink applications……………………6
Table: 3 Material properties for the calculation…………………………………………………………………..9

LIST OF FIGURES
Fig: 1 Growth of Cu matrix……………………………………………………………………………………….5
Fig: 2 Mechanism of Negative Thermal Expansion (NTE) ……………………………………………………...5
Fig:3 Temperature Contour of CFD Simulations for both a) New composite, b)Aluminum …………………....11
Fig: 4 Heat Sink from Book Example…………………………………………………………………………….11
Fig: 5 Comparison graphs of improved properties of new composite material…………………………………..12

2
 1. INTRODUCTION

In 21st century, the scientific emergent is mainly based on huge data processing to revamp the properties of materials
and their utilization in specific applications. Additionally, available commercial modelling software like Ansys
Fluent, Solid Works and ABAQUS etc having massive RAM and processing features play a vital role to avoid trial
and error cost and help us in having flawless results for anticipating future phenomena. On the down side, these
modelling operations with such software sometimes takes months to accomplish single simulation depending upon
the number of nodes to be used in the process and as a result the temperature inside the CPU due to conducting
material resistance and so as ICs can increase immensely, and rapid removal of this heat is needed during operation.
Silicon is the foundation material of chip having embedded circuit with the Coefficient of thermal expansion (CTE)
of 2.35×10-6/mk. In order to avoid heat accumulation in this circuit, there is an attachment of heat conducting element
called ‘Heat Sink’ which accumulates the heat and aids in removing heat by the forced or natural convention.
Initially, Aluminium is used as heat sink material (CTE of Al=23.1X10-6 /mK, Thermal Conductivity of Al= 237
Wm-1 K-1) however it’s high Coefficient of thermal expansion value was creates discrepancy with Si during circuit
heating because accumulated strain reduces coherency between heat sink element and Si chip and so as the life of
integrated system. Simultaneously, other material like copper is available with higher thermal conductivity which
can be proven more effective for this application than Al. Copper (CTE of Cu=16.5X10-6 /mK, Thermal
Conductivity of Cu= 401 Wm-1 K-1) has better potential to replace Al as it has better physical properties. Although
having enhanced properties in Cu, the CTE of heat sink material should be close to that of Si. Hence, producing
such properties in the heat sink materials has become the motivation for many researchers. A new composite is
proposed in this report with CTE close to Silicon’s without compromising the thermal conductivity needed for
effective application as heat sink.

2. LITERATURE SURVEY

Many researchers have given the valuable inputs about selection of material, manufacturing methods, testing
procedure and modelling for predicting the thermal conductivity and CTE of heat sink material. They have been
mainly emphasizing on the use of composite materials for achieving thermal conductivity more than 450 W/mk and
coefficient of thermal expansion below 7 * 10-6 /K simultaneously exhibited in same material. Metal matrix
Composites are the materials which can reach close to the desired properties, however manufacturing methods and
material selection play vital role in achieving these properties. Table-1 below summarizes the heat sink materials
synthesized by researchers using different processing methods and materials. It can be observed from the table that
Aluminum matrix composite could not provide a desired and satisfactory properties for heat sink application.
Carbide particulate could reduce the CTE values when added with Aluminum matrix, but the final value is still not
sufficient for high end applications [1,2,3,4,5,6,7]. Most of the research was diverted to the utilization of Cu matrix
reinforcement composite due its better thermal conductivity and lower CTE than that of Aluminium. Cost was
certainly increased but from the reliability point of view, Copper performs better than Aluminum which reduces the
long terms cost of heat sink. Changing the matrix to Copper could also not solve the issue completely and more
ambitious use was still not possible. Hence, variation in reinforcement material, manufacturing process and coating
of reinforcement became the only way to proceed for researchers. There were different reinforcement materials
chosen to embed with Cu & Al matrix mentioned in the table below but conditioning of reinforcement particulate
in terms of formation of coating on the surface of the reinforcement could provide better results for both the
properties.

Table: 1 Comparison of thermo-physical properties of heat sink materials

Heat sink materials Thermal CTE Synthesis Process Author
Conductivity 10-6/K
(W/mK)
Diamond/Al 130, 210, 321 17, 13, 13.2 Powder Metallurgy Beffort et. al [1],
(60, 65 & 50% Vol Wu et. al [2],
respectively) Long et. al[3]

3
 SiC/Al 165-224, 190, 10 Powder Metallurgy K Chu et.al [4],
(50-60 %, 60%, 53-60% Vol) 151-216 H. Guo et al [5],
J.M. Molina
et.al [6]
Titanium Carbide (TiCx ) 90 9.6 Combustion synthesis and S. Shu et. al [7]
based Aluminum matrix hot press consolidation
Composite
TiCx + TiB2 based Aluminum 150 9.3 Combustion synthesis and S. Shu et. al [7]
matrix composite hot press consolidation
Carbon Nanotube Aluminum 120-199 Not given Spark plasma Sintering J.H. Wu et al.
matrix composite (0.5–5 [2]
wt.%)
Diamond and Boron Carbide 585 9 Powder Metallurgy (Hot Th. Schubert
Reinforced Copper matrix Press + Sintering/Rapid et.al [8]
composite Sintering)
Chromium Carbide based Cu Not 12 Powder Metallurgy A. Veillere et al
matrix composite Mentioned [9]

Titanium Carbide coated 557 at 34.7 Not Given Electrodeposition Hai Jun Cho
Diamond Reinforced Copper Vol% et.al [10]
matrix composite Diamond
Carbon Fiber coated & 275 12.8 PVD Coating + Powder Ivi Smid et. Al
Chromium reinforced in Metallurgy [11]
Copper matrix
Carbon Nanotube based 160 3,9,11 for 3, 2, Coating & Mechanical V. Datsyuk et.al
Copper matrix composite 1% CNT) Mixing [12]
respectively
Cu / K6371T (30,35,40% 300, 330, 360 14, 12,10 Powder Metallurgy J. F. Silvain et.al
Reinforcement) [13]
Cu / K223HG (30,35,40% 240,210,180 14, 12,10 Powder Metallurgy J. F. Silvain et.al
Reinforcement) [13]
CNT 3% Reinforced Cu 272 - Powder Metallurgy G. M. Vallet et
Matrix (solid Route) (powder mixing) al. [14]
CNT Reinforced Cu Matrix 337 - Chemical Species Mixing G. M. Vallet et
(Liquid Route) + Hot Pressing al. [14]
Y2W3O12 Reinforced Copper 60 14 Powder Metallurgy S. Das et.al [15]
matrix composite

From the table above, it can also be observed that researchers have achieved good combination of properties
simultaneously when they use either diamond or CNT in Cu matrix. Coating of reinforcement with carbides both on
diamond and CNT helped to achieve desired properties. In case of CNT, the synthesis process plays vital role
because experimental thermal conductivity is found drastically reduced compared to the modeled thermal
conductivity using rule of mixture. It happens because of the agglomeration of CNT among themselves with Vander-
Waal force and occurring poor interfacial bonding between CNT reinforcement and Cu or Al matrix [16]. Therefore,
solving this issue could prove to be helpful in increasing thermal conductivity. Uncoated carbon nanotubes and
diamond embedded composites do not exhibit good thermal conductivity due to poor wetting with Copper matrix.
Both Cu and CNT possess high thermal conductivity values but the efficient control on interfacial bonding of CNT
with matrix and agglomeration into itself is extremely difficult and not yet reported in literature. Diamond is proved
a better material in this respect because interfacial bonding can be controlled by coating as reported in literature.
The bonding between diamond particles and Copper matrix is a weak mechanical bonding which reduces the thermal
conductivity drastically due to poor wetting between Cu-Diamond interface which leads to high interfacial thermal
4
resistance called Kapitza Resistance [17]. Mismatch generated on the interface can increase the density of voids
which acts as phonon scattering points that reduce the overall thermal conductivity of the composite. Coating of
CNT or diamond particles reduces the thermal contact resistance significantly. The thickness of coating plays
important role in optimizing the thermal conductivity. Too thick coating can also create problem in terms of
accumulation of porosity which works as insulator in heat transfer. The growth of the carbide layer on the diamond
particle should not be very extensive otherwise the thermal conductance may not be maximized and here the process
parameters of coating process comes into the picture. Hai Jun Cho et.al [10] controlled current density in
electrodeposition process for reducing the interfacial porosity. The copper matrix grows only on the Ti cathode and
not on the diamond interface due to diamonds inert nature towards copper but when diamond is coated by TiC, the
reduction in thermal contact resistance leads to the growth of copper matrix on the Diamond particles. When the
Diamond content is more in the matrix, the interfacial Cu matrix growth leaves pores behind as shown in the figure-
1. These pores are not found on reducing the diamond content in the matrix because interface advancement can
travel sufficient distance to fill the pores volume with copper and this increases the thermal conductivity
consequently.

Fig: 1 Growth of Cu matrix a) On Ti Cathode, b) On Ti-Cathode and interfaces (formation of pores) [10]

This problem was resolved by reducing the current density in electrodeposition process which helps in reducing the
growth rate of Cu matrix and then the formation of pores could be minimized significantly. Hence process
parameters and selection of process can affect the thermal properties for this application.
The concept of negative CTE is found useful in reducing the overall CTE of the composites by S. Das et al. [15]

2.1 Negative thermal Expansion

Materials with Negative thermal expansion exhibits contraction on the application of heat rather than expansion.
NTE behaviour has been observed in many oxide families such as [15]

1. AM2O8 (A- Zr or Hf ; M- W or Mo),

2. A2M3O12 (A-variety of +3 ions; M- Mo or W), and
3. AX2O7 (A-variety of +4 ions; X- P or V)

The main reason for occurring negative thermal expansion are (1) transverse vibrational mode in which M-O bond
distance is reduced between M-M bonds as shown in Fig.2(a) and cause NTE behaviour, (2) Rigid Unit Modes in
which polyhedra move without distorting by translation and rotation of lattice vibration. An open, flexible structure
of rigid corner sharing polyhedra which can accommodate transverse vibrational modes of the oxygen atoms may
give rise to negative thermal expansion as shown in Fig.2(b) and (3) The structural frames are liable to undergo
symmetry and restrict displacive phase transformation which cause NTE behavior to occur. β-α transitions in both
quartz and cristobalite in which phase transitions generally give rise to a reduction of volume, with one possible
driving force being an increase in O-O interactions.

Fig: 2 Mechanism of NTE due to (a) transverse vibrational modes, (b) rigid unit mode [18]
5
These type of NTE materials are incorporated in positive thermal expansion material to modify or decrease effective
CTE of composite [12,19]. Y2W3O12 belongs to NTE family and the average linear NTE coefficient of Y2W3O12, as
determined from neutron diffraction data, is α = −7.0 × 10-6/oC in the temperature range of 15 to 1373 K [20]. It
shows no phase transition over a wide temperature range; thus, it is easy to develop zero or near zero thermal
expansion materials. Other NTE materials like Zr2WP2O12 in ZrW2O8/ Zr2WP2O12 composites shows rapid increase
in CTE values over the temperature ranges of 323–373 and 473–673 K. Cu/ZrW2O8 composite also exhibits a change
in CTE value from about temperature 120 and 160oC [37, 38]. Y2W3O12 has a stable phase at room temperature.
Y2W3O12 is easy to synthesize compared to other oxides. These properties make it very useful as an additive to
positive thermal expansion materials among the members of A2M3O12 family. It is highly hygroscopic in nature and
forms a trihydrate structure at room temperature. These water molecules might restrict transverse thermal vibrations
and prevent NTE at room temperature. Thermal conductivity of Y2W3O12 is very less, which leads to decrease in
overall conductivity. The overall conductivity of composite with 60% Y2W3O12 and 40% copper is, 109 W/mK.
While CTE is 0.6 x 10-6/K [15].

3. SELECTION OF MATERIALS AND SYNTHESIS PROCESS FOR PROPOSED COMPOSITE

According to the literature on the available heat sink composites given in table-1, it can be observed that Cu matrix
coated Diamond reinforcement composites show superior properties to the composites when CNT was used as
reinforcement in Cu matrix [8, 10]. To be assured with superiority of these composites and identify the best
processing methods an extensive literature survey is summarized in table-2 below.

Table: 2 Different manufacturing methods for various composites in heat sink applications
Composites Thermal CTE Manufacturing Method Name of the Researchers
Conductivity -6 o
10 / C
W/mk
Cu + Cr7C3 562 7.8 Coating on diamond by Qiping Kang et. al [22], 2013
Coated (approx.100 molten salt method and
Diamond (65 points more composite was fabricated
vol%) Particle than by vacuum pressure
theoretical) infiltration method.
Cu + Cr Coated 284 Not Given Composite made by Spark Ke. Chua et al [23] 2010
diamond Plasma Sintering
Composite
(Flakes Graphite 272-334 6.8 to 9.8 Hot Pressing, Sintering Shubin Ren et al [24] 2015
+ Diamond) in
Copper Matrix
Cu + Ti Coated 405-811 based 4.8 to 8 Ti Coating on diamond Luhua Wang et al [25],2018
Diamond on the coating based on was done using radio
composite thickness. temperature frequency electron
Optimum for 220 nm sputtering (for achieving
thickness is thickness different coating
220 nm. coating thickness) and composite
was synthesized using gas
pressure infiltration
Cu-B/Diamond 83 to 847 with 5.3 to 7.3 Composite preparation by Guangzhu Bai et. al [26], 2018
composites %B = 0%, from 300 k gas pressure infiltration
0.3% or 1.0% to 600 k method and diamond
particles were not
precoated. Boron Carbide
formed during GPI
process

6
Cu 300 very less Not Diamond particle Xia Yang et al [27], 2009
Alloy/Diamond for such Available precoated with Cu
Composite composites Alloyed with Cu-4%Ti,
because of Cu-3%Si, Cu-1%Cr and
uncontrolled Cu-0.5%B
thickness of
coating
Cu + Tungsten 658 6.8–7.6 for WC coating using molten Qiping Kang et al, 2015 [28]
Carbide coating temperature salt method and composite
on diamond 50 to 400 was synthesized by
o
particles C vacuum pressure
infiltration
Cu + coated 672 Not WC coating on diamond Hua Bai et al, [29], 2013
diamond Achieved at available particle using a Novel
composites 1320 K Approach and Composite
was made using Spark
Plasma Sintering method
Cu + Ti/Cr 657 at 0.5 Not Ti or Cu coating on Shubin Ren et al [30]
Coated micron available diamond particle using
Diamond thickness and Microdeposition
70% Diamond technology
particle
Cu + Mo Coated 726 w/mk at 2 Not Composite made using [31] Xiao-Yu Shena et al
65 vol % micron thick available infiltration method
Diamond coating 2012
Particles
Cu–Zr/diamond 615 with 1.2% Formation of Cu-Zr alloy [32] Ke Chu et al 2013
composites USE Zr by gas atomization
Modified HJ process and composite by
Model hot pressing sintering
Cu-B/diamond >660 <7.4 Cu-B alloyed with [33]Ye-Ming Fan 2010
composites 700 for 0.3 0.5B=5.56 0.1wt%, 0.3wt%, and
wt% B 0.1B= 6.67 0.5wt% boron and
H & J Model 0.3B= 8.33 Composite prepared by
ROM is pressure infiltration
good method
Cu-X/diamond 485 for Cu-B 11 at RT Pre-alloyed Cu with B, Cr, [8]Th. Schubert et al. (2008)
Composite and 480 for to 200oC Al, Ti, Zr using gas
where Cu-Cr with atomization and the
X= B, Cr, Al, 42% diamond composite by mixing and
Ti, Zr also for hot pressing
increased time
and directly
heated hot
pressing 639
Cu-Ti 608 used H-J 5.4 Pressureless Sintering [34] Chih-Yu Chung et. al
composites (60 Model for TC Process
vol.% diamond) combining
with diffused
Mismatch
model

7
It can be observed from the table above that achieved thermal conductivity value for carbide coated diamond
reinforcement Cu matrix composite is satisfactory, but coefficient of thermal expansion is found at higher end. The
opportunity arises here to reduce it further. Cost of diamond particles has also been reduced recently which helps
the idea of using diamond reinforcement into Cu Matrix [10]. Coating of diamond particle is also important as
discussed already. As listed in the table above, researchers have obtained different manufacturing methods for
synthesizing Carbide coated Diamond reinforcement copper matrix composites.
The main general group of synthesis methods are as follows:
• Electrodeposition,
• Chemical vapor deposition (CVD), and
• Powder metallurgy with different sintering processes

The former two process Electrodeposition and CVD are extremely slow, relatively high cost, with design limitation
and requires precursor which should be volatile. Powder metallurgy route is comparatively easy and efficient
technique. It is useful in fabrication of any type of composites using variety of materials [35, 36]. Powder metallurgy
has been proved to be a flexible process in tailoring the microstructure (e.g., volume fraction and morphology of the
reinforcement). Mechanical milling/alloying (MM/MA) is a solid-state powder processing technique involving
repeated welding, fracturing and rewelding of powder particles in a high energy ball mill.
Some of the major advantages of mechanical milling/alloying routes are as follows:
i. Large amount of bulk material can be produced.
ii. Chemical (displacement) reactions can be induced in powder mixtures at relatively lower temperature than
normally required for synthesis.
iii. Finer structure can be obtained due to severe plastic deformation, and hence good for refinement of
microstructure.
iv. Alloying of normally immiscible elements are possible.

For synthesizing the Cu + Y2W3O12 composite, S Das et al used powder metallurgy with molecular level mixing and
sintering. For the addition of third element, further mixing can be carried out with the previous mixture of Cu +
Y2W3O12 . The diamond particles would be precoated before mixing with Molten salt method or Radio frequency
electron sputtering method. Apart from precoating of Diamond particle, Cu was alloyed with carbide forming
elements like B, Cr, Al, Ti, Zr using gas atomization or gas pressure infiltration process and a coating is formed
during the process on the diamond particles and could be observed in microstructural analysis using SEM [8, 33].
The composite synthesis processes adopted by the researchers mentioned in table-2 are vacuum pressure infiltration
method, powder processing with Spark Plasma Sintering, gas pressure infiltration and powder processing with
pressure sintering.

3.1 Proposal for composite material and process selection

Composite Coating Method Composite Preparation Process
(Cu + Y2W3O12) matrix embedded with carbide Gas Pressure Powder Metallurgy with Spark Plasma
Coated Diamond as reinforcement material Infiltration Sintering

On the basis of the above survey, following proposal is made regarding the selection of material as well as process
of synthesis.

4. DESIGN OF FINAL COMPOSITE

Design for the material of construction (MOC) was carried out on the basis of two main properties i.e. 1) Thermal
Conductivity 2) Coefficient of Thermal Expansion as found from literature.
Firstly, above two properties are calculated for Cu + Y2W3O12 and secondly the same properties are calculated for
the final composite considering Cu + Y2W3O12 is matrix and Chromium Carbide Coated Diamond particles are
reinforcement particles.

8
 Table: 3 Material properties for the calculation
kCu kY2W3O12 CTECu CTEY2W3O12 Shear Bulk Bulk
(W/mk) (W/mk) 10^-6 m/K [41] 10^-6 m/K Modulus Modulus, Modulus,
GCu (GPa) KCu (GPa) KY2W3O12,
(GPa)[40]
401 60 17 -7 48 140 25
K Diamond CTE Diamond Bulk Rcu- RCr7C3[22] RCr7C3/Di RCr7C3-
(W/mk) 10^-6 m/K Modulus, Cr7C3[22] amond[22] Y2W3O12
KDiamond (GPa) (Assumption)
1500 2.3 580 0.23 3.7 0.4 0
Average Diameter of Coating Density of Density of Density of Density of
Diamond Particles Thk(m) Cu Y2W3O12 Matrix Final composite
275 micron 1 8960Kg/m3 4637Kg/m3 6458Kg/m3 4741.6 Kg/m3

4.1 Calculation of Thermal Conductivity and CTE of Cu + Y2W3O12 :

The thermal conductivity of Cu+ Y2W3O12 was best matching with the Maxwell Model as given by following
equation [15].
Where Km = Thermal Conductivity of Matrix
Kp = Thermal Conductivity of Spherical Particles
Kcom = Thermal Conductivity of Composites

For Composite with Cu 50 vol% -Y2W3O12-50% Vol %, kcomposite can be directly calculated by plugging in the values
given in table in above Maxwell Model Equation. kcomposite= 173.7 w/mk and this value will become the thermal
conductivity of Matrix for final composite.
The CTE value for this Cu 50 vol% -Y2W3O12-50% Vol %, composite can be calculated using Kerner equation
which is again a good match for this combination as follows [39].
Here, Gm=Shear Modulus of Matrix, Kp & Km
are bulk modulus of particle and Matrix
The values can be taken from the table-3 containing material constants.

CTE of Cu 50 vol% -Y2W3O12-50% Vol % = 5 x 10-6 m/K, this will be used later as the CTE of matrix in final
composite.

4.2 Calculation of Thermal Conductivity and CTE of Carbide Coated Diamond Reinforced Cu + Y2W3O12
composite (New Composite)
Hasselman & Johnson (H-J) model was used by most researches for thermal conductivity of Diamond Based
composite. This model gives a good correlation with experimental values.[22].
The equation is as follows:
Where, Km is thermal conductivity of matrix and Kp eff is
calculated after considering Kapitza resistance effect and
particle size.
Where, Rk = RCu-Cr7C3 + RCr7C3 + RCr7C3/Diamond + RCr7C3-Y2W3O12
= 4.33* 10-8
Kp eff = 1018.77
Plugging these values above in kc yields thermal conductivity of composite when Vp, Diamond=0.60 and Vm =0.40
Kcomposite = 481.2 W/mk
Let us assume 5% porosity is still there in the final composite which will reduce the thermal conductivity further by
following ROM equation [22]:
Kc-p = Kc X Vc + Kair x Vporosity where Kair = 0.02435 W/mk
Kc-p = 457.14 W/mK, this is the value of thermal conductivity of proposed composite. CTE values were
calculated using the same model as discussed in CTE calculation for matrix. For calculating shear modulus of matrix,
9
Y2W3O12 is assumed an isotropic material and its shear modulus is calculated by the following equation because its
bulk modulus is known from literature [15]
2G(1+v) = 3K(1-2v) For Isotropic Materials GCu- Y2W3O12 = Gm*Gf / (GmVf + Gf Vm )
G Y2W3O12 = 33 GPa with Poison’s Ratio= GCu + Y2W3O12 = 39.11 GPa (when Vm=Vp=0.5)
0.1(assumption)
This value is used as Gm for calculating CTE of the final composite.
CTE with Vp, Diamond=0.60 and Vm = 0.40 = 3.38 x 10-6 /K
On increasing Diamond content beyond 0.65, density values may get reduced because carbide coating will leave
porosity behind during their growth.

4.3 Heat Capacity of New Composite

The main issue for estimating the new composite is the heat capacity of Y2W3O12 which is not mentioned in literature.
For the synthesis of Y2W3O12 , researchers have chosen Y2O3 and WO3 as oxide compounds [21]. The assumed linear
reaction is Y2O3 + 3WO3 → Y2W3O12
Hence, Heat Capacity of mixture is
Cp, mix = Cp, Y2O3 X Mole Fraction of Y2O3 + Cp, WO3 X Mole Fraction of WO3

Mole fraction of Y2O3 and WO3 are 0.25 and 0.75 and heat capacities are 483.82 J/Kg-K [42] and 338.6 J/Kg-K[43].
Plugging in these values in Cp, mix equation we can find 374.9 J/Kg-K. Using this value, the heat capacity for matrix
of new composite calculated which is 395.96 J/Kg-K. Using the Rule of Mixture, the heat capacity of new composite
is calculated which is 521.67 J/Kg-K.

4.4 Thermal Diffusivity of New Composite

Thermal diffusivity, , is the rate of transfer of heat of a material from the hot end to the cold end. This also shows
the efficiency of composite material. The equation is as follows-
 = K/( x CP) where  is density, K is thermal conductivity and Cp is specific heat capacity.
 = 457.14/(4741.6* 521.67)
 = 18.48* 10-5 m2/s
Thermal diffusivity of new composite is more than that of Copper (11.1* 10-5 ) and Aluminum (9.7*10-5) which
shows better performance of this material as heat sink.

5. APPLICATION OF NEW MATERIAL

5.1 Numerical Simulation
In order to obtain the rate of heat Governing Equations: 1) Navier’s Stokes Equation for X-momentum and
transfer through the heat sink made of Incompressible flow:[43]
different materials, two Pin type heat
sink geometries were made. Heat sink The Equation of Continuity [44]:
was attached in the plate and 2
capacitors. The reference for design The Energy Equation [44]:
was taken from RAEF KOBEISSI Averaging of Navier Stokes equation was done using k- SST Model [45]
ENGINEERING ONLINE
TRAINING [42] website which is
close to the real-world problem. Total
No. of Cell is more than 5 million for
achieving grade independency for the
solution.

This CFD simulation is a time dependent solution and Time(s) Pins, W Plate, W Capacitor, W
total run time is 25.267 Sec for the model having new 25.267(NC) 0.845 0.0067 0.4142
composite (NC) as heat sink and 26.402 sec for 26.402(Al) 0.818 0.008 0.427
Aluminum heat Sink. Design is having two capacitors, Heat transfer rate for 25.267s is more than that of 26.402 s.
one heat sink and one base plate all made of Aluminum This shows that new material performs better as a heat sink.
and in another heat sink is made of new composite. Rest values follow with time lapsed.
10
 Fig: 3 Temperature Contour of CFD Simulations for both a) New composite, b) Aluminum

Temperature contours are not well established within the given time of simulation but calculation of heat flux
from wall of pin gives clear idea that heat transfer from new composite is more than that of Aluminium heat sink.
If further run time will be provided to this model, the temperature contour will be established to distinguish the
effect of heat sink materials.

5.2 Theoretical calculation

Theoretical Calculation was made for plate type heat sink from book example [46].

No. of Length Width Thk Spacing Base Ext. Ext. Heat Thermal Conductivities
Fins(n) (mm) (mm) (mm) (mm) Temp. Tb Air Transfer (W/m.K)
(designed) Temp. Co-efficient Al Cu Cu-Y2W3O12+
Diamond
9 60 40 1 3 60oC 20oC 12 W/m2 170 401 458
The heat sink surface temperature T, at a distance, x, from the base of the fin is given by Heat flux from unfinned Base
=Ah *h*(Tb-Tf)
= width*Spacing*(n-1)*(Tb-Tf)
and P is Periphery of one fin Material Independent
Equation
Total Heat Flux = Heat flux from Unfinned Base + Heat Flux from Fins
For Single Fin, Qf = -kAc (dT/dx)x=0 , where Relationship between T and x is given in above equation,
Hence, (dT/dx)= -sinhm(L-x)(m*(Tb - Tf )/coshmL)
Qf = -kAc(dT/dx)x=0 = kAc *sinhm(L-x)(m*(Tb - Tf )/coshmL) and
Where, Periphery P=2*(w+t) and Ac = w*t Material Dependent Equation

Material Dependent Material Dependent

Step of For Al heat For Cu For New Composite

Calculation sink Heat Sink Heat Sink
m 12.03 7.94 7.33
mL 0.72 0.48 0.44
tanh(mL) 0.62 0.44 0.41
Qf, AL 2.02 2.20 2.22
N*Qf 18.20 19.78 19.98
Unfinned Qu 0.461 0.461 0.461
Total Q 18.66 20.24 20.44
Fin Effectiveness 105.32 114.46 115.64
Fin Efficiency 85.6 93.1 94 Fig: 4 Heat Sink from Book Example

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 6. RESULTS

The new composite proposed in this report is found better than Al, Cu, Cu-CNT, Cu-Diamond, Cu-Coated Diamonds
composite in terms of CTE and thermal conductivity is equivalent to the Cu-coated Diamond composites. The
comparison graph is given in fig a for thermal diffusivity and fig. b for fin effectiveness, fin efficiency, CTE and
thermal conductivity.

Fig: 5 Comparison graphs of improved properties of new composite material

The graphs above show that new composite material is better than Al and Cu in terms of thermal diffusivity, fin
effectiveness, fin efficiency and thermal conductivity. In addition to that new proposed composite is having better
CTE value than that of most of the materials available in literature till date.

7. IMPORTANT OBSERVATIONS

a. The thermal resistance values were taken from literature for coatings hence while synthesis of coating on
diamond particles, the process parameters should match with the particular case.
b. Theoretically, on increasing Diamond particles in the composite, both the properties are improved but when
the content of diamond particle goes beyond 65%, the chances for increasing the porosity content increase
drastically which reduces thermal conductivity eventually, hence in the proposed new composite, the content
of diamond is kept 60% max.
c. While calculating the shear modulus, Y2W3O12 is considered to be an isotropic material and while calculating
shear modulus of new composite, ROM is assumed to be followed but for this new material, ROM may not
be followed because that would be found by experimental analysis only. However, this value is not affecting
much the final CTE values.
d. Heat Capacity of new composite is needed for calculating the thermal diffusivity. Heat capacity of Y2W3O12
is not available in literature but heat capacity of Y2O3 and WO3 were available at different temperatures.
Hence, that was calculated at service temperatures.
e. Thermal Conductivity is a temperature dependent property hence all estimated values are taken at normal
service temperatures.
f. CFD analysis is mainly carried out when theoretical analysis is not available and, in this report, both the
calculations were shown. To achieve the real solution, number of cells were kept as high as 5.3 million and
transient simulations are considered.
g. Porosity content of final composite was assumed, and conservative values were used.
h. It can be seen from 25 s of CFD run that new material provides better heat transfer rate than that of
Aluminum.

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