Microsystem Technologies

https://doi.org/10.1007/s00542-019-04596-9 (0123456789().,-volV)(0123456789().
,- volV)

TECHNICAL PAPER

Design, analysis, and fabrication of silicon-based MEMS gyroscope

for high-g shock platform
Jinkui Wang1 • Wenzhong Lou1 • Dakui Wang2 • Hengzhen Feng1

Received: 13 February 2019 / Accepted: 14 August 2019

Ó Springer-Verlag GmbH Germany, part of Springer Nature 2019

Abstract
This paper proposes a silicon-based micro-electro-mechanical systems (MEMS) tuning fork gyroscope designed for high-g
shock environments. The results obtained by a shock experiment demonstrate that MEMS gyroscopes can still work well
after a load of 30,000 g is applied to the y-axis. This MEMS gyroscope is double symmetrical and connected by middle
coupling beams. The results obtained by mathematical analysis and finite element analysis revealed that the designed solid
stoppers are helpful in improving the gyroscope’s shock resistance. The high aspect-ratio structures were fabricated by an
efficient fabrication process using a silicon-on-glass wafer. To investigate the mechanical characteristics of the fabricated
gyroscopes, the silicone’s fracture strength and Young’s modulus were obtained by conducting tensile tests. The working
frequencies of the gyroscope were designed as 4000 Hz, and the driving and sensing modes in the test were 4095 Hz and
4137 Hz, respectively.

1 Introduction investigated (Gao et al. 2015; Yoon et al. 2015a, b; Gao

Recently, the rapid development of MEMS technology has
made great progress in military aerospace technology
(Zhang et al. 2017). Moreover, the development of military
applications is considered to be challenging, owing to the
low cost and high reliability requirements (Wang et al.
2016; Niu et al. 2012; Lu et al. 2010). In the military field,
MEMS gyroscopes require high reliability to face the harsh
environments of military operations, and the sensor is
required to have high overload resistance (Lin et al.
2013a, b; Ni et al. 2014; Cao et al. 2013; Si et al. 2014).
Therefore, MEMS gyroscopes used in shock environments,
such as missile and smart projectiles, have been extensively
& Dakui Wang
wangdakui2019@126.com
Jinkui Wang
wangjinkui2013@126.com
Wenzhong Lou
louwz@bit.edu.cn
Hengzhen Feng
fenghengzhen@gmail.com
1
School of Mechatronical Engineering, Beijing Institute of
Technology, Beijing 100081, China
2
Beijing Institute of Electronic System Engineering,
Beijing 100854, China
et al. 2017).
Simulation and experimental techniques are the main
techniques used in the reliability analysis of MEMS
gyroscopes. In this field, several experiments and simula-
tions have been conducted to verify the reliability of
MEMS sensors under shock conditions (Zhang et al. 2015;
Lee et al. 2016a, b; Cao et al. 2016). For instance, Li et al.
(Qiu et al. 2017) conducted experiments and used finite
element analysis (FEA) to analyze the reliability of the
gyroscope in a shock environment, which was of great
significance as a reference for the anti-overload design of a
MEMS gyroscope.
Measuring the rotation through the Coriolis force in the
vertical direction is a principle used by most current
MEMS gyroscopes. In shock environments, the overload
causes the large non-linear displacement of elastic struc-
tures, which in turn causes the moving part to collide with
the fixed part and results in damage to the structure.
Additionally, massive displacements produce stress con-
centration in the weak part (mostly elastic beams) (Li et al.
2014; Yang et al. 2017; Zhou et al. 2014). In recent years,
the development of MEMS technology has achieved many
breakthroughs with regard to shock resistance in the field
of MEMS structural design. One of the main methods used
to is optimizing the beam’s structural design to reduce the
stress at the weak structure. A circular arc step structure is

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helpful in relieving stress at the corner of the structure, as
has been reported in a previous paper (Tao et al. 2014), and
improving the shock-resistibility of the MEMS gyroscope
to 10,000 g, although the latter approach only slightly
improves the anti-overload performance (Zhou et al. 2014).
Adding a stopper to a moving structure is another widely
used optimization method, wherein both elastic and solid
stoppers are used. For example, the two-lever stopper has a
significant effect on improving the gyroscope’s anti-over-
load performance.
In particular, the MEMS gyroscope, which is used in
cannons, is an important element for controlling the pre-
cision of striking. However, because the maximum launch
overload of the cannon is 20,000 g, current gyroscopes
cannot meet the cannon’s anti-overload requirements.
Therefore, in this paper, a silicon-based MEMS tuning fork
gyroscope used for a cannon platform is proposed, and
standardized experiment proved its performance in high
shock platform. We equipped our gyroscope with solid-
stoppers, which are designed specifically for high-g shock
platform. The responding frequency is a key factor in
realizing the high performance of the MEMS gyroscope.
Therefore, the structure is designed to get the performance
result by combining mathematical analysis and FEA. Its
shock resistance was calculated by conducting an overload
simulation using FEA software. Moreover, the proposed
MEMS gyroscope was fabricated using bulk silicon micro-
fabrication technology, and the mechanical properties of
silicon were obtained through tensile testing. A shock
experiment was conducted using a Split-Hopkinson pres-
sure bar. The dynamic performance of the fabricated
MEMS gyroscopes was measured after the shock experi-
ment to verify its anti-shock ability.
2 Device design and working principle
In this study, a double-vibrator structure was designed to
suppress the gyroscope’s common-mode interference error
and improve the measurement accuracy. As shown in
Fig. 1 Sketch map of the MEMS tuning fork gyroscope (color
figure online)
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Microsystem Technologies
Fig. 1, the structure is bilaterally symmetric and mainly
consists of a Coriolis mass pair and several driving and
detecting combs. The Coriolis mass (blue) is driven by a
differential capacitor (red) parallel to the z-axis, and the
detection comb is a set of two differential capacitors (pink)
parallel to the x-axis. The Coriolis mass is connected to the
combs by a u-beam parallel to the x-axis (dark blue), and to
the frame by eight pairs of u-beams parallel to the z-axis.
Moreover, based on the major structure, the anchors
were designed as stoppers along the x- and z-axis to further
increase the anti-shock performance of the gyroscope, as
shown in Fig. 1. In the shock environment, the deflection
of the beams can be effectively suppressed by the stopper.
When there exists an input angular velocity on the
gyroscope plane, the Coriolis mass will move in the z-axis
under the influence of the Coriolis force. Owing to the
electrostatic effect, the input angular velocity will be
converted into the output voltage in the detection mode.
Thus, the angular velocity can be detected. The size of the
proposed MEMS gyroscope is 6.5 9 2.7 mm2, and ensures
the gyroscope’s effectiveness after a shock of 20,000 g.
Additionally, the driving and detection modes of the
gyroscope exceed 4000 Hz to ensure its application to a
cannon platform.
3 Fabrication
According to the specific structure of the gyroscope and the
bulk silicon process, the process flow and method of fab-
ricating the MEMS gyroscope were designed as shown in
Fig. 2.
Boron diffusion is performed using low-resistance sili-
con to improve the electrical performance of the differen-
tial capacitor. The diffusion process is presented in
Table 1. The surface of the silicon substrate is cleaned
using concentrated sulfuric acid #1 liquid and NH3, and
H2O to remove the residual impurities on the surface.
Additionally, the SiO2 on the silicon-based surface is
Fig. 2 Micro fabrication process of the gyroscope
Microsystem Technologies

Table 1 Table of thermal

Process 1 2 3 4 5 6 7 8
silicon oxide process parameters
Temperature (°C) 40 500 1100 1100 1100 1100 1100 500
B (min) 0 0 0 20 35 0 0 0
N2 (min) 80 30 10 50 10 15 180 - 61

removed using BOE. The preparation of Si is carried out by
sputtering Al on the side of the silicon substrate as an
interface for electrically connecting the gyroscope to the
test circuit. To perform photolithography on the side of the
Al, the positions of the drive and detection modules are
selected (2.a). DRIE is used so that the structure can release
the movable comb (2.b). Next, the surface photoresist and
metal Al are removed (2.c) and the ionic activity of the
silicon-based structure surface is enhanced by Plasma (2.d).
Then, a glass with Au (2.e) is prepared and deposited onto
the surface. A device-level package of the silicon-based
structure and glass substrate is prepared using an anodic
bonding process (2.f). Metal Al is puttered on the other side
of the silicon substrate, and the structure of each mecha-
nism of the silicon-based gyroscope is patterned using the
photolithography process (2.g). The structure is released by
DRIE (inductively coupled plasma etching technology) to
realize device processing (2.h) (Fig. 3).
In this study, the micro-samples were taken from the
same batch of the silicon wafers used in the fabrication
process. The cross-sections of the tested micro-samples
were 0.3 9 0.08 mm2, 0.4 9 0.08 mm2, 0.5 9 0.08 mm2,
and 0.6 9 0.08 mm2, respectively. The lengths of the tested
micro-samples were 1.5 mm and 2.4 mm, respectively. The
cross-sections and lengths of the micro-samples were freely
combined, and eight groups of tests were conducted. One of
the stress–strain curves of the micro-samples is shown in
Fig. 4. Young’s modulus and the fracture strength of the
silicon were obtained according to the micro-samples’
stress–strain curves. By computing the average of the test
results obtained for the eight groups, we obtained the
average Young’s modulus of the silicon material as E = 127
GPa, and the average fracture strength as r = 726 MPa.
5 Analysis

5.1 Mathematical formulation

4 Testing
The mechanical arrangement of the oscillating frames was
A tensile test was conducted by loading the micro-samples simplified as a one-dimensional spring-mass system with
onto a Tytron 250 tensile testing machine. A diagram of the two spring-coupled masses, as shown in Fig. 5a.
testing machine’s operating principles is shown in Fig. 4. By disregarding the damping and non-linearity, which
The device is a horizontal tensile testing machine, and can originated from the large deformation of the beams, the
be used to carry out micro-force tensile tests for various differential equation of the free vibration for a dual-mass
materials and devices. silicon MEMS gyroscope can be expressed as follows (Ni
et al. 2011).

2m€x1 þ 2kx1 ¼ 0
ð1Þ
m€x2 þ kx2 þ kc x2 ¼ 0
where k is the spring constant of the driving beams, kc is
the spring constant of the coupling beams, m ¼ ma þ mb is
the mass of half of the oscillator, x1 is the displacement of
the left oscillator, and x2 is the displacement of the right
oscillator.
The resonant frequency of the in-phase f1 and anti-phase
f2 was obtained using Eq. (1).
rffiffiffiffi
1 k
f1 ¼ ð2Þ
2p m
rffiffiffiffiffiffiffiffiffiffiffiffi
1 k þ kc
f2 ¼ ð3Þ
2p m
Therein, the coupling spring resulted in a drive
Fig. 3 SEM photo of the gyroscope combs dynamical system with two degrees of freedom, and an in-

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Fig. 4 Tensile test of the micro-sample

where ks is the spring constant of the sensing beams, ms ¼

mb þ mc is the mass of the oscillator, and y is the dis-
placement of the oscillator.
Based on the expected design criteria, the parameters of
the coupling mechanism are shown in Table 2. L1 repre-
sents the length of the driving spring; L2 represents the
length of the sensing spring; L3 represents the length of the
coupling spring; W represents the width of the sensing and
driving springs; W1 represents the width of the coupling
spring, and H presents the thickness of the coupling
mechanism.
Thus, the stiffness of the driving spring is k1 = 35.96 N/
m, the stiffness of the sensing spring is k2 = 62.27 N/m,
and the stiffness of the coupling beam is k3 = 93.45 N/m.
Moreover, half of the driving oscillator mass is
m = 0.7457 mg, and the mass of the sensing oscillator is
Fig. 5 Schematic of the oscillating system ms = 0.7709 mg. Thereby, we obtained the following
results.
phase and anti-phase mode. The device was operated at the rffiffiffiffi rffiffiffiffiffiffiffi
anti-phase drive frequency, which excited the masses in the 1 k 1 8k1
f1 ¼ ¼ ¼ 3126 Hz ð5Þ
opposite directions (Acar and Shkel 2008), as desired. 2p m 2p m
rffiffiffiffiffiffiffiffiffiffiffiffi rffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffi
The mechanical arrangement of the sensing frames was 1 k þ kc 1 8k1 þ 2k3
simplified as a one-dimensional spring-mass system with f2 ¼ ¼ ¼ 4015 Hz ð6Þ
2p m 2p m
one spring-coupled mass, as shown in Fig. 5b. Thus, the rffiffiffiffiffi rffiffiffiffiffiffiffi
resonant frequency fs of the sensing frames can be 1 ks 1 8k2
fs ¼ ¼ ¼ 4110 Hz ð7Þ
expressed by Eq. (4), as follows: 2p ms 2p ms
rffiffiffiffiffi
1 ks
fs ¼ ð4Þ
2p ms

Table 2 The parameters of the

Parameters L1 (mm) L2 (mm) L3 (mm) W (mm) W1 (mm) H (mm)
coupling mechanism
Values 0.625 0.515 0.525 0.012 0.011 0.08

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b Fig. 6 First four modes of the gyroscope

Fig. 7 Finite element models

5.2 Simulation analysis

5.2.1 Modal analysis

Depending on the finite element method, the first four

modes of the gyroscope were obtained as shown in Fig. 6.
Additionally, Fig. 6a shows the first mode by which the
two frames moved in the same direction along the x-axis.
Figure 6b shows the second mode by which the two frames
moved reversely along the x-axis. This mode is the driving
mode of the gyroscope with a design frequency of
3949 Hz. Figure 6c shows the third mode by which the left
frame moved along the y-axis. Figure 6d shows the fourth
mode by which the right frame moved reversely along the
y-axis. This mode is the sense mode of the gyroscope
whose design frequency is 4024 Hz.

5.2.2 Transient dynamic analysis

To verify the effectiveness of the proposed structure,

transient dynamic analysis was implemented using the
ANSYS software. For the impact response considered in
this study, there may occur negative volumes of the mesh
element owing to large deformation, which results in the
termination of the ANSYS calculation process. To avoid
this situation, it is important to adjust and optimize the
mesh size and accuracy. The symmetric finite element
model is shown in Fig. 7.
FEA was conducted using the commercial software LS-
DYNA to obtain the stress distribution over time during the
input of shock to the designed gyroscope. To begin the
simulation, a half-sine acceleration of 20,000 g was
applied along the x-, y-, and z-axis, respectively, for 1 ms,
because gyroscopes are typically mounted in each orthog-
onal axis of an inertial navigation system. Figure 8 shows
the overall stress distribution and maximum stress over
time for half of the gyroscope structure under a half-sine
shock load of 20,000 g along the x-, y-, and z-axis.

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b Fig. 8 Stress distribution and maximum stress of the gyroscope

structure under the half-sine shock loading of 20,000 g along the
different axis

Table 3 The simulation results of the shock resistance for gyroscopes

Structure x-Axis y-Axis z-Axis

With solid stopper 35,600 g 29,800 g 31,000 g

Without solid stopper 27,400 g – 23,600 g
Shock resistance improved 123% – 131%

Table 4 Comparison of the resonance characteristics obtained from

the test and from the analyses (% values in parentheses indicate the
difference with respect to the measured value)
Method Drive mode (Hz) Sense mode (Hz)

Measured value 4095 4158

Mathematical analysis 4015 (1.95%) 4110 (1.15%)
FEA 3949 (3.57%) 4024 (3.22%)

The maximum stress occurred at the root of the driving

and sensing beams. The value of the maximum stress under
a shock of 20,000 g was determined as approximately
278.8 MPa, 373 MPa, and 375.5 MPa, respectively, which
is less than the yield strength of the crystal silicon.
Throughout the rest of the structure, the stress distribution
was much more uniform. Therefore, the shock resistance of
the MEMS gyroscope satisfied the design criteria.
Moreover, to investigate the shock resistance of the
MEMS gyroscope, the simulation started with a shock
impact at an acceleration peak of 20,000 g. The accelera-
tion increased by 500 g every time, if failure did not occur.
The shock resistance of the devices is shown in Table 3,
as obtained by the simulation results. As can be seen in the
table, the shock resistance of the gyroscope was 35,600 g
along the x-axis and 31,000 g in the direction of the z-axis.
The shock resistance of the gyroscope along the y-axis was
29,500 g. The solid stopper improved the shock resistance
capability of the x- and z-axis by 123% and 131%,
respectively, compared to the simulation results obtained
by the MEMS gyroscope without a solid stopper.

5.3 Experimental analysis

5.3.1 Resonance characteristics

The processed gyroscope was selected for the frequency

characteristics test. The experimental test results are shown
in Table 4. The driving frequency was 4095 Hz, which is
1.95% higher than the frequency obtained by numerical

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Fig. 9 Frequency response of the gyroscope. a Driving frequency, b sensing frequency

Fig. 10 Split-Hopkinson
pressure bar for shock
experiment

Signal Signal
Computer Tachymeter
analyzer amplificaon
Barrel
Grang

Grang base
Air valve Bullet Proving lever
Shim

Air pump

Gyroscope for experiment

1
10 4 calculation, and 3.57% higher than that obtained by FEA.
0.5
The perceived frequency was 4158 Hz, which is 1.15%
0
higher than the perceived frequency obtained by numerical
-0.5 calculation and 3.22% higher than that obtained by FEA.
The test frequency and theoretical frequency were slightly
Shock load(g)

-1
-1.5 different, owing to the model and error of the simulation
-2 (Fig. 9).
-2.5
-3 5.3.2 Shock experiment
-3.5
-4 To evaluate the shock reliability of the MEMS gyroscope,
-4.5 a shock experiment was conducted using a Split-Hopkinson
200 300 400 500 600 700 800 900 1000
t(us) pressure bar. The experimental platform is shown in
Fig. 10. Moreover, Fig. 11 shows the curve of the maxi-
Fig. 11 Curve of the maximum shock load mum shock load in the process of the shock experiment,

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Table 5 The output of gyroscope among different over-load in the

experiment
Load (g) x-Axis y-Axis z-Axis

5000 0.62 0.97 0.67

10,000 1.24 1.99 1.33
15,000 1.76 2.83 1.98
20,000 2.44 3.78 2.68
25,000 3.02 4.91 3.22
30,000 3.96 5.67 4.11
35,000 4.09 – –
40,000 – – –

Fig. 13 Allan variance of sample signal after 30,000 g shock

samples were tested in three axes, respectively. Several

Fig. 12 The shock experimental results
and Fig. 12 shows the output of the MEMS gyroscope. As
can be seen, the peak value and pulse duration of the
maximum shock load were 39,657 g and 92 ls,
respectively.
This study designed the load rank to ensure the test
reliability of the gyroscope. The tests were conducted from
5000 to 40,000 g for three axes. Additionally, each load
was exerted five times. In the experiments, eight gyroscope
shock experimental results are presented in Fig. 12.
According to these results, the output of the gyroscope at
19,667 g was 2.44 V along the x-axis, and 4.91 V at
24,833 g in the direction of the y-axis. Additionally, the
output of the gyroscope along the z-axis at 24,667 g was
3.22 V. Table 5 shows the output of the gyroscope in the
three coordinate axes under different overload conditions.
As can be seen, when the applied load exceeded 40,000 g,
the system failed.
To confirm whether the gyroscope could still work after
the impact overload, a gyroscope output signal of 30,000 g
was loaded in the y-axis direction for analysis. Figure 13
shows the Allan variance analysis of the sampling signal,
when the gyroscope was static. As can be seen, after a
shock overload of 30,000 g, the gyroscope’s bias stability
was 30 °/h and its performance was satisfactory.
Thus, the shock resistance of the MEMS gyroscope can
maintain a tactical grade performance level after a shock of

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Microsystem Technologies
30,000 g is applied, and therefore the MEMS gyroscope
satisfies the requirements.
6 Conclusions
This paper proposes a tactical-grade MEMS gyroscope for
use in a high-G shock platform. We enumerated the anti-
shock methods and improved the shock resistance by
designing a gyroscope with a high working frequency and
solid stoppers. Both mathematical analysis and FEA were
used to design the MEMS gyroscope with high shock
reliability. The key geometric parameters, stiffness, reso-
nant frequencies, and shock resistance were determined by
mathematical analysis. Moreover, a finite element simula-
tion was conducted, and the mathematically predicted
resonant frequencies were determined to be approximately
identical to the FEA results, which validates the frequency
formula derived in this study.
The designed MEMS gyroscope was fabricated using an
efficient fabrication process that employed a silicon-on-
glass (SOG) wafer. To investigate the mechanical charac-
teristics of the fabricated gyroscope, the fracture strength
and Young’s modulus of the silicon were obtained through
tensile tests. By using well-established test procedures, the
resonance characteristics of the fabricated MEMS gyro-
scope were evaluated to verify that the gyroscope satisfies
the requirements for application to tactical navigation
systems. The working frequencies of the gyroscope in the
driving and sensing modes were 4095 Hz and 4158 Hz,
respectively. A shock experiment was conducted using a
Split-Hopkinson pressure bar to investigate the usability of
the MEMS gyroscope in high-shock environments. After
the shock was applied, the Allan variance analysis of the
sample signal demonstrated that the shock resistance of the
MEMS gyroscope’s bias stability was 30 °/h. The MEMS
could maintain a tactical grade performance level after a
shock of 30,000 g was applied. The model and simulation
analysis method described in this paper are also applicable
to other micro-electro-mechanical system. Stopper can
effectively restrain the deflection of micro-beam in impact
environment. Aiming at the movable parts of micro-elec-
tromechanical system, a suitable stopper is designed at its
anchor point to limit the displacement of movable parts,
which can significantly improve the anti-impact ability of
micro-electro-mechanical systems.
The experimental results confirmed the high shock
resistance of the proposed MEMS gyroscope for use in a
high-G shock platform. Moreover, the proposed MEMS
gyroscope can be useful in a wide range of applications,
including military and aerospace systems such as cannons,
guided missiles, smart munitions, and launching systems.
Funding The research is supported by the State Key National Project
(6141B021310).
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