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Annotation

REGUL R100
System manual
DPA-305

en | 0.2 | December 2020


Annotation

ANNOTATION
This part of the manual contains information on design, operating principles,
technical characteristics of the product, and instructions necessary for correct and
safe operation of the REGUL R100 controller.
This manual is intended for operating personnel and design engineers of the process
control system, who must:
• have at least a secondary technical education;
• begin work only after studying this manual.

Updating the information in the manual


The manufacturer "GP Systems" GmbH reserves the right to change the information
in this Manual and undertakes to publish newer versions with the changes made. The
updated version of the Manual is available for downloading at the Manufacturer's
official website: https://www.gp-systems.com.
In order to keep track of the new version of the Manual, it is recommended to
subscribe for updating of the document. To do this, on the Manufacturer's website:
https://www.gp-systems.com in the tab "Documentation" under the document icons
click on the button "Subscribe for updates" and leave your contact information.
The manual contains signs with warning and explanatory information. Each sign
means the following:

WARNING SIGNS

ATTENTION!
! Here you should pay attention to the methods and techniques that must be exactly followed
in order to avoid errors in operation or setup

INFORMATION SIGNS

. INFORMATION
I Here we should pay attention to important information

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Introduction

CONTENTS

ANNOTATION ................................................................................................................................................................... 2
Updating the information in the manual........................................................................................................................ 2
WARNING SIGNS .............................................................................................................................................................. 2
INFORMATION SIGNS ....................................................................................................................................................... 2
INTRODUCTION ................................................................................................................................................................ 5
Information about certification ...................................................................................................................................... 5
HARDWARE CONFIGURATION .......................................................................................................................................... 6
DESCRIPTION OF THE CONTROLLER COMPONENTS ............................................................................................................................ 6
Submodules ...................................................................................................................................................................... 6
Chassis ............................................................................................................................................................................ 10
CONTROLLER CONFIGURATIONS..................................................................................................................................... 17
PLACEMENT OF MODULES IN THE RACK ........................................................................................................................................ 17
COMBINING RACKS IN THE CONTROLLER ....................................................................................................................................... 18
"HOT" REPLACEMENT OF CONTROLLER MODULES .......................................................................................................................... 22
POWER DISTRIBUTION WITHIN THE RACK ...................................................................................................................................... 22
REDUNDANCY OF CONTROLLER MODULES ..................................................................................................................................... 24
Full redundancy .............................................................................................................................................................. 24
Partial redundancy ......................................................................................................................................................... 25
Combined redundancy scheme ...................................................................................................................................... 26
MOUNTING .................................................................................................................................................................... 28
CHASSIS SLOT CODING .............................................................................................................................................................. 37
ORGANIZATION OF COMMUTATION OF EXTERNAL CIRCUITS .............................................................................................................. 38
PARAMETERS FOR CONNECTING EXTERNAL CIRCUITS ....................................................................................................................... 41
CONTROLLER MODULES ................................................................................................................................................. 42
GENERAL INFORMATION ........................................................................................................................................................... 42
INTERFACE SUBMODULES ............................................................................................................................................... 44
ANALOG INPUT SUBMODULES .................................................................................................................................................... 47
Input signal processing in analog input submodules ..................................................................................................... 47
Control of the measuring range limits ........................................................................................................................... 49
Control of the measuring range limits ........................................................................................................................... 49
Signal Burst Control ........................................................................................................................................................ 49
Options for the end of emission processing ................................................................................................................... 50
Status of channel rejection by emission ......................................................................................................................... 52
AI 02 011-100 Analog input submodule ......................................................................................................................... 53
AI 02 041-100 Analog input submodule ......................................................................................................................... 60
ANALOG OUTPUT SUBMODULES ................................................................................................................................................. 67
Output signal processing in analog output submodules ................................................................................................ 67
AO 02 011-100 Analog output submodule ..................................................................................................................... 69
AO 02 031-100 Analog output submodule ..................................................................................................................... 75
AO 01 531-100 Analog output submodule ..................................................................................................................... 81
DIGITAL INPUT SUBMODULES .................................................................................................................................................... 87
DI 02 011-000 digital input submodule .......................................................................................................................... 87
DI 02 021-000 digital input submodule .......................................................................................................................... 93

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Introduction

DI 02 621-000 digital input submodule .......................................................................................................................... 98


DIGITAL OUTPUT SUBMODULES ................................................................................................................................................104
DO 02 011-000 Digital output submodule ...................................................................................................................104
DO 02 021-000 Digital output submodule ...................................................................................................................109
DO 02 511-000 Digital output submodule ...................................................................................................................115
CHASSIS MODULES ....................................................................................................................................................... 120
MAINTENANCE ............................................................................................................................................................. 124
APPENDIX A. LIST OF CUSTOM CONTROLLER POSITIONS .............................................................................................. 125

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Hardware configuration

Introduction
REGUL R100 controller is part of the REGUL RX00 family of programmable
controllers. It is designed for collecting and processing information from the primary
sensors, forming control signals according to the specified algorithms, receiving and
transmitting information via serial communication channels.
The features of REGUL R100 controller are:
• small channel submodules (1-2 channels);
• scalability with digitalness of one submodule;
• hot swapping of controller I/O submodules;
• high resistance to electromagnetic interference;
• operation as part of redundant controllers REGUL RX00;
• Epsilon LD runtime environment with support for all IEC 61131-3 languages;
• installation on a standard DIN rail with a width of 35 mm.
Programming and configuration of the controller is done using the Epsilon LD
software. How to work with the Epsilon LD development environment is described in
the document "Epsilon LD. User Guide".

Information about certification


Information about certification can be found on the website https://www.gp-
systems.com.

5
Hardware configuration

HARDWARE CONFIGURATION
Description of the controller components
The REGUL R100 controller has a block-modular design consisting of one or more
racks. The rack consists of modules, which include chassis mounted on a DIN rail and
sub-modules of different types installed on them. The submodules are the basic
elements of the controller and, depending on the type, perform one or another
function.

Figure 1 - Appearance of the REGUL R100 controller

Submodules
The controller includes the following types of submodules:
• interface submodule;
• I/O submodules, including:
o Analog input submodule;
o Analog output submodule;
o Digital input submodule;
o digital output submodule;
o pulse counting submodule.
The interface submodules provide the connection of the R100 expansion chassis to
the RegulBus data bus of the REGUL series controllers. For each RegulBus, IN and
OUT ports are provided on the front of the chassis module.

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Hardware configuration

The I/O submodules form the interface between the controller and the process
through the mutual conversion of physical and logical signals.
The I/O submodules convert external signals into data that are transmitted to the
CPU and vice versa. The external channels are also galvanically separated from the
internal controller buses.
The dimensions of the controller submodule are shown in figure 2.

Figure 2 – Dimensions of the submodule

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Hardware configuration

The submodule housing consists of the main part and a transparent hinged cover (Figure
3).

Side view
Front view
Jumper / fuse slots

Service indicator

Disconnector motors
Test Sockets
Latch that provides
mechanical attachment of
the submodule to the
chassis module

Ground contact

Slot coding keys (behind


the ground contact)

Functional indicators

20-pin connector for connecting to external


circuits of the chassis module

10-pin connector for connecting to the internal


circuits of the chassis module

Figure 3 – Appearance of the submodule controller REGUL R100

On the front panel of the submodule, under the transparent hinged cover, are located:
• test sockets - six test sockets allowing electrical measurements of the circuit
connected to the submodule;

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Hardware configuration

• Jumper/fuse jacks - two jacks that can be used to configure the submodule
functionality. In addition, these jumpers, in some types of submodules, play
the role of fuses;
• Indicators, which are conventionally divided into two main groups:
• service indicator (submodule state) - displays the submodule state, as well as
its operation within the controller;
• Functional indicators (status of channels and power supply) - indicates the
execution of functional programmed to the submodule and the presence of
power supply for the channel.
On the front end of the submodule are:
• disconnector slides - two screw slides designed to control built-in
disconnectors that allow breaking the measuring circuit (elements QS1 and
QS2 in the schematic diagram of the corresponding submodule).
Disconnection of the circuit by means of disconnectors can be either short-
term (e.g. for some measurements of electrical parameters of the circuit) or
permanent (for guaranteed disconnection of signal or supply circuits);
• a latch that provides mechanical attachment to the chassis module;
• A guide tab that fits into the slot in the chassis when the submodule is
installed.
• The rear wall has ventilation holes for heat dissipation and an eyelet for
sealing the submodules.
The bottom of the submodule contains:
• connectors for connecting the submodule to the chassis module - two
connectors, immersed inside the chassis, which have the following purpose:
o 10-pin - for connection to internal circuits - the internal data bus and
power bus "A" are terminated on it;
o 20-pin - for connection to external circuits, by means of terminal
blocks for input of signal circuits, and to the power buses "B" and "C".
• Slot coding keys - two keys to prevent the submodule from being erroneously
inserted into a slot that is not designed for that type of submodule.
• submodule ground contact.

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Hardware configuration

Chassis
The chassis module provides mechanical attachment, electrical switching, and data
exchange between controller submodules and is a slot-separated structure with
connectors for mounting submodules and a terminal block for connecting external
circuits.
The chassis modules are divided into three types and come with different numbers of
slots:
• Main module - chassis with slots for installing all types of submodules;
• control module - chassis with slots for installing interface submodules only;
• Expansion module - chassis with slots for installing I/O submodules.

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Hardware configuration

Main module
Slots for installing interface submodules

Slot

Slot
Slot
Slot

Slot
Slot
Slot
B1

B2

...

N
3
1

2
Slots for installing I/O submodules

Control module Expansion module

Slots for installing interface submodules Slots for installing I/O submodules

Slot
Slot

Slot

Slot
Slot
Slot
Slot
B2
B1

...

N
1

Figure 4 – Example chassis modules

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Hardware configuration

Connectors for connecting submodules to the internal


data bus and power bus A

Bus power
inputs A

Connectors for connecting Submodule


submodules to external – + – + ground
signal lines and power buses A1 A2 connector
B and C

Communication ports IN and OUT


for second RegulBus
communication between the
controller crates Slot coding
key slots
IN

IN
Communication ports IN and OUT
В1 В2
for the first RegulBus
OUT

OUT
communication between the
controller crates

Address switch to А1 А2 С I1 O1 I2 O2
set the crate
address

Power supply indicators on


Bus power input Terminal block for
busbar inputs A and C
terminal block B input of signal
and C circuits
Interface status indicators (SFP L(+) N(-) A B
connectors only)

24(+) 0(-) C D

E F

Figure 5 – Fragment of the main module

Chassis modules have a universal design with distinctive features. The main elements
of the chassis modules design:
1. Addressing. Each rack in the controller is assigned an address. This address is set by three
rotary switches on the front panel of the main module or control module. The switches are
programmed from 0 to 9. Each switch (starting from the left) stands for the corresponding digit:
the first one for hundreds, the second one for tens, the third one for ones. The range of valid
addresses is from 0 to 255. The address of a subrack can be set arbitrarily, without regard to the

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Hardware configuration

physical order of the subrack connections, but it must always be the same as the address
assigned to that subrack in the Epsilon LD development environment.
2. Indications. Indicators installed in the main module and the control module are divided into
two groups:
3. indicators of power supply on busbar inputs "A" and "C" - the first group of four
indicators shows the following (starting from left to right):
• "A1" - lights up when there is input voltage on the 1st input of bus "A";
• "A2" - illuminated when there is input voltage on the 2nd input of bus "A";
• not used;
• "C" - illuminated when there is input voltage on the bus "C" input;
4. interface status indicators (only for SFP connector) - the second group of four indicators
shows the following (starting from left to right):
• "I1" - lit when there is an initialized SFP module on the port IN1;
• "O1" - lights when there is an initialized SFP module on port OUT1;
• "I2" - Illuminates when there is an initialized SFP module on port IN2;
• "O2" - Lights when there is an initialized SFP module on port OUT2;
5. Communications. The main module and the chassis control module include a RegulBus node
containing two pairs of communication ports on the front panel. The IN and OUT
communication ports, designated B1, are used to communicate on the first RegulBus by means
of the interface module installed in slot B1. The communication ports IN and OUT, designated
as B2, are used in the redundant controller and are intended for communication on the second
RegulBus by means of the interface module installed in slot B2.
6. External circuits. Each slot designated for installation of an I/O submodule includes an input
terminal block for direct connection of external signal circuits (from field devices). Each
terminal block is factory marked with Latin letters from A to F.
7. Power input. The chassis module has a distributed power supply system for submodules,
external electrical circuits and the rack as a whole, consisting of three independent buses:
internal power bus "A" and two external buses "B", "C".
8. Two inputs ("A1", "A2") on the front panel of the main module and control module are
provided for bus "A", united by means of diode "OR".

Each chassis module has a separate power input for buses "B" and "C":
• In the main module and control module, the power supply is connected to any
of the two terminals located in slots B1, B2;

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Hardware configuration

• In the expansion module, the power input is on the leftmost terminal block
(Figure 6).

Bus power
input terminal
block B and C

Terminal
block for input
of signal
circuits

Figure 6 – Fragment of the expansion module

1. Inter-module connection. The chassis modules are combined into the rack
using inter-module connectors "X1", "X2", "X3", located on the left and right
sides of the chassis (Figure 7). These connectors are switched by means of
plug connectors (see the section "Power distribution inside the rack).
2. Module ground contact (Figure 7).

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Hardware configuration

Inter-module connector X1 provides


switching of chassis modules with each
other via internal data bus and power bus
A

Earthing contact in the form of a


metal tendon, which ensures the
attachment of the chassis module
to the carrier rail and its earthing

Connector intermodule connection X2


provides switching of chassis modules with
each other through the power bus B

Connector intermodule connection X3


provides switching of chassis modules with
each other through the power bus C

Figure 7 – Side view. Intermodule connectors

All chassis modules have the same height and depth, but different length (L). The chassis
module dimensions are shown in Figure 8.

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Hardware configuration

Figure 8 – Dimensions of chassis modules with installed submodules

L – the module length value varies depending on the module type and the number of
slots. The specific length value is given in the module section of this document.

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Hardware configuration

Controller configurations
Placement of modules in the rack
The R100 Expansion Rack must contain one (and only one) Control Module or Main
Module. The control module is designed for installation of two interface submodules.
In the main module, only the first two slots, listed as B1 and B2, are designated for the
interface submodules, the remaining slots are occupied by I/O submodules in free
order.
There is a limit on the number of chassis modules in a rack (Figure 9):
• up to four expansion modules can be connected to the main module;
• Up to five expansion modules can be connected to the control module.

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Hardware configuration

Rack
Control module Extension module Extension module

B1 B2 + 1 2 ... N ... 1 2 ... N

Up to five expansion modules per rack

Main module Extension module Extension module

B1 B2 1 ... N + 1 2 ... N ... 1 2 ... N

Up to four expansion modules in one rack

Control module (main


Extension module module) Extension module

1 2 ... N + B1 B2 ... + 1 2 ... N

Expansion modules can be connected to a control module or main


module either on the left or on the right

Figure 9 – Composition of one rack

Combining racks in the controller


Expansion racks of the REGUL R100 controller can be used as part of the controllers,
whose basic rack is represented by the modules of the REGUL R600, R500, R400,
R200 series. One controller can include up to 255 REGUL R100 controller racks.
Communication of the base rack with the expansion racks is carried out via the
RegulBus.
It is possible to connect the expansion lattices either by the "ring" scheme (Figure 10)
or by the "star" scheme (Figure 11). The "ring" connection will redundant the

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Hardware configuration

communication line and in case one of them breaks, the controller will continue to
function in full.
Standard Category 5 (Cat. 5) copper cables with a standard Ethernet interface
termination scheme are used as connection cables. The permissible distance between
racks connected by one cable should not exceed 100 meters. If IN and OUT ports with
an SFP interface are used, the distance is determined by the characteristics of the SFP
modules (SFP modules themselves are not included with the R100 controller and are
purchased separately).

ATTENTION!
! When switching the racks, the RegulBus should only be connected under one number,
i.e. the OUT port (B1) can only be connected to the IN port (B1) and the OUT port (B2) to
the IN port (B2).

ATTENTION!
! Do not switch the two buses to each other, otherwise it may lead to loss of
communication on both RegulBus.

Modules with RJ45 interface have built-in electrical protection against mis-switching.
Modules with SFP interface have no such protection, and the user, when using a
redundant controller, in order to protect against the consequences of improper
switching, is recommended to use SFP-modules with WDM function. In this case, to
install
SFP-modules should be installed "crosswise", ie port OUT (B1) set transceiver with a
wavelength of X receiver and Y transmitter, and the port OUT (B2) - Y and X,
respectively. Then transceivers with wavelength Y for receiver and X for transmitter
must be installed in IN port (B1), and X and Y respectively in IN port (B2).
You can also use SFP modules with different wavelengths or different connectors (e.g.
SC and LC) for different RegulBus.

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Hardware configuration

OUT IN

IN B1

OUT

IN B1

OUT

Figure 10 - Connecting R100 expansion racks to R400 in a "ring" scheme

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Hardware configuration

IN B1

B1
OUT

IN B1

OUT

IN B1

Figure 11 - Connecting R100 expansion racks to R500 in a star configuration

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Hardware configuration

"Hot" replacement of controller modules


The controller supports hot-swapping of all submodules. The remaining submodules
are fully functional.
If an interface submodule is removed from the slot, the RegulBus communication of
the submodule with the CPU module operating on the RegulBus is interrupted.
Therefore, hot-swapping of an interface submodule can only be done if the module is
operating as part of a redundant controller, and the other RegulBus communication
will be present for the entire time during which the replacement is to take place.

Power distribution within the rack


There are three power buses inside the rack - internal and two external (Figure 12).
The internal power bus "A" is designed to supply power to electronic components of
submodules which do not directly interact (separated by basic galvanic isolation)
with the channel part of the submodule. The rated voltage of bus "A" is 24 V DC, the
maximum current is 12 A.
External power bus "B" is designed to supply input and output digital channels with
voltage up to 220 V AC/DC. Maximum bus "B" current - 16 A.
External power bus "C" is designed to supply channel-forming electronic components
of submodules, as well as to supply power to the channel itself (both via galvanic
isolation and without it). The rated voltage of bus "C" is 24 V DC, the maximum
current is 20 A.

Control
Extension module Extension module Extension module Extension module
module
24V DC
24V DC

Power bus A

B1 B2 1 2 ... N 1 2 ... N 1 2 ... N 1 2 ... N

Power bus B

Power bus C

24V DC 24V DC 24V DC V AC/DC


V AC/DC V AC/DC

Figure 12 - Wiring and power distribution within the rack

Bus "A" is common (electrically connected) for all modules within one rack.
Bus "B" and "C" can be segmented within the rack in increments of one module.

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Hardware configuration

For this purpose, each module has an individual power supply input for these
buses, as well as inter-module connectors "X2" and "X3", which are used to
combine bus "B" and "C" (respectively) of different modules into one segment.

The load in the segment is evenly distributed, so power can be supplied to any
portion of the "B" and "C" buses. In order to increase the load capacity of these
buses within one rack, multiple power inputs to the same segment can be made
by means of terminals located in each module. It must be ensured that the load
on any segment of the busbar does not exceed the maximum current set for it.

ATTENTION!
! One power input terminal block of buses "B" and "C" is designed for a maximum load
current of 12A. Thus, in case the power supply segment of these buses consists of only
one module (the module is not connected by means of inter-module connectors "X2" and
"X3" to other modules), the maximum current of these buses must not exceed 12A.

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Hardware configuration

Redundancy of controller modules


The R100 controller modules support operation in a redundant controller of the
REGUL series. Redundancy is realized by the possibility of installing two interface
submodules that exchange two RegulBus independently of each other.
Expansion racks based on REGUL R100 can operate in the REGUL controllers
configured according to the following schemes of redundancy:
• full redundancy;
• partial redundancy;
• combined redundancy scheme.

Full redundancy
In this redundancy scheme, there are two identical sets of expansion racks combined
into one redundant controller. The interconnection takes place through a redundant
communication link between the CPU modules, one of which is the master and the
other is the slave (Figure 13). In a full redundancy scheme, each expansion frame
communicates with only one CPU module.

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Hardware configuration

Figure 13 - Full controller redundancy scheme using REGUL R500 series modules

At the same time both parts of the redundant controller are in operation, measuring
in all submodules/input modules, information processing and algorithm execution in
both CPU modules, and issuing commands to all output submodules. However, only
the output submodules connected to the CPU master directly issue control
commands.
R100 full redundant expansion racks include one interface submodule each. The
submodule itself is installed in the slot corresponding to the bus number to which the
module is connected.

Partial redundancy
The controller configured in this way uses two CPU modules and one set of expansion
racks. Because the controller has two RegulBuses, the CPU modules communicate
with the expansion racks on their own buses. In a partial redundancy scheme, each
expansion frame communicates with both CPU modules (Figure 14).

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Hardware configuration

B1 B1

IN OUT

B2 B2

IN
IN
OUT B1 B2

OUT

Figure 14 - Partial redundancy scheme of the controller using the REGUL R500 series modules

To synchronize operation, as in the case of the full redundancy scheme, the CPU
modules are interconnected via a redundant communication line.

Combined redundancy scheme


In this redundancy scheme some of the expansion frames are duplicated and work
with only one CPU module, as in the case of full redundancy, and some are present in
a single instance and exchange data with both CPU modules (as in the partial
redundancy scheme). The number of possible variants of this type of redundancy
schemes is unlimited. Figure 15 shows one of them.

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Hardware configuration

B1 B1

IN OUT IN OUT

B2 B2

IN

IN
OUT B1 B2

OUT

IN

IN
OUT B1 B2

OUT

Figure 15 – Combined controller redundancy scheme using REGUL R500 series modules

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Hardware configuration

Mounting
The controller is mounted on a standard DIN rail with a width of 35 mm. The
recommended height of the DIN rail is 15 mm. The carrier rail can be attached
directly to the cabinet mounting panel, either vertically or horizontally.
To mount a chassis module to a DIN rail, first hook the top brackets (with the ground
contact integrated into them) onto the rail and then push the module down to snap
the bottom bracket into place (Figure 16).

Figure 16 – Installing the chassis module

To remove the chassis module from the rail, hook one bottom latch, pull the latch
down (1) and pull the bottom of the module (2), then do the same with the remaining
latches, or simultaneously perform the same manipulation with all the fasteners
(Figure 17).

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Hardware configuration

Figure 17 - Removing the chassis from the rail

Inter-module connectors located on the left and right sides of the chassis module are
used to interconnect the modules. The connectors are switched using the plug
connectors supplied with the chassis module. To enable switching on the internal
data bus and power bus "A", a plug connector must be installed in connector X1
(Figure 18).

Figure 18 - Installation of a plug connector for switching on the internal data bus and

power bus "A"

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Hardware configuration

In order to ensure switching through the power bus "B" and "C" it is required to
install a plug connector in connectors X2 (Figure 19) and X3 (Figure 20) respectively.
If there is a need for separate power supply of these buses for different modules of
the chassis, plug connectors are not installed in these connectors (see description of
power supply organization in "Power distribution inside the rack" section).

Figure 19 – Installing the plug connector for switching bus "B"

Figurte 20 - Installing the plug connector for switching bus "C"

For switching on all buses, it is necessary to install plug connectors in all connectors X1, X2, X3 (Figure 21).

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Hardware configuration

Figure 21 - Installation of a plug connector for switching on all buses

After installing the required connectors, the next module of the chassis is placed on
the DIN rail and docked with the already installed (Figure 22).

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Hardware configuration

ATTENTION!
! Minimal longitudinal movement of the module mounted on the DIN rail (sufficient to
connect the modules) is allowed. Significant movements of the DIN rail-mounted module
(e.g. to change its location) are not allowed, in order to avoid deformation of the
module's grounding contact.

Figure 22 – Chassis module docking

The chassis modules, due to the inter-module connectors on both sides, can be
docked on either left or right side. The rack can be assembled in any order.
At the ends of the rack, on both sides, end stops are installed to provide mechanical
fixation of the device (Figure 23).

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Hardware configuration

Figure 23 – Mechanical fixation of the entire rack on the rail on one side

The rack is disassembled in the reverse order.

ATTENTION!
! Assembly and disassembly of the racks, as well as assembly/disassembly of the plug
connectors, must be carried out with complete de-energizing of the entire rack.

After the modules are installed in the chassis slots, submodules are installed
according to the configuration of the specific project. When a submodule is first
installed, the chassis slot is coded (see "Chassis slot coding").
The submodule in the slot can be in two positions:
• mounting - the submodule is fixed in the slot, but not connected to the
connectors of the chassis;
• working - the submodule is fixed in the slot and connected to the connectors of
the chassis.
The diagram of installation of the submodule in the mounting position is shown in
Figure 24.

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Hardware configuration

Figure 24 - Installing the submodule to the mounting position (view of the submodule from both sides)

Pressing further from the top will place the submodule in the working position
(Figure 25).

Figure 25 - Installing the submodule to the working position

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Hardware configuration

To remove the submodule, simultaneously press the latch (1) and pull the submodule
up (2), removing it from the slot (Figure 26).

Figure 26 – Removal of the submodule from the chassis

ATTENTION!
! The design and circuit design allows the submodule to be mounted/dismounted in a
functioning controller with power and external circuits connected. However, in order to
avoid arcing in the submodule connector, the power circuits switched by the submodule
must be de-energized beforehand.

For natural cooling of the controller, as well as for ease of installation and operation,
there should be a free space around the perimeter of the controller, at least as shown
in Figure 27.
The controller is grounded by means of a DIN rail ground.

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Hardware configuration

Figure 27 - Minimum free space around the perimeter of the controller

36
Hardware configuration

Chassis slot coding


In order to prevent erroneous installation of a submodule in a chassis slot not
intended for that type of submodule, there are keys in the lower part of the housing
which encode the slots for the corresponding submodule type when it is first
installed.
Each submodule contains two keys. In turn, each key consists of two components, one
of which is installed in the submodule and the other in the chassis slot (Figure 28).

Figure 28 - Submodule keys

The keys are part of the submodules and are supplied pre-installed in the position
corresponding to the given submodule type. When a submodule is initially installed,
the slot is automatically coded for the corresponding type (Figure 29).

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Hardware configuration

Figure 29 – Chassis slot coding

If you need to install a different type of submodule in the chassis, you can remove the
encoding keys from the slot and re-encode it.

Organization of commutation of external circuits


The submodules are equipped with disconnectors (QS1 and QS2) for breaking
external circuits (e.g. for measuring purposes). The normal position of the
disconnector (recessed) determines the closed state of the respective circuit (see the
schematic diagram of the corresponding submodule).
To break the circuit, unscrew the disconnector slider with a flat-blade screwdriver,
turning it counterclockwise (Figure 30).

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Hardware configuration

Figure 30 – Screw breaker to break the measuring circuit

The disconnector can be left in the open position indefinitely (e.g. for the purpose of
permanently disconnecting the circuit).

ATTENTION!
! The disconnector is not equipped with an arc-quenching chamber, so it is necessary to
disconnect the power circuit only after it has been de-energized.

To access the test sockets and jumpers/fuses, it is necessary to open the cover of the
submodule.
To set the required functionality of operation, guided by the structural diagram for
the submodule, it is necessary to install a jumper/fuse in the socket by closing the
appropriate contacts (Figure 31).

39
Hardware configuration

Figure 31 – Fuse installation

To make an electrical measurement of the circuit, insert the probe all the way into the
appropriate test sockets (Figure 32).

40
Hardware configuration

Figure 32 - Measurement of electrical circuit parameters

Parameters for connecting external circuits


Connection of external circuits to the submodule is made by means of the signal
circuit input terminal block, located in the corresponding chassis slot.
The terminal block is designed for a cross-sectional area:
• 0.2 mm² to 2.5 mm² for a rigid conductor;
• 0.2 mm² to 1.5 mm² for a flexible conductor.
The cable length to be connected to the submodule terminal block must not exceed
200 meters.

41
Hardware configuration

CONTROLLER MODULES
General information
The unit designation of the REGUL R100 controller modules is formed as follows:

Example of sub-module symbol - R100 AI 02 011-100, where:


• R100 - controller model;
• AI - analog input;
• 02 - number of channels;
• 011 - serial number in the model range and development number
• 100 - additional code A 0 0, where "A" takes value:
o "0" - no built-in power supply with galvanic isolation;
o "1" - presence of built-in power supply with galvanic isolation.
The galvanically isolated power supply in I/O submodules is installed in the power
supply circuit from the external bus "C".
The full name of the submodule is formed from the name of the submodule and its
designation. An example of the full name when ordering or specifying it in the
submodule documentation is: R100 AI 02 011-100 Analog input submodule.

42
Hardware configuration

Indicators of input/output submodules are divided into two major groups:


The controller submodules have a set of program-configurable parameters that can
be mapped to application program variables in the Epsilon LD development
environment. A list of parameters is given in the table "Parameter settings for
submodule..." per submodule.
In addition, most submodules have a certain number of logical I/O channels to which
application variables can be bound. Some of these logical I/O channels correspond to
certain "physical" inputs/outputs of the submodule and some are bound to internal
registers of the submodule. As with submodule parameters, the logic I/Os are also
available for user configuration in the Epsilon LD development environment. A list of
logic inputs/outputs is listed in the table "Submodule I/O Data Registers ..." per
submodule.
The I/O submodule indicators are divided into two main groups:
• service indicator (submodule status) - displays the submodule status and its
operation in the controller (RUN indicator);
• Functional indicators (status of channels and power supply) - displays the
execution of the functionality of the submodule and the presence of power
supply for the channel. The operation algorithm of the indicators is described
in the corresponding sections of this document dedicated to the specific
submodule.
See Table 1 for the correspondence of the RUN indicator to the operation mode of the
submodule.

Table 1 - RUN indicator algorithm on I/O submodules

RUN indicator Submodule status


status
Off No power to submodule or fatal submodule error
Lights up red There has been no internal bus communication with the submodule since it was
turned on (submodule not configured)
Flashing red The submodule type does not match the controller configuration
Flashing green The submodule was previously configured, but there is currently no communication
with the interface submodule

On The submodule is configured and communicating on the internal data bus (submodule
normal state)

43
Interface submodules

Interface Submodules
Part-number Description
R100 ST 00 011 Interface submodule, installation in chassis modules with RJ45
interface for RegulBus connection
R100 ST 00 111 Interface submodule, installation in chassis modules with SFP
interface for RegulBus connection

The interface submodules allow the connection of the R100 expansion rack to the
RegulBus data bus of the REGUL series controllers.
The interface submodule is installed in slot B1 for bus 1 and in slot B2 for bus 2.
For each RegulBus there are IN and OUT connection ports on the front panel of the
chassis module.

44
Interface submodules

Table 2 - Technical characteristics of interface submodules ST 00 011, ST 00 111

Value
Parameter name, unit of measurement
ST 00 011 ST 00 111

Supports the RegulBus expansion function yes


Supports RegulBus redundancy function yes
Interface (IN and OUT ports) RJ45 SFP
Power consumption, W, max. 2
Operating conditions:

ambient air temperature, ºC – 40 … + 70

relative air humidity, % 5 … 98


Without condensation
Storage conditions:

ambient air temperature, ºC – 55 … + 70

Relative humidity of air, % 5 … 98


Without condensation
Degree of protection against external influences IP20
Dimensions (WxHxD), mm 13х124х91
Weight, kg 0.06

The indicators of the interface submodule are divided into two groups:
• group of service indicators (submodule status) - displays the submodule
status and its operation within the controller, as well as the status of the rack
under control of the submodule (indicators RUN and ERR);
• a group of communication indicators - displays the status of communication
via RegulBus of the submodule (indicators IN and OUT).
The RUN and ERR LEDs correspond to the operation mode of the submodule in
Tables 3 and 4, respectively.

Table 3 - Algorithm of the RUN indicator on the interface submodule

RUN indicator Submodule status


status
Off No power to submodule or fatal submodule error
Lit red The submodule is not configured and/or there is no RegulBus communication
Lit yellow The submodule is configured and communicates via RegulBus, but does not output
any data to the output channels of I/O submodules (the bus, as well as the CPU module

45
Interface submodules

RUN indicator Submodule status


status
connected to it, are redundant)
Flashing green The RegulBus has been exchanging data since it was switched on, but later the
communication with the CPU module has been lost
Lit green The submodule is configured and communicating via RegulBus (submodule normal
state)

Table 4 - Operating algorithm of the ERR indicator on the interface submodule

ERR indicator Submodule status


status

Off No hardware error (all submodules in the kit are configured and communicate with
them)
Lit yellow All submodules are configured and communicating with them, but there are
submodules in the rack that are not specified in the project
Flashing red The configuration has not been obtained (for example, because there is no
communication with the CPU module), so the presence or absence of a hardware error
in the krait cannot be determined
Lit red Missing or faulty one of the sub-modules in the krait
The correspondence of the IN/OUT indicator lights to the RegulBus communication status of the
submodule is shown in Table 5.

Table 5 - IN/OUT indicator operation algorithm

IN/OUT Submodule status


indicator
status
Off No physical port connection
Lit green There is a physical port connection, but no RegulBus communication
Flashing green There is RegulBus communication
Lit red There is physical connection of the ports, but different RegulBus of the controller is
interconnected

46
Analog input submodules

Analog input submodules


Unit designation Submodule name
R100 AI 02 011-100 Analog input submodule,
2 channels, current 0 to 20 mA, 4 to 20 mA
R100 AI 02 041-100 Analog input submodule,
2 channels, minus 5 to plus 5 V, 0 to plus 5 V,
minus 10 to plus 10 V, 0 to plus 10 V

Input signal processing in analog input submodules


The analog input modules provide the user with information about the input signal in
three variants:
• the code of analog-to-digital converter (ADC) reduced to the operating range;
• value of electrical value of the input signal (mA, V);
• values of engineering quantity measured by the primary transducer (pressure,
temperature, mass, level, etc.).
The signal conversion algorithm is as follows: the analog signal at the ADC input is
converted into the instantaneous value of code A (according to Table 6),
corresponding to the input signal, taking into account the calibration coefficients.

Table 6 - Representation of analog quantities in measurement ranges

Negative Negative
Operating range Reloading Overflow
overflow overloading
< – 11.0315 V – 11.0315 V – 10 … 0 V 0 …10 V 11.0315 V >11.0315 V
8008 8009-8BFF 8C00-FFFF 0000-7400 7401-7FF7 7FF8

< – 11.0315 V – 11.0315 … 0.0003 V 0 … 10 V 11.0315 V >11.0315 V


8008 8009-FFFF 0000-7400 7401-7FF7 7FF8
< – 5.157 V – 5.5157 V –5…0V 0…5V 5.5157 V > 5.5157 V
8008 8009-8BFF 8C00-FFFF 0000-7400 7401-7FF7 7FF8
< – 5.157 V – 5.5157 … – 0.0003 V 0…5V 5.5157 V > 5.5157 V
8008 8009-FFFF 0000-7400 7401-7FF7 7FF8
< – 22.0629 mA – 22.0629 … – 0.0007 mA 0 … 20 mA 22.0629 mA > 22.0629 mA
8008 8009-FFFF 0000-7400 7401-7FF7 7FF8
< – 13.6503 mA – 13.6503 … 3.9995 mA 4 … 20 mA 21.6503 mA > 21.6503 mA
8008 8009-FFFF 0000-7400 7401-7FF7 7FF8

47
Analog input submodules

Calculation of the electrical quantity Yi is made by the formula

, (1)

where k0 and k1 are coefficients of conversion of ADC code to electrical quantity,


which are parameters of channel calibration and are individual for each measuring
range of each analog channel.
After the electrical quantity Yi, is obtained, the current average value of the electrical
quantity Ui is calculated as an exponential weighted moving average using the
formula

, (2)

where λ is the averaging coefficient (set by the user).

Figure 33 - Dependence of the analog signal on the averaging coefficient λ

The engineering value Xi is calculated by the formula

, (3)

where K0 and K1 are coefficients of conversion of electrical value to engineering value.


These coefficients are set by the user. They are individual for each analog channel.

48
Analog input submodules

Control of the measuring range limits


At each of the three stages of the conversion of the input analog signal an algorithm
functions to check the signal for out-of-bounds:
• when the signal reaches the ADC measurement limits (the maximum or
minimum ADC code comes), the value of the physical quantity is equal to the
maximum or minimum possible value for this type of data respectively and the
sign of channel unreliability by exceeding the lower or upper limits of ADC is
exhibited;
• If the electrical value Yi reaches the minimum possible Ymin (for example, less
than 4 mA), the sign of signal exceeding the lower boundary of the electrical
value measurement is exhibited. If the value of Yi is higher than the maximum
possible Ymax (for example, more than 20 mA), then sets the sign of the signal
exceeding the upper limit of measurement of electrical quantity;
• The exceeding of the limits of the engineering value is processed similarly to
the exceeding of the limits of the electrical value. The limits of the engineering
value are set by the user.

Control of the measuring range limits


At the stage of conversion of the input analog signal the algorithm for checking the
signal for exceeding the limits functions. In particular, when the signal reaches the
ADC measurement limits (the maximum or minimum ADC code comes), the value of
the physical quantity is equated to the maximum or minimum possible value for this
type of data respectively and the sign of invalid channel by exceeding the lower or
upper limits of ADC is exhibited.

Signal Burst Control


In addition to tracking the signal out of the measurement limits, the signal outlier is
also monitored and the channel is rejected when certain conditions are reached.
The outlier is detected as follows:
Initially the user sets the maximum rate of change of the engineering value Vmax. The
speed of change of the engineering value Vi means the increment ΔX of the value X
during one cycle of polling of all unmasked channels (the maximum cycle value is
equal to the value of the parameter "Conversion time per submodule, ms"). In case of

49
Analog input submodules

parallel polling of channels the cycle time does not depend on the number of masked
channels and is always equal to the conversion time per submodule.
Example
There is a container with liquid. The user knows that the liquid level cannot increase
or decrease faster than 1 m in 30 seconds. Based on this, it is calculated how the level
can change per polling cycle (e.g. 2 ms) and specified as the maximum speed Vmax.
If the current rate of change Vi is greater in modulo than Vmax, it is considered that the
ejection has started and all instantaneous values are discarded until its end. At the
moment of the start of the emission the last valid instantaneous value X0 is
memorized, which is substituted in each measurement cycle until the end of the
emission.
For each new Xi, some X′i is calculated, which is the theoretical possible value of the
engineering quantity, changing with the speed Vmax in the same direction in which the
emission is detected.
The theoretical value of X′i is calculated by the formula

, (4)

where is equal to X, and the sign in front of ΔXmax depends on the direction of the
burst.

Options for the end of emission processing


Once the condition is reached

Xi ≤ ,( ) or Xi ≥ ,( ),

check the direction of further changes in the value:


• if the direction of change of the value Xi coincides with the direction of the
ejection (example in Figure 34), or Xi stops changing (const), the processing of
the ejection ends immediately;

50
Analog input submodules

Figure 34 - The direction of change of the value Xi coincides with the direction of ejection

• if the direction of change of the value Xi does not coincide with the direction of
the ejection, then wait for 100 ms, and then forcibly end the processing of the
ejection (an example is in Figure 35).
If the ejection has not ended after 100 ms, the procedure will start again in the first
measurement cycle, after the previous ejection processing has been deactivated.

Figure 35- The direction of change of the value Xi does not coincide with the direction of the emission

In the figures, the green color shows the signal at the input, the red shows the
processing in the submodule.
During outlier processing averaging is not performed, the last valid instantaneous
value X0 is transmitted. When the outlier processing ends, the averaging cycle starts
from the beginning, the first value is the last valid instantaneous value X0, fixed before
the outlier.
The channel reject sign, if it was set during outlier processing, is removed after the
processing is finished.

51
Analog input submodules

Status of channel rejection by emission


The channel reject status by outlier is formed only when the averaging algorithm is
on. The channel reject status is formed after the time from the beginning of the signal
outlier exceeded the time of insensitivity to outliers, defined in ms (parameter
"Insensitivity time"). Time of insensitivity to outliers gives users the possibility to set
the change so that the channel reject status is formed with a delay.
If the "Insensibility time" is "0", then the status of channel rejection will be set
immediately after the start of the outlier.
If the user admits the presence in the averaged measured value of a certain share of
unreliable values resulting from freezing the current value for the ejection time, he
can set the insensitivity time value other than "0". So, at an averaging cycle of 100 ms,
the user, setting the dead time value equal to 10 ms, allows the presence of 10%
invalid values in the final averaged value. However, it should be taken into account
that by defining such a dead zone there is a possibility that the emission will end
before the dead time expires and the signal rejection status will not be set.
Indication
Correspondence of the function indicators of the submodule:
• indicator CH1/CH2 - input channel state is presented in table 7;
• indicator PWR - external power supply status of the channels is presented in
Table 8;

Table 7 - Analog input submodule channel status indication

Indicator status Channel status


CH1/CH2
Off Channel is masked or there is no power to the DAC
Lit Input signal is in the measurement boundary of the electrical quantity
Lit yellow Input signal has exceeded the measurement threshold
Lit red Input signal has exceeded the ADC measurement limit, possible causes are
breakage of sensor lines or short circuit on the lines

Table 8 - Indication of external power supply to the submodule channels

Indicator status External power status of the channel


PWR
Lit green External power supply is normal
Lit red External power out of tolerance or not present

52
Analog input submodules

AI 02 011-100 Analog input submodule


The submodule is designed to input analog DC signals in the range of 0 to 20 mA, 4 to
20 mA, with the function of channel power supply from the submodule
Measurement channels can be both passive and active, guided by the structural
diagram, you must install a jumper/fuse in the connector by closing the appropriate
contacts of the circuit. In the passive channel, the power supply of the analog circuits
is provided by an external power supply, in the active channel - from the built-in
power supply with galvanic isolation.
The connection scheme, depending on the type of external device (sensor), is
selected for each of the channels separately.
For its operation, the submodule requires operating voltage on the external power
bus "C".
The submodule consists of the following basic elements:
• microprocessor;
• single analog-to-digital converter (ADC) for all measurement
channels;
• power supply (DC/DC converter) with galvanic isolation;
• indication node.

53
Analog input submodules

Table 9 – Technical data of analog input submodule AI 02 011-100

Parameter name, unit of measurement Value


0 to 20 mA / 4 to 20 mA current conversion channel

Number of channels 2

Nominal ranges of DC power conversion, mA 0 … 20 / 4 … 20

Extended range of DC power conversion, mA 0 … 25

Limits of acceptable basic reduced error of dc conversion (in nominal ±0.1


ranges), %
Maximum permissible additional reduced error of DC power conversion ±0.002
when the ambient air temperature changes, %/°C
Permissible input current, mA 40

Input impedance, ohm, not more 50

Bit depth (including overload area), bits 16

Conversion time per channel, msec

Channel polling Parallel

Conversion time per submodule, ms

Two-wire sensor connection (passive current sensor) Yes


Three-wire sensor connection (passive current sensor) Yes

Four-wire sensor connection (active/passive current sensor) Yes

Isolation breakdown voltage (galvanic isolation), V, not less:

between conversion channels and power supply bus "A"/internal data bus 4000

Between the conversion channels and protective earthing 4000

Between conversion channels ⎯

Power Channel Characteristics

Power supply voltage from power bus "C", V 20.4 … 28.8

Power consumption from the power bus "C", W, max. 2.1

Maximum load of power supply, W 1.2

Isolation breakdown voltage (galvanic isolation), V, no less:

between power supply channel and power supply bus "A"/internal data 4000
bus
between the power supply channel and conversion channels 4000

54
Analog input submodules

Parameter name, unit of measurement Value


General characteristics of the submodule

Power consumption from the power bus "A", W, max 0.15

Overcurrent protection Yes

Operating conditions:

ambient air temperature in normal conditions, ºC + 15 … + 25

ambient air temperature in working conditions, ºC – 40 … + 70

Relative air humidity, % 5 … 98


Without condensation
Storage conditions:

ambient air temperature, ºC – 55 … + 70

Relative humidity of air, % 5 … 98


Without condensation
Degree of protection against external influences IP20

Dimensions (WxHxD), mm 13х124х91


Weight, kg 0.07

55
Analog input submodules

R100 AI 02 011-100

Internal data
bus
24 V(+)
Power bus A 0 V(-)

Indicators
RUN
MPU
PWR

CH1
ADC
CH2
QS2
4 6
Submodule
Chassis module

QS1
2 5

7 8
9 8

10 11
12 11

+ - + -

1 3

24 V(+)
Power bus C
0 V(-)

Terminal 24 V(+) PWR A B 0 V(-) PWR


block for
input of signal I(+) CH1 C D I(-) CH1
circuits
I(+) CH2 Е F I(-) CH2

Unit
Name
designation
MPU Microprocessor
ADC Analog to digital converter
QS1(QS2) Disconnector
1...6 Test Sockets
7...12 Contacts for jumper/fuse installation

Figure 36 – Block diagram of submodule AI 02 011-100

56
Analog input submodules

Channel One

Connection type Four-wire, externally


Two-wire Three-wire Four-wire
powered

Bus C power
supply

Jumper position 8 9 8 9 7 8 7 8

+ - + - + + - + - + - + - + -
Imes Upow Imes Upow Imes Imes Upow Upow
Sensor Sensor Sensor Sensor Power
supply

Second channel

Connection type Four-wire, externally


Two-wire Three-wire Four-wire
powered

Bus C power
supply

Jumper position 11 12 11 12 10 11 10 11

+ - + - + + - + - + - + - + -
Imes Upow Imes Upow Imes Imes Upow Upow
Sensor Sensor Sensor Sensor Sensor

Figure 37 – Diagrams for connecting external devices (sensors) to submodule AI 02 011-100

Table 10 - AI 02 011-100 submodule settings

Parameter Data type Default value Description

57
Analog input submodules

Parameter Data type Default value Description


Masking Channel masking:
BOOL 0 0 - the channel is not masked,
1 - the channel is masked (not processed)
K0 coefficient K0 coefficient of conversion of electrical
REAL 0.0
quantity to engineering quantity
Factor K1 K1 Conversion factor of electrical quantity to
REAL 1.0
engineering quantity
Factor K0_mA set during Coefficient k0 to convert ADC code to
REAL
calibration current (0 to 20 mA / 4 to 20 mA)
Coefficient K1_mA set during Ratio k1 of ADC code conversion to current
REAL
calibration (0 to 20 mA / 4 to 20 mA)
Channel type Channel type:
BYTE 2 2 - 4 to 20 mA;
4 - 0 to 20 mA
Type of transmitted Type of transmitted value:
value 0 - ADC codes;
BYTE 0
1 - electrical units;
2 - value of physical quantity
Averaging factor λ Averaging coefficient λ in the value range
REAL 0
[0...1], 0 - averaging disabled
Maximum signal velocity Maximum rate of change of the engineering
REAL 3.4E+38 value per cycle of sampling of unmasked
submodule channels
Insensitivity time Time interval in ms, after which the channel
BYTE 100 reject status is set. Default is 100 - channel
reject status is set after 100 ms.
Lower limit of Value of the lower limit of the engineering
REAL -3.4E+38
engineering value value

Upper limit of Value of the upper limit of the engineering


REAL +3.4E+38
engineering value value

Table 11 - AI 02 011-100 submodule I/O data registers

Data type Purpose


Status of the submodule:
BYTE Bit 6 is the output power in the submodule;
Bit 7 - power supply status on bus "C"

58
Analog input submodules

Data type Purpose


Channel N, where N is the serial number of the channel
REAL Channel N data
Status of channel N:
Bit 0 - rejection of the channel by outlier;
Bit 1 - signal output beyond the upper limit of engineering value
measurement;
Bit 2 - signal output beyond the lower limit of engineering value
measurement;
BYTE Bit 3 - signal output beyond the upper limit of measurement of the
electrical quantity;
Bit 4 - signal output beyond the lower limit of measurement of the
electrical quantity;
Bit 5 - unreliability of the channel for exceeding the upper limit of ADC;
Bit 6 - unreliability of the channel beyond the lower limit of ADC;
Bit 7 - hardware failure of the channel

59
Analog input submodules

AI 02 041-100 Analog input submodule


The submodules are designed to input two analog DC voltage signals, with the
function of supplying the sensor from the submodule.
The measuring range of the signals is software-configurable and lies within the
following limits:
• minus 5 to plus 5 V;
• 0 to plus 5 V.
• minus 10 to plus 10 V;
• 0 to plus 10 V.
The measuring channels are passive. The power supply of the analog circuits of the
sensor is provided by an external power supply, or from the built-in power supply
with galvanic insulation.
The connection scheme, depending on the type of external device (sensor), is
selected for each of the channels separately.
The submodule requires operating voltage on the external power bus "C" for its
operation.
The submodule consists of the following main elements:
• microprocessor;
• single analog-to-digital converter (ADC) for all measurement
channels;
• power supply (DC/DC converter) with galvanic isolation;
• indication node.

60
Analog input submodules

Table 12 - Technical data of analog input submodule AI 02 041-100

Parameter name, unit of measurement Value

0 to plus 5 V voltage conversion channel

Nominal voltage conversion range, V 0 … +5

Extended range of voltage conversion, V 0 … + 5.5

Input resistance, MOhm, not less 2

Voltage conversion channel from minus 5 V to plus 5 V

Nominal voltage conversion range, V –5…+5

Extended range of voltage conversion, V – 5.5 … + 5,5

Input resistance, MOhm, not less 2

0 to plus 10 V voltage conversion channel

Nominal voltage conversion range, V 0 … + 10

Extended range of voltage conversion, V 0 … + 11

Input resistance, MOhm, not less 2

Voltage conversion channel from minus 10 to plus 10 V

Nominal voltage conversion range, V – 10 … + 10

Extended range of voltage conversion, V – 11 … + 11

Input resistance, MOhm, not less 2

General characteristics of the conversion channel

Number of channels 2

Permissible input voltage, V 75

Limits of acceptable basic reduced error of dc voltage conversion (in


±0.025
nominal ranges), %

Maximum permissible additional reduced error of DC voltage conversion


±0.002
when the ambient air temperature changes, %/°C
Bit rate (including overload area), bits 16

Conversion time per channel, msec

Channel polling Parallel


Conversion time per submodule, ms
Three-wire sensor connection (passive sensor) Yes

61
Analog input submodules

Parameter name, unit of measurement Value

Four-wire sensor connection (active/passive sensor) Yes

Isolation breakdown voltage (galvanic isolation), V, not less:

between conversion channels and power supply bus "A"/internal data bus 4000

Between the conversion channels and protective earthing 4000

Between conversion channels ⎯

Power channel characteristics

Power supply voltage from power bus "C", V 20.4 … 28.8

Power consumption from the power bus "C", W, max. 2.1

Maximum load of power supply, W 1.2

Isolation breakdown voltage (galvanic isolation), V, no less:


between power supply channel and power supply bus "A"/internal data 4000
bus
between the power supply channel and conversion channels 4000

General characteristics of the submodule

Power consumption from the power bus "A", W, max 0.15

Overcurrent protection Yes

Operating conditions:

ambient air temperature in normal conditions, ºC + 15 … + 25

ambient air temperature in working conditions, ºC – 40 .. + 70

Relative air humidity, % 5 … 98


Without condensation
Storage conditions:

ambient air temperature, ºC – 55 … + 70

Relative humidity of air, % 5 … 98


Without condensation
Degree of protection against external influences IP20

Dimensions (WxHxD), mm 13х124х91


Weight, kg 0.07

62
Analog input submodules

R100 AI 02 041-100

Internal data
bus
24 V(+)
Power bus
0 V(-)
A

Indicators
RUN
MPU
PWR

CH1
ADC
CH2
QS2
Submodule
Chassis module

4 6
QS1
2 5

7 8
9 8

10 11
12 11

+ - + -

1 3

Power bus 24 V(+)


C 0 V(-)

Terminal 24 V(+) PWR A B 0 V(-) PWR


block for
input of U(+) CH1 C D U(-) CH1
signal
circuits U(+) CH2
Е F U(-) CH2

Unit
Name
designation
MPU Microprocessor
ADC Analog to digital converter
QS1(QS2) Disconnector
1...6 Test Sockets
7...12 Contacts for jumper/fuse installation

Figure 38 – Block diagram of submodule AI 02 041-100

63
Analog input submodules

Channel One
Connection Four-wire, externally
Three-wire Four-wire
type powered

Bus C power
supply
Jumper
position 8 9 7 8 7 8

+ - + + - + - + - + - + -
Upow Umes Upow Umes Umes Upow Upow
Sensor Sensor Sensor Sensor

Second channel

Connection Four-wire,
type Three-wire Four-wire
externally powered

Bus C power
supply

Jumper position 11 12 10 11 10 11

+ - + + - + - + - + - + -
Upow Umes Upow Umes Umes Upow Upow
Sensor Sensor Sensor Sensor

Figure 39 – Diagram options for connecting external devices (sensors) to submodule AI 02 041-100

Table 13 - AI 02 041-100 submodule settings

Parameter Data type Default value Description

64
Analog input submodules

Parameter Data type Default value Description


Masking Channel masking:
BOOL 0 0 - the channel is not masked,
1 - the channel is masked (not processed)
K0 coefficient Coefficient K0 of conversion of electrical
REAL 0.0
value to engineering value
Factor K1 Coefficient K1 of conversion of electrical
REAL 1.0
value to engineering value
Factor K0_V set during ADC code-to-voltage conversion factor k0
REAL
calibration
Factor K1_V set during ADC code-to-voltage conversion factor k1
REAL
calibration
Channel type Channel type:
0 - minus 10 to plus 10 V;
BYTE 0 1 - 0 to plus 10 V;
10 - from minus 5 to plus 5 V;
11 - 0 to plus 5 V
Type of transmitted value Type of transmitted value:
0 - ADC codes;
BYTE 0
1 - electrical units;
2 - value of physical quantity
Averaging factor λ Averaging coefficient λ in the value range
REAL 0
[0...1], 0 - averaging disabled
Maximum signal velocity Maximum rate of change of the
REAL 3.4E+38 engineering value per cycle of sampling of
unmasked submodule channels
Insensitivity time Time interval in ms, after which the
BYTE 100 channel reject status is set. Default is 100
- channel reject status is set after 100 ms.
Lower limit of engineering Value of the lower limit of the
REAL -3.4E+38
value engineering value
Upper limit of engineering Value of the upper limit of the
REAL +3.4E+38
value engineering value

Table 14 - AI 02 041-100 submodule I/O data registers

Data type Purpose

65
Analog input submodules

Data type Purpose


Status of the submodule:
BYTE 6 bits - output power in the submodule;
Bit 7 - power supply status on bus "C"
Channel N, where N is the serial number of the channel
REAL Channel N data
Status of channel N:
Bit 0 - rejection of the channel by outlier;
Bit 1 - signal output beyond the upper limit of engineering value
measurement;
Bit 2 - signal output beyond the lower limit of engineering value
measurement;
BYTE Bit 3 - signal output beyond the upper limit of measurement of the
electrical quantity;
Bit 4 - signal output beyond the lower limit of measurement of the
electrical quantity;
Bit 5 - unreliability of the channel by the upper boundary of the ADC;
Bit 6 - unreliability of the channel beyond the lower limit of ADC;
Bit 7 - hardware failure of the channel

66
Analog output submodules

Analog output submodules


Unit designation Description
R100 AO 02 011-100 Analog output submodule,
2 channels, current 0 to 20 mA, 4 to 20 mA
R100 AO 02 031-100 Analog output submodule,
2 channels, current 0 to 20 mA, 4 to 20 mA,
Minus 5 to plus 5 V, 0 to plus 5 V
minus 10 to plus 10 V, 0 to plus 10 V
R100 AO 01 531-100 Analog output submodule,
1 channel, thermal resistance sensor simulation
(5 to 200 Ohm)

Output signal processing in analog output submodules


The algorithm of the submodule is as follows: The microprocessor receives the
command to set the output value x from the central processor.
The microprocessor recalculates this value into the value of current U according to
the formula

, (5)

where K0 and K1 are signal conversion coefficients from engineering quantity to


electrical quantity.
By default the coefficients K0, K1 are "0" and "1" respectively, which means the
following equality x = U. I.e. without setting the channels from the application
program, a control signal in the form of current/voltage output value is transmitted
to the submodule. If the user wishes, the coefficients K0, K1 can be changed
individually for each channel both when configuring the controller and during
operation.
The coefficients K0, K1 are stored in the configuration file of the project in the CPU
module, so when you change the analog output submodule, they retain their value.
Then there is a recalculation of current U in the code of digital-to-analog converter C
by the following formula:

(6)

where: k0, k1 - signal conversion coefficients from electrical signal to DAC code.
Coefficients k0, k1 are calibration coefficients and are unique for each channel. Initially,
they are prescribed when calibrating the submodule at the factory.

67
Analog output submodules

Coefficients k0, k1 are stored in the submodule analog output ROM.


Indication of the status of the submodule channels: correspondence of the glow of the
submodule functional indicators to the status of the output channel is shown in Table
15.

Table 15 - Analog output submodule channel status indication

Indicator status Channel status


Off Channel is masked or there is no power to the submodule's external
circuits
Lit green Channel is normal
Lit red Open circuit in output channel

68
Analog output submodules

AO 02 011-100 Analog output submodule


The submodules are designed to output analog DC signals in the ranges of 0 to 20
mA, 4 to 20 mA, with the function of supplying the channel from the submodule.
The signal output channels can be either passive or active, guided by the schematic
diagram, you must install a jumper/fuse in the connector by shorting the
corresponding circuit contacts. In the passive channel, the power supply of the
analog circuits is provided by an external power supply, and in the active channel -
from the built-in power supply with galvanic isolation.
The wiring scheme, depending on the type of playback signal, is selected for each of
the channels separately.
The submodule requires operating voltage on the external power bus "C" for its
operation.
The submodule consists of the following main elements:
• microprocessor;
• two digital-to-analog converters (DAC);
• power supply (DC/DC converter) with galvanic isolation;
• indication node.

69
Analog output submodules

Table 16 - Technical data of the analog output submodule AO 02 011-100

Parameter name, unit of measurement Value


0 to 20 mA / 4 to 20 mA current playback channel

Number of channels 2

Bit depth, bit 16

Nominal ranges of DC current playback, mA 0 … 20 / 4 … 20

Extended range of reproduced DC current, mA 0 … 24

Load resistance, ohm, not more 500

Limits of tolerable basic reduced error of DC current reproduction (in ±0.1


nominal ranges), %
Limits of admissible additional reduced error of DC current reproduction ±0.0025
when the ambient air temperature changes, %/°C

Total time of signal establishment on all outputs, ms, not more

Isolation breakdown voltage (galvanic isolation), V, not less:


between the playback channels and power bus "A"/internal data bus 4000

between the playback channels and the protective earthing 4000

between the playback channels ⎯


Power channel characteristics

Power supply voltage from power bus "C", V 20.4 … 28.8

Power consumption from the power bus "C", W, max. 2.1

Maximum load of power supply, W 1.2

Isolation breakdown voltage (galvanic isolation), V, no less:

between power supply channel and power supply bus "A"/internal data 4000
bus
between the power supply channel and the playback channels 1500

General characteristics of the submodule

Power consumption from the power bus "A", W, max 0.15

Overcurrent protection Yes

Operating conditions:

ambient air temperature in normal conditions, ºC + 15 … + 25

ambient air temperature under working conditions, ºC – 40 … + 70

70
Analog output submodules

Parameter name, unit of measurement Value


relative air humidity, % 5 … 98
Without condensation
Storage conditions:
ambient air temperature, ºC – 55 … + 70

Relative humidity of air, % 5 … 98


Without condensation
Degree of protection against external influences IP20

Dimensions (WxHxD), mm 13х124х91


Weight, kg 0.07

71
Analog output submodules

R100 AO 02 011-100

Internal data
bus
24(+)
Power bus A 0(-)

Indicators
RUN
MPU
PWR

CH1
DAC
CH2
Submodule
Chassis module

DAC QS2
4 6
QS1
2 5

7 8
9 8

10 11
12 11

- + - + - +
1 3

24 V(+)
Power bus C
0 V(-)

Terminal 24 V(+) PWR A B 0 V(-) PWR


block for
input of signal I(+) CH1 C D I(-) CH1
circuits
I(+) CH2 Е F I(-) CH2

Unit
Name
designation
MPU Microprocessor
DAC Digital-to-analog converter
QS1(QS2) Disconnector

1...6 Test Sockets


7...12 Contacts for jumper/fuse installation

Figure 40 – Block diagram of submodule AO 02 011-100

72
Analog output submodules

Channel One Second channel


Channel type
Passive Active Passive Active

Bus C power
supply

Jumper position 7 8 8 9 10 11 11 12

+ - - + + - + - - + + -
А А А А
Upow=24 VDC Upow=24 VDC
Power Power
supply supply

Figure 41 – Variants of schemes for connecting external devices to submodule AO 02 011-100

Table 17 - Setting parameters for submodule AO 02 011-100

Data Default
Parameter Description
type value
Masking Channel masking:
0 - channel is not masked,
BOOL 0
1 - the channel is masked (not processed, no
output values are given)

K0 coefficient Coefficient K0 of conversion of engineering value to


REAL 0.0
electrical value
Factor K1 K1 coefficient of engineering value to electrical
REAL 1.0
value conversion
Factor K0_mA ROM Factor k0 of electrical quantity conversion (current
REAL
from 0 to 20 mA) into DAC code
Coefficient K1_mA ROM Factor k1 of electrical quantity conversion (current
REAL
from 0 to 20 mA) into DAC code
Channel control
Channel control timeout on loss of communication
timeout on loss of
UDINT 0 with the CPU module, ms. Range [1 - 65535]
communication with the
(0 - infinity)
master

73
Analog output submodules

Data Default
Parameter Description
type value
Channel Type Channel type:
BYTE 3 2 - 0 to 20 mA;
3 - 4 to 20 mA
Preset value of the Preset value of the channel when communication
channel at loss of REAL 0.0 with the CPU module is lost
communication
Channel state at loss of State of the channel when communication with the
communication with the CPU module is lost:
master BYTE 0
0 - set preset value;
1 - do not change state

Table 18 - I/O data registers of submodule AO 02 011-100

Data type Purpose


Status of the submodule:
Bit 0 - failure of channel 1;
Bit 1 - failure of DAC channel 1;
Bit 2 - failure of channel 2;
BYTE Bit 3 - failure of DAC of channel 2;
Bit 4 - standby;
Bit 5 - standby;
Bit 6 - output power in the submodule;
Bit 7 - presence of power on bus "C"
Channel N, where N is the serial number of the channel
REAL Channel N value

74
Analog output submodules

AO 02 031-100 Analog output submodule


The submodules are designed to output two analog dc signals and/or dc voltages.
The signal playback range is software-configurable and lies within the following
limits:
• 0 to 20 mA;
• 4 to 20 mA.
• minus 5 to plus 5 V;
• 0 to plus 5 V;
• minus 10 to plus 10 V;
• 0 to plus 10 V.
The wiring diagram, depending on the type of playback signal, is set for each of the
channels separately.
The submodule requires operating voltage on the external power bus "C" for its
operation.
The submodule consists of the following main elements:
• microprocessor;
• two digital-to-analog converters (DAC);
• power supply (DC/DC converter) with galvanic isolation;
• indication node.

75
Analog output submodules

Table 19 – Technical data of the analog output submodule AO 02 031-100

Parameter name, unit of measurement Value

Playback current channel 0 to 20 mA / 4 to 20 mA


Nominal DC current reproduction ranges, mA 0 … 20 / 4 … 20
Extended range of reproduced DC current, mA 0 … 24
Load resistance, ohm, not more 500
0 to plus 5 V voltage playback channel
Nominal voltage reproduction range, V 0…+5
Extended range of voltage reproduction, V 0 … + 5.5

Load resistance, kOhm, not less 1


Channel voltage playback from minus 5 V to plus 5 V
Nominal voltage reproduction range, V –5…+5
Extended range of voltage reproduction, V – 5.5 … + 5.5
Load resistance, kOhm, not less 1
0 to plus 10 V voltage playback channel
Nominal voltage reproduction range, V 0 … + 10
Extended range of voltage reproduction, V 0 … + 11

Load resistance, kOhm, not less 1


Channel voltage playback from minus 10 V to plus 10 V
Nominal voltage reproduction range, V – 10 … + 10
Extended range of voltage reproduction, V – 11 … + 11
Load resistance, kOhm, not less 1
General channel characteristics
Number of channels 2
Bit depth, bit depth 16

Limits of tolerable basic reduced error of voltage / d.c. current


± 0.1
reproduction (in nominal ranges), %
Maximum permissible additional reduced error of
voltage/voltage/dcurrent reproduction when the ambient air ± 0.0025
temperature changes, %/ºC
Total time of signal setting on all outputs, ms, not more
Insulation breakdown voltage (galvanic insulation), V, not less:
between the playback channels and the power bus "A"/internal data

76
Analog output submodules

Parameter name, unit of measurement Value

bus 4000

between the playback channels and the protective ground 4000

between the playback channels ⎯

Power channel characteristics


Power supply voltage from power bus "C", V 20.4 … 28.8

Power consumption from the power bus "C", W, max. 2.1

Maximum load of power supply, W 1.2

Isolation breakdown voltage (galvanic isolation), V, no less:


between power supply channel and power supply bus "A"/internal 4000
data bus
between the power supply channel and the playback channels 1500

General characteristics of the submodule


Power consumption from the power bus "A", W, max 0.15
Over current protection Yes
Operating conditions:
ambient air temperature under normal conditions, ºC + 15 … + 25

ambient air temperature in working conditions, ºC – 40 … + 70

relative air humidity, % 5 … 98


Without condensation
Storage conditions:
ambient air temperature, ºC – 55 … + 70
Relative humidity of air, % 5 … 98
Without condensation
Degree of protection against external influences IP20

Number of occupied slots 1


Dimensions (W × H × D), mm 13х124х91

Weight, kg 0.07

77
Analog output submodules

R100 AO 02 031-x00

Internal data
bus
24 V(+)
Power bus A 0 V(-)

Indicators
RUN
MPU
PWR

CH1
DAC
CH2

DAC
Submodule
Chassis module

QS1 QS2
1 3 2 4
5 6

+ -

24 V(+)
Power bus C
0 V(-)

Terminal I/U (-) A B I/U (-)


block for
input of signal I(+) CH1 C D U(+) CH1
circuits
I(+) CH2 Е F U(+) CH2

Unit
Name
designation
MPU Microprocessor
DAC Digital-to-analog converter
QS1(QS2) Disconnector
1...6 Test Sockets

Figure 42 – Block diagram of submodule AO 02 031-100

78
Analog output submodules

Channel One Second channel


Channel type Passive (by Passive (by Passive (by Passive (by
current) voltage) current) voltage)

Bus C power
supply

Jumper position 1 1 1 1
7 8 8 9
0 1 1 2

+ - + - + - + -
А V А V

Figure 43 – Variants of schemes for connecting external devices to submodule AO 02 031-100

Table 20 - Setting parameters for submodule AO 02 031-100

Data Default
Parameter Description
type value
Masking Channel masking:
0 - channel is not masked,
BOOL 0
1 - the channel is masked (not processed, no
output values are given)
K0 coefficient K0 coefficient of engineering value to electrical
REAL 0.0
value conversion
Factor K1 Factor K1 of engineering value to electrical value
REAL 1.0
conversion

Factor K0_mA ROM Factor k0 to convert an electrical quantity (current


REAL
0 to 20 mA) to DAC code
Factor K1_mA ROM Factor k1 of electrical quantity conversion (current
REAL
0 to 20 mA) into DAC code
Factor K0_V ROM Factor k0 of electrical quantity (voltage)
REAL
conversion to DAC code
Factor K1_V ROM Conversion factor k1 of electrical quantity (voltage)
REAL
into DAC code

79
Analog output submodules

Data Default
Parameter Description
type value
Channel Type Channel type:
0 - from minus 10 V to plus 10 V;
1 - 0 to plus 10 V;
BYTE 0 2 - from 0 to 20 mA;
3 - from 4 to 20 mA;
4 - from minus 5 V to plus 5 V;
5 - 0 to plus 5 V
Channel control
Channel control timeout on loss of communication
timeout on loss of
UDINT 0 with the CPU module, ms. Range [1 - 65535]
communication with the
(0 - infinity)
master
Preset value of the Preset value of the channel at loss of
channel at the loss of REAL 0.0 communication with the CPU module
communication
Channel state at loss of Channel state when communication with the CPU
communication with the module is lost:
master BYTE 0
0 - set preset value;
1 - do not change state

Table 21 - I/O data registers of submodule AO 02 031-100

Data type Purpose


Submodule status:
Bit 0 - breakage on channel 1 (for channel types 0 to 20 mA / 4 to 20 mA);
Bit 1 - failure of channel 1 DAC;
Bit 2 - breakage on channel 2 (for channel types from 0 to 20 mA / from 4 to
BYTE
20 mA);
Bit 3 - failure of DAC of channel 2;
Bits 4...6 - reserve;
Bit 7 - presence of power on the "C" bus
Channel N, where N is the serial number of the channel
REAL Value on channel N

80
Analog output submodules

AO 01 531-100 Analog output submodule


The submodule is designed to simulate the operation of a four-wire thermocouple
sensor. The signal reproduction range is in the resistance range from 5 to 200 Ohm.
The submodule requires operating voltage on the external power bus "C" for its
operation.
The submodule consists of the following main elements:
• microprocessor;
• converter (ADC/DAC);
• power supply (DC/DC converter) with galvanic isolation;
• indication node.
The algorithm of the submodule is as follows: The current input signal is fed to the
ADC/DAC converter. The microprocessor receives from the application program the
value of the simulated thermal resistance in degrees Celsius or resistance in ohms and
gives the corresponding control signals to the ADC/DAC. The output voltage will be
proportional to the input current and the set value of the simulated value.

81
Analog output submodules

Table 22 - Technical data of the analog output submodule AO 01 531-100

Parameter name, unit of measurement Value

Playback Channel Characteristics

DC input current range, mA 0.2 … 2

Imitation resistance range, Ohm 5 … 200

Total time of signal setting on output, ms, not more

Limits of tolerable basic reduced error of DC voltage reproduction (in ±0.1


nominal ranges), %
Limits of admissible additional reduced error of DC voltage reproduction ±0.0025
when the ambient air temperature changes, %/°C
Isolation breakdown voltage (galvanic isolation), V, not less:

between the playback channel and the power supply bus "A"/internal data 4000
bus
between the playback channel and the protective ground 4000

Power channel characteristics

Power supply voltage from power bus "C", V 20.4 … 28.8

Power consumption from the power bus "C", W, max. 2.1

Maximum load of power supply, W 1.2

Isolation breakdown voltage (galvanic isolation), V, no less:


between power supply channel and power supply bus "A"/internal data bus 4000

between the power supply channel and the playback channel 4000

General characteristics of the submodule

Power consumption from the power bus "A", W, max 0.15


Overcurrent protection Yes
Operating conditions:
ambient air temperature in normal conditions, ºC + 15 … + 25

ambient air temperature in working conditions, ºC – 40 … + 70


Relative air humidity, % 5 … 98
Without condensation
Storage conditions:
ambient air temperature, ºC – 55 … + 70
Relative humidity of air, % 5 … 98
Without condensation

82
Analog output submodules

Parameter name, unit of measurement Value

Degree of protection against external influences IP20

Dimensions (WxHxD), mm 13х124х91


Weight, kg 0.07

83
Analog output submodules

R100 AO 02 541-100

Internal data
bus
24 V(+)
Power bus A 0 V(-)

Indicators
RUN
MPU
PWR

CH1
DAC
CH2
Submodule

DAC
Chassis module

QS2
2 4

QS1
1 3

5 6

7 8 11 12
9 8 11 10

+ -

24 V(+)
Power bus C
0 V(-)

Terminal A B
block for
input of signal I/U(+) CH1 C D I/U(-) CH1
circuits
I/U(+) CH2 Е F I/U(-) CH2

Unit
Name
designation
MPU Microprocessor
DAC Digital-to-analog converter

QS1(QS2) Disconnector
1...6 Test Sockets
7...12 Contacts for jumper/fuse installation

Figure 44 – Block diagram of submodule AO 02 541-100

84
Analog output submodules

Connection
type Four-wire

Bus C power
supply

Jumper position

I+ I- U+ U-

Measuring module

Figure 45 – Variants of connection diagrams of the external measuring module to the submodule AO 01 531-100

Table 23 - Setting parameters for submodule AO 01 531-100

Data Default
Parameter Description
type value
Masking Channel masking:
0 - channel is not masked,
BOOL 0
1 - the channel is masked (not processed, no
output values are given)
K0_R factor set during Coefficient k0 of ADC code conversion into
REAL
calibration resistance
K1_R coefficient set during Coefficient k1 of ADC code conversion into
REAL
calibration resistance

Channel type Channel type:


BYTE 6
6 - TC simulator, four-wire connection scheme

Table 24 - I/O data registers of submodule AO 01 531-100

Data type Purpose


Status of the submodule:
Bit 0 - input current (measuring current);
BYTE
Bits 1...6 - reserve;
Bit 7 - bus "C" power supply

85
Analog output submodules

Data type Purpose


REAL Channel data

86
Digital input submodules

Digital Input Submodules


Unit designation Submodule name
R100 DI 02 011-000 Digital input submodule, 24 V DC, 2 channels
R100 DI 02 021-000 Digital input submodule, 220 V AC/DC, 2 channels
R100 DI 02 621-000 Digital input submodule, 220 V AC/DC, 2 channels

Submodule channel status indication

The input channel status indicators of submodules indicate the presence of a "1"
signal in the corresponding input channel.

DI 02 011-000 digital input submodule


The submodule is designed to input two 24 V DC binary signals, with the function of
supplying the channel from the submodule.
Connection scheme is selected for each of the channels separately.
The submodule consists of the following main elements:
• microprocessor;
• two signal detection units;
• power supply (DC/DC converter) with galvanic isolation;
• indication node.
The submodules operation algorithm is as follows: the contacts of the sensors
connected to the submodule are supplied with an external 24 V DC power supply, or
power from bus "C", depending on the location of the jumpers.
The input signal from the sensor enters the receiving unit, then the received signal
passes through software filtering ("debouncing", the processing time of which is set
in the settings by the user).

87
Digital input submodules

Table 25 – Technical data of the DI 02 011-000 digital input submodule

Parameter name, unit of measurement Value


Input channel characteristics

Number of channels 2

Rated DC voltage of the channel, V 24

Signal detection voltage, when the channel is powered from an external


power supply, V:

• logic "1" level 13 … 30

• logic "0" level 0…5

Signal detection voltage, when the channel is supplied from the power bus
"C", V:

• logic "1" level 19 … 30

• logic "0" level 0…5

Permissible input DC voltage of the channel, V 75

Input current at signal "1", mA, not more 10

Delay time, μs, not more:

• from "0" to "1"

• from "1" to "0"

Isolation breakdown voltage (galvanic isolation), V, no less:

• between input channels and power supply bus "A"/internal data bus 4000

• Between the input channels and protective earth 4000

• between input channels ⎯

Power channel characteristics

Power supply voltage from "C" power bus, V 20.4 … 28.8

Power consumption from "C" power bus (without regard to load), W, not
0.15
more

Isolation breakdown voltage (galvanic isolation), V, no less:

• between power supply channel and power supply bus "A"/internal 4000
data bus

• between the power supply channel and input channels ⎯

General characteristics of the submodule

88
Digital input submodules

Parameter name, unit of measurement Value


Power consumption of power bus "A", W, max 0.15
Overcurrent protection Yes

Operating conditions:

• ambient air temperature, ºC – 40 … + 70

• relative air humidity, % 5 … 98


Without condensation
Storage conditions:

• ambient air temperature, ºC – 55 … + 70

• Relative humidity of air, % 5 … 98


Without condensation
Degree of protection against external influences IP20

Dimensions (WxHxD), mm 13х124х91


Weight, kg 0.07

89
Digital input submodules

R100 DI 02 011-х00

Internal data
bus
24 V(+)
Power bus A 0 V(-)

Indicators
RUN
MPU
PWR

CH1

CH2
QS1 QS2
1 3 2 5 4 6
Submodule
Chassis module

7 8
9 8

10 11
12 11

+ -

24 V(+)
Power bus C
0 V(-)

Terminal 24 V(+) PWR A B 0 V(-) PWR


block for
input of signal CH1(+) C D CH1(-)
circuits
CH2(+) Е F CH2(-)

Unit
Name
designation
MPU Microprocessor
QS1(QS2) Disconnector
1...6 Test Sockets
7...12 Contacts for jumper/fuse installation

Figure 46 – Block diagram of submodule DI 02 011-x00

90
Digital input submodules

Channel One

Connection Two-wire,
Three-wire, Four-wire,
type Two-wire With external power Four-wire
externally powered externally powered
supply
Bus C power
supply

Jumper position 8 9 7 8 7 8 7 8 7 8

1 2 + - 1 2 - - + + - + - + - + - + -
Upow=24 V DC Upow=24 V DC Signal Upow Signal Upow Upow

Power Power Sensor Sensor Power


Dry contact supply Dry contact Sensor with supply supply
sensor sensor P-N-P output

Second channel

Connection Two-wire,
Three-wire, Four-wire,
type Two-wire With external power Four-wire
externally powered externally powered
supply
Bus C power
supply

Jumper position 11 12 10 11 10 11 10 11 10 11

1 2 + - 1 2 - - + + - + - + - + - + -
Upow=24 V Upow=24 V Signal Upow Signal Upow
DC
Upow
DC Sensor Sensor
Dry contact Power Dry contact Sensor with Power Power
sensor supply sensor P-N-P output supply supply

Figure 47 – Diagrams for connecting external devices (sensors) to submodule DI 02 011-000

Table 26 - Settings for submodule DI 02 011-000

Parameter Data type Default value Description


Masking Channel masking:
0 - the channel is not masked,
BOOL 0
1 - the channel is masked (not
processed)

91
Digital input submodules

Parameter Data type Default value Description


Anti-chatter time Minimum time between state changes
UINT 0 0 1 allowed to register a state
change. Set in ms
Channel Inversion BOOL 0 Enabling channel inversion

Table 27 - I/O data registers of submodule DI 02 011-000

Data type Purpose


Data and status:
Bit 0 is channel 1 data;
BYTE
Bit 1 - data of channel 2;
Bit 7 - power supply status on bus "C"

92
Digital input submodules

DI 02 021-000 digital input submodule


The submodule is designed to input digital AC or DC signals at 220 V, with the
function of supplying the channel from the submodule.
The wiring diagram is set for each channel separately.
The submodule consists of the following main elements:
• microprocessor;
• two input digital signal receiving units;
• power supply (DC/DC converter) with galvanic isolation;
• indication node.
The submodule operating algorithm is as follows: The sensors connected to the
submodule are supplied with an external 220 V DC or AC power supply, or power
from the "B" bus, depending on the location of the jumpers.
The signal from the sensors goes to the input signal receiver, then the received
signal goes through software filtering ("debouncing", the processing time of which is
set in the settings by the user).

93
Digital input submodules

Table 28 – Technical data of the DI 02 021-000 digital input submodule

Parameter name, unit of measurement Value


Input channel characteristics

Number of channels 2

Rated DC/AC channel voltage, V 220

DC signal detection voltage, V:

• logic level "1" 163 … 264

• logical "0" level 0 … 40

AC signal detection voltage, V:

• logic "1" level 164 … 264

• logic "0" level 0 … 40

Permissible DC input voltage of the channel, V 300

Input current at signal "1", mA, max:

• direct current 1.5

• AC current 1.5

Delay time, μs, not more:

• from "0" to "1"

• from "1" to "0"

Isolation breakdown voltage (galvanic isolation), V, no less:

• between input channels and power supply bus "A"/internal data bus 4000

• Between the input channels and protective earth 4000

• between input channels ⎯

Power Channel Characteristics

DC/AC supply voltage from the "V" power bus, V 187 … 264

Power consumption from the power bus "B", W, not more 1

Isolation breakdown voltage (galvanic isolation), V, no less:

• between power supply channel and power supply bus "A"/internal data 4000
bus

• between the power supply channel and input channels ⎯

General characteristics of the submodule

ower consumption from the power bus "A", W, max 0.15

94
Digital input submodules

Parameter name, unit of measurement Value


Overcurrent protection Yes
Operating conditions:

• ambient air temperature, ºC – 40 … + 70

• relative air humidity, % 5 … 98


Without condensation
Storage conditions:

• ambient air temperature, ºC – 55 … + 70

• relative air humidity, % 5 … 98


Without condensation
Degree of protection against external influences IP20

Dimensions (WxHxD), mm 13х124х91


Weight, kg 0.07

95
Digital input submodules

R100 DI 02 021-00х

Internal data
bus
24 V(+)
Power bus A 0 V(-)

Indicators
RUN
MPU
PWR

CH1

CH2
QS1 QS2
1 3 2 5 4 6
Submodule
Chassis module

7 8
9 8

10 11
12 11

L(+)
Power bus B
N(-)

Terminal L(+) PWR A B L(+) PWR


block for
input of signal L(+) СН1 C D N(-) СН1
circuits
L(+) СН2 Е F N(-) СН2

Unit
Name
designation
MPU Microprocessor
FV Surge voltage protection device (SPD)
QS1(QS2) Disconnector
1...6 Test Sockets
7...12 Contacts for jumper/fuse installation

Figure 48 – Block diagram of submodule DI 02 021-00x

96
Digital input submodules

Channel First Second


Two-wire,
Connection type Two-wire, with
Two-wire Two-wire with external power
external power supply
supply

Bus B power
supply

Jumper position 8 9 7 8 11 12 10 11

1 2 1 2 L N 1 2 1 2 L N
Upow=220 V Upow=220 V
AC/DC AC/DC
Dry contact Dry contact Power Dry contact Dry contact Power
sensor sensor supply sensor sensor supply

Figure 49 – Diagrams for connecting external devices (sensors) to submodule DI 02 021-000

Table 29 - Settings for submodule DI 02 021-000

Parameter Data type Default value Description


Masking Channel masking:
0 - the channel is not masked,
BOOL 0
1 - the channel is masked (not
processed)
Anti-chatter time Minimum time between state changes
UINT 0 0 1 allowed to register a state
change.
Channel Inversion BOOL 0 Enabling channel inversion

Table 30 - I/O data registers of submodule DI 02 021-000

Data type Purpose


Data and status:
Bit 0 is channel 1 data;
BYTE
Bit 1 - data of channel 2;
Bit 7 - power supply status on bus "B"

97
Digital input submodules

DI 02 621-000 digital input submodule


The submodule is designed to input, as well as output, two digital AC or DC signals
of 220 V.
The connection scheme is configured for each of the channels separately.
The submodule consists of the following main elements:
• microprocessor;
• two units for receiving and outputting digital signals;
• power supply with galvanic isolation;
• indication node.
The algorithm for the submodule is as follows:
• input of digital signals - the contacts of the sensors connected to
the submodule are supplied with external power 220 V DC or AC,
or the power is taken from the bus "B", depending on the location
of jumpers. The signal from the sensors goes to the input signal
receiving unit, then the received signal goes through software
filtering ("debouncing", the processing time of which is set in the
settings by the user). Alarm thresholds are set programmatically
in the development environment Epsilon LD, in the range from
140 to 190 V for each channel, in increments of 10 V.
• binary signals output - the microprocessor receives from the
application program the state mask of the output signals and gives
the corresponding control signals to the relay control coils. The
relays close their contacts, thus switching external power circuits.

Table 31 – Technical data of the DI 02 621-000 Digital input submodule

Parameter name, unit of measurement Value


Input channel characteristics

DC signal detection voltage, V:

• logic level "1" 140 to 190


software configurable in 10 V
increments
• logical "0" level 0 … 40

AC signal detection voltage, V:

98
Digital input submodules

Parameter name, unit of measurement Value

• logic "1" level 140 to 190


software configurable in 10 V
increments

• logic "0" level 0 … 40

Permissible DC input voltage of the channel, V 300

Input current at signal "1", mA, max:

• direct current 1.5

• AC current 1.5

Delay time (direct current), μs, not more:

• from "0" to "1"

• from "1" to "0"

Output channel characteristics

Contact resistance in open state, MOhm, not less 1

Characteristics of channels when switching circuits: DC AC

• rated voltage, V 220 220

• maximum voltage, V 250 250

• maximum power, not more 45 Watt 500 VA

• maximum current (for resistive load), A, max 0.15 2

Delay time (direct current), μs, not more:

• from "0" to "1"

• from "1" to "0"

General channel characteristics

Number of channels 2

Isolation breakdown voltage (galvanic isolation), V, not less:

• between channels and power bus "A"/internal data bus 3750

• between the channels and protective earthing 4000

• between channels 500

Power Channel Characteristics

DC/AC supply voltage from the "V" power bus, V 187 … 264

Power consumption from the power bus "B", W, not more 1

99
Digital input submodules

Parameter name, unit of measurement Value


Isolation breakdown voltage (galvanic isolation), V, no less:

• between power supply channel and power supply bus 3750


"A"/internal data bus

• between the power supply channel and I/O channels ⎯

General characteristics of the submodule

Power consumption from the power bus "A", W, not more 0.15
Overcurrent protection Yes

Operating conditions:

• ambient air temperature, ºC – 40 … + 70

• relative air humidity, % 5 … 98


Without condensation
Storage conditions:

• ambient air temperature, ºC – 55 … + 70

• relative air humidity, % 5 … 98


Without condensation
Degree of protection against external influences IP20

Dimensions (WxHxD), mm 13х124х91


Weight, kg 0.07

100
Digital input submodules

R100 DI 02 621-000

Internal data
bus
24 V(+)
Power bus A 0 V(-)

Indicators
MPU RUN

PWR

CH1
Chassis module

CH2
Submodule

QS1
1 3
9 8
7 8 5

QS2
2 4
12 11
10 11
6

L(+)
Power bus B
N(-)

Terminal N(-) PWR A B N(-) PWR


block for
input of signal L(+) CH1 C D N(-) CH1
circuits
L(+) CH2 Е F N(-) CH2

Unit
Name
designation
MPU Microprocessor
QS1(QS2) Disconnector
1...6 Test Sockets
7...12 Contacts for jumper/fuse installation

Figure 50 – Block diagram of submodule DI 02 621-000

101
Digital input submodules

Output channel First Second


Two-wire, with Two-wire, with
Connection Two-wire
Two-wire external power external power
type
supply supply
Bus B power
supply

Jumper position 8 9 7 8 11 12 10 11

К К К К

+ - + -
Umax=220 V Umax=220 V
DC/AC DC/AC

Power Power
supply supply

Input channel First Second


Connection Two-wire, with Two-wire, with
type Two-wire external power Two-wire external power
supply supply
Bus B power
supply

Jumper position 8 9 7 8 11 12 10 11

1 2 1 2 L N 1 2 1 2 L N

Upow=220 V Upow=220 V
AC/DC AC/DC
Dry contact Dry contact Dry contact Dry contact
sensor sensor Power sensor sensor Power
supply supply

Figure 51 – Diagrams for connecting external devices (sensors) to submodule DI 02 621-000

Table 32 - Settings for submodule DI 02 621-000

Parameter Data type Default value Description

102
Digital input submodules

Parameter Data type Default value Description


Channel masking:
0 - the channel is not masked,
Masking BOOL 0
1 - the channel is masked (not
processed)
For the input channel
Trigger threshold code BYTE 0 Triggering threshold code
(code corresponding to a voltage in the
range of 140 to 190 V, in 10 V steps)
Anti-chatter time Minimum time between state changes
UINT 0 01 allowed to register the state
change.
Channel Inversion BOOL 0 Enable channel inversion

Table 33 - I/O data registers of submodule DI 02 621-000

Data type Purpose


Data and status:
Bit 0 is channel 1 data;
BYTE
Bit 1 - data of channel 2;
Bit 7 - power supply status on bus "B"

103
Digital output submodules

Digital output submodules


Unit designation Submodule name
R100 DO 02 011-000 Digital output submodule 24 V DC, 3 A, 2 channels
R100 DO 02 021-000 Digital output submodule 220 V AC/DC, 3 A, 2 channels
R100 DO 02 511-000 Digital output submodule, NAMUR standard sensor simulation, 2 channels

Submodule channel status indication

The LEDs of the output channels on the submodules indicate the presence of a "1"
signal on the corresponding output circuit.

DO 02 011-000 Digital output submodule


The submodules are designed to output signals switching 24 V DC circuits, with the
function of supplying the channels from the submodule.
The wiring scheme is selected for each of the channels individually.
The submodule consists of the following basic elements:
• microprocessor;
• power supply (DC/DC converter) with galvanic isolation;
• two blocks of output relay signals outputs of "dry contact" type,
and each channel is galvanically isolated from the processing
circuit;
• indication node.
The algorithm of the submodule is as follows: The microprocessor receives from the
application program the state mask of the output signals and gives the
corresponding control signals to the relay control coil. The relays close their
contacts, thus switching external circuits.

104
Digital output submodules

Table 34 – Technical data of the digital output submodule DO 02 011-000

Parameter name, unit of measurement Value


Number of channels 2

Type of switching element Electromagnetic relay

Switchable DC voltage of the channel, V:

• nominal 24

• permissible 30

Switched channel current, A, max 3

Mechanical life of switching 106

Contact resistance in open state, MOhm, not less 1

Delay time (for resistive load), ms, not more:

• from "0" to "1"

• from "1" to "0"

Isolation breakdown voltage (galvanic isolation), V, no less:

• between output channels and power bus "A"/internal data bus 4000

• between the output channels and the protective ground 4000

• between the output channels (if the channel is powered by an 1500


external power supply)
Power Channel Characteristics

Power supply voltage from "C" power bus, V 20.4 … 28.8


Power consumption from the "C" power bus (without taking the load into
0.15
account), W, not more
Voltage of insulation breakdown (galvanic isolation), V, not less:

• between the power channel and power bus "A"/internal data bus 4000

• between the power supply channel and output channels ⎯

General characteristics of the submodule

Power consumption from the power bus "A", W, max 0.15


Overcurrent protection Yes
Operating conditions:

• ambient air temperature, ºC – 40 … + 70

• relative air humidity, % 5 … 98


Without condensation

105
Digital output submodules

Parameter name, unit of measurement Value


Storage conditions:

• ambient air temperature, ºC – 55 … + 70

• relative air humidity, % 5 … 98


Without condensation
Degree of protection against external influences IP20

Dimensions (WxHxD), mm 13х124х91


Weight, kg 0.07

106
Digital output submodules

R100 D0 02 011-x00

Internal data
bus
24 V(+)
Power bus A 0 V(-)

Indicators
MPU RUN

PWR

CH1
Chassis module

CH2
Submodule

QS1
1 3 5
9 8
7 8

QS2
2 4 6
12 11
10 11

+ -

24 V(+)
Power bus C
0 V(-)

Terminal 0 V(-) PWR A B 0 V(-) PWR


block for
input of signal 24 V(+) CH1 C D 0 V(-) CH1
circuits

24 V(+) CH2 Е F 0 V(-) CH2

Unit
Name
designation
MPU Microprocessor
QS1(QS2) Disconnector
1...6 Test Sockets
7...12 Contacts for jumper/fuse installation

Figure 52 – Block diagram of submodule DO 02 011-x00

107
Digital output submodules

Channel One Second channel


Channel type
Passive Active Passive Active

Bus C power
supply

Jumper position 7 8 8 9 10 11 11 12

К К К К

+ - + -
Upow= 24 V Upow= 24 V
DC DC
Power Power
supply supply

Figure 53 – Connection options for external devices to submodule DO 02 011-000

Table 35 - Setting parameters for submodule DO 02 011-000

Data Default
Parameter Description
type value
Channel masking:
0 - channel is not masked,
Masking BOOL 0
1 - the channel is masked (not processed, no output
values are given)

Table 36 - I/O data registers of submodule DO 02 011-000

Data type Purpose


Status of the submodule:
BYTE Bits 0...6 are reserved;
Bit 7 - power on bus "C"
Submodule data:
Bit 0 is the state of channel 1;
BYTE
Bit 1 - state of channel 2;
Bits 2...7 - reserve

108
Digital output submodules

DO 02 021-000 Digital output submodule


The submodules are designed to output digital signals switching power circuits of
220 V AC or DC, with the function of supplying the channels from the submodule.
The connection scheme is selected for each of the channels separately.
The submodule includes the following main elements:
• microprocessor;
• power supply with galvanic isolation;
• two blocks of output relay signals outputs of "dry contact" type, and each
channel is galvanically isolated from the processing circuit;
• indication node.
The submodule algorithm is as follows: The microprocessor receives the output
signal state mask from the application program and outputs appropriate control
signals to the relay control coil. The relays close their contacts, thus switching
external power circuits.

109
Digital output submodules

Table 37 – Technical data of the digital output submodules DO 02 021-000

Parameter name, unit of measurement Value


Number of channels 2

Type of switching element Electromagnetic relay

Mechanical switching life (at 250 VAC, 3 A) 106

Contact resistance in open state, MOhm, not less 1

Characteristics of channels when switching circuits: DC AC

rated voltage, V 220 220

maximum voltage, V 250 250

maximum power, not more 45 W 750 VA


maximum current (for resistive load), A, max 0.15 3

Delay time (for resistive load), ms, not more:

• from "0" to "1"

• from "1" to "0"

Isolation breakdown voltage (galvanic isolation), V, no less:

• between output channels and power bus "A"/internal data bus 4000

• between the output channels and the protective ground 4000

• between the output channels (if the channel is powered by an 1000


external power supply)

Power Channel Characteristics

DC/AC supply voltage from the "V" power bus, V 187 … 264

Power consumption from the power bus "B", W, not more 1

Isolation breakdown voltage (galvanic isolation), V, no less:

• between power supply channel and power supply bus 4000


"A"/internal data bus
• between the power supply channel and output channels ⎯

General characteristics of the submodule

Power consumption from the power bus "A", W, max 0.15


Overcurrent protection Yes
Operating conditions:
• ambient air temperature, ºC – 40 … + 70

110
Digital output submodules

Parameter name, unit of measurement Value

• relative air humidity, % 5 … 98


Without condensation
Storage conditions:

• ambient air temperature, ºC – 55 … + 70

• relative air humidity, % 5 … 98


Without condensation
Degree of protection against external influences IP20

Dimensions (WxHxD), mm 13х124х91


Weight, kg 0.07

111
Digital output submodules

R100 D0 02 021-000

Internal data
bus
24 V(+)
Power bus A 0 V(-)

Indicators
MPU RUN

PWR

CH1
Chassis module

CH2
Submodule

QS1
1 3 5
9 8
7 8

QS2
2 4 6
12 11
10 11

L(+)
Power bus B
N(-)

Terminal N(-) PWR A B N(-) PWR


block for
input of signal L(+) CH1 C D N(-) CH1
circuits
L(+) CH2 Е F N(-) CH2

Unit
Name
designation
MPU Microprocessor
QS1(QS2) Disconnector
1...6 Test Sockets
7...12 Contacts for jumper/fuse installation

Figure 54 – Block diagram of submodule DO 02 021-000

112
Digital output submodules

Channel One Second channel


Channel type
Passive Active Passive Active

Bus B power
supply

Jumper position 7 8 8 9 10 11 11 12

К К К К

+ - + -
Umax=220 V Umax=220 V
DC/AC DC/AC

Power Power
supply supply

Figure 55 – Connection options for external devices to submodule DO 02 021-000

Table 38 - Setting parameters for submodule DO 02 021-000

Data Default
Parameter Description
type value
Channel masking:
0 - channel is not masked,
Masking BOOL 0
1 - the channel is masked (not processed, no output
values are given)

Table 39 - I/O data registers of submodule DO 02 021-000

Data type Purpose


Status of the submodule:
BYTE Bit 0...6 - reserve;
Bit 7 - power on "B" bus
Submodule data:
BYTE Bit 0 is the state of channel 1;
Bit 1 - state of channel 2;

113
Digital output submodules

Bits 2...7 - reserve

114
Digital output submodules

DO 02 511-000 Digital output submodule


The submodule is designed to simulate a NAMUR standard sensor.
The submodule consists of the following basic elements:
• microprocessor;
• power supply (DC/DC converter) with galvanic isolation;
• two blocks consisting of solid-state relays and ballasts, simulating different
modes of operation of the NAMUR sensor;
• an indication unit.
The submodule algorithm is as follows: The microprocessor receives the output
signal state mask from the application program and outputs the corresponding
signals to the control circuits of the solid-state relays.

115
Digital output submodules

Table 40 – Technical data of the digital output submodule DO 02 511-000

Parameter name, unit of measurement Value


Number of channels 2
Type of switching element Solid state relay
Rated DC voltage of the channel, V 8.2
Resistance of the resistors, kOhm
R1 10
R2 1
Isolation breakdown voltage (galvanic isolation), V, no less:

• between output channels and power bus "A"/internal data bus 3000

• between output channels and protective earthing 3000

• between output channels 1500

Overcurrent protection Yes


Power consumption from power bus "A", W 0.15
Operating conditions:

• ambient air temperature, ºC – 40 … + 70

• relative air humidity, % 5 … 98


Without condensation
Storage conditions:
• ambient air temperature, ºC – 55 … + 70

• relative air humidity, % 5 … 98


Without condensation
Degree of protection against external influences IP20
Number of occupied slots 1
Dimensions (WxHxD), mm 13х124х91
Weight, kg 0.07

116
Digital output submodules

R100 DO 02 511-000

Internal data
bus
24 V(+)
Power bus A 0 V(-)

К1.1
Indicators
К1.2
MPU RUN

К2.1

К2.2
CH1
Chassis module

CH2
Submodule

5 6

К1.1 R1 К2.1 R1

R2 R2
К1.2 К2.2

QS1 QS2
3 1 4 2

24 V(+)
Power bus C
0 V(-)

Terminal A B
block for
input of signal 9 V(+) CH1 C D 0 V(-) CH1
circuits
9 V(+) CH2 Е F 0 V(-) CH2

Unit
Name
designation
MPU Microprocessor
QS1(QS2) Disconnector
1...6 Test Sockets

Figure 56 – Block diagram of submodule DO 02 511-000

117
Digital output submodules

Channel One Second channel


Channel type
Passive Passive

Bus C power
supply

+ - + -

Measuring Measuring
module module

Figure 57 – Connection options for external devices to submodule DO 02 511-000

Table 41 - Setting parameters for submodule DO 02 511-000

Data Default
Parameter Description
type value
Channel masking (open all relays):
0 - channel is not masked,
Masking BOOL 0
1 - the channel is masked (not processed, no output
values are given)

Table 42 - I/O data registers of submodule DO 02 511-000

Data type Purpose


BYTE Module state:
Bits 0...6 - reserve;
Bit 7 - bus "C" power supply
Channel data:
Bit 0 is the state of relay K0.0;
BYTE Bit 1 is the state of relay K0.1;
Bit 2 - state of relay K0.2;
Bit 3 - state of relay K1.0;

118
Digital output submodules

Data type Purpose


Bit 4 is the state of relay K1.1;
Bit 5 - state of relay K1.2;
Bits 6...7 - reserve

119
Chassis Modules

Chassis Modules
Unit designation Short description
Control module
R100 CH 00 011 Chassis module, supporting the expansion function of two RegulBus,
connection ports: 2x IN, 2x OUT with RJ45 interface, 2 slots for
installation of interface submodule
R100 CH 00 111 Chassis module with dual RegulBus expansion function, connection
ports: 2x IN, 2x OUT with SFP interface,
2 slots for installation of interface submodule
Basic modules
R100 CH 16 011 Chassis module, with dual RegulBus expansion function, connection
ports: 2x IN, 2x OUT with RJ45 interface,
2 slots for installation of interface submodules and 16 slots for
installation of I/O submodules
R100 CH 24 011 Chassis module, with dual RegulBus expansion function, connection
ports: 2x IN, 2x OUT with RJ45 interface,
2 slots for installation of interface submodules and 24 slots for
installation of I/O submodules
R100 CH 32 011 Chassis module, with dual RegulBus expansion function, connection
ports: 2x IN, 2x OUT with RJ45 interface,
2 slots for installation of interface submodules and 32 slots for
installation of I/O submodules
R100 CH 16 111 Chassis module with dual RegulBus expansion function, connection
ports: 2x IN, 2x OUT with SFP interface,
2 slots for installation of interface submodules and 16 slots for
installation of I/O submodules
Extension Modules
R100 CH 16 021 Chassis module, 16 slots for I/O submodules
R100 CH 24 021 Chassis module, 24 slots for I/O slots
R100 CH 32 021 Chassis module, 32 I/O submodule slots

The chassis modules perform the following functions:


• mechanical fastening on the rail, bundling in a rack and fixation of submodules in slots;
• power input for buses "A", "B", "C" (no power input for bus "A" in expansion modules);
• power distribution on buses "A", "B", "C", both between submodules and in the rack as a
whole;

120
Chassis Modules

• connection of the module/cremit to the RegulBus, except for the expansion modules.
The chassis modules are subdivided into:
• Main module - supports operation of all types of submodules;
• Control module - supports only interface submodules;
• Extension module - supports only I/O submodules.

Table 43 - Chassis module specifications

Parameter name, unit of Value


measurement
CH ХХ 011 CH ХХ 111 CH ХХ 021
Supports the RegulBus expansion
Yes No
function
Supports the RegulBus
Yes No
redundancy function
Interface SFP
RJ45 ⎯
(IN and OUT ports) (100BASE-FX)

Maximum length of the connected Determined by the


100 ⎯
communication line, m type of SFP module
Number of slots for installation of
2 ⎯
interface submodules
Number of slots for installing I/O ХХ ХХ
submodules - XX
00 16 24 32 16 24 32
Weight, kg 0.35 0.9 0.7
Dimensions (WxHxD), mm
L (W) x 130 (H) x 100 (D) L (W) x 130 (H) x 92 (D)
(L value - see table 44)
Characteristics of power buses "A",
see table 45
"B", "C"
Operating conditions:
ambient air temperature, °C – 40 … + 70
relative humidity, % 5 … 98
Without condensation
Storage conditions:

• ambient air temperature, – 55 … + 70


°C

• relative humidity, % 5 … 98
Without condensation

121
Chassis Modules

Parameter name, unit of Value


measurement
CH ХХ 011 CH ХХ 111 CH ХХ 021
Degree of protection against
IP20
external influences

Table 44 – Values of the lengths (L) of the chassis modules

Chassis Control
Basic modules Extension Modules
Modules modules
Number of
00 16 24 32 16 24 32
slots (XX)

L (mm) 110 345 285

Table 45 - Power bus specifications in the chassis modules

Parameter name, unit of measurement Value


Power bus "A" characteristics
DC input voltage, V:

• nominal value 24

• permissible range 20.4 … 28,8

Maximum value of direct current, A 12


Power bus "B" specifications
DC/ac input voltage, V:
• nominal value 220 AC/DC

• admissible value, not more 264 AC/370 DC

Maximum value of direct/accelerated current, A 16


Power bus "C" characteristics
DC input voltage, V:
• nominal value 24

• permissible range 20.4 … 28.8

Maximum value of direct current, A 20


General power bus characteristics

Protection against reverse polarity Yes


Isolation breakdown voltage (galvanic isolation), V, not less:

122
Chassis Modules

Parameter name, unit of measurement Value


between inputs and case 1500

123
Maintenance

MAINTENANCE
Maintenance of the controller consists of preventive inspection of submodules,
condition of connectors and periodic calibration of analog channels of conversion and
playback.
Frequency of preventive maintenance inspections is at least once a year. When
inspecting the controller is performed:
• check that there is no external damage that affects the functional or
technical characteristics of the controller;
• check the reliability of contacts of connectors.
If necessary, the screw terminals are tightened and the dust is removed by blowing
out with compressed air.
Analog channels of the controller are subject to periodic calibration to ensure unity of
measurement with the required accuracy. The interval between verifications is 6
years. Records of the calibration are recorded in the submodule passport.

124
Functional unit HartUserRequest and dynamically generated command

APPENDIX A. List of custom controller positions


The tables show the available components for ordering in the REGUL R100 controller.

Table A.1

Module part number Short description


Control module
R100 CH 00 011 Chassis module, with dual RegulBus expansion function, connection ports: 2x
IN, 2x OUT with RJ45 interface,
2 slots for installation of an interface submodule
R100 CH 00 111 Chassis module with dual RegulBus expansion function, connection ports: 2x
IN, 2x OUT with SFP interface,
2 slots for installation of interface submodule
Basic modules
R100 CH 16 011 Chassis module, with dual RegulBus expansion function, connection ports: 2x
IN, 2x OUT with RJ45 interface,
2 slots for installation of interface submodules and 16 slots for installation of
I/O submodules
R100 CH 24 011 Chassis module, with dual RegulBus expansion function, connection ports: 2x
IN, 2x OUT with RJ45 interface,
2 slots for installation of interface submodules and 24 slots for installation of
I/O submodules

R100 CH 32 011 Chassis module, with dual RegulBus expansion function, connection ports: 2x
IN, 2x OUT with RJ45 interface,
2 slots for installation of interface submodules and 32 slots for installation of
I/O submodules
R100 CH 16 111 Chassis module with dual RegulBus expansion function, connection ports: 2x
IN, 2x OUT with SFP interface,
2 slots for installation of interface submodules and 16 slots for installation of
I/O submodules

Extension Modules
R100 CH 16 021 Chassis module, 16 slots for I/O submodules
R100 CH 24 021 Chassis module, 24 slots for I/O slots
R100 CH 32 021 Chassis module, 32 I/O submodule slots

Table A.2

Module part number Short description

125
Functional unit HartUserRequest and dynamically generated command

Module part number Short description


R100 ST 01 011 Interface submodule, installation in chassis modules with RJ45 interface for
RegulBus connection
R100 ST 01 111 Interface submodule, installation in chassis modules with SFP interface for
RegulBus connection
R100 AI 02 011-100 Analog input submodule, 2 channels, current 0 … 20 mA, 4 … 20 mA
R100 AI 02 041-100 Analog input submodule, 2 channels, -5 … +5 V, 0 … +5 V,
-10 … +10 V, 0 … +10 V

R100 AO 02 011-100 Analog output submodule, 2 channels, current 0 … 20 mA, 4 … 20 mA


R100 AO 02 031-100 Analog output submodule, 2 channels, current 0 … 20 mA, 4 … 20 mA,
-5 … +5 V, 0 … +5 V
-10 … +10 V, 0 … +10 V
R100 AO 01 531-100 Analog output submodule, thermal resistance sensor simulation (5 to 200
ohms), 1 channel
R100 DI 02 011-000 Digital input submodule, 24 V DC, 2 channels
R100 DI 02 021-000 Digital input submodule, 220 V AC/DC, 2 channels
R100 DI 02 621-000 Digital input submodule, 220 V AC/DC, 2 channels
R100 DO 02 011-000 Digital output submodule 24 V DC, 3 A, 2 channels
R100 DO 02 021-000 Digital output submodule 220 V AC/DC, 3 A, 2 channels
R100 DO 02 511-000 Digital output submodule, NAMUR probe simulation,
2 channels

126
Company Information

GP Systems GmbH
Ochshäuser Str., 45
34123 Kassel Germany

Phone: +49 561 820 93350


Fax: +49 561 820 93351

Technical support: support@gp-systems.com


Website: www.gp-systems.com

127

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