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CM150DU-12H
HIGH POWER SWITCHING USE
INSULATED TYPE
CM150DU-12H
● IC ................................................................... 150A
● VCES .......................................................... 600V
● Insulated Type
● 2-elements in a pack
APPLICATION
UPS, NC machine, AC-Drive control, Servo, Welders
TC measured point
94
7 80 ±0.25 2–φ6.5
17 23 23 MOUNTING HOLES 4
4 11
CM
C2E1 E2 C1
E2 G2
24
18
13
48
G1E1
12 13.5
3–M5NUTS
12mm deep
E2 G2
C2E1 E2 C1
30 –0.5
G1 E1
+1
21.2
LABEL
CIRCUIT DIAGRAM
Feb. 2009
1
MITSUBISHI IGBT MODULES
CM150DU-12H
HIGH POWER SWITCHING USE
INSULATED TYPE
Limits
Symbol Item Test Conditions Unit
Min Typ Max
ICES Collector cutoff current VCE = VCES, VGE = 0V — — 1 mA
Gate-emitter
VGE(th) IC = 15mA, VCE = 10V 4.5 6 7.5 V
threshold voltage
IGES Gate-leakage current ±VGE = VGES, VCE = 0V — — 0.5 µA
Collector-emitter Tj = 25°C — 2.4 3.0
VCE(sat) IC = 150A, VGE = 15V (Note 4) V
saturation voltage Tj = 125°C — 2.6 —
Cies Input capacitance — — 13.2 nF
VCE = 10V
Coes Output capacitance — — 7.2 nF
VGE = 0V
Cres Reverse transfer capacitance — — 2 nF
QG Total gate charge VCC = 300V, IC = 150A, VGE = 15V — 300 — nC
td (on) Turn-on delay time VCC = 300V, IC = 150A — — 100 ns
tr Turn-on rise time VGE = ±15V — — 350 ns
td (off) Turn-off delay time RG = 4.2Ω — — 300 ns
tf Turn-off fall time Resistive load — — 300 ns
V EC(Note 2) Emitter-collector voltage IE = 150A, VGE = 0V — — 2.6 V
t rr (Note 2) Reverse recovery time IE = 150A, — — 160 ns
Q rr (Note 2) Reverse recovery charge die / dt = –300A / µs — 0.36 — µC
Rth(j-c)Q Junction to case, IGBT part (Per 1/2 module) — — 0.21 K/W
Thermal resistance (Note 5)
Rth(j-c)R Junction to case, FWDi part (Per 1/2 module) — — 0.47 K/W
Case to heat sink, conductive grease applied
Rth(c-f) Contact thermal resistance — 0.07 — K/W
(Per 1/2 module) (Note 6)
Note 1. Pulse width and repetition rate should be such that the device junction temperature (Tj) does not exceed Tjmax rating.
2. IE, VEC, trr, Qrr & die/dt represent characteristics of the anti-parallel, emitter-collector free-wheel diode.
3. Junction temperature (Tj) should not increase beyond 150°C.
4. Pulse width and repetition rate should be such as to cause negligible temperature rise.
5. Case temperature (TC) measured point is shown in page OUTLINE DRAWING.
6. Typical value is measured by using thermally conductive grease of λ = 0.9[W/(m • K)].
Feb. 2009
2
MITSUBISHI IGBT MODULES
CM150DU-12H
HIGH POWER SWITCHING USE
INSULATED TYPE
PERFORMANCE CURVES
OUTPUT CHARACTERISTICS TRANSFER CHARACTERISTICS
(TYPICAL) (TYPICAL)
300 300
VGE=20 14 VCE = 10V
(V) 13
COLLECTOR CURRENT IC (A)
150 11 150
100 10 100
50 9 50
Tj = 25°C
8 Tj = 125°C
0 0
0 2 4 6 8 10 0 4 8 12 16 20
VGE = 15V
SATURATION VOLTAGE VCE(sat) (V)
Tj = 25°C
Tj = 25°C
4 Tj = 125°C 8
COLLECTOR-EMITTER
COLLECTOR-EMITTER
3 6
IC = 300A
2 4
IC = 150A
1 2
IC = 60A
0 0
0 40 80 120 160 200 240 280 300 0 4 8 12 16 20
FREE-WHEEL DIODE
FORWARD CHARACTERISTICS CAPACITANCE CHARACTERISTICS
(TYPICAL) (TYPICAL)
102 102
Tj = 25°C 7
CAPACITANCE Cies, Coes, Cres (nF)
7 5
5
EMITTER CURRENT IE (A)
3
2
3
2 101
7 Cies
5
101 3
7 2
5 100 Coes
7
3 5
2 3
2 Cres
VGE = 0V
100 10–1 –1
1.0 1.4 1.8 2.2 2.6 10 2 3 5 7 100 2 3 5 7 101 2 3 5 7 102
Feb. 2009
3
MITSUBISHI IGBT MODULES
CM150DU-12H
HIGH POWER SWITCHING USE
INSULATED TYPE
2 td(off) 3 3
2 2
102
trr
7 102 101
5 7 7
td(on) lrr
5 5
3
2 tr 3 3
VCC = 300V 2 2
VGE = ±15V
101
RG = 4.2Ω
7 101 1 100
101 2 3 5 7 102 2 3 5 7 103 10 2 3 5 7 102 2 3 5 7 103
3 TC = 25°C 3 TC = 25°C
NORMALIZED TRANSIENT
NORMALIZED TRANSIENT
2 2
Per unit base = Rth(j – c) = 0.21K/W Per unit base = Rth(j – c) = 0.47K/W
100 100
7 7
5 5
3 3 3 3
2 2 2 2
10–1 10–1 10–1 10–1
7 7 7 7
5 5 5 5
3 3 3 3
2 2 2 2
10–2 10–2 10–2 10–2
7 7 7 7
5 5 5 5
3 3 3 3
2 2 2 2
10–3 10–3 10–3 10–3
10–5 2 3 5 710–4 2 3 5 7 10–3 10–5 2 3 5 710–4 2 3 5 7 10–3
15
VCC = 200V
VCC = 300V
10
0
0 100 200 300 400
Feb. 2009