Manufacturing Process Technology part-2

Solutions _ Assignment – 1

1. LIGA technology, (b) microelectromechanical systems, (c) micromachines,

2. (b)10-6 m to 10-3 m,

3. (a) air-bag release sensors,

(d) oil pressure sensors,

4. (e) silicon.

5. (d) lithography, electrodeposition, and plastic molding,

6. c) Both photo etching and making of photographic mask

Explanation: Photolithographic involves both processes in sequence. First photographic
mask is used for artwork and reduction. Then Photo etching for removal of SiO2 from
designed region.

7. (a) With positive resist, the exposed regions are dissolved during develop.
(d) With negative resist, the exposed regions are hardened during develop.
8. (d) The spin speed of the wafer after deposition of resist and the viscosity of the resist
9. (b) Decrease exponentially
Resist thickness is given by t = kp2/w½, where
k is spinner constant, typically 80-100.
p is resist solids content in percent.
w is spinner rotational speed in rpm/1000.

10. d) None of the above

11. (b) the ratio of horizontal rate to the vertical etch rate

12. (b) 0.5 – 2 µm

13. (a) 3.17 µm

�= . ×√ × −9 . × −3 + . × −6

3  t
R  g  
2  2
14. a) Anisotropic

15. (a) 0.44 d

MOOC course under NPTEL (July 2016) IIT Kanpur

 Manufacturing Process Technology part-2
Solutions _ Assignment – 1

16. c) Plasma etching

Explanation: Plasma etching is also called as dry etching. The major advantage of dry
etching process is that, it is possible to achieve smaller line openings (<1µm) compared
to other process.

17. a) Accelerating voltage

Explanation: The depth of penetration of any particular type of ion increases with
increasing accelerating voltage.

18. c) Beam current controlled from outside.

Explanation: In diffusion process, temperature has to be controlled over a large area
inside the oven, whereas in ion implantation technique, accelerating potential and the
beam current are electrically controlled from outside.

19. (a) chemical vapor deposition,

(d) physical vapor deposition,
(f) thermal oxidation

20. (d) ultraviolet light

MOOC course under NPTEL (July 2016) IIT Kanpur