The Printed Circuit Assembler’s Guide to...

™
SMART DATA
Using Data to Improve Manufacturing

Sagi Reuven and Zac Elliott

Siemens Digital Industries Software

© 2020 BR Publishing, Inc.

All rights reserved.

BR Publishing, Inc.
dba: I-Connect007
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ISBN: 978-1-7342005-7-7
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 Peer Reviewers
Happy Holden
Consulting Technical Editor, I-Connect007

Happy Holden is the retired director of electronics

and innovations for Gentex Corporation. Happy is
the former chief technical officer for the world’s
largest PCB fabricator, Hon Hai Precision Industries
(Foxconn). Prior to Foxconn, Happy was the senior PCB technologist for
Mentor Graphics and the advanced technology manager at Nan Ya/West-
wood Associates and Merix. Happy previously worked at Hewlett-Packard
for over 28 years as director of PCB R&D and manufacturing engineering
manager. He has been involved in advanced PCB technologies for over 47
years.

Marius Stepanescu
Technical Director, ICCO EMT

Marius Stepanescu is currently serving as the tech-

nical director at ICCO EMT, a Romanian electronics
manufacturer serving Europe and the Romanian
market, offering PCB production and assembly
services, where he leads the engineering team. Marius joined ICCO 21
years ago and invested most of his entire career there. Marius graduated
from the Universitatea Politehnica Timișoara with a bachelor's degree in
engineering in 1999. He started his career as a service engineer for the
K&S pick-and-place line. Since 2007, he has been the technical director at
ICCO, leading the service and production engineering teams.
 Meet the Authors
Sagi Reuven
Mechanical Engineer, Siemens Digital
Industries Software

Sagi Reuven is a mechanical engineer

who holds an MBA and is experienced in
Mentor Graphics layout design and simu-
lation products. Before joining Siemens
Digital Industries Software, he was the
CEO and co-founder of a medical device
company in the retinal imaging sector and consulted for other startup
companies. Sagi is a part of the Siemens Opcenter-Valor business devel-
opment team focused on electronics manufacturing.

Zac Elliott
Technical Marketing Engineer, Siemens
Digital Industries Software

Zac Elliott is a technical marketing engi-

neer with Siemens Digital Industries
Software. Working directly with elec-
tronic manufacturing service providers
in the medical, aerospace, automotive,
and public-safety markets, Zac ensures
that key requirements for the smart factory are fulfilled using software
and automation. Before joining Siemens, he was responsible for devel-
oping and implementing solutions for a global contract electronics manu-
facturer, providing an in-depth understanding of the market pressures
driving Industry 4.0. Recently, Zac has served as a member of the IPC task
group working on an industry standard for traceability of critical electronic
components.
CONTENTS

1 Introduction
CHAPTER 1

5 The Benefits and Challenges of Collecting Big Data

CHAPTER 2

21 The Difference Between Data and Analytics

CHAPTER 3

33 Putting Data to Work in the Factory to Improve Business

42 Conclusion and References

43 About Siemens Digital Industries Software

 Introduction

Whenever we discuss data, keep in mind that people have been collecting
data, verifying it, and translating it into reports for a long time. And if data is
collected and processes are changed automatically, people still will be inter-
preting and verifying the accuracy of the data, creating reports, making recom-
mendations, solving problems, tweaking, improving, and innovating. What-
ever data collection system is used, any effort to digitalize needs to engage
and empower the production team at the factory. Their role is to attend to
the manufacturing process but also to act as the front line of communications
and control.

When operations are not performing as expected, they need to be able to:

1. Act as the first line of issue containment so that they can minimize the
effect of the problem on the final product or process through problem-
solving and corrective actions in real-time.

2. Act as intelligence gatherers during escalation events when engineering

is called to the work cell so that they can spend less of their time on data
gathering and more on re-engineering for root-cause elimination to remove
the possibility for any undesired condition to reappear.

To help your factory take the next steps in the journey to digitalization, in this
book, we’re going to look at some of the major hurdles that your teams face in
collecting manufacturing data that then will be useful—not only for improving
processes but also for improving materials and supply chain management,
tracing the sources of problems and defective or counterfeit parts, and
providing trends analysis for business forecasting and reporting.

In our previous book The Printed Circuit Assembler’s Guide to… Advanced Manu-
facturing in the Digital Age, we looked at what needs to be done to create a
smart factory that is able to collect data—including how to remove barriers in
an organization, protect the data, and create a system for managing it.

1
 In Chapter 1, we will look at the challenges of collecting good data and where
collecting it makes sense for the factory and improving business. In Chapter
2, we will examine what makes data smart, meaning the difference between
data on its own and analytics. In Chapter 3, we will cover how data can be
distributed from the underlying infrastructure for external use. We also detail
some of the tools available today to help you put these principles into practice
and look at a real-world example of how companies are reaping the benefits
of putting their data to good use with analytics.

The requirements for product quality and reliability contribute to the growing
need for meaningful analytics in manufacturing. With growing demands from
quality-sensitive industries—such as aerospace, automotive, smartphones,
and medical—manufacturers need to ensure their factory operations work
properly. Analyzing data simply is not enough. Company managers need to
use analytics to create knowledge that can positively affect manufacturing.

Today, with internet of things (IoT) technology entering the manufacturing

world, factory managers can take their efficiency and waste-reduction efforts
to the next phase using big-data analytics. Advanced big-data analytics can
help electronics manufacturers cope with the sheer number and complexity
of production activities that influence yield, providing a granular approach to
diagnosing and correcting process flaws.

Figure 0.1: Manufacturing intelligence enables Industry 4.0.

Figure 1.1: Newspaper Rock State Historic Monument has hundreds of petroglyphs
believed to be from about 2000 years ago. (Image Source: AdobeStock)
2
Advanced analytics refers to the application of statistics and other mathemat-
ical tools to business data to assess and improve practices. In manufacturing,
operations managers can use advanced analytics to take a deep dive into
historical process data, identify patterns and relationships among discrete
process steps and inputs, and then optimize the factors that prove to have the
greatest effect on yield.

With IoT applications gathering huge amounts of real-time, shop-floor data

constantly, what the electronics manufacturing industry now needs are
analytics solutions that can aggregate these isolated data sets and analyze
them to reveal important insights. These insights can be leveraged to enable
better decision-making and ultimately reduce cost and waste.

3
4
 Chapter 1

The Benefits and Challenges of

Collecting Big Data
Accurate data is required to adjust processes and to ensure quality over time.
This is difficult because not all data is in the same format, and not all sensors
perform the same over time. How do you know what the best data to collect
is and how to filter out the junk data from useful or smart data? This is not an
easy task when the interfaces to data collection sources are complex, and they
do not speak the same language, often requiring the vendor’s help to get data
out of the machine and then spending time normalizing the data to turn it into
something useful. This is a challenge for companies trying to set up a custom
data collection system themselves.

High-tech manufacturing processes generate huge amounts of data. However,

approximately 70% of that data is not used, according to research at MIT, either
because it has not been collected or because of the lack of a platform that will
use the data in an intelligent manner to drive informed business decisions.

Figure 1.1: Data courtesy of MIT.

5
The Benefits of Using Data
One of the key benefits of using data effectively is boosting prediction accu-
racy, and this requires a deep understanding of the data and domain exper-
tise. It also requires access to the data in the first place, and not all companies
are willing to give that up. When this is the case, many companies commit R&D
resources to figure out how to do it.

Companies can differentiate themselves from their competition with intelli-

gent, responsive, and supportive productization. Those that more effectively
balance customization with complexity costs can generate organic sales
growth and profit margins significantly higher than their industry peers.

Businesses can appeal to consumers

By eliminating silos by providing a product that matches or

of information and comes close to their ideal product while

allowing producers to utilize improved

enabling the sharing workflows and technology to maintain

high output and obtain cost savings
of data, businesses compared to a pure mass production
environment.
can dramatically Smart manufacturing supports mass

shorten NPI cycles customization by providing insight on

production efficiency, equipment usage,
and time to market. and status across the entire value chain.
By eliminating silos of information and
enabling the sharing of data, businesses can dramatically shorten NPI cycles
and time to market.

Digital innovation and adoption of smart manufacturing strategies will also

give businesses greater adaptability by providing better control and visibility
into their supply chain and optimizing their capacity to build more products,
faster and with profitable growth.

By adopting smart manufacturing strategies, businesses will know upfront

that a design can be made, the manufacturing plan is up-to-date and synchro-
nized, and the production system is optimized and performing as planned.

Using software to create models and optimize processes allows businesses to

run multiple what-if scenarios that can be evaluated relatively inexpensively.
They are able to save time and money by simulating and proving-out product
designs and manufacturing capabilities before investing in new equipment
and materials.

6
Data is key to companies unlocking the ability to optimize their processes,
reduce costs, and accurately measure ROI—all by being able to make good
decisions about products, services, employees, and strategy.

Companies that lack the ability to use data in an intelligent manner to drive
informed business decisions are at a competitive disadvantage and will miss
actionable insights about their customers and their products.

Not knowing the best way to read, understand, and apply data can actually be
costing your business. Those costs could take the form of lost revenue oppor-
tunities, lower efficiency and productivity, quality issues, and more.

Businesses that fail to analyze the data from production equipment and
adequately predict machine performance and downtime put their manufac-
turing capabilities at risk. Breakdowns happen suddenly and cause a huge hit
to productivity.

The Challenges of Collecting Raw Manufacturing Data

Many PCB assemblers still maintain multiple machine vendors in their facto-
ries, creating a reality where a Juki line is operating alongside an ASM line
and a Fuji line, for example. This creates a complex environment in which to
collect data because each machine line can be using a different, or variations
of, language. This situation can hinder the development of an Industry 4.0
operation because the data cannot be shared easily through the entire shop
floor, hindering real-time process control and improvements.

All surface-mount technology (SMT) processes have variation. They have

inputs, transformation, and output. The process is not a function, department,
or building; it is an activity that variates to produce products. Each process at
SMT generates process data. From the data, we can find out the process varia-
tion and opportunities for improvement.

Thus, machine communication, both on the programming and monitoring

side, was an area that needed to be addressed to support smart manufac-
turing. This communication was necessary between machines, operations,
business systems, and ultimately to the cloud.

For this sharing of language and data to work best, the data has to be visible,
accurate, detailed, and live to enable real-time communication and better
agility when reacting to changes.

However, while these changes in PCB manufacturing were developing, product

mixes and flexibility increased. This resulted in a corresponding decrease in
efficiency and productivity because the manufacturing variables increased.

7
These changes made it clear that smarter and leaner processes are necessary
for Industry 4.0 to take hold in manufacturing. Addressing such challenges
while maintaining and optimizing smart and lean processes requires software
and hardware solutions that can make use of data.

Figure 1.2: The stages from raw data to useful and actionable analytics.

With traditional high-volume PCB assembly manufacturing, typical manufac-

turing lines consisted of best-in-class chip shooters and fine-pitch machines
from different vendors—all focused on the fastest throughput possible. As
machine capability increased, the typical delineation of those machine types
blurred as machine vendors introduced more and more capable machines.
These machines brought more flexible placement capabilities, along with
multiple conveyor-lanes and higher capacity feeder banks, all delivered by the
same machine vendor.

Figure 1.3: Various machine interfaces, consistent and complete data delivery,
bandwidth, and integration efforts are all challenges to moving data from the
machine lines to applications that can provide actionable information.

8
The third-party software vendors that were supporting mixed-vendor lines
were often replaced with the machine vendor’s own software. This enabled
better balance and optimized the line in a more efficient manner, given the
complexities of this new generation of automatic placement machines.

Things started to change again when places like Europe and North America
brought an increasing trend of higher-mix production, which changes the
number-one challenge for manufacturers in these regions. Rather than
needing to focus on speeding up the placement for a single board, the new
trend created a need to focus on better changeover time between products to
optimize line utilization. Given that PCB manufacturers are still working with
more than one machine vendor, part-data creation, and management are put
in higher significance.

Applying Data Gathered in the Factory

The following are some examples of areas in manufacturing that are particu-
larly useful for gathering, qualifying, and using data in the factory.
Stencil Creation
A typical SMT reflow process usually starts with screen-printing, and for that, a
stencil foil is needed. Stencil layers can either be created from the paste layers
or derived from the copper layers. These will be used to create the stencil
that is used to apply solder paste to the appropriate areas of the board in the
required volume.

The stencil apertures can be a percentage reduction in the size of the original
copper pad, a specific distance inset from the copper pad, or some form of a
custom aperture that is not related to the copper pad underneath but more a
function of the package that will be placed on the land pattern.

For example, two-pin, surface-mount components usually have an aper-

ture that looks like a baseball home plate, but with the points of the aper-
ture pointing inward towards each other. Without automated software tools
designed for this purpose, the engineer must manually search and edit each
aperture or create a stencil drawing and hope the stencil manufacturer follows
their requirements.

Jet solder-paste printers, such as the Mycronic MY-600, are becoming more
popular for high-mix, low-volume designs, as well as for prototype runs,
replacing the stencil and screen-printing steps. Very small drops of paste
are deposited individually on each pad to build up the correct paste profile,
depending on shape and volume requirements.

9
Quick programming in the software will prevent having to cut a stencil and will
bring a quick turnaround of PCB assembly. Here, it is less about using data
to analyze the cost differential between jet printing and screen-printing but
more about the time-to-market aspect of getting the small number of boards
built in quickly as possible.
Solder Paste Inspection Data
Solder paste inspection (SPI) is used to detect any issues once the paste has
been laid on to the PCB. At this point, the little incremental cost has been
added to the PCB in the form of expensive components, but it is widely known
that ~70% of the scrap is caused by the solder paste printing process.

Traditionally, Gerber data is used as a starting point to create the SPI program.
However, in these circumstances, the information about which pad is associ-
ated with which component and component pin is lost. This makes aggrega-
tion of defect data challenging unless formats that are more intelligent are
used, or additional component and pin data is provided and tagged with the
component references.

SPI machines are available today that can perform the inspection of the solder
on the PCB autonomously. Based on the results, the data can be used to make
a decision regarding depositing additional solder paste in the case of insuf-
ficient paste on certain pads. This way, instead of having to clean the paste
off the defective board, the correction is made while the board remains in the
production line.
Automated SMT Placement Equipment
Any individual component on the board will only be physically placed by one
machine during the PCB manufacturing process. Therefore, decisions need to
be made that determine which machine will place each component onto the
PCB to maximize throughput or minimize line configuration changes.

Line balancing is the technique used to decide which components should

be placed by which machine, given the machine capability, with the goal of
reducing the slowest machine and having the fastest overall beat rate. Usually,
only one machine can physically place the component to the board; however,
it is not unusual to have choices for individual components, and so decisions
have to be made as to which machine or module should ultimately place the
component.

With the trend to adopt a single vendor for SMT component placement, a
single machine vendor will typically provide multiple modules of flexible
placement machines to place the parts from the feeders and trays in the

10
correct positions on the board automatically. Smaller components are typi-
cally placed first, and then larger and taller components follow later. Given the
single machine vendor for placement equipment, it is more common for the
vendor’s software to perform the machine optimization and balancing across
the placement modules.

However, regardless of the machine vendor being used, it is still possible to

leverage common data collection practices for the preparation of the NC data
needed by the vendor software. Part, package, and supply form information
can be distilled into a neutral data format that is independent of any specific
machine vendor. This enables the PCB assembler to create and manage their
part data independently and then transform it to target machine vendor
formats as required. As pointed out earlier, this is important because although
individual lines consist of a single machine vendor, a PCB manufacturer will
usually have multiple vendor lines across the factory or enterprise.
Product Grouping
With the increase in higher-mix manufacturing, the overall equipment effec-
tiveness becomes less dependent on the speed to build a single board and
more on the time that it takes to reconfigure the line from one product to
another. This is known as the changeover time. A small batch may take a
number of hours to configure the line, whereas the time to build the small
batch is measured in minutes.

Smart production software must understand the work orders that need to
be scheduled at a higher level with respect to the finite limitations of the SMT
production environment. Enterprise resource planning (ERP) systems are

11
typically scheduling in an infinite planning environment. They consider a due
date, product, quantity, and material. If they have enough material, and based
on the beat rate of a line, they can determine that they can achieve a due date.

Unfortunately, SMT line capacity and material reels can affect these assump-
tions, which results in due dates missed and significant time needed between
product changeovers. Smart scheduling software that considers the line
capability and part supply form data can determine a much more achievable
schedule that works in conjunction with ERP to achieve a higher on-time due-
date delivery.

Furthermore, by analyzing the line capacity and part commonality of multiple

products, intelligent grouping can be determined to allow multiple products
to be built without any or minimal changeover time between products. Even
when there are more significant differences, a partial common machine setup
can be employed to reduce the changeover time from product to product.
Inspection Equipment
A PCB manufacturer may use automated optical inspection (AOI) either before
or after the reflow oven. Post-placement AOI inspects the components before
they are soldered to the board. Only presence/absence inspection can take
place at this point because the solder joints have not been formed; however,
adjustments can be made with minimal cost.

Once the PCB has been through the oven, post-reflow AOI can inspect both the
component and the joints because the solder has set. Hidden joints cannot be
inspected with AOI because this technique relies on a visual line of sight to the

12
joint. Components can be repaired if defects are found, although the repair
cost will be higher now because the existing component needs to be removed
and replaced with a new one.

In both cases, AOI measurements can be analyzed, and the results can indi-
cate if actions should be taken to improve the manufacturing process.

Automated X-ray inspection (AXI) can be used to detect component- and pin-
level issues and even find defects within the solder joints or hidden defects
under components because of its ability to look through the board or compo-
nent. However, AXI testing is time-consuming and costly, and machine-learning
algorithms can be used to predict which AXIs can be skipped to optimize the
cost.

Software for programming inspection equipment should automatically know

which components to include in the program based on where the inspection
machine is located in the line. Furthermore, because component shapes and
characteristics are consistently based on the manufacturer’s part number,
AOI programming can be accelerated by the use of shape libraries that are
synchronized to the actual part numbers included in the product design and
manufacturing bill of materials (BOM).
Verifying Process Data
There are four typical categories of electrical test equipment: in-circuit test,
boundary scan test, flying probe test, and functional test. The first three
are typically used for manufacturing process verification to determine if the
product was built correctly. Functional test is typically used for product veri-
fication. Is the product working correctly? The lines between these two areas
are blurry, but, in general, the goal is to have fast, accurate, and good diagnos-
tics for process verification and at-speed for complete product verification.

The go-to solution for high volumes has been in-circuit test for more than
30 years. It uses electrical test techniques to isolate each component on the
board, confirm that the connectivity of the design is correct, and deduce that
the board should operate correctly. In reality, certain circuit configurations
and functional defects limit the detection capability that, in turn, will reduce
the overall fault coverage achieved with these techniques. Because it is fast,
it is used in high-volume environments; but because of the expense and time
involved in creating the in-circuit fixture, it is less applicable to low volume
situations.

Boundary-scan test is a specific test technique that uses the IEEE 1149 standard
to perform manufacturing defect detection via additional circuitry built into

13
certain types of components that provide simple access to complex compo-
nent circuitry. It can also be used for built-in self-test or in-system program-
ming. Provided the test access port of the boundary scan chain is exposed to
an edge connector, it can be straightforward to run.

Figure 1.4: SMT data format, consistency, application integration, and machine control.

Flying probe test uses similar techniques to in-circuit test, but instead of using
a custom fixture interface, it uses a limited number of robotic probes that
move and then press down to contact the PCB. Because of the physical move-
ment of the probes, the test times associated with flying probe test will be
longer than in-circuit test, but for small batches and quick turnaround, it can
be used when in-circuit test is not appropriate.

More intelligent test creation for flying probe allows the test time to be reduced
to align with the SMT line beat rate. Using board sampling techniques and only

Figure 1.5: Post-SMT process traceability, rigid test plan, complete line performance, and data loss.

14
running flying probe test if functional tests fail can be employed to align with
the overall production and quality goals. However, as the product mix and
manufacturing variants increase, non-fixturing test methodologies will likely
become more popular.

Data collected from the test machines can be used to improve the design for
the test process and reduce the cost and time of both the test programming
and the test duration and quality.
Normalizing, Interpreting, and Exchanging Data
Beyond the connection and exchange of data, normalized data is required to
integrate disparate automated processes and computerize human decision-
making. Normalized data is data that is expressed in a single language with a
consistent meaning regardless of the source of information.

To make the data useable from point to point and throughout the systems, it
needs to be understood from machine to machine, hardware to software, and
system to person. The point of normalization is to make variables comparable
to each other.

For example, you can measure temperature in both Fahrenheit and Centi-
grade in Seattle and Paris on a given day, and one is 68°F, and the other is
25°C. Saying 68 is bigger than 25, so Seattle is warmer, is wrong. Instead, the
measurements need to be reduced to the same scale and then compared.
Normalization is the process of reducing measurements to a neutral or stan-
dard scale.

A fully normalized database allows its structure to be extended to accommo-

date new types of data without changing the existing structure too much. As
a result, applications interacting with the database are minimally affected.

Figure 1.6: In the entire machine network, the data can be normalized so that it can be used
throughout the factory to control and improve processes.

15
Normalized relations, and the relationship between one normalized relation
and another, mirror real-world concepts and their interrelationships.

In the factory, process applications are responsible for exchanging raw data
with equipment and operators. When connected using a gateway platform,
they can normalize the events and information into a single language for
external consumption. Internally, each application functions optimally for the
given equipment or process but can be set up to use the same interface to
describe the manufacturing operations being performed.

For the purposes of the adoption of computerized control over existing auto-
mated processes, and to enable more intelligent and flexible automated
processes in the future, the new internet of manufacturing communication
standard must represent all events of significance on the shop floor, not only
those from machines.

The ODB++Manufacturing (ODB++M) machine-language specification defines

how information can be exchanged between automated and manual processes
and systems, including data format and content. This ability to communicate
is essential for a reliable and robust data-exchange environment. With a stan-
dardized format, whenever a new machine or process is introduced into any
part of the manufacturing operation, it can be immediately integrated without
rewriting software interfaces, algorithms, and data definitions. ODB++M is
designed to be part of the plug-and-play architecture for all manufacturing
events, such as machine events, material logistics, quality issues, and/or
product flow control.

The specification is available free to everyone from the ODB++M community

website at odbplusplus.com/manufacturing. Any manufacturing company,

Figure 1.7: Maintaining a digital thread with open, intelligent data exchange formats.

16
large or small, can use the specification for communication projects custom-
ized to each operation, knowing there is full compatibility with any future proj-
ects and new machines.

CFX communication is also supported by an ODB++M adapter. ODB++M

enables manufacturing intelligence. This example of interpreting an event
from an SMT machine on the production line illustrates how it works in the
factory.

Figure 1.8: ODB++M simplifies data qualification.

The raw data captured from a machine or process, using whatever proprietary
interfaces the machine may have, or other data capture methods, will usually
simply state that the machine is, for example, stopped because no PCB has
arrived. As an event, this has little information other than the obvious. It can be
used to calculate machine uptime and downtime, but without understanding
the cause of the event, little else. Most messages from processes are similar to
these, which are very much dependent on— yet ignorant of— external issues.

In the normalized ODB++M environment, the system can receive the raw event
data and immediately investigate the cause of the non-arrival of the next PCB
to be processed. The preceding process may belong to a different platform,
be from a different vendor, or may be a completely different type of process
altogether. As ODB++M normalizes the data into a standard language, the
system can easily determine that the preceding machine had been stopped
for another reason, such as an error when attempting to pick up a material for
placement. The true location of the issue behind the event is clarified.

When ODB++M is used to represent material and logistics events, such as

verification, the nature of the reason for the missed pick can be determined.
In this example, this could be caused by a multitude of reasons, including a
replenishment material that had not been delivered, the wrong replenishment

17
material had been delivered, an MSD issue had occurred with the material, or
a feeder jam happened.

Only by putting together all of the information from all of the relevant sources
can the original event be fully qualified, valuable event data created, and the
data used immediately for managing the live operation. The qualified event
can be stored in a cloud-based application, where subsequent analysis can
search for patterns that can yield significant improvement opportunities.
ODB++M makes all of this possible.

Closed-loop feedback systems, analysis of productivity and asset utilization,

and the creation of live just-in-time (JIT) material operations based on actual
material usage and spoilage can all be built and managed using ODB++M. With
full and reliable visibility of the operation, the flow and allocation of products
to lines can be dynamically optimized to meet volatile changes in customer
demand without loss of productivity from unnecessary setup changes or inef-
ficient SMT feeder layouts. The information represents the complete build-
record of each product made, a combination of material and process trace-
ability, and provides assurance of correct operating procedures by direct
process interaction and control.

Data exchange using ODB++M is bidirectional. As well as the collection of

data from processes, process setup and control can be done remotely. The
built-in normalization definitions within ODB++M are based on more than
15 years’ experience in all shop-floor operations, activities, and events. The
user community, consisting of machine vendors, manufacturers, and software
providers, continues to evolve ODB++M so that it remains relevant for the
latest machines and automation technology supporting the processes of the
future. A software development kit is available for ODB++M partners to apply
rapidly to a new machine and critical projects.

ODB++M enables value to be created from data from all kinds of machines
and processes, where individual vendors are open to share information and
to create value in their own products from the others’ use of ODB++M data.
Perspective and Qualification
Site applications are responsible for adding perspective from the complete
line and qualifying the data collected to identify root causes and bottlenecks.
When using a networked data collection and management system, the process
applications can all produce the same type of normalized events in a single
language; thus, minimal effort is required to connect processes for the highest
level of detail and perspective. In Chapter 2, we will look at what makes data
smart; that is, the difference between data on its own and analytics.

18
Distributing and Using the Data
In addition to the existing enterprise-level resources, such as ERP and MES, a
gateway combined with a standardized language provides the capability for
the discovery of resources in the factory and the events supported by those
resources. We also look at some real-world examples of how data can be
used to improve manufacturing and bring ROI to big data. In Chapter 3, we
will look at how data can be distributed from the underlying infrastructure for
external use.

19
 Chapter 2

The Difference Between Data and Analytics

Companies have been collecting data in large volumes. Highly varied data
from manufacturing operations comes in quickly that needs to be validated,
and its value prioritized so that it can be turned into something useful—trans-
formed from big data to smart data.

The amount of data available has grown exponentially into big data. Twenty
years ago, a PCB work order resulted in 100 data records, megabytes of data;
today, it is 10 billion records, terabytes of data. The investment in collecting
this data and storing it is high. However, without a way to analyze the data,
without analytics, it will not result in ROI.

Figure 2.1: Creating insights from big data.

Using analytics provides the best results with high-quality data. However, with
bad or non-validated, and inappropriately prioritized data, the most advanced
analytics still can be misleading and a waste of time.

What is high-quality data? It is data that has been normalized, formatted, and
validated so that it can be translated and read to provide insights and fore-
sight. It is data that can be understood at the point of consumption and be
immediately acted on.

21
 Data analytics is the process of exam-
ining data sets to draw conclusions
about the information they contain.
Manufacturing intelligence means
taking big data, applying advanced
analytics, and putting it back into
manufacturing processes.

Analytics for manufacturing can be used in:

• Asset management for accurate, real-time utilization, and OEE
• Traceability for capturing and investigating complete material
and process traceability data for individual PCBs, as well as full
system assemblies, using high-availability big-data storage
• Operation and labor management to measure and analyze how
resources are spent and track WIP in real-time
• Quality control to identify and analyze process and material fail-
ures and drive continuous improvement
• Design-to-manufacturing flow to detect factors affecting yield
and point out areas for improvement

What kind of data is most useful for improving and modifying manufacturing
processes?

Useful data comes from managed material handling across the factory,
including:
• Incoming material management and labeling
• JIT Kanban material delivery and FIFO
• Material setup and verification for the entire process
• MSD, AVL and LED management, and feeder maintenance
management
• Material consumption, replenishment, and traceability
• Asset utilization and monitoring

What are the benefits of using this data?

• Ensure material is at the right location at the right time
• Eliminate excess WIP and improve inventory turnover
• Reduce material changeover and management effort

22
What is needed to make this data actionable?
• Automated capture of the full build record from machines and
material verification processes (including events, tests, inspec-
tion, results, symptoms, causes, and resulting actions)
• Support for all materials, including PCB, SMT, bulk, hand-placed,
plated through-hole (PTH), solder paste, and serialized and
assembly parts
• The ability for process control
• Consistent data across all platforms and processes
• Efficient and practical data storage and fulfilling long-term
storage requirements
• Comprehensive reporting tool

We talk a lot about the digital twin. The whole point of having a digital twin for
an electronics manufacturing operation is to be able to analyze and under-
stand what is happening, why it is happening, and how to improve it. Research
shows that while the amount of data generated by manufacturing operations
increases exponentially, a small portion is analyzed.

A practical approach focuses on multiple levels of data analytics. It improves

asset management with accurate, real-time utilization, and overall equip-
ment effectiveness. It also helps capture and investigate complete material
and process traceability data for PCBs and assemblies using big-data, high-
availability storage.

Figure 2.2: Digital twin applications in manufacturing.

23
Further, it optimizes operation and labor by measuring and analyzing how
resources are spent and by tracking WIP in real-time. In addition, it ensures
quality and drives improvement by identifying and analyzing process defects
and material and process failures and increases design-to-manufacturing effi-
ciency by detecting factors affecting yield and areas for improvement.

There are four primary types of data analytics:

1. Descriptive analytics help answer questions about what
happened.
2. Diagnostic analytics help answer questions about why things
happened.
3. Predictive analytics help answer questions about what will
happen in the future.
4. Prescriptive analytics help answer questions about what
should be done.

At the descriptive level, analytics needs to be able to describe what is

happening. Indicators for key performance and operational efficiency can be
identified and alerts set up. All the process and material data can be aggre-
gated to provide detailed material and process traceability reports that assist
with proof of compliance and recall management.

24
At the diagnostic and predictive levels, data incorporates all collected param-
eters at corporate and site levels. It can be used to identify root cause, yield,
utilization, quality and performance issues, and for trend analysis. A good
analytics tool can be used to perform a root-cause analysis and discover why
the KPIs behave the way they do. At this point, it is useful to be able to connect
multiple sources of data.

Predictive analytics is based on accumulated data and behavior patterns. We

can identify trends and provide forecasts that can drive effective and efficient
executive decision-making. For example, the data can be analyzed to improve
material and/or vendor selection.

Here, a report shows two alternate components from different vendors. When
factoring the quality data with the cost of the components, we see that the
cheaper component actually ends up costing more because of the scrap mate-
rial resulting from it.

Manufacturing intelligence is enabled by the exchange of data from multiple

sources that is normalized so that it can go from data acquisition and control
through to the manufacturing execution system and finally to business
reporting and analytics.

More Effective Use of R&D Resources

Smart data is necessary to implement Industry 4.0. In some cases, manufac-
turers are choosing to develop their own data acquisition platform. However,
with the capabilities of advanced tools available, they do not have to be
investing their specialized knowledge in building an IoT platform.

Today, it is easier to get a data acquisition platform out-of-the-box. R&D

resources can be invested in leveraging the data to describe, analyze, and
improve manufacturing processes and material handling. Simple analysis can
identify bottlenecks in production, and this insight can translate to action—
how to improve yield and profitability. In this way, IT can focus their expertise
on leveraging the knowledge to drive excellence in manufacturing with less
focus on the technology, which is not the real target of the Industry 4.0 digita-
lization journey.

A PCB design for manufacturing analysis can perform 950 fabrication,

assembly, test, and reliability checks that assess the digital product twin for
issues affecting performance. Mechanical variation analysis simulates and
predicts assembly-level quality from part and subassembly geometric dimen-

25
sioning and tolerancing, identifying critical product and manufacturing infor-
mation.

PCB assembly process planning creates a digital twin of the production process,
enabling a “design anywhere, build everywhere” approach. Box-build planning
prepares process plans for NPIs, identifying the effects of design changes on
box-build lines, and delivering updated work instructions.

Process validation enables the visualization and analysis of the entire

assembly operation to discover issues relating to human, robot, and collab-
orative robotics assembly and to ensure adherence to best practices. Plant
throughput and utilization simulation improves the planning of capital invest-
ments and prediction of operating expenses, maximizes utilization, and
reduces per-part costs by optimizing production.

Material management tools ensure JIT deliveries of materials to the line,

eliminating excess work-in-process and improving inventory turnover. We
provide a comprehensive manufacturing operations management solution
for electronic and mechanical preproduction, production, and execution. The
solutions manage data from all resources (tools, operators, and machines),
provide complete as-built traceability, and integrate seamlessly with ERP and
product lifecycle management systems.

IoT solutions collect all data generated by the manufacturing process—

including data about mate-
rials consumed, quality, and
the process flow—creating a
digital twin of production and
making real-time, normalized
manufacturing data available
to enterprise applications.
Business analytics solutions
drive intelligent decision-
making based on real-time
analysis of manufacturing
data, root-cause analysis, and
prediction of future perfor-
mance, quality, and cost
trends.
Figure 2.3: Model of machine learning, predicting defects.

26
Figure 2.4: Examples of a sophisticated matrix. The clusters show group suppliers by mate-
rial characteristics. Regression shows the influence of material age on the potential for
defects. This image also shows the correlation matrix of the four KPI parameters.

27
Figure 2.5: A report can become the driver to make the necessary process changes by analyzing
the correlation between different parameters. For each component, we can see the different
manufacturer/supplier and unit price. A certain manufacturer may be more expensive for a
specific component, but its yield is higher, so its factored unit price will be lower than the other
and recommended to be used. The analytics shows how much money you can save if ordering
10,000 units from this component.

Figure 2.6: The distribution shows us all times when a machine stopped for changeover.
Thresholds can be defined to determine which changeover times were within the norm and
which deviated from it.

Not Just About Collecting Data, but Making the Data Smart
Industry 4.0 is not just about connecting another machine and collecting the
data. It is really about the mindset of understanding how problems can be
solved—looking at improving and moving toward excellence. Manufacturers
can buy a digital solution out-of-the-box from most companies in this area,
but they really must focus on how to use the knowledge in the data and the
software solutions implemented to improve the business.

28
Many of our customers are looking at overall equipment efficiency or overall
line efficiency only from the placement point of view, not the overall line. It can
be that the bottleneck is in the oven. They also do not consider that change-
over is actually a plant stop. This simple example shows the importance of
data.

Figure 2.7: OEE calculation, detailed planning for working/non-working time.

Let us say, in a given week, we have 10,080 minutes, and we need to run main-
tenance, a few changeovers, inventory count, and shift changes—all planned
stoppages. Next, we have weekends and holidays. Actually, we already lost a
chunk of the available production time. In the following example, you can see
there is no third shift (we need to reduce 2,400 minutes), so by design and
plan, we would never get 100% overall equipment efficiency (OEE).

Next, we have planned meetings—30 minutes of stopped production to

discuss things. The planning factor is important. OEE and overall line efficiency
(OLE) is how well we succeeded from the full realistic potential. Let us proceed
to the availability breakdown.

Figure 2.8: OEE calculation, breakdown of machine stop reasons.

29
We have a line waiting upstream. Let us say the printer had to wait for the
pick-and-place machines, for example. We also have a line waiting down-
stream—the oven is waiting. From the total time, we “wasted” 76% on the
planned factors, and out of the total availability, the performance was not
good enough.

Figure 2.9: OEE, Overall line efficiency calculation.

If the printer is really slowing down upstream, maybe we should take the
SP+SPI offline. However, to make a case and prove it, we need a baseline to
compare it with. With such a simple step, we can increase the line perfor-
mance by 10%, and we will never have soldering issues on the line itself.

In this example, we can see the overall picture. The real numbers factored into
the OEE/OLE that is presented with the current utilization rate (CUR)—that is,
how efficiently we used the actual available production time. To summarize,
making the data smart means taking the previous example and automating
the process so that this data is continuously monitored and analyzed for
better decision-making. Digitalization has to start by turning data into smart
data.

30
31
32
 Chapter 3

Putting Data to Work in the Factory

to Improve Business

There are many different and valid perspectives on the performance of a

factory. For instance, the fact that the factory is on shutdown may be signifi-
cant to a planner who is concerned with overall factory capacity. However, the
shutdown is less significant to the production manager, who simply wants to
know if the machines will run efficiently when they are scheduled to run.

With a mix of different customers, products, factories, lines, and machines,

hundreds of different KPIs may need to be considered. Some of these measure-
ments can be complex, requiring data from multiple processes—for example,
overall equipment effectiveness (OEE) calculations in which the performance
of the factory resources are considered as well as the quality of the end
products.

With all of this complexity, a bottleneck is often caused by some external force
that is not being measured. A machine may not be operating because of an
actual malfunction in the equipment, or it may be waiting for some upstream
or downstream process. Perhaps the operator is on break, or there is a
shortage of materials causing the downtime. To identify the root cause of a
problem and provide for an actionable response, these external forces must
be considered.

The Opcenter Intelligence Electronics application addresses this need, consid-

ering information coming from the enterprise and processes. Process-specific
applications provide performance data about the status of equipment.
Site-based constraints can be used to qualify any process status based on
constraints such as the overall factory schedule, material availability, or the
upstream/downstream bottleneck.

33
With information about process performance and the external constraints
influencing production, many optimization opportunities are possible using
an intelligent application. The process-specific layer would be able to optimize
based on external knowledge from other processes and higher-level appli-
cations, while the site-application layer would benefit from detailed process
information from each individual equipment.

Feedback
A prime example of applying these layers in a smart factory is in closed-loop
feedback. In this scenario, measurements taken at one process are used to
adjust the operation of another process automatically to maintain a consis-
tent result. For example, the SMT machine could adjust placements based on
drift data measured at the AOI.

A site-level analysis application collects the placement and material informa-

tion from the SMT machine through the process-specific application managing
that equipment. Next, the real-time measurement results coming from the AOI
are collected and analyzed to identify a process-control problem. The results
of this statistical analysis are fed back to the SMT machine so that adjustments
and compensations can be made as appropriate for the equipment.

Because a normalized interface is used at the AOI and the SMT machine, this
application functions across varying platforms while allowing each individual
equipment to take the optimal action for its technology.

Finite Planning
Finite planning of the SMT schedule can be significantly improved and opti-
mized through automation and computerization. In the typical situation, the
ERP system manages the customer demand and material requirements in
coarse granularity with little detail of the resources used in manufacturing.
Once the work order demand is generated in the ERP system, diligent work is
put into developing a production plan to satisfy the orders.

Complicated spreadsheets and workbooks are used to model the manufac-

turing flow and to manage constraints that are external to the ERP system.
Unexpected changes in customer demand or the manufacturing constraints
are difficult to integrate into the existing plan. Optimization of product group-
ings infrequently happens outside of the day-to-day planning activity.

34
If we use a smart factory topology, automation of the finite planning process
functions at each layer of the factory. The ERP system manages the customer
requirements and the high-level site calendar. A digital model of the production
process is generated based on constraints in the factory. All lines, machines,
processes, materials, transactions, and resources are taken into account in the
model to create a simulation of the manufacturing process. It supplies real-
time performance information from the manufacturing equipment through
the IoT infrastructure. The model also supplies the means to simulate produc-
tion for the given process.

In this way, a fully optimized production plan can be developed. Demand

from the ERP system can be deconstructed into the individual manufacturing
processes. Iterative simulations can find the ideal manufacturing sequence
using static site constraints and live performance data from the factory. A
feedback mechanism between the planning application and the equipment
processes can optimize programs and product groups based on the discrete
demand. Changes in the demand or the constraints can be continuously
accounted for in the production schedule.

Lean Material Management

For many manufacturers of electronic assemblies, maintaining an efficient
supply chain is key to success. Significant investments in ERP systems and
automation ensure that materials are in the warehouse to satisfy customer
demand; however, the act of moving material from the warehouse to the
machine often involves many manual processes. Large line-side buffer stocks
and lack of visibility into individual packages (reels, sticks, trays) of compo-
nents contribute to a discrepancy between the real-world stock and the system
inventory. With rich, detailed information available in the smart factory, a lean
material engine can bridge the gap between the ERP inventory and the shop
floor to provide JIT material logistics to the machines.

The first step to developing the lean material management engine is accessing
information held in various systems. The ERP system provides the work-order
demand that defines the sequence and schedule of products to run. The
warehouse management system provides the detail of individual components
that are available for production. At the process-specific layer, the equipment
system provides the machine program information, performance information,
and material consumption details.

35
Next, using the production schedule, the current machine setup, and the
live IoT data stream from the equipment, the lean material engine can work
out when individual components will need to be replenished—either on
the current order as reels are exhausted or on an upcoming order during a
changeover. With the connection to warehouse management, the lean mate-
rial engine can determine the ideal location from which to move components
and automatically initiate the movement transactions. The consumption data
reported by the individual machines can be aggregated, and accurate reports
made to the ERP system.

Finally, the large line-side buffer stocks are unnecessary. Material is ordered
from the warehouse or from Kanban storage only when it is needed on the
machine. With the automated reporting of consumption and wasted mate-
rials from the machine, the ERP inventory is as accurate as possible.

Traceability
Collecting traceability data has traditionally been a difficult requirement for
manufacturers. The complexity and cost associated with collecting detailed,
accurate data could lead to inconsistent results because individual trace-
ability requirements are negotiated between the customer and supplier on a
product-by-product basis.

The requirements for traceability data collection can be fulfilled by the existing
process applications in the smart factory infrastructure. Because the process
applications support a neutralized language and a normalized set of events,
consistent information can be aggregated by the site layer applications regard-
less of the particular machine platform. Detailed and consistent data can be
gathered regardless of the equipment platform.

Many opportunities exist today to implement improvements based on the

automation of manufacturing processes and business processes using a
smart factory infrastructure. This approach enhances machine vendor solu-
tions through information exchange with other machines and site applica-
tions. By collecting data from all manufacturing processes in the flow defined
here, with the process, site, and enterprise applications feeding each other
in an intelligently managed infrastructure, historically troublesome require-
ments, such as traceability, are much easier to fulfill. A smart factory solution
that removes these barriers will lead the industry to a greater adoption of
smart manufacturing functionality.

36
Manufacturing Analytics and IoT Systems
Now let us look at specific applications that will allow us to turn data into busi-
ness intelligence. First, we will cover the specifics that target this specific need.
Then, we will look at a real-world example that illustrates how it is being done
today.

Earlier, we touched on having a networked platform to make it easy to collect

data. By combining hardware connectivity throughout the lines and for each
machine, as well as input
and control from human
operators, with a uniform
language such as OML,
data can be moved easily
from the collection phase
into actionable informa-
tion and onward to mean-
ingful analytics.

You can implement the

system modularly, or
you can invest in an
entire control system
that provides analytics to
manufacturing managers,
supply chain managers,
and quality managers with
the ability to make intelli- Figure 3.1: Siemens edge device hardware extends con-
nectivity directly to equipment and equipment networks.
gent decisions in real-time
and drive continuous product improvement.

Transforming your data into usable business intelligence analytics provides

greater visibility into manufacturing equipment, processes, products, and
supply chain performance. It allows you to easily identify and monitor produc-
tion and supplier issues, prevent costly recalls, spot emerging trends, and
solve quality problems quickly.

With business analytics, you can harness historic data to drive informed deci-
sions. Companies can unearth powerful insights by identifying patterns in

37
thousands of readings from many products over time. The ability to predict
anomalies in equipment performance can result in significant savings on
scheduled repairs, maintenance cost reductions, and the virtual elimination
of breakdowns.

To begin, you can get a full enterprise performance overview for all manufac-
turing sites, lines, and equipment, including overall equipment effectiveness,
KPI reports, and dashboards. You can compare performance between facto-
ries and production lines, view history trends, and get an intuitive display of
results using graphs and detailed text listings of search results. Other data
sources can be integrated to enrich and share your reports and dashboards
throughout the company and with customers.

The system provides hundreds of out-of-the-box analytical functions, data-

mining algorithms, and predictive models, which will instantly improve your
ability to provide reports with accurate delivery estimates, production sched-
uling and capacity, WIP, and greater visibility to order fulfillment and status of
delivery against the due dates.

Video: Collecting data is not enough for improving PCB manufacturing processes.
The challenge is to turn big data into smart data. Watch this video clip to better
understand how Opcenter Intelligence Electronics can help achieve this target.

38
It’s a big-data analytics platform focused on and optimized for electronics
manufacturing. Its capabilities cover the areas discussed earlier: descriptive
analytics that provides real-time and historical KPI data, diagnostic analytics
that provides root-cause analysis and drill-down, and predictive analytics
for advanced trend analysis and prediction. Now, let us look at a real-world
example of companies putting their data to good use.

The Goal: Smarter Control Systems

ICCO EMT is part of the ICCO Group in Romania, which runs 55 new product
introductions (NPIs) and 3.5 million finished goods a year with three SMT lines,
two of which are IoT boxes. They started out as a reseller of pick-and-place
machinery from Kulicke & Soffa (K&S). Today, they are also a customer of K&S,
using their equipment to provide fast, high-quality manufacturing services for
a wide variety of businesses and markets, including automotive, medical, and
consumer electronics.

In today’s highly competitive electronics market, manufacturers are under

constant pressure to improve the speed and efficiency of their processes
without sacrificing quality. As a low-volume, high-mix producer, ICCO is
faced with the daily challenge of NPIs that are characterized by increasing
complexity and a growing BOM, increasing the possibility of error and waste.
The wide variety of products being produced requires better control systems
that reduce errors and provide real-time notifications when problems arise.

In addition, some of ICCO’s customers require special consumption reports

that enable them to trace the usage of parts and their assembly. Before
adopting these solutions, ICCO EMT used manual methods for tracking inven-
tory and production problems and provided manually generated reports to
their customers.

The company introduced its own PCB assembly process using K&S machines.
ICCO serves as a beta site for new K&S software releases. In this win-win situ-
ation, ICCO has access to the most advanced, cutting-edge software, and
K&S can test their software in a real production environment. ICCO is highly
involved in K&S’s software development process and can influence it as well,
providing the feedback that is so essential in the release of stable, fine-tuned
software systems.

39
Siemens provides K&S with OEM materials-management capabilities for their-
production software. While working with K&S, ICCO was exposed to our digital
manufacturing software and evaluated the solutions for their own use.

Tools for Creating Good Data

ICCO uses Valor Process Preparation software in every project to build the
programs and for stencil design. ICCO’s high project mix requires them to
plan multiple projects simultaneously, which allows them to plan two to three
products simultaneously. With this tool, ICCO’s production team automatically
verifies the orientation and position of components as designed in their CAD
system, helping to save time and reduce errors and waste.

Marius Stepanescu, ICCO’s technical director, explained, “Now, we get it right

the first time. With Valor Process Preparation, there is no need to check
orientation and positioning, which is a big timesaver. The entire engineering
process is done digitally. Before, our process included sticky tape. We had to
produce one board, check it, and then make corrections. We do the whole
thing digitally, saving two to three hours, depending on the complexity of the
board. Since we produce an average of four boards per week, we save at least
10 hours on this process alone. For the first time, we can now prepare multiple
plans simultaneously.”

They also use Opcenter Execution Electronics IoT software to acquire valu-
able manufacturing data that is used to analyze and improve production
processes. The software runs on any Linux-based system and easily connects
to the devices on the line, generating a real-time digital twin of shop-floor
performance.

One Unified IoT Controller to Collect and Manage Data

Using these solutions, ICCO was able to streamline its operations, replacing
multiple controllers with a single, central IoT controller. The unified controller
collects data from all the machines and allows ICCO users to log in and view
data on their mobile phones.

The IoT-generated data is then transmitted to Opcenter Intelligence Elec-

tronics, which has powerful analytics and reporting capabilities that enable
ICCO EMT to perform numerous compliance and troubleshooting functions,
such as board-specific data compilation and reporting, traceability data
storage and reports, remediation of quality issues of all types, including pick
issues and scrap rate reports. The reporting function helps ICCO discover

40
trends and proactively perform maintenance when required, tracking machine
uptime/downtime and percentage of defects, for example. The ability to track
incoming material helped reduce their inventory levels.

Nicolae Pindaru, ICCO’s executive director, said, “Opcenter Intelligence Elec-

tronics has really helped us to improve the quality of our products. We have a
better understanding of every stage of the manufacturing process and know
exactly when, where, and how to act in order to reach maximum efficiency.”
“The reports are now generated automatically. We can quickly respond to our
customers’ queries with highly accurate information,” Stepanescu added.

Using these execution and intelligence electronics tools, ICCO accelerated its
shop-floor processes by 20% while cutting the number of errors nearly in half
by using automated data mining processes and analytics. Performance data,
once available only in historical reporting format, can now be accessed by
ICCO in real-time when it is needed. Problems can be fixed immediately, and
scrap is minimized.

ICCO also leverages the traceability capabilities of Valor Material Manage-

ment software, generating unique serial numbers for each PCB, which is
now a common requirement of medical and automotive customers. The
system enables components to be traced back to their suppliers. The mate-
rial management capabilities streamline the requisition process, saving on the
need for rush orders and keeping the lines running at all times.

41
 Conclusion
IoT applications are gathering huge amounts of real-time, shop-floor data
constantly but collecting data simply is not enough—it needs to be used intel-
ligently. Analytics is the application of statistics and other mathematical tools
to business data to assess and improve practices. In manufacturing, opera-
tions managers today are using analytics to dive deeply into historical process
data, identifying patterns and relationships among discrete process steps and
inputs and optimizing aspects that have the greatest effect on yield.

Siemens, in its own factories and with customer partners worldwide, is putting
analytics solutions to work to enable better decision-making and ultimately
to reduce cost and waste. In the real world, manufacturers can use data to
improve factory performance, product quality, and profitability. Each manu-
facturing operation is unique, so let us help you get started down the right
path to the best solution for your factory.

References
1. Cadalyst Staff. “Closed-Loop Digital Twins are Key to Harnessing Data
Complexity,” June 2019.

2. Elliott, Z. “A Generalized Approach Can Help All Manufacturers Move

to Smart Factories,” Mentor Graphics white paper, June 2018.

3. Franke, M. and Avidan, I. “Improving the PCB Print Process Using Factory
Data: How We Transform a Buzzword into Manufacturing Excellence in
Electronics,” presented at IPC APEX EXPO 2019.

4. Atar, D. “From Data Collection to True Intelligence: How Electronics

Manufacturing is Becoming Smarter on the Way to Industry 4.0,”
Mentor Graphics white paper, August 2017.

5. Sperling, E. “Big Shifts in Big Data,” Semiconductor Engineering, July

2019.

6. Sundblad, W. “Two Ways to Transform Your Manufacturing: The Tradi-

tional Approach and the ‘Intelligent’ Way,” Forbes, February 2019.

7. “Valor IoT Manufacturing Analytics—Delivering Product Performance

Intelligence in a Global Value Chain,” Siemens data sheet.

42
About Siemens Digital Industries Software
Siemens Digital Industries Software is driving transformation to
enable a digital enterprise where engineering, manufacturing and
electronics design meet tomorrow. Our solutions help companies
of all sizes create and leverage digital twins that provide organiza-
tions with new insights, opportunities and levels of automation to
drive innovation. For more information on Siemens Digital Indus-
tries Software products and services, visit siemens.com/software
or follow us on LinkedIn, Twitter, Facebook and Instagram.

Siemens Digital Industries Software—Where today meets tomorrow.

43
 OEE Quality
OEE Quality

OEE Quality
88.7% 97.8%
88.7% 97.8%
Availability Performance
Availability
88.7% Performance
97.8%

Availability Performance
94.6% 95.5%

94.6% 95.5%
OEE Quality
1.90%
Pickup Error Monthly
94.6% Trend 95.5%
1.90%
1.25%
Pickup Error Monthly Trend
1.10%
88.7% 97.8% 0.80% 1.90%
1.25% 0.68%
Pickup Error Monthly Trend
1.10%
Availability Performance 0.34%
1.25% 0.80%
0.18% 0.17% 0.18% 0.68%
0.10%
1.10%
0.34% 0.80%
0.68%
0.18% 0.17% 0.18%
0.10%
Defects Pareto 0.34%
94.6% 0.18% 95.5%
0.17% 0.18%
0.10%

Cum. Defect Percentage

140 123 80%
72%
Number of DefectsNumber of Defects

80%
Defects Pareto
65%
Quality 100
1.90%
60%
Defects Pareto

Cum. Defect Percentage

Pickup Error Monthly Trend 14060 123 38 72%
40%
Minimum 31% 80%
Number of Defects

35 35 80%

Cum. Defect Percentage

65% 20 12 11 11 11 20%
10020
140
1.25% 123 6 5 5 5 3 3 3 2 1 1 1 80%
72% 80% 60%
1.10% 65%
Missingsolder
82
Missingcomponent
80
Shiftcomponent
Reverspolarit Reverspolarit
28
20
24

Shortsolder Shortsolder
26
18
29
Pin in air/tombstone

16
23
61

Wrong ComponentWrong Component

67
78
Billboard

NA
100
60 60% 40%
Minimum 31%
97.8% 38 35 35
0.68%
0.80%

2060
20 12 11 11 11
6 Minimum 31% 40% 20%
38 35 35 5 5 5 3 3 3 2 1 1 1
0.34% 20 12 11 11 11 20%
20 6
0.17%Performance
5 5 5 3 3 3 2 1 1 1
Missingsolder
82
Missingcomponent

80 80
Shiftcomponent

28 28
20 20
24 24

26
18
29
Pin in air/tombstone

16

61 23
61

Wrong Component
78 67
Billboard 78
Billboard

NA
0.18% 0.18%
0.10%
Missingsolder
82
Missingcomponent

Shiftcomponent
Reverspolarit

Shortsolder
26
18
29
Pin in air/tombstone

16
23

67

NA
Defects Pareto
95.5%
Cum. Defect Percentage

140 123 80%

72%
Number of Defects

80%
65%
100 60%
1.90%
60 Minimum 31% 40%
38 35 35
20 12 11 11 11 20%
20 6 5 5 5 3 3 3 2 1 1 1
1.25%
Missingsolder
82
Missingcomponent
80
Shiftcomponent
Reverspolarit
28
20
24

Shortsolder
26
18
29
Pin in air/tombstone

16
23
61

Wrong Component
67
78
Billboard

NA

1.10%

Smarter Decisions
0.80%
0.68%

0.10%

Data Driven Manufacturing

Cum. Defect Percentage

Smart manufacturing 80% processes generate terabytes

80%

of data. 60%

However, approximately
Minimum 31% 40% 70% of the data is not
20%
11 11 6 5 used
5 5 3due
3 3 to
2 the
1 1 lack
1 of an easy platform that will
leverage the data in an intelligent manner to drive
24

Shortsolder
26
18
29
Pin in air/tombstone

16
23
61

Wrong Component
67
78
Billboard

NA

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