L506 Mini PCIe User Guide - V1 - 1 - 39

L506MiNi PCIe Hardware User Manual
L506MiNi PCIe Hardware User

Manual
Version ：V1.4
Date ：2020-02-29
Shanghai Shike Communication Technology Co., Ltd

Copyright Shanghai Mobile Communications Technology Co., Ltd 1
Introduction
Some functions of this product and its accessories depend on the installed
software, the capabilities and settings of the local network, and some functions may
not be activated or restricted due to the relationship between the local network
operator or the network service provider. Therefore, the description of this article
may not exactly match the product you purchased or its accessories. The Company shall
not be liable for property loss or life injury caused by improper operation of the
user. Before declaration, the Company shall have the right to modify or change the
contents of this manual according to the needs of technical development.
Copyright notice
The copyright of this manual belongs to Shanghai Shike Communication Technology

Co., Ltd., anyone who copies, quotes or modifies this manual without our written
permission will bear legal liability.
Version history
Date Versio Revised version Author

n
Number
2016-07-07 V1.0 Initial Edition
2017-07-03 V1.1.0 Change PIN foot description
2017-05-22 V1.1.1 Update picture
2019-03-14 V1.1.2 LED_WWAN_N Update Notes and

Mapping
2019-04-09 V1.2 Update Temperature Information
2019-09-15 V1.3 Add the support band information
Copyright Shanghai Mobile 2

Communications Technology Co., Ltd
2020-02-29 V1.4 Updated edge and gprs specifications

Directory
1 About this document............................................................................................... 1
1.1 Scope of application................................................................................................................. 1
1.2 Purpose of writing..................................................................................................................... 1
1.3 List of supporting and reference documents.................................................................... 1
1.4 Abbreviations.............................................................................................................................. 2
2 Product Profile............................................................................................................ 3
2.1 Mechanical properties.............................................................................................................. 3
2.2 Product technical parameters................................................................................................ 5
2.3 Product Function Description................................................................................................ 8
2.3.1 Introduction to Baseband Function...................................................................................... 8
2.3.2 Introduction to Radio Frequency Function........................................................................ 8
3 Interface description.............................................................................................. 11
3.1 Pin definition.............................................................................................................................11
3.1.1 Definition of parameters I/O pin......................................................................................... 11
3.1.2 Pin configuration diagram.................................................................................................... 11
3.1.3 Pin description..........................................................................................................................12
3.2 Working conditions.................................................................................................................17
3.3 Interface level characteristics............................................................................................... 18
3.4 Power interface........................................................................................................................ 18
3.4.1 Power Pin Description............................................................................................................ 18
3.5 (U) SIM card interface.............................................................................................................18
3.5.1 Pin description..........................................................................................................................18
3.5.2 Electrical characteristics......................................................................................................... 19
3.5.3 (U) SIM card interface applications.................................................................................... 19
3.6 USB2.0 interface....................................................................................................................... 20
3.6.1 Pin description..........................................................................................................................20

3.6.3 USB Interface Applications................................................................................................... 20
3.7 UART interface..........................................................................................................................21
3.7.1 Pin description..........................................................................................................................21
3.8 PON_RST_N reset signal........................................................................................................ 22
3.8.1 Pin description..........................................................................................................................22
3.8.2 Interface application............................................................................................................... 22
3.9 LED_WWAN_N signals............................................................................................................ 23
3.9.1 Pin description..........................................................................................................................23
3.9.2 Interface application............................................................................................................ 23
3.10 W_DISABLE_N signals............................................................................................................. 24
4 Electrical characteristics of products................................................................25
4.1 Power supply characteristics................................................................................................ 25
4.1.1 Power supply............................................................................................................................ 25
4.1.2 Working current....................................................................................................................... 25
5 Design guidance.......................................................................................................26
5.1 General design rules and requirements............................................................................ 26
5.2 Radio frequency circuit design............................................................................................ 26
5.2.1 Radio Frequency Antenna Circuit Design......................................................................... 26
5.2.2 Precautions in antenna design............................................................................................ 27
5.2.3 Interface application............................................................................................................... 29
5.3 Mini PCI Express connector.................................................................................................. 32
5.4 EMC and ESD design recommendations.......................................................................... 32

Chart
Figure 2-1........................................................................................................Product Physical Map 3

Figure 2-2................................................................................................................Module size type 4
Figure 2-3....................................................Structure Chart of System Connection Framework 8
Figure 3-1....................................................................Schematic diagram of pin configuration
12
Figure 3-2....................................................................(U) SIM card signal connection circuit
19
Figure 3-3....................................................................................................USB connection diagram
21
Figure 3-4..................................................Module Serial Port and AP Application Processor
22
Figure 3-5..............................................................................................Reset Recommended Circuit
23
Figure 3-6....................................................................Reference circuit for status indicator
24
Figure 5-1............................................ RF Interface Test Block (HRS Company U.FL-R-SMT-1)
26
Figure 5-2..............................................................................................................Testing of cables
27
Figure 5-3..............................................................................................Pin configuration diagram
29
Figure 5-4......................Schematic diagram of main antenna matching circuit (MAIN_ANT)
29
Figure 5-5............................LTE diversity antenna matching circuit schematic (AUX_ANT)
30
Figure 5-6..............................GNSS active antenna matching circuit schematic (GNSS_ANT)
31
Figure 5-7......Schematic diagram of GNSS passive antenna matching circuit (GNSS_ANT)
31
Figure 5-8................................................................................................. Mini PCIe connection seat
32

Table
Table 1-1 Supporting Document List............................................................................................ 1

Table 1-2................................................................................................................. List of acronyms 2
Table 2-1............................................................................................... Main technical parameters 5
Table 3-1............................................................................................... I/O parameter definitions
11
Table 3-2........................................................................ Mini PCIe Interface Definition Description
12
Table 3-3...........................................Definition description Mini PCIe interface with audio board
15
Table 3-4............................................................................................... Module working conditions
17
Table 3-5................................................................................... Digital Signal High Level Range
18
Table 3-6................................... (U) Definition and description of SIM card signal group
18
Table 3-7..........................................................................................................UART signal definition
21
Table 3-8........................................................................................... Indicator Status Definition
24
Table 3-9 Indicator Status Definition....................................................................................24
Table 4-1....................................................................................................................... Input voltage
25
Table 4-2................................................................................................................... Working current
25

1 About this document

1.1 Scope of application
This document is designed for users who develop wireless Internet function products
and is suitable for hardware development guidance of 4 G Mini PCIe Module L506
products. Users are required to design according to this document, which is only suitable
for hardware application development of L506Mini PCIe products.
1.2 Purpose of writing

This document provides design and development basis for module product users. By
reading this document, the user can have an overall understanding of the product, a clear
understanding of the technical parameters of the product, and on the basis of this
document, the application development of wireless 4 G Internet function products or
devices can be successfully completed.
This hardware development document not only provides product function

characteristics and technical parameters, but also provides product reliability test and
related test standards, business function implementation process, RF performance
indicators and user circuit design guidance. Are providing users with a more
comprehensive design reference.
1.3 List of supporting and reference documents

In addition to this hardware development document, we also provide a product-
based development board operating instructions manual and software development
guidance manual, Table 1-1 is supported as a list.
Table 1-1 Supporting Document List
Serial Document name

number

1 L506 module software user manual. pdf
L506 module hardware user guidance manual. pdf

1.4 Abbreviations
Table 1-2 is the relevant abbreviations and Chinese and English
explanations involved in the whole document.
Table 1-2 List of acronyms

Abbreviations English full name Chinese interpretation
AP Another name of DTE Another name of DTE
BER Bit Error Rate BER rate
DL Downlink Downlink
DPCH Dedicated Physical Channel Private physical channels
ESD Electro-Static discharge Electrostatic discharge
GPRS General Packet Radio Service Universal Packet Radio

Frequency System
GSM Global Standard for Mobile Communications Global standard mobile
communications system
I/O Input/output Input/output
LED Light Emitting Diode Light emitting diode
PWL Power Level Level
SIM Subscriber Identification Module User identification module
SMT Surface Mount Technology Surface patch technology
SPI Serial Peripheral Interface Serial Peripheral Interface
UMTS Universal Mobile Telecommunication System Universal Mobile

Communications System
WCDMA Wideband Code Division Multi Access Broadband Code Division
Multiple Access
RTC Real Time Clock Real-time clock
LTE Long Term Evolution Long-term evolving

technologies
NC Not connect Not connected
EDGE Enhanced data rates for GSM evolution Enhanced data rate GSM
Evolutionary techniques
O
p
er
at
io


2 Product Profile
This product is a Mini PCIe interface 4 G wireless Internet module, with fast Internet access,
small volume, light weight, reliable
The advantages of high sex can be widely used in various products and devices with wireless
Internet access function.
Figure 2-1 Product Physical Map
2.1 Mechanical properties

The package size of this product module is 51/31 mm, and the thickness is 5.18 mm. Figure

2-2 is the product shape size type diagram.

Figure 2-2 Module size type

2.2 Product technical parameters

The main characteristics of this product can be seen from mechanical characteristics,
baseband, RF, technical standards and environmental characteristics, etc. Table 2-1 is the
main technical parameters and characteristics supported by this product.
Table 2-1 Main technical parameters
Title Parameter items Specification

Dimensions (L*W*H) 51 mm *31mm *5.43mm
Mechanical Weight About

properties
Package type 52Pin Mini PCIe interface
Processor architecture MDM 9X07(Qualcomm)
(U) SIM/SIM Support 3V SIM card and 1.8V SIM card
USB interface USB 2.0HIGH SPEED
Baseband Maximum power 1.9 W

consumption 1
Voltage 3.0 V-3.6V, Typical 3.3 V
Peak current A ≤2
Average operating current mA ≤600
Working current 2
Normal average current (no service) mA ≤30
Standby current ≤6 mA
TDD-LTE
B38/B39/B40/B41FDD-LTE
B1/B3/B7/B8/B20TD-SCDMA
Support band B34/B39UMTS/HSDPA/HSPA+B1/
Radio B8GSM/GPRS/EDGE
900/1800MHz
GPS/BEIDOU/GLONASS
AGPS support
TDD-LTE B38/B39/B40/B41
Frequency of diversity
FDD-LTE B1/B3/B7/B8/B20
reception
LTE CAT4
Up lin k u p t o
50Mb ps,Downlink up
to 150Mbps T D -HSD
Technical Data rate PA/HS UPA
standards .2Up link up t o 2Mbp
s,Downlink up to
4.2Mbps TD -SCD MA
Up lin k u p t o 128Kb ps,
Downlink up to

384Kbps HSPA+

Title Parameter items Specification

.76Up lin k u p t
o 5Mb p s,Downlink
up to 42Mbps UMTS
Up link/D o wn li n k u p to
384Kbps EDGE Cla ss 33：
Max.296Kbps (DL), Max.236.8Kbps

(UL) GPRS Cla ss 33:
Max.107Kb p s (DL), Max.85.6K b ps (UL)
Windows XP (SP2 and water)
Windows Vista
Operating system Windows 7
Linux
Android
Working temperature -40 to 85°C
Environmenta Storage temperature 45 to 90°C

l Humidity 5%~ 95%
characteristic
s
RAS dial Support
Short message Support
Locker Support
Applications
SIM READER Support
AT Commands Compatible with 3 GPP TS 27.007,27.005 and AT instruction set.
Upgrade Support
Table 2-2 Frequency band parameters for each model

L506 series, frequency bands
supported by each model
Band support L506C L506E L506CF
L506LD L506ELD L506CFLD
L506XC L506XE L506X (G) CF
GSM GSM900 ● ● ●
GSM1800 ● ● ●
CDMA2000 BC0 ●
/EVDO
WCDMA UMTS900 ● ● ●
UMTS2100 ● ● ●

TD-SCDMA TD-SCDMA ● ● ●
B34
TD-SCDMA ● ● ●
B39
LTE-TDD TDD_LTE B38 ● ● ●
TDD_LTE B39 ● ● ●
LTE-FDD FDD_LTE B1 ● ● ●
FDD_LTE B3 ● ● ●
FDD_LTE B5 ● ●
FDD_LTE B7 ●
FDD_LTE B8 ● ● ●
FDD_LTE B20 ●
GNSS(1) GPS L1BAND ● ● ●
GLONASS ● ● ●
BEIDOU ● ● ●
(1)
LD series and X series products do not support GNSS (X (G) series can support GNSS).
note:
1： maximum power consumption of the module is the average measured at the maximum
transmit power.
The peak current in the 2： working current, the normal working average current, the
normal working (no service) current value are all tested in the module maximum power
consumption mode to obtain the maximum value, the standby current refers to the SLEEP
mode current;
3： application conditions beyond the limit may permanently damage the module.

2.3 Product Function Description
2.3.1 Introduction to Baseband Function
The baseband part of this product mainly includes the following signal groups: USB
interface signal, USIM card interface signal, UART interface signal, network status indicator
signal, reset signal and WAKE_N control signal, W_DISABLE_N signal, power supply and
ground, etc. Figure 2-3 is the system connection frame structure diagram.
Figure 2-3 Structure Chart of System Connection Framework
2.3.2 Introduction to Radio Frequency Function

The RF features of the product are as follows:
 Four-Band TDD-LTE B38/B39/B40/B41
 Five-Band FDD-LTE B1/B3/B7/B8/B20
 Dual-Band TD-SCDMA B34/B39
 Dual-Band UMTS/HSDPA/HSPA+B1/B8
 GSM/GPRS/EDGE 900/1800MHz
 GPS/BEIDOU/GLONASS

The working frequency range of the transceiver of this product is

shown in Table 2-2.
Table 2-2 Operating Frequency
Working uplink band (Uplink) Downband (Downl i nk)

frequency
UMTS900 890MHz —915MHz 925MHz —960MHz
UMTS1900 1850MHz —1910MHz 1930MHz —1990MHz
GSM900 890MHz —915MHz 925MHz —960MHz
GSM1800 1710MHz —1785MHz 1805MHz —1880MHz
T D -S C 2010~2025 MHz 2010~2025 MHz

DM A B34
T D -SC D 1880~1920 MHz 1880~1920 MHz
MA B39
TDD_LTE B38 MHz 2570MHz~2620 MHz 2570MHz~2620
TDD_LTE B39 MHz 1880MHz~1920 MHz 1880MHz~1920
TDD_LTE B40 2300MHz~2400 MHz 2300MHz~2400 MHz
TDD_LTE B41 2555~2655 MHz 2555~2655 MHz
FDD_LTE B1 MHz 1920MHz~1980 MHz 2110MHz~2170
FDD_LTE B7 MHz 2500MHz~2570 2620MHz~ MHz 2690
FDD_LTE B8 MHz 880MHz~915 925MHz~960 MHz
GPS L1BAND 1574.4~ MHz 1576.44
GLONASS MHz 1598~1606
BEIDOU B1 MHz 1559.05~1563.14
Table 2-3 Conducted Power
Frequency Maximum power Minimum power
UMTS900 24 dBm +1/-3 dB <-50 dB m
UMTS1900 24 dBm +1/-3 dB <-50 dB m
GSM900 33 dB m ±2 dB 5 dBm ±5 dB 5
DCS1800 30 dB m ±2 dB 0 dBm ±5 dB
GSM900(8-PSK) 27 dB m ±3 dB 5 dBm ±5 dB 5
DC S1800(8-PSK) 26 dBm +3/-4 dB 0 dBm ±5 dB

T D -SC D MA 24 dBm +1/-3 dB <-50 dB m

B34
T D -SC D MA 24 dBm +1/-3 dB <-50 dB m
B39
TDD_LTE B38 d B 23 dB m +/-2.7 <-40 dB m
TDD_LTE B39 dB 23 dB m +/-2.7 <-40 dB m
FDD_LTE B1 d B 23 dB m +/-2.7 <-40 dB m
Table 2-4 Conduction Receiving Sensitivity
Frequency Acceptance sensitivity (Typical) Acceptance sensitivity (MAX)
WCDMA B1 d Bm <-109 3GPP

WCDMA B8 d Bm <-109 3GPP
GSM900 d Bm <-109 3GPP
DCS1800 d Bm <-108 3GPP
T D -SC D d Bm <-110 3GPP
MA B34
T D -SC D d Bm <-110 3GPP
MA B39
Table 2-5 Reference Sensitivity (QPSK)
Band bandwidth
E -U TRA 1.4 MHz 3MHz 5MHz 10MHz 15MHz 20MHz Duplex mode
frequency
1 -- -- -100 -97.2 -96.2 -95 FDD
3 -102.2 -99.7 -98 -95 -94.2 -93 FDD
7 -- -- -98 -95 -93.2 -92 FDD
8 -103.2 -101.7 -100.2 -97.2 -- -- FDD
20 -- -- -97 -94 -91.2 -90 FDD
38 -- -- -100 -97 -95.2 -94 TDD
39 -- -- -100 -97 -95.2 -94 TDD
40 -- -- -100 -97 -95.2 -94 TDD
41 -- -- -100 -97 -95.2 -94 TDD

3 Interface description
3.1 Pin definition
3.1.1 Definition of parameters I/O pin
I/O parameter definitions for this product are shown in Table 3-1.
Table 3-1 I/O parameter definitions
Pin attribute Des

identifier crip
tion
DI Digital signal input pin
DO Digital signal output pin
AI Analog signal input pin
AO analog signal output pin
B Bidirectional digital port, CMOS

input
Z High resistance output
P1 Pin 1, supply voltage is VDD_P1
P2 Pin 2, supply voltage is VDD_P2
PU Pull inside the pin
PD Inside the pin
3.1.2 Pin configuration diagram
This product interface pin sequence definition is shown in figure 3-1 below.

Figure 3-1 Schematic diagram of pin configuration
3.1.3 Pin description
L506Mini PCIe interface definition is divided into audio version and no audio
version, see the following two table standard version Mini PCIe interface definition
description and interface definition description with audio board.
Table 3-2 Mini PCIe Interface Definition Description
Pipe L506mini PCIe pin Standard mini

Pin I/O Pin attribute Remarks
foot Definition PCIe management
voltage
No. Foot definitions
No
Low efficiency
1 WAKE_N P1 DO Wake-up signal WAKE# (multiplexing
as RF antenna
switch control
GPIO)
2 V_MAIN -- -- Power supply 3.3 Vaux 3.0-3.6 V

3 NC -- -- -- COEX1
4 GND -- -- Land GND


voltage
No
5 RESERVED -- -- Reservation COEX2
6 NC -- -- -- 1.5 V
7 RESERVED -- -- Reservation CLKREQ#
8 VREG_UIM P1/P2 -- USIM card power UIM_PWR

signal
10 UIM_DATA P1/P2 B USIM card data signal UIM_DATA
11 UART1_RX P1 DI UART1 data reception REFCLK-
12 UIM_CLK P1/P2 DO USIM clock signal UIM_CLK
13 UART1_TX P1 DO UART1 send data REFCLK+ --
14 UIM_RST P1/P2 DO USIM card reset signal UIM_RESET
15 GND -- -- Land GND --
Go up to 1.8 V
16 FORCE_USB_BOOT P1 DI Forced USB Download UIM_VPP
enter
mandatory
download
mode
17 UART1_RI P1 DO UART1 ringing signals RESERVED --
USIM card hot plug Low

19 UIM_PRESENT P1 DI RESERVED
detection signal effectiveness.
The interior
has been
pulled up.
Low
20 W_DISABLE_N P1 DI Flight mode enabling W_DISABLE#
effectiveness.
The interior
has been
pulled up.
Low efficiency,
22 PON_RESET_N -- DI Module Reset Signal PERST#
internal pull
up
23 UART1_CTS P1 DI UART1 allows sending PERn0
data
24 V_MAIN -- -- Main Power Supply 3.3 Vaux 3.0-3.6 V.

25 UART1_RTS P1 DO UART1 receive ready PERp0
28 NC -- -- -- 1.5 V --
30 I2C_SCL -- -- I2C clock signal SMB_CLK Internal pull-up
31 UART1_DTR P1 DI UART1 terminal ready PETn0 --


voltage
No
32 I2C_SDA -- -- I2C data signal SMB_DATA Internal pull-up
33 UART1_DCD P1 DO UART1 Carrier PETp0 --

Detection
AI/ A differential
36 USB_DM -- USB differential data (- USB_D-
AO 90Ω
)
impedance line
is required.
AI/ A differential
38 USB_DP -- USB differential data USB_D+
AO 90Ω
(+)
impedance line
is required.
39 VMAIN -- -- Main Power Supply 3.3 Vaux 3.0-3.6 V.
42 LED_WWAN_N AI Work status indicator LED_WWAN#
44 NC -- -- -- LED_WLAN# --
PCM Audio
45 PCM_CLK P1 DO PCM clock RESERVED
Decoder
46 NC -- -- -- LED_WPAN# --
PCM Audio
47 PCM_IN P1 DI PCM data input RESERVED
Decoder
48 NC -- -- -- 1.5 V --
PCM Audio
49 PCM_OUT P1 DO PCM data output RESERVED
Decoder
PCM Audio
51 PCM_SYNC P1 DO PCM frame RESERVED
Decoder
synchronization signal
52 VMAIN -- -- Main Power Supply 3.3 Vaux --

Table 3-3 Definition description Mini PCIe interface with audio board
Pipe Standard mini

L506 pin definition Pin I/O Pin attribute Remarks
foot PCIe management
voltage
No
Low efficiency
1 WAKE_N P1 DO Wake-up signal WAKE# (multiplexing
as RF antenna
switch control
GPIO)
2 V_MAIN -- -- Power supply 3.3 Vaux 3.0-3.6 V
3 NC -- -- -- COEX1
5 SPK_OUT_P -- AO Differential horn COEX2 Analog

output signal positive differential
wiring
6 NC -- -- -- 1.5 V
7 SPK_OUT_N -- AO Negative pole of CLKREQ# Analog

differential horn differential
output signal wiring
8 VREG_UIM P1/P2 -- USIM card power UIM_PWR
signal
10 UIM_DATA P1/P2 B USIM card data signal UIM_DATA
11 UART1_RX P1 DI UART1 data reception REFCLK-
12 UIM_CLK P1/P2 DO USIM clock signal UIM_CLK
13 UART1_TX P1 DO UART1 send data REFCLK+ --
14 UIM_RST P1/P2 DO USIM card reset signal UIM_RESET
Go up to 1.8 V
16 FORCE_USB_BOOT P1 DI Forced USB Download UIM_VPP
enter
mandatory
download

mode
17 UART1_RI P1 DO UART1 ringing signals RESERVED --
USIM card hot plug Low

19 UIM_PRESENT P1 DI RESERVED
detection signal effectiveness.
The interior
has been
pulled up.
20 W_DISABLE_N P1 DI Flight mode enabling W_DISABLE# Low
effectiveness.
Internal

Pipe Standard mini

voltage
No
Pull up.
Low efficiency,
22 PON_RESET_N -- DI Module Reset Signal PERST#
internal pull
up
23 UART1_CTS P1 DI UART1 allows sending PERn0
data
24 V_MAIN -- -- Main Power Supply 3.3 Vaux 3.0-3.6 V.
25 UART1_RTS P1 DO UART1 receive ready PERp0
28 NC -- -- -- 1.5 V --
30 MIC_P -- AI MIC input positive SMB_CLK Differential

wiring
31 UART1_DTR P1 DI UART1 terminal ready PETn0 --
32 MIC_N -- AI MIC Input Negative SMB_DATA Differential

wiring
33 UART1_DCD P1 DO UART1 Carrier PETp0 --
Detection
AI/ A differential
36 USB_DM -- USB differential data (- USB_D-
AO 90Ω
)
impedance line
is required.
AI/ A differential
38 USB_DP -- USB differential data USB_D+
AO 90Ω
(+)
impedance line
is required.
42 LED_WWAN_N AI Work status indicator LED_WWAN#

44 NC -- -- -- LED_WLAN# --
45 RESERVED -- -- Reservation RESERVED --
46 NC -- -- -- LED_WPAN# --

Pipe Standard mini

voltage
No
48 NC -- -- -- 1.5 V --
52 VMAIN -- -- Main Power Supply 3.3 Vaux --
note:
"NC" identification indicates Not Connected, there is no connection within the

module ;" RESERVED "identification indicates that there is a connection within the
module but can not be used for the time being.P1、P2 is the power supply signal level
group 1,2. No functional pins can be suspended.
3.2 Workin
g Table 3-4 Module working conditions
conditi
ons
Signal Description Mini Typical Maxim Unit
mu um
m
V_MAIN Module Main Power Supply 3.0 3.3 3.6 V
VDD_P1 Pin P1 supply voltage 1.7 1.8 1.9 V
VDD_P2 Pin P2 supply voltage 2.71 2.85 2.99 V
note:
1. A typical voltage value represents the default voltage value of the input and output
P1、P2 the pin in this product, and requires the external input pin to provide the
interface voltage for this value;

2. External circuit interface voltage design must match product pin voltage.

3.3 Interface
level Table 3-5 Digital Signal High Level Range
characteris
tics
Symbol Description Minimum Maximum Unit
VIH Input voltage high level 0.65* VDD_PX* VDD_PX+0.3 V
VIL Input voltage low level -0.3 0.35* VDD_PX* V
VOH Output voltage high level VDD_PX-0.45 VDD_PX V
VOL Output voltage low level 0 0.45 V
3.4 Power interface
3.4.1 Power Pin Description
Pin number :2/24/39/41/52 is a V_MAIN signal (i.e .3.3 Vaux), which is a 3.3 V
positive signal of the power supply. Foot
number :4/9/15/18/21/26/27/29/34/35/37/40/43/50 is a GND signal.
This is the power source and signal ground of this product and needs to be
connected to the ground plane of the system board. Incomplete connection of GND
signal will affect the performance of this product. During the design of main power
supply, it is necessary to ensure that the power supply capacity is more than 2.5 A,
otherwise the system will work abnormally.
3.5 (U) SIM card interface
L506Mini PCIe module integrates the (U) SIM card interface that meets the ISO 7816-2
standards and supports and can automatically detect 3.0 V

The (U) SIM card and (U) SIM card interface signals V 1.8 are shown in Table 3-5.
Table 3-6 (U) Definition and description of SIM card signal

group
Pin Protocol Signal definition Signal description

Signal Name
8 VREG_UIM SIM card power USIM card power, output by
module

10 UIM_DATA SIM Card Data Pin USIM card DATA signal,

bidirectional signal
12 UIM_CLK SIM clock gauge USIM clock signal, output by
module
14 UIM_RST SIM card reset pin USIM card reset signal, output
by module
3.5.2 Electrical characteristics
(U) SIM card signals are defined in detail in Table 3-5. On the line near (U) SIM card
seat, pay attention to the need to add ESD protection devices.
To meet GPP TS 51.010-1 3 protocols and EMC certification requirements,

Recommendation (U) SIM card holder is located close to the module SIM card interface,
Avoid running too long, Causes the waveform to deform badly, affect signal integrity.
UIM_CLK and UIM_DATA signal wiring is recommended for protection. Parallel one uF and
33 pF between the VREG_UIM and the GND, UIM_CLK, UIM_RST, The capacitance of 33 pF
parallel between UIM_DATA and GND, Filter the interference of RF signal.
3.5.3 (U) SIM card interface applications
Figure 3-2 (U) SIM card signal connection circuit
Note: the pull-up resistance on the UIM_DATA signal line has been designed in the module

without additional pull-up resistance.

3.6 U SB2.0 interface
This product has high speed USB2.0 interface, supports full-speed and high-speed
mode, the main processor (AP) and module mainly through the USB interface for data
transmission.
The USB interface of the module conforms to the USB2.0 specification and electrical
characteristics. Support low-speed ,full-speed and high-speed
Three working modes. The data interaction between the main processor (AP) and the module is
mainly completed through the USB interface.
note:
USB differential data lines must control impedance matching at 90 ohms.
3.6.3 US B Interface Applications
USB bus is mainly used for data transmission, software upgrade, module program
detection. The USB circuit working in high-speed mode must meet the junction
capacitance value of ESD protection device <2 if it needs to be designed. Otherwise, the
larger junction capacitance will cause waveform distortion and affect bus communication.

Figure 3-3 USB connection diagram
3.7 U ART interface
A serial communication interface UART, is provided Comply with RS-232 interface

protocol, Support 8-wire serial bus interface, The module can communicate serially with
the outside world and AT instruction input through the UART interface. UART port
supports programmable data width, Programmable data stop bit, Programmable parity
bit, with independent TX and RX FIFOs (128 bytes each), Default baud rate is bps,115200
Pin signal definitions are shown in Table 3-7.
Table 3-7 UART signal definition
Pin Signal name I/O type Functional description

11 UART1_RX DI UART1 receive data
13 UART1_TX DO UART1 send data
17 UART1_RI DO UART1 ringing instructions
23 UART1_CTS DI DTE allows modules to send data
25 UART1_RTS DO module receive ready DTE can send
31 UART1_DTR DO DCE ready
33 UART1_DCD DO UART1 Carrier Detection
In order to have a means of grasping log in the process of software alignment, we

suggest that users keep this interface and reserve test points when designing.If the
module is used in conjunction with the application processor and the level matches at 1.8
V, the connection mode is shown in figure 3-4, which can be connected in 4-wire or 2-wire
mode. The module interface level is 1.8 V, If it does not match the AP interface level, it is
recommended to increase the level conversion circuit.

Figure 3-4 Module Serial Port and AP Application Processor
3.8 P ON_RST_N reset signal
PON_RST_N pin is used to reset the module. After pulling the PON_RST_N pin down
200 ms, the pin is suspended or set high, and the pin can be reset.
3.8.2 Interface application
PON_RST_N circuit can refer to the design circuit shown in figure 3-5.

Figure 3-5 Reset Recommended Circuit
3.9 L ED_WWAN_N signals
The module LED_WWAN_N signal is used to control the LED display lamp and can be
used as an indication of the network connection state. The state lamp indicates different
modes of flicker, indicating different network states. The pin is a current sink pin, the
maximum driving current can reach 100 mA, external connection VBAT can be directly
driven, and the current limiting resistance R100, resistance value are calculated according
to the LED working voltage and rated working current. Figure 3-6 is a reference circuit
design. The host can design and control the state of the indicator lamp by instruction.
Figure 3-6 is a reference circuit design, and the status definition of the indicator is shown in
Table 3-8.
VBAT
R100
L506MINI PCIe ISINK

Figure 3-6 Reference circuit for status indicator
Table 3-8 Indicator Status Definition
Module working state Signal status Remarks
Boot status Elimination --
Netting status 3Hz frequency Searching the network

flicker
IDLE status 1Hz frequency Registered to Network

flicker
Traffic status (calls, Internet 5Hz frequency Call / GPRS data transfer
access, etc) flicker
3.10 W _DISABLE_N signals

W_DISABLE_N signal is RF enable switch for entering flight mode and normal mode. as shown in
Table 3-9.
Table 3-9 Indicator Status Definition
Module work mode W_DISABLE_N signals Remarks
Normal mode High level Module normal operation
Flight pattern Low level Turn off RF function

4 Electrical characteristics of
products
4.1 Power supply characteristics
4.1.1 Power supply
The input voltage range of this product is DC 3.0V~3.6 V, typical value is 3.3 V, as shown in
Table 4-1.
Table 4-1 Input voltage
Parameters Minimu Typical Maximu

m value values m value
Input voltage 3.0 V 3.3 V 3.6 V
4.1.2 Working current
As shown in Table 4-2, the IDLE mode represents the power consumption of the module
when there is no service, and gives the power consumption in
Working current range when there is data service under GSM and WCDMA.
Table 4-2 Working current
Standard State Average value Remarks

GSM No operating mode IDLE mode
current
Data transmission GPRS/EDGE mode
current
WCDMA No operating mode IDLE mode
current
Data transmission HSPA mode
current
note:

1. the above mean current is tested under the maximum transmit power condition, there
may be errors in the values tested in different environments, please refer to the
actual situation.

5 Design guidance
This chapter provides general design guidance for this product, and users can refer to the
design guidance to make the product better
Yes.
5.1 General design rules and requirements

When designing the peripheral circuit of this product, the user should first ensure that
the external power supply circuit can provide sufficient power supply capacity, and control
90 ohm differential impedance for USB high speed signal line. For the general signal
interface, the user is required to design strictly according to our requirements, in
accordance with the interface signal level matching, to prevent inconsistent level damage
module. The RF index of this product is good, the customer needs to design the main
board side antenna circuit and make the corresponding impedance control according to
the requirement, otherwise it will affect the RF index of the whole machine.
5.2 Radio frequency circuit design
5.2.1 Radio Frequency Antenna Circuit Design
The RF antenna access part of this product adopts RF connector mode. Currently selected
RF connector test seat is HRS company
U.FL-R-SMT-1, is shown in Figure 5-1.
Figure 5-1 RF Interface Test Block (HRS Company U.FL-R-SMT-1)
The RF connector of the antenna can be directly stuck on the RF test seat of the

module, which can save the connection between the RF port of the module and the
antenna interface.

Figure 5-2 Testing of cables
5.2.2 Precautions in antenna design
1. Pre-project evaluation
The selection of antenna position should first ensure that the antenna and base
station are kept in the horizontal direction, so the efficiency is the highest. Secondly, try
to avoid placing near the switching power supply or data line, chip and other devices or
chips that may produce electromagnetic interference. At the same time, the position of
the hand on the antenna should be avoided, so as to prevent the human body from
attenuating the antenna, and the reduction of radiation and the realizability of the
structure should be taken into account. As a result, in the early stage of the design, the
structure, ID 、 circuit, antenna engineers are required to carry out layout evaluation
together.
2.Location of antenna placement
Antenna placement for notebook products: the ideal placement is located in the
upper left or right of the LCD, this position is far from the main board, the
electromagnetic interference is small, the second is to take into account the distance
from the human body, SAR indicators are easy to meet; Second, the better position is the
left or right side of the LCD. Other products such as routers, e-books and so on
according to the characteristics of the product specific evaluation.
3.Proposal for antenna occupancy
Since different antenna manufacturers may adopt different antenna forms, the

antenna reservation space is also different :3 G 5 frequency main antenna :5

mm( thick)12 mm( wide)80 mm( long).
4.Antenna RF Connector

The radio frequency connection line of the antenna is as short as possible.

Considering the transmission loss, it is suggested to adopt a thicker radio frequency line.
The RF line should also keep away from FSB, chips and memory, power interface, data line
interface and other modules and devices that may produce EMI. Connect antenna and 3 G
module RF connection line can not go right corner, can not be squeezed, wear; RF line is
best close to the main board of the ground.
5.Selection of Radio Frequency Line and Radio Frequency Connector for Antenna
The RF cable of the antenna usually uses Taiwan's GBE (TW) and Mainland Shenyu. It
can also be considered that the RF cable of the Japanese Somitomo、Shin Din,3G antenna
generally adopts 1.37 mm diameter. The RF connector of antenna generally adopts
Japanese IPX, also uses HRS, but the price is slightly higher.
It is suggested that the insertion loss between the antenna feed point and the antenna
should meet the following requirements:
● GSM900< dB 0.5
● DCS1800<0.9 dB
● WCDMA 2100<0.9 dB
● WCDMA 900< dB 0.5
● TDSCDMA 1900/2000<0.9 dB
● LTE (F <1 GHz)0.5
● LTE (1 GHz<F<2 GHz)<0.9
● LTE (2GHz <F)<1.2 dB

Figure 5-3 Pin configuration diagram
Signal name I/O type Functional description
MAIN_ANT AI/AO Main set antenna feed point
AUX_ANT AI LTE diversity antenna feed point
GNSS_ANT AI GNSS antenna feed point
Table 1 5-1 antenna feeder foot definition

To facilitate antenna tuning and certification testing, RF connectors and antenna matching
circuits should be added. The following figure shows the recommended circuits:
Figure 5-4 Schematic diagram of main antenna matching circuit (MAIN_ANT)
The component R1、C1、C2 and R2 are used for antenna matching, and the value of
the component depends on the antenna debugging. by default, a resistor of R1,R2 0 ohm is
C1、C2 retained for debugging. RF connectors in this figure are used for rf performance
testing and should be placed near the antenna pins of the module. The line impedance
between components must be controlled at 50 ohms.

Figure 5-5 LTE diversity antenna matching circuit schematic (AUX_ANT)
R3 and R4,C3、C4 are used for diversity antenna matching in the figure above. R3,R4 are
0Ω resistors, and C3、 by default
C4 is to retain
debugging.
Note:
LTE diversity antenna is recommended for retention due to a number of high frequency
TDD-LTE designs, such as band38,band40 and Band41. Because of the high insertion loss
of RF lines, if there is no diversity antenna, the receiving sensitivity of these bands will be at
risk in authentication.

Figure 5-6 GNSS active antenna matching circuit schematic (GNSS_ANT)
Figure 5-7 Schematic diagram of GNSS passive antenna matching circuit (GNSS_ANT)
Above, the element C1、L1、L2 is used for antenna matching, and the value of the element
depends on the antenna after debugging.
Figure 5-6, C2 for DC isolation. the user is required to provide a VDD voltage with an
external LDO /DCDC in an active antenna circuit whose value should be based on the
characteristics of the active antenna VDD can be turned off to avoid consuming
additional current without using the GNSS.
Figure 5-7, the user can add an external LNA to get better gain.
L506 ensemble GNSS (GPS/GLONASS) satellite and network information provides a
high availability solution that provides industry-leading performance and accuracy. this
solution outperforms conventional GNSS receivers even in very challenging environmental
conditions and provides a platform for wireless operators to target location-based services
and first aid tasks.
Tracking sensitivity -159 dBm (GPS)-158 dBm
(GLONASS) capture sensitivity -148 dBm
Cold start-up sensitivity 142 dBm
C/N0=S -(-170) CN value S=Input Signal Intensity
Accuracy (open space) 2.5 m (CEP50)
First location (open) hot start <1 s
cold start 35 receive type channel,C/A
Code GPS L1 frequency (1575.42±1.023
MHz),
MHz GLONASS：1597.5~1605.8
Default update rate 1Hz

NMEA-0183 GNSS data format

Total power consumption 100 mA (GNSS (WCDMA/GSM sleep mode)

5.3 M ini PCI Express connector

A standard 52 Pin Mini PCI Express connector is used for the connection seat on the user
board. Molex companies recommended
The 67910-0002 series connectors are shown in Figure 5-8.
Figure 5-8 Mini PCIe connection seat
5.4 E MC and ESD design recommendations

The user should take full account of the EMC problems caused by signal integrity and
power integrity in the design of the whole machine. When the module peripheral circuit
layout the line, it can effectively reduce the coupling between the signals and make the
signal have a "clean" reflux path. When designing the peripheral power supply circuit, the
decoupling capacitor should be placed close to the module power supply tube

Foot, high frequency high speed circuit and sensitive circuit should be far away from the
PCB edge, and the layout between them should be isolated as far as possible, reduce the
interference between each other, and protect the sensitive signal. Shield the circuit or
device that may interfere with the module on the board side of the system.
This product is embedded in the system board side, the design needs to pay
attention to ESD protection, key input and output signal interface, such as (U) SIM card
signal interface, need to be placed nearby ESD device protection, in addition to the main
board side, Users are required to reasonably design structural parts and PCB layouts to
ensure adequate grounding of metal shields and a smooth discharge channel for
electrostatic discharge.


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L506MiNi PCIe Hardware User Manual

L506MiNi PCIe Hardware User

Shanghai Shike Communication Technology Co., Ltd

The copyright of this manual belongs to Shanghai Shike Communication Technology

Date Versio Revised version Author

2017-07-03 V1.1.0 Change PIN foot description

2017-05-22 V1.1.1 Update picture

2019-03-14 V1.1.2 LED_WWAN_N Update Notes and

2019-09-15 V1.3 Add the support band information

Copyright Shanghai Mobile 2

2020-02-29 V1.4 Updated edge and gprs specifications

Copyright Shanghai Mobile 3

1 About this document............................................................................................... 1

1.1 Scope of application................................................................................................................. 1

1.2 Purpose of writing..................................................................................................................... 1

1.3 List of supporting and reference documents.................................................................... 1

2.1 Mechanical properties.............................................................................................................. 3

2.2 Product technical parameters................................................................................................ 5

2.3 Product Function Description................................................................................................ 8

2.3.1 Introduction to Baseband Function...................................................................................... 8

2.3.2 Introduction to Radio Frequency Function........................................................................ 8

3.1 Pin definition.............................................................................................................................11

3.1.1 Definition of parameters I/O pin......................................................................................... 11

3.1.2 Pin configuration diagram.................................................................................................... 11

3.1.3 Pin description..........................................................................................................................12

3.2 Working conditions.................................................................................................................17

3.3 Interface level characteristics............................................................................................... 18

3.4 Power interface........................................................................................................................ 18

3.4.1 Power Pin Description............................................................................................................ 18

3.5 (U) SIM card interface.............................................................................................................18

3.5.1 Pin description..........................................................................................................................18

3.5.2 Electrical characteristics......................................................................................................... 19

3.5.3 (U) SIM card interface applications.................................................................................... 19

3.6 USB2.0 interface....................................................................................................................... 20

3.6.1 Pin description..........................................................................................................................20

Copyright Shanghai Mobile 4

3.6.2 Electrical characteristics......................................................................................................... 20

3.6.3 USB Interface Applications................................................................................................... 20

3.7 UART interface..........................................................................................................................21

3.7.1 Pin description..........................................................................................................................21

3.7.2 Electrical characteristics......................................................................................................... 21

3.8 PON_RST_N reset signal........................................................................................................ 22

3.8.1 Pin description..........................................................................................................................22

3.8.2 Interface application............................................................................................................... 22

3.9 LED_WWAN_N signals............................................................................................................ 23

3.9.1 Pin description..........................................................................................................................23

3.9.2 Interface application............................................................................................................ 23

3.10 W_DISABLE_N signals............................................................................................................. 24

4 Electrical characteristics of products................................................................25

4.1 Power supply characteristics................................................................................................ 25

4.1.1 Power supply............................................................................................................................ 25

4.1.2 Working current....................................................................................................................... 25

5.1 General design rules and requirements............................................................................ 26

5.2 Radio frequency circuit design............................................................................................ 26

5.2.1 Radio Frequency Antenna Circuit Design......................................................................... 26

5.2.2 Precautions in antenna design............................................................................................ 27

5.2.3 Interface application............................................................................................................... 29

5.3 Mini PCI Express connector.................................................................................................. 32

5.4 EMC and ESD design recommendations.......................................................................... 32

Copyright Shanghai Mobile 5

Figure 2-1........................................................................................................Product Physical Map 3

Copyright Shanghai Mobile 6

Table 1-1 Supporting Document List............................................................................................ 1