Sjzl20081400-Unitrans ZXMP S200 (V3.00) Product Descriptions

ZXMP S200
SDH Based Multi-Service Node Equipment

Product Descriptions
Version 3.00
ZTE CORPORATION
ZTE Plaza, Keji Road South,
Hi-Tech Industrial Park,
Nanshan District, Shenzhen,
P. R. China
518057
Tel: (86) 755 26771900
Fax: (86) 755 26770801
URL: http://ensupport.zte.com.cn
E-mail: support@zte.com.cn
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The ultimate right to interpret this product resides in ZTE CORPORATION.
Revision History
Date Revision Serial No. Description

No.
Second edition. Adds SMB board and EIE3

2009/01/08 R1.1 sjzl20081400
board.
Add the descriptions about the networking
2009/05/20 R1.2 sjzl20081400
application of Ethernet.
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Please fax to: (86) 755-26770801; or mail to ZTE University, ZTE CORPORATION,
ZTE Plaza, A Wing, Keji Road South, Hi-Tech Industrial Park, Shenzhen, P. R. China
518057.
Thank you for your cooperation!
Document ZXMP S200 (V3.00) SDH Based Multi-Service Node Equipment Product
Name Descriptions
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Contents
About This Product Descriptions .................................................... i

Purpose ......................................................................................................i
Intended Audience ....................................................................................i
Prerequisite Skill and Knowledge..............................................................i
What is in This Manual...............................................................................i
Related Documentation ............................................................................ ii
Conventions .............................................................................................. ii
Typographical Conventions ...................................................................................... ii
Mouse Operation Conventions..................................................................................iii
How to Get in Touch ................................................................................ iii
Customer Support ................................................................................................. iv
Documentation Support ......................................................................................... iv
Chapter 1 .......................................................................................1
Overview .......................................................................................1
ZTE’s Unitrans ZXMP Family .....................................................................1
Introduction to ZXMP S200 ......................................................................2
System Structure ......................................................................................3
Structure of Hardware System ................................................................................. 3
Network Management System ................................................................................. 5
System Features .......................................................................................7
Chapter 2 .....................................................................................15
System Hardware........................................................................15
Outline and Structure ............................................................................ 15
Board Overview ..................................................................................... 17
Main Board ............................................................................................. 19
SMC Main Board ................................................................................................... 22
SMB Main Board ................................................................................................... 37
Front Panel........................................................................................................... 50
DC Power Module (PWA/PWB) ............................................................. 54
Functions ............................................................................................................. 54
Operating Principle................................................................................................ 54
Front Panel........................................................................................................... 55
AC Power Module (PWC) ....................................................................... 58
Front Panel........................................................................................................... 59
V.35 Data Interface Board (V35B) ........................................................ 60
Front Panel........................................................................................................... 61
E1/T1 Electrical Tributary Board ........................................................... 62

Types .................................................................................................................. 62
Functions ............................................................................................................. 63
Front Panel........................................................................................................... 64
E3/T3 Electrical Interface Board (EIE3) ............................................... 65
Functions ............................................................................................................. 65
Front Panel........................................................................................................... 66
4-Channel Transparent-Transmission Fast Ethernet Electrical Interface
Board (TFEx4)........................................................................................ 67
Functions ............................................................................................................. 67
Front Panel........................................................................................................... 67
4-Channel Transparent-transmission Fast Ethernet Optical Interface
Board (TFEx4B) ..................................................................................... 69
Functions ............................................................................................................. 69
Front Panel........................................................................................................... 69
Audio Interface Board (AI) ................................................................... 70
Functions ............................................................................................................. 70
Front Panel........................................................................................................... 72
Orderwire Board (OW) .......................................................................... 74
Functions ............................................................................................................. 74
Front Panel........................................................................................................... 75
Enhanced Smart Ethernet Board (SEC) ................................................. 77
Functions ............................................................................................................. 77
Front Panel........................................................................................................... 78
SHDSL Interface Board (SDB) ............................................................... 80
Functions ............................................................................................................. 80
Front Panel........................................................................................................... 81
Chapter 3 .....................................................................................83
Technical Specifications ..............................................................83

Dimensions & Weight ............................................................................ 84
Power Supply Requirements ................................................................. 85
Voltage Range ...................................................................................................... 85
Power Consumption and Weight ............................................................................ 85
Environment Requirements................................................................... 90
Grounding and Lightning Protection Requirements................................................... 90
Temperature/Humidity Requirements..................................................................... 94
Cleanness Requirements ....................................................................................... 94
Application Environment Requirements................................................................... 95
Earthquake-Proof Performance............................................................. 95
Reliability Indexes ................................................................................. 96
Electromagnetic Compatibility .............................................................. 96
Criterion .............................................................................................................. 96
Immunity Performance ......................................................................................... 97
Disturbance Characteristics.................................................................................... 99
Eye Pattern of Optical Launched Signals ............................................. 100
Optical Interfaces Specifications ......................................................... 101
Electrical Interfaces Specifications ..................................................... 104
Specification of STM-1 Electrical Interfaces............................................................ 104
Specification of E1 Electrical Interfaces ................................................................. 104
Specification of T1 Electrical Interfaces ................................................................. 105
Specification of E3 Electrical Interfaces ................................................................. 106
Specification of T3 Electrical Interfaces ................................................................. 107
Clock Timing & Synchronization .......................................................... 108
Bit Error Performance.......................................................................... 109
Protection Switching Time .................................................................. 109
Compliant Standards of Interfaces ..................................................... 109
Chapter 4 ...................................................................................111
Networking and Configurations ................................................111

Functions as an SDH NE....................................................................... 111
Terminal Multiplexer (TM).................................................................................... 111
Add/Drop Multiplexer (ADM) ................................................................................ 112
Regenerator (REG) ............................................................................................. 112
Networking Modes............................................................................... 112
Point-to-Point Networking.................................................................................... 113
Chain Networking ............................................................................................... 113
Ring Networking ................................................................................................. 113
Hybrid Networking .............................................................................................. 115
Networking Application of Ethernet .................................................... 115

Overview ........................................................................................................... 115
Ethernet Private Line (EPL) .................................................................................. 115
Ethernet Virtual Private Line (EVPL) ..................................................................... 116
Ethernet Private LAN (EPLAN) .............................................................................. 117
Ethernet Virtual Private LAN (EVPLAN).................................................................. 118
Application Example ............................................................................ 119

Network Description............................................................................................ 119
Networking Analysis............................................................................................ 120
Board Configurations........................................................................................... 121
Installation Configurations ................................................................................... 122
Configurations in the EMS.................................................................................... 122
Networking Features ........................................................................................... 122
Appendix A ................................................................................125
Compliant Recommendations and Standards ...........................125
Appendix B ................................................................................131
Abbreviations ............................................................................131
About This Product
Descriptions
Purpose
This manual provides the basic information you need for understanding
Unitrans ZXMP S200 (V3.00) SDH Based Multi-Service Node Equipment
(ZXMP S200 for short).
Intended Audience
This document is intended for engineers and technicians who want to
know the system information, hardware information, operating principle
and technical specifications of ZXMP S200.
Prerequisite Skill and Knowledge

To use this document effectively, users should have a general
understanding of SDH transmission system technology. Familiarity with
the following is helpful:
 ZXMP S200 equipment and its various components

 ZXONM E300 Network Element Management System (EMS)
What is in This Manual

This Manual contains the following chapters and appendixes:
T AB L E 1 C H AP T E R AN D AP P E N D I X S U M M AR Y
Chapter/Appendix Summary
Chapter 1 Overview Introduces the overall structures, features and
compliant standards of ZXMP S200.
Chapter 2 System Describes the hardware structure and mechanical
Confidential and Proprietary Information of ZTE CORPORATION i

ZXMP S200 (V3.00) Product Descriptions
Chapter/Appendix Summary
Hardware characteristics of ZXMP S200, including working
principles, functions, structures, panels and
indicators.
Chapter 3 Technical Lists and describes the specifications and
Specifications parameters of ZXMP S200.
Chapter 4 Networking and Introduces the networking modes, network
Configurations application of Ethernet, as well as a networking
example of ZXMP S200.
Appendix A Compliant Lists all compliant recommendations and
Recommendations and standards used in the design of ZXMP S200.
Standards
Appendix B Abbreviations Lists the abbreviations of technical terms you may
encounter in this manual.
Related Documentation
The following documentation is related to this manual:
Documentation Descriptions
Unitrans ZXMP S200  Introduces the installation steps on site, including

(V3.00) Installation installation preparation, hardware installation,
& Maintenance cable layout, installation checkup, the process of
Manual power-on/power-off.
 Introduces the main and common operations
during the routine maintenance, focusing on the
common alarms and performance information, in
addition, the reasons and handling way of some
typical faults.
Unitrans ZXMP S200 Based on ZXONM E300, introduce the provisioning
(V3.00) methods, basic configuration of the NE, SDH
Configuration Manual protection configuration and the data service
configuration, which are related to ZXMP S200.
Conventions
Typographical Conventions
ZTE documents employ with the following typographical conventions.
ii Confidential and Proprietary Information of ZTE CORPORATION

About This Product Descriptions
T ABLE 2 TYPOGRAPHICAL CONVENTIONS
Typeface Meaning
Italics References to other guides and documents.
“Quotes” Links on screens.
Bold Menus, menu options, function names, input fields,
radio button names, check boxes, drop-down lists,
dialog box names, window names.
CAPS Keys on the keyboard and buttons on screens and
company name.
C o n s t a nt w i d t h Text that you type, program code, files and directory
names, and function names.
[] Optional parameters
{} Mandatory parameters
| Select one of the parameters that are delimited by it
Note: Provides additional information about a certain

topic.
Checkpoint: Indicates that a particular step needs to

be checked before proceeding further.
Tip: Indicates a suggestion or hint to make things

easier or more productive for the reader.
Mouse Operation Conventions

T ABLE 3 M OUSE OPER ATION CONVENTIONS
Typeface Meaning
Click Refers to clicking the primary mouse button (usually
the left mouse button) once.
Double-click Refers to quickly clicking the primary mouse button
(usually the left mouse button) twice.
Right-click Refers to clicking the secondary mouse button
(usually the right mouse button) once.
Drag Refers to pressing and holding a mouse button and
moving the mouse.
How to Get in Touch

The following sections provide information on how to obtain support for
the documentation and the software.
Confidential and Proprietary Information of ZTE CORPORATION iii

Customer Support
If you have problems, questions, comments, or suggestions regarding
your product, contact us by e-mail at support@zte.com.cn. You can also
call our customer support center at (86) 755 26771900.
Documentation Support
ZTE welcomes your comments and suggestions on the quality and
usefulness of this document. For further questions, comments, or
suggestions on the documentation, you can contact us by e-mail at
doc@zte.com.cn; or you can fax your comments and suggestions to (86)
755 26770801. You can also explore our website at
http://ensupport.zte.com.cn, which contains various interesting subjects
like documentation, knowledge base, forums and service request.
iv Confidential and Proprietary Information of ZTE CORPORATION

Chapter 1
Overview
In this chapter, you will learn about:

 ZTE’s SDH transmission product family–Unitrans ZXMP family,
 Structure and system features of ZXMP S200.
ZTE’s Unitrans ZXMP Family

ZTE’s SDH based multi-service node equipment family (Unitrans ZXMP
family) can support all applications at the core layer, convergence layer
and access layer. It provides users with future-oriented and integrated
solutions for metro area network (MAN).
The Unitrans ZXMP family includes various SDH based multi-service node
equipment, such as ZXMP S390, ZXMP S385, ZXMP S380, ZXMP S330,
ZXMP S325, ZXMP S320, ZXMP S310, ZXMP S200, ZXMP S150 and ZXMP
S100, as illustrated in Figure 1.
FIGURE 1 ZTE’S UNITRANS ZXM P FAMILY
ZXMP S390
ZXMP S385
ZXMP S380
核心层
ZXMP S385
ZXMP S380
ZXMP S330
汇聚层
ZXMP S330
ZXMP S325
ZXMP S320
ZXMP S310
接入层 ZXMP S200
ZXMP S150
ZXMP S100
Confidential and Proprietary Information of ZTE CORPORATION 1

Introduction to ZXMP S200

ZXMP S200 is a kind of SDH transmission equipment for multi-service
access, supporting the rate up to STM-4. Besides serving as the
integrative transmission equipment in GSM, CDMA or 3G base stations, it
can also access multi-services for customers in buildings or communities
as well as private line services for business customers. Moreover ZXMP
S200 can replace existing PDH equipment for transmission.
ZXMP S200, designed as a platform, strictly complies with related ITU-T

recommendations and China national standards. It provides a main board
for accessing various services. The main board integrates all SDH
functions (including the transmission of data services) and provides the
bus, control and communication interfaces for extension plug-in cards.
Multiple plug-in cards, which provide more powerful service access
function, are optional. The main board and plug-in cards support the
remote online upgrade of card software, including software programs and
FPGA programs.
Currently, ZXMP S200 can be configured with SMB main board or SMC
main board. It can provide STM-1/STM-4 optical interfaces, STM-1
electrical interface, E3/T3 electrical interfaces, E1/T1 electrical interfaces,
and FE (Fast Ethernet) optical/electrical interfaces, SHDSL interfaces, V.35
data interface, RS232/RS485/RS422 interfaces, orderwire telephone
interfaces and audio interfaces.
Figure 2 shows the front view of ZXMP S200.
FIGURE 2 FRONT VIEW OF ZXMP S200
ZXMP S200 can be used as a network element, such as terminal

multiplexer (TM), regenerator (REG) or add/drop multiplexer (ADM), in
simple networking applications.
Note: The SMB and SMC have the same design principle. The differences
between them are the types and quantities of interfaces. Refer to Main Board.
ZXMP S200 has good network adaptive capability. It can be managed by

Unitrans ZXONM E300 Unified EMS/SNMS of Optical Network (ZXONM
E300 for short) developed by ZTE CORPORATION. The network
management information can be transmitted via E1 tributaries. ZXMP
S200 can also work without the network management system.
ZXMP S200 is a compact equipment with high integration. It has high

reliability and high cost to performance ratio. It can be applied to various
2 Confidential and Proprietary Information of ZTE CORPORATION

Chapter 1 Overview
situations and be configured flexibly. ZXMP S200 can be configured as

various network element, such as terminal multiplexer (TM), regenerator
(REG) or add/drop multiplexer (ADM).
ZXMP S200 can be powered by any of below power supply ways: AC

110/220 V, DC -48 V and DC +24 V.
ZXMP S200 supports various installation modes, that is, it can be installed
on the desktop, hung on the wall, inside an indoor cabinet, an
transmission outdoor cabinet (including outdoor functional cabinet and
field power supply cabinet).
System Structure
Figure 3 shows the structure of ZXMP S200.
FIGURE 3 STRUCTURE OF ZXMP S200
ZXMP S200
SDH Equipment
ZXONM E300
(TM, ADM, REG)
Configuration management
Performance management
Maintenance management
NE control processing unit
Security management
System management
Fault management
Cross-connect unit
Micro Control Unit
Orderwire Unit
Overhead unit
Service unit
Power unit
Clock unit
Hardware System Network Element Management System
ZXMP S200 consists of the hardware system and the network

management software system, which are independent of each other while
working in a coordinated way.
The hardware system is the principal part of ZXMP S200, and it can work
independently without the network element management system.
Structure of Hardware System

The ZXMP S200 hardware system is composed of eight functional units.
Figure 4 illustrates the relationship among these units in the block diagram.

FIGURE 4 REL ATIONSHIP S BETWEEN F UNCTION AL UNITS IN ZXM P S200
Service Unit Cross-Connect Unit Service Unit
Clock Unit
Overhead
Orderwire Unit
Processing Unit
Power Micro Control NE Control

Unit Unit Processing Unit
The functions of each unit are described as follows.
1. NE control processing unit (NCP)

As the control management core of ZXMP S200, the NCP unit can:
 Process ECC data,
 Manage alarms, performances and configurations,
 Provide interfaces for connections between equipment and EMS.
2. Micro control unit (MCU)
As the service management core of ZXMP S200, the MCU implements
the initialization, configuration, alarm and performance monitoring of
the service chips on the main board.
3. Service unit
This unit implements the accessing of SDH, PDH and Ethernet services,
which are translated into special format, and then sent to the cross-
connect unit for service convergence and distribution.
4. Cross-connect unit
Based on configuration information from the EMS and alarms in each
optical direction, cross-connect unit can:
 Cross connect traffic from different optical directions,
 Cross overheads,
 Perform path protection switching,
 Perform APS bridging/switching.
5. Overhead processing unit
This unit provides user with transparent data channel by means of the
overhead bytes in Section Over Head (SOH).
6. Orderwire unit

Chapter 1 Overview
This unit implements the orderwire and low-rate data transmission.

Audio interfaces are also provided by this unit.
7. Clock unit
This unit provides each functional unit in the equipment with the
standard system clock, to achieve the entire network synchronization
based on the configuration in the EMS. In addition, the clock unit
provides external clock input/output interfaces.
8. Power unit
Working as an independent unit, the power unit provides steady power
supply to all the other functional units in the system.
Network Management System

ZXONM E300 with the version V3.18R2 or above can manage and monitor
the ZXMP S200 (V3.00) hardware system and the transmission network,
thus coordinate the operation of the transmission network.
ZXONM E300 is designed with a four-layer structure, consisting of the

equipment layer, NE layer, NE management layer and the subnet
management layer. It also provides Corba interface for the network
management layer. Figure 5 illustrates the hierarchical structure of
ZXONM E300.
FIGURE 5 HIERARCHIC AL S TRUCTURE OF ZXONM E300
NMS NMS
Network
Management
Layer Corba Corba
GUI(Cient)
SNMS
Subnet Manager 3
Management
Layer F F
GUI(Cient) GUI(Cient) GUI(Cient) GUI(Cient)
F F F
F
Element EMS/SNMS LCT EMS/SNMS EMS/SNMS

Management Manager 1 Manager 2 …… Manager n
Layer
Qx Qx Qx
GNE/Agent f
GNE/Agent
ECC ECC ECC ECC
NE/Agent NE/Agent NE/Agent NE/Agent
ECC ECC ECC ECC

ECC
NE/Agent NE/Agent NE/Agent GNE/Agent
NE Layer
Equipment S S S S S S
Layer
MCU …… MCU MCU …… MCU MCU …… MCU

Four-Layer Structure of NMS

The four-layer structure of the network management system is described
as follows.
 Equipment layer (MCU)

It monitors alarms and performances of boards, receives instructions
from the network management system and controls the specific
operation of the boards.
 Network element layer (Agent)
As the Agent in the network management system, it performs the
management function for the individual NE.
The agent initializes each board when the NE is powered on firstly.
Normally, it monitors alarm and performance status of the NE. In
addition, it receives and processes monitoring commands from the
element management layer (Manager) through the gateway network
element (GNE).
 Element management layer (Manager)
It controls and coordinates the operation of multiple NEs. This layer
includes Manager, Graphical User Interface (GUI) and Local Craft
Terminal (LCT).
 Manager: core of the element management layer, also called as
Server. It can manage multiple subnets simultaneously, controlling
and coordinating the NE equipment.
 GUI: graphical user interfaces. It converts user’s management
requests into commands in the internal format, and then forwards
them to the Manager.
 LCT: it is a simple combination of GUI and Manager by controlling
the user authority and software functional parts. The LCT provides
the reduced NE management function. It is usually used for
commissioning or maintenance of local NEs.
 Subnet management layer
The structure of the subnet management layer is similar to that of the
NE management layer. The configuration and maintenance for NEs are
performed through the element management system (EMS) indirectly.
SubNet Management System (SNMS) sends a command to the EMS,
and then the EMS forwards it to the NE. Finally the NE responds to the
SNMS through the EMS. The SNMS can provide the network
management layer with the Corba interface to transmit subnet
monitoring command and operation information.
Interfaces in NMS
Table 4 lists the interfaces in a network management system and the
corresponding descriptions.

Chapter 1 Overview
T ABLE 4 I NTERFACES IN A NETWORK M ANAGEMENT S YSTEM
Interface Description
It is the interface between Agent and Manager, as shown in
Figure 5, that is, the interface between the NCP and the
Qx interface computer with the Manager program.
The Qx interface complies with the TCP/IP protocol.
It is the interface between GUI and Manager, or between the
Manager on the subnet management layer and the Manager on
F interface the NE management layer, as shown in Figure 5.
The F interface complies with the TCP/IP protocol.
It is the interface between Agent and LCT, as shown in Figure 5,
that is, the interface between the NCP and the local craft
f interface terminal. There is network management software on the LCT.
The f interface complies with the TCP/IP protocol.
It is the interface between Agent and MCU, as shown in Figure
5, that is, the communication interface between the NCP and
other boards.
S interface
The S interface adopts the point-to-multipoint communication
mode based on the High level Data Link Control (HDLC)
communication mechanism.
It is the interface between Agents, as shown in Figure 5, that is,
the communication interface between NEs.
ECC The ECC interface adopts Data Communication Channel (DCC)
interface for communication, be capable of supporting both the
customized communication protocol and the standard protocol.
It implements the network bridge function Agents.
You can get more information about the network management system in
the related manuals of ZXONM E300.
System Features
 Small Size and Compact Structure
ZXMP S200 has small size and high integration. Equipped with various
mounting flanges, ZXMP S200 can be installed on the desktop, hung on
the wall, or in an IEC, ETS standard 19-inch cabinet and transmission
outdoor cabinet (including outdoor functional cabinet and field power
supply cabinet). It needs less space for accommodation.
All interfaces are located at the front, by which, operation and
maintenance of the equipment is very convenient.
 Abundant Service Functions
ZXMP S200 can access multi-services, including traditional SDH
services and data services. Table 5 lists the cross-connect capacity of
ZXMP S200.

T ABLE 5 CROSS-CONNECT CAP ACITY OF ZXM P S200
Higher-order Cross- Lower-order Cross-

Main Board
connect Capacity connect Capacity
SMB 32 × 32 VC4 1008 × 1008 VC12
SMC 64 × 64 VC4 2037 × 2037 VC12
Table 6 and Table 7 respectively list the service interfaces and

corresponding maximum access capacities provided by ZXMP S200
with SMB or SMC main board.
T ABLE 6 S ERVICE I NTERF ACES P ROVIDED BY ZXM P S200 (SM B)
Max. Capacity
Interface Remark
(Channel)
ZXMP S200 supports 4 channels of
STM-1 and 2 channels of STM-4 optical
interfaces at most.
SDH optical Thus, the allowable SDH interface
4 combinations are as follows:
interface
4 × STM-1 or
2 × STM-1 + 2 × STM-4 or
3 × STM-1 + 1 × STM-4
E1/T1
42 -
electrical interface
E3/T3 E3 or T3 rate is supported via the
3
electrical interface EMS.
FE interface include FE electrical

interface and FE optical interface. The
allowable combinations of 8 channels
of FE interfaces are as follows:
4 × FE (electrical) + 4 × FE (optical)
FE interface or
8
8 × FE (electrical)
The main board provides 4 channels of
FE interfaces, and the SEC board
provides another 4 channels of FE
electrical interfaces, which supports L2
switch.
V.35 data
interface 2 N is an integer from 1 to 31
(N × 64 kbit/s)
Set the interface type is two-line or
Audio interface 6 four-line via EMS, or set the output
electrical level gain.

Chapter 1 Overview
Max. Capacity
Interface Remark
(Channel)
The ZXMP S200 supports
6 RS232 interfaces or
6 RS485 interfaces or
Data interface 6 or 3
3 RS422 interfaces.
The interface type can be set via the
EMS.
Orderwire
telephone 1 -
interface
TRK interface 1 -
SHDSL interface 4 -
Note:
 Optical interfaces adopt Small form Factor Pluggable (SFP) modules,
supporting interface diagnosis function.
 ZXMP S200 provides an extension slot. If the maximum capacity of one type of
interface is reached by using the extension slot, the other types of interfaces that
need to use the extension slot cannot reach the maximum capacity listed in Table
6.
T ABLE 7 S ERVICE I NTERF ACES P ROVIDED BY ZXM P S200 (SM C)
Max. Capacity
Interface Remark
(Channel)
Each of the optical interfaces can
SDH optical
4 be set to access the STM-4 or
interface
STM-1 signal.
STM-1 electrical
4 -
interface
The main board provides 21 x
E1/T1 E1/T1, besides, the plug-in board
42
electrical interface ET1 can provide another 21 x
E1/T1.
FE interface include FE electrical
interface and FE optical interface.
The allowable combinations of 8
channels of FE interfaces are as
follows:
FE interface 8
4 × FE (electrical) + 4 × FE
(optical) or
8 × FE (electrical)
The main board provides 4 channels of
FE interfaces, and the SEC board

Max. Capacity
Interface Remark
(Channel)
provides another 4 channels of FE
electrical interfaces, which supports L2
switch.
V.35 data interface

2 N is an integer from 1 to 31.
(N × 64 kbit/s)
Set the interface type is two-line or
Audio interface 6 four-line via EMS, or set the output
electrical level gain.
ZXMP S200 can provide:
 6 RS232 interfaces or,
 6 RS485 interfaces or,
Data interface 6 or 3
 3 RS422 interfaces.
The interface type can be set on
the EMS.
Orderwire
1 -
telephone interface
TRK interface 1 -
SHDSL interface 4 -
Note:
 Optical interfaces and STM-1 electrical interfaces adopt Small form Factor
Pluggable (SFP) modules, supporting interface diagnosis function.
 ZXMP S200 provides an extension slot. If the maximum capacity of one type of
interface is reached by using the extension slot, the other types of interfaces that
need to use the extension slot cannot reach the maximum capacity listed in Table
7.
ZXMP S200 supports E1/T1 and E3/T3 mapping and multiplexing

structure specified by ITU-T recommendations, as illustrated in Figure
6.

Chapter 1 Overview
FIGURE 6 M APPING/M ULTIPLEXING S TRUCTURE OF ZXM P S200
×N ×1
STM-N AUG AU-4 VC-4
×1
×3 ×3 TUG-3 TU-3 VC-3
×7 E3（34368kbit/s（
AU-3 VC-3 C-3 T3（44736kbit/s（
×3
×7 TUG-2
Pointer processing TU-12 VC-12 C-12 E1（2048kbit/s（
×4
Multiplexing TU-11 VC-11 C-11 T1（1544kbit/s（
Aligning
Mapping
In addition, with the SMC board, SDH optical interfaces of ZXMP S200
also support the application of single fiber bi-directional transmission of
STM-1/4 optical signal, which is a fiber-saving solution to transport the
receiving signal and transmitting signal in a same fiber.
ZXMP S200 can act as a terminal multiplexer (TM), add/drop
multiplexer (ADM) or a regenerator (REG) depending on the actual
networking requirements. It supports point-to-point, chain and ring
networking modes.
 Perfect Network-Level Protection
 At the Multiplex Section (MS) layer, ZXMP S200 supports the
following MS protection modes:
T ABLE 8 M S PROTECTION M ODES SUPPORTED BY ZXM P S200
Networking Rate Protection mode Remark

mode
MS ring STM-4 Two-fiber Revertive protection
bidirectional MS without extra traffic
shared protection and the fault blocked
ring function
MS link STM-1/ Four-fiber Revertive or non-
STM-4 bidirectional link MS revertive protection
1+1 protection
Four-fiber Revertive protection
bidirectional link MS with the extra traffic
1:1 protection
Four-fiber -
unidirectional link
MS 1+1 protection
Four-fiber It is divided into two
unidirectional link modes further: with
MS 1:1 protection extra traffic and
without extra traffic
 At the path layer, ZXMP S200 supports the Sub-Network

Connection (SNC) protection modes, such as SNC (I) protection at

the level of VC12/VC3 and SNC (N) and SNC (I) protection at the
level of VC4.
The SNC protection complies with ITU-T G.841 and G.842
recommendations. Table 9 lists the alarms that will trigger the SNC
protection switching.
T AB L E 9 AL AR M S TR I G G E R I N G S N C P R O T E C TI O N S W I T C H I N G
Protection Mode Alarms Triggering Protection Switching

SNC (I) at VC12/VC3 level TU AIS, TU LOP
SNC (I) at VC4 level AU AIS, AU LOP
SNC (N) at VC4 level AU AIS, AU LOP, HP TIM, HP UNEQ, HP SD
Note: Currently, ZXMP S200 doesn’t support SNC (N) at the level of
VC12/VC3.
 Powerful Overhead Configuration Capability

The service unit of ZXMP S200 separates the SOH and payloads in SDH
frames, combines the overhead bytes into standard overhead bus and
then forwards them to the overhead unit.
The overhead bus not only includes the management, orderwire and
switching bytes complying with ITU-T recommendations, but also loads
orderwire and data services into idle overhead bytes.
The overhead unit of ZXMP S200 performs the overhead processing
function. It implements the cross-connection and dispatch of
overheads. The minimum cross-connect granularity is byte. The
overhead unit can cross-connect overheads to any port according to
the configuration in the EMS.
 Multiple Power Supply Input Modes
The ZXMP S200 equipment adopts concentrated power supply mode. It
can be powered by multiple kinds of power supplies, including AC 110
V/220 V, DC -48 V and DC +24 V.
When DC power supply is used, ZXMP S200 supports the dual-input
mode, that is, dual paths of DC power supply are input to the
equipment for protection. Accordingly, the EMS indicates the input
status (normal or alarm) of each path of the two power supply inputs.
 Various Alarm Modes
ZXMP S200 supports the alarms in visible and audible modes:
 Indicators on the main board use different colors to indicate critical,
major and minor alarms. Indicators on plug-in cards are used to
indicate whether the cards report an alarm.
 The buzzer provided by the equipment presents alarm sound when
an alarm occurs. User can enable or disable the audible alarm
function via the ring trip button (identified with “B.OFF”) on the
main board.

Chapter 1 Overview
 In addition, ZXMP S200 provides one alarm input interface and one
alarm output interface, to support four alarm inputs (on-off signal
inputs) and two alarm outputs (on-off signal outputs).
 SSM-based Timing Synchronization Processing
ZXMP S200 has multiple synchronous timing sources, including internal
timing source, timing signal extracted from line/tributary and external
timing source. It supports one external timing source (2 MHz or 2
Mbit/s), all of the extracted clocks from optical interfaces and STM-1
electrical interface (i.e. four line extracted clocks) and two tributary
clocks extracted from tributary 1 and 2.
ZXMP S200 supports the processing of the synchronization status byte
S1. It also identifies timing quality with synchronization status
message (SSM). By this way, NEs can select the synchronous path with
the highest quality level, to ensure the network synchronization
performance and avoid possible timing loop caused by timing reference
switching.
 Powerful and Easy-to-Use Network Management System
ZXMP S200 (V3.00) can be managed by ZXONM E300 with the version
of V3.18R2 or above, which can manage all optical transmission
equipment of ZTE CORPORATION and support their hybrid networking.
ZXONM E300 has the element management layer functions and some
network management layer functions. It performs fault (maintenance)
management, performance management, configuration management,
security management and system management functions.
ZXONM 300 provides a graphical user interface (GUI) for easy
operation.
 Good Network Adaptability
 Provides network management channels suitable for hybrid
networking
Different SDH equipment manufacturers define the DCC (data
communication channel) bytes and process them in different ways.
Due to this, network management information interconnection may
be impossible in a hybrid network consisting of equipment provided
by different manufacturers.
ZXMP S200 adopts DCC bytes as embedded control channel (ECC)
for transmitting network management information. In addition,
timeslots of E1 tributaries can also be used as ECC.
In this way, the network management information is added in the
SDH payload, and then transmitted transparently through other
SDH equipment. Thus the integrated network management in
hybrid network is implemented.
 Supports normal operation without EMS
ZXMP S200 can operate normally without the management of the
ZXONM E300.
 Online Download and Upgrade of Board Software

The main board and plug-in cards of ZXMP S200 support remote online
download and upgrade of board software, including application and
logic programs.
Not interrupted traffic during the download of application programs
makes the maintenance and upgrade of the equipment more
convenient and guarantees the reliability during system upgrade. Only
downloading logic programs may cause transient interruption of traffic.

Chapter 2
System Hardware
 Hardware structure and mechanical characteristics of ZXMP S200,

 Operating principles, functions, structures, interfaces and indicators of
the boards in ZXMP S200.
Outline and Structure

ZXMP S200 can be flexibly configured according to the power board and
service interface type to meet different requirements of users. The outline
and structure of ZXMP S200 with different configurations are similar
except the power input mode, the type and quantity of service interfaces.
ZXMP S200 consists of the chassis, main board, plug-in cards (configured
as needed), power module, fan module and the dustproof module.
For example, Figure 7 shows the ZXMP S200 equipment configured with 4
optical interfaces, 21 E1 electrical interfaces and a power module for
accessing DC -48 V power supply.
FIGURE 7 OUTLINE AND S TRUCTURE OF ZXM P S200
1. Fan module 2. Power module

3. Dummy panel 4. Main board
5. Dustproof module 6. Chassis

 Fan module
In order to meet the different installation conditions, ZXMP S200
supports middle-speed and high-speed fan module. The middle-speed
fan module is applied to the indoor environment under the
temperature between -5 and 45 degrees, meanwhile it has low noise.
On the other side, the high-speed fan module is applied to the
environment under the temperature between -5 and 50 degrees.
The middle-speed and high-speed fan modules have the same outline,
structure and size. They both contain three plastic fans to guarantee
heat dissipation of the chassis.
Figure 8 shows the structure of the fan module.
FIGURE 8 S TRUCTURE OF THE F AN M ODULE
Fan
 Power module
The power module consists of the power board and enclosure. It
provides power to all units in the ZXMP S200 equipment.
Figure 9 illustrates the structure of power module with a power board
(PWA).
The descriptions of PWA and PWB refer to DC Power Module
(PWA/PWB), and the descriptions of PWC in details refer to AC Power
Module (PWC).

Chapter 2 System Hardware
F I G U R E 9 S T R U C T U R E O F T H E P O W E R M O D U L E ( P W A)
1. Knob 2. Handle
3. Power indicator (A path) 4. Power indicator (B path)
5. DC power socket (A path) 6. DC power socket (B path)
7. Power switch 8. Running and alarm indicator
9. Enclosure
 Dustproof module
As shown in Figure 7, the dustproof module keeps the inner of the
equipment clean, and prevents dust accumulation, which may affect
the equipment performance. It is composed of a dustproof cover and
an air filter. The air filter is pluggable for periodical cleaning.
Board Overview
ZXMP S200 provides various main boards and plug-in cards for choice, as
listed in Table 10.
T ABLE 10 BOARD LIST OF ZXMP S200
No. Board Code Description

System Main Center of Dual optical interfaces and Eight
1 SMCxD75E
75 Ω E1 interfaces
System Main Center with Dual optical interface and
2 SMCxD75T
Twenty-one 75 Ω E1 interfaces
System Main Center with Four optical interfaces and
3 SMCxF75E
Eight 75 Ω E1 interface
4 SMCxF75T
System Main Center with Dual optical interfaces and
5 SMCxD120E
Eight 120 Ω E1 interfaces
6 SMCxD120T
7 SMCxF120E


8 SMCxF120T
9 SMCxD100E
eight 100 Ω T1 interfaces
10 SMCxD100T
Twenty-One 100 Ω T1 interfaces
11 SMCxF100E
12 SMCxF100T
System Main Board with Dual optical interfaces and
13 SMBxD75E0
System Main Board with Dual optical interface and
14 SMBxD75T0
System Main Board with Four optical interfaces and
15 SMBxF75E0
Eight 75 Ω E1 interface
16 SMBxF75T0
17 SMBxD120E0
18 SMBxD120T0
19 SMBxF120E0
20 SMBxF120T0
21 SMBxD100E0
22 SMBxD100F0
23 SMBxF100E0
24 SMBxF100F0
25 PWA Power Board A, -48 V DC power module
26 PWB Power Board B, +24 V DC power module
27 PWC Power Board C, 110 V/220 V AC power module
28 IBB 2 Mbit/s BITS interface board
29 IBBZ 2 MHz BITS interface board
30 ET1-75 21-channel E1 Electrical Tributary board (75 ohm)

31 ET1-120 21-channel E1 Electrical Tributary board (120 ohm)
32 TT1-100 21-channel T1 Electrical Tributary board (100 ohm)
33 EIE3 Electrical interface board of E3/T3
34 V35B 2-channel V.35 data interface Board
4-channel Transparent-transmission Fast Ethernet

35 TFEx4
electrical interface board
4-channel Transparent-transmission Fast Ethernet
36 TFEx4B
optical interface board
37 AI Audio Interface board
38 OW Order Wire interface board
39 SDB 4xSDB interface board
40 SEC 4xFE Enhanced Smart Ethernet board
41 MB Mother board
42 FAN Fan board
Main Board
The main board of ZXMP S200 integrates the functions of NCP, aggregate,
tributary, cross-connect, clock, and Ethernet service processing. In
addition, it supports the temperature detection function. Set the upper and
lower temperature thresholds on the EMS, once the temperature is over
threshold, the board will report an alarm.
ZXMP S200 supports two different main board types: SMB and SMC. They
have the same design and differ in interface types and interface quantities.
Table 11 and Table 12 list various SMC boards and SMB boards.
T AB L E 1 1 L I S T O F S M C M AI N B O AR D S
Available Interfaces
Board
No. Optical Electrical
Code Other Interface
Interface Interface
Eight 75 Ω non- Each type of SMC main
SMCxD7 2 optical
1 balanced E1 board can provide:
5E interfaces
electrical interfaces

Board
No. Optical Electrical
Code Other Interface
Interface Interface
Twenty-one 75 Ω  One 75 Ω BITS
SMCxD7 2 optical
2 non-balanced E1 interface,
5T interfaces
electrical interfaces  One alarm output
Eight 75 Ω non-
interface,
SMCxF75 4 optical
3 balanced E1  One RS232
E interfaces
electrical interfaces interface/120 Ω
Twenty-one 75 Ω
BITS interface,
SMCxF75 4 optical
4 non-balanced E1  One LCT interface,
T interfaces
electrical interfaces  One network
Eight 120 Ω management
SMCxD1 2 optical
5 balanced E1 interface,
20E interfaces
electrical interfaces  One alarm input
Twenty-one 120 Ω interface,
SMCxD1 2 optical
6 balanced E1  Four fast Ethernet
20T interfaces
electrical interfaces electrical
Eight 120 Ω interfaces.
SMCxF12 4 optical
7 balanced E1
0E interfaces
Twenty-one 120 Ω
SMCxF12 4 optical
8 balanced E1
0T interfaces
Twenty-one 100 Ω
SMCxD1 2 optical
9 balanced T1
00T interfaces
Eight 100 Ω
SMCxD1 2 optical
10 balanced T1
00E interfaces
Twenty-one 100 Ω
SMCxF10 4 optical
11 balanced T1
0T interfaces
Eight 100 Ω
SMCxF10 4 optical
12 balanced T1
0E interfaces
Note:
 ZXMP S200 can support the STM-1 electrical service by being configured with
the SFP electrical interface module on the SMC board.
 For the main board providing two optical interfaces, each of the optical
interfaces supports traffic at the rate of either STM-1 or STM-4. On the board panel,
they are identified as “5” and “6”.

T ABLE 12 LIST OF SM B BOARDS
Board
No. Optical Electrical Other Interface
Code
Interface Interface
Eight 75 Ω non-
SMBxD75 Two optical balanced E1
1
E0 interfaces electrical
interfaces
Twenty-one 75 Ω
SMBxD75 Two optical
2 non-balanced E1
T0 interfaces
Eight 75 Ω non-
SMBxF75 Four optical balanced E1
3
E0 interfaces electrical
interfaces
Twenty-one 75 Ω
SMBxF75 Four optical non-balanced E1
4
T0 interfaces electrical
interfaces Each type of SMB
main board can
Eight 120 Ω provide:
SMBxD12 Two optical balanced E1
5  One 75 Ω BITS
0E0 interfaces electrical
interfaces
interface
 One alarm output
Twenty-one 120
interface
SMBxD12 Two optical Ω balanced E1
6  One RS232
0T0 interfaces electrical
interfaces interface/120 Ω
BITS interface
Eight 120 Ω
SMBxF12 Four optical balanced E1  One LCT interface
7
0E0 interfaces electrical  One network
interfaces management
Twenty-one 120 interface
SMBxF12 Four optical Ω balanced E1  One alarm input
8
0T0 interfaces electrical interface
interfaces
 Four fast Ethernet
Twenty-one 100 electrical
SMBxD10 Two optical Ω balanced T1 interfaces
9
0F0 interfaces electrical
interfaces
Eight 100 Ω
SMBxD10 Two optical balanced T1
10
interfaces
Twenty-one 100
SMBxF10 Four optical Ω balanced T1
11
0F0 interfaces electrical
interfaces
Eight 100 Ω
SMBxF10 Four optical balanced T1
12
interfaces

Note: For the main board providing two optical interfaces, each of the
optical interfaces supports traffic at the rate of either STM-1 or STM-4. On the
board panel, they are identified as “5” and “6”.
Table 13 lists the differences between SMB board and SMC board.
T ABLE 13 DIFFERENCES BETWEEN SM B BO ARD AND SMC BOARD
Main Board Type

Function.
SMC SMB
Higher-order cross-connect: Higher-order cross-connect:
Cross-connect 64×64 VC4 32×32 VC4
capacity Lower-order cross-connect: Lower-order cross-connect:
2037×2037 VC12 1008×1008 VC12
Accesses two channels of STM-
Optical Accesses four channels of
1 optical signals and two STM-
interface unit STM-1/STM-4 optical signals
1/STM-4 optical signals
STM-1
Accesses four channels of Does not support STM-1
electrical
STM-1 electrical signals electrical interface
interface unit
Supports SNC-N and SNC-I
Supports SNC-I+SD and SNC-
switching at higher-order
Switching N switching at both higher-
(VC4) path, and SNC-I
mode order (VC4) path and lower-
switching at lower-order
order (VC12) path
(VC12) path
E3/T3 service Does not support EIE3 board Supports EIE3 board which
configuration which accesses E3/T3 service accesses E3/T3 service
EOS service Supports configuration of 12 Supports configuration of 12
configuration TUG3 TUG3
PRBS self-test Does not support PRBS self-test
Supports PRBS self-test function
function function
LCT
management Ethernet interface RS232 interface
interface
SMC Main Board

Operating Principle
Figure 10 illustrates the operating principle of SMC board.

FIGURE 10 OPERATING P RINCIPLE OF SM C BOARD
In Figure 10, SMC board of ZXMP S200 consists of the following functional
units.
 NE control processor (NCP)

 Optical interface unit
 STM-1 electrical unit
 Tributary unit
 Ethernet interface unit
 Cross-connect unit
 Overhead unit
 ECC-2M unit
 HDLC unit
 Clock unit
 Micro control unit (MCU)
NCP Unit
Functions The NCP unit is the control core of the main board, and it can:
 Provide Qx interface, through which the EMS implements the

configuration and management of the NE,
 Provide ECC to implement the communication between the NEs,
 Issue the configuration commands to the optical interface unit,
tributary unit and Ethernet interface unit, meanwhile collect their
performances and alarms information,

 Monitor the power module and fan module intelligently and detect
alarms reported by the fan board and power module, such as board
on-position information, DC power indication, power module type and
power module failure information,
 Support online download and upgrade of board software,
 Provide four external alarm input interfaces (on-off signal inputs),
 Provide alarm output interfaces to column-head cabinet (on-off signal
outputs),
 Provide real-time clock, which can be ensured even the power is down
due to its built-in battery,
 Provide a buzzer and ring trip for audible alarm function.
Operating Figure 11 illustrates the operating principle of the NCP in the block
Principle diagram. And Table 14 lists the modules in the diagram.
FIGURE 11 OPERATING PRINCIPLE OF THE NCP UNIT
Board-in-Position Detection
Real-Time Clock
NE Alarm Output
Control &
Qx/f Interface Processing Board Reset Control
External Alarm Input

ECC/S Interface
Fan/Power Distribution Unit

Monitoring
T ABLE 14 FUNCTIONS OF M ODULES IN THE NCP
Module Function
Used to ensure the accurate time when alarms occur or

disappear during the monitoring of NE.
Real-Time Clock This module will be powered by the spare rechargeable
battery once the power is down, so as to guarantee the
correct timing of the clock.

Module Function
 Qx is the interface between NE and Subnet Management

Control Center (SMCC), through which the main board
can report performances and alarms of the NE or the
subnet to the SMCC. In addition, the main board
Qx/f Interface executes the commands and configurations from the
SMCC.
 f interface is the communication interface between the
NE and a portable computer.
As the monitoring center, this module provides embedded

ECC/S Interface control channel and communication interface between the
NCP and other functional units.
Control & Implements the initialization and startup of board software,

Processing and cooperates with other functional modules.
Board-in-
Detects whether the board is in position, that is, whether
Position
the board is inserted into the slot.
Detection
External Alarm
Monitors external alarms.
Input
NE Alarm Output Outputs the alarms of the NE.
Board Reset
Resets all boards in the NE (hard reset).
Control
Fan/Power
Monitors the fan module and power module of the NE
Distribution Unit
intelligently.
Monitoring
Optical Interface Unit

Functions The optical interface unit has the following functions.
 Provide up to four STM-1/STM-4 compatible optical interfaces.

 The optical interfaces marked as 5 and 6 on the panel can access
the signal at either STM-1 or STM-4 rate.
 The optical interfaces marked as 4-1 and 4-2 on the panel only can
access the signal at the same rate level.
 STM-4 optical interface can access up to 4 channels of STM-4 signal.
 Adopt LC/PC fiber optic connectors and SFP lasers, supporting the
detection of optical received power, optical transmitted power, laser
temperature and transmit laser bias current. In addition, SFP lasers
support the detection of on-position status, LOS (loss of signal) alarm
and ALS (automatic laser shutdown) function.
 Support SOH extraction and insertion functions, and process 28 section
overheads according to the system specifications. Table 15 lists the
overhead bytes processed by the optical interface unit.

T ABLE 15 OVERHE ADS PROCESSED BY OPTIC AL INTERFACE UNIT
Overhead Type Number Overhead Byte
Standard byte 20 J0, D1-D12, E1, E2, F1, K1, K2, S1, M1
User-defined R2C6, R3C6, R3C8, R3C9, R5C5, R5C6,

8
byte R2C8 and R2C9 [Note]
Note: “R” represents the row and “C” represents the column of the STM-1
frame. For example, R2C6 means the byte lies at the 2nd row and the 6th
column in the STM frame.
 Support the transparent transportation of overheads except the byte

M1.
 Support the function of DCC extraction and insertion.
The extraction mode of each DCC can be configured as DCCr (D1-D3),
DCCm (D4-D12), DCCr+m (D1-D12) or disabled according to the EMS
command. The DCC extraction mode of optical receiving interfaces and
optical transmitting interfaces can be configured independently.
 Implement the transfer from DCC to ECC in a hardware way, thus
breaking through CPU resource limitation, avoiding ECC block and
finally improving the stability of ECC in optical transmission network.
 Read signal degrade (SD) and signal failure (SF) alarms via board
software after the alarm led-out by the hardware connection lines,
which ensures protection switching implemented in the specified time.
 Provide clock to the clock unit as the reference clock for phase locking.
 Support channel-level loopback.
Optical interfaces support line side AU loopback and terminal side AU
loopback.
 Support VC-4-4C concatenation of STM-4 optical interfaces.
 Support the insertion and detection of pseudo-random binary sequence
of each AU-4 channel.
Operating Figure 12 illustrates the operating principle of the optical interface unit in
Principle the block diagram. And Table 16 lists the functional modules in the
diagram.

FIGURE 12 OPERATING P RINCIPLE OF THE OPTICAL I NTERF ACE UNIT
SOH（E1, E2, DCC）
Clock
Recovery
Optical SOH POH Data
STM- &
Interfac Processi Processi bus
1/STM-4 Data
e ng ng
Regenerati
on
Clock signal Alarm monitoring

Controlling & Processing
Communication
interface
T ABLE 16 FUNCTIONS OF M ODULES IN THE OPTICAL I NTERF ACE UNIT
Module Function
 It converts STM-1/STM-4 optical signals to the

corresponding electrical signals, and checks the input
optical signals.
 The key component of it is an integrated optical
Optical receiving/transmitting module with general auto gain
Interface control function.
 Three types of STM-1 optical modules are available: S-
1.1, L-1.1 and L-1.2.
 Three types of STM-4 optical modules are available: S-
4.1, L-4.1 and L-4.2.
Clock Recovery
& It extracts the line clock from the received data stream, and
Data regenerates the received data according to this clock.
Regeneration
 At the receiving end, it locks the frame alignment byte
in the received data to achieve frame synchronization,
and then extracts the section overheads after
SOH Processing unscrambling the data.
 At the transmitting end, it inserts section overheads into
the launched data which will be framed after scrambled.
 At the receiving end, it processes the AU-4 pointer,
separates the path overheads and payloads.
POH Processing
 At the transmitting end, it justifies the AU-4 pointer and
inserts path overheads into the payloads.
It monitors the working status and mode of the optical

Controlling & interface unit, and performs part functions of overhead
Processing processing. In addition, it implements switching and statistic
of performance.

Module Function
Communication It implements the communication between the optical

Interface interface unit and the NCP.
It outputs the alarm/status signals of the optical interface

Alarm Detecting unit, detects and responds to alarms/status of other units,
and provides reasons for switching control.
STM-1 Electrical Unit

Functions The STM-1 electrical unit has the following functions:
 Provide 4 channels STM-1 electrical interfaces, adopting SFP

transmitting/receiving module and supporting alarm detection.
 Support SOH extraction and insertion functions, and process 28 section
overheads according to the system specifications. Table 17 lists the
overhead bytes processed by the STM-1 electrical interface unit.
T ABLE 17 OVERHE ADS PROCESSED BY S TM -1 ELECTRICAL I NTERF ACE UNIT

8
Note: “R” represents the row and “C” represents the column of the STM-1
frame. For example, R2C6 means the byte lies at the 2nd row and the 6th
column in the STM frame.
 Support the transparent transportation of overheads except the byte

M1.
 Support the function of DCC extraction and insertion.
The extraction mode of each DCC can be configured as DCCr (D1-D3),
DCCm (D4-D12), DCCr+m (D1-D12) or disabled according to the EMS
command. The DCC extraction mode of electrical transmitting and
receiving interfaces can be configured independently.
 Implement the transfer from DCC to ECC in a hardware way, thus
 Read signal degrade (SD) and signal failure (SF) alarms via board
software after the alarm led-out by the hardware connection lines,
which ensures protection switching implemented in the specified time.
 Provide clock to the clock unit as the reference clock for phase locking.
 Support channel-level loopback.
Electrical interfaces support line side AU loopback and terminal side AU
loopback.

 Support the insertion and detection of pseudo-random binary sequence

of each AU-4 channel.
Operating Figure 13 illustrates the operating principle of the STM-1 electrical

Principle interface unit in the block diagram. And Table 18 lists the functional
modules in the diagram.
FIGURE 13 OPERATING P RINCIPLE OF THE S TM -1 ELECTRICAL INTERF ACE UNIT
SOH
Clock
Recovery
STM-1 STM-1 SOH POH
&
Electrical Electrical Processin Processin Data bus
Data
Service Interface g g
Regeneratio
n

Communication
interface
T ABLE 18 FUNCTIONS OF M ODULES IN THE ELECTRICAL INTERF ACE UNIT
Module Function
It achieves the receiving and transmitting of STM-1 electrical signal.

STM-1 Electrical
Interface Its main component is common electrical transmitting and receiving
module.
Clock Recovery
& It extracts the line clock from the received data stream, and
Regeneration
 At the receiving end, it locks the frame alignment byte
in the received data to achieve frame synchronization,
and then extracts the section overheads after
SOH Processing unscrambling the data.
 At the transmitting end, it inserts section overheads into
the launched data which will be framed after scrambled.
separates the path overheads and payloads.
POH Processing
 At the transmitting end, it justifies the AU-4 pointer and
inserts path overheads into the payloads.
It monitors the working status and mode of the STM-1

Controlling & electrical interface unit, and performs part functions of
Processing overhead processing. In addition, it implements switching
and statistic of performance.

Module Function
Communication It implements the communication between the optical

Interface interface unit and the NCP.
It outputs the alarm/status signals of the optical interface

Alarm Detecting unit, detects and responds to alarms/status of other units,
and provides reasons for switching control.
Tributary Unit
Functions The E1/T1 tributary unit has the following functions.
 Implement the mapping or demapping of E1/T1 signals.
 Add/drop the dependent timeslots according to the different timeslot
No..
 Analyze the performance and alarm of E1/T1 signals and report them
to the EMS.
 Support up to 21 channels of E1 or T1 interfaces.
 Support both non-balanced and balanced E1 interfaces and only
balanced T1 interfaces.
 Support framing of E1/T1 signals.
 Support the retiming function at the E1 tributaries.
 Transmit the DCC bytes transparently through the first three timeslots
of the 5th to 8th E1 tributaries.
 Extract the timing clock from the clock recovered from the 1st and 2nd
E1 tributaries and send it to the clock unit.
 Detect the pseudo-random binary sequence at all E1/T1 tributaries.
Operating Figure 14 illustrates the operating principle of the tributary unit. And Table
Principle 19 lists the functional modules.
FIGURE 14 OPERATING P RINCIPLE OF TRIBUTARY UNIT
DCC
DCC
Infromation DCC
Detection
Tributary Insertion/ information
&
E1/T1 Interface Extraction
Timing
Module
Clock Mapping/ Cross-
Extraction Demapping Connect Unit
Clock Unit

T ABLE 19 FUNCTIONS OF M ODULES IN TRIBUTARY UNIT
Module Function
It codes/decodes line signals.

 In the receiving direction, this module converts the line
Tributary signals into monopole signals and recovers the tributary
Interface clock. After retiming the signals according to the recovered
Module clock, it forwards the line signals.
 In the transmitting direction, this module converts monopole
signals into the line signals.
 In the receiving direction, it detects whether there is DCC

information in the 5th-8th decoded tributary signals. If yes,
DCC send them to the DCC Information Insertion/Extraction
Detection & module, if no, send them to the Mapping/Demapping module.
Timing  In the transmitting direction, it sends the DCC information
Clock from the DCC Information Insertion/Extraction module and
Extraction tributary signals from the Mapping/Demapping module to the
Tributary Interface Unit.
In addition, this module extracts the timing reference clock.
DCC
Information It extracts DCC information from the 5th-8th tributary signals or
Insertion/Ex inserts DCC information into them.
traction
 Maps tributary services to the corresponding timeslots of AU,

or gets tributary services by demapping the corresponding
Mapping/De AU.
mapping
 Reads and inserts the higher-order and lower-order path
overheads.
Ethernet Interface Unit

Functions The Ethernet interface unit has the following functions.
 Process up to 8 channels of Fast Ethernet (FE) services. The main

board provides four FE interfaces while the TFEx4/TFEx4B board offers
the other four FE interfaces.
These interfaces are adaptive 10/100 Mbit/s Ethernet electrical
interfaces, complying with IEEE802.3. They support 10 M/100 M full
duplex mode as well as auto-negotiation and forced working status.
 Access and process other FE data services via other plug-in cards.
 Support Ethernet flow control and 802.3x flow control frame processing.
 Support GFP or PPP/HDLC encapsulation.
 Support Jumbo frame with 9600 bytes.

 Support VLAN processing. It is optional for user port to add a VLAN tag
into a frame head under the Transparent LAN Service (TLS) access
mode.
 Provide 8 system side directions and support service convergence
based on port.
The system side bandwidth is 12 × VC3. Bandwidth in each system
direction can be concatenated virtually based on 2 M bandwidth at
least. The compensation time for virtual concatenation is up to 64 ms.
The system supports VC4, VC3 and VC12 virtual concatenation. Table
20 lists the supported virtual concatenation groups of different
concatenation modes.
T ABLE 20 DESCRIPTIONS OF VIRTUAL CONCATENATION GROUP
Virtual Number/Type
Group Maximum Number of
Concatenation of Members in
Number Group Supported
Group Mode Each Group
VC4 group 4 1/VC4 4/VC4
VC3 group 8 1-3/VC3 12/VC3
VC12 group 8 1-63/VC12 252/VC12
 Support the function of scatheless Link Capacity Adjustment Scheme

(LCAS).
 Support the Ethernet Private Line (EPL) function for FE services.
 Support alarm and performance query for user ports and virtual
concatenation groups.
 Provide loopback test for engineering applications
Operating Figure 15 illustrates the operating principle of the Ethernet interface unit.
Principle Table 21 lists the functional modules.
FIGURE 15 OPERATING P RINCIPLE OF THE E THERNET I NTERFACE UNIT
Overhead/
Backplane clock bus Cross-Connect
Interface Unit
Module
Ethernet
data packet Interface Ethernet Control Cross-Connect
Mapping Module Unit
Module Module
LCAS Processing
NCP Control Module
Module

T ABLE 21 FUNCTIONS OF M ODULES IN THE E THERNET I NTERFACE UNIT
Module Function
Interface Module Inputs/outputs Ethernet data packets.
Processes the MAC layer of Ethernet.

 At the receiving side, it implements the extraction,
verification, flow control detection and serial-parallel
conversion for data frames, and then sends the
Ethernet Control
processed data to the Mapping Module.
Module
 At the transmitting side, it generates the preamble
code, implements the verification, flow control and
parallel-serial conversion, and then sends the
processed data to the Ethernet optical module.
 Implements the translation between Ethernet frames

and SDH frames and processes path overheads,
including PPP/GFP-F encapsulation/de-encapsulation,
Mapping Module virtual concatenation mapping /demapping and LCAS
processing.
 Transfers the payloads in SDH frames to service bus
and then sends them to the Cross-Connect Unit.
When the LCAS is effective, the channel will be discarded

automatically in case that the channel in the virtual
concatenation group is detected damaged. Then the
LCAS Processing bandwidth decreases automatically, thus guaranteeing the
Module other traffic in the virtual concatenation.
When the channel recovers, it will return to the virtual
concatenation group.
Receives the clock selected from the overhead bus and

Backplane
clock bus of the Cross-Connect Unit in the main board, and
Interface Unit
then sends it to the Mapping Module.
 Provides channels for the communication between the

unit and the NCP of main board.
Control Unit
 Implements performance statistic, alarm detection, and
the communication among modules.
Cross-Connect Unit
Functions The cross-connect unit has the following functions.
 Implement cross-connection and protection switching for line signals

and tributary signals.
 Support space division cross-connect capacity up to 64×64 VC-4 and
time division cross-connect capacity up to 2037×2037 VC-12.
 Support overhead cross-connection.
 In the EMS, up to 20 overhead bytes of each optical interface can be
configured as full byte-based cross-connection.

 Support the broadcast, uni-direction and bi-direction working modes

through configuration in the EMS.
Operating The line signals from the optical interface unit and tributary signals from
Principle the tributary unit are input to the cross-connect unit, where they are
cross-connected. The cross-connect unit implements corresponding cross-
connect and allocation of timeslots according to service configuration
requirements.
Overhead Unit
Functions The overhead unit has the following functions.
 Extract and combine serial overheads from different directions, and

control the cross-connection, read/write of them.
 Provide user with a transparent channel by using one of the seven
bytes (including F1 byte) in the section overheads.
 Provide an RS232 interface (RJ45 socket) on the front panel of main
board.
Operating The overheads extracted from STM-1/STM-4 optical interfaces are
Principle converted to a standard highway (HW) and then sent to the overhead unit.
At the same time, send the HWs from interfaces on boards in extended
slots to the overhead unit too. Finally cross-connect all the overheads in
the overhead unit.
The overhead unit also processes F1 byte in section overheads or

configures the other six idle overhead bytes, converts them into RS232
data and then sends the data to the corresponding interface circuit.
ECC-2M Unit
Functions The ECC-2M unit implements the transmission of SDH management
information through the 5th-8th 2 M channels. Thus the network
management information can pass through equipment developed by other
manufacturers.
Operating In the direction from 2 M to ECC, the unit extracts DCC bytes in the 1 st-3rd
Principle timeslots of the 2 M signal, implements framing and then forwards them to
the HDLC bus.
In the direction from ECC to 2 M, the unit extracts ECC information from
the HDLC bus, unframes it and converts it to DCC bytes. Then it inserts
the DCC bytes into the 1st-3rd timeslots of the 2 M signal.
HDLC Unit
Functions The HDLC unit transmits ECC information received from multiple directions.
Operating This unit combines ECC information from multiple directions to the HDLC
Principle bus or extracts ECC information from the HDLC bus. Then the HDLC unit
forwards the ECC information directly through hardware.

Clock Unit
Functions The clock unit provides the clock signal and system frame header
(complying with ITU-T G.813) for SDH NEs. It can implement the network
synchronization by limiting the frequency and phase of every NE in the
network within the predefined tolerance. In this way, the correct and
effective transmission and exchange of data flow in the network is
achieved by avoiding slip errors caused by unsynchronized clock.
ZXMP S200 adopts the master-slave synchronization mode. The available

clocks include line clock, tributary clock and external reference clock,
which can be selected and switched according to alarms of clock source
and the synchronization status message (SSM). The clock unit supports
extracted line clock in all optical directions and the tributary clock
extracted from the first or the second E1 tributary.
In addition, the clock unit provides BITS interfaces to implement an

external clock output (2.048 Mbit/s or 2.048 MHz) and an external clock
input (2.048 Mbit/s or 2.048 MHz). Get the 2.048 Mbit/s clock by installing
2 Mbit/s BITS interface board on the main board, and 2.048 MHz clock by
installing 2 MHz BITS interface board on the main board.
Two types of BITS interface are provided, 75 Ω (coaxial socket) and 120 Ω
(RJ45 socket). The impedance 75 Ω or 120 Ω of a BITS interface can be
set through jumpers on the main board.
System clock or line clock can be exported from the clock unit.
Operating Figure 16 illustrates the operating principle of the clock unit.

Principle
FIGURE 16 OPERATING PRINCIPLE OF THE CLOCK UNIT
Line/
tributary Timing
Timing reference
clock Reference
Selection Digital Controlling
VCXO Drive
Discriminator &
Output
Processing
External
reference
clock External Clock Frequency
Interface Unit Division
The clock unit selects the timing reference for the NE from the line clock,
tributary clock and external reference clock according to alarm information
of clock source and synchronization information. It implements the
synchronization of the local clock and clock source selected through the
phase locked loop, which consists of the digital discriminator and Voltage
Controlled Oscillator (VCXO). In addition, it distributes the timing
reference to other units.
The clock unit has four working mode during the synchronization and
phase locking described as follows.

 Fast pull-in mode

The fast pull-in is the process from selecting the reference clock to
locking the reference clock source.
 Tracking mode
After locking the reference clock source, the clock unit works in the
tracking mode. In this mode, the clock unit tracks small variance of the
reference clock source and keeps synchronization with it.
 Hold-on mode
When all timing references are lost, the clock unit will work in the hold-
on mode. The last frequency saved before losing the timing reference
will be held on as the timing reference. The hold-on mode will last 24
hours at most.
 Free-run mode
If the equipment loses all external timing references, it will work in the
hold-on mode for a certain time period. When it is up to the hold-on
time limitation and the timing reference does not recover yet, the
oscillator inside the clock unit will work in free-run mode, providing
timing reference for the system.
Micro Control Unit

Functions The micro control unit implements the initialization and configuration of
main service chips on the main board and monitors their alarms and
performances.
Operating Figure 17 illustrates the operating principle of the micro control unit. And
Principle Table 22 lists the functional modules.
FIGURE 17 OPERATING PRINCIPLE OF THE MICRO CONTROL UNIT
Channel Alarm &

Performance Detection
Controlling Alarm & Perforamnce
& Report
Processing
Service Chip Control
T ABLE 22 FUNCTIONS OF M ODULES IN THE M ICRO CONTROL UNIT
Module Function
Channel Alarm & Monitors alarm and performance of each channel and
Performance Detection implements protection switching if necessary
Initializes and configures chips for PDH, SDH and

Ethernet services

Module Function
Controlling & Controls other modules and allows the interactive

Processing processing among these modules
Alarm & Performance Receives commands from the NCP and reports alarms
Report and performances
SMB Main Board

Operating Principle
Figure 18 illustrates the operating principle of the main board.
FIGURE 18 OPERATING P RINCIPLE OF SM B BOARD
STM-1/ E1/T1
STM-4 Optical Cross-Connect Tributary Unit
E3/T3
Interface Unit Unit
Clock Unit Ethernet

Interface Unit Ethernet
ECC-2M
Overhead
Unit and
Unit
HDLC Unit
Clock, service,
communication
information
Micro Control Unit NCP
As shown in Figure 18, SMB board of ZXMP S200 consists of the following
functional units.
 NE control processor (NCP)
 Optical interface unit
 Tributary unit
 Ethernet interface unit
 Cross-connect unit
 Overhead unit
 ECC-2M unit
 HDLC unit
 Clock unit

 Micro control unit (MCU)
NCP Unit
Functions NCP unit is the control core of the main board, which provides the
following functions.
 Provides Qx interface, through which the EMS implements the

configuration and management of the NE
 Provides ECC to implement the communication between the NE and the
EMS
 Issues configuration commands to the optical interface unit, tributary
unit and Ethernet interface unit, and collects their performances and
alarms
 Monitors the power module and fan module intelligently and detects
alarms reported by the fan board and power board, such as board on-
position information, DC power indication, power board type and power
board failure information
 Supports online download and upgrade of board software
 Provides four external alarm input interfaces (on-off signal inputs)
 Provides alarm output interfaces to column-head cabinet (on-off signal
outputs)
 Provides real-time clock, which can be ensured even the power is down
due to its built-in battery
 Provides a buzzer and ring trip for audible alarm function
Operating Figure 19 illustrates the operating principle of the NCP in the block
Principle diagram. And the modules in the diagram are described in Table 23.
FIGURE 19 OPERATING PRINCIPLE OF NCP UNIT
Board-in-Position
Detection
Real-Time Clock
NE Alarm Output
Controlling &
Qx/f Interface Processing Board Reset Control
External Alarm Input

ECC/S Interface
Fan/Power Distribution
Unit Monitoring

T ABLE 23 FUNCTIONS OF M ODULES IN NCP UNIT
Module Function
Used to ensure the accurate time when alarms occur or

disappear during the monitoring of NE.
Real-Time
Clock This module will be powered by the spare rechargeable
battery once power down is detected, so as to guarantee the
correct timing of the clock.
Qx is the interface between NE and SMCC (Subnet

Management Control Center), through which the main board
can report performances and alarms of the NE or the subnet
Qx/f Interface to the SMCC. In addition, the main board executes the
commands and configurations received from the SMCC.
f interface is the communication interface between the NE and
a portable computer.
As the monitoring center, this module provides embedded

ECC/S
control channel and communication interface between the NCP
Interface
and other functional units.
Controlling & Implements the initialization and startup of board software,

Processing and cooperates with other functional modules
Board-in-
Detects whether the board is in position, that is, whether the
Position
board is inserted into the slot.
Detection
External Alarm
Monitors external alarms
Input
NE Alarm
Outputs the alarms of the NE
Output
Board Reset
Resets all boards in the NE (hard reset)
Control
Fan/Power
Distribution Monitors the fan module and power module of the NE
Unit intelligently
Monitoring
Optical Interface Unit

Functions The optical interface unit has the following functions:

 The optical interface unit provides up to four STM-1/STM-4 optical

interfaces. However, two STM-4 optical interfaces are available at the
same time at most. The following lists the available combination of
optical interfaces:
 Four STM-1 optical interfaces
 Two STM-1 optical interfaces and two STM-4 optical interfaces
 Three STM-1 optical interfaces and one STM-4 optical interface
 It adopts LC/PC fiber optic connectors and SFP lasers, supporting the
detection of optical received power, optical launched power, laser
temperature and transmit laser bias current. In addition, SFP lasers
support the detection of in-position status, LOS (loss of signal) alarm
and ALS (automatic laser shutdown) function.
 Supports SOH extraction and insertion functions, and processes 28
section overheads according to the system specifications. Table 24 lists
the overhead bytes processed by the optical interface unit.
T ABLE 24 OVERHE ADS PROCESSED BY OPTIC AL INTERFACE UNIT

8
Note: “R” refers to the row and “C” refers to the column of the STM-1 frame
 Supports the transparent transfer of overheads except the byte M1.

 Supports the function of DCC extraction and insertion
 The extraction mode of each DCC can be configured as DCCr (D1-D3),
DCCm (D4-D12), DCCr+m (D1-D12) or Disabled according to the EMS
command. The DCC extraction mode of optical receive interfaces and
optical transmit interfaces can be configured independently.
 Implements the transfer from DCC to ECC in a hardware way, thus
 Board software reads signal degrade (SD) and signal failure (SF)
alarms through hardware connection, which ensures protection
switching implemented in specified time.
 Provides clock to the clock unit as the reference clock for phase locking
 Supports port-level and channel-level loopback
 Optical interfaces identified with “4-1” and “4-2” on the panel support
line side AU loopback, terminal side port loopback and AU loopback.
 Optical interfaces identified with “5” and “6” supports line side port
loopback, line side AU loopback and terminal side port terminal.
 STM-4 optical interfaces support VC-4-4C concatenation.

 Each AU-4 channel supports the insertion and detection of pseudo-

random binary sequence.
Operating Figure 20 illustrates the operating principle of the optical interface unit in
Principle the block diagram. And the functional modules in the diagram are
described in Table 25.
FIGURE 20 OPERATING P RINCIPLE OF THE OPTICAL I NTERF ACE UNIT
SOH( E1, E2, DCC)
Clock
Recovery
Optical SOH POH Data bus
STM-1/STM-4 &
Interface Processing Processing
Data
Regeneration

Communication interface
T ABLE 25 FUNCTIONS OF M ODULES IN THE OPTICAL I NTERF ACE UNIT
Module Function
It converts STM-1/STM-4 optical signals to corresponding

electrical signals, and checks the input optical signals.
Integrated optical receive/transmit modules with general auto
Optical gain control function are adopted as the key component.
Interface  Three types of STM-1 optical modules are available: S-1.1,
L-1.1 and L-1.2.
 Three types of STM-4 optical modules are available: S-4.1,
L-4.1 and L-4.2.
Clock Recovery
& It recovers the line clock from the received data stream, and
Regeneration
 At the receiving end, it locks the frame alignment byte in

the received data to achieve frame synchronization, and
SOH then extract the section overheads after unscrambling the
Processing data.
 At the transmitting end, it inserts section overheads into the
launched data which will be framed after scrambled.

Module Function

separating the path overheads and payloads.
POH Processing
 At the transmitting end, it justifies the AU-4 pointer
and inserts path overheads into the payloads.
It monitors the working status and mode of the optical

Controlling & interface unit, and performs part functions of overhead
Processing processing. In addition, it implements switching and statistic
of performance.
Communication It is used to implement the communication between the

Interface optical interface unit and the NCP.
It outputs alarm/status signals of the optical interface unit,

Alarm
detects and responds to alarms/status of other units, and
Detecting
provides reasons for switching control.
Tributary Unit
ZXMP S200 provides two kinds of tributary unit for accessing different
tributary services: E1/T1 tributary unit and E3/T3 tributary unit.
The following describes the functions and operating principle of E1/T1
tributary unit and E3/T3 tributary unit.
E1/T1 The E1/T1 tributary unit has the following functions:
Tributary Unit
 Implements the mapping or demapping of E1/T1 signals.
 Supports the adding/dropping of timeslots with different serial
numbers, and independent adding/dropping of timeslots
 Analyzes the performance and alarms of E1/T1 signals and reports
them to the EMS
 Supports for up to 21 channels of E1 or T1 interfaces. Supports both
non-balanced and balanced E1 interfaces and only balanced T1
interfaces
 Supports framing of E1/T1 signals
 E1 tributaries support the retiming function
 Supports transmitting DCC bytes transparently through the first three
timeslots of the 5th to 8th E1 tributaries
 Supports extracting timing clock from the received clock recovered
from the first and second E1 tributaries and sending it to the clock unit
 All E1/T1 tributaries support the detection of pseudo-random binary
sequence
Figure 21 illustrates the operating principle of the E1/T1 tributary unit.
And the functional modules are described in Table 26.

FIGURE 21 OPERATING P RINCIPLE OF E 1/T1 TRIBUTARY UNIT
DCC
Infromation
DCC
DCC Detection Insertion/
Tributary information
& Extraction
E1/T1 Interface
Timing Clock
Module
Extraction
Mapping/ Cross-Connect
Demapping Unit
Clock Unit
T ABLE 26 FUNCTIONS OF M ODULES IN E 1/T1 TRIBUTARY UNIT
Module Function
It codes/decodes line signals.

 In the receiving direction, this module converts line
Tributary signals into monopole signals and recovers tributary
Interface clock. After retiming the signals according to the
Module recovered clock, it forwards the line signals.
 In the transmitting direction, this module converts
monopole signals into line signals.
 In the receiving direction, it detects whether there is

DCC information in the 5-8 decoded tributary
signals. If DCC information is included, send them to
the DCC Information Insertion/Extraction module; if
DCC no DCC information, send them to the
Detection & Mapping/Demapping module.
Timing Clock  In the transmitting direction, it sends the DCC
Extraction information from the DCC Information
Insertion/Extraction module and tributary signals
from the Mapping/Demapping module to the
Tributary Interface Unit.
In addition, this module extracts the timing reference clock.
DCC
Information Extracts DCC information from the 5-8 tributary signals or
Insertion/Ext inserts DCC information into them.
raction
 Maps tributary services to corresponding timeslots of

AU, or gets tributary services by demapping the
Mapping/De corresponding AU.
mapping
 Reads and inserts higher-order and lower-order path
overheads.

E3/T3 The E3/T3 tributary unit has the following functions:

Tributary Unit
 Implements the mapping/demapping of E3/T3 signals. Each board
provides three E3/T3 interfaces, which support HDB3 and B3ZS
coding/decoding.
 The mapping path can be set as AU4 or AU3 in the EMS. The unit
supports the mapping and demapping between three E3/T3 signals and
any timeslots of AU-4/AU-3.
 The added and dropped timeslots can be independent and different.
 The E3/T3 tributary unit can process lower-order overheads and
pointers, and report corresponding alarms and performance to the EMS.
Figure 22 illustrates the operating principle of the E3/T3 tributary unit.
And the functional modules are described in Table 27.
FIGURE 22 OPERATING P RINCIPLE OF E 3/T3 TRIBUTARY UNIT
E3/T3 tributary Service

Cross-Connect
interface board Interface Module Processing
Unit
(EIE3) Module
Clock System Clock

Module
Reference Clock
Control
NCP
Module
T ABLE 27 FUNCTIONS OF M ODULES IN E 3/T3 TRIBUTARY UNIT
Module Function
Distributes the system clock to the main board and

Clock Module
provides clocks needed by the board.
Implements the code pattern conversion, jitter attenuation

Interface Module and coding between tributary analog signals and digital
signals.
Implements the mapping/demapping of timeslots,

Service Processing
tributary path protection, and the processing of pointers
Module
and path overheads.
Provides channels for the communication between the unit

and the NCP of the main board, and implements the
Control Module
performance statistic, alarm detection, and the
communication among modules.

Ethernet Interface Unit

Functions The Ethernet interface unit has the following functions:
 Processes up to eight channels of Fast Ethernet (FE) services. The

main board provides four FE interfaces while the TFEx4/TFEx4B board
offers the other four FE interfaces.
These interfaces are adaptive 10/100 Mbit/s Ethernet electrical
interfaces, complying with IEEE802.3. They support 10 M/100 M full
duplex mode as well as auto-negotiation and forced working status.
 Accesses and processes other FE data services via other plug-in cards
 Supports Ethernet flow control and 802.3x flow control frame
processing
 Supports GFP or PPP/HDLC encapsulation
 Supports Jumbo frame with 9600 bytes
 Supports VLAN processing. It is optional for user port to add a VLAN
label into a frame head under the transparent LAN service (TLS) access
mode.
 Provides eight system side directions and supports service convergence
based on port.
The system side bandwidth is 10 × VC-3. Bandwidth in each system
direction can be cascaded virtually based on 2 M bandwidth at least.
The compensation time for virtual concatenation is up to 64 ms.
The system supports VC-4, VC-3 and VC-12 virtual concatenation.
Table 28 describes the supported virtual concatenation groups of
different cascade modes.
T ABLE 28 DESCRIPTION OF VIRTUAL CONCATEN ATION GROUP
Virtual Number/Type of Maximum

Group
Concatenation Members in Each Number of Group
Number
Group Mode Group Supported
VC-4 group 2 1/VC-4 2
VC-3 group 8 1-3/VC-3 10
VC-12 group 8 1-63/VC-12 210
 Supports the function of scratchless Link Capacity Adjustment Scheme

(LCAS)
 Supports Ethernet private line (EPL) function for FE services
 Supports alarm and performance query for user ports and virtual
concatenation groups
 Provides loopback test for engineering applications
Operating Figure 23 illustrates the operating principle of the Ethernet interface unit.
Principle The functional modules are described in Table 29.

FIGURE 23 OPERATING P RINCIPLE OF THE E THERNET I NTERFACE UNIT
Overhead/
Motherboard clock bus Cross-Connect
Interface Unit
Module
Ethernet
data packet Interface Ethernet Control Cross-Connect
Mapping Module Unit
Module Module
LCAS Processing
NCP Control Module
Module
T ABLE 29 FUNCTIONS OF M ODULES IN THE E THERNET I NTERFACE UNIT
Module Function
Interface Module Inputs/outputs Ethernet data packets
Processes the MAC layer of Ethernet

 At the receiving side, it implements the extraction,
verification, flow control detection and serial-parallel
conversion for data frames, and then sends the
Ethernet Control
processed data to the Mapping Module.
Module
 At the transmitting side, it generates the preamble
code, implements the verification, flow control and
parallel-serial conversion, and then sends the processed
data to the Ethernet optical module.
 Implements the translation between Ethernet frames

and SDH frames and processes path overheads,
including PPP/GFP-F encapsulation/de-encapsulation,
Mapping Module virtual concatenation mapping /demapping and LCAS
processing.
 Transfers the payloads in SDH frames to service bus and
then sends them to the Cross-Connect Unit.
When the LCAS is effective, the channel will be discarded

automatically in case that the channel in the virtual
concatenation group is detected damaged. Then the
LCAS Processing bandwidth decreases automatically, thus guaranteeing the
Module other traffic in the virtual concatenation.
When the channel recovers, it will return to the virtual
concatenation group.

Module Function
Receives the clock selected from the overhead bus and clock
Backplane
bus of the Cross-Connect Unit in the main board, and then
Interface Unit
sends it to the Mapping Module.

Control Unit
 Implements performance statistic, alarm detection, and
the communication among modules.
Cross-Connect Unit
Functions The cross-connect unit has the following functions:
 Implements cross-connection and protection switching for line signals

and tributary signals
 Supports space division cross-connect capacity up to 16×16 VC-4 and
time division cross-connect capacity up to 1008×1008 VC-12
 Supports overhead cross-connection
 In the EMS, up to 20 overhead bytes of each optical interface can be
configured as full byte-based cross-connection
 Supports the broadcast, uni-direction and bi-direction working modes
through configuration in the EMS
Operating The operating principle of the cross-connect unit is described below:
Principle
Line signals from the optical interface unit and tributary signals from the
tributary unit are input to the cross-connect unit, where they are cross-
connected. The cross-connect unit implements corresponding cross-
connection and allocation of timeslots according to service configuration
requirements.
Overhead Unit
Functions The overhead unit has the following functions:
 Extracts and combines serial overheads from different directions, and

controls the cross-connection, read/write of them
 Provides user with a transparent channel by using one of the seven
bytes (including F1 byte) in the section overheads
 Provides an RS232 interface (RJ45 socket) on the front panel of main
board
Operating The operating principle of the overhead unit is described below:
Principle
Overheads extracted from STM-1/STM-4 interfaces are converted to a
standard highway (HW) and then sent to the overhead unit. At the same

time, the HWs from interfaces on boards in extended slots are sent to the
overhead unit too. The overhead unit cross-connects all the overheads.
The overhead unit also processes F1 byte in section overheads or

configures the other six idle overhead bytes, converts them into RS232
data and then sends the data to corresponding interface circuit.
ECC-2M Unit
Functions The ECC-2M unit implements the transmission of SDH management
information through the 5th-8th 2 M channels. Thus the network
management information can pass through equipment developed by other
manufacturers.
Operating In the direction from 2 M to ECC, the unit extracts DCC bytes in the 1st-
Principle 3rd timeslots of the 2 M signal, implements framing and then forwards
them to the HDLC bus.
In the direction from ECC to 2 M, the unit extracts ECC information from
the HDLC bus, unframes it and converts it to DCC bytes. Then it inserts
the DCC bytes into the 1st-3rd timeslots of the 2 M signal.
HDLC Unit
Functions The HDLC unit transmits ECC information received from multiple directions.
Operating This unit combines ECC information from multiple directions to the HDLC
Principle bus or extracts ECC information from the HDLC bus. Then the HDLC unit
forwards the ECC information directly through hardware.
Clock Unit
Functions The clock unit provides the clock signal and system frame header
(complying with ITU-T G.813) for SDH NEs. It is used to implement the
network synchronization by limiting the frequency and phase of every NE
in the network within the predefined tolerance. In this way, the correct
and effective transmission and exchange of data flow in the network is
achieved by avoiding slip errors caused by unsynchronized clock.
The ZXMP S200 adopts the master-slave synchronization mode. The

available clocks include line clock, tributary clock and external reference
clock, which can be selected and switched according to alarms of clock
source and the synchronization status message (SSM). The clock unit
supports extracted line clock in all optical directions and the tributary clock
extracted from the first or the second E1 tributary.
In addition, the clock unit provides BITS interfaces to implement an

external clock output (2.048 Mbit/s or 2.048 MHz) and an external clock
input (2.048 Mbit/s or 2.048 MHz). Two types of BITS interface are
provided, 75 Ω (coaxial socket) and 120 Ω (RJ45 socket). The impedance
75 Ω or 120 Ω of a BITS interface can be set through jumpers on the main
board.
System clock or line clock can be exported from the clock unit.

Operating Figure 24 illustrates the operating principle of the clock unit.

Principle
FIGURE 24 OPERATING PRINCIPLE OF THE CLOCK UNIT
Line/
tributary Timing
Timing reference
clock Reference
Selection Digital Controlling
VCXO Drive
Discriminator &
Output
Processing
External
reference
clock External Clock Frequency
Interface Unit Division
The clock unit selects the timing reference for the NE from the line clock,
tributary clock and external reference clock according to alarm information
of clock source and synchronization information. It implements the
synchronization of the local clock and clock source selected through the
phase locked loop, which consists of the digital discriminator and Voltage
Controlled Oscillator (VCXO). In addition, it distributes the timing
reference to other units.
The clock unit has four working mode during the synchronization and
phase locking described as follows.
 Fast pull-in mode

The fast pull-in is the process from selecting the reference clock to
locking the reference clock source.
 Tracking mode
After locking the reference clock source, the clock unit works in the
tracking mode. In this mode, the clock unit tracks small variance of the
reference clock source and keeps synchronization with it.
 Hold-on mode
When all timing references are lost, the clock unit will work in the hold-
on mode. The last frequency saved before losing the timing reference
will be held on as the timing reference. The hold-on mode will last 24
hours at most.
 Free-run mode
If the equipment loses all external timing references, it will work in the
hold-on mode for a certain time period. When it is up to the hold-on
time limitation and the timing reference does not recover yet, the
oscillator inside the clock unit will work in free-run mode, providing
timing reference for the system.

Micro Control Unit

Functions The micro control unit implements the initialization and configuration of
main service chips on the main board and monitors their alarms and
performances.
Operating Figure 25 illustrates the operating principle of the micro control unit. And
Principle the functional modules are described in Table 30.
FIGURE 25 OPERATING PRINCIPLE OF THE MICRO CONTROL UNIT
Channel Alarm &

Performance Detection
Controlling Alarm & Perforamnce
& Report
Processing
T ABLE 30 FUNCTIONS OF M ODULES IN THE M ICRO CONTROL UNIT
Module Function
Channel Alarm & Monitors alarm and performance of each channel

Performance Detection and implements protection switching if necessary
Initializes and configures chips for PDH, SDH and

Ethernet services
Controls other modules and allows the interactive

processing among these modules
Alarm & Performance Receives commands from the NCP and reports
Report alarms and performances
Front Panel
Types and quantities of interfaces vary with different main boards.
Figure 26 illustrates the front panel of the main board with four optical
interfaces and twenty-one 75 Ω E1 interfaces (SMCxF75T).
F I G U R E 2 6 F R O N T P AN E L O F T H E M AI N BO AR D (S M CX F 75 T)

Table 31 describes the components on front panel.
T ABLE 31 COMPONENTS ON THE FRONT P ANEL OF M AIN BOARD
No. Component ID Descriptions

Captive
1 - Used to secure the main board in the chassis.
fastener
Used to help pull in/out the main board and fix
2 Ejector lever -
it in the chassis.
When some alarm occurs, the buzzer begins
ringing, and the alarm indicator glows in
corresponding color.
 Press this button less than 2 second to stop
ringing. If a new alarm occurs, the buzzer
will ring again.
 Press this button more than 2 seconds, the
alarm buzzer will never ring even a new
Ring trip alarm occurs. However, the alarm indicator
3 B.OFF
button will become to flicker 10 seconds per
minute when a new alarm occurs.
 Press this button again, the permanent ring
trip status will be cancelled and then the
buzzer will ring if the alarm has not been
cleared yet.
 During the reset of the main board, press
this button more than 40 seconds to enter
the Download status.
SMB: Press this button to reset the NCP unit of
4 Reset button N.RST the main board.
SMC: Press this button to reset the main board.
Green indicator
NCP running
5 RUN Flickering regularly (once per second) means
indicator
that the NCP unit runs normally.
Bi-color indicator (red-yellow)
 OFF if the board runs normally,
NCP alarm
6 MAJ/MIN  ON if the critical alarm occurs,
indicator
 Only yellow indicator ON if the major or
minor alarm occurs.
Four optical interfaces with LC/PC connectors
on the front panel, marked as “4-2”, “4-1”, “5”
and “6” from left to right.
 For SMC board, the optical interfaces all
can access STM-1 or STM-4 signal.
Optical However, the optical interfaces marked as
receiving/tran “4-1” and “4-2” must be set to access the
7 -
smitting signal with the same rate.
interface  For SMB board, the optical interfaces
marked as “5” and “6” can access STM-1 or
STM-4 signal, the optical interfaces marked
as “4-1” and “4-2” can only access STM-1
signal.
Types of the optical module supported by the


STM-1 interface are S-1.1, L-1.1 and L-1.2.
Types of the optical module supported by the
STM-4 interface are S-4.1, L-4.1 and L-4.2.
Indicator of Green indicator

optical  ON if the optical interface receives the
8 R
receiving optical signal,
interface  OFF if the signal is lost.
Indicator of Green indicator
optical
9 T  ON if the laser is turned on,
transmitting
interface  OFF if the laser is turned off.
75 Ω BITS 75 Ω clock output interface

10 output Tx Connector type: 1.0/2.3 angle PCB solder
interface female socket (with installed screw)
75 Ω BITS 75 Ω clock input interface

11 input Rx Connector type: 1.0/2.3 angle PCB solder
interface female socket (with installed screw)
It can output two channels of alarm signals,
one is critical alarm and the other is
Alarm output major/minor alarm
12 OUT
interface
Connector type: RJ11 socket with relay
isolation mode
Connector type: RJ45 socket
It provides the function of either RS232
interface or 120 Ω BITS clock interface.
On the lower part of the interface, there are
two green indicators, one on the left and the
other on the right.
The left indicator is for the alarm indication of
SMC board, marked as M-ALM.
 ON if any unit of SMC board (except NCP
unit), TFEx4 and TFEx4B boards have the
alarms (including critical, major, minor and
RS232 prompt alarm).
interface/
13 232  OFF if the alarm is cleared or shielded.
120 Ω BITS
interface The right indicator is for the status indication of
clock, marked as M-RUN.
 Flickering 0.25 times per second indicates
internal clock or hold-on mode.
 Flickering once per second indicates normal
locking of line clock or external clock.
 Flickering 0.5 times per second indicates
that the clock is working in the free-run
mode.
 Flickering five times per second indicates
that the clock is working in the pull-in or
tracking mode.
Interface for Connector type: RJ45 socket

14 local craft LCT
terminal Used to connect a Local Craft Terminal (LCT).


Used to connect the EMS computer.
Under the Qx interface, there are two green
indicators on the left and right of the Qx
interface.
Left Indicator (LA): connection indicator.
 ON if the interface is correctly connected.
15 Qx interface Qx  OFF if the interface is not connected.
Right indicator: speed indicator.
 ON if the data transmission speed is 100
Mbit/s.
 OFF if the data transmission speed is 10
Mbit/s.
Note: Since the interface speed is 10 Mbit/s
forcibly, the right indicator is always OFF.

Alarm input 4 channels of external alarms (on-off signals)
16 IN are supported through this interface, such as
interface
smoke alarm, entrance control alarm, fire
alarm and temperature alarm.

On the front panel, there are four 10M/100M
fast Ethernet electrical interfaces, which are
identified as FE1, FE2, FE3 and FE4 from left to
right.
On the top of each FE electrical interface, there
are two green indicators on the left and right
FE1 respectively.
Fast Ethernet FE2
17 electrical Left Indicator (LINK/ACTIVE): connection
interface FE3 indicator
FE4  ON if the interface is correctly connected.
 OFF if the interface is not connected.
Right Indicator: speed indicator
 ON if the data transmission speed is 100
Mbit/s.
 OFF if the data transmission speed is 10
Mbit/s.
E1 electrical Connector type: 50-pin angle PCB solder socket

18 interface (1- - (female)
12) Used to access 1-12 channels of E1 signals.
E1 electrical Connector type: 50-pin angle PCB solder socket

19 interface (13- - (female)
21) Used to access 13-21 channels of E1 signals.
Laser This sign warns users to beware of strong laser

20 -
warning sign beam and avoid burning eyes.

DC Power Module (PWA/PWB)

ZXMP S200 provides two kinds of DC power modules to meet different
power supply environment.
 PWA module
It uses -48 V primary DC power supply.
Allowed voltage fluctuation range: -36 V to -72 V
 PWB module
It uses +24 V primary DC power supply.
Allowed voltage fluctuation range: +18 V to +36 V
Functions
The DC power module supplies DC power, i.e. the secondary power supply,
to all the other boards in ZXMP S200.
The power module provides dual power inputs: path A as the active power
supply and path B as the standby power supply (such as storage battery).
When the path A fails, the power supply is switched to the path B
smoothly. Once the path A recovers, the power supply is switched back to
the A path. Above means that the path A and path B are 1:1 backup one
another.
Operating Principle
Figure 27 illustrates the functional block of PWA/PWB module.
Table 32 lists the function of each unit in the power module.
F I G U R E 2 7 O P E R A T I N G P R I N C I P L E O F T H E P W A/ P W B M O D U L E
Control Circuit Alarm output
Primary power
supply Output
Input Filter & Power
Filter Other boards
Protection Transform
-48V / -60 V or
+24 V

T A B L E 3 2 U N I T S I N T H E P W A/ P W B B O A R D
Unit Function
This unit consists of the input switch, fuses, lightning and
surging protection circuit, EMI filter circuit and soft start
circuit.
Input Filter and
Protection It implements the EMI filtering for the input power and
provides lightning/surging protection and over-
voltage/under-voltage protection, thus improving the
adaptability to the input power supply.
Power Converts the primary power supply to the DC power needed

Transform by other boards.
Improves the stability of output power by decreasing output

Output Filter
voltage ripple.
Implements protection and control with the input over/under

voltage protection circuit and output over/under voltage
Control Circuit protection circuit.
In addition, it performs the function of failure alarming,
outputting alarm and board-in-position signal.
Front Panel
Front Panel of Figure 28 shows the front panel of PWA board and Table 33 lists the
PWA Board components on the front panel.
FIGURE 28 F RONT P ANEL OF THE PW A BO ARD
84.5mm
9
40mm
1 2 3 4 5 6 7
T ABLE 33 COMPONENTS ON THE FRONT P ANEL OF PW A BOARD
No. Component Description
1 Handle Helps to pull in/out the power board.
Used to fix the fan module and the power module.

Rotary  LOCK: to fix the fan module and the power module
2
switch  UNLOCK: to unlock the fan module and the power
module

Green indicator, used to indicate the working status of B

Power path power supply.
3 indicator of B  ON if there is the power supply at B path,
path  OFF if the output end of B path of power board is
disconnected, or the power switch is turned off.
Green indicator, used to indicate the working status of A

4 indicator of A  ON if there is the power supply at A path.
path  OFF if the output end of A path of power board is
Used to connect with active external power supply (A
path).
DC power
Connector type: D-type, 3-pin angle PCB solder socket
5 socket of A
(pin-hole-pin)
path
The signal definition of the pin/hole from left to right is -
48 VGND, PGND and -48 V.
Used to connect with standby external power supply (B

path).
DC power
6 socket of B
(pin-hole-pin)
path
The signal definition of the pin/hole from left to right is -
48 VGND, PGND and -48 V.
Turn the power switch to “I” to connect the external

7 Power switch power supply.
Turn it to “O” to disconnect the external power.
Running
status Indicate the running status of the board.
8
indicator ON in green means that the board is running normally.
(RUN)
Alarm Indicates the alarm status of the board.

9 indicator OFF means that the board is running normally, ON in red
(ALM) means that the alarm occurs in the board.
Front Panel of Figure 29 shows the front panel of PWB board and Table 34 lists the
PWB Board components on the front panel.

FIGURE 29 F RONT P ANEL OF THE PW B BOARD
84.5mm
9
40mm
1 2 3 4 5 6 7
T ABLE 34 COMPONENTS ON THE FRONT P ANEL OF PW B BOARD
1 Handle Helps to pull in/out the power module.
Used to lock the fan module and the power module.

Rotary  LOCK: to fix the fan module and the power module
2
switch  UNLOCK: to unlock the fan module and the power
module
Green indicator, used to indicate the working status of B

3 indicator of B  ON if there is the power supply at B path.
path  OFF if the output end of B path of power board is
Green indicator, used to indicate the working status of A

4 indicator of A  ON if there is the power supply at A path.
path  OFF if the output end of A path of power board is
Used to connect with active external power supply (A

path).
DC power
5 socket of A
(pin-hole-pin)
path
The signal definition of the pin/hole from left to right is
+24 VGND, PGND and +24 V.
Used to connect with standby external power supply (B

path).
DC power
6 socket of B
(pin-hole-pin)
path
The signal definition of the pin/hole from left to right is
+24 VGND, PGND and +24 V.

Turn the power switch to “I” to connect the external

7 Power switch power supply.
Turn it to “O” to disconnect the external power.
 The indicator identified as RUN indicates the running

status of the board. ON in green means that the
Working board is running normally.
status
8  The indicator identified as ALM indicates the alarm
indicator
(RUN, ALM) status of the board. OFF means that the board is
running normally, ON in red means that the alarm
occurs in the board.
AC Power Module (PWC)

Besides the DC power module (PWA/PWB), ZXMP S200 also provides an
AC power module (PWC) to meet the environment where only 110 V or
220 V AC primary power supply is available. The allowed voltage
fluctuation range of the primary AC power supply is from 90VAC to
290VAC.
Caution: If the input voltage is higher than 280VAC, the PWC module will
start the power supply protection. Once the power supply protection is started, the
equipment can not be turned on.
Note: Additional voltage-regulated power supply (such as UPS) should be

configured when the PWC module is used in ZXMP S200. Besides, Class-B lightning
protector with the nominal discharge current of 60 kA should be installed in the
equipment room where ZXMP S200 is located.
The PWC module meets the requirements specified in the standards IEC
60950:1999, EN 60950: 2000 and GB 4943:2001.
Operating Principle
The PWC module converts the AC power (primary power supply) into DC
power needed by the other boards in ZXMP S200.
Figure 30 illustrates the operating principle of the PWC module.

FIGURE 30 OPERATING PRINCIPLE OF THE PWC MODULE
Control Circuit Alarm output
AC power supply Input

AC/DC Power Output Other
Filter and
220V Converter Converter Filter boards
Protection
Table 35 lists the function of each unit in the PWC module.
T ABLE 35 UNITS IN THE PWC M ODULE
Unit Function
This unit consists of the input switch, fuses, lightning and
surging protection circuit, EMI filter circuit and soft start
circuit.
Input Filter and
Protection It implements the EMI filtering for the input power and
provides lightning/surging protection and over-
voltage/under-voltage protection, thus improving the
adaptability to the input power.
AC/DC Converts 220 V AC power supply into DC power supply, and
Converter then outputs the DC power to the next module.
Power Converts the -48 V DC power into DC power with proper
Converter voltages needed by other boards.
Improves the stability of output power by decreasing output
Output Filter
voltage ripple.
Implements protection and control with the input over/under
voltage protection circuit and output over/under voltage
Control Circuit protection circuit.
In addition, it performs the function of failure alarming,
outputting alarm and board-in-position signal.
Front Panel
Figure 31 shows the front panel of the PWC module. Table 36 describes
the components on front panel.

FIGURE 31 F RONT P ANEL OF THE PW C M ODULE
84.5mm
6
40mm
1 2 3 4
T ABLE 36 COMPONENTS ON THE FRONT P ANEL OF THE P W C M ODULE
1 Handle Helps to pull in/out the power board.
Used to lock the fan module and the power module.

 LOCK: to fix the fan module and the power
2 Rotary switch module
 UNLOCK: to unlock the fan module and the
power module
AC power Used to connect with 220 V AC power supply.

3
socket Connector type: D-type 3-pin socket
 Turns the power switch to “I” to connect the

external power supply.
4 Power switch
 Turns the power switch to “O” to disconnect the
external power.
Working Indicates the running status of the board.
status
5 ON in green means that the PWC board runs
indicator
(RUN) normally.
Alarm Indicates the alarm status of the board.

6 indicator OFF means that the board is running normally, ON
(ALM) in red means that the alarm occurs in the board.
V.35 Data Interface Board (V35B)

Operating Principle
V35B board provides two V.35 synchronous data interfaces of N × 64K
(N=1-31), which can be connected to V.35 data interfaces of a router
directly. The board software and FPGA program can be upgraded remotely
online.

The V35B board uses E1 timeslots in SDH networks to transfer low-rate

transparent data services.
Figure 32 illustrates the operating principle of V35B board.
FIGURE 32 OPERATING P RINCIPLE OF THE V35B BO ARD
V.35 data
2M & N× 64K Data Service
Interface Unit
Adaptation Unit
Backplane
signals
Mapping/ Rate Adaptation
Demapping Unit Unit
The V35B board converts the high-rate signal received from the backplane
into low-rate service signals, and then demaps them to two channels of 2
M signals in the Mapping/Demapping Unit. After that, adapts the 2 M
signals to N×64K data service signals, which are sent to the Interface Unit.
Finally, the Interface Unit converts the N×64K signals into V.35 data and
output it.
In the opposite direction, the V35B board adapts two N×64K data signals
into 2 M signals and then maps them to 2 M timeslots. The Rate
Adaptation Unit converts the signals into high-rate signals and then sent
them to the backplane.
Table 37 lists the functions of units of V35B board.
T ABLE 37 UNITS IN THE V 35B BOARD
Unit Function
Interface Unit Inputs/outputs V.35 data services.
Implements the adaptation between 2 M signals and
2 M & N×64K Data
N×64 K service signals. The timeslots of 2 M signals
Service Adaptation
occupied by N × 64 K data service are configured
Unit
through software.
Mapping/Demapping
Maps/demaps two 2 M signals.
Unit
Implements the conversion between high-rate signals
Rate Adaptation Unit
from the backplane and low-rate service signals.
Front Panel
Figure 33 shows the front panel of V35B board.

FIGURE 33 F RONT P ANEL OF THE V35B BOARD
156.7mm
20.6mm
1 2 3 4 5 6
Table 38 lists the components on the front panel of V35B board.
T ABLE 38 COMPONENTS ON THE FRONT P ANEL OF V35B BOARD
1 Captive fastener Used to fix the board in the chassis.
Helps to pull in/out the board into/from the chassis

2 Ejector lever
and also used to fix the board in the chassis.
V.35 interface 1 Connector type: D-type 26-pin angle PCB solder

3
(PORT1) socket (female)
V.35 interface 2 Connector type: D-type 26-pin angle PCB solder

4
(PORT2) socket (female)
Working status Indicate the running status of the board.

5 indicator (RUN, Flickering regularly (once per second) in green
ALM) means that the board is running normally.
Indicate the alarm status of the board.

Alarm indicator
6 OFF means that the board is running normally, ON in
(ALM)
red means that the alarm occurs in the board.
E1/T1 Electrical Tributary Board

Types
As an extension board of the main board, the E1/T1 electrical tributary
board can process 21 channels of E1 or T1 signals. In terms of function,
class the electrical tributary board into three types:
 E1 electrical tributary board with interface impedance 75 Ω

 E1 electrical tributary board with interface impedance 120 Ω
 T1 electrical tributary board with interface impedance 100 Ω
These three kinds of the E1/T1 electrical tributary boards have the same
operating principle but different board identifiers on their front panels.

Table 39 lists the relations between the type and identifier of different
E1/T1 boards.
T ABLE 39 REL ATIONS BETWEEN E1/ T1 ELECTRICAL TRIBUTARY BOARD AND ID
Board Type ID on Front Panel

E1 electrical tributary board
ET1-75
(Interface matching impedance 75 Ω)
E1 electrical tributary board
ET1-120
T1 electrical tributary board
TT1
Functions
The E1/T1 electrical tributary board has the following functions:
 Provides 21 E1 or T1 physical interfaces, which support HDB3 or B8ZS

encoding/decoding.
 Supports the mapping/demapping and multiplexing/demultiplexing
between 21 E1/T1 signals and any timeslots in AU-4.
 Supports the adding/dropping of timeslots with different serial
numbers, and supports independent adding/dropping of timeslots.
 Supports remote online upgrade of board software and logic programs.
In addition, the mapping path can be configured as AU-4 on the EMS.
Operating Principle
Figure 34 illustrates the operating principle of the E1/T1 electrical tributary
board.
FIGURE 34 OPERATING P RINCIPLE OF THE E1/ T1 ELECTRIC AL TRIBUTARY BO ARD
Service
E1/T1 Interface Unit Cross-connect unit
Processing Unit
System clock
Clock Unit
Reference clock
NCP Control Unit
Table 40 lists the functions of all units in E1/T1 electrical tributary board.

T ABLE 40 FUNCTIONS OF UNITS IN THE E1/ T1 ELECTRICAL TRIBUTARY BO ARD
Unit Function
Implements the distribution of system clock for the clock

Clock Unit
needed by the board.
Implements the code pattern conversion, jitter attenuation

Interface Unit and HDB3 coding between E1/T1 analog signals and digital
signals.
Service Implements the mapping/demapping between E1/T1

Processing Unit payloads and VC-4, and processes pointers.

Control Unit
 Implements the performance statistic, alarm detection,
and the communication among modules.
Front Panel
The front panels of the electrical tributary boards are same with each
other except the identifiers on the panels. Take the ET1-75 board as an
example, the front panel is shown in Figure 35.
FIGURE 35 F RONT P ANEL OF THE ELECTRIC AL TRIBUTARY BO ARD (ET1-75 BOARD)
156.7mm
206mm
1 2 3 4 5 6
Tx+
Rx+
Rx-
Tx-
Table 41 describes the components on front panel.
T ABLE 41 COMPONENTS ON THE FRONT P ANEL OF E T1 BOARD

2 Ejector lever

Connector type: 50-pin angle PCB solder female

socket
This interface corresponds to the 1st to 12th channel
E1/T1 electrical
E1/T1 electrical ports from left to right.
3 interface
Each E1/T1 signal occupies four pins with the signal
(channel 1-12)
definition Rx+, Tx+, Rx- and Tx- in order.
Note: “R” represents for “Receive” while “T”
represents for “Transmit”. x=1, 2, 3, … 12.
Indicate the running status of the ET1 board.

Running
4 Flickering in green regularly (once per second)
indicator (RUN)
means that the ET1 board runs normally.
Indicate the alarm in the ET1 board.
Alarm indicator  OFF means that the ET1 board runs normally
5
(ALM)  ON in red means that the alarm occurs in the
ET1 board.
Connector type: 50-pin angle PCB solder female
socket
This interface corresponds to the 13th to 21st channel
E1/T1 electrical
E1/T1 electrical ports from left to right.
6 interface
Each E1/T1 signal occupies four pins with the signal
(channel 13-21)
definition Rx+, Tx+, Rx- and Tx- in order.
Note: “R” represents for “Receive” while “T”
represents for “Transmit”. x=13, 14, 15, … 21.
E3/T3 Electrical Interface Board

(EIE3)
Functions
EIE3 board has the following functions:
 Provides three E3 or T3 physical interfaces, which support HDB3 or
B3ZS code/decode
 The rate of each interface can be configured as 45 M (T3) or 34 M (E3)
through the EMS.
 Supports the remote online download of board software and logic
programs
 Supports channel protection
Operating Principle
The operating principle of EIE3 board is as follows:

 At the receiving side, the EIE3 board receives three E3/T3 PDH signals.
After impedance matching and analog/digital conversion, the EIE3
board sends the digital E3/T3 signals to the main board for mapping
and cross-connection.
 At the transmitting side, the EIE3 board receives three E3/T3 digital
signals from the main board. After the digital/analog conversion and
impedance matching, it sends the analog signals out from the board.
Front Panel
The front panel of EIE3 board is shown in Figure 36.
FIGURE 36 F RONT P ANEL OF THE EIE3 BOARD
156.7mm
20.6mm
1 2 3 4 5 6
Table 42 describes the components on the front panel of EIE3 board.
T ABLE 42 DESCRIPTIONS OF COMPONENTS ON THE F RONT P ANEL OF EIE3 BO ARD

Captive
1 Used to fix the board in the chassis
fastener
Helps to pull in/out the board into/from the chassis and

2 Ejector lever
also used to fix the board in the chassis
Three electrical receive interfaces are available on the

Electrical front panel with the identifier “INn”, where n=1, 2, 3.
3 receive
interface Connector type: 1.0/2.3 angle PCB solder female socket
(with screw installed)
Three electrical transmit interfaces are available on the

Electrical front panel with the identifier “OUTn”, where n=1, 2, 3.
4 transmit
interface Connector type: 1.0/2.3 angle PCB solder female socket
(with screw installed)
Green indicator
Running
Indicates the running status of EIE3 board
5 indicator
(RUN) Flickering regularly (once per second): EIE3 board runs
normally.


Red indicator
Alarm Indicates alarm of EIE3 board
6 indicator
(ALM)  OFF: EIE3 board runs normally.
 ON: Some alarm occurs in EIE3 board.
4-Channel Transparent-
Transmission Fast Ethernet
Electrical Interface Board (TFEx4)
Functions
The TFEx4 board has the following functions:
 Provides four 10 M/100 M adaptive Ethernet electrical interfaces,

 Supports 10 M/100 M, full duplex modes,
 Supports auto-negotiation and forced working status,
 Supports AutoMDIX (Auto-Medium Dependent Interface Crossover)
function of network cables, i.e. auto-identification of crossover and
straight-through network cables.
In addition, the Ethernet electrical interfaces comply with the standard
IEEE802.3.
Operating Principle
The operating principle of the TFEx4 board is as follows:
 At the receiving side, the TFEx4 board receives four Ethernet signals.
After pulse transform, then sends the signals to the main board
through the backplane for Ethernet service processing.
 At the transmitting end, the TFEx4 board receives Ethernet data
frames from the main board. After pulse transform, the signals are
output from the TFEx4 board.
Note: For the details of Ethernet service processing procedure, please
refer to the description of Ethernet interface unit in the section “Main
Board”.
Front Panel
The front panel of TFEx4 board is shown in Figure 37.

FIGURE 37 F RONT P ANEL OF THE TFEX4 BOARD
156.7mm
20.6mm
1 2 3 4 5
Table 43 lists the components on the front panel of the TFEx4 board.
T ABL E 43 COMPONENTS ON THE FRONT P ANEL OF TFE X4 BOARD

Captive
1 Used to fix the board in the chassis.
fastener

2 Ejector lever
Yellow indicator
Used to indicate the connecting and running status of
corresponding Ethernet electrical interface.
LINK/ACK  ON: The Ethernet interface is connected, that is,
3
indicator in the LINK status.
 OFF: The Ethernet interface is not connected.
 Flickering: Data packets are being received or
transmitted through the Ethernet interface.
Four Ethernet electrical interfaces are available on the

Ethernet front panel, numbered with 5, 6, 7 and 8 respectively
4 electrical from left to right.
interface
Green indicator
Used to indicate the data transmission speed of
Interface corresponding Ethernet electrical interface.
5 speed  ON: The data transmission speed of the Ethernet
indicator interface is 100 Mbit/s.
 OFF: The data transmission speed of the Ethernet
interface is 10 Mbit/s.
Note: If the TFEx4 board reports an alarm, the M_ALM indicator on the main board
will be ON continuously. For the description of the M_ALM indicator, please refer to
Table 31 in the section “Main Board”.

4-Channel Transparent-
transmission Fast Ethernet
Optical Interface Board (TFEx4B)
Functions
The TFEx4B board has the following functions.
 It provides four Ethernet optical interfaces.

 Ethernet optical interfaces comply with the standard IEEE802.3.
 The interfaces works under the 100 M full duplex mode forcibly.
 It supports hot-swappable SFP (small form-factor pluggable) optical
modules. The interfaces on the board support optical modules for the
transmission distance 2 km (multi-mode 1310 nm) and 15 km (single-
mode 1310 nm).
 It can flexibly configure the optical modules for different transmission
distance according to user’s requirements.
Operating Principle
The operating principle of the TFEx4B board is as follows:
 At the receiving side, the TFEx4B board receives four Ethernet optical
signals. It converts these optical signals into electrical signals and then
sends them to the main board (SMC) through the backplane for
Ethernet service processing.
 At the transmitting side, the TFEx4B board receives four Ethernet
electrical signals returned by the main board through the backplane. It
converts these electrical signals into optical signals and then sends
them out from the board.
For the details of Ethernet service processing procedure, please refer to
the description of Ethernet interface unit in the section “Main Board”.
Front Panel
The front panel of TFEx4B board is shown in Figure 38.

FIGURE 38 F RONT P ANEL OF THE TFEX4B BO ARD
156.7mm
20.6mm
1 2 3 4
Table 44 lists the components on the front panel of the TFEx4B board.
T ABLE 44 COMPONENTS ON THE FRONT P ANEL OF TFE X4B BO ARD

2 Ejector lever
Four Ethernet optical interfaces are available on
the front panel, numbered with 5, 6, 7 and 8
respectively from left to right.
Ethernet optical
3 Supports hot-swappable SFP optical modules.
interface
Supportable optical module type: 2 km (multi-
mode 1310 nm) and 15 km (single-mode 1310
nm) module.
Green indicator
Used to indicate the LINK/ACTIVE status of
corresponding Ethernet optical interface.
Indicator of
4 Ethernet optical  ON: The Ethernet interface is connected, that
interface (LA) is, the interface is in the LINK status.
transmitted through corresponding Ethernet
optical interface.
Note: If the TFEx4B board reports an alarm, the M_ALM indicator on the main
board will be continuously lit. For the description of the M_ALM indicator, please
refer to Table 31 in the section “Main Board”.
Audio Interface Board (AI)

Functions
The AI board provides analog audio interfaces without feed.
Each board provides six audio interfaces of two-line or four-line type,

which are optional.
The electrical level of interface:

 Transmitting end: 0 dB
 Receiving end: 0 dB, -3.5 dB or -7 dB, optional
The interface type and the electrical level at the transmit end can be set
through the EMS (ZXONM E300).
Operating Principle
The AI board uses idle overhead bytes in SDH frames to carry transparent
analog services. Table 45 lists the positions of the used overhead bytes in
the SDH frame.
T ABLE 45 P OSITIONS OF THE USED OVERHE AD BYTES IN THE SDH FR AME
Codes of the Positions in the Codes of the Positions in the

overhead SDH frame overhead bytes SDH frame
bytes
R2C6 The 2nd row and R3C9 The 3rd row and
the 6th column the 9th column
R3C6 The 3rd row and R5C5 The 5th row and
Figure 39 illustrates the operating principle of the AI board.
F I G U R E 3 9 O P E R A T I N G P R I N C I P L E O F T H E AI B O A R D
2-Line Audio signal

Audio
Interface
2/4-Line Unit
Interface
Processing Audio
Motherboard
Unit Interface
Selection
Unit 4-Line Audio signal
Audio
NCP unit Control Unit Interface
Unit
The AI board provides non-feed 2-line or 4-line audio services in the

following way:
The interface processing unit separates and processes the overhead bytes
received from the motherboard bus, and then outputs the analog audio
signal to the 2/4-line audio interface selection unit, which selects the audio
interface unit for the audio signal. After converting the analog audio signal,
the 2/4-line audio interface selection unit outputs the audio signal to the
selected audio interface unit.

On the other hand, user’s audio service is input to the 2-line or 4-line
audio interface unit, which forwards it to the 2/4-line audio interface
selection unit. After conversion, the audio signal is output to the interface
processing unit by the 2/4-line audio interface selection unit. The interface
processing unit combines the audio signal into system signal and outputs it
to the motherboard for further processing.
Table 46 lists each functional unit in the AI board.
T A B L E 4 6 F U N C T I O N S O F U N I T S I N T H E AI B O A R D
Unit Function
2-Line/4-Line Audio
Inputs/outputs audio signals.
Interface Unit
2/4-Line Audio Interface
Selects 2-line or 4-line audio signals.
Selection Unit
Implements A/D and D/A conversions of audio
Interface Processing
signals, and the separation and combination
Unit
between system signals and audio signals.
 Provides a channel for the AI board to

communicate with the NCP unit.
Control Unit
 Supports the communication among functional
units in the AI board.
Front Panel
Figure 40 shows the front panel of the AI board.
F I G U R E 4 0 F R O N T P A N E L O F AI B O A R D
156.7mm
20.6mm
1 2 3 4 5
Table 47 lists the components on the front panel of AI board.
T A B L E 4 7 C O M P O N E N T S O N T H E F R O N T P A N E L O F AI B O A R D

2 Ejector lever

Provides six channels of 2-line/4-line audio interface.

3 Audio interface Connector type: 26-pin D-type angle PCB solder
female socket (blade hole)
Green indicator
Running Used to indicate the running status of the AI board.
4
indicator (RUN) Flickering regularly (once per second) means that the
AI board runs normally.
Red indicator
Alarm indicator Used to indicate alarm in the AI board.
5
(ALM)  OFF: The AI board runs normally.
 ON: Some alarm occurs in the AI board.
Table 48 lists the signal definition of each pin in the audio interface.
T AB L E 4 8 S I G N AL D E F I N I T I O N S O F P I N S I N T H E AU D I O I N TE R F AC E
Pin Signal Definition Pin Signal Definition

1 ALINE1 14 BLINE1
2 ALINEG1 15 BLINEG1
3 ALINE2 16 BLINE2
5 ALINE3 18 BLINE3
7 ALINE4 20 BLINE4
9 ALINE5 22 BLINE5
11 ALINE6 24 BLINE6
13 PGND 26 PGND
Note:
 ALINEn/ALINEGn (n=1-6) corresponds to the transmitting and

receiving signal lines of two-line audio interface, or transmitting signal
line pair of four-line audio interface. There is no polarity requirement
when they are connected.
 BLINEn/BLINEGn (n=1-6) corresponds to receiving signal line pair of
four-line audio interface. When corresponding to two-line audio
interface, they will not be used. There is no polarity requirement when
they are connected.
 PGND represents for protection ground.

 The definition of transmitting and receiving is related to the AI board.
Orderwire Board (OW)

Functions
The OW board supports orderwire telephone and low-speed data
transmission. In addition, it supports the trunk (TRK) function,
implementing the orderwire communication between two SDH NEs without
optical connection, between SDH NE orderwire and the Public Switched
Telephone Network (PSTN).
One orderwire telephone interface and six channels of RS232/RS485

interface (or three channels of RS422 interface) are available on the OW
board.
Operating Principle
The OW board uses E1, E2, protection bytes and other idle overhead bytes
to carry orderwire data and low-speed data. Table 49 lists the positions of
the idle overhead bytes which are used to carry the low-speed data service.
T ABLE 49 P OSITIONS OF THE IDLE OVERHE AD BYTES USED TO CARRY THE LOW-SPEED
DATA SERVICE
Codes of the Positions in the Codes of the Positions in the

overhead SDH frame overhead bytes SDH frame
bytes
R2C6 The2nd row and R3C9 The 3rd row and
Figure 41 illustrates the operating principle of the OW board.

FIGURE 41 OPERATING P RINCIPLE OF THE OW BOARD
Orderwire signal
Orderwire Unit
NCP unit Control Unit
Low-speed data signal

Low-Speed Data
Processing Unit
Table 50 describes the functions of each unit in the OW board.
T ABLE 50 UNITS IN THE OW BO ARD
Unit Function
 Implements the function of one channel two-line

Orderwire Unit analogue telephone interface.
 Implements trunk (TRK) function.
Processes the services to or from 6 channels of RS232

Low-Speed Data
interface, 6 channels of RS485 interface or 3 channels of
Processing Unit
RS422 interface.
Provides a channel for the AI board to communicate with

the NCP unit.
Control Unit
Supports the communication between modules in the OW
board.
Front Panel
Figure 42 shows the front panel of the OW board.
FIGURE 42 F RONT P ANEL OF THE OW BOARD
156.7mm
20.6mm
1 2 3 4 5 6 7
Table 51 describes the components on the front panel of OW board.

T ABLE 51 COMPONENTS ON THE FRONT P ANEL OF OW BOARD
Helps to pull in/out the board into/from the

2 Ejector lever chassis and also used to fix the board in the
chassis.
Provides the service to or from 6 channels of

RS232 interface, 6 channels of RS485 interface
RS232/RS485/RS422 or 3 channels of RS422 interface.
3
interface
Connector type: 26-pin D-type angle PCB solder
female socket (blade hole)
4 TRK interface (TRK) Connector type: RJ11 socket
Orderwire telephone
5 Connector type: RJ11 socket
interface (PHONE)
Green indicator
Used to indicate the running status of the OW
Running indicator
6 board.
(RUN)
Flickering regularly (one time per second)
means that the OW board runs normally.
Red indicator
Used to indicate alarms in the OW board.
7 Alarm indicator (ALM)
 OFF: The OW board runs normally.
 ON: Some alarm occurs in the OW board.
Table 52 lists the signal definitions of pins in the RS232/RS485/RS422

interface.
T ABLE 52 SIGNAL DEFINITIONS OF PINS IN RS232/ RS485/RS422 INTERFACE
Pin Signal Definition

1 RS232_R1/RS422_R1+/RS485+_1
2 RS232_T1/RS422_R1-/RS485-_1
3 GND
4 RS232_R2/RS422_T1+/RS485+_2
5 RS232_T2/RS422_T1-/RS485-_2
6 GND
7 RS232_R3/RS422_R2+/RS485+_3
8 RS232_T3/RS422_R2-/RS485-_3
9 GND
10 RS232_R4/RS422_T2+/RS485+_4
11 RS232_T4/RS422_T2-/RS485-_4

Pin Signal Definition

12 GND
13 GND
14 RS232_R5/RS422_R3+/RS485+_5
15 RS232_T5/RS422_R3-/RS485-_5
16 GND
17 RS232_R6/RS422_T3+/RS485+_6
18 RS232_T6/RS422_T3-/RS485-_6
19 PGND
20 PGND
21 PGND
22 PGND
23 PGND
24 PGND
25 PGND
26 PGND
Note:
 RS232_Tx (x=1-6) represents for the xth transmitting channel of

RS232 signal, while RS232_Rx (x=1-6) represents for the xth receiving
channel of RS232 signal.
 RS422_Tx+ (x=1-3) represents for the positive polarity of the x th
transmitting channel, while RS422_Tx- (x=1-3) represents for the
negative polarity of the xth transmitting channel.
 RS422_Rx+ (x=1-3) represents for the positive polarity of the x th
receiving channel, while RS422_Rx- (x=1-3) represents for the
negative polarity of the xth receiving channel.
 RS485+_x (x=1-6) represents for the positive polarity of the x th
channel, while RS485-_x (x=1-6) represents for the negative polarity
of the xth channel.
 GND represents for ground. PGND indicates that the pin is connected
to the protection ground in the socket.
Enhanced Smart Ethernet Board

(SEC)
Functions
The SEC board has the following functions.

 Provides 4 FE electrical interfaces at the user side. All of these

interfaces meet the requirements of IEEE 802.3, and support the rate
of 10 M/100 M, full duplex/half duplex modes as well as self-
negotiation and forced working status.
 Provides 4 system ports at the system side. All of these ports support
the convergence in 4:1 mode.
 Supports the Ethernet flow control and the processing of flow control
frames as specified in IEEE 802.3x.
 Supports Jumbo frames with the length of 9600 bytes.
 Supports VLAN processing and Q in Q.
 Supports learning and searching in Independent VLAN Learning (IVL)
and Shared VLAN Learning (SVL) modes. The capacity of MAC address
table is 8 K.
 Supports the special processing of L2 frames specified by users.
 Supports Internet Group Management Protocol Snooping (IGMP)
protocol.
 Provides the Trunk function for ports and supports the protection
based on Link Aggregation Control Protocol (LACP).
 Provides the mirroring function for ports.
 Supports Multi-Service Transport Platform (MSTP) protocol.
 User ports support the access mode, TLS (Transparent LAN Services)
mode, trunk mode and the transparent transmission mode. The
function of querying user ports’ alarm and performance messages is
also provided.
Operating Principle
The operating principle of the SEC board is as follows:
 At the receiving side, the SEC board accesses 4 channels of Ethernet

signal. After L2 switching, these signals are converted into differential
signals and then forwarded to the main board through the backplane
for Ethernet service signal processing.
 At the transmitting side, cross-connect, de-map and de-capsulate the
Ethernet service signals in the main board firstly. Then send these
signals to the SEC board through the backplane. The SEC board
performs L2 switching for these signals and finally outputs them.
Note: For the details of Ethernet service processing procedure, please
refer to the description of Ethernet interface unit in the section “Main
Board”.
Front Panel
The front panel of the SEC board is shown in Figure 43.

FIGURE 43 F RONT P ANEL OF THE SEC BOARD
156.7mm
20.6mm
1 2 3 4 5 6 7
Table 53 lists the components on the front panel of the SEC board.
T ABLE 53 COMPONENTS ON THE FRONT P ANEL OF SEC BOARD

Captive
fastener

2 Ejector lever
and also is used to fix the board in the chassis.
Green indicator
Used to indicate the connecting and running status of
corresponding Ethernet interface.
LINK/ACK
3  ON: The Ethernet interface is connected, that is, in
indicator
the LINK status.
transmitted through the Ethernet interface.
Four Ethernet electrical interfaces are available on the

Ethernet front panel, numbered with 5, 6, 7 and 8 respectively
4 electrical from left to right.
interface
Green indicator
Used to indicate the data transmission speed of
corresponding Ethernet electrical interface.
Interface
5 speed  ON: The data transmission speed of corresponding
indicator Ethernet interface is up to 100 Mbit/s after self-
negotiation.
 OFF: The data transmission speed of
corresponding Ethernet interface is 10 Mbit/s.
Green indicator
Running
Used to indicate the running status of the SEC board.
6 indicator
(RUN) Flickering regularly (once per second): The SEC board
runs normally.
Red indicator
Alarm Used to indicate alarm in the SEC board.
7 indicator
(ALM)  OFF: The SEC board runs normally.
 ON: Some alarm occurs in the SEC board.

SHDSL Interface Board (SDB)

G.SHDSL (Single-pair high-bit-rate Digital Subscriber Line) is a
telecommunication technology corresponding to ADSL and VDSL. It not
only supports the symmetrical data rates of 2.048 Mbit/s but also has the
longer transmission distance than ADSL. Replacing E1 lines by G.SHDSL
can access the high-speed data services for transmission over long
distance.
The SHDSL interface board (SDB) can act as a circuit-based SHDSL

Transceiver Unit-Central office (STU-C) equipment working in TDM (Time
Division Multiplexing) mode. The SDB board enables ZXMP S200 to
implement the long-distance transmission of E1 data by cooperating with
corresponding SHDSL terminal equipment, moreover, the transmission
distance is up to 2 km.
Functions
The SDB board has the following functions.
 Provides up to 4 SHDSL data interfaces that meet the requirements of

ITU-T G.991.2; supports two lines mode and symmetric PSD (Power
Spectral Density).
 Supports the rate symmetry for the upward and downward data of
each SHDSL.
 Supports the payload transport rate of up to 2.048 Mbit/s.
 Supports the framing of E1 signals.
 Supports retiming four E1 signals, which is set on the EMS.
 Supports the remote download of board software.
 Provides two loopback configuration points at VC12 and SHDSL ports
for convenient test. Each loopback point supports two loopback modes:
terminal-side loopback and line-side loopback.
 It is hot pluggable.
Operating Principle
Figure 44 illustrates the operating principle of the SDB board.

FIGURE 44 OPERATING P RINCIPLE OF THE SDB BO ARD
Multiplexing/ Mapping/
Demultiplexing Demapping Interface Unit
Backplane Unit Unit SHDSL
signal
Microprocessor
Unit
Table 54 lists the functions of each unit in the SDB board.
T ABLE 54 UNITS IN THE S DB BOARD
Unit Function
Inputs/outputs SHDSL signals and completes the conversion
Interface Unit
between E1 signals and SHDSL signals.
Mapping/ De-
Performs the mapping/de-mapping of four E1 signals.
mapping Unit
Implements the conversion between traffic buses, the relay
Multiplexing/ overlay of up/down traffic buses.
De-
multiplexing It also performs the de-framing of E1 signals in the up
Unit direction when the framing function is enabled, and the
retiming of E1 signals.
Microprocessor Performs the functions of system configuration, monitoring
Unit and management.
Front Panel
The front panel of the SDB board is shown in Figure 45.
FIGURE 45 F RONT P ANEL OF THE SDB BOARD
156.7mm
20.6mm
1 2 3 4 5 6 7
Table 55 describes the components on the front panel of SDB board.
T ABLE 55 COMPONENTS ON THE FRONT P ANEL OF S DB BOARD
Captive
fastener


2 Ejector lever
Yellow indicator
Interface Used to indicate whether the interface has any alarm.
3 alarm
indicator  ON: Some alarm occurs in the interface.
 OFF: No alarm occurs in the interface.
Four SHDSL interfaces are available on the front

panel, identified with PORT1, PORT2, PORT3 and
PORT4 respectively from left to right.
Connector type: 8P8C angle PCB welding shielded
RJ45 socket with LED
SHDSL
4 Each RJ45 socket has eight metal contact sheets
interface
numbered from left to right. The 4th and 5th metal
sheets correspond to A and B lines of SHDSL interface.
The other metal sheets are impending.
The cable used to connect SHDSL interface is a special
cable equipped with RJ45 plug.
Green indicator
Line Used to indicate whether the interface is connected.
5 connection
indicator  ON: The interface is connected.
 OFF: The interface is not connected.
Green indicator
Running
Used to indicate the running status of the SDB board.
6 indicator
(RUN) Flickering regularly (once per second): The SBD board
runs normally.
Red indicator
Alarm Used to indicate alarms in the SDB board.
7 indicator
(ALM)  OFF: The SBD board runs normally.
 ON: Some alarm occurs in the SBD board.

Chapter 3
Technical Specifications
 Dimensions and weight of ZXMP S200 and its components

 Power supply requirements
 Environment requirements, including
 Grounding and lightning protection requirements
 Temperature and humidity requirements
 Cleanness requirements
 Application environment requirements
 Earthquake proof performance
 Reliability Indexes
 Electromagnetic compatibility (EMC) indexes
 Eye pattern of optical launched signals
 Technical specifications of optical interfaces and electrical interfaces
 Clock timing and synchronization
 Bit error indexes
 Protection switching time
 Compliant recommendations and standards of interfaces

Dimensions & Weight

Table 56 lists the dimensions and weight of ZXMP S200 and its
components.
T ABLE 56 DIMENSIONS & WEIGHT OF COMPONENTS IN ZXMP S200
Dimension Weight
Equipment/Module
(H × W × D, mm) (kg)
ZXMP S200 subrack 49.5 (height) × 442.5 (width) × 240.0 2.900[Note
(installed in cabinet) (depth) 1]
ZXMP S200 subrack

(installed on the 49.5 (height) × 482.6 (width) × 240.0 3.000
desktop or hung on (depth) [Note 2]
the wall)
Fan module PCB: 39 (width) × 27.2 (depth)× 229.9
(height)
Total: 44.5 (height) x 33.1 (width) x 229.9
0.154
(depth)
Panel: 44.5 (height) x 33.1 (width) x 16.8
(depth)
Dustproof module 44.5 (height) × 4.5 (width) × 226.0
-
(depth)
Backplane PCB: 418.5 (width) x 38.3 (depth)ｘ３.0
-
(height)
PWA/PWB/PWC PCB: 76 (width) x 210 (depth) x 2 (height)
Total:
40.1 (height) x 84.5 (width) x 206 (depth)
(ejector lever not counted)
(ejector lever counted)
Panel: 40.1 (height) x 84.5 (width) x 12.3
(depth)
Main board PCB: 306 (width) x 200 (depth) x 2

(height)
Panel: 40.1 (height)ｘ319.1 (width) x 25 Refer to
(depth) (the length of captive screw not Table 58.
counted)
40.1 (height) ｘ 319.1 (width) x 12.3
(depth) (the length of captive screw
counted)
Plug-in boards PCB: 149 (width) x 200 (depth) x height)
Panel:
( the depth of captive screw counted)
20.6 (height) x 156.7 (width) x 12.3
(depth) ( the depth of captive screw not
counted)

Chapter 3 Technical Specifications
Note 1: The weight of subrack includes that of the backplane. And the subrack
dimensions include those of the removable feet washer. When installing the
subrack in the cabinet, remove the feet washer if necessary.
Note 2: Refer to the subrack that is installed in ZTE transmission cabinet, IEC
standard cabinet or hung on the wall. The weight of subrack includes that of both
backplane and installation hug. The dimensions include those of removable feet
washer.
Power Supply Requirements

Voltage Range
ZXMP S200 supports three kinds of power supply:
 -48 V DC power supply (PWA)

 +24 V DC power supply (PWB)
 110 V/220 V AC power supply (PWC)
Table 57 lists the allowable fluctuation range for each kind of input voltage.
T AB L E 5 7 AL L O W AB L E V O L T AG E F L U C TU AT I O N R AN G E O F Z X M P S 2 0 0
Power Module Input Voltage Fluctuation Range

PWA -48 V DC -72 V to -36 V
PWB +24 V DC +18 V to +36 V
PWC 110 V/220 V AC 90 V to 290 V, 45 Hz to 65 Hz
Power Consumption and Weight

Table 58 lists the power consumption and the weight of each board.
T AB L E 5 8 P O W E R C O N S U M P T I O N AN D W E I G H T O F E AC H B O AR D AV AI L AB L E F O R Z X M P
S200
Max. Power
Max. Power
Consumptio
Consumption Weig
n under
Board Code under High ht Remark
Normal
Temperature (kg)
Temperatur
(45℃)(W)
e (25℃)(W)
SMBxD75E0 17.33 17.85 0.830

Descriptio
SMBxD75T0 18.83 19.39 0.830 ns of the
SMB main main
SMBxF75E0 19.50 20.09 0.870
board board
SMBxF75T0 19.54 20.13 0.870 refer to
Table 10.
SMBxD120E 18.50 19.06 0.830

Max. Power
Max. Power
Consumptio
Consumption Weig
n under
Normal
Temperature (kg)
Temperatur
(45℃)(W)
e (25℃)(W)
0
SMBxD120T
19.50 20.09 0.830
0
SMBxF120E
19.84 20.44 0.790
0
SMBxF120T
20.18 20.79 0.870
0
SMBxD100E
17.49 18.01 0.830
0
SMBxD100F
19.17 19.75 0.830
0
SMBxF100E
19.17 19.75 0.870
0
SMBxF100F
19.84 20.44 0.870
0
SMCxD75E 19.50 20.09 0.760
SMCxF75E 20.85 21.48 0.800
SMCxD75T 20.18 20.79 0.760
SMCxF75T 21.52 22.17 0.800
SMCxD120E 19.17 19.75 0.760 Descriptio
ns of the
SMC main SMCxF120E 19.84 20.44 0.800 main
board SMCxD120T 19.84 20.44 0.760 board
refer to
SMCxF120T 20.51 21.13 0.800 Table 10.
SMCxD100E 19.92 20.52 0.760
SMCxF100E 20.70 21.32 0.800
SMCxD100T 21.07 21.70 0.760
SMCxF100T 21.85 22.51 0.800
2 M bit/s BITS
BITS interface
IBB 0.43 0.44 0.020
interface board
board installed
on the
PCB of
2 MHz the main
BITS board
IBBZ 0.43 0.44 0.025
interface provides
board the clock
interface.
-48 V PWA Efficiency
power 7.49 7.71 0.718 of PWA
board ≥75%

Max. Power
Max. Power
Consumptio
Consumption Weig
n under
Normal
Temperature (kg)
Temperatur
(45℃)(W)
e (25℃)(W)
Efficiency
+ 24 V
of
power PWB 8.14 8.38 0.700
PWB≥72
board
%
Efficiency
110 V/220
of
V power PWC 9.11 9.38 0.710
PWC≥70
board
%
2-channel
V.35 data V35B 2.21 2.28 0.250 -
board
21-
channel E1
electrical ET1-75 8.69 8.95 0.294 -
tributary
board (75
ohm)
21-
channel E1
electrical
ET1-120 8.70 8.96 0.290 -
tributary
board (120
ohm)
21-
channel T1
electrical
TT1-100 11.28 11.62 0.300 -
tributary
board (100
ohm)
3-channel
E3/T3
electrical EIE3 2.16 2.20 0.290 -
interface
board
4-channel
transparen
t-
transmissi
on fast TFEx4 0.86 0.89 0.220 -
Ethernet
electrical
interface
board
4-channel The types
transparen of the
t- TFEx4B 2.59 2.67 0.294 optical
transmissi module
on fast are S-1.1,

Max. Power
Max. Power
Consumptio
Consumption Weig
n under
Normal
Temperature (kg)
Temperatur
(45℃)(W)
e (25℃)(W)
Ethernet L-1.1 or
optical L-1.2,
interface and the
board LC/PC
optical
interfaces
are
adopted.
Orderwire
OW 3.50 3.61 0.282 -
board
Audio
AI 1.78 1.83 0.368 -
board
4xFE
enhanced
smart SEC 9.60 9.89 0.270 -
Ethernet
board
SHDSL
interface SDB 3.94 4.06 0.300 -
board
Fan
FAN 3.46 3.56 0.154 -
module
The overall power consumption of ZXMP S200 depends on its configuration.
 If SMB main board is equipped, Table 59 lists the power consumption

for the typical configuration of ZXMP S200, and Table 60 lists the
maximum power consumption of ZXMP S200.
T ABLE 59 POWER CONSUMPTION FOR THE TYPIC AL CONFIGURATION OF ZXM P S200

(SMB)
Component Name Component ID Unit Number

ZXMP S200 subrack (including fan - Set 1
module and motherboard)
System Main Board with Four optical SMBxF75T0 Piece 1
interfaces and Twenty-one 75 Ω E1
interfaces
Fan module FAN Set 1
-48 V power module PWA Piece 1
2 Mbit/s BITS interface board IBB Piece 1
Total power consumption (w) 29.96

T ABLE 60 M AXIMUM POWER CONSUMPTION OF ZXM P S200 (SM B)

System Main Board with Four optical SMBxF120T0 Piece 1
interfaces
21-channel E1 electrical tributary ET1-75 Piece 1

board (75 ohm)
 If SMC main board is equipped, Table 61 lists the power consumption

for the typical configuration of ZXMP S200, and Table 62 lists the
maximum power consumption of ZXMP S200.
T ABLE 61 POWER CONSUMPTION FOR THE TYPIC AL CONFIGURATION OF ZXM P S200

(SMC)

System Main Center with Four optical SMCx75T Piece 1
interfaces
T ABLE 62 M AXIMUM POWER CONSUMPTION OF ZXM P S200 (SM C)

System Main Center with Four optical SMCxF120T Piece 1
interfaces


21-channel E1 electrical tributary ET1-75 Piece 1

board (75 ohm)
Environment Requirements
The environment requirements of ZXMP S200 include:
 Grounding and lightning protection requirements

 Temperature and humidity requirements
 Cleanness requirements
 Application environment requirements
Grounding and Lightning Protection

Requirements
Requirements for Grounding System in Equipment Room
 All PCBs of boards and the cover of ZXMP S200 must be connected to
the protection ground in the equipment.
 If the equipment room adopts the joint grounding mode, the following
requirements should be met:
 The grounding resistance of the central equipment room should be
no more than 1 Ω.
 The grounding resistance of a far-end equipment room should be
no more than 5 Ω.
 If the equipment room adopts the independent grounding mode, the
grounding resistances should meet the requirements in Table 63.
T ABLE 63 GROUNDING RESISTANCE REQUIREMENTS IN I NDEPENDENT GROUNDING

MODE
Grounding Resistance Value (Ω)

AC working ground resistance ≤4
DC working ground resistance ≤4
Security protection ground resistance ≤4

Grounding Resistance Value (Ω)

Lightning protection ground resistance ≤4
 Copper busbar with cross section area of no less than 120 mm2 should
be used as earth busbar or earth bar. Galvanized flat steel with the
dimensions equal to or more than 40 mm×4 mm can also be used.
 Be sure to use copper flanges, bolts and spring washers to fasten the
connections between equipment grounding cables and the earth busbar
or earth bars. One bolt can only be used to connect one grounding
cable. Determine the joint grounding cable size and the number of
screws according to the quantity of equipment’s grounding cables in
the equipment room.
Requirements for Grounding and Lightning Protection of

Power Supply
Table 64 lists typical power supply lightning protection classes.
T ABLE 64 TYPICAL POWER SUPPLY LIGHTNING P ROTECTION CLASSIFIC ATION
Location of Lightning Protection

Class Parameter
Circuit
Class B 40 kA (8 μs /20 μs) AC power distribution board/unit
Class C 20 kA (8 μs/20 μs) DC power cabinet
6000 V (combination
Class D -48 V power rectifier
wave)
ZXMP S200 must meet the following power supply lightning protection
requirements.
 A central equipment room should meet the following lightning

protection requirements:
 AC power cables should be led into the cable vault or power room
underground.
 Install Class B lightning protection unit in the AC power distribution
board/unit or at the entrance of it. The unit is grounded by
connecting the floor earth bar through the AC power distribution
board/unit.
 Install Class C lightning protection unit in the DC power cabinet,
being grounded by connecting the floor earth bar through the DC
power cabinet.
 Install Class D lightning protection unit in the rectifier, being
grounded by connecting the floor earth bar through the rectifier
and the DC power cabinet.
 A far-end equipment room should meet the following lightning
protection requirements:
 AC power cables should be led into the far-end equipment room
underground.

 Connect Class B lightning protection unit to the protection

grounding bar in the equipment room through the AC power
distribution board/unit.
Connect Class C lightning protection unit to the protection
grounding bar in the equipment room through the DC power
cabinet.
Connect Class D lightning protection unit to the protection
grounding bar in the equipment room through the rectifier and the
DC power cabinet.
 Connect the -48 V ground of the DC power cabinet to the working
grounding bar in the equipment room.
If there is no working grounding bar in the equipment room,
connect it to the protection grounding bar instead.
Figure 46 illustrates the connection for power supply lightning
protection in a far-end equipment room.
FIGURE 46 P OWER S UPPLY LIGHTNING PROTECTION CONNECTION IN A F AR-END

EQUIPMENT ROOM
DC Power Cabinet
AC Power Distribution
Board/Unit
-48V
AC DC
-48V GND
Class B Class C
Working Grounding Bar

Protection Grounding Bar
 Since the AC power distribution board/unit and the DC power

cabinet in the same equipment room, the distance between Class B
and Class C lightning protection units should meet the following
decoupling distance requirements:
When the protection grounding bar is laid independently, the
distance between Class B and Class C lightning protection units
should no less than 5 m.
When the protection grounding bar and the power cords are laid in
parallel, the distance between Class B and Class C lightning
protection units should no less than 15 m.
If the required decoupling distance can not be satisfied due to some
restriction in the equipment room, additional decoupling
inductance(s) should be installed before the Class C lightning
protection unit by 1.5μH/m.
 Bunched copper wires with cross section area no less than 35 mm 2
should be used as the grounding cables of the Class B lightning

protection unit (AC power distribution board/unit), and the

protection grounding cables and working grounding cables of the
Class C lightning protection unit (DC power cabinet), which are
connected to the protection grounding bar in the equipment room.
Keep the length of grounding cables as short as possible.

ZXMP S200
 The requirements for the lightning protection of subrack, indoor
cabinet and transmission outdoor cabinet where ZXMP S200 is installed
are as follows:
 For ZXMP S200 installed in an indoor cabinet or transmission
outdoor cabinet, its protection grounding wire should be connected
to the protection grounding busbar in the cabinet.
For the indoor cabinet and transmission outdoor cabinet, their
protection grounding adopt bunched copper wires whose cross
section area is no less than 16 mm2. The protection grounding
wires are connected to the earth busbar or earth bar (including
column-head power cabinet).
 If the equipment uses DC power supply, its protection ground
should be short circuited with the ground of DC power supply and
then connected to the protection grounding busbar in the indoor
cabinet or transmission outdoor cabinet.
 It is forbidden to lead the protection grounding wire of the
equipment out of the cabinet and connect it to the earth busbar or
earth bar (including column-head power cabinet) in the equipment
room directly.
 The requirements for the lightning protection of ZXMP S200 installed
on desktop or mounted on wall are as follows:
 If ZXMP S200 uses DC power supply, short circuit its protection
ground with the ground of DC power supply first, and then connect
it to the earth busbar or earth bar (including column-head power
cabinet) in the equipment room with bunched copper wires with
cross section area no less than 4 mm2.
 For the wall-mounted ZXMP S200, it should be mounted on the
inner wall of the equipment room. Keep the expansion screws used
to fix the brackets away from reinforcing steel bars inside the wall
as far as possible.

Other Equipment
 Implement strict equipotential connections among equipment
connected to ZXMP S200, such as DC power cabinet, switch and digital
distribution frame (DDF).

 The protection grounds of DC power cabinet, switch and DDF should be

connected to the earth busbar in the equipment room with bunched
copper wires with cross section area no less than 35 mm 2.
 Other metal equipment and components in the equipment room, such
as the monitoring unit, metal door and windows and AC power
distribution unit, should be connected to the nearby earth busbar in
the equipment room with bunched copper wires with appropriate cross
section area.
 Before being led into a central equipment room, external optical cables
in the cable vault must be connected to the earth busbar through lead-
in connection devices.
 In a far-end equipment room, external optical cables must be
connected to the protection grounding busbar or outdoor lightning
protection ground through optical termination box, which is connected
to the protection grounding busbar or earth network with bunched
copper wires with cross section area no less than 16 mm 2.
Temperature/Humidity Requirements
ZXMP S200 should operate in the environment meeting the following
temperature and humidity requirements, as listed in Table 65.
T ABLE 65 TEMPER ATURE AN D HUMIDITY REQUIREMENTS OF ZXM P S200
Item Requirement
Working temperature (on the desktop, in the indoor
-5°C to +50°C
cabinet or on the wall)
Working temperature (in the outdoor functional
-5°C to +45°C
cabinet)
Working temperature (in the field power supply
-40°C to +45°C
cabinet)
Performance-guaranteed
10% to 95%
Relative humidity index
Operation-guaranteed index 5% to 95%
Cleanness Requirements
The cleanliness represents the requirement for the dust and harmful gas in
the air. The equipment room where ZXMP S200 works should meet the
following cleanliness requirements.
 There is no explosive, conductive, magnetic-conductive and corrosive

dust in the equipment room.
 The concentration of dust with dimension above 5 µm should be no
more than 3×104 particles/m3.
 There is no harmful gas which may destroy metal and insulation, such
as SO2, NH3, H2S and NO2.

Table 66 lists the requirements for the concentration of harmful gas in

the equipment room.
T ABLE 66 REQUIREMENTS FOR CONCENTRATION OF H ARMFUL G AS IN EQUIPMENT

ROOM
Concentration
Harmful Gas
Average (mg/m3) Maximum (mg/m3)
SO2 <0.2 <1.5
H2S <0.006 <0.03
NO2 <0.04 <0.15
NH3 <0.05 <0.15
Cl2 <0.01 <0.3
 Keep the equipment room clean, and confirm that the door and
windows are sealed.
Application Environment Requirements

According to China national standard GB/T 4798 and the application scope
of ZXMP S200, the application environment requirements are listed in
Table 67.
T AB L E 6 7 AP P L I C AT I O N E N V I R O N M E N T R E Q U I R E M E N T S O F Z X M P S 2 0 0
Application Environment Condition Class Time Limit

Storage 1K5/1Z1/1B2/1C2/1S3/1M3 180 days
Transportation 2K4P/2B2/2C2/2S3/2M3 30 days
Use 3K5/3Z2/3Z7/3B2/3C2/3S2/3M3 20 years
Note: For the meaning of the environment class in the above table, please refer to
the China national standard GB/T 4798 Environmental Conditions Existing in the
Application of Electric and Electronic Products, which is an equivalent standard of
IEC 60721.
Earthquake-Proof Performance
The earthquake proof performance meets the requirements specified in
the following China standards for telecommunication industry:
 YD 5091-2000 Specification for Seismic Test of Optical Transmissions

Equipment
 YD 5083-99 Specification for Seismic Test of Telecommunications
Equipment
ZXMP S200 meets the requirements during the seismic test with the
magnitude 8.

Reliability Indexes
The reliability indexes of ZXMP S200 are listed in Table 68.
T ABLE 68 RELIABILITY INDEXES OF ZXM P S200
Item Index
Mean Time Between Failures (MTBF) ≥ 20000 hours
Mean Time Between Critical Failures (MTBCF) ≥ 40000 hours
Service life ≥ 20 years
Electromagnetic Compatibility
Criterion
 Performance A
 At digital signal ports: The equipment operates normally under the
test. After each single disturbance, the bit error count does not
exceed the bit error number allowed during normal operation. For
ZXMP S200, the allowable bit error number is zero, which means no
bit error occurs.
 At analog audio signal ports: Continuous connections are kept
under the test. The noise measured with 600 Ω impedance from
the equipment under test does not exceed -40 dBm.
 Performance B
 At digital signal ports: Temporary function degradation caused by
the disturbance occurs under the test. However, the function of
equipment recovers automatically after the disturbance being
cancelled. Under the disturbance, there is no loss of the frame
queue and synchronization. No alarm occurs after electromagnetic
disturbance.
 At analog audio signal ports: Continuous connections are kept
under the test. The connection interruption is allowable under the
surge test. After the disturbance finishes, the performance of
equipment under test should recover.
 Performance C
Temporary function degradation caused by the disturbance occurs
under the test. After the disturbance being cancelled, the function of
equipment can recover automatically, or recover after being reset
manually.

Immunity Performance
 Electrostatic discharge (ESD) immunity
It complies with the standard of IEC61000-4-2.
Table 69 shows the ESD immunity indices.
T ABLE 69 ESD I MMUNITY INDICES
Contact Discharge Air Discharge Examination Criterion

6 kV 8 kV Performance B
 Radiated Susceptibility (RS)

The radiated susceptibility of ZXMP S200 complies with the standard
IEC61000-4-3, as listed in Table 70.
T ABLE 70 R ADIATED SUSCEPTIBILITY I NDICES
Frequency Range: 80 MHz - 1000 MHz, 1.4 GHz – 2 GHz

Electric Field
Amplitude Modulation Criterion
Intensity
10 V/m 80% AM at 1 kHz rate Performance A
 Electrical Fast Transient (EFT) immunity

The EFT immunity of ZXMP S200 complies with the standard
IEC60001-4-4.
Table 71 lists the EFT immunity indices on DC power supply ports.
T ABLE 71 EFT IMMUNITY I NDICES ON DC P OWER S UPPLY PORTS
Voltage Repetition Criterion

Generator Waveform
Rate
5 ns/50 ns ±1 kV 5 kHz Performance B
Table 72 lists the EFT immunity indices on signal and control ports
(with capacitive coupling clamp).
T ABLE 72 EFT IMMUNITY I NDICES ON SIGNAL AND CONTROL PORTS
Voltage Repetition Criterion

Generator Waveform
Rate

Table 73 lists the EFT immunity indices on AC power supply ports

(direct coupling).
T A B L E 7 3 E F T I M M U N I T Y I N D I C E S O N AC P O W E R S U P P L Y P O R T S
Generator Waveform Repetition Criterion

Voltage
Rate
 Lightning strike and surge immunity

The lightning strike and surge immunity of ZXMP S200 complies with
the standard IEC61000-4-5.
Table 74 lists the lightning surge immunity indices of DC power supply.
T ABLE 74 DC POWER SUPPLY L IGHTNING SURGE I MMUNITY INDICES
Generator Waveform: 1.2 μs/50 μs (8 μs/20 μs)

Test Mode Source Test Voltage Criterion
Impedance
Line to line 2Ω ±1 kV Performance B
Line to ground 12 Ω ±2 kV Performance B
Table 75 lists the lightning surge immunity indices of AC power supply.
T A B L E 7 5 AC P O W E R S U P P L Y L I G H T N I N G S U R G E I M M U N I T Y I N D I C E S

Impedance
Line to line 2Ω ±2 kV Performance B
Table 76 lists the surge immunity indices of outdoor signal line.
T ABLE 76 OUTDOOR SIGN AL LINE SURGE IMMUNITY I NDICES
Generator Waveform: 10 μs/700 μs

Impedance
Table 77 lists the surge immunity indices of signal line with length
more than 10 m.

T ABLE 77 SIGNAL L INE SURGE I MMUNITY INDICES

Impedance
 Conducted Susceptibility (CS)

The conducted susceptibility of ZXMP S200 complies with the standard
IEC61000-4-6, as listed in Table 78.
T ABLE 78 CONDUCTED SUSCEPTIBILITY INDICES
Frequency Range: 0.15 MHz - 80 MHz

Test Intensity Amplitude Modulation Criterion
3V 80% AM at 1 kHz rate Performance A
 AC voltage transient dropout immunity

This item is only applicable to the PWC board when AC power is
supplied to ZXMP S200. The immunity satisfies the standard IEC1000-
4-11.
Table 79 lists the AC voltage transient dropout immunity indices of the
PWC board.
T A B L E 7 9 AC V O L T A G E T R A N S I E N T D R O P O U T I M M U N I T Y I N D I C E S
Dropout Ratio Duration (ms) Criterion

30% 10 Performance B
30% 500 Performance C
60% 100 Performance C
>95% 50 Performance B
>95% 5000 Performance C
Disturbance Characteristics
Disturbance characteristics include conducted emission characteristic and
radiated emission characteristic.
The corresponding indices of ZXMP S200 satisfy the Class B specified in

the standard CISPR 22.
 Conducted emission
Table 80 lists the conducted emission indices at DC/AC power ports.

T A B L E 8 0 C O N D U C T E D E M I S S I O N I N D I C E S AT D C / AC P O W E R P O R T S
Voltage (dB μV)

Frequency Range (MHz)
Quasi-peak Average
0.15 - 0.5 79 66
0.5 - 30 73 60
Table 81 lists the conducted emission indices at communication/control

ports.
T ABLE 81 CONDUCTED E MISSION INDICES AT COMMUNICATION/ CONTROL PORTS
Frequency Range Voltage (dB μV) Current (dB μA)

(MHz) Quasi-peak Average Quasi-peak Average
0.15 - 0.5 97 – 87 84 - 74 53 - 43 40 - 30
5 - 30 87 74 43 30
 Radiated emission
Table 82 lists the radiated emission indices of ZXMP S200.
T ABLE 82 R ADIATED EMISSION I NDICES OF ZXM P S200
Quasi-Peak Limit (dB μV/m)

Frequency Range (MHz)
Test Distance: 10 m Test Distance: 3 m
30 - 230 40 50
230 - 1000 47 57
Eye Pattern of Optical Launched

Signals
The eye patter of ZXMP S200 meets the specification in ITU-T G957, as
shown in Figure 47.

FIGURE 47 E YE P ATTERN OF OPTICAL L AUNCHED SIGNALS
1＋y1
Mean level of
1
logical "1"
y2
Amplitude
0.5
y1
Mean level of
0
logical "0"
-y1
x1 x2 x3 x4 1
UI
Time
Table 83 lists the parameters specifying the eye diagram.
T ABLE 83 P AR AMETERS OF TRANSMITTING SIGN AL E YE P ATTERN
 Value
 Parameter
 STM-1  STM-4
x1/x4 0.15/0.85 0.25/0.75
x2/x3 0.35/0.65 0.40/0.60
y1/y2 0.20/0.80 0.20/0.80
Optical Interfaces Specifications

Table 84, Table 85, Table 86 and Table 87 list the specifications of optical
interfaces in ZXMP S200.
T ABLE 84 SPECIFICATIONS OF S TM -1 OPTIC AL INTERFACES
Performance Performance
Unit Specification
type item
Code pattern Line code pattern - Scrambled NRZ code
Nominal rate kbps 155 520
Optical module - S-1.1 L-1.1 L-1.2
1261 1280 1480
Operating wavelength range nm
-1360 -1335 -1580
Transmission distance km ≤15 ≤40 ≤80
Maximum mean optical launched
dBm -8 -8 0
power
Minimum mean optical launched
dBm -15 -15 -5
power

Performance Performance
Unit Specification
type item
Worst sensitivity dBm -28 -34 -34
Minimum extinction ratio dB 8.2 10 10
Minimum overload point dBm -8 -8 -10
0.50 (the filter for testing: 500
UI
Hz-1.3 MHz)
Output jitter
UI
kHz-1.3 MHz)
Meets the requirement for STM-1
Input jitter and wander
- level network interface specified in
tolerance
ITU-T G.825
Maximum frequency
offset of optical input ppm ±20 ppm
interface
Maximum AIS rate offset
of optical output - Rate offset within ±20 ppm
interface
1. The line code pattern of optical interfaces complies with the specification about
the synchronous scrambler in ITU-T G.707.
2. For STM-1 interface, 1 UI=6.43 ns
3. 1 ppm=1×10-6
Table 85 lists the specification of STM-4 optical interfaces in ZXMP S200.
T ABLE 85 SPECIFICATION OF S TM -4 OPTICAL INTERF ACES
Parameter
Performance item Unit Specification
type
Code pattern Line code pattern - Scrambled NRZ code
Nominal rate kbps 622 080
Optical module - S-4.1 S-4.1 S-4.1
1261 1280 1480

Operating wavelength range nm
-1360 -1335 -1580
Transmission distance km ≤15 ≤40 ≤80

Maximum mean optical launched
dBm -8 2 2
power
Minimum mean optical launched
dBm -15 -3 -3
power
Worst sensitivity dBm -28 -28 -28
Minimum extinction ratio dB 8.2 10 10
Minimum overload point dBm -8 -8 -8
UI
Output jitter Hz- 5 MHz)
UI 0.10 (the filter for testing: 250

Parameter
Performance item Unit Specification
type
kHz-5 MHz)
Meets the requirement for STM-1,
- STM-4 level network interface
tolerance
specified in ITU-T G.825
Maximum frequency offset of
ppm ±20
optical input interface
Maximum AIS rate offset of
- Rate offset within ±20 ppm
optical output interface
1. The line code pattern of optical interfaces complies with the specification about
the synchronous scrambler in ITU-T G.707.
2. 1 UI=1.61 ns
3.1 ppm=1×10-6
T ABLE 86 S PECIFIC ATION S OF S TM -4 SINGLE F IBER WITH DU AL DIRECTIONS OPTIC AL

INTERF ACES
Items Unit Performance Specifications

Module Name - Optical module A Optical module B achieving
achieving the the application of single
application of single fiber with bi- direction
fiber with bi- direction
Transmission km 20 20
distance
Transmitting nm 1550 1310
optical wavelength
Receiving optical nm 1310 1550
wavelength
Mean outputting dBM -15 - -8 -15 - -8
optical power
Receiver dBm ≤ -28 ≤ -28
sensitivity
Module A and module B should work cooperatively. For example, in order to
achieve the application of single fiber with bi-direction, if a site uses the optical
module A (or optical module B), then the opposite site should use the optical
module B (or optical module A) correspondingly.
T ABLE 87 S PECIFIC ATION S OF 100 M BIT/ S E THERNET OPTIC AL INTERFACES

Module Name - 100Base-FX, multiple 100Base-FX, single
mode mode
Transmission km 2 15
distance
Mean launched dBM -15 - -8 -15 - 0
optical power
Minimum dB 8.2 10
extinction ratio


Receiver dBm ≤ -28 ≤ -28
sensitivity
Receiver overload dBm -8 -10
optical power
Electrical Interfaces
Specifications
Specification of STM-1 Electrical
Interfaces
Table 89 lists the specifications of STM-1 electrical interfaces.
T ABLE 88 S PECIFIC ATION S OF S TM -1 ELECTRICAL INTERFACES
Parameter Specification
Nominal rate 155520 kbit/s
Code pattern CMI [Note 1]
Allowable attenuation at
output port (square-root 0-12.7 dB, 78 MHz
attenuation)
Allowable frequency offset
> ±20 ppm[Note 2]
at input port
Bit ratio tolerance at output
< ±20 ppm
port
Mapping jitter at tributary f1-f4: 0.4UI

port f3-f4: 0.075UI
Combined jitter Meets the requirement specified in ITU-T G.783
Pulse shape at output port Complies with the mask specified in ITU-T G.703
Test load impedance 100 Ω
Meet the requirement specified in ITU-T G.824
tolerance
[Note 1]: CMI: Code Mark Inversion
[Note 2]: 1 ppm= 10-6, for 1544 kbit/s interface, 1UI=648 ns.
Specification of E1 Electrical Interfaces

Table 89 lists the specifications of E1 electrical interfaces.

T ABLE 89 S PECIFIC ATION S OF E1 E LECTRIC AL INTERFAC ES
Nominal rate 2 048 kbit/s
Code pattern HDB3 [Note 1]
input port (square-root 0-6 dB, 1024 kHz
attenuation)
> ±50 ppm [Note 2]
at input port
< ±50 ppm
port
f1 High-pass, 20 Hz, 20 dB/dec
Filter
f3 High-pass, 18 kHz, 20 dB/dec
characteristic
f4 Low-pass, 100 kHz, -60 dB/dec
Mapping jitter at output f1-f4: 1.5UI [Note 3]

port f3-f4: 0.2UI

port f3-f4: 0.075UI
Test load impedance 75 Ω or 120 Ω
Anti-interference capability
18 dB
at input port (SNR)
tolerance
Output 51 kHz to 102 kHz, ≥6 dB

port 102 kHz to 3072 kHz, ≥8 dB
Reflectance
attenuation 51 kHz to 102 kHz, ≥12 dB
Input port 102 kHz to 2048 kHz, ≥18 dB
2048 kHz to 3072 kHz, ≥14 dB
[Note 1]: HDB3: High Density Bipolar of order 3
[Note 2]: 1 ppm= 10-6
[Note 3]: 1UI=488 ns
Specification of T1 Electrical Interfaces

Table 90 lists the specification of T1 electrical interfaces.
T ABLE 90 SPECIFICATION OF T1 ELECTRICAL INTERFAC ES
Code pattern AMI, B8ZS

input port (square-root 0-6 dB, 772 kHz
attenuation)
> ±32 ppm
at input port
Bit ratio tolerance at
< ±32 ppm
output port
Filter
f3 High-pass, 8 kHz, 20 dB/dec
characteristic
f1-f4: 5.0UI
Jitter at output port
f3-f4: 0.1UI

port f3-f4: 0.1UI
tolerance
Note:
1. AMI: Alternate Mark Inversion; B8ZS: Bipolar with 8-Zero Substitution
2. 1 ppm= 10-6
3. 1UI=648 ns
Specification of E3 Electrical Interfaces

The specification of E3 electrical interfaces is listed in Table 91.
T ABLE 91 SPECIFICATION OF E3 E LECTRIC AL INTERFAC ES
Code pattern HDB3 [Note 1]
Allowable attenuation at output
0-12 dB, 17 184 kHz
port (square-root attenuation)
Allowable frequency offset at
> ±20 ppm [Note 2]
output port
Bit ratio tolerance at output port < ±20 ppm
Filter characteristic f3 High-pass, 10 kHz, 20 dB/dec
Jitter at output port f1-f4: 1.5UI [Note 3]

f3-f4: 0.15UI
f1-f4: 0.4UI
Mapping jitter at tributary port
f3-f4: 0.1UI
Meets the requirement specified in ITU-T
Combined jitter
G.783
Complies with the mask specified in ITU-T
Pulse shape at output port
G.703
Anti-interference capability at
20 dB
input port (SNR)
Meets the requirement specified in ITU-T
Input jitter and wander tolerance
G.823
860 kHz to 1720 kHz, ≥6 dB
Output port
1720 kHz to 51550 kHz, ≥8 dB
Reflectance
attenuation 860 kHz to 1720 kHz, ≥12 dB
Input port 1720 kHz to 34368 kHz, ≥18 dB
34368 kHz to 51550 kHz, ≥14 dB
[Note 1]: HDB3: High Density Bipolar of order 3
[Note 2]: 1 ppm= 10-6
[Note 3]: 1UI=29.1 ns
Specification of T3 Electrical Interfaces

The specification of T3 electrical interfaces is shown in Table 92.
T ABLE 92 SPECIFICATION OF T3 ELECTRICAL INTERFAC ES
Code pattern B3ZS [Note 1]
output port (square-root 0-20 dB, 22 368 kHz
attenuation)
> ±20 ppm [Note 2]
at output port
< ±20 ppm
port
Filter characteristic f3 High-pass, 30 kHz, 20 dB/dec
f1-f4: 5.0UI [Note 3]
Jitter at output port
f3-f4: 0.1UI


port f3-f4: 0.1UI
Meets the requirement specified in ITU-T G.824
tolerance
[Note 1]: B3ZS: Bipolar with 3-Zero Substitution
[Note 2]: 1 ppm= 10-6
[Note 3]: 1UI=22.4 ns
Clock Timing & Synchronization

The clock timing and synchronization specifications of ZXMP S200,
complying with ITU-T G.813, are as follows:
 Output jitter
The output jitter does not exceed 0.05UI peak-peak when measured by
the interval of 60s through a single pole band-pass filter with corner
frequencies at 20 Hz and 100 kHz, where 1UI equals to 488 ns.
 Excursion transfer characteristic
In the pass band range from 1 Hz to 10 Hz, the phase gain is smaller
than 0.2 dB.
 Free oscillation output frequency deviation: < 4.6 ppm, where 1 ppm
equals to 1×10-6.
 Pull-in and pull-out range: ≥ 4.6 ppm, where 1 ppm equals to 1×10-6.
 Wander in locked mode
Table 93 and Table 94 list the mean time interval error (MTIE) limit
and time deviation (TDEV) limit respectively.
T ABLE 93 M TIE LIMIT IN L OCKED M ODE (WITH CONSTAN T TEMPER ATURE )
Observation Interval τ (s) MTIE Limit (ns)

0.1 < τ ≤ 1 40
1 < τ ≤ 100 40τ0.1
100 < τ ≤ 1000 25.25τ0.2
T ABLE 94 M TIE LIMIT IN L OCKED M ODE (WITH TEMPERATURE EFFECTS)

τ ≤ 100 0.5τ


τ > 100 50
T ABLE 95 TDEV L IMIT IN L OCKED M ODE (WITH CONSTANT TEMPERATURE)
Observation Interval τ (s) TDEV Limit (ns)

0.1 < τ ≤ 25 3.2
25 < τ ≤ 100 0.64τ0.1
100 < τ ≤ 1000 6.4τ0.2
Bit Error Performance

ZXMP S200 reports no bit error in continuous 24 hours.
Protection Switching Time

The protection switching time of ZXMP S200 is less than 50 ms.
Compliant Standards of
Interfaces
Table 96 lists the standards which the interfaces of ZXMP S200 comply
with.
T ABLE 96 S TAND ARDS OF I NTERF ACES P ROVIDED BY ZXMP S200
Interface Standard Remark
Network node interface for the

ITU-T G.707
synchronous digital hierarchy (SDH)
Optical interfaces Optical interfaces for equipments and
at ITU-T G.957 systems relating to synchronous digital
 155520 kbit/s hierarchy (SDH)
 622080 kbit/s
The control of jitter and wander within
ITU-T G.825 digital networks which are based on the
synchronous digital hierarchy(SDH)
Physical/electrical characteristics of
ITU-T G.703
Electrical interface hierarchical digital interfaces
(155520 kbit/s) Network node interface for the
ITU-T G.707

Interface Standard Remark
The control of jitter and wander within

Physical/electrical characteristics of
Electrical ITU-T G.703
hierarchical digital interfaces
interfaces at
 1544 kbit/s Synchronous frame structures used at
 2048 kbit/s ITU-T G.704 1544, 6312, 2048, 8448 and 44736
kbit/s hierarchical levels
 34368 kbit/s
 44736 kbit/s The control of jitter and wander within
2.048 MHz Physical/electrical characteristics of

network clock hierarchical digital interfaces
ITU-T G.703
synchronization
interface
User data channel Physical/electrical characteristics of

interface (64 ITU-T G.703 hierarchical digital interfaces
kbit/s)
Ethernet interface Meets the requirements related to

 100BASE-TX IEEE 802.3 100BASE-TX and 10BASE-T physical
interfaces specified in IEEE 802.3
 10BASE-T
Orderwire Frequency range: 300 Hz to 3400 Hz

telephone - Pulse Mode Modulation (PCM)
interface Bit rate: 64 kbit/s

Chapter 4
Networking and
Configurations

 Functions of the ZXMP S200 as an SDH NE,
 Supportable networking modes of ZXMP S200,
 A networking example of ZXMP S200.
Functions as an SDH NE
ZXMP S200 can act as a terminal multiplexer, an add/drop multiplexer or a
regenerator, performing corresponding functions in SDH networks.
Terminal Multiplexer (TM)

As a TM, ZXMP S200 terminates aggregate signals and SDH overheads at
the line side. It adds or drops E1/T1 tributary signals at the terminal side.
Figure 48 illustrates ZXMP S200 acting as a TM.
FIGURE 48 ZXM P S200 AS A TERMIN AL M ULTIPLEXER (TM )
ZXMP S200
(TM) STM-1/STM-4
E1/T1

Add/Drop Multiplexer (ADM)

As an ADM, ZXMP S200 has two line directions. In each line direction, it
can add or drop E1/T1 tributary signals, or pass them straight without
damage.
In addition, ZXMP S200 can terminate, forward and originate SDH

overheads, or pass them directly through the equipment.
Figure 49 illustrates ZXMP S200 acting as an ADM.
F I G U R E 4 9 Z X M P S 2 0 0 A S A N A D D / D R O P M U L T I P L E X E R ( AD M )
ZXMP S200
STM-1/STM-4 STM-1/STM-4
(ADM)
E1/T1
Regenerator (REG)
As a REG equipment, ZXMP S200 regenerates and amplifies optical signals.
It only processes regenerator section overheads (RSOH), instead of
service signals. Multiplex section overheads (MSOH) will pass through it
transparently.
Figure 50 illustrates ZXMP S200 acting as an REG.
FIGURE 50 ZXM P S200 AS A REGENER ATOR (REG)
STM-1/STM-4 ZXMP S200 STM-1/STM-4

(REG)
Networking Modes
ZXMP S200 supports multiple networking modes, such as point-to-point,
chain, ring networking mode and hybrid networking mode with other SDH
equipment, as shown in Figure 51.

Chapter 4 Networking and Configurations
FIGURE 51 NETWORKING MODES OF ZXMP S200
1. Point-to-Point 2. Chain 3. Ring
SDH
transmission
network
4. Hybrid networking
Point-to-Point Networking
Point-to-point network can be used in inter-office trunk and capacity
expansion, or used to replace original PDH system.
The point-to-point networking of ZXMP S200 is shown in Figure 52.
FIGURE 52 POINT-TO-POINT NETWORKING OF ZXMP S200
ZXMP S200 ZXMP S200
TM TM
Chain Networking
Chain network is applicable to communication networks with distributed
traffic in chains, or chain-shaped branch networks.
The chain networking of ZXMP S200 is shown in Figure 53.
FIGURE 53 CH AIN NETWORKING OF ZXM P S200
ZXMP S200 ZXMP S200 ZXMP S200 ZXMP S200
TM ADM ADM TM
Ring Networking
Ring network is applicable to distributed NEs which can construct a ring.
Due to the self-closing feature of line interface in ring network, services

can be transmitted end-to-end in two directions (eastward and westward)

in the ring. Ring networks have strong survivability and self-healing ability.
The ring networking of ZXMP S200 is shown in Figure 54.
FIGURE 54 RING NETWORKING OF ZXMP S200
ADM
ZXMP S200
ZXMP S200 ZXMP S200
ADM ADM
ZXMP S200
ADM
The self-healing ring is divided into two categories: the path switched ring
and the multiplex section (MS) switched ring. In terms of abstract
functional structure, the path switched ring supports subnet connection
protection while the MS switched ring supports path protection.
ZXMP S200 can form two-fiber unidirectional path switched ring at STM-
1/STM-4 level and two-fiber bidirectional MS switched ring at STM-4 level.
 Two-fiber unidirectional path switched ring

The path switched ring enables the fast and flexible protection
switching at various capacity levels. The switching is determined locally
and is independent of the topology. It is applicable to all kinds of
complicated network topologies and is not confined to the ring.
Therefore, it is more applicable to dynamic network environments,
such as cellular telecommunication networks.
However, because the principle of “concurrent transmitting and
preferential receiving” is adopted for all tributary signals, so all the
tributary signals are transmitted to the receiving node in two directions,
which is equivalent to transmission through the whole ring. Therefore
the total of the add/drop traffic in each NE can not exceed the system
capacity of ADM NEs.
 Two-fiber bidirectional MS switched ring
The two-fiber bidirectional MS switched ring has the transmission
capability up to K/2 × STM-N, where K is the quantity of nodes in the
ring, STM-N is the highest rate of the ring.
The MS switched ring supports the large transmission capacity and
flexible protection switching. However, fault response and recovering
time will be longer because it needs time to process APS protocol
during the switching.

Hybrid Networking
Hybrid networking is applied to capacity expansion or interconnection of
existing SDH networks. The hybrid networking can sufficiently utilize the
existing network resources, to compensate the ZXMP S200’s limitations in
terms of capacity and networking capability.
ZXMP S200 can cooperate with other SDH equipment and DWDM
equipment of ZTE CORPORATION for hybrid networking. The same
network management system can be used to implement the unified
management.
When ZXMP S200 is used for hybrid networking with equipment of other
manufacturers, E1 network management channels can be used to transfer
the management information, so as to implement the integrated network
management in a hybrid network.
Networking Application of
Ethernet
Overview
If the ZXMP S200 equipment is configured with the SEC board, it functions
not only as traditional SDH equipment, but also as Multi-Service
Transportation Platform (MSTP) node equipment with Ethernet data
process functions.
As the MSTP node equipment, ZXMP S200 can access the service of
Ethernet Private line (EPL), Ethernet Virtual Private Line (EVPL), Ethernet
Private LAN (EPLAN) and Ethernet Virtual Private LAN (EVPLAN), moreover,
provides the flow control and QoS function according to the actual
requirements.
Ethernet Private Line (EPL)

EPL service has two accessing points through which the Ethernet service is
transparently transported point to point. Each user’s service is carried by
the private SDH channel in EPL, so different users have no need to share
bandwidth one another. Thus, EPL has the same bandwidth guarantee and
security performance as SDH.
Besides, it is a point-to-point transmission mode, so neither L2 switch nor

MAC address learning is needed.
Figure 55 shows a typical networking of EPL. The Ethernet service between

user X and user Y is transparently transmitted through MSTP equipment A
and J, as well as the passing-by sites such as B, C, D, E, F, G and H.

FIGURE 55- A TYPICAL NETWORKING OF EPL
Ethernet Virtual Private Line (EVPL)

In EVPL, users can share the bandwidth with each other, which is the main
difference between EVPL and EPL. EVPL uses VLAN ID and other
mechanisms to distinguish the data from the different users. QoS
mechanism is adopted once the service varies with the user.
Because the user’ services are only separated logically, as another point-
to-point transmission mode, EVPL has the security performance lower than
EPL.
Figure 56 shows a typical networking of EVPL. User 1 has the service FE1
and FE2, and user 2 has the service FE3 and FE4. The service of user 1
and user 2 are isolated when passing by the sites A, B, C, D, E, F, G, H
and J.

FIGURE 56- A TYPICAL NETWORKING OF EVPL
Ethernet Private LAN (EPLAN)

EPLAN, as a point to multi-point transmission mode, can guarantee the
bandwidth and isolate the service perfectly, so the users have no need to
share the SDH bandwidth. Meanwhile, QoS and security mechanism are
not needed.
Because multi points are involved in an EPLAN networking, the data is

transferred based on MAC address, so the functions of MAC address
learning and L2 switch are needed.
Figure 57 shows a typical networking of EPLAN. The services of two

braches Z and Y of the user pass through the SDH network formed by the
timeslots links, then converge at the central node X. Moreover, the
bandwidth is exclusive from each branch to the central.

F I G U R E 5 7 - A T Y P I C A L N E T W O R K I N G O F E P L AN
Ethernet Virtual Private LAN (EVPLAN)

EVPLAN can be achieved in virtue of MPLS, VLAN stack (Q-in-Q) and other
technologies. From the point of user view, the network of the carriers is
like a LAN because of EVPLAN. The difference between EPLAN and EVPLAN
is that the user of EVPLAN should share the bandwidth. EVPLAN has the
especial attributes about protection, usability, bandwidth, MAC address
learning and data frame transferring.
Figure 58 shows a typical networking of EVPLAN. The traffic FE3 and FE5
of user 1 converge as the traffic FE1 at M through A and J. The traffic FE4
and FE5 of user 2 converge as the traffic FE2 at M through A and J. The
traffic of user 1 and user 2 are isolated by VLAN ID in the SDH
transmission channel.

F I G U R E 5 8 - A T Y P I C A L N E T W O R K I N G O F E V P L AN
Application Example
This section introduces a simple networking example of ZXMP S200,
including the selection and analysis of networking mode and the
equipment configuration based on network requirements.
Network Description
Site Locations Suppose three new sties A, B and C need to be constructed. -48 V DC
power supply is available for all equipment.
As shown in Figure 59, Sites A and B are connected directly through

optical cables, Sites B and C are connected through an SDH transmission
network. The network element management system (EMS) is configured at
Site A.

FIGURE 59 TOPOLOGY OF NETWORKING E XAMPLE
15km 15km 15km

SDH transmission
network
A B C
Services There is 2 M bidirectional service between Site A and Site B as well as Site
B and Site C.
Networking Analysis
Determine the The network topology structure should be selected according to site
Networking distribution and service allocation. Generally, ring networking is preferable
Mode as long as the routes are permitted due to its excellent self-healing
capability. Some special condition is exceptional, for example, networks
along the railway or highway are often chain networks. However, ring
network is recommended if adequate optical fibers are available.
In this sample, Site A, B and C form a chain network.
Set the Access Access NE is the NE that accesses the EMS computer in the network. It
NE should be selected according to user’s requirement and generally in major
site with centralized traffic.
In this sample, NE A (site A) is selected as the access NE.
Select ECC Since Site B and C are connected through an SDH transmission network,
the whole network can be seemed as a hybrid network.
To implement the integrated management of ZXMP S200 equipment, the

network management channel between Site B and C adopts E1 mode, that
is, the 1st-3rd timeslots of the 5th-8th E1 channels are used to transmit
network management information.
The network management channel between Site A and B still adopts SDH
overhead mode.
Networking Based on the above analysis, the system networking diagram is illustrated
Configurations in Figure 60.

FIGURE 60 NETWORKING DRAWING
EMS
155Mbit/s 155Mbit/s SDH transmission 155Mbit/s

network
NE A NE B NE C
Board Configurations
While configuring the ZXMP S200 equipment, the following two factors
should be considered.
 Power voltage
ZXMP S200 supports both AC power supply and DC power supply. You
can choose the power board according to actual power supply.
In this example, all the sites use -48 V DC power supply.
 Optical module type
The STM-1 optical interface of ZXMP S200 supports three types of
optical modules: S-1.1, L-1.1, and L-1.2.
Select proper optical module type according to the actual transmission
distance.
Table 97 lists the transmission distance corresponding to each optical
module type for your reference.
T ABLE 97 TR ANSMISSION DISTANCE FOR DIFFERENT OPTICAL M ODULE TYPES
Optical Module Type Reference Transmission Distance

S-1.1 ≤ 15 km
L-1.1 ≤ 40 km
L-1.2 ≤ 80 km
Note: In actual use, the transmission distance of optical modules may change
due to fiber types or line quality.
In this example, S-1.1 optical modules are used in the site A, B and C.
Then determine the equipment type and boards to be used in each site
according to the interface type. Table 98 lists the configurations of site A,
B and C.
T A B L E 9 8 C O N F I G U R A T I O N S O F S I T E A, B A N D C
Configuration Site A Site B Site C

Power supply voltage -48 V -48 V -48 V
Optical module type S-1.1 S-1.1 S-1.1

Configuration Site A Site B Site C

Main board type SMCxD75E SMCxD75E SMCxD75E
Installation Configurations
After equipment configurations, the installation/mounting of equipment
should be completed.
The installation configurations include the mounting of equipment,

accessories, cables and fiber pigtails, uninterrupted power supply (UPS)
for network management system, as well as DDF and ODF.
Note: For detailed installation procedure, please refer to Unitrans ZXMP

S200 (V3.00) SDH Based Multi-Service Node Equipment Installation &
Maintenance Manual.
Configurations in the EMS

After installation, networking configurations in ZXONM E300 should be
implemented for the ZXMP S200 equipment, such as services and
connections. Based on the status of an NE (equipment), online or offline,
two configuration procedures are as follows.
 Create online NE
Create online NE → Select the access NE → Install boards (cards) →
Establish connections between NEs → MS protection configuration →
Configure services → Configure overheads → Set clock source → Set
orderwire → Extract NCP time
 Create offline NE
Create offline NE → Select the access NE → Install boards (cards) →
Establish connections between NEs → MS protection configuration →
Configure services → Configure overheads → Set clock source → Set
orderwire → Change the NE status to Online → Download database of
NE → Extract NCP time
Note: Refer to the ZXONM E300 EMS/SNMS operation manual for detailed
operations of networking configuration.
Networking Features
In this example, the ZXMP S200 equipment and other SDH equipment
form a hybrid network, to utilize the existing network resources sufficiently.
Through the usage of E1 ECC channels, the unified network element
management to all ZXMP S200 equipment is implemented.

On the other hand, the network consisting of ZXMP S200 can be regarded
as a chain network disregarding the network topology of other SDH
equipment in the example.

This page is intentionally blank.

Appendix A
Compliant Recommendations
and Standards
The design of ZXMP S200 complies with the recommendations and

standards listed in Table 99.
T ABLE 99 COMPLIANT RECOMMEND ATIONS AND S TANDAR DS
Recommendation
Title
/Standard
Physical/electrical characteristics of hierarchical digital
ITU-T G.703
interfaces
Synchronous frame structures used at 1544, 6312, 2048,
ITU-T G.704
8448 and 44736 kbit/s hierarchical levels
Frame alignment and cyclic redundancy check (CRC)
ITU-T G.706 procedures relating to basic frame structures defined in
Recommendation G.704
Network node interface for the synchronous digital
ITU-T G.707
hierarchy (SDH)
Protocol suites for Q-interfaces for management of
ITU-T G.773
transmission systems
Synchronous digital hierarchy (SDH) management
ITU-T G.774
information model for the network element view
Synchronous digital hierarchy (SDH) bidirectional
ITU-T G.774.01
performance monitoring for the network element view
Synchronous digital hierarchy (SDH) configuration of the
ITU-T G.774.02
payload structure for the network element view
Synchronous digital hierarchy (SDH) management of
ITU-T G.774.03
multiplex-section protection for the network element view
Synchronous digital hierarchy (SDH) management of the
ITU-T G.774.04 subnetwork connection protection for the network
element view
ITU-T G.774.05 connection supervision functionality (HCS/LCS) for the
network element view

Recommendation
Title
/Standard
Synchronous digital hierarchy (SDH) unidirectional
ITU-T G.774.06
performance monitoring for the network element view
ITU-T G.774.07 lower order path trace and interface labelling for the
network element view
Terms and definitions for synchronous digital hierarchy
ITU-T G.780
(SDH) networks
Characteristics of synchronous digital hierarchy (SDH)
ITU-T G.783
equipment functional blocks
ITU-T G.784 Synchronous Digital Hierarchy (SDH) management
Architecture of transport networks based on the
ITU-T G.803
ITU-T G.805 Generic functional architecture of transport networks
ITU-T G.810 Definitions and terminology for synchronization networks
ITU-T G.811 Timing characteristics of primary reference clocks
Timing requirements of slave clocks suitable for use as
ITU-T G.812
node clocks in synchronization networks
Timing characteristics of SDH equipment slave clocks
ITU-T G.813
(SEC)
The control of jitter and wander within digital networks
ITU-T G.823
which are based on 2048 kbit/s hierarchy
The control of jitter and wander within digital networks
ITU-T G.825 which are based on the synchronous digital
hierarchy(SDH)
End-to-end error performance parameters and objectives
ITU-T G.826 for international, constant bit-rate digital paths and
connections
Management capabilities of transport networks based on
ITU-T G.831
the synchronous digital hierarchy (SDH)
Transport of SDH elements on PDH networks - Frame and
ITU-T G.832
multiplexing structures
Types and characteristics of SDH network protection
ITU-T G.841
system
ITU-T G.842 Interworking of SDH network protection architectures
Optical interfaces for equipments and systems relating to
ITU-T G.957
Digital line systems based on the synchronous digital
ITU-T G.958
hierarchy for use on optical fiber cables
Resistibility of internal interfaces of telecommunication
ITU-T K.41
centers to surge voltage
ITU-T M.20 Maintenance philosophy for telecommunication networks
Performance limits for bringing-into-service and
ITU-T M.2100 maintenance of international PDH paths, sections and
transmission systems

Appendix A Compliant Recommendations and Standards
Recommendation
Title
/Standard
Performance limits and objectives for bringing-into-
ITU-T M.2101 service and maintenance of international SDH paths and
multiplex sections
PDH path, section and transmission system and SDH path
ITU-T M.2120 and multiplex section fault detection and localization
procedures
ITU-T M.3010 Principles for a telecommunications management network
ITU-T M.3400 TMN management functions
ITU-T Q.811 Lower-layer protocol frame of the Q3 interface
ITU-T Q.812 Higher-layer protocol frame of Q3 interface
ITU-T X.214 Information technology - open systems interconnection -
(ISO 8072) transport service definition
ITU-T X.215 ITU-T application - Open Systems Interconnection -

(ISO 8326) Session service definition
ITU-T X.216 Information technology - Open Systems Interconnection -

(ISO 8822) Presentation service definition
ITU-T X.217 ITU-T application - Open Systems Interconnection -

Service definition for the Association Control Service
(ISO 8649) Element
ITU-T X.219
Remote Operations: Model, notation and service definition
(ISO IS 9072-1)
ITU-T X.224 Protocols and specifications for information processing

system - interconnecting of open systems - connection
(ISO 8073) orientated transmitting

Connection-oriented Session protocol: Protocol
(ISO 8327) specification

Connection-oriented Presentation protocol: Protocol
(ISO 8823) specification
ITU-T X.229
Remote operation: Protocol specification
(ISO IS 9072-2)
Information technology - Protocol for providing the
ITU-T X.233 connectionless-mode network service: Protocol
specification
ITU-T X.511 Information technology - Open systems interconnection -
(ISO9594-3) The directory: Abstract service definition
ITU-T X.519 Information technology - Open systems interconnection -

(ISO9594) The directory: Protocol specifications
Information technology - Protocol for providing the

ITU-T X.622 connectionless-mode network service: Provision of the
underlying service by an X.25 Subnetwork
ITU-T X.710 Management information service definition: Public
(ISO 9595) management information service definition

Recommendation
Title
/Standard
ITU-T X.710 Management information service definition: Public
(ISO 9596-1) management information protocol
Information processing system - open systems

ISO 7498
interconnection – Basic reference model
Information technology – Open systems interconnection –
ISO 8073/AD2 Protocol for providing the connection-mode transport
service Amendment 2
Information technology – Open systems interconnection –
ISO 8348
Network service definition
Information technology – Protocol for providing the
ISO 8473
connectionless-mode network service
Information processing systems – Open systems
ISO 8571.1 interconnection – File transfer, access and management –
Part 1: General introduction
Information processing system - Open systems
ISO 8571.2 interconnection - File transfer, access and management -
Part 2: Virtual filestore definition
Part 3: File service definition
Part 4: File protocol specification
Information processing system - Open system
ISO 8648 interconnection - Internal organization of the network
layer
Information technology – Telecommunications and
information exchange between systems – Local and
ISO 8802.2
metropolitan area networks – Specific requirements – Part
2: Logical link control
Information technology - Telecommunications and
information exchange between systems - Local and
ISO 8802.3 metropolitan area networks – Specific requirements - Part
3: Carrier sense multiple access with collision detection
(CSMA/CD) access method and physical layer
Information processing system - Telecommunications and
information exchange between systems - End system to
ISO 9542 intermediate system routing exchange protocol for use in
conjunction with the protocol for providing the
connectionless-mode network service (ISO 8473)
Information technology - Open systems interconnection –
ISO 9545
Application layer structure
ISO 9546-1 interconnection - Common management information
protocol specification
ISO 10172 Interconnection - Telecom and information switching
network/transport protocol interworking specification

Appendix A Compliant Recommendations and Standards
Recommendation
Title
/Standard
Information technology – Telecommunications and
information exchange between systems – Intermediate
system to intermediate system intra-domain touting
ISO 10589
information exchange protocol for use in conjunction with
the protocol for providing the connectionless-mode
network service (ISO8473)
YDN 099-1998 Optical synchronous transport network technical system
Technical Requirements for SDH Multi-Service Transport
YD/T 1238-2000
Platform
Specification for Seismic Test of Telecommunications
YD 5083-1999
Equipment
Safety Standard of the Information and Technology
GB 4943
Equipment
Information Technology Equipment – Radio Disturbance
GB 9254
Characteristics – Limits and Methods of Measurement
Environment Experiment for Electric and Electronic
GB/T 2423
Products
Classification of environmental parameters and their
GB/T 4796–1984
severities of electric and electronic products
Safety of Laser Products--Part 1: Equipment
GB 7247.1-2001
Classification, Requirements and User's Guide
Information technology equipment--Immunity
GB/T 17618-1998
characteristics--Limits and methods of measurement
Electromagnetic compatibility - Limits - Limits for
GB 17625.1 harmonic current emissions (equipment input current
≤16A per phase
Electromagnetic compatibility Limits Limitation of voltage
GB 17625.2 fluctuations and flash in low-voltage supply systems for
equipment with rated current ≤16A
Electromagnetic compatibility Limits Limitation of voltage
GB/Z 17625.3 fluctuations and flash in low-voltage supply systems for
equipment with rated current >16A
Electromagnetic compatibility – Testing and measurement
GB/T 17626.2
techniques – Electrostatic discharge immunity test
Electromagnetic compatibility - Testing and measurement
GB/T 17626.3 techniques - Radiated, radio-frequency, electromagnetic
field immunity test
GB/T 17626.4
techniques - Electrical fast transient/burst immunity test
GB/T 17626.5
techniques - Surge immunity test
GB/T 17626.6 techniques-Immunity tl conducted disturbances, induced
by radio - frequency fields
GB/T 17626.8 techniques - Power frequency magnetic field immunity
test

Recommendation
Title
/Standard
GB/T 17626.11 techniques – Voltage dips, short interruptions and voltage
variations immunity tests
GJB/Z 299B-1998 Reliability Prediction of Electronic Equipment

Appendix B
Abbreviations
Abbreviation Full Name

A
ADM Add-Drop Multiplexer
ADSL Asymmetrical Digital Subscriber Line
ALS Automatic Laser Shutdown
AMI Alternate Mark Inversion
APS Automatic Protection Switching
ATM Asynchronous Transfer Mode
AU-n Administrative Unit, level n
AUG Administrative Unit Group
B
BBE Background Block Error
BER Bit Error
BITS Building Integrated Timing Supply
B8ZS Bipolar with 8-Zero Substitution
B3ZS Bipolar with 3-Zero Substitution
C
CDMA Code Division Multiple Access
Corba Common object request broker architecture
CMI Code Mark Inversion
CV Coding Violation
D
DCC Data Communications Channel
DDF Digital Distribution Frame
DWDM Dense Wavelength Division Multiplexing
E
ECC Embedded Control Channel
EFT Electrical Fast Transient


EPL Ethernet Private Line
EPLAN Ethernet Private Local Area Network
ETSI European Telecommunications Standards Institute
EUT Equipment Under Test

EVPL Ethernet Virtual Private Line
EVPLAN Ethernet Virtual Private Local Area Network
ES Errored Second
ESD Electro-Static Discharge immunity
F
FE Fast Ethernet
FEBBE Far End Background Block Error
FEES Far End Errored Second
FESES Far End Severely Errored Second
G
GFP Generic Framing Protocol
GNE Gateway Network Element
GUI Graphical User Interface
GSM Global System for Mobile communications
H
HDB3 High Density Bipolar of order 3
HDLC High level Digial Link Control
I
IC Integrated Circuit.
IEC International Electrotechnical Commission
IGMP Internet Group Management Protocol
IP Internet Protocol
International Telecommunication
ITU-T
Union-Telecommunication Standardization Sector
IVL Independent VLAN Learning

L
LAN Local Area Network
LACP Link Aggregation Control Protocol
LCAS Link Capacity Adjustment Scheme
LCT Local Craft Terminal
LST Link Status Transport
LOS Loss Of Signal
M

Appendix B Abbreviations

MAC Media Access Control
MCU Micro Control Unit
MSOH Multiplex Section OverHead
MS-PSC Multiplex Section - Protection Switching Count
MS-PSD Multiplex Section - Protection Switching Duration
MTBCF Mean Time Between Critical Failures
MTBF Mean Time Between Failures
N
NE Network Element
O
ODF Optical fiber Distribution Frame
P
PCB Printed Circuit Board
PCM Pulse Code Modulation
PDH Plesiochronous Digital Hierarchy
PGND Protection GND
PJE+ Positive Pointer Justification Event
PJE- Negative Pointer Justification Event
PPP Point-to-Point Protocol
PRBS Pseudo Random Binary Sequence
PSD Power Spectral Density
PSTN Public Switched Telephone Network
R
REG Regenerator
S
SDH Synchronous Digital Hierarchy
SD Signal Degrade
SES Severely Errored Second
SFP Small Form Factor Pluggable
SF Signal Failure
SHDSL Single-pair High-bit-rate Digital Subscriber Line
SMCC Sub-network Management Control Center
SNC (I) Sub-Network Connection Protection with Inherent monitoring
Sub-Network Connection Protection with Non-intrusive
SNC (N)
monitoring
SSM Synchronization Status Message
STM-N Synchronous Transport Module, level N (N=1, 4, 16, 64)


STU SHDSL Transceiver Unit
STU-C STU-Central Office
T
TCP Transfer Control Protocol
TDM Time Division Multiplexing
TM Terminal Multiplexer
TRK Trunk
TU-m Tributary Unit, level m
TUG-m Tributary Unit Group, level m
U
UAS Unavailable Second
UPS Uninterrupted Power Supply
V
VC-n Virtual Container, level n
VCXO Voltage Control Crystal Oscillator
VDSL Very-high-bit-rate Digital Subscriber Line
VLAN Virtual Local Area Network

Figures
Figure 1 ZTE’s Unitrans ZXMP Family.............................................................. 1

Figure 2 Front View of ZXMP S200 ................................................................. 2
Figure 3 Structure of ZXMP S200 ................................................................... 3
Figure 4 Relationships Between Functional Units in ZXMP S200 ......................... 4
Figure 5 Hierarchical Structure of ZXONM E300 ............................................... 5
Figure 6 Mapping/Multiplexing Structure of ZXMP S200 .................................. 11
Figure 7 Outline and Structure of ZXMP S200 ................................................ 15
Figure 8 Structure of the Fan Module ............................................................ 16
Figure 9 Structure of the Power Module (PWA) .............................................. 17
Figure 10 Operating Principle of SMC Board .................................................. 23
Figure 11 Operating Principle of the NCP Unit ................................................ 24
Figure 12 Operating Principle of the Optical Interface Unit .............................. 27
Figure 13 Operating Principle of the STM-1 Electrical Interface Unit .................. 29
Figure 14 Operating Principle of Tributary Unit .............................................. 30
Figure 15 Operating Principle of the Ethernet Interface Unit ............................ 32
Figure 16 Operating Principle of the Clock Unit .............................................. 35
Figure 17 Operating Principle of the Micro Control Unit ................................... 36
Figure 18 Operating Principle of SMB Board................................................... 37
Figure 19 Operating Principle of NCP Unit...................................................... 38
Figure 20 Operating Principle of the Optical Interface Unit .............................. 41
Figure 21 Operating Principle of E1/T1 Tributary Unit ..................................... 43
Figure 22 Operating Principle of E3/T3 Tributary Unit ..................................... 44
Figure 23 Operating Principle of the Ethernet Interface Unit ............................ 46
Figure 24 Operating Principle of the Clock Unit .............................................. 49
Figure 25 Operating Principle of the Micro Control Unit ................................... 50
Figure 26 Front Panel of the Main Board (SMCxF75T) ..................................... 50
Figure 27 Operating Principle of the PWA/PWB Module.................................... 54
Figure 28 Front Panel of the PWA Board........................................................ 55
Figure 29 Front Panel of the PWB Board........................................................ 57
Figure 30 Operating Principle of the PWC Module ........................................... 59
Figure 31 Front Panel of the PWC Module ...................................................... 60
Figure 32 Operating Principle of the V35B Board ............................................ 61
Figure 33 Front Panel of the V35B Board....................................................... 62
Figure 34 Operating Principle of the E1/T1 Electrical Tributary Board ................ 63
Figure 35 Front Panel of the Electrical Tributary Board (ET1-75 Board) ............. 64
Figure 36 Front Panel of the EIE3 Board ....................................................... 66
Figure 37 Front Panel of the TFEx4 Board ..................................................... 68
Figure 38 Front Panel of the TFEx4B Board ................................................... 70
Figure 39 Operating Principle of the AI Board ................................................ 71
Figure 40 Front Panel of AI Board ................................................................ 72
Figure 41 Operating Principle of the OW Board .............................................. 75
Figure 42 Front Panel of the OW Board ......................................................... 75
Figure 43 Front Panel of the SEC Board ........................................................ 79
Figure 44 Operating Principle of the SDB Board ............................................. 81
Figure 45 Front Panel of the SDB Board ........................................................ 81
Figure 46 Power Supply Lightning Protection Connection in a Far-End Equipment
Room ................................................................................................. 92
Figure 47 Eye Pattern of Optical Launched Signals ........................................ 101
Figure 48 ZXMP S200 as a Terminal Multiplexer (TM) .................................... 111
Figure 49 ZXMP S200 as an Add/Drop Multiplexer (ADM) ............................... 112
Figure 50 ZXMP S200 as a Regenerator (REG) .............................................. 112

Figure 51 Networking Modes of ZXMP S200 .................................................. 113

Figure 52 Point-to-Point Networking of ZXMP S200 ....................................... 113
Figure 53 Chain Networking of ZXMP S200................................................... 113
Figure 54 Ring Networking of ZXMP S200 .................................................... 114
Figure 55 Topology of Networking Example .................................................. 120
Figure 56 Networking Drawing.................................................................... 121

Tables
Table 1 Chapter and Appendix Summary ......................................................... i

Table 2 Typographical Conventions ................................................................ iii
Table 3 Mouse Operation Conventions ............................................................ iii
Table 4 Interfaces in a Network Management System ....................................... 7
Table 5 Cross-connect Capacity of ZXMP S200 ................................................ 8
Table 6 Service Interfaces Provided by ZXMP S200 (SMB) ................................. 8
Table 7 Service Interfaces Provided by ZXMP S200 (SMC)................................. 9
Table 8 MS Protection Modes Supported by ZXMP S200 .................................. 11
Table 9 Alarms Triggering SNC Protection Switching ....................................... 12
Table 10 Board List of ZXMP S200 ............................................................... 17
Table 11 List of SMC Main Boards ................................................................ 19
Table 12 List of SMB Boards ........................................................................ 21
Table 13 Differences between SMB Board and SMC Board ............................... 22
Table 14 Functions of Modules in the NCP ..................................................... 24
Table 15 Overheads Processed by Optical Interface Unit ................................. 26
Table 16 Functions of Modules in the Optical Interface Unit ............................. 27
Table 17 Overheads Processed by STM-1 Electrical Interface Unit .................... 28
Table 18 Functions of Modules in the Electrical Interface Unit .......................... 29
Table 19 Functions of Modules in Tributary Unit ............................................. 31
Table 20 Descriptions of Virtual Concatenation Group ..................................... 32
Table 21 Functions of Modules in the Ethernet Interface Unit ........................... 33
Table 22 Functions of Modules in the Micro Control Unit .................................. 36
Table 23 Functions of Modules in NCP Unit .................................................... 39
Table 24 Overheads Processed by Optical Interface Unit ................................. 40
Table 25 Functions of Modules in the Optical Interface Unit ............................. 41
Table 26 Functions of Modules in E1/T1 Tributary Unit .................................... 43
Table 27 Functions of Modules in E3/T3 Tributary Unit .................................... 44
Table 28 Description of Virtual Concatenation Group ...................................... 45
Table 29 Functions of Modules in the Ethernet Interface Unit ........................... 46
Table 30 Functions of Modules in the Micro Control Unit .................................. 50
Table 31 Components on the Front Panel of Main Board .................................. 51
Table 32 Units in the PWA/PWB Board .......................................................... 55
Table 33 Components on the Front Panel of PWA Board .................................. 55
Table 34 Components on the Front Panel of PWB Board .................................. 57
Table 35 Units in the PWC Module ................................................................ 59
Table 36 Components on the Front Panel of the PWC Module........................... 60
Table 37 Units in the V35B Board................................................................. 61
Table 38 Components on the Front Panel of V35B Board ................................. 62
Table 39 Relations Between E1/T1 Electrical Tributary Board and ID ................ 63
Table 40 Functions of Units in the E1/T1 Electrical Tributary Board .................. 64
Table 41 Components on the Front Panel of ET1 Board ................................... 64
Table 42 Descriptions of Components on the Front Panel of EIE3 Board ............ 66
Table 43 Components on the Front Panel of TFEx4 Board ................................ 68
Table 44 Components on the Front Panel of TFEx4B Board .............................. 70
Table 45 Positions of the Used Overhead Bytes in the SDH Frame ..................... 71
Table 46 Functions of Units in the AI Board ................................................... 72
Table 47 Components on the Front Panel of AI Board ..................................... 72
Table 48 Signal Definitions of Pins in the Audio Interface ................................ 73

Table 49 Positions of the Idle Overhead Bytes Used to Carry the Low-Speed Data
Service .............................................................................................. 74
Table 50 Units in the OW Board ................................................................... 75
Table 51 Components on the Front Panel of OW Board ................................... 76
Table 52 Signal Definitions of Pins in RS232/RS485/RS422 Interface................ 76
Table 53 Components on the Front Panel of SEC Board................................... 79
Table 54 Units in the SDB Board .................................................................. 81
Table 55 Components on the Front Panel of SDB Board .................................. 81
Table 56 Dimensions & Weight of Components in ZXMP S200 .......................... 84
Table 57 Allowable Voltage Fluctuation Range of ZXMP S200 ........................... 85
Table 58 Power Consumption and Weight of Each Board Available for ZXMP S200
......................................................................................................... 85
Table 59 Power Consumption for the Typical Configuration of ZXMP S200 (SMB) 88
Table 60 Maximum Power Consumption of ZXMP S200 (SMB) ......................... 89
Table 61 Power Consumption for the Typical Configuration of ZXMP S200 (SMC) 89
Table 62 Maximum Power Consumption of ZXMP S200 (SMC) ......................... 89
Table 63 Grounding Resistance Requirements in Independent Grounding Mode . 90
Table 64 Typical Power Supply Lightning Protection Classification .................... 91
Table 65 Temperature and Humidity Requirements of ZXMP S200 ................... 94
Table 66 Requirements for Concentration of Harmful Gas in Equipment Room ... 95
Table 67 Application Environment Requirements of ZXMP S200 ....................... 95
Table 68 Reliability Indexes of ZXMP S200 .................................................... 96
Table 69 ESD Immunity Indices ................................................................... 97
Table 70 Radiated Susceptibility Indices ....................................................... 97
Table 71 EFT Immunity Indices on DC Power Supply Ports .............................. 97
Table 72 EFT Immunity Indices on Signal and Control Ports ............................ 97
Table 73 EFT Immunity Indices on AC Power Supply Ports .............................. 98
Table 74 DC Power Supply Lightning Surge Immunity Indices ......................... 98
Table 75 AC Power Supply Lightning Surge Immunity Indices .......................... 98
Table 76 Outdoor Signal Line Surge Immunity Indices .................................... 98
Table 77 Signal Line Surge Immunity Indices ................................................ 99
Table 78 Conducted Susceptibility Indices ...................................................... 99
Table 79 AC Voltage Transient Dropout Immunity Indices ............................... 99
Table 80 Conducted Emission Indices AT DC/AC Power Ports .......................... 100
Table 81 Conducted Emission Indices at Communication/Control Ports ............ 100
Table 82 Radiated Emission Indices of ZXMP S200 ........................................ 100
Table 83 Parameters of Transmitting Signal Eye Pattern ................................ 101
Table 84 Specifications of STM-1 Optical Interfaces ....................................... 101
Table 85 Specification of STM-4 Optical Interfaces ........................................ 102
Table 86 Specifications of STM-4 Single Fiber with Dual Directions Optical
Interfaces .......................................................................................... 103
Table 87 Specifications of 100 Mbit/s Ethernet Optical Interfaces ..................... 103
Table 88 Specifications of STM-1 Electrical Interfaces ..................................... 104
Table 89 Specifications of E1 Electrical Interfaces .......................................... 105
Table 90 Specification of T1 Electrical Interfaces ........................................... 105
Table 91 Specification of E3 Electrical Interfaces ........................................... 106
Table 92 Specification of T3 Electrical Interfaces ........................................... 107
Table 93 MTIE Limit in Locked Mode (with Constant Temperature) .................. 108
Table 94 MTIE Limit in Locked Mode (with Temperature Effects) ..................... 108
Table 95 TDEV Limit in Locked Mode (with Constant Temperature) ................. 109
Table 96 Standards of Interfaces Provided by ZXMP S200 .............................. 109
Table 97 Transmission Distance for Different Optical Module Types ................. 121
Table 98 Configurations of Site A, B and C ................................................... 121
Table 99 Compliant Recommendations and Standards ................................... 125

Sjzl20081400-Unitrans ZXMP S200 (V3.00) Product Descriptions

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ZXMP S200

SDH Based Multi-Service Node Equipment

Copyright © 2006 ZTE CORPORATION.

The ultimate right to interpret this product resides in ZTE CORPORATION.

Date Revision Serial No. Description

Second edition. Adds SMB board and EIE3

Thank you for your cooperation!

About This Product Descriptions .................................................... i

E1/T1 Electrical Tributary Board ........................................................... 62

Technical Specifications ..............................................................83

Networking and Configurations ................................................111

Networking Application of Ethernet .................................................... 115

Application Example ............................................................................ 119

Compliant Recommendations and Standards ...........................125

Prerequisite Skill and Knowledge

 ZXMP S200 equipment and its various components

What is in This Manual

Confidential and Proprietary Information of ZTE CORPORATION i

Unitrans ZXMP S200  Introduces the installation steps on site, including

ii Confidential and Proprietary Information of ZTE CORPORATION

T ABLE 2 TYPOGRAPHICAL CONVENTIONS

Note: Provides additional information about a certain

Checkpoint: Indicates that a particular step needs to

Tip: Indicates a suggestion or hint to make things

Mouse Operation Conventions

How to Get in Touch

Confidential and Proprietary Information of ZTE CORPORATION iii

iv Confidential and Proprietary Information of ZTE CORPORATION

In this chapter, you will learn about:

ZTE’s Unitrans ZXMP Family

FIGURE 1 ZTE’S UNITRANS ZXM P FAMILY

Confidential and Proprietary Information of ZTE CORPORATION 1

Introduction to ZXMP S200

ZXMP S200, designed as a platform, strictly complies with related ITU-T

Figure 2 shows the front view of ZXMP S200.

FIGURE 2 FRONT VIEW OF ZXMP S200

ZXMP S200 can be used as a network element, such as terminal

ZXMP S200 has good network adaptive capability. It can be managed by

ZXMP S200 is a compact equipment with high integration. It has high

2 Confidential and Proprietary Information of ZTE CORPORATION

situations and be configured flexibly. ZXMP S200 can be configured as

ZXMP S200 can be powered by any of below power supply ways: AC

FIGURE 3 STRUCTURE OF ZXMP S200

Hardware System Network Element Management System

ZXMP S200 consists of the hardware system and the network

Structure of Hardware System

Confidential and Proprietary Information of ZTE CORPORATION 3

FIGURE 4 REL ATIONSHIP S BETWEEN F UNCTION AL UNITS IN ZXM P S200

Service Unit Cross-Connect Unit Service Unit

Power Micro Control NE Control

The functions of each unit are described as follows.

1. NE control processing unit (NCP)

4 Confidential and Proprietary Information of ZTE CORPORATION

This unit implements the orderwire and low-rate data transmission.

Network Management System

ZXONM E300 is designed with a four-layer structure, consisting of the

FIGURE 5 HIERARCHIC AL S TRUCTURE OF ZXONM E300

GUI(Cient) GUI(Cient) GUI(Cient) GUI(Cient)

Element EMS/SNMS LCT EMS/SNMS EMS/SNMS

ECC ECC ECC ECC

NE/Agent NE/Agent NE/Agent NE/Agent

ECC ECC ECC ECC

Confidential and Proprietary Information of ZTE CORPORATION 5