20.020 (LEC-1 Reference Manual)

LEC-1 Embedded Controller Card
Integrator Reference Manual
20.020 10/18/13
Rev 2.47
LEC-1 OEM Integration Reference Manual
Lanmark Controls Inc. has prepared this document for use by its personnel, licensees, and potential licensees. Lanmark
Controls Inc. reserves the right to change any products described in this document as well as information included
herein without prior notice. Although the information presented in this document has been tested and reviewed, this
document does not convey any license or warrantee beyond the terms and conditions set forth in the written contracts
and license agreements between Lanmark Controls Inc. and its customers.
The software described in this document is licensed from and is a trade secret of Lanmark Controls Inc. Refer to your
License Agreement for restrictions on use, duplication, or disclosure. Government users and prime contractors are also
governed by the following restricted rights legend:
RESTRICTED RIGHTS LEGEND. Use, duplication, or disclosure by the U.S. Government is subject to the Rights
in Technical Data and Computer Software clause at DFARS 252.227-7013 © (1) (ii) (Oct. 1988) and FAR 52.227-19 ©
(June 1987) or other agency provision is as applicable. Copyright Lanmark Controls Inc.
Copyright © 2012 Lanmark Controls Inc. – All rights reserved under the copyright laws of the United States of
America.
WinLase and Lanmark are registered trademarks of Lanmark Controls Inc. in the United States and/or other countries.
Other brands mentioned are trademarks or registered trademarks of their respective holders.
There is no implied warranty of fitness for a particular purpose, and Lanmark Controls Inc. is not responsible for
consequential damages. Individual components and/or software modules manufactured by Lanmark Controls Inc. or
others may be covered by their own warranties. Refer to the appropriate manuals for this information.
Lanmark Controls Inc. reserves the right to make changes to the product covered in this manual to improve
performance, reliability or manufacturability. Although every effort has been made to ensure accuracy of the
information contained in this manual, Lanmark Controls Inc. assumes no responsibility for inadvertent errors.
Contents of this manual are subject to change without notice.
Lanmark Controls Inc. 2

Table of Contents
1. Introduction .............................................................................................................................. 7
1.1 About this Manual ............................................................................................................ 7
1.2 Scope ................................................................................................................................ 7
1.3 Technical Support............................................................................................................. 7
1.4 Manufacturer .................................................................................................................... 7
1.5 Revision History ............................................................................................................... 9
2. Safety ...................................................................................................................................... 13
2.1 Safety labels and symbols .............................................................................................. 13
2.2 General safety guidelines ............................................................................................... 14
2.3 Safety Cautions............................................................................................................... 14
3. Product Introduction ............................................................................................................... 15
3.1 System Description ......................................................................................................... 15
3.2 LEC-1 Features............................................................................................................... 16
3.2.1 Hardware ................................................................................................................ 16
3.2.2 Software.................................................................................................................. 16
3.2.3 System Architecture Diagram................................................................................. 17
3.3 Technical Specifications ................................................................................................. 18
4. Principle of Operation ............................................................................................................ 19
4.1 Hardware Overview ....................................................................................................... 19
4.2 Software Overview ......................................................................................................... 21
4.2.1 LEC-1 On-Board Software ..................................................................................... 21
4.2.2 Streaming Mode ..................................................................................................... 22
4.2.3 Stand-Alone Mode ................................................................................................. 23
4.3 Scanning Job Fundamentals ........................................................................................... 24
4.3.1 Coordinate System Conventions ............................................................................ 24
4.3.2 Marks and Jumps .................................................................................................... 25
4.3.3 Basic Action Commands ........................................................................................ 26
4.3.4 Micro-vectoring ...................................................................................................... 27
4.4 Delays ............................................................................................................................. 28
4.4.1 Jump command ....................................................................................................... 28
4.4.2 Jump delay .............................................................................................................. 29
4.4.3 Mark Delay ............................................................................................................. 30
4.4.4 Laser On Delay ....................................................................................................... 31
4.4.5 Poly Delay .............................................................................................................. 32
4.4.6 Laser Off Delay ...................................................................................................... 33
4.4.7 Micro-vectoring ...................................................................................................... 34
4.5 Image Field Correction ................................................................................................... 35
4.5.1 Mirror Induced Distortion ...................................................................................... 36
4.5.2 F-theta Objective Induced Distortion ..................................................................... 37
4.5.3 Composite Distortion and Correction Methodology .............................................. 38
4.6 Laser Timing Control ..................................................................................................... 39
4.6.1 Secondary Laser Modulation .................................................................................. 40
4.6.2 Laser Timing .......................................................................................................... 40
4.7 Laser Timing Emulation ................................................................................................. 40
4.7.1 CO 2 Laser Timing .................................................................................................. 41
4.7.2 Nd:YAG Emulation Mode-1 Timing ..................................................................... 41
4.7.7 New Laser Mode Timings ...................................................................................... 41
4.8 System I/O Timing ......................................................................................................... 42
5. Using the LEC-1 Embedded Controller ................................................................................. 45
5.1 WinLase LAN Graphical User Interface ........................................................................ 45
5.1.1 User Interface ......................................................................................................... 45

5.1.2 COM Automation Server API ................................................................................ 46
5.1.3 Installing new Firmware ......................................................................................... 46
5.2 Pendant Controller .......................................................................................................... 48
5.2.1 Pendant Error Codes ............................................................................................... 48
5.2.2 Example Program ................................................................................................... 49
5.2.2.1 C# Example ........................................................................................................ 49
5.3 WinLase Embedded Graphical User Interface ............................................................... 50
6. LEC-1 Installation Requirements ........................................................................................... 51
6.1 Storage and Installation Environment ............................................................................ 51
6.2 Status LEDs .................................................................................................................... 52
6.3 Connection and Jumper Locations ................................................................................. 53
LEC-1 User Accessible Connector Pin-outs .............................................................................. 54
6.3.1 J9 Digital Servo Connectors ................................................................................... 54
6.3.2 J10 USB + Ethernet Connector .............................................................................. 54
6.3.3 J11 SPI AUX Connector ........................................................................................ 55
6.3.3.1 Input / Output Design Concept ........................................................................... 55
6.3.3.2 Timing Diagram ................................................................................................. 56
6.3.4 J12 Serial COM Connector .................................................................................... 57
6.3.5 J13 Video & Touch screen Digital Interface Connector ........................................ 58
6.3.6 J14, J15 X & Y-Axis Analog Connectors .............................................................. 58
6.3.7 J16 Z-Axis Analog Connector ................................................................................ 59
6.3.7.1 XYZ Analog Signal Descriptions ....................................................................... 59
6.3.7.2 Jumper Settings for Analog Servo Outputs ........................................................ 60
6.3.8 J17 USER I/O Connector ....................................................................................... 61
6.3.8.1 About the XY/2-100 Protocol Interface ............................................................. 61
6.3.9 J18 USER I/O Connector ....................................................................................... 62
6.3.10 J19 Analog Out 1 & 2 Connector ........................................................................... 63
6.3.11 J20 DC Input Power Connector .............................................................................. 63
6.4 Signal Conditioning ........................................................................................................ 64
6.5 Connector Part Number Reference ................................................................................. 67
6.6 Physical Dimensions ...................................................................................................... 68
7. End-User I/O Module Installation Requirements ................................................................... 69
7.2 Connection and Jumper Locations ................................................................................. 70
7.3 Jumper Positions............................................................................................................. 71
7.4 Connecting to the LEC-1 ................................................................................................ 72
7.5 End-User I/O Module User Accessible Connector Pin-outs .......................................... 73
7.5.1 J2Lower Control Connector ................................................................................... 73
7.5.2 J2Upper COM1 Connector ..................................................................................... 73
7.5.3 J3Lower XY2-100 Connector ................................................................................ 74
7.5.4 J3Upper User I/O Connector .................................................................................. 75
7.5.4.1 Power On Delay Circuit ..................................................................................... 75
7.5.5 J12A Backside Connector ...................................................................................... 76
7.5.8 J20A Power Connector ........................................................................................... 79
7.7 Physical Dimensions ...................................................................................................... 83
8. OEM Interface Module Installation Requirements................................................................. 85
8.2 Connector and Jumper Locations ................................................................................... 86
8.3 Jumper Positions – J14 ................................................................................................... 86
8.4 Connecting to the LEC-1 ................................................................................................ 87
8.5 OEM Interface Module User Accessible Connector Pin-outs ........................................ 88
8.5.1 J1 Laser Extension Connector ................................................................................ 88
8.5.2 J2 XY2-100 Connector ........................................................................................... 89
8.5.3 XY2-100 Connector D-Sub .................................................................................... 90

8.5.4 J3 User I/O Connector ............................................................................................ 91
8.5.5 User I/O Connector D-Sub ..................................................................................... 92
8.5.6 J4 COM1 Connector ............................................................................................... 93
8.5.7 COM1 Connector, D-Sub ....................................................................................... 93
8.5.8 J5 COM2 Connector ............................................................................................... 94
8.5.10 J6 COM3 Connector ............................................................................................... 95
8.5.12 J7 Ethernet Connector ............................................................................................ 96
8.5.13 J8 USB Connector .................................................................................................. 96
8.5.14 J20 DC Power Connector ....................................................................................... 97
8.5.15 J20A, J20B DC Power Connectors ........................................................................ 97
8.5.16 J21 Scan Head Power Connector ........................................................................... 98
8.7 Connector Part Number Reference ............................................................................... 101
8.8 Physical Dimensions .................................................................................................... 102
9. Extended I/O Module Installation Requirements ................................................................. 103
9.1 Storage and Installation Environment .......................................................................... 103
9.2 Connector and Jumper Locations ................................................................................. 104
9.3 Jumper Positions – W2 - W13 ...................................................................................... 105
9.4 Connecting to the LEC-1 .............................................................................................. 105
9.5 Extended I/O Module User Accessible Connector Pin-outs ........................................ 106
9.5.1 J1 SPI AUX Connector ........................................................................................ 106
9.5.2 J2 User Inputs Connector ..................................................................................... 107
9.5.3 J3 User Inputs Terminal Block ............................................................................. 107
9.5.4 J4 DC Power Connector ....................................................................................... 108
9.5.5 J7 User Outputs Connector ................................................................................... 108
9.5.6 J8 User Outputs Terminal Block .......................................................................... 109
9.5.7 J9 User Outputs Terminal Block .......................................................................... 110
9.6 Signal Conditioning ...................................................................................................... 111
10. SPI Laser Extension Board Installation Requirements ..................................................... 115
10.5 Jumper Positions – J10 ................................................................................................. 117
10.6 Switch Positions – SW1 ............................................................................................... 117
10.7 Connecting to the OEM Interface Module ................................................................... 118
10.8 SPI G3 Laser Extension Board User Accessible Connector Pin-outs .......................... 119
10.8.1 J1 Laser Extension Input Connector..................................................................... 119
10.8.2 J3 Interlock Connector ......................................................................................... 120
10.8.3 J5 LEDS Connector .............................................................................................. 121
10.8.4 J6 Analog Input Connector................................................................................... 122
10.8.5 J7 Laser Output Connector ................................................................................... 122
10.8.6 J8 Laser Status Connector .................................................................................... 123
10.8.7 J11 COM Connector ............................................................................................. 123
10.8.8 J20 DC Power Connector ..................................................................................... 123
10.10 Physical Dimensions ................................................................................................ 125
11. IPG Fiber Laser Extension Board Installation Requirements........................................... 127
11.5 IPG Fiber Laser Extension Board User Accessible Connector Pin-outs ...................... 129

11.5.2 J2 LEDS Connector .............................................................................................. 130
12. General Purpose Laser Extension Board Installation Requirements ................................ 135
12.5 General Purpose Laser Extension Board User Accessible Connector Pin-outs ........... 138
12.5.2 J2 LEDS Connector .............................................................................................. 139
12.5.6 J7 Analog Input Connector................................................................................... 142
12.5.7 J8 Aux Signal Connector Output Connector ........................................................ 142
13. Video Module Installation Requirements ......................................................................... 145
14. Warranty ........................................................................................................................... 147
15. Index ................................................................................................................................. 149
Appendix A – OEM Interface Module Schematics (55.026) ....................................................... 153
Appendix B – End-User Interface Module Schematics (55.019) ................................................. 157
Appendix C – SPI G3 Laser Extension Board Schematics (55.031) ........................................... 161
Appendix D – Fiber Laser Extension Board Schematics (55.036) .............................................. 165
Appendix E – General Purpose Laser Extension Board Schematics (55.028) ............................. 169

1. Introduction
Thank you for purchasing a Lanmark Controls Inc. LEC-1 controller card. The following guide will assist you in using
the LEC-1 with the associated I/O module.
1.1 About this Manual

This manual provides the following information for the Lanmark Controls Inc. LEC-1 system:
 product description
 operation
 installation
 troubleshooting
1.2 Scope
This manual covers the Lanmark Controls Inc. LEC-1 control board and the I/O-A optional interface board.
1.3 Technical Support

If you are experiencing problems and you need help, you should:
1. Retry the action, carefully following the instructions given for that task in this guide.
2. Try to determine the nature of the problem. By eliminating variables, the problem can be narrowed down. If it
appears to be hardware problems, check the documentation that came with your hardware for maintenance or
hardware-related issues. Contact your hardware representative if necessary.
3. Contact Lanmark Controls Inc. Customer Service department for additional technical support.
1.4 Manufacturer
Lanmark Controls Inc.

125 Nagog Park, Suite 305
Acton, MA 01720 USA
www.lanmarkcontrols.com


1.5 Revision History
REVISION DATE CHANGES FROM PREVIOUS REVISION

1.0 April 8, 2007 Original Release
1.1 May 22, 2007 Changed COM port call descriptions
1.2 July 10, 2007 Clarified LoadJob calls, added ClearJobList, RemoveJob
Changed “Visible Pointer” to “Ready”, changed “Busy/Ready” to
1.3 August 8, 2007 “Job Busy”, added jumper descriptions, added System I/O Timing
diagram.
1.4 September 19, 2007 Added pendant error codes
Changed Error to Error/System Enabled, added Latch on
1.5 November 30, 2007
LaserPower0, added new timing diagram.
1.6 December 11, 2007 Corrected Figure 52
1.7 January 3, 2008 Corrected Figure numbers
1.8 January 28, 2008 Added details on updating firmware to section 5.1.3
Added details for SetPerformanceGlobals and
1.9 March 5, 2008
SetMOTFEncoderRate
Added End-user outline drawing, preliminary RS-232 High speed
1.11 April 30, 2008
API commands.
1.14 June 19, 2008 Added I/O Job Selection documentation.
1.15 July 21, 2008 Redefined COM port calls
2.0 August 1, 2008 Finalized API call structure, removed string based protocol.
2.1 August 18, 2008 Added references to Job Select input on pin-out diagrams.
2.2 September 24, 2008 Added OEM Interface Module documentation
2.3 November 11, 2008 Added SPI G3 Controller documentation
Added TransformObject, GetObjectRect, GetObjectCenter,
2.4 November 14, 2008
GetObjectType
Changed the order of parameters in COMWriteChar and
2.5 November 20, 2008 COMWriteLine. Cleaned up typos and added more detail to some
descriptions.
Corrected pin outs for J1 on the OEM Interface Module and the
2.6 November 20, 2008
SPI G3 Laser Extension Board
Corrected dimensions on Fig. 44, added changes to I/O Job Select
2.7 December 9, 2008 section, updated Appendix A schematics, added Appendix B
schematics.
Corrected pin outs for J1 on the OEM Interface Module and the
2.8 December 18, 2008
SPI G3 Laser Extension Board
Added updated SPI G3 Extension board photo and defined jumper
2.9 February 3, 2009
and switch positions
Updated text return values in some API calls. Added additional
2.10 February 11, 2009
Error code definitions.
Corrected SetMOTFEncoder rate example to correctly indicate
2.11 February 12, 2009
bits/count.
Changed the RemoveJob definition. Clarified LoadFlashJob, and
2.12 February 21, 2009
LoadUSBJob
Added SW1 descriptions to SPI G3 board, replaced SPI G3 pinout
2.13 February 24, 2009
descriptions and illustration.


2.14 March 4, 2009 Updated OEM Interface Connector locations and J20 pinouts
2.15 March 11, 2009 Clarified the RemoteAPI command / response rules.
2.16 March 23, 2009 Added additional API response codes
2.17 April 9, 2009 Revised +5VDC current requirements to 4000 ma
Added SetUserOutBit, GetUserInWord, GetAllIOWords,
2.18 April 13, 2009
SetUserOutInitWord, GetUserOutInitWord API functions
2.19 April 19, 2009 Added J11 SPI AUX connector details to LEC-1 connector section
2.20 April 23, 2009 Added SPI G3 COM port detail, corrected pagination
2.21 May 12, 2009 Added EnableObject API command
Corrected pin out description errors on J17 of LEC-1, clarified
2.22 May 21, 2009
comments on SetUserOutInitWord API call.
Added Extended I/O Module section. Minor improvements
2.23 May 26, 2009
throughout.
Added Remote API functions SetObjectUserData,
2.24 June 8, 2009 GetObjectUserData, GetObjectString, GetObjectName,
GetMOTFEncoderCount, updated I/O Job Selection.
2.25 July 27, 2009 Added Status LED details to LEC-1 section.
Added new API Response Codes. Added default jumper positions
2.26 August 17, 2009
to 55.031
Updated SPI G3 schematics in Appendix. Added detail about use
2.27 August 25, 2009 of inputs for I/O Job Selection when Extended I/O option is
present.
Clarified Remote API call GetJobStatus. Added NoVectors
2.28 September 10, 2009
errorcode. Added GetJobExecutionStatus RemoteAPI call.
2.29 October 7, 2009 Added detail on LED connector on Laser Extension boards
Added new Remote API calls Echo, ClearMOTFEncoderCounter,
2.30 November 4, 2009 SampleMOTFEncoderCounter, ResetObject, and modified
GetMOTFEncoderCount.
Added new Remote API calls GetExternalStartMode,
SetExternalStartMode, TransformObjectByName,
2.31 December 3, 2009
ResetUserTransform. Added IPG Fiber Laser Extension section.
Added General Purpose Laser Extension Section.
2.32 December 7, 2009 Added IPG Fiber photos, connector details
2.33 December 9, 2009 Added new RemoteAPI call GetLensFileList
Corrected SW1 description for IPG Laser Extension, added SW1
2.34 December 30, 2009
description for General Purpose Laser Extension
2.35 January 4, 2010 Added new RemoteAPI call GetActiveJob
2.36 January 14, 2010 Typo corrections
2.37 March 18, 2010 Added new RemoteAPI call GetVersions
Added details to the ExecuteJobOnce and ExecuteJobContinuous
2.38 March 24, 2010
Remote API calls about dealing with Interlock conditions.
Added preliminary documentation on list commands, but they are
2.39 July 14, 2010 not currently implemented in the hardware. Added new API
response codes.


Added new RemoteAPI commands LoadLensFile,
GetLaserFileList, LoadLaserFile, GetMotion FileList,
LoadMotionFile, GetActiveLaser, GetActiveLens, and
2.40 August 2, 2010
GetActiveMotion. Updated documentation for GetFlashJobFileList
and GetUSBJobFileList by adding a leading “0,” on a successful
call.
Added new Remote API command ClearCommandFIFO. Added
new Error codes NotInCacheMode and NotWaitingForStartMark.
2.41 January 3, 2011
Corrected Figures 36, 37, 57 and 58. Added Opto-Isolator output
maximum current.
2.42 February 8, 2011 Clarified AUX SPI timing diagrams
Added new Remote API commands SaveFlashJob and
2.43 February 8, 2011
SaveUSBJob.
Added new Remote API commands TurnLaserOn and
2.44 February 24, 2011
TurnLaserOff.
Corrected GoToXYZ command documentation. Added new
Remote API commands ConnectNetworkShare,
2.45 April 12, 2011
GetNetworkFileList, LoadNetworkJob, and SaveNetworkJob.
Added new Remote API error code definitions.
2.46 June 6, 2012 Updated company address
2.47 December 3, 2012 Corrected pin outs for J12 on LEC-1.


2. Safety
Please read all operating instructions completely before installing and using the LEC-1 board.
2.1 Safety labels and symbols

The following safety labels and symbols are used throughout the documentation:
LABEL MEANING
Serious bodily injury or death.
Potential for serious bodily injury.
Potential for property damage and/or bodily injury.
SHOCK HAZARD - Electrical voltage present. Take

appropriate measures to protect yourself from electrical shock.
LASER HAZARD
ESD HAZARD

2.2 General safety guidelines
LASER RADIATION - Do not stare directly into a laser beam. Follow all system laser safety requirements during
installation and operation.
LASER RADIATION - Lanmark Controls Inc. recommends the use of a shutter to prevent unwarranted emission
of laser radiation, where practical.
2.3 Safety Cautions
Use of controls, adjustments, or procedures other than those specified in this manual without consulting a
competent safety professional may result in component damage, and/or exposure to potential hazards. Always
follow established industrial safety practices when operating equipment.
ESD HAZARD! Use appropriate anti-static wrist straps and/or work area equipment to prevent damage to the
board electronic components.
Always check your application program BEFORE running it. Errors can cause system damage.
Electronic boards are fragile! Handle and store with care. Protect electronic components from dust, humidity,
electromagnetic fields, static electricity, chemicals, and mechanical stress.

3. Product Introduction
3.1 System Description

The LEC-1 is a self-contained controller that provides advanced hardware and software control technology to drive
laser scanning systems. The LEC-1 control board is specifically designed for remote embedding and control of a scan
head or laser system, and is capable of controlling up to three motion axes with concurrent laser timing control. It also
provides integrated synchronization I/O for connection to factory automation equipment.
Connection to a PC for job download and administrative control is made via Ethernet® network using industry
standard TCP/IP protocols. In addition to Ethernet connectivity, the LEC-1 provides external USB connections to
support job file distribution via industry standard USB Flash disks. RS232 Serial I/O is also provided for a pendant
style user interface, serial laser control, and diagnostic access.
An optional End-User I/O Module board or an optional OEM I/O Module board provides an off-the-shelf solution for
communication and power connectivity, or custom cabling can be configured as desired. In a typical installation, the
LEC-1 is an “embedded” device, installed remotely in a laser scanning system. Positioning vectors are streamed from a
networked PC to the remote LEC-1 board which processes these vectors in real-time and sends them to the laser
steering galvo servos as analog or digital signals. Alternatively, the vector stream can originate from a locally stored
file in on-board or external USB based Flash memory.
There is no requirement to dedicate a full-time host PC to a laser scanning system, as the LEC-1 board can process
vectors while the PC is used for other purposes. In fact, one PC can support multiple LEC-1 based scanning systems
with no loss in performance. This is due in part to the large amount of buffer memory available on the controller, the
use of a separate supervisory processor on the controller to handle network communication processing, and the
complete off-loading of time critical tasks to a second real-time processor on the LEC-1.
An optional Video Interface board provides the capability for a locally installed display screen, which can be used for
machine control interaction. Both VGA video, and OEM LCD touch panel configurations are available.

3.2 LEC-1 Features
3.2.1 Hardware
 stand-alone design targeted at “embedded” installation in scanning equipment
 dual processor architecture with integrated 10/100BaseT Ethernet communication capability
 real-time processing engine for precise, synchronized scanner movement and laser control
 fully programmable laser control signals for most commonly used lasers
 direct analog or digital interface to XY or XYZ scan head galvanometer servo controllers
 16-bit galvanometer position command resolution
 industry standard XY2-100 scan head control
 integrated lens distortion correction table support
 integrated slave head control via XY2-100 standard protocol
 software selectable polarity and timing of all laser control signals
 two auxiliary analog output channels (12-bit) 0-10V for control of laser current or pulse intensity
 one 8-bit optically isolated digital output port for laser power control
 optically isolated digital inputs and outputs (four each) for external equipment synchronization
 four optically isolated interlock inputs
 one digital video connector for use with optional Video Interface Module
 two USB host ports for portable Flash disk access and other peripheral I/O
 16Mbytes of on-board Flash for local job and parameter storage
 one RS232 serial pendant port
 one RS232 serial laser control port
 two RS232 diagnostic control ports
3.2.2 Software
The Lanmark Controls Inc. LEC-1 is designed to fit into client-server architectures. The module implements all
required server code functions including identification broadcast, data streaming, command and control
communications, and real-time positioning operations. Host to module communications uses TCP/IP as a transport
mechanism over Ethernet.
Key features supported by the software are:

 compatibility with Windows® XP, Windows Vista, and Windows 7 operating systems
 administrative management of the LEC-1 including scanning head configuration data
 automatic device recognition for any number of network attached controllers
 COM access to high level object functionality through the WinLase LAN COMServer.
 support for lens correction files (65 x 65 data points) from any scan head vendor, to correct for field distortions
 designed to integrate easily with custom marking software applications

3.2.3 System Architecture Diagram

The following figure illustrates the functional concept of the LEC-1 product when integrated with other components in
a laser processing system.
Figure 1 LEC-1 Hardware System Architecture Diagram

3.3 Technical Specifications
Number of axes 3 (X, Y, Z)

Command resolution 16-bit (-32768 to +32767)
Analog:
 Differential output with software programmable range:
+/- 2.5 volts, +/- 5.0 volts, +/- 10 volts
 Optional jumper configuration for additional range capability of:
+/- 1.5 volts, +/- 3.0 volts, +/- 6.0 volts,
Single ended operation is possible using an analog ground reference and one of the differential output
signals. Signals present a 50-Ohm source impedance.
Galvo control Pos command
Digital:
 Full-time SPI serial digital output for the X&Y axes, 3.3V TTL compatible. Signal values
represented at the analog outputs are reflected on the SPI data channels.
 Factory jumper configurable SPI serial digital output for the Z axis, 3.3V TTL compatible. Signals
are presented at the Z axis connector in lieu of the analog signals.
 XY2-100 compatible protocol for X, Y and Z axes including status read back. Signal values
represented at the analog outputs are reflected on the XY2-100 data channels.
Galvo enable outputs, per axis, 5 volt TTL compatible, programmable polarity.
Auxiliary signals
Galvo status inputs, per axis, 5 volt TTL compatible, programmable polarity
No. of signals: 6, software programmable polarity and timing:
 LASERENABLE: asserted a programmable time prior to a sequence of mark instructions and de-
asserted after a programmable period of laser inactivity
 LASERON1: asserted when the laser is active
Laser control
 LASERON2: logical complement of LASERON1
 LASERFPK: programmable laser first pulse killer, or suppression signal
 LASERMOD1: programmable laser modulation or Q-switch pulse stream
 VISIBLEPOINTER: Used to enable/disable visible pointer laser
Electrical outputs 5 volt TTL compatible
Signal Resolution 20 ns, in 100 ns steps
User inputs Optically isolated  User In 1 - 4, programmable within WinLase job, or from Remote API.
User outputs Optically isolated  User Out 1 - 4, programmable within WinLase job, or from Remote API. Maximum 50 mA.
 BUSY: asserted when BeginJob instruction is executed and de-asserted when EndJob instruction is
executed. Maximum 50 mA.
System status Optically isolated  MARKINPROGRESS: asserted when marking is in progress. Maximum 50 mA.
 ERROR: asserted if an error is detected. Maximum 50 mA.
 READY: asserted when system is waiting for STARTMARK signal. Maximum 50 mA.
 STARTMARK: a marking job may contain an instruction that pauses execution until this signal is
Synchronization Optically isolated asserted by external equipment
RS-422 digital quadrature inputs (A & B phases + Index), used for tracking objects in motion and
Tracking
automatically compensating for that motion while marking. Compensation can be software configured
(Mark on the Fly)
to be applied to either the X or Y axis. Maximum pulse frequency 12.5 MHz.
4, optically isolated, programmable polarity - used to provide hardware level protection from accidental
Interlock protection Optically isolated
exposure to laser radiation
Ethernet 10/100 BaseT compatible
COM1: Full modem interface, configurable for motion control, pendant or RemoteAPI
Serial RS-232 COM2: Three-wire (Tx + Rx + Gnd) port, configurable for motion control, pendant or RemoteAPI
COM3: Three-wire (Tx + Rx + Gnd) port, configurable for motion control, pendant or RemoteAPI
USB 2 USB host ports for access to external Flash memory disks or other peripherals
 +/- 15-24 volts @ 500 mA
Electrical Requirements DC Power
 +5 volts @ 4000 mA

4. Principle of Operation
The LEC-1 controls a laser system’s galvanometer motors, accurately positioning deflection mirrors affixed to these
motors in synchronization with laser control signals. The motion sequence, the operation speed/s, the laser power used,
and any synchronization with external ancillary equipment is determined by scanning jobs created and formatted by
WinLase LAN. These jobs consist of sequences of instructions to the marking engine located on the LEC-1 module.
Some instructions configure the module, such as setting up to emit laser control signals with the appropriate timing
relative to the commanded motion of the laser beam steering galvos. Most instructions however, are sequences of mark
and jump instructions, which describe when and where to move the galvos and when to switch the laser control signals
in direct relationship to those motions.
4.1 Hardware Overview

The LEC-1 is a single board multi-processor system that contains a supervisory/ communications control processor,
and a high-performance FPGA responsible for real-time micro-vectoring and laser control. The following figure shows
a functional block diagram of the LEC-1 Module.
The LEC-1 is normally paired with an I/O expansion module that takes signals from the LEC-1 high-density ribbon
cable connectors and re-distributes them to functionally specific connectors that are easy to interface to.
The LEC-1 takes three voltages: ±15 to ±24V for the analog section, and +5V for the digital sections. Voltages required
for the various circuits on the module are regulated down from these supplies. Four mass-terminated ribbon cables
connect the LEC-1 to the I/O Module. Two are 40-pin 2mm pitch carrying all the system control signals, 1 is a 26-pin
0.050” pitch carrying the Ethernet and USB signals, and the other is a 20-pin 0.050” pitch cable carrying the RS232
serial communications signals.
The optional End-User I/O Module is intended to be mounted inside a controls cabinet with the LEC-1 main module
and presents connectors for interfacing to external devices such as lasers, automation equipment, and factory networks.
An OEM I/O module is available for OEM applications where connectivity internal to a controls cabinet is required.
When properly configured, the LEC-1 boots up from on-board Flash memory, configures any attached devices, and
begins local interaction with an attached pendant and local serial devices, and waits for network connections.

Figure 2 LEC-1 Hardware Block Diagram

4.2 Software Overview
4.2.1 LEC-1 On-Board Software

The LEC-1 contains a fully integrated processor and operating system capable of high-level communications with
WinLase LAN using TCP/IP protocols, or operating in a fully independent stand-alone mode. The control software of
the LEC-1 is stored in Flash memory on the module. In a networked application, the LEC-1 firmware boots upon
system power-up and periodically broadcasts identification information on the network. The WinLase LAN software
accepts and processes these broadcast messages. The broadcast messages contain data that identifies the serial number,
friendly name, and IP address of the LEC-1. This data, in turn is used to establish session communication channels to
the controller.
A communications session (WinLase LAN connection) permits the transmission of job data to the LEC-1 and the
reception of job-generated messages. Jobs are streamed to the LEC-1 with multiple levels of buffering to guarantee full
marking performance without CPU load-dependent timing anomalies. Two additional channels of communications are
provided to permit asynchronous job aborts, job pausing and resuming, and exception message propagation back to the
application.
WinLase LAN and the LEC-1 also support the concept of fixed configuration data, i.e. data that defines the
configuration of the scan-head and surrounding electronics. Examples of such data are lens correction tables, laser
interface signal polarities, lens field-size, focal length and calibration values, etc. This data can be set by WinLase LAN
and stored in Flash memory on the LEC-1. On the next power-up, the LEC-1 will load these configuration files from
Flash.
When running the board locally, WinLase Embedded provides the services to connect and interact with the LEC-1. In
addition, a local user interface is available for a richer user interface experience.

4.2.2 Streaming Mode

The LEC-1 embedded controller is capable of receiving job instructions sent as a stream of data in real time. This data
is meant to be executed by the vector engine as it arrives, and once consumed, is no longer available. WinLase LAN
fully supports the LEC-1 in streaming mode. The following figure illustrates the software architecture configuration in
Streaming Mode.
Figure 3 Streaming mode Block Diagram
Key Technology Blocks:

• PC – Computer running Windows® XP, Windows Vista, or Windows 7
• WinLase LAN GUI – Off the shelf user interface solution for job creation, editing and streaming.
• Custom GUI – Optional custom user interface software solution developed by the integrator using the
COMServer interface.
• PLC or PC Host – Optional host controller, using the Remote Interface API provided by WinLase LAN
• Local I/O – Local control over the marking process with Start Mark, Busy/Ready and Mark in Progress using
optional 24-bit I/O card installed in PCI slot.
• Marker Library – Software libraries providing job editing and marking functionality
• TCP/IP – Streaming information is passed between PC and LEC-1 over TCP/IP
• Marking Engine – Software libraries providing marking services for LEC-1

4.2.3 Stand-Alone Mode

In addition to streaming jobs in real time to the LEC-1, a user can create and edit job content with WinLase LAN and
save the job on the LEC-1 for execution at a later time. The number of jobs that can be saved is limited only by the
available storage on either the built in Flash memory, or an installed USB Flash drive. Individual jobs to be processed
are accessed and selected either on the local pendant interface, or through commands sent to the Remote Command
API. The Remote Command API is available via TCP/IP, the serial port (exclusive of the pendant), or a Bluetooth
module (future).
The following figure illustrates the software and control architecture configurations that are possible in Stand-Alone
Mode.
Figure 4 Stand-Alone Mode Block Diagram
Key Technology Blocks:

• Windows CE Embedded – LEC-1 running WinCE
• WinLase Embedded – Software libraries for job storage and execution services.
• WinLase Embedded GUI – Optional MMI (user interface) displayed on a local VGA monitor or OEM LCD
touch screen.
• PLC or PC Host – Optional host controller, using the Remote Interface API provided by WinLase Embedded.
• Pendant – Optional user interface pendant for local control of job editing and execution.
• Local I/O – Local control over the marking process with Start Mark, Busy/Ready and Mark in Progress using
hardware I/O ports of the LEC-1.
• External job storage – Externally connected compatible USB drive for job storage.
• Internal job storage – Embedded Flash memory for job storage.
• Vector Engine – Real time vector engine for direct control of scan head and laser equipment.

4.3 Scanning Job Fundamentals

The purpose of scanning jobs is to direct the motion of laser galvanometers while simultaneously modulating a laser
beam. The laser is turned on when a pattern is to be drawn, and off when moving to the beginning of a new pattern
location. In laser marker systems, the drawing action is commonly referred to as a “mark”, and a move to new pattern
location is called a “jump”. These terms will be used in the rest of this manual to describe these fundamental actions
even though an LEC-1 could be used for laser projection where a more appropriate term for “mark” might be “display”.
4.3.1 Coordinate System Conventions

Both of the basic movement commands, “mark” and “jump” are expressed in a Cartesian coordinate system that is
illustrated in the following figure.
Figure 5 Scanning system coordinate conventions
The imaging field is addressed using 16-bit integers with a range of -32768 to +32767. These units are referred to in the
following sections as “bits”. All job coordinates are expressed in these units. When a user desires to represent
coordinates in other units such as mm, WinLase LAN scales those coordinates appropriately taking into account the
projection system optics that are involved.

4.3.2 Marks and Jumps

Laser marking is specified by a list of instructions that defines “jumps” to locations and “marks” to the end points of a
vector or series of “connected” vectors otherwise known as poly-vectors. Other instructions represent commands to
specify related actions and pauses required to ensure the desired marking quality. WinLase LAN provides methods to
control these instructions through the interaction with marking objects and their properties. The terms Mark, Jump, and
related delays are defined below in the following figure.
Figure 6 A sample of the beginning of simple laser marking

The image is composed of straight line segments (vectors). Connected line segments are formed with sequential Mark
commands and spaces between unconnected segments are formed with Jump commands. Both Marks and Jumps are
controlled-velocity coordinated X & Y galvo motions. The speeds are controllable within a job.

4.3.3 Basic Action Commands
Command/Parameter Purpose
A jump causes a (typically) rapid movement of the scanner mirrors to a new position. Ideally no marking occurs
during a jump, and typically, the laser is turned off during a jump. The jump command defines the starting point
Jump
(X and Y coordinates) of the laser marking: the LEC-1 directs the laser to the end of the “jump” position where
marking will begin.
Determines the speed of the jump. The laser is off during a jump and the jump speed is set high enough to
JumpSpeed maximize throughput, but low enough to minimize instability in the galvo motion as the galvo slows down as it
approaches the next marking location.
A mark command begins the marking process. The laser typically turns on at the beginning of the mark command
and continues at a set speed to its pre-defined location (X and Y coordinates) of the end point of a mark
Mark
command. As shown in Figure 7, subsequent mark commands can create a sequence of marks. The laser is turned
off at the end of the last Mark command in a series of commands.
Sets the speed during marking. The speed is set to a value such that the laser forms the proper width and depth of
MarkSpeed
a mark in the target media. This is laser power and target material dependent.
Delays are used to ensure that the marking is complete with no skips, no over-burns, and no inadvertent marks.
Delays Delay commands are necessary to fine-tune system control, as needed to compensate for system inertia,
acceleration, deceleration, and requested jump and marking speeds.
In addition to the dynamic signals used to control the galvanometers and lasers, the LEC-1 provides supplemental
digital inputs and outputs for external equipment synchronization, and an analog output for laser power adjustment.
These signals can be manipulated at any point in a job, but are less tightly controlled in time as compared with the
galvanometer and laser control signals.
The initial galvanometer position after system power-up is the center of the image field. Marks and jumps are specified
from the current position of the galvanometers to a new target position. WinLase LAN jobs typically begin with an
absolute jump to the first marking position, and after that, each vector (jump or mark) starts at the new current position,
which is usually the end point of the preceding vector.

4.3.4 Micro-vectoring
Controlled velocity marking and jumping is accomplished through a process call micro-vectoring. This process is
illustrated in the following figure. The marking engine of the LEC-1 takes a vector and divides it into multiple shorter
segments that are applied to the galvos at regularly spaced time intervals. This interval is known as the update interval.
The galvo speed is controlled by the magnitude of the change in the output command at each update period.
The following figure shows the sequence of typical output commands for the X axis. The commands for the Y and Z
axes are similar and are strictly locked in time with the X axis, differing only in magnitude of the discrete steps. As the
X axis reaches successive targets X1,X2, etc., so do the Y and Z axes reach their corresponding targets, Y1, Z1,Y2, Z2,
etc.
Figure 7 Micro-vector operation

4.4 Delays
Because laser scanning systems are electro-mechanical in nature, various delays must be employed to compensate for
inertial effects of the mirror and motor structure. These effects generally result in a positional lag of the deflection
mirrors relative to the electrical command to make them move. These delays are used to properly time laser on/off and
modulation signals relative to the mirror positions. In addition to compensating for lag times, the delays can be used to
compensate for transient instability in mirror positions after a step to a new location. The following figures illustrate
these effects.
Each system configuration requires fine-tuning of delay commands to ensure full and complete marking with no over
burns. The individual delay settings are dependent on the dynamic response of the galvo/mirror combination in use, and
the sensitivity characteristics of the marking medium. Determining these delays is typically a trial-and-error process.
The delays are specified as part of the job definition described in the next section.
4.4.1 Jump command

During a jump, the system mirrors accelerate to rapidly get to the next mark position, ideally at the fastest speed
possible to minimize overall marking time. As with all accelerations, mirror and system inertia create a slight lag at the
beginning of the acceleration. Likewise, the system will require a certain delay (settling time) at the end of the jump as
it decelerates to precisely the correct speed required for accurate marking. Acceleration and deceleration times and
settling times will vary from system to system (weight of mirrors, type of galvanometer, etc.), and will vary depending
on the requested jump speed and the length of the jump.
Figure 8 Effects of the Jump Command

4.4.2 Jump delay

Too short of Jump Delay will cause marking to start before mirrors are properly settled, resulting in inadvertent
marking. Too long of a Jump Delay will have no visible effect, but marking is delayed so overall job production time
(marking time) increases.
Figure 9 Jump Delay too short: Marking starts before mirrors properly settle

4.4.3 Mark Delay

A mark delay at the end of marking a line segment allows the mirrors to complete the move to the required position
prior to executing the next mark command.
Too short of a Mark Delay will allow the subsequent jump command to begin before the system mirrors get to their
final marking position. The end of the current mark will turn towards the direction of the jump vector, as shown to the
right. Too long of a Mark delay will cause no visible marking errors, but will add to the overall processing time.
Figure 10 Mark Delay too short: Marking continues into a jump vector

4.4.4 Laser On Delay

The Laser On Delay can be used to prevent burn-in effects at the start of a vector. This delay in time before the laser is
turned on is typically used to turn on the laser after the first few micro-steps of a mark command to ensure that the
laser’s motion control systems (mirrors, Etc.) are “up to speed” before marking. This delay can have either a positive or
a negative value and will vary with different systems and lasers because of galvo motor and mirror inertias, and laser
activation timings. Typically, too short of a delay will cause burn-in effects, and too long of a delay will cause skipping
or missing vector segments, where the vector mark has started before the laser has switched on.
Figure 11 Laser On Delay too short: Burn-in at vector start points
Figure 12 Laser On Delay too long: Marking starts too late, skips vector start points

4.4.5 Poly Delay
A polygon delay is a delay automatically inserted between two marking segments where two vectors meet. The
minimum delay allows enough time for the galvos and mirrors to “catch up” with the command signal before a new
command is issued to move on to the next point.
Figure 13 Poly Delay too short: Characters not well formed

If a variable polygon delay mode is selected, then the delay is variable and changes as a function of how large an
angular change is required to move on to the next point. The larger the angular change, the longer it takes for the galvos
and mirrors to change direction and accelerate to the required marking speed in the new direction. The delay is scaled
proportionally to the size of the angle.
Figure 14 Poly Delay too long: Burn-in at vector junctions

4.4.6 Laser Off Delay
The Laser Off Delay is used to prevent burn-in effects at the end of a vector. This delay in time before the laser is
turned off is typically used to turn off the laser just before the last few micro-steps of a mark command to ensure that
the marking stops exactly where it is desired to stop.
Figure 15 Laser Off Delay too short: Marking stops too soon, skipping vector endpoints
The goal is to adjust the Laser Off Delay to ensure uniform marking with no variations of intensity throughout the
desired vector. Typically, too short of a delay will cause skipping of vector endpoints as the laser switches off too early,
and too long of a delay will cause burn-in at the end of a vector where the laser stays on too long.
Figure 16 Laser Off Delay too long: Marking stops too late, burn-in at vector end points

4.4.7 Micro-vectoring
The relationship of the delays to the micro-vectoring process is illustrated in the following figure.
Figure 17 Micro-vectoring and laser timing relationships

4.5 Image Field Correction

Image field correction capability is provided to compensate for optical errors induced by all two-mirror laser beam
systems. These optical distortions are caused by a number of factors, including the distance between each mirror, the
distance between the mirrors and the image field, and the type of lens used in the laser for focusing the laser beam.
Figure 18 Projection system layout

4.5.1 Mirror Induced Distortion

Projection of a laser beam via an X-Y mirror set controlled by galvanometers induces distortion in the X axis
proportional to the tangent of the angle of the Y axis mirror and the distance from the focal plane to the center of the Y
axis mirror. This distortion is also known as “pincushion” distortion.
Figure 19 Pincushion distortion caused by X-Y mirror set

4.5.2 F-theta Objective Induced Distortion

The addition of an F-theta objective in the laser field provides direct proportionality between the scan angle and the
distance in the image field, as well as ensures that the focus lies on a flat surface. F-theta objective lenses, like all
optical lenses, are not perfect and induce their own projection field distortions. This distortion, illustrated in the
following figure, is called “barrel” distortion for what it does to a square image. In reality, this distortion is radially
symmetric from the image field origin and can often be modeled as a third order polynomial. Many projection lens
vendors will provide these model coefficients, or measurement data from which these coefficients can be derived. For
many applications, however, this distortion is negligible.
Figure 20 Barrel distortion caused by F-theta lens

4.5.3 Composite Distortion and Correction Methodology
Figure 21 Composite Image Field Distortion

The two distortion components described previously combine to create a distorted image field similar to that shown in
the preceding figure. This distortion is automatically compensated for by the LEC-1 through the use of correction
tables.
Correction tables represent a 65x65 element grid covering the full addressable projection range of the system. Each grid
element contains three correction components: one each for the X, Y and Z axes. The components represent an offset
that if added to an ideal position command for that point, would alter the galvo positions such that the resulting
projected point would fall onto a “perfect” grid, i.e. the point would be “corrected”.
During the micro-vectoring process at each update interval, the LEC-1 calculates the ideal position of the mirrors along
the path. It compares this value to the correction table grid and accesses the four grid points that immediately surround
the calculated point. The corrections at these four points are proportionally averaged depending on how close the ideal
point is to each grid point. This process, called bi-linear interpolation, produces a correction that is applied to the ideal
point, and the result is then sent to the system D/A converters and serial digital command outputs.
WinLase LAN provides a lens correction file conversion feature, which allows the use of any lens correction file from
the major scan head vendors.

4.6 Laser Timing Control

The LEC-1 provides very flexible laser control capability that is synchronized with galvo motion control. Six1
dedicated TTL compatible signals are provided at all times whose timing relationships are defined by the diagram
below. Not all signals may be required for a given customer laser configuration. An integrator need only select an
appropriate subset of these signals, and configure them via a WinLase LAN laser configuration Wizard with
appropriate timing parameters. Provisions are made for the synchronous control of two separate lasers running with two
independent pulse-widths during the laser-on period.
Figure 22 Laser timing relationships

Notes: 1. Laser Enable Delay, Laser Enable timeout, and Laser Modulation Delay must be >=0.
2. Laser Enable Delay is relative to the leading edge of LASER ON, but the leading edge of LASER ENABLE
will never occur after: a) Micro-vector start, b) the leading edge of LASER ON, or c) the leading edge of
LASER FPK.
3. Laser On delay may be positive or negative and is relative to Micro-vector start.
4. Laser FPK position may be positive or negative relative to the leading edge of LASER ON.
5. Laser pulse generation starts relative to but no earlier than the leading edge of LASER ON or the leading
edge of LASER FPK.
6. Standby pulse suppression is accomplished by setting the standby pulse width to zero.
7. The first laser-on laser pulse on LASER MOD is always a full pulse.

4.6.1 Secondary Laser Modulation
Secondary laser activation and modulation signals are also provided which are the logical complements of LASER ON
1 and LASER MOD respectively. The LASER MOD 1 and LASER MOD 2 signals are time-related in that the periods
of the signals must be the same for the Standby and Output active intervals. The phase of the two signals is locked 180
degrees apart from each other to ensure that the two lasers never fire at the same instant of time, thus reducing peak
power demands and reducing EMI effects. Otherwise, the pulse widths during the Standby and Output active intervals
are independent and programmable for each signal.
4.6.2 Laser Timing

The preceding laser timing diagram introduces 12 possible timing parameters that can be set to yield signal
relationships that are suitable for controlling all known commercial lasers used in marking or projection scanning
systems.
The reference point for the timing is the beginning of micro vectoring shown on the diagram as Micro-vector start.
When the marking engine processor encounters a mark instruction it asserts the LASER ENABLE signal and waits the
specified Laser Enable Delay. The LASER ENABLE signal is normally used to precondition fiber laser systems in
anticipation of being called into action during a marking operation. LASER ENABLE will remain asserted until the
Laser Enable timeout period expires after marking has stopped, i.e. after the last vector of a sequence of marking
vectors. If a new series of marking vectors begins before the Laser Enable timeout expires, LASER ENABLE remains
asserted and a new timeout period is armed.
When the Laser Enable delay expires, one of three things will happen based on the setting of the delay parameters:
1. Micro-vectoring begins if Laser On Delay and Laser FPK position are both positive.
2. LASER ON is asserted if Laser On Delay is negative and Laser FPK position is positive.
3. LASER FPK is asserted if Laser FPK Delay is negative and Laser On Delay is also negative OR if Laser FPK Delay
is negative and the absolute value of Laser FPK Delay is larger than Laser On Delay if Laser On Delay is positive.
As can be seen from the diagram the timing of laser emission is directly related to the timing of the LASER ON signal.
Pulse emission will never occur earlier than the leading edge of LASER ON or LASER FPK, but may be delayed after
the leading edge of LASER ON by setting the Laser Modulation Delay to a non-zero value. The LASER FPK signal
may be asserted any time before or after the leading edge of LASER ON. The signals LASER FPK and LASER MOD
are dependently related to the timing of LASER ON. That is, if Laser On Delay is changed, the system timing is
changed to keep all three signals in the proper timing relationship.
The lasers are turned off automatically after the micro vectoring completes and the Laser Off Delay expires. The
LASER ON signal is de-asserted and the LASER MOD 1/2 signals switch to the standby mode. Certain lasers, e.g.
CO 2 , do not require any LASER FPK signal. Users have complete control over these parameters when using the Laser
Configuration Wizard in WinLase LAN.
4.7 Laser Timing Emulation

Traditional laser scanning controllers often use fixed signal sets and constrained timing relationships to provide laser
control, whereas the LEC-1 uses a completely flexible and programmable suite of signals. The LEC-1 can be
configured to emulate the timing produced by other commercial controllers because of the flexible nature of the laser
timing generator.
Typical laser configurations are described in the following sections. These configurations emulate the typical standard
laser controls required by currently available scan head and laser combinations.
These configurations are by no means the only ones possible and new laser systems are frequently introduced. Most
notably within the past two years, fiber lasers have become much more reliable and affordable offering compact
packaging and highly efficient energy properties. The LEC-1 has been specifically designed to accommodate the
unique timing requirements of these and other developing lasers.

4.7.1 CO2 Laser Timing
The simplest emulation mode is for CO 2 lasers. These lasers do not require a Laser FPK signal so these parameters are
set to zero. LASER ENABLE is also not typically needed therefore the Laser Enable Delay and Laser Enable timeout
can be set to zero to maximize throughput. In fact, whenever LASER ENABLE is not required, the Laser Enable Delay
should be set to zero.
Additional to the required laser modulation for processing, certain lasers benefit from a ‘Tickle’ signal to assist initial
activation. The can be set as the ‘Standby Modulation’ with an appropriate frequency and duty cycle as specified by the
laser manufacturer. The standby tickle signal will then be overridden by the main LASER MOD signal required for
processing when the micro vectoring starts.
4.7.2 Nd:YAG Emulation Mode-1 Timing

Most of the Nd:YAG modes do not require standby or idle pulses. To suppress these pulses, the Standby pulse width
and pulse period are set to zero. In this mode, the LASER FPK is asserted coincident with the LASER ON and LASER
MOD signals, but its assertion can have variable length. If the Laser On Delay is modified, the timing of LASER FPK
and LASER MOD track with it.

In this mode, the LASER FPK signal is a 10µ sec pulse asserted a variable amount of time prior to the assertion of
LASER ON and the coincident generation of pulses. This timing is typically suited for Lee and Coherent lasers.

This mode is very similar to Mode-2. The difference is that Laser FPK length can vary. Spectron lasers normally use
this type of timing.

In this mode, the LASER FPK signal leading edge is coincident with the leading edge of LASER ON and the
generation of the laser pulses is delayed to be coincident with the trailing edge of the LASER FPK signal.

This mode is very similar to emulation mode-4. The difference is that the start of laser pulse generation is 10µ sec after
the coincident leading edges of LASER ON and LASER FPK.
4.7.7 New Laser Mode Timings

Please contact us directly should you have purchased, be in development with, or have acquired a laser that is not
serviced by the laser timing modes available, at info@lanmarkcontrols.com

4.8 System I/O Timing

The LEC-1 provides very flexible System I/O control capability for applications that require the LEC-1 to interact with
other process control equipment. Not all signals may be required for a given process control scenario. There are four
opto-isolated fixed purpose system outputs and 5 opto-isolated fixed purpose system inputs. An integrator need only
select an appropriate subset of these signals.
System Outputs:
• Error / System Enabled – From a cold start, or on a reset, the opto-isolator output transistor will be OFF (not
conducting) until the LEC-1 has completed its initialization sequence and is ready for operation. Once the
LEC-1 is ready (approximately 20 seconds), the output transistor will turn ON (conducting). The output
transistor will turn OFF (not conducting) if the following occurs: software exception, interlock trigger, or
opcode command exception.
• Job Busy – This output indicates when a job is busy marking. When no marking is occurring, the Job Busy
opto-isolator output transistor will be ON (conducting). The Job Busy opto-isolator output transistor will turn
OFF (not conducting) when the first object starts marking, and stays OFF until the last object is finished
marking. The Job Busy output transistor then turns ON (conducting).
• Ready – This output indicates when the LEC-1 is waiting for a Start Mark signal. Normally the opto-isolator
output transistor will be ON (conducting). When the LEC-1 starts waiting for a Start Mark signal, the
transistor will turn OFF (not conducting). When the Start Mark signal is received, the Ready output transistor
turns ON (conducting). The Ready output will not change state if a job is executed from the software with the
External Start feature disabled.
• Mark In Progress – This output indicates when a job is busy marking and is identical to the Job Busy output.
When no marking is occurring, the Mark In Progress opto-isolator output transistor will be ON (conducting).
The Mark In Progress opto-isolator output transistor will turn OFF (not conducting) when the first object
starts marking, and stays OFF until the last object is finished marking. The Mark In Progress output transistor
then turns ON.

System Inputs:
• Start Mark – This input is used to start the job marking sequence. The marking job must be configured to use
the External Start feature. To start the marking sequence, switch the Start Mark input to HIGH.
• Interlock 1-4 – Four individual Interlock inputs are provided as a means to immediately abort the current
process and set all laser outputs to the Idle state. The trigger level of the Interlock inputs can be configured to
be HIGH or LOW active.
Figure 23 System I/O timing diagram


5. Using the LEC-1 Embedded Controller

Because of the flexibility of the LEC-1 architecture, there are a number of different system integration possibilities that
are available. All possible solutions rely on a combination of the following interfaces to control the LEC-1 in a marking
application:
• WinLase LAN Graphical User Interface
• Pendant controller, for local interaction
• Remote Command API, for interaction with a PC or PLC
5.1 WinLase LAN Graphical User Interface

The WinLase LAN Software includes the following:
• WinLase LAN Graphical User Interface.
• Lanmark Controls Inc. COM server object interface.
• Full documentation on the features of the included software tools.
5.1.1 User Interface

WinLase LAN elements include:
• Line-art graphics: CAD, line-drawings, logos.
• Shaded graphics: photos, halftones & grayscale artwork.
• TrueType: filled or outline-only.
• Single point or drill object arrays.
• AutoDate, TextMerge, Serialization, and Barcode.
• Automation: I/O control, 4-axis motor control, time delays, custom operator messages.
WinLase LAN facilitates the creation, editing, control, execution, and automation of all laser-marking tasks. The
WinLase LAN Software Suite includes the following features:
• Password-protected security lockout – operators can be limited to only selected and running Jobs.
• Multiple open Jobs – quickly switch between marking tasks with a mouse click
• Background template – place an image of the parts tooling in the background to aid in mark placement
• Runtime Fill - change fill levels “on the fly” to develop the optimum in image quality for each object type and
material.
• Full support for lasers with visible pointers for real time positioning of the mark
• HPGL (*.plt), WMF (*.wmf), EMF (*.emf), DXF (*.dxf), EPS (*.eps), JPEG (*.jpg), GIF (*.gif), PCX (*.pcx),
and Windows Bitmap (*.bmp) graphic filters.
• Internal capability to generate linear and radial text, barcodes, AutoDate, serialization, and hole drilling.
• Complete TrueType font support – engrave any TrueType font installed on the system.
• Scale, move, rotate, group, or reverse any object on the screen.
• Precise numerical control of laser-operation parameters.
• Automation scripts easily built via mouse click.
• Programmable alerts, warning, and run-time operator input of job numbers, batch numbers, etc.
• Built-in 4-axis motor control – use rotary tables, linear motion, and/or XY tables.
• Text marking on cylindrical parts using an optional rotary indexer.

WinLase LAN contains all of the elements of a multi-element Job Editor, automation sequencing tool (simplified ladder
logic), and password-protected Operator’s Interface. Most procedures can be efficiently served entirely from within the
program.
Figure 24 The WinLase LAN User Interface Main Screen
5.1.2 COM Automation Server API

WinLase LAN exposes a COM Automation server, which offers external programs the ability to communicate with and
control WinLase LAN. For detailed information on the COM Automation server interface, please refer to the document
package WinLase COM Automation Server Interface Manual available separately from Lanmark Controls Inc.
Please refer to the WinLase Professional Reference Manual for complete details on using the WinLase LAN software
package.
5.1.3 Installing new Firmware

From time to time, Lanmark Controls Inc. will release an updated version of the firmware resident on the LEC-1 board.
This update may be in the form of a single file, or a web link.
WARNING: When updating the LEC-1 firmware, all files stored locally on the LEC-1 will be lost. It is highly
recommended to back up any job files that have been stored in the flash memory of the LEC-1.
NOTE: After updating the firmware, the LEC-1 board must be automatically (or manually) restarted for changes to
take effect.

To install an update from a provided update file:
1. From the Main menu of WinLase, click Tools -> Laser System device software update. The backup warning
appears.
2. Click Yes, and the Browse for Laser System software updates dialog box appears.
3. Browse to the provided Update file, select it, and click Open. The Laser System Software Updater appears.
The settings listed in the Laser System Software Updater consist of the following:
• Refresh button – Click this button to rescan the network for LEC-1 cards.
• Laser System name – The name of an LEC-1 board that has been detected on the network. The icon representing
the LEC-1 will also indicate it’s status.
• Current – The version of the firmware currently on the LEC-1.
• Status – Indicates whether the update file you have selected is newer, older, or the same version as the version
currently on the LEC-1.
• Automatically restart Laser System(s) after update – On current firmware versions after 1.4.2, the LEC-1 can
automatically restart when the firmware update is complete. In order for changes to take effect, the LEC-1 must
be restarted after an update session. On LEC-1 cards with current firmware previous to 1.4.2, this checkbox has
no effect, and the LEC-1 must be restarted manually.
• Update button – After selecting the LEC-1 boards to update, click the Update button to start the process.
4. Select the LEC-1 boards to update, and click the Update button.

5.2 Pendant Controller
5.2.1 Pendant Error Codes

The following error codes may be displayed when the pendant is executing jobs locally.
LoadFail = 100
NoObjects = 101
NoProperties = 102
WriteFail = 103
FileFormat = 104
FileException = 105
UnknownObject = 106
UnknownType = 107
NotSupported = 108

5.2.2 Example Program

An example program is provided to illustrate how to initiate a session with the LEC-1, load a job stored locally on the
controller, run the job once, and then close the session.
5.2.2.1 C# Example
This is an example written for the LAN interface. Error checking of the value returned from Socket.ReadLine() has
been omitted for clarity.
//Connect to the LEC-1(with specific platform function call)

Socket.Connect();
string result = Socket.ReadLine(); //Welcome banner sent by LEC-1
//Take exclusive control of the LEC-1

Socket.WriteLine(“2”);
result = Socket.ReadLine();
//Load a job
Socket.WriteLine(“205,testjob.dat”);
//Make the job active

Socket.WriteLine(“201,testjob.dat”);
//Run the job once

//Wait while job is running

do
{
//Check job status
Sleep(100);
}
while (result != “Idle”);
//Close session
//Disconnect (with specific platform function call)

Socket.Close();

5.3 WinLase Embedded Graphical User Interface

WinLase Embedded was not released at the time of this revision.

6. LEC-1 Installation Requirements
Figure 25 The LEC-1 Embedded Controller
6.1 Storage and Installation Environment
board and the electronic components.
Protect the LEC-1 boards from mechanical stress, humidity, dust, and thermal damage. Storage temperature is -20° C to
+ 60° C. Operating temperature is 15 to 35° C.
The LEC-1 boards are designed for installation in or near a marking head. Remote connection/programming download
control can be achieved via an Ethernet connection, USB cable, or serial connection.

6.2 Status LEDs

There are 7 status LEDs located adjacent to J14. The following figure and charts describe each status LED.
Figure 26a Status LED locations
Status LED Purpose

LEC-1 BROADCAST indicator. Blinks approximately once per second to indicate when the LEC-1 is broadcasting its
D2
presence to the network. During startup, D2 and D3 indicate the progress of the startup procedure. See below for details.
D3 During startup, D2 and D3 indicate the progress of the startup procedure. See below for details.
D20 FPGA PROCESSING indicator. Command information is being processed by the FPGA real time engine when blinking.
FPGA ERROR indicator. This LED will be on after initial startup, but will turn off when the first FPGA command is
D21
processed.
D23 FPGA STATUS indicator. This LED will blink constantly indicating the FPGA real time engine is running.
D1 CPU ERROR indicator. This LED should blink briefly when the LEC-1 is first powered up, then turn off.
D19 CPU STATUS indicator. This LED should blink briefly when the LEC-1 is first powered up, then turn off.
Startup state D2 D3 Comments

1 OFF OFF Initial state
2 ON ON Initialization started, USB ports initializing, Hosts initializing
3 OFF ON FPGA initializing, configuration tables loading
4 ON OFF Checking IP address
5 BLINKING BLINKING Waiting for valid IP address if in DHCP mode
6 BLINKING OFF Start Broadcasting, and in run state

6.3 Connection and Jumper Locations

NOTE: Connectors and jumpers not listed are reserved for Lanmark Controls Inc. use.
Figure 26b LEC-1 connection and jumper location map

LEC-1 User Accessible Connector Pin-outs

The following sections describe each user accessible connector on the LEC-1 board.
6.3.1 J9 Digital Servo Connectors

Pinouts for connector J9 available on request.
6.3.2 J10 USB + Ethernet Connector

This section contains pin-out and connectivity details for the J10 Ethernet & USB connectors. Connector J10 on the
LEC-1 board provides access to Ethernet and USB connectivity. The following figure details pin-outs and relevant
signal names.
Figure 27 J10 26-pin connector pin-outs.

6.3.3 J11 SPI AUX Connector

This section contains pin-out and connectivity details for the LEC-1 J11 SPI AUX connector. Connector J11 on the
LEC-1 board provides an interface for implementing Extended I/O. Extended I/O provide 16 output bits (designated
User Out 5 User Out 20), and 16 input bits (designated User In 5 – User In 20). Note that these signals are active
ONLY on version 2.2.x of the LEC-1 firmware or later.
Figure 28 J11 SPI AUX connector pin-outs
6.3.3.1 Input / Output Design Concept

For User I/O, the controller uses an industry-standard SPI interface. This synchronous serial interface uses a master bit
clock (SCLK) of 12.5 MHz. The interface is implemented from the controller perspective as a “register model” where
the CPU reads or writes to a register in the local FPGA, which is responsible for performing the SPI timing. The FPGA
runs constantly (with or without CPU attention), reading or writing User Out and User In bits approximately every 6
µs.

6.3.3.2 Timing Diagram
Figure 29 SPI AUX timing diagram. Time values are for reference only and are not accurate.
Important considerations:
• The User Out bits are gated by the select line SS0 and the User In bits are gated by SS1. The Input and Output
signals are therefore independent. The current controller implementation alternates between Input and Output
signals (i.e. they cannot happen simultaneously and are approximately 6 µs apart).
• The User Out (UOUT) and User In (UIN) data bits only occupy the upper two bytes of the 32-bit data word.
This is specific to this implementation of SPI. For User In (UIN), the lower two bytes must have the data
0xA500.
• UIN corresponds to User In and UOUT corresponds to User Out on J18. The numbering of the User Out and
User In bits goes from 5 to 20 due to the fact that User Out and User In 1 through 4 are implemented on J18.
• The highest order SPI data bit (31) controls the lowest User In/Out bit (5) and that there is an inverse
relationship between these bits.

6.3.4 J12 Serial COM Connector

Connector J12 on the LEC-1 board provides access to the Serial connections. The following figure details pin-outs and
relevant signal names for the Serial connectors.
CO M1 Trans mit Data (1) (2) COM2 Transmit Data

COM1 Requ est to Send (3) (4) COM2 Receive D ata
COM1 Data Term in al Read y (5) (6) GN D
COM1 Rec eive Data (7) (8) COM3 Transmit Data
GN D (9) (10) COM3 Receive D ata
GN D (11) (12) GN D
CO M1 Clea r to Send (13) (14) FPGA Transmit Data
COM1 Data S et Ready (15) (16) FPGA Receive Data
COM1 Carri er Detect (17) (18) GN D
COM1 Ring Indicato r (19) (20) GN D

6.3.5 J13 Video & Touch screen Digital Interface Connector

The J13 video and touch screen interface connector is specific to the Lanmark Controls video and touch screen product
that is supplied at customer request to function with the LEC-1 card.
6.3.6 J14, J15 X & Y-Axis Analog Connectors

Connectors J14 & J15 on the LEC-1 board provides access to X & Y-Axis connections, respectively. Figures 33 and 34
detail the connector pin-outs. Since the X & Y-Axis servo control electronics are expected to be contained within a
marking head along with the LEC-1 controller, there are no provisions to provide external access to these signals via
the optional I/O Module.
Figure 31 J14 6-pin X-axis servo connector pin-outs.
Figure 32 J15 6-pin Y-axis servo connector pin-outs.

6.3.7 J16 Z-Axis Analog Connector

Connector J16 on the LEC-1 board provides access to Z-Axis connections. The following figure details pin-outs and
signal names for the connector.
Figure 33 J16 6-pin Z-axis servo connector pin-outs.
6.3.7.1 XYZ Analog Signal Descriptions

The position command outputs for the X, Y and Z axes are differential analog signals that are actively driven. If the
servo board has a single-ended input, the reference is the analog ground reference and the positive signal (plus signal)
will be the controlling output signal from the control board.
Differential signals are used on some controllers to reduce inherent signal noise, particularly when transferring signals
over long distances.
NEVER connect the negative (minus) signal on the board to ground or you will damage the board.

6.3.7.2 Jumper Settings for Analog Servo Outputs

A jumper can be installed on J30-32 to change the laser galvanometer analog command voltage from the standard
(±10V, or ±5V, or ±2.5V) to ±6V, ±3V, and ±1.5V, respectively. J30 affects the X axis, J31 the Y axis, and J32 the Z
axis. Note: J30, J31, and J32 are the ONLY user jumper settings on the LEC-1 board.
Figure 34 LEC-1 Voltage jumper position settings for non-standard galvo systems. No jumper = ±10V, ±5V or
±2.5V
Figure 35 LEC-1 Voltage jumper position settings for non-standard galvo systems. Jumper installed = ±6V, ±3V
or ±1.5V

6.3.8 J17 USER I/O Connector

This section contains pin-out and connectivity details for the LEC-1 J17 USER I/O B connector. Connector J17 on the
LEC-1 board provides access to User I/Os. The following figure details pin-outs for the J17 USER I/O A connector.
6.3.8.1 About the XY/2-100 Protocol Interface

The XY2-100 Protocol is a serial digital protocol that allows you to connect the controller to a packaged scan head, and
send command data digitally. Each command is broken up and sent in a 20-bit serial data stream. The stream is
received at the scan head (and re-assembled into a parallel “word”) and converted via an A/D (analog/digital) converter
to an analog signal to drive the scan head galvanometer motors. The signals that comprise the XY2-100 protocol can be
accessed via the optional End-User or OEM I/O Module.

6.3.9 J18 USER I/O Connector

This section contains pin-out and connectivity details for the LEC-1 J18 USER I/O A connector. Connector J18 on the
LEC-1 board provides access to User I/Os. The following figure details pin-outs for the J18 USER I/O A connector.
All output signals are optically isolated. The 8-bit laser power data connectors are intended to provide digital
representation of the laser power information. The 0-255 signal range corresponds to a voltage range of 0-10V for
control of a digital laser. (Direct analog control of a laser is provided through connector J19.)
Four interlock lines are also available to provide interlock protection for the system, which can be connected to safety
switches (for example, door interlocks, etc.). All laser pattern generation will stop immediately, and any current job
will be aborted and will need to be reset.
There are four user inputs that are intended to provide external synchronization capability with external equipment (for
example, a loader or handler).
There are four independent user outputs that are intended to provide system status/state information to external
equipment and/or user signaling devices.
A fifth user input, the Start Mark signal, is provided for specific use as the start process input.
Figure 37 J18 40-pin connector pin-outs

6.3.10 J19 Analog Out 1 & 2 Connector

Connector J19 on the LEC-1 board provides access to Laser Analog connections. The following figure details pin-outs
and relevant signal names for the connector. The Laser Analog Power connectors are differential analog signals that go
from 0-10V (not negative). The intent of the laser analog power is to set the laser power level for the duration of a
marking object. The AOM output is typically used in systems where the instantaneous power is adjusted at every pixel
within a bitmap, for example.
Figure 38 J19 6-pin Laser Analog connector pin-outs.
6.3.11 J20 DC Input Power Connector

J20 on the LEC-1 card is the input power connector. The following figure details pin-outs and relevant signal names for
the Power connector.
Figure 39 J20 4-pin Power connector pin-outs.

6.4 Signal Conditioning

Most control connections are optically-isolated directly on the LEC-1 board. On the optional I/O Modules some signal
sets are further pre-conditioned to simplify system wiring. To handle these cases the optional I/O Module connectors
are wired so that simple connector jumpers can be used to connect LEC-1 system power and ground for satisfying the
opto-isolator drive requirements. All optically-isolated outputs can sink a maximum of 50 mA.
The following figures illustrate the LEC-1 input and output optical isolation used with the various signal groups.
Figure 40 LEC-1 System Control and Status optical isolation
Figure 41 LEC-1 Laser Control Signal conditioning

Figure 42 LEC-1 User Inputs optical isolation
Figure 43 LEC-1 User Outputs optical isolation

Figure 44 LEC-1 Laser Digital Outputs optical isolation
Figure 45 System Interlock optical isolation

6.5 Connector Part Number Reference

The following chart details the connector specifications.
LEC-1 Board Connector Part Mating Cable or

Purpose Style Mfg.
Connector # Connector/Pins
J10 Ethernet & USB 0.050 x 2 x 26 Samtec FFSD-13-D-02.00-01-N
J11 Aux SPI 0.050 x 2 x 5 Samtec
J12 Serial I/O 0.050 x 2 x 10 Samtec FFSD-10-D-02.00-01-N
J13 LCD interface 0.100 x 2 x 17
J14 X Servo 2.5mm X 1 X 6 Molex 22-03-5065 50-37-5063/08-70-1040
J15 Y Servo 2.5mm X 1 X 6 Molex 22-03-5065 50-37-5063/08-70-1040
J16 Z Servo 2.5mm X 1 X 6 Molex 22-03-5065 50-37-5063/08-70-1040
J17 Digital I/O ‘A’ 2mm x 2 x 20 Samtec TCSD-20-D-02.00-01-N
J18 Digital I/O ‘B’ 2mm x 2 x 20 Samtec TCSD-20-D-02.00-01-N
J19 Laser Analog Out 2.5mm X 1 X 6 Molex 22-03-5065 50-37-5063/08-70-1040
3mm Microfit x
J20 DC Input Power Molex 43045-0414 43025-0400/43030
4

6.6 Physical Dimensions
Figure 46 LEC-1 Mechanical dimensions

7. End-User I/O Module Installation Requirements

The End-User I/O Module is used to gain access to the signals available on the high-density connectors of the LEC-1
and allow integrators to expose connectivity to the outside of their system. The following figure shows a typical
interconnection scenario.
Figure 47 End-User I/O module shown with LEC-1
Protect the End-User I/O Module from mechanical stress, humidity, dust, and thermal damage. Storage temperature is -
20° C to + 60° C. Operating temperature is 15 to 35° C.

7.2 Connection and Jumper Locations

Figure 48 User connector view
Figure 49 Top view

Figure 50 Bottom view
7.3 Jumper Positions

Because of the density of connections required on the J3U connector, jumpers are installed to enable some of the
signals. In certain situations, for example when connecting J3U directly to a Lee Laser, these jumpers will need to be
removed. The following chart details the jumpers and their function.
Jumper Position Function Comment

1 Ready Install jumper to enable Ready signal.
2 User In 3 Install jumper to enable User In 3 signal.
5 User Out 3 Install jumper to enable User Out 3 signal.
7 Laser Enable Install jumper to enable Laser Enable signal.

7.4 Connecting to the LEC-1

The End-User I/O Module has been designed to interconnect directly with the LEC-1 using standard ribbon cable
assemblies included with the module, and provides most of the signals available on the LEC-1. Three LEC-1
connectors, J17, J18 and J12 have been duplicated on the End-User I/O Module in cases where additional signals on
these connectors not exposed on the End-User I/O Module may be needed.
Connect the LEC-1 to the End-User I/O Module using the following interconnection chart and diagram:
From LEC-1 To End User Interface Module

Comment
Connector Connector
J10 J10 26-pin ribbon cable ass'y, Lanmark Part # 60.035

J20 J20 4 conductor power cable, Lanmark Part # 60.030
Figure 51 Interconnection diagram

7.5 End-User I/O Module User Accessible Connector Pin-outs

The following sections describe each user accessible connector on the I/O Module
7.5.1 J2Lower Control Connector

Connector J2Lower on the End-User I/O Module provides access to a subset of control signals for the laser and control
automation equipment. The following figure details pin-outs and relevant signal names for the Control connector.
Figure 52 J2Lower Control connector
7.5.2 J2Upper COM1 Connector

Connector J2Upper on the End-User I/O Module provides access to the COM1 port connector which supports the J10H
user interface pendant. The following figure details pin-outs and relevant signal names for the COM1 connector.
Figure 53 J2Upper COM1 connector

7.5.3 J3Lower XY2-100 Connector

Connector J3Lower on the End-User I/O Module provides access to the XY2-100 signals. The following figure details
pin-outs and relevant signal names for the XY2-100 connector.
Figure 54 J3Lower XY2-100 connector

7.5.4 J3Upper User I/O Connector

Connector J3Upper on the End-User I/O Module provides access to a subset of control signals for the laser. The
following figure details pin-outs and relevant signal names for the User I/O connector.
Figure 55 J3Upper User I/O connector
7.5.4.1 Power On Delay Circuit

In some wiring situations, it is desirable to delay the closing of a safety circuit until some time after the power is
applied to the End-User I/O Module. The End-User I/O Module provides a dry contact relay closure between Relay Out
1 and Relay Out 2 for this purpose. Approximately 8 seconds after power is applied to the I/O Module, the relay
contacts will close.

7.5.5 J12A Backside Connector

Connector J12A on the backside of the End-User I/O Module duplicates connector J12 on the LEC-1.
Figure 56 J12A Backside connector





7.5.8 J20A Power Connector

J20A on the End-User I/O Module card is the input power connector. The following figure details pin-outs and relevant
signal names for the Power connector.
Figure 59 J20A 4-pin Power connector


On the I/O Module, most control connections optically-isolated directly on the LEC-1 board are converted to single
ended outputs and inputs. The following figures illustrate the End-User I/O Module input and output optical isolation
used with the various signal groups. All optically-isolated outputs can sink a maximum 50 mA.
Figure 60 End-User I/O Module Laser Control Signal conditioning
Figure 61 End-User I/O Module Laser Digital Outputs optical isolation

Figure 62 End-User I/O Module Power On Delay Circuit
Figure 63 End-User I/O Module Inputs Optical Isolation

Figure 64 End-User I/O Module Outputs optical isolation

Figure 65 End-User I/O Module Physical Dimensions


8. OEM Interface Module Installation Requirements

The OEM Interface Module is used to gain access to the signals available on the high-density connectors of the LEC-1
and allow integrators to expose connectivity to the inside of their systems by using standard DIN connectors. The
following figure shows a typical interconnection scenario.
Figure 66 OEM Interface Module with LEC-1 and optional Laser Extension board
Protect the OEM Interface Module from mechanical stress, humidity, dust, and thermal damage. Storage temperature is
-20° C to + 60° C. Operating temperature is 15 to 35° C.

8.2 Connector and Jumper Locations

Figure 67 Top view, OEM Interface Module connector locations
8.3 Jumper Positions – J14

Jumper J14 is used to make +5VDC available on pin 8 of the COM port DIN connectors. This is useful for powering
the optional handheld pendant.
Jumper Position Function Comment

1 Connects J4 pin 8 to RING COM1 is a full COM port, and uses the Ring Indicator signal on pin 8
2 Connects J4 pin 8 to +5VDC For powering the handheld pendant on COM1.


The OEM Interface Module has been designed to interconnect directly with the LEC-1 using standard ribbon cable
assemblies included with the module.
Connect the LEC-1 to the OEM Interface Module using the following interconnection chart and diagram:

Comment
Connector Connector

J20 J20A 4 conductor power cable, Lanmark Part # 60.030
Figure 68 Interconnection diagram

8.5 OEM Interface Module User Accessible Connector Pin-outs

The following sections describe each user accessible connector on the OEM Interface Module
8.5.1 J1 Laser Extension Connector

Connector J1 on the OEM Interface Module provides the laser extension signals.
Figure 69 J1 Laser Extension connector

8.5.2 J2 XY2-100 Connector

Connector J2 on the OEM Interface Module provides access to the XY2-100 signals. The figure below details pin-outs
and relevant signal names for the DIN XY2-100 connector.
Figure 70 J2 DIN XY2-100 connector

8.5.3 XY2-100 Connector D-Sub

Connector J2 on the OEM I/O Module provides access to the XY2-100 signals. The figure below details pin-outs and
relevant signal names for the XY2-100 connector when using a DIN to 25-pin D-sub female ribbon cable assembly.
Figure 71 D-Sub XY2-100 connector

8.5.4 J3 User I/O Connector

Connector J3 on the OEM Interface Module provides access to a subset of control signals for the laser. The figure
below details pin-outs and relevant signal names for the User I/O connector.
Figure 72 J3 DIN User I/O connector

8.5.5 User I/O Connector D-Sub

Connector J3 on the OEM Interface Module provides access to a subset of control signals for the laser. The figure
below details pin-outs and relevant signal names for the User I/O connector when using a DIN to 25-pin D-sub male
ribbon cable assembly.
Figure 73 D-Sub User I/O connector pin-out

8.5.6 J4 COM1 Connector

Connector J4 on the OEM Interface Module provides access to the COM1 port. The figure below details pin-outs and
relevant signal names for the COM1 connector.
Figure 74 J4 DIN COM1 connector pin-out
8.5.7 COM1 Connector, D-Sub

relevant signal names for the COM1 connector when using a DIN to 9-pin D-sub male ribbon cable assembly.
Figure 75 D-Sub COM1 connector



Figure 77 D-Sub COM2 connector pin-out



Figure 79 D-Sub COM3 connector pin-out

8.5.12 J7 Ethernet Connector

Connector J7 on the OEM Interface Module provides access to the Ethernet signals. The figure below details pin-outs
and relevant signal names for the Ethernet connector.
Figure 80 J7 Ethernet connector
8.5.13 J8 USB Connector

Connector J8 on the OEM Interface Module provides access to the USB signals for USB0 and USB1. The figure below
details pin-outs and relevant signal names for the USB connector.
Figure 81 J8 USB connector

8.5.14 J20 DC Power Connector

J20 on the OEM Interface Module is the input power connector, and J20A and J20B are used for the LEC-1 and the
Laser Extension board respectively.
Figure 82 J20 4-pin Power connector
8.5.15 J20A, J20B DC Power Connectors

J20A and J20B are used for the LEC-1 and the Laser Extension board respectively.
Figure 83 J20A, J20B 4-pin Power connector

8.5.16 J21 Scan Head Power Connector

J21 on the OEM Interface Module is used for powering scanheads. The differential voltages available on J21 are the
same as the input voltage applied to J20 pins 1 and 2.
Figure 84 J21 10-pin Scan Head Power connector


On the OEM Interface Module, most control connections optically-isolated directly on the LEC-1 board are converted
to single ended outputs and inputs. The following figures illustrate the OEM Interface Module input and output optical
isolation used with the various signal groups. All optically-isolated outputs can sink a maximum 50 mA. For a
complete schematic of the OEM Interface Module, please refer to Appendix A.
Figure 85 OEM Interface Module Laser Control Signal conditioning
Figure 86 OEM Interface Module Laser Digital Outputs optical isolation

Figure 87 OEM Interface Module Inputs Optical Isolation
Figure 88 OEM Interface Module Outputs optical isolation

Interface Mod. Mating Cable or

Purpose Style Mfg. Board Connector Part #
Connector Connector/Pins
J1 Laser Extension 0.050 x 2 x 26 Samtec FTSH-113-SM-D FFSD-13-D-02.00-01-N
J2 XY2-100 0.100 x 2 x 13 3M 2526-6002UB
J3 User I/O 0.100 x 2 x 13 3M 2526-6002UB
J4 COM1 0.100 x 2 x 5 3M 2510-6002UB
J5 COM2 0.100 x 2 x 5 3M 2510-6002UB
J6 COM3 0.100 x 2 x 5 3M 2510-6002UB
J7 Ethernet 0.050 x 2 x 8 Samtec FTSH-108-01-LM-DV-K
J8 USB0, USB1 0.050 x 2 x 5 Samtec FTSH-110-01-L-D-K
J20 DC Input Power 0.150 x 1 x 4 Molex 20-60-4040 09-50-8041 / 08-52-0072
J20A, B DC Power Dist 3mm Microfit x 4 Molex 43045-0414 43025-0400 / 43030
J21 Scan head power 3mm Microfit x 10 Molex 43045-1012 43025-1000 / 43030

Figure 89 OEM Interface Module Physical Dimensions

9. Extended I/O Module Installation Requirements

The Extended I/O Module uses the LEC-1 AUX SPI port (J11) to provide an additional 16 bits of optically isolated
digital inputs and outputs.
Figure 90 The Extended I/O Module
Protect the Extended I/O Module from mechanical stress, humidity, dust, and thermal damage. Storage temperature is -


Figure 91 Top view, Extended I/O Module connector locations

9.3 Jumper Positions – W2 - W13

Jumpers W2 – W13 are used to control whether the optical isolators use the internal +5V (supplied on J4), or an
externally supplied +5V.
Jumper Function Jumper Positions

W2 Controls User In 5 - 12 INT uses internal +5V, EXT uses external +5V
W6 Controls User Out 5 - 8 INT uses internal +5V, EXT uses external +5V

Connect the LEC-1 to the Extended I/O Module with the supplied ribbon cable, using the following interconnection
chart:

Comment
Connector Connector
J11 J1 10-pin ribbon cable ass'y, Lanmark Controls Part # 60.048

9.5 Extended I/O Module User Accessible Connector Pin-outs

The following sections describe each user accessible connector on the Extended I/O Module
9.5.1 J1 SPI AUX Connector

Connector J1 on the Extended I/O Module provides the input connector for the SPI AUX signals.
Figure 92 J1 AUX SPI connector

9.5.2 J2 User Inputs Connector

Connector J2 on the Extended I/O Module provides access to the User input signals. The figure below details pin-outs
and relevant signal names for the User Inputs connector.
Figure 93 J2 User Inputs connector
9.5.3 J3 User Inputs Terminal Block

Connector J3 on the Extended I/O Module provides access to the User inputs in a terminal block format.
Figure 94 J3 User Inputs Terminal Block connector


Power needs to be applied to J4 only if the optical inputs and outputs are configured to use the internal power supply
connections. If the external power connection option is configured, power does not need to be applied to J4.
Figure 95 J4 4-pin DC Power connector
9.5.5 J7 User Outputs Connector

Connector J7 on the Extended I/O Module provides access to the User output signals. The figure below details pin-outs
and relevant signal names for the User Outputs connector.
Figure 96 J7 User Outputs connector

9.5.6 J8 User Outputs Terminal Block

Connector J8 on the Extended I/O Module provides access to a subset of the User outputs in a terminal block format.
Figure 97 J8 User Outputs terminal block connector

9.5.7 J9 User Outputs Terminal Block

Connector J9 on the Extended I/O Module provides access to a subset of the User outputs in a terminal block format.
Figure 98 J9 User Outputs terminal block connector


On the Extended I/O Module, all inputs and outputs are optically isolated. The board can be configured to power the
optical isolators from the supplied +5V power. Refer to Jumpers W2 – W13. If using an external source for the optical
isolators, the +5V power input does not need to be connected. The following figures illustrate the Extended I/O Module
input and output stages.
Figure 99 Extended I/O Module Inputs Signal conditioning
Figure 100 Extended I/O Module Outputs Signal conditioning

Interface Mod. Mating Cable or

Connector Connector/Pins
J1 SPI AUX in 0.050 x 2 x 5 Samtec FTSH-110-01-L-D-K
J2 Digital inputs 20-pin IDC
J4 DC Power in 3mm Microfit x 4 Molex 43045-0414 43025-0400 / 43030
J7 Digital outputs 26-pin IDC

Figure 101 Extended I/O Module Physical Dimensions


10. SPI Laser Extension Board Installation Requirements

The SPI G3 Laser Extension Board is used to simplify connections to the SPI G3 laser controller series, and to provide
interfacing to the error reporting features of the laser.
Figure 102 The SPI G3 Laser Extension Board
Protect Laser Extension board from mechanical stress, humidity, dust, and thermal damage. Storage temperature is -20°
C to + 60° C. Operating temperature is 15 to 35° C.


Figure 103 Top view, SPI G3 Laser Extension Board connector locations


Jumper J2 is used to control the use of the SPI Global Enable signal.
Jumper pins Function Comment

1-2 Connects Global Enable to +5VDC Permanently enables the Global Enable signal
3-4 LEC-1 controls Global Enable Global Enable controlled by LEC-1 Laser Enable parameters (default)

Jumper J9 is used to control the use of the SPI Laser Disable signal.

1-2 Connects LaserDisable to GND Permanently enables the laser (default)
3-4 Reserved Reserved

Jumper J10 is used to control the use of the SPI Pulse/CW signal.

1-2 Connects Pulse/CW to LASER6 Connects LASERPOWER6 on the LEC-1 to the Pulse/CW input
3-4 Connects Pulse/CW to LASER7 Connects LASERPOWER7 on the LEC-1 to the Pulse/CW input (default)
10.6 Switch Positions – SW1

Switch SW1 is used to control the error handling features of the card.
Switch position OFF position ON position

1 Enable Laser Error detection (default) Disable Laser Error detection
2 Enable System Error detection (default) Disable System Error detection
3 Error LED ON when error(default Error LED BLINKING when error
4 Reserved Reserved

10.7 Connecting to the OEM Interface Module

The SPI G3 Laser Extension Board has been designed to interconnect directly with the OEM Interface Module using
cable assemblies included with the extension board. Additionally, analog laser control signals are accessed directly on
the LEC-1 board.
Connect the SPI G3 Laser Extension Board to the OEM Interface Module and the LEC-1 using the following
interconnection chart:
From SPI
Laser To OEM Interface To LEC-1 Board Connector
Comment
Extension Module Connector
Connector

J6 J19 AOUT 6-pin shielded cable ass'y, Lanmark Part # 60.041
J20 J20B 4 conductor power cable, Lanmark Part # 60.030

10.8 SPI G3 Laser Extension Board User Accessible Connector Pin-outs

The following sections describe each user accessible connector on the SPI G3 Laser Extension Board.
10.8.1 J1 Laser Extension Input Connector

Connector J1 on the SPI G3 Laser Extension Board provides the inputs to the SPI G3 Laser Extension Board laser
control signals.

10.8.2 J3 Interlock Connector

Connector J3 on the SPI G3 Laser Extension Board provides access to the Interlock interface. The figure below details
pin-outs and relevant signal names for the Interlock connector.
Figure 105 J3 DIN Interlock connector pin-out

10.8.3 J5 LEDS Connector

Connector J5 on the SPI G3 Laser Extension Board provides access to optional signals that can be used to illuminate
front panel LEDs. The figure below details pin-outs and relevant signal names for the LEDS connector. All the outputs
are open collector, and are designed to sink a maximum of 15 ma through an LED and series resistor using the +5VDC
provided on the connector.
Figure 106 J5 LEDS connector pin-out
Function When output is floating: When output is at GND (Sinking): Suggested LED color
Job Busy Job is not busy Job is currently executing. Yellow
System Enabled / Error System in Error state or not ready System is ready Green
Laser Error No laser errors At least one laser error flag is set Red
Ready to Mark Not ready System is waiting for an External Start Green
Power No power applied Power is applied to Laser Extension Green
Interlock Interlock circuit in closed Interlock circuit is open Red

10.8.4 J6 Analog Input Connector

Connector J6 on the SPI G3 Laser Extension Board provides the inputs to the laser analog control signals. The figure
below details pin-outs and relevant signal names for the Analog Input connector.
Figure 107 J6 Analog Input connector pin-out
10.8.5 J7 Laser Output Connector

J7 on the SPI G3 Laser Extension Board provides the interface to the SPI G3 controller. A standard SCSI cable can be
used to make this connection. For pin out information, see Appendix C.

10.8.6 J8 Laser Status Connector

Connector J8 on the SPI G3 Laser Extension Board provides access to the Laser Status signals. The figure below
details pin-outs and relevant signal names for the Laser Status connector.
Figure 108 J8 DIN Laser Status connector pin-out
10.8.7 J11 COM Connector

Connector J11 on the SPI G3 Laser Extension board provides access to COM port on the G3 controller. The figure
below details pin-outs and relevant signal names for the COM connector.
Figure 109 J11 COM connector pin-out

J20 on the SPI G3 Laser Extension Board is the input power connector.

SPI Laser
Extension Mating Cable or
Board Connector/Pins
Connector
J1 Laser Extension Input 0.050 x 2 x 13 Samtec FTSH-113-SM-D FFSD-13-D-02.00-01-N
J3 Interlocks 0.100 x 2 x 5 3M 2510-6002UB
J5 LED 0.050 x 2 x 5 Samtec FTSH-105-SM-D FFSD-5-D-02.00-01-N
J6 Analog inputs 2.5mm X 1 X 6 Molex 22-03-5065 50-37-5063/08-70-1040
J7 Output to SPI G3 68-pin SCSI Harting 60 01 068 5102
J8 Laser Status 0.100 x 2 x 8 3M 2516-6002UB
J20 DC Input Power 3mm Microfit x 4 Molex 43045-0414 43025-0400/43030

Figure 111 SPI Laser Extension Board Physical Dimensions


11. IPG Fiber Laser Extension Board Installation Requirements

The IPG Fiber Laser Extension Board is used to simplify connections to the IPG Fiber laser controller series, and to
provide interfacing to the error reporting features of the laser.
Figure 112 The IPG Fiber Laser Extension Board
Protect the Laser Extension board from mechanical stress, humidity, dust, and thermal damage. Storage temperature is -


Figure 113 Top view, IPG Fiber Laser Extension Board connector locations


1 Error LED ON when error (default) Error LED BLINKING when error
2 Enable Laser Error detection (default) Disable Laser Error detection
3 Enable Interlock detection (default) Disable Interlock detection
4 Emergency Stop controlled by LEC-1(default) Connects Emergency Stop to HIGH (+5VDC)
5 Disable Visible Pointer signal on laser connector Enable Visible Pointer on laser connector(default)


The IPG Fiber Laser Extension Board has been designed to interconnect directly with the OEM Interface Module using
cable assemblies included with the extension board. Additionally, analog laser control signals are accessed directly on
the LEC-1 board.
Connect the IPG Fiber Laser Extension Board to the OEM Interface Module and the LEC-1 using the following
From IPG
Laser To OEM Interface
Comment
Extension Module Connector
Connector

11.5 IPG Fiber Laser Extension Board User Accessible Connector Pin-outs
The following sections describe each user accessible connector on the IPG Fiber Laser Extension Board.

Connector J1 on the IPG Fiber Laser Extension Board provides the inputs to the laser control signals.


Connector J2 on the IPG Fiber Laser Extension Board provides access to optional signals that can be used to illuminate
front panel LEDs. The figure below details pin-outs and relevant signal names for the LEDS connector. All the outputs
are open collector, and are designed to sink a maximum of 15 ma through an LED and series resistor using the +5VDC
provided on the connector.


Connector J3 on the IPG Fiber Laser Extension Board provides access to the Interlock interface. The figure below
details pin-outs and relevant signal names for the Interlock connector.


J4 on the IPG Fiber Laser Extension Board provides the interface to the IPG laser controller.
Figure 117 J4 DIN Laser Output connector pin-out

Connector J8 on the IPG Fiber Laser Extension Board provides access to the Laser Status signals.

J20 on the IPG FiberLaser Extension Board is the input power connector.
IPG Laser
Extension Mating Cable or
Board Connector/Pins
Connector
J4 Output to IPG 0.100 x 2 x 13 3M 2526-6002UB

Figure 120 IPG Fiber Laser Extension Board Physical Dimensions

12. General Purpose Laser Extension Board Installation Requirements

The General Purpose Laser Extension Board is available for connection the lasers not supported by a specific Laser
Extension board.
Picture not available
Figure 121 The General Purpose Laser Extension Board
Protect the Laser Extension board from mechanical stress, humidity, dust, and thermal damage. Storage temperature is -


Picture not available
Figure 122 Top view, General Purpose Laser Extension Board connector locations


1 Error LED ON when error (default) Error LED BLINKING when error
2 Disable Visible Pointer signal on laser connector Enable Visible Pointer on laser connector(default)
3 Enable Interlock detection (default) Disable Interlock detection
4 Not used Not used
5 Error 1 input HIGH active(default) Error 1 input FLOATING active
6 Enable Error 1 detection(default) Disable Error 1 detection
7 Error 2 input HIGH active(default) Error 1 input FLOATING active
8 Enable Error 2 detection(default) Disable Error 2 detection


The General Purpose Laser Extension Board has been designed to interconnect directly with the OEM Interface
Module using cable assemblies included with the extension board. Additionally, analog laser control signals are
accessed directly on the LEC-1 board.
Connect the General Purpose Laser Extension Board to the OEM Interface Module and the LEC-1 using the following
From Laser
To OEM Interface
Extension To LEC-1 Board Connector Comment
Module Connector
Connector

J6 J19 AOUT 6-pin shielded cable ass'y, Lanmark Part # 60.041

12.5 General Purpose Laser Extension Board User Accessible Connector Pin-outs
The following sections describe each user accessible connector on the General Purpose Laser Extension Board.

Connector J1 on the General Purpose Laser Extension Board provides the inputs to the laser control signals.


Connector J2 on the General Purpose Laser Extension Board provides access to optional signals that can be used to
illuminate front panel LEDs. The figure below details pin-outs and relevant signal names for the LEDS connector. All
the outputs are open collector, and are designed to sink a maximum of 15 ma through an LED and series resistor using
the +5VDC provided on the connector.


Connector J3 on the General Purpose Laser Extension Board provides access to the Interlock interface. The figure
below details pin-outs and relevant signal names for the Interlock connector.


J4 on the General Purpose Laser Extension Board provides all the laser signals available on the LEC-1 card.
Figure 126 J4 DIN Laser Output connector pin-out

Connector J8 on the General Purpose Laser Extension Board provides access to the Laser Status signals.

12.5.6 J7 Analog Input Connector
Connector J7 on the General Purpose Laser Extension Board provides the inputs to the laser analog control signals. The
figure below details pin-outs and relevant signal names for the Analog Input connector.
Figure 128 J7 Analog Input connector pin-out
12.5.7 J8 Aux Signal Connector Output Connector

Connector J8 on the General Purpose Laser Extension Board provides a subset of the Laser control signals that are
usually used with CO2 lasers. The figure below details pin-outs and relevant signal names for the Analog Input
connector.
Figure 129 J8 Aux Signal Output connector pin-out


J20 on the General Purpose Laser Extension Board is the input power connector.
Laser Extension
Mating Cable or
Board Purpose Style Mfg. Board Connector Part #
Connector/Pins
Connector
J4 Laser Controls signals 0.100 x 2 x 13 3M 2526-6002UB
J7 Analog inputs 2.5mm X 1 X 6 Molex 22-03-5065 50-37-5063/08-70-1040
J8 Aux signal outputs 3mm Microfit x 4 Molex

Figure 131 General Purpose Laser Extension Board Physical Dimensions

13. Video Module Installation Requirements

Video Module was not released at the time of this revision.


14. Warranty
Lanmark Controls Inc. warrants to the Customer that the product is free from defects in workmanship and materials for
a period of 12 months from the delivery date.
Lanmark Controls Inc. obligation under this warranty is limited to repair, replacement or service, at its option, any part
of the product which, within the warranty period and upon Lanmark Controls Inc. examination shall disclose to its
satisfaction not to have conformed to this Agreement or to have been defective. Defective parts or products are to be
returned to Lanmark Controls Inc. place of shipment.
The above warranties do not apply (i) to defects or failure of product or parts caused by accident, alteration, abuse,
misuse, corrosion or improper installation or operation, or (ii) to alterations or modifications made by Customer in any
way so as in Lanmark Controls Inc. judgment to affect the products reliability, or (iii) to installation not performed
pursuant to Lanmark Controls Inc. factory authorized protocol, or (iv) in the case of custom software designed to
interact with other Customer-supplied software, in the event of any change, upgrade or reprogramming of such
Customer-supplied software so as to create an incompatibility with Lanmark Controls Inc. software.
Authorization to return products purchased from Lanmark Controls Inc. must be obtained by Customer. Returns should
always be carefully packed and sent freight prepaid. Unless otherwise agreed, return shipment freight and duty charges
shall be borne by Customer. Customer shall bear all charges for freight and handling of products returned which are
not defective.
THIS WARRANTY IS EXPRESSLY MADE IN LIEU OF ANY AND ALL OTHER WARRANTIES EXPRESSED
OR IMPLIED, INCLUDING THE WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A
PARTICULAR PURPOSE, EXPRESSED OR IMPLIED.


15. Index
B D
Barrel Distortion · 37 Delays · 28

Basic Action Commands · 26 Delays, jump command · 28
Delays, jump delay · 29
Delays, laser off delay · 33
C Delays, Laser on delay · 31
Delays, mark delay · 30
CO 2 Laser Timing · 41 Delays, poly delay · 32
COM Automation Server API · 46 Delays, when micro-vectoring · 34
COM1 Connector, D-Sub, OEM Interface Module · 93
COM2 Connector, D-Sub, OEM Interface Module · 94
COM3 Connector, D-Sub, OEM Interface Module · 95 E
Connecting, End-User I/O Module to LEC-1 · 72
Connecting, Extended I/O Module to LEC-1 · 105 End-User I/O Module Installation · 69
Connecting, OEM Interface Module to General Example Program, Remote Command API · 49
Purpose Laser Extension Board · 137 Example, C# · 49
Connecting, OEM Interface Module to IPG Fiber Extended I/O Module Installation · 103
Laser Extension Board · 129
Connecting, OEM Interface Module to LEC-1 · 87
Connecting, OEM Interface Module to SPI G3 Laser F
Extension Board · 118
Connection and Jumper Locations, End-User I/O Firmware update, installing · 46
Module · 70
Connection and jumper locations, LEC-1 · 53 G
Connector and Jumper Locations, Extended I/O
Module · 104 General Purpose Laser Extension Board Installation ·
Connector and Jumper Locations, General Purpose 135
Connector and Jumper Locations, IPG Fiber Laser
Extension Board · 128 H
Connector and Jumper Locations, OEM Interface
Module · 86 Hardware Overview · 19
Connector and Jumper Locations, SPI G3 Laser
Connector Part Number Reference, Extended I/O I
Module · 112
Connector Part Number Reference, General Purpose Image Field Correction · 35
Laser Extension Board · 143 Installation Requirements, Video Module · 145
Connector Part Number Reference, IPG Fiber Laser Introduction · 7
Extension Board · 133 IPG Fiber Laser Extension Board Installation · 127
Connector Part Number Reference, LEC-1 · 67
Connector Part Number Reference, OEM Interface J
Module · 101
Connector Part Number Reference, SPI Laser J1 Laser Extension Connector, OEM Interface Module
Extension Board · 124 · 88
Cooordinate System Conventions · 24 J1 Laser Extension Input Connector, General Purpose
J1 Laser Extension Input Connector, IPG Fiber Laser

J1 Laser Extension Input Connector, SPI G3 Laser J4 Laser Output Connector, IPG Fiber Laser Extension
Extension Board · 119 Board · 132
J1 SPI AUX Connector, Extended I/O Module · 106 J5 COM2 Connector, OEM Interface Module · 94
J10 USB + Ethernet Connector, LEC-1 · 54 J5 Laser Status Connector, General Purpose Laser
J11 COM Connector, SPI G3 Laser Extension Board · Extension Board · 141
123 J5 Laser Status Connector, IPG Fiber Laser Extension
J11 SPI AUX Connector, LEC-1 · 55 Board · 132
J12 Serial COM Connector, LEC-1 · 57 J5 LEDS Connector, SPI G3 Laser Extension Board ·
J12A Backside Connector, End-User I/O Module · 76 121
J13 Video & Touch screen Digital Interface J6 Analog Input Connector, SPI G3 Laser Extension
Connector, LEC-1 · 58 Board · 122
J14, J15 X & Y-Axis Analog Connectors, LEC-1 · 58 J6 COM3 Connector, OEM Interface Module · 95
J16 Z-Axis Analog Connector, LEC-1 · 59 J7 Analog Input Connector, General Purpose Laser
J17 USER I/O Connector, LEC-1 · 61 Extension Board · 142
J17A Backside Connector, End-User I/O Module · 77 J7 Ethernet Connector, OEM Interface Module · 96
J18 USER I/O Connector, LEC-1 · 62 J7 Laser Output Connector, SPI G3 Laser Extension
J18A Backside Connector, End-User I/O Module · 78 Board · 122
J19 Analog Out 1 & 2 Connector, LEC-1 · 63 J7 User Outputs Connector, Extended I/O Module ·
J2 LEDS Connector, General Purpose Laser Extension 108
Board · 139 J8 Aux Signal Output Connector, General Purpose
J2 LEDS Connector, IPG Fiber Laser Extension Board Laser Extension Board · 142
· 130 J8 Laser Status Connector, SPI G3 Laser Extension
J2 User Inputs Connector, Extended I/O Module · 107 Board · 123
J2 XY2-100 Connector, OEM Interface Module · 89 J8 USB Connector, OEM Interface Module · 96
J20 DC Input Power Connector, LEC-1 · 63 J8 User Outputs Terminal Block, Extended I/O
J20 DC Power Connector, General Purpose Laser Module · 109
Extension Board · 143 J9 Digital Servo Connector, LEC-1 · 54
J20 DC Power Connector, IPG Fiber Laser Extension J9 User Outputs Terminal Block, Extended I/O
Board · 133 Module · 110
J20 DC Power Connector, OEM Interface Module · 97 Job Fundamentals · 24
J20 DC Power Connector, SPI G3 Laser Extension Jumper Positions – J10, SPI G3 Laser Extension Board
Board · 123 · 117
J20A Power Connector, End-User I/O Module · 79 Jumper Positions – J14, OEM Interface Module · 86
J20A, J20B DC Power Connectors, OEM Interface Jumper Positions – J2, SPI G3 Laser Extension Board ·
Module · 97 117
J21 Scan Head Power Connector, OEM Interface Jumper Positions – J9, SPI G3 Laser Extension Board ·
Module · 98 117
J2Lower Control Connector, End-User I/O Module · Jumper Positions – W2 – W13, Extended I/O Module ·
73 105
J2Upper COM1 Connector, End-User I/O Module · 73 Jumper settings, analog servo outputs, LEC-1 · 60
J3 Interlock Connector, General Purpose Laser
J3 Interlock Connector, IPG Fiber Laser Extension L
Board · 131
J3 Interlock Connector, SPI G3 Laser Extension Board Laser Timing Control · 39
· 120 Laser Timing Emulation · 40
J3 User I/O Connector, OEM Interface Module · 91 LEC-1 Features · 16
J3 User Inputs Terminal Block, Extended I/O Module · LEC-1 Installation · 51
107 LEC-1, Using · 45
J3Lower XY2-100 Connector, End-User I/O Module ·
74 M
J3Upper User I/O Connector, End-User I/O Module ·
75 Manufacturer · 7
J4 COM1 Connector, OEM Interface Module · 93 Micro-vectoring · 27
J4 DC Power Connector, Extended I/O Module · 108
J4 Laser Output Connector, General Purpose Laser

O Stand-Alone Mode · 23
Status LEDs, LEC-1 · 52
OEM Interface Module Installation · 85 Storage and Installation Environment, End-User I/O
Module · 69
Storage and Installation Environment, Extended I/O
P Module · 103
Storage and Installation Environment, General Purpose
Pendant Controller · 48 Laser Extension Board · 135
Pendant Error Codes · 48 Storage and Installation Environment, IPG Fiber Laser
Physical Dimensions, End-User I/O Module · 83 Extension Board · 127
Physical Dimensions, Extended I/O Module · 113 Storage and Installation Environment, OEM Interface
Physical Dimensions, General Purpose Laser Module · 85
Extension Board · 144 Storage and Installation Environment, SPI G3 Laser
Physical Dimensions, IPG Fiber Laser Extension Extension Board · 115
Board · 134 Storage, LEC-1 · 51
Physical Dimensions, LEC-1 · 68 Streaming Mode · 22
Physical Dimensions, OEM Interface Module · 102 Switch Positions – SW1, General Purpose Laser
Physical Dimensions, SPI Laser Extension Board · 125 Extension Board · 136
Pincushion Distortion · 36 Switch Positions – SW1, IPG Fiber Laser Extension
Pin-outs, End-User I/O Module · 73 Board · 128
Pin-outs, Extended I/O Module · 106 Switch Positions – SW1, SPI G3 Laser Extension
Pin-outs, General Purpose Laser Extension Board · Board · 117
138 System Architecture · 17
Pin-outs, IPG Fiber Laser Extension Board · 129 System Description · 15
Pin-outs, LEC-1 · 54 System I/O Timing · 42
Pin-outs, OEM Interface Module · 88 System Inputs · 43
Pin-outs, SPI G3 Laser Extension Board · 119 System Outputs · 42
Power · 75
Principle of Operation · 19
Product Introduction · 15 T
Table of Contents · 3
R Technical Specifications · 18
Technical Support · 7
Revision History · 9
U
S
User I/O Connector, D-Sub, OEM Interface Module ·
Safety · 13 92
Safety Cautions · 14
Safety Guidelines · 14
Safety labels · 13 W
Scope · 7
Secondary Laser Modulation · 40 Warranty · 147
Signal Conditioning, End-User I/O Module · 80 WinLase Embedded · 50
Signal Conditioning, Extended I/O Module · 111 WinLase LAN · 45
Signal Conditioning, LEC-1 · 64
Signal Conditioning, OEM Interface Module · 99
X
Software , On-board · 21
Software features · 16
XY/2-100 Protocol Interface, LEC-1 · 61
Software Overview · 21
XY2-100 Connector, D-Sub, OEM Interface Module ·
SPI AUX Connector, Input / Output Design Concept ·
90
55
XYZ Analog Signal Descriptions, LEC-1 · 59
SPI G3 Laser Extension Board Installation · 115


Appendix A – OEM Interface Module Schematics (55.026)




Appendix B – End-User Interface Module Schematics (55.019)




Appendix C – SPI G3 Laser Extension Board Schematics (55.031)




Appendix D – Fiber Laser Extension Board Schematics (55.036)




Appendix E – General Purpose Laser Extension Board Schematics

(55.028)




20.020 (LEC-1 Reference Manual)

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LEC-1 Embedded Controller Card

Integrator Reference Manual

Contents of this manual are subject to change without notice.

Lanmark Controls Inc. 2

Lanmark Controls Inc. 3

Lanmark Controls Inc. 4

Lanmark Controls Inc. 5

Lanmark Controls Inc. 6

1.1 About this Manual

1.3 Technical Support

Lanmark Controls Inc.

Lanmark Controls Inc. 7

Lanmark Controls Inc. 8

1.5 Revision History

REVISION DATE CHANGES FROM PREVIOUS REVISION

Lanmark Controls Inc. 9

REVISION DATE CHANGES FROM PREVIOUS REVISION

Lanmark Controls Inc. 10

REVISION DATE CHANGES FROM PREVIOUS REVISION

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2.1 Safety labels and symbols

Serious bodily injury or death.

Potential for serious bodily injury.

Potential for property damage and/or bodily injury.

SHOCK HAZARD - Electrical voltage present. Take

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2.2 General safety guidelines

2.3 Safety Cautions

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3.1 System Description

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3.2 LEC-1 Features

Key features supported by the software are:

Lanmark Controls Inc. 16

3.2.3 System Architecture Diagram

Figure 1 LEC-1 Hardware System Architecture Diagram

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3.3 Technical Specifications

Number of axes 3 (X, Y, Z)

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4.1 Hardware Overview

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Figure 2 LEC-1 Hardware Block Diagram

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4.2 Software Overview

4.2.1 LEC-1 On-Board Software

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4.2.2 Streaming Mode

Figure 3 Streaming mode Block Diagram

Key Technology Blocks:

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4.2.3 Stand-Alone Mode

Figure 4 Stand-Alone Mode Block Diagram

Key Technology Blocks:

Lanmark Controls Inc. 23

4.3 Scanning Job Fundamentals

4.3.1 Coordinate System Conventions

Figure 5 Scanning system coordinate conventions

Lanmark Controls Inc. 24

4.3.2 Marks and Jumps

Figure 6 A sample of the beginning of simple laser marking

Lanmark Controls Inc. 25

4.3.3 Basic Action Commands