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FAP-IIA Series: Features Outline Drawing
FAP-IIA Series: Features Outline Drawing
> Applications
- Switching Regulators
- UPS
- DC-DC converters
- General Purpose Power Amplifier
- Thermal Characteristics
Item Symbol Test conditions Min. Typ. Max. Unit
Thermal Resistance R th(ch-a) channel to air 35 °C/W
R th(ch-c) channel to case 1,25 °C/W
Collmer Semiconductor, Inc. - P.O. Box 702708 - Dallas, TX - 75370 - 972-233-1589 - FAX 972-233-0481 - http://www.collmer.com
N-channel MOS-FET 2SK1940-01
600V 0,75Ω 12A 125W FAP-IIA Series
> Characteristics
Typical Output Characteristics Drain-Source-On-State Resistance vs. Tch Typical Transfer Characteristics
↑ 1 ↑ 2 ↑ 3
RDS(ON) [Ω]
ID [A]
ID [A]
VDS [V] → Tch [°C] → VGS [V] →
Typical Drain-Source-On-State-Resistance vs. ID Typical Forward Transconductance vs. ID Gate Threshold Voltage vs. Tch
↑ 4 4 ↑ 5 ↑ 6
RDS(ON) [Ω]
gfs [S]
VGS(th) [V]
Typical Capacitance vs. VDS Typical Input Charge Forward Characteristics of Reverse Diode
↑ 7 ↑ 8 ↑ ↑ 9
C [nF]
VDS [V]
VGS [V]
IF [A]
↑
Zth(ch-c) [K/W]
↑ 10 ↑ 12 11
ID [A]
PD [W]