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2016-03-01

Silicon Photodiode with Vλ Characteristic


Version 1.0

SFH 2440

Features:
• Spectral sensitivity adapted to Human Eye Sensitivity (Vλ)
• Low temperature coefficient of spectral sensitivity
• High linearity
• DIL plastic package with high packing density
• Fast switching time

Applications
• Ambient light sensor (Mobile phone, regulation of air conditioning)
• Bio Monitoring

Ordering Information
Type: Spectral sensitivity Ordering Code
S [nA/Ix]
VR = 5 V, standard light A, T =
2856 K
SFH 2440 9.4 Q65111A8524

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Version 1.0 SFH 2440

Maximum Ratings (TA = 25 °C)


Parameter Symbol Values Unit
Operating and storage temperature range Top; Tstg -40 ... 100 °C
Reverse voltage VR 16 V
Total Power dissipation Ptot 150 mW
ESD withstand voltage VESD 1500 V
(acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)

Characteristics (TA = 25 °C)


Parameter Symbol Values Unit
Spectral sensitivity (typ) S 9.4 (≥ 7) nA/Ix
(VR = 5 V, standard light A, T = 2856 K)
Wavelength of max. sensitivity (typ) λS max 620 nm
Spectral range of sensitivity (typ) λ10% (typ) 400 nm
... 690
Radiant sensitive area (typ) A 7.02 mm2
Dimensions of radiant sensitive area (typ) LxW 2.65 x 2.65 mm x
mm
Half angle (typ) ϕ ± 60 °
Dark current (typ (max)) IR 1 (≤ 10) nA
(VR = 5 V)
Spectral sensitivity of the chip (typ) Sλ typ 0.37 A/W
(λ = 550 nm)
Quantum yield of the chip (typ) η 0.83 Electro
(λ = 550 nm) ns
/Photon
Short-circuit current (typ) ISC 8.1 µA
(Ev = 1000 lx, Std. Light A)
Rise and fall time (typ) tr, tf 0.09 µs
(VR = 5 V, RL = 50 Ω, λ = 550 nm)
Forward voltage (typ) VF 1 V
(IF = 100 mA, E = 0)
Capacitance (typ) C0 135 pF
(VR = 0 V, f = 1 MHz, E = 0)
Noise equivalent power (typ) NEP 0.048 pW /
(VR = 5 V, λ = 550 nm) Hz½
Detection limit (typ) D* 5.5e12 cm x
Hz½ / W

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Version 1.0 SFH 2440

Relative Spectral Sensitivity 1) page 11 Photocurrent 1) page 11


Srel = f(λ) IP/IP(25 °C) = f (TA) Ev = 1000 lx, VR = 5 V
OHF05712 OHF05713
100 110
% IP %
Srel
IP (25 ˚C)
80
105
70

60

50 100

40

30
95
20

10

0 90
400 500 600 700 800 900 nm 1100 -40 -20 0 20 40 60 ˚C 100
λ TA
Power Consumption Dark Current 1) page 11
Ptot = f(TA) IR = f(VR), E = 0
OHF05583 OHF05714
160 1.6
mW nA
Ptot IR

TA TS
120 1.2

100

80 0.8

60

40 0.4
TA temp. ambient
20
TS temp. solder point

0 0
0 25 50 75 ˚C 100 0 2 4 6 8 10 12 V 16
TA VR

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Version 1.0 SFH 2440

Capacitance 1) page 11
C = f(VR), f = 1 MHz, E = 0

140
C pF

120

100

80

60

40

20

0
-3 -2 -1 0 1
10 10 10 10 10 V

V
R

Directional Characteristics 1) page 11


Srel = f(ϕ)
40 30 20 10 0 OHF01402
ϕ
1.0

50
0.8

60
0.6

70 0.4

80 0.2

0
90

100
1.0 0.8 0.6 0.4 0 20 40 60 80 100 120

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Version 1.0 SFH 2440

Package Outline

Dimensions in mm.
Package
SMT DIL, Epoxy
Approximate Weight:
43 mg

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Version 1.0 SFH 2440

Recommended Solder Pad

Dimensions in mm (inch).

Reflow Soldering Profile


Product complies to MSL Level 4 acc. to JEDEC J-STD-020D.01
OHA04525
300
˚C
T 250
240 ˚C Tp 245 ˚C
217 ˚C tP
200
tL

150
tS

100

50
25 ˚C
0
0 50 100 150 200 250 s 300
t

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Version 1.0 SFH 2440

OHA04612

Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit


Profil-Charakteristik Symbol Minimum Recommendation Maximum Einheit
)
Ramp-up rate to preheat* 2 3 K/s
25 °C to 150 °C
Time tS tS 60 100 120 s
TSmin to TSmax
Ramp-up rate to peak*) 2 3 K/s
TSmax to TP
Liquidus temperature TL 217 °C
Time above liquidus temperature tL 80 100 s

Peak temperature TP 245 260 °C


Time within 5 °C of the specified peak tP 10 20 30 s
temperature TP - 5 K
Ramp-down rate* 3 6 K/s
TP to 100 °C
Time 480 s
25 °C to TP
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

Taping

Cathode/Collector Side
1.75 (0.069)

4 (0.157)
1.5 (0.059) 2 (0.079)
6.9 (0.272)
12 (0.472)
5.5 (0.217)

0.8 (0.031) 4.1 (0.161)

OHAY2287

Dimensions in mm (inch).

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Version 1.0 SFH 2440

Tape and Reel


12 mm tape with 1500 pcs. on ∅ 180 mm reel
W1

D0 P0
P2

13.0 ±0.25
E
F

A
W

P1 Label
Direction of unreeling Direction of unreeling
W2
Leader: min. 400 mm *
Trailer: min. 160 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
OHAY0324

Tape dimensions [mm]


Tape dim ensions in m m

W P0 P1 P2 D0 E F
12 + 0.3 / - 0.1 4 ± 0.1 4 ± 0.1 2 ± 0.05 1.5 ± 0.1 1.75 ± 0.1 5.5 ± 0.05
or
8 ± 0.1

Reel dimensions [mm]


Reel dim ensions in m m

A W Nmin W1 W2max
180 12 60 12.4 + 2 18.4

Barcode-Product-Label (BPL)
OSRAM Opto

EX
LX XXXX BIN1: XX-XX-X-XXX-X
Semiconductors
RoHS Compliant
(6P) BATCH NO: 1234567890

A
(1T) LOT NO: 1234567890
MP
(9D) D/C: 1234
ML Temp ST
X XXX °C X

Pack: RXX

(X) PROD NO: 123456789(Q)QTY: 9999 (G) GROUP:


DEMY

LE
XX-XX-X-X
XXX
X_X123_1234.1234 X

OHA04563

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Version 1.0 SFH 2440

Dry Packing Process and Materials


Moisture-sensitive label or print

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Humidity indicator
Barcode label
Do not eat.
Avoid metal contact.
Discard if circles overrun.
bag opening.
Please check the HIC immidiately after

check dot WET


Comparator

bake units
examine units, if necessary 15%
If wet,

bake units
examine units, if necessary 10%
If wet,

change desiccant
parts still adequately dry. 5%
If wet,

MIL-I-8835
Humidity Indicator

AM
Desiccant OSR

OHA00539

Note:
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card.
Regarding dry pack you will find further information in the internet. Here you will also find the normative
references like JEDEC.

Transportation Packing and Materials

Barcode label Barcode label


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Packing
Sealing label OHA02044

Dimensions of transportation box in mm


Width Length Height

195 ± 5 195 ± 5 30 ± 5

2016-03-01 9
Version 1.0 SFH 2440

Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language wordings.

Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any
costs incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components* may only be used in life-support devices** or systems with the express written approval of
OSRAM OS.

*) A critical component is a component used in a life-support device or system whose failure can reasonably be
expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that
device or system.
**) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or
maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be
endangered.

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Version 1.0 SFH 2440

Glossary
1)
Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or
calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily
correspond to the actual parameters of each single product, which could differ from the typical data and calculated
correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data
will be changed without any further notice.

2016-03-01 11
Version 1.0 SFH 2440

Published by OSRAM Opto Semiconductors GmbH


Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.

2016-03-01 12
Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

Osram Opto Semiconductor:


SFH 2440

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