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Product End-of-Life Disassembly Instructions

Product Category: Notebooks and Tablet PCs

Marketing Name / Model


[List multiple models if applicable.]
HP Stream
HP Stream Notebook PC
HP Stream Notebook PC 11

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Quantity
of items
Item Description Notes
included
in product
Printed Circuit Boards (PCB) or Printed Circuit With a surface greater than 10 sq cm 2
Assemblies (PCA)
Batteries All types including standard alkaline and lithium coin 1
or button style batteries
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater Includes background illuminated displays with gas 1
than 100 sq cm discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink, Include the cartridges, print heads, tubes, vent
including liquids, semi-liquids (gel/paste) and toner chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing

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refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Description #1 Screwdriver #1
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove base rubber foot -L & -R


2. Remove screw rubber foot -L & -R
3. Dis-fasten BASE screw*11
4. Pull out FFC*3 (Power, Touchpad, keyboard membrane)
5. Dis-fasten battery screw *4
6. Remove battery
7. Pull out wire cable *5 (LCD, DC, SPEAKER, WLAN, WWAN) Pull out FFC (SIM)
8. Dis-fasten daughter boards screw *3 (DB, WLAN, WWAN)
9. Remove daughter boards*3 (DB, WLAN, WWAN)
10. Dis-fasten motherboard screw *6
11. Remove motherboard
12. Remove speaker -L & -R
13. Dis-fasten daughter boards screw*4 (Power, Touchpad)
14. Remove daughter boards*2 (Power, Touchpad )
15. Dis-fasten KB Hook screw*2
16. Remove KB Hook
17. Dis-fasten HEAT SINK screw*4
18. Remove HEAT SINK
19. Dis-fasten Hinge screw*4
20. Remove Screw MYLAR -L & -R
21. Dis-fasten LCD Bezel screws*2
22. Remove LCD bezel
23. Dis-fasten Hinge screw*4
24. Pull out LCD cable & camera cable
25. Remove LCD module
26. Remove Camera module
27. Remove LCD cable & camera cable
28. Dis-fasten Hinge screw*6
29. Remove Hinge -L & -R
30. Remove Antenna cables

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

3.21 Total

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3.22 Remove base rubber foot -L & -R and screw rubber foot -L & -R

3.23 Remove TOP assy..

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3.24 Remove Power boards & Touchpad & KB Hook & HEAT SINK

3.25 Remove battery & daughter boards*3 (DB, WLAN, WWAN)

3.26 Remove motherboard & speaker -L & -R

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3.27 Remove Screw Mylar -L & -R and LCD bezel

3.28 Remove Panel

3.29 Remove Camera module and Hinge -L & -R & LCD cable

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PSG instructions for this template are available at EL-MF877-01


3.30 Remove Antenna cables

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PSG instructions for this template are available at EL-MF877-01

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