Celular Samsung gt-s5260 Service Manual 0

GSM TELEPHONE
GT-S5260
GSM TELEPHONE CONTENTS
1. Safety Precautions
2. Specification
3. Product Function
4. Exploded View and Parts list
5. MAIN Electrical Parts List
6. Level 1 Repair
7. Level 2 Repair
8. Level 3 Repair
9. Reference data
Notice :
All functionality, features, specifications and other
product information provided in this document inclu
ding, but not limited to, the benefits, design, pricing,
components, performance, availability, and capabiliti
-es of the product are subject to change without
notice or obligation. Samsung reserves the right to
make changes to this document and the product
described herein, at anytime, without obligation on
Samsung to provide notification of such change.
This Service Manual is a property of Samsung Electronics Co.,Ltd. ⓒ Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under applicable
International and/or domestic law. 2011. 01. Rev.1.0
2. Specification
2-1. GSM General Specification
EG SM 900 DCS1800
Fre q. Band[MHz] 880~ 915 1710~ 1785

Uplink/Downlink 925~ 960 1805~ 1880
0~1 24 &
ARFCN r ange 512~ 885
975~1 023
Tx/Rx spa cing 45MHz 95MHz
Mod. Bit rat e/ 270.8 33kbps 270. 833kbps

Bit Period 3.6 92us 3.6 92us
T im e Sl ot
576. 9us 576. 9us
Period/F rame
4.615 ms 4.615 ms
Period
Modulation 0.3 GMSK 0.3 GMSK
MS Powe r 33dBm~ 5dBm 30dBm~0dBm
4 1
Power Class
(max +33dBm) (max +30dBm)
Sensit ivit y - 102dBm - 100dBm
T DM A Mu x 8 8
Cell Radius 35Km 2Km
2-1
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Specification
2-2. GSM Tx Power Class
TX Power TX Power
GSM900 DCS1800
control level control level
5 32.5±2 dBm 0 29.5±3 dBm
6 31±2 dBm 1 28±3 dBm
2 26±3 dBm
7 29±2 dBm
3 24±3 dBm
8 27±2 dBm
4 22±3 dBm
9 25±2 dBm
5 20±3 dBm
10 23±2 dBm
6 18±3 dBm
11 21±2 dBm
7 16±3 dBm
12 19±2 dBm
8 14±3 dBm
13 17±2 dBm
9 12±4 dBm
14 15±2 dBm
10 10±4 dBm
15 13±2 dBm
11 8±4 dBm
16 11±3 dBm
12 6±4 dBm
17 9±3 dBm 13 4±4 dBm
18 7±3 dBm 14 2±5 dBm
19 5±3 dBm 15 0±5 dBm
2-2

3. Operation Instruction and Installation
Main Function
• Android OS: Eclair

• HSDPA 7.2Mbps / HSUPA 5.76Mbps
• 5MP AF w/o LED Flash
• 4.0" WVGA Super AMOLED Full Touch (C-Type)
• A-GPS / BT v3.0 / USB v2.0 / WiFi (802.11 b/g/n)
• HD Recording (720p) / Full HD Playback (1080p), DLNA
• Sensors: Accelerometer, Compass, Proximity, Light
• TouchWiz 3.0 for Android, Multistage, Augmented Reality, Integrated phonebook with
SNS, IM, E-mail, Face Recognition, etc.
3-1
6. Level 1 Repair
6-1. S/W Download
6-1-1. Pre-requsite for S/W Downloading
• Downloader Program(MultiLoader_V5.65.exe)
• GT-S5260 Mobile Phone
• Data Cable
• JIG BOX (GH99-36900A)
• RF Test Cable (GH39-00985A)
• JIG Cable (GH39-01290A)
• Adapter (GH99-38251A)
• Binary files
（ Settings
Connect to ANYWAY JIG BOX

& JIG CABLE (Phone to JIG)
6-1

Level 1 Repair
6-1-2. S/W Downloader Program

｝ Load the binary download program by executing the
" MultiLoader_V5.65.exe " enter this file.
1. Check the "Full Download BOX" and open binary folder.
6-2
Level 1 Repair
2. Select the each items in the Downloader V5.65 and Choose the files.
Downloader V5.65 file name
Boot BOOTFILES (folder)
Apps apps_compressed.bin
Rsrc1 Rsrc_S5260_Open_Europe_Common.rc1
Rsrc2 Rsrc2_S5260(Low).rc2
Factory FS FactoryFs_S5260_Open_Europe_Common.ffs
CSC CSC_S5260_Open_Europe_Common_OXA.csc
SHP APP ShpApp.app
6-3
Level 1 Repair
3. Connect the handset, select Download.

(For enter "Download mode", press hold key+Vol. up key+send key.)
(downloading screen)
6-4
Level 1 Repair
4. When downloading is complete, confirm the this message.

"All files complete"
5. Confirm the downloaded version name and etc. :

*#1234#
Full Reset :
*2767*3855#
6-5
9. Reference Abbreviate
Reference Abbreviate
― AAC: Advanced Audio Coding.

― AVC : Advanced Video Coding.
― BER : Bit Error Rate
― BPSK: Binary Phase Shift Keying
― CA : Conditional Access
― CDM : Code Division Multiplexing
― C/I : Carrier to Interference
― DMB : Digital Multimedia Broadcasting
― EN : European Standard
― ES : Elementary Stream
― ETSI: European Telecommunications Standards Institute
― MPEG: Moving Picture Experts Group
― PN : Pseudo-random Noise
― PS : Pilot Symbol
― QPSK: Quadrature Phase Shift Keying
― RS : Reed-Solomon
― SI : Service Information
― TDM : Time Division Multiplexing
― TS : Transport Stream
9-1
1. Safety Precautions
1-1. Repair Precaution
― Repair in Shield Box, during detailed tuning. Take specially care of tuning or test, because
specipicty of cellular phone is sensitive for surrounding interference(RF noise).
― Be careful to use a kind of magnetic object or tool, because performance of parts is damaged by
the influence of magnetic force.
― Surely use a standard screwdriver when you disassemble this product, otherwise screw will be
worn away.
― Use a thicken twisted wire when you measure level.

A thicken twisted wire has low resistance, therefore error of measurement is few.
― Repair after separate Test Pack and Set because for short danger (for example an overcurrent
and furious flames of parts etc) when you repair board in condition of connecting Test Pack and
tuning on.
― Take specially care of soldering, because Land of PCB is small and weak in heat.
― Surely tune on/off while using AC power plug, because a repair of battery charger is dangerous
when tuning ON/OFF PBA and Connector after disassembling charger.
― Don't use as you pleases after change other material than replacement registered on SEC System.
Otherwise engineer in charge isn't charged with problem that you don't keep this rules.
1-1
Safety Precautions
1-2. ESD(Electrostatically Sensitive Devices) Precaution
Several semiconductor may be damaged easily by static electricity. Such parts are called by ESD
(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.
You can prevent from ESD damage by static electricity.
― Remove static electricity remained your body before you touch semiconductor or parts with
semiconductor. There are ways that you touch an earthed place or wear static electricity prevention
string on wrist.
― Use earthed soldering steel when you connect or disconnect ESD.
― Use soldering removing tool to break static electricity. , otherwise ESD will be damaged by static
electricity.
― Don't unpack until you set up ESD on product. Because most of ESD are packed by box and
aluminum plate to have conductive power,they are prevented from static electricity.
― You must maintain electric contact between ESD and place due to be set up until ESD is
connected completely to the proper place or a circuit board.
1-2
4. Exploded View and Parts List
4-1. Cellular phone Exploded View
QME03
QFR01
QLC01
QLB01
QKP02
QCA01 QME01
QJK01
QAR01
QMO01
QMP01
QSP01
QRF06
QVO01 QCK02
QSD01
QRE01
QCR67
QBC00
4-1

Exploded View and Parts List
4-2. Cellular phone Parts list

Design LOC Description SEC CODE
QAR01 AUDIO-RECEIVER 3009-001521

QCR67 SCREW-MACHINE 6001-002083
QMO01 MOTOR DC-SPHV8400 GH31-00187A
QJK01 MODULE-EARJACK/FPCB ASSY GH59-10334A

QME03 TOUCH/PANEL-EU COMMON (WHITE) GH59-10336A
QSP01 MODULE-SPK/INTENNA (GT-S5260) GH59-10488A
QCA01 CAMERA MODULE-3M CAMERA MODULE GH59-10594A

QMP01 A/S ASSY-PBA MAIN (COMM) GH82-05493A
QLC01 ASSY LCD-MODULE ASSY(GT-S5260) GH96-04956A
QME01 ASSY MODULE-KEY PBA/MIC/BRACKET GH96-05038A

QKP02 ASSY KEYPAD-SUB GH98-18495A
QFR01 ASSY CASE-FRONT GH98-18510A
QBC00 ASSY COVER-BATT GH98-18512A
QLB01 ASSY BRACKET-LCD GH98-18513A
QRE01 ASSY CASE-REAR GH98-18511A
QVO01 PMO KEY-VOLUME GH72-61830A

QCK02 PMO KEY-HOLD GH72-61831A
QRF06 PMO COVER-USB GH72-61832A
QSD01 PMO COVER-SD GH72-61833A
4-2

5. MAIN Electrical Parts List
SEC CODE Design LOC Description

0403-001870 ZD300 DIODE-ZENER
0404-001172 D402 DIODE-SCHOTTKY
0404-001504 D100,D101 DIODE-SCHOTTKY
0406-001286 ZD400 DIODE-TVS
0406-001329 ZD401 DIODE-TVS
0406-001446 ZD402,ZD40 DIODE-TVS
0406-001446 ZD405 DIODE-TVS
0407-001002 D300 DIODE-ARRAY
0505-002388 Q401 FET-SILICON
0801-003130 U200 IC
1001-001607 U104 IC
1001-001655 U401 IC
1001-001687 U102 IC
1108-000395 UME200 IC
1201-003166 PAM100 IC
1202-001068 U409 IC
1203-006589 U402 IC
1203-006660 U300 IC
1205-003868 U100 IC
1205-004046 UCP200 IC
1205-004113 U103 IC
1209-001945 U302 IC
1404-001221 VR300 VARISTOR
1405-001231 VR200,VR20 VARISTOR
1405-001231 VR411,VR41 VARISTOR
1405-001298 VR400,VR40 VARISTOR
1405-001298 VR405,VR40 VARISTOR
1405-001298 VR412 VARISTOR
2007-000137 R407 R-CHIP
2007-000138 R101 R-CHIP
2007-000140 R103,R424 R-CHIP
2007-000141 R204,R205, R-CHIP
2007-000141 R415,R416 R-CHIP
2007-000143 R201,R219, R-CHIP
2007-000144 C231,R211, R-CHIP
2007-000148 R304,R411 R-CHIP
5-1

Main Electrical Parts List

2007-000156 R305 R-CHIP
2007-000157 R423 R-CHIP
2007-000159 R208 R-CHIP
2007-000162 R107,R110, R-CHIP
2007-000162 R217,R221, R-CHIP
2007-000165 R300,R421, R-CHIP
2007-000169 R429 R-CHIP
2007-000170 R402,R408, R-CHIP
2007-000172 R401,R406 R-CHIP
2007-000758 R422 R-CHIP
2007-001244 R209 R-CHIP
2007-001291 R301,R302 R-CHIP
2007-001295 R404,R413 R-CHIP
2007-001298 R102,R403 R-CHIP
2007-001333 R409 R-CHIP
2007-002965 R108 R-CHIP
2007-003014 R312 R-CHIP
2007-003015 R418,R419 R-CHIP
2007-007008 R306 R-CHIP
2007-007014 R410 R-CHIP
2007-007015 R430 R-CHIP
2007-007132 R106,R112 R-CHIP
2007-007193 R200 R-CHIP
2007-007312 R214 R-CHIP
2007-007315 R218 R-CHIP
2007-007981 R309,R311 R-CHIP
2007-008401 R308 R-CHIP
2203-000233 C129,C130, C-CERAMIC
2203-000233 C234 C-CERAMIC
2203-000254 C137,C223, C-CERAMIC
2203-000278 C120,C121, C-CERAMIC
2203-000278 C127,C128, C-CERAMIC
2203-000278 C166,C167, C-CERAMIC
2203-000386 C165,C312, C-CERAMIC
2203-000386 C416 C-CERAMIC
2203-000425 C220 C-CERAMIC
5-2


2203-000438 C144,R425 C-CERAMIC
2203-000466 C131 C-CERAMIC
2203-000696 C140 C-CERAMIC
2203-000714 C119 C-CERAMIC
2203-000812 C114,C342, C-CERAMIC
2203-000812 C414 C-CERAMIC
2203-000854 C118,C151, C-CERAMIC
2203-000995 C206,C217, C-CERAMIC
2203-001101 C224 C-CERAMIC
2203-001153 C400,C405, C-CERAMIC
2203-002487 C428,C429, C-CERAMIC
2203-005057 C117 C-CERAMIC
2203-005450 C145 C-CERAMIC
2203-005481 C423 C-CERAMIC
2203-006048 C102,C104, C-CERAMIC
2203-006048 C109,C125, C-CERAMIC
2203-006048 C157,C171, C-CERAMIC
2203-006048 C211,C212, C-CERAMIC
2203-006048 C215,C216, C-CERAMIC
2203-006048 C316,C341, C-CERAMIC
2203-006048 C402,C403, C-CERAMIC
2203-006048 C419,C420 C-CERAMIC
2203-006141 C306 C-CERAMIC
2203-006190 C112,C155 C-CERAMIC
2203-006257 C345 C-CERAMIC
2203-006260 C122 C-CERAMIC
2203-006348 C301,C437, C-CERAMIC
2203-006399 C126,C133, C-CERAMIC
2203-006399 C147,C200, C-CERAMIC
2203-006399 C208,C210, C-CERAMIC
2203-006399 C307,C309, C-CERAMIC
2203-006399 C319,C322, C-CERAMIC
2203-006399 C328,C329, C-CERAMIC
2203-006399 C352,C412, C-CERAMIC
2203-006399 C427,C431, C-CERAMIC
2203-006399 C434,C435 C-CERAMIC
5-3


2203-006562 C401 C-CERAMIC
2203-006681 C226,C421 C-CERAMIC
2203-006824 C100,C422 C-CERAMIC
2203-006841 C305 C-CERAMIC
2203-006872 C105,C135, C-CERAMIC
2203-006872 C205,C207, C-CERAMIC
2203-006872 C225,C349 C-CERAMIC
2203-006890 C300,C320, C-CERAMIC
2203-006890 C337 C-CERAMIC
2203-007271 C326,C327, C-CERAMIC
2203-007271 C334,C335 C-CERAMIC
2203-007279 C113,C303, C-CERAMIC
2203-007317 C101,C143 C-CERAMIC
2203-007775 C115,C116 C-CERAMIC
2404-001377 TA400 C-TA,CHIP
2404-001496 TA300 C-TA,CHIP
2404-001506 TA301 C-TA,CHIP
2404-001516 C302 C-TA,CHIP
2703-001733 C103 INDUCTOR-SMD
2703-001748 L106,L107 INDUCTOR-SMD
2703-001751 L119,L121 INDUCTOR-SMD
2703-001938 L403 INDUCTOR-SMD
2703-002198 L115,L116 INDUCTOR-SMD
2703-002200 L120,L122 INDUCTOR-SMD
2703-002204 L112,L123 INDUCTOR-SMD
2703-002267 L114,L117 INDUCTOR-SMD
2703-002281 L109,L113 INDUCTOR-SMD
2703-002367 C153,C154 INDUCTOR-SMD
2703-003686 L300,L301 INDUCTOR-SMD
2801-004466 OSC300 CRYSTAL-UNIT
5-4


2901-001639 F400,F401, FILTER-EMI SMD
2904-001935 F100 FILTER-SAW
2904-001937 F101 FILTER-SAW
2909-001337 F102 FILTER-DUPLEXER
3003-001136 MIC401 MIC-CONDENSOR
3301-001438 L128 CORE-FERRITE BEAD
3301-001534 L100,L101 CORE-FERRITE BEAD
3301-001659 L124,L125, CORE-FERRITE BEAD
3301-001812 L400,L402 CORE-FERRITE BEAD
3301-002062 L404 CORE-FERRITE BEAD
3301-002065 L406,L407, CORE-FERRITE BEAD
3301-002065 R400 CORE-FERRITE BEAD
3404-001303 TAC_DN,TAC SWITCH-TACT
3404-001303 TAC_UP SWITCH-TACT
3705-001731 RFS100 CONNECTOR-COAXIAL
3708-002222 SLC401 CONNECTOR-FPC/FFC/PIC
3709-001575 SD300 CONNECTOR-CARD EDGE
3709-001668 SIM300 CONNECTOR-CARD EDGE
3711-006615 HDC401,SLC CONNECTOR-HEADER
3711-006676 HDC400 CONNECTOR-HEADER
3711-007650 BTC300 CONNECTOR-HEADER
3712-001348 ANT400,ANT CONNECTOR-TERMINAL
3722-002867 IFC400 JACK-PHONE
GH62-00018A GA100 PAD GAP-PCB GASKET
Please consult the GSPN website (Samsung Portal) for the most recent version of the product's
part list.
5-5

7. Level 2 Repair
7-1. Disassembly and Assembly Instructions

7-1-1. Disassembly
1 1) disassemble Screw 6 point from Rear 2 1) Start side line and then bottom line using
disassemble tool.
1) When you disassemble screw, be careful crack of

rear and scratch. 1) When using disassemble tool, be careful crack of
2) Screw size : 1.4 * 3.5 (6001-002083) rear and scratch.
TORQUE : 1.0~1.2 Kgf·cm
3 1) Next step, opposite side of rear using 4 1) Take rear from set.
disassemble tool.
1) When using disassemble tool, be careful crack of rear

1) be careful crack of rear and scratch.
and scratch.
7-1

7. Level 2 Repair
5 1) First, take off motor from bracket using 6 1) Take off KEY Connector from PBA
tweezers
1) Be careful not to damage MOTOR WIRE. 1) Be careful not to damage connector and FPCB.
7 1) Lift PCB from right side of PBA 8 1) Disconnect LCD connector.
1) Be careful not to damage components around

1) Be careful not to damage LCD FPCB.
connector.
7-2

7. Level 2 Repair
9 1) Take off PBA from Front ass'y 10 1) Take off KEY Connector from Front ass'y
using tweezers.
1) Be careful not to damage FPCB. 1) Be careful not to damage connector and FPCB.
11 1) Take off KEYPAD from Front. 12 1) Take off LCD BRACKET from frint.
1) Take off KEY PAD easily if overturn FRONT. 1) Be careful not to damage LCD FPCB.
7-3

7. Level 2 Repair
13 1) Diconnect TSP Connector를 and take off 14 1) Take off LCD from FRONT.
FPCB using tweezers.
1) When using tweezers, be careful not to damage

1) When disassembling, be careful not to damage LCD.
components around FPCB.
15 1) Disassembling completed
1) Be careful not to inflow dust into LCD and TSP

WINDOW.
7-4

7. Level 2 Repair
7-1-2. Assembly
1 1) Before put LCD on FRONT, keep eyes 2 1) Put LCD on the FRONT from upper line.
dust on the front.
1) Keep eyes dust on the front. 1) Be careful dust and damage of components.
3 1) Connect TSP FPCB and LCD 4 1) Insert LCD FPCB into hole of BRACKET
CONNECTOR. and then assemble front hook and bracket.
1) Be careful not to damage FPCB.

1) Be careful not to damage FPCB.
2) During assembling HOOK with BRACKET, Be careful
2) follow guideline.
not to damage Bracket.
7-5

7. Level 2 Repair
5 Put KEY PAD on the Front Ass'y 6 1) Put KEY BRACKET on KEYPAD.
1) Be care not to put KEY PAD on the front wrong 1) First, put on right side of KEY Bracket and push
position and scratch. left side of KEY Bracket along the Z axis.
7 1) Connect LCD FPCB and PBA 8 1) Put MOTOR on the PCB and connect KEY
CONNECTOR Connector..
2) Assemble FRONT ASS'Y and PBA.
1) Be careful not to damage FPCB and components around

1) Be careful not to damage MOTOR WIRE and FPCB
PBA.
7-6

7. Level 2 Repair
9 1) Assembling REAR CASE from upper side. 10 1) Insert 6 point screw.
1) When assembling, be careful dust inflow,

1) When assembling, be careful dust inflow, components components damage, scratch.
damage, scratch. 2) Screw size : 1.4 * 3.5 (6001-002083)
TORQUE : 1.0~1.2 Kgf·cm
11 1) Assembling completed
1) Keep eyes on SET scratch, key click tension, screw

status.
7-7

8. Level 3 Repair
8-1. Block Diagram
8-1

Level 3 Repair
8-2. PCB Diagrams

8-2-1. Top
8-2

Level 3 Repair
8-2-1. Bottom
8-3

Level 3 Repair
8-3. Flow Chart of Troubleshooting
※ presetting methods for checking TP

- GND & TP(exp. VBAT=C302 , C303) using Oscilloscope
- look over the coming out signal.
← Oscilloscope
GND
TP (Test Point)
8-4

Level 3 Repair
← Multi-meter
← Checking the TP(test point) using Multi-meter
- EX) to look up the TP, shunt Cap. - if checking the GND, you can listen "beep"
if checking the Signal, you can't listen it.
8-5

Level 3 Repair
8-3. LOGIC
8-3-1. Power On
Power switch on
NG
Check the current NO

consumption Download
>= 100mA?
Yes
Check the battery NO

voltage Change the battery
>= 3.45?
Yes
Check the clock at NO

OSC300 = 32 kHz ? Resolder OSC300
Yes
C220(1.28V_VCORE)=1.28V?
C211(3.0V_DIG)=3.0V? NO
C214(1.8V_MEM)=1.8V?
C221(2.7V_VRF)=2.7? Check the U300
C224(1.3V_VRF)=1.3V?
C208(1.3V_VCXO)=1.3V?
Yes
NO
Check the clock Check the clock generation circuit
26 MHz ? OSC200
Yes
Check the initial operation
8-6

Level 3 Repair
8-7

Level 3 Repair
8-8

Level 3 Repair
8-3-2. LCD Working
Power Switch On
LCD FPCB
LCD Display connector is co correctly connect
On? rrectly connecti
NO NO
ned?
Yes
F400, F401,
F400, F401,
F402, HDC400 F402, HDC400
Correctly moun
ted? NO Resolder
Yes
Yes
C421
LED_P_24V=24V?
Yes NO
LCD Replace U402 & Check

Replace neighboring circuits
8-9

Level 3 Repair
8-10

Level 3 Repair
8-11

Level 3 Repair
8-12

Level 3 Repair
8-3-3. TSP
Operate TSP
NG
Check NO
TSP Connecting Reconnecting TSP
YES
Change TSP Module
NO
No Problem? Change main PBA
YES
END
8-13

Level 3 Repair
8-3-4. Audio Working

 Speaker Working
Operate speaker
NG
Check NO
Speaker Reconnecting SPK
Connecting
YES
Speaker break YES Change Speaker

down? Module
NO
YES Resolder
Signal on in C309, C318
C309, C318? Replace U300
NO
Change main PBA
8-14

Level 3 Repair
8-15

Level 3 Repair
l Receiver Working
Operate Receiver
NG
Check NO
Receiver Resoldering
Correctly mount? Receiver
YES
Receiver break YES Change Receiver

down? Module
NO
Change main PBA
8-16

Level 3 Repair
 Main MIC Working
Operate MIC
NG
YES
Pollute Clean up MIC hole
MIC Hole?
NO
Check MIC NO
Correctly Reconnecting MIC
Connecting?
YES
MIC break NO Change MIC

down? Module
YES
Check NO Resolder
HDC401 HDC401
Correctly mount?
YES
Change main PBA
8-17

Level 3 Repair
8-18

Level 3 Repair
8-3-5. KEY Working
 Volume KEY
Press Side Key
NG
YES
All key NG? Change Rear
NO
Change Side key pad
YES
Any key NG? Change Main PBA
NO
END
8-19

Level 3 Repair
 Main Key
Press Power Key
Power (END) Yes 3key PBA FPCB

Yes Change Key PBA
Key NG? Connector correct
ly connected? Change Main PBA
NO
NO
Correctly connect
The End
8-20

Level 3 Repair
8-3-6. Vibrator Working
Operate Vibrator
NO
Check
NO
Vibrator Correctly Resolderling
mount?
Yes
VDD_MOT-3V0 Check PMIC (U300)

No
(C323) = 3.0V ? Change Main PBA/ Motor
Yes
D300 Yes
Resolder D300, C349
C349 = 3.0V?
NO
Change Main PBA
8-21

Level 3 Repair
8-3-7. T-Flash Card Working
Insert & Operate

microSD card
NG
SD300 YES
break down ? Change SD300
NO
YES
R300 = 1.8V ? Change SD300
NO
NO
C304 = 3.0V ? Check U300(PMIC)
YES
Change Main PBA
8-22

Level 3 Repair
8-23

Level 3 Repair
8-3-8. SIM Card Working
Insert & Operate

SIM card
NG
Yes
SIM Soket
Break down? Change SIM Soket
No
R304 No Check PMIC

= 3.0V ? (U300)
Yes
Change PBA
8-24

Level 3 Repair
8-25

Level 3 Repair
8-3-9 CAMERA Working
Operate CAMERA
NG
Camera FPCB con NO

nector is correctly correctly connect
connected?
Yes
NO Change
C424 = 1.8V ? U300(PMIC) / PBA
C427 = 2.8V ?
Yes
CAMERA
Replace
8-26

Level 3 Repair
※ presetting 8960
(Rx setting)
1. Active Cell
: select GSM or GPRS
2. Connetion Type
: select Auto(GSM), BLER(GPRS)
3. BCH Parameter
: select measuring band (DCS or EGSM)
4. Cell power
: -60dBm
8-27

Level 3 Repair
(Tx setting)
※ After setting 8960 ( EGSM / DCS )
1. After setting, prepare the call setup Display

2. Using an Originate Call, make a call.
3. Confirm the display "connected"
4. start the measuring
※ 8960 & spectrum analyzer (down & up at picture)
- spectrum analyzer : testing method = the way using an Osciliscope
- 8960 : connect using RF Cable between 8960 & RF Connector in board.
8-28

Level 3 Repair
8-3-10. GSM850 Receiver
RX ON
Cell Power : -60dBm
Yes
PAM100 Pin11 ≥
-65dBm No
Resolder PAM100, L103,C114
(L103 using spectrum
analyzer)
Yes
PAM100 Pin18 ≥ No Check PAM100 No Check ANT Switch

-68dBm control check control circuit
Yes
Resolder PAM100
Yes
F100 8,9pin,
D100,D101,C153,L106, No
L107,C154 ≥ Resolder F100,D100,D101,C153,L106,L107,C154
-75dBm
Yes
Check UCP200
Yes
END
8-29

Level 3 Repair
8-3-11. GSM900 Receiver
RX ON
Cell Power : -60dBm
Yes
PAM100 Pin01 ≥
-65dBm No
analyzer)
Yes

Yes
Resolder PAM100
Yes
F100 6,7Pin, No
L109,L123,L112,L113 ≥ Resolder F100, L109,L123,L112,L113
-75dBm
Yes
Check UCP200
Yes
END
8-30

Level 3 Repair
8-3-12. DCS Receiver
RX ON
Cell Power : -60dBm
Yes
PAM100 Pin11 ≥
-65dBm No
analyzer)
Yes
PAM100 Pin16≥ No Check PAM100 No Check ANT Switch

Yes
Resolder PAM100
Yes
F101 9,8pin,
L114,L115,L116,L117 No
Resolder F101, L114, L115, L116, L117
≥
-75dBm
Yes
Check UCP200
Yes
END
8-31

Level 3 Repair
8-3-13. PCS Receiver
RX ON
Cell Power : -60dBm
Yes
PAM100 Pin11 ≥
-65dBm No
analyzer)
Yes

Yes
Resolder PAM100
Yes
F101 6,7pin,
L119,L120,L121,L122 No
Resolder F101, L119, L120, L121, L122
≥
-75dBm
Yes
Check UCP200
Yes
END
8-32

Level 3 Repair
8-4. Service Schematics
8-33

Level 3 Repair
8-34

Level 3 Repair
8-3-14. GSM850/GSM900 Transmitter
TX Power is too Low!!

TX ON (5Level)
CLOCK CHECK? NO
26MHz @ OSC200 Re-solder OSC200
YES
PAM100 pin28 ≥ -4
dBm NO
Re-solder or change
(R102 using spectrum UCP200
analyzer)
YES
Check the Voltage NO Check the UCP200 & VBAT

C113,C155 < 3.3V? circuit.
YES
PAM100 Pin11 ≥
30dBm NO
Resolder PAM100
analyzer)
YES
Check the RFS100 NO

connection with PCB? Resolder RFS100.
YES
Antenna change
8-35

Level 3 Repair
8-3-15. DCS/PCS Transmitter
TX Power is too Low!!

TX ON (5Level)
CLOCK CHECK? NO
26MHz @ OSC200 Re-solder OSC200
YES
PAM100 pin27 ≥ -4 NO
dBm Re-solder or change
(R101 using spectrum UCP200
analyzer)
YES
NO
Check the Voltage Check the UCP200 & VBAT
C113, C155 < 3.3V? circuit.
YES
PAM100 Pin11 ≥ NO
30dBm Resolder PAM100
analyzer)
YES
NO
Check the RFS100
connection with PCB? Resolder RFS100.
YES
Antenna change
8-36

Level 3 Repair
8-4. Service Schematics
8-37

Level 3 Repair
8-38

Level 3 Repair
- NC Point(Top View)
: NC
U300
1 2 3 4 5 6 7 8 9
A ○ ○ ○ ○ ○ ○ ○ ○ ○
B ○ ○ ○ ○ ○ ○ ○ ○ ○
C ○ ○ ○ ○ ○ ○ ○ ○ ○
D ○ ○ ○ ○ ○ ○ ○ ○ ○
E ○ ○ ○ ○ ○ ○ ○ ○ ○
F ○ ○ ○ ○ ○ ○ ○ ○ ○
G ○ ○ ○ ○ ○ ○ ○ ○ ○
H ○ ○ ○ ○ ○ ○ ○ ○ ○
J ○ ○ ○ ○ ○ ○ ○ ○ ○
UME200
8-39

Level 3 Repair
UCP200
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
A ○ ○ ● ● ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
B ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
C ○ ○ ○ ○
D ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
E ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
F ○ ○ ○ ○ ○ ○ ● ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
G ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
H ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
J ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
K ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
L ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
M ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
N ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
P ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
R ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
T ○ ○ ● ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
U ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
V ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
W ○ ● ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
Y ○ ● ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
AA ○ ○ ○ ○ ○ ○ ○
AB ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ● ○ ○ ○ ○ ○ ○
AC ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ● ○ ○ ○ ○ ○ ○
8-40


Celular Samsung gt-s5260 Service Manual 0

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GSM TELEPHONE

GSM TELEPHONE CONTENTS

2-1. GSM General Specification

Fre q. Band[MHz] 880~ 915 1710~ 1785

Tx/Rx spa cing 45MHz 95MHz

Mod. Bit rat e/ 270.8 33kbps 270. 833kbps

Modulation 0.3 GMSK 0.3 GMSK

MS Powe r 33dBm~ 5dBm 30dBm~0dBm

Sensit ivit y - 102dBm - 100dBm

Cell Radius 35Km 2Km

2-2. GSM Tx Power Class

5 32.5±2 dBm 0 29.5±3 dBm

6 31±2 dBm 1 28±3 dBm

17 9±3 dBm 13 4±4 dBm

18 7±3 dBm 14 2±5 dBm

19 5±3 dBm 15 0±5 dBm

SAMSUNG Proprietary-Contents may change without notice

• Android OS: Eclair

6-1-1. Pre-requsite for S/W Downloading

Connect to ANYWAY JIG BOX

This Document can not be used without Samsung's authorization

6-1-2. S/W Downloader Program

1. Check the "Full Download BOX" and open binary folder.

3. Connect the handset, select Download.

4. When downloading is complete, confirm the this message.

5. Confirm the downloaded version name and etc. :

― AAC: Advanced Audio Coding.

1-1. Repair Precaution

― Use a thicken twisted wire when you measure level.

1-2. ESD(Electrostatically Sensitive Devices) Precaution

― Use earthed soldering steel when you connect or disconnect ESD.

4-1. Cellular phone Exploded View

SAMSUNG Proprietary-Contents may change without notice

4-2. Cellular phone Parts list

QAR01 AUDIO-RECEIVER 3009-001521

QJK01 MODULE-EARJACK/FPCB ASSY GH59-10334A

QCA01 CAMERA MODULE-3M CAMERA MODULE GH59-10594A

QME01 ASSY MODULE-KEY PBA/MIC/BRACKET GH96-05038A

QVO01 PMO KEY-VOLUME GH72-61830A

QSD01 PMO COVER-SD GH72-61833A

SAMSUNG Proprietary-Contents may change without notice

SEC CODE Design LOC Description

SAMSUNG Proprietary-Contents may change without notice

SEC CODE Design LOC Description

SAMSUNG Proprietary-Contents may change without notice

SEC CODE Design LOC Description

SAMSUNG Proprietary-Contents may change without notice

SEC CODE Design LOC Description

SAMSUNG Proprietary-Contents may change without notice

SEC CODE Design LOC Description

SAMSUNG Proprietary-Contents may change without notice

7-1. Disassembly and Assembly Instructions

1) When you disassemble screw, be careful crack of

1) When using disassemble tool, be careful crack of rear

SAMSUNG Proprietary-Contents may change without notice

7 1) Lift PCB from right side of PBA 8 1) Disconnect LCD connector.

1) Be careful not to damage components around

SAMSUNG Proprietary-Contents may change without notice

SAMSUNG Proprietary-Contents may change without notice

1) When using tweezers, be careful not to damage

1) Be careful not to inflow dust into LCD and TSP

SAMSUNG Proprietary-Contents may change without notice