Advances in Interconnect Technologies: An International Journal (AITIJ)

https://airccse.com/aitij/index.html

Scope & Topics

Advances in Interconnect Technologies: An International Journal (AITIJ) invites original

and significant contributions relating to the theory, design, performance and reliability of
interconnect, including materials, analysis, modeling and simulation of interconnect. The journal
proposes to stimulate the development of latest technology in industry and academia. High
quality review papers and short communications are also acceptable.

Research areas suitable for publication include, but are not limited to the following fields:

Topics of interest include, but are not limited to, the following

 EmergingMaterials
 CNT/ Graphene Interconnects
 Modeling and Simulation
 Testing
 RFIC
 Optical Interconnects
 Wireless Interconnects
 Microstrip Lines
 Analog andMixedSignals
 Dedicated Software and Systems for Developing InterconnectTechnology
 On-Chip andOff-ChipInterconnects
 EMC/EMI
 FPGA/ASICs
 FabricationTechniques
 NeuralNetworks
 Parasitics Issues
 OptimizationTechniques
Paper Submission

Authors are invited to submit papers for this journal through

Email aitijjournal@airccse.comor Submission System . Submissions must be original and
should not have been published previously or be under consideration for publication while being
evaluated for this Journal.

Important Dates

 Submission Deadline : June 11, 2022

 Notification : July 11, 2022
 Final Manuscript Due : July 19, 2022
 Publication Date : Determined by the Editor-in-Chief

Contact Us

Here’s where you can reach us: aitijjournal@yahoo.comor aitijjournal@airccse.com