Altium Designer Pick and Place Locations

G:\drE-bku\pcbs12\Examples\AMR17x\amr17x-v6tv7\Project Outputs for amr17x-v6tv7\

Pick Place for AMR17X-VER8-27apr22(amr17x-nolcd).txt

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File Design Information:

Date: 11/05/22
Time: 12:28
Revision: Not in VersionControl
Variant: amr17x-nolcd
Units used: mil

Designator Comment Layer Footprint

Center-X(mil) Center-Y(mil) Rotation Description

SIG "SOLDER PT" TopLayer TEST_POINT

1312.008 -990.158 90 ""

D1 "Diode 1N4007" TopLayer DO-214AC

-169.291 -1319.882 180 "1 Amp General Purpose Rectifier"

AX2 "SOLDER PT" TopLayer TEST_POINT

1387.795 -1351.378 90 ""

AX1 "SOLDER PT" TopLayer TEST_POINT

1387.795 -1287.402 90 ""

Z1 "RS485 TRANSIENT SUPPRESSOR" TopLayer SOT-23

-169.291 -259.842 0 "CDSOT23-SM712 SOT23 SEMTECH"

X2 "16Mhz 12pF" BottomLayer CRYSTAL-ECX-1637-2.0x1.6mm

587.598 138.780 90 "ECX-1637 ECS-160-8-37-CWY-TR3 2.0x1.6mm"

F1 0805L005/30YR BottomLayer 0805-ASIS

-254.921 -524.606 270 "RESETTABLE FUSE, 0805L005/30 SMT 0805
LITTLEFUSE"
F2 0805L005/30YR BottomLayer 0805-ASIS
-141.732 -523.622 270 "RESETTABLE FUSE, 0805L005/30 SMT 0805
LITTLEFUSE"
C29 0.1uF TopLayer 0603-ASIS-CAP
1427.638 207.677 360 "603YC104KAT2A SMD CAP 0.1uF 16V 10% 0603
X7R"
R6 "3.3R 1%" TopLayer 6-0805
622.125 -1415.354 180 "Res, 0603, 0.1W 1%, YAGEO:RC0603JR-071K"

R5 "3.3R 1%" TopLayer 6-0805

797.322 -1416.338 360 "Res, 0603, 0.1W 1%, YAGEO:RC0603JR-071K"

U1 PN5120A0HN1/C1 TopLayer
HVQFN32_(5X5)_0.5mm_PITCH_K02cpu 1475.394 -1119.094 270
"PN5120A0HN1/C1 READER IC (HVQFN32) NXP"

R2 0R TopLayer O6O3-ASIS
1088.535 -1109.850 360 "Res, 0603, 0.1W 5%, YAGEO:RC0603JR-071K"

R1 1K TopLayer O6O3-ASIS
1312.008 -1265.236 270 "Res, 0603, 0.1W 5%, YAGEO:RC0603JR-071K"
R3 2.7K TopLayer O6O3-ASIS
1018.307 -1247.047 180 "RC0603JR-072K7L 2K7 5% RES 0603"

KL2 560nH TopLayer 0603

1216.063 -1044.291 180 ""

KL1 560nH TopLayer 0603

1215.079 -1176.181 180 ""

C3 15pF TopLayer 0603-ASIS-CAP

1447.835 -1327.244 270 "GRM1885C1H150JA01D MLCC SMD 0603 15pF 50V C0G
FN18N150J500PSG"
C4 15pF TopLayer 0603-ASIS-CAP
1613.189 -1319.370 90 "GRM1885C1H150JA01D MLCC SMD 0603 15pF 50V C0G
FN18N150J500PSG"
C12 "18pF 1%" TopLayer O6O3-ASIS
1018.267 -1375.984 360 "CAP CER 18pF 50V 1% NP0 0603
CC0603JRNPO9BN180"
C16 "43pF 1%" TopLayer O6O3-ASIS
523.228 -1344.488 180 "CAP CER 43pF 50V 1% NP0 0603 /
0603N430J500CT"
C8 200pF TopLayer O6O3-ASIS
1089.173 -1044.291 180 "Chip Cap 0603 NPO 200pf 1% 50V"

C11 NC TopLayer O6O3-ASIS

1018.267 -1311.023 360 "CAP CER 18pF 50V 1% NP0 0603
CC0603JRNPO9BN180"
C15 "43pF 1%" TopLayer O6O3-ASIS
894.291 -1344.488 180 "CAP CER 43pF 50V 1% NP0 0603 /
0603N430J500CT"
C7 "200pF 1%" TopLayer O6O3-ASIS
1088.110 -1177.165 360 "Chip Cap 0603 NPO 200pf 1% 50V"

C5 0.1uF TopLayer O6O3-ASIS

1243.110 -1286.890 270 "0603YC104KAT2A SMD CAP 0.1uF 16V 10% 0603
X7R"
C13 "18pF 1%" TopLayer O6O3-ASIS
400.196 -1312.008 180 "CAP CER 18pF 50V 1% NP0 0603
CC0603JRNPO9BN180"
C6 1nF TopLayer O6O3-ASIS
1214.094 -1110.236 180 "CC0603JRX7R9BB102 MLCC SMD 1.0nF 50V X7R 5%
0603"
C1 0.1uF TopLayer O6O3-ASIS
1664.842 -1008.858 360 "603YC104KAT2A SMD CAP 0.1uF 16V 10% 0603
X7R"
C2 0.1uF BottomLayer O6O3-ASIS
1375.000 -1079.252 90 "603YC104KAT2A SMD CAP 0.1uF 16V 10% 0603
X7R"
SW1 "SW DIP-8" BottomLayer DIP_SW_8WAY_SMD
1503.976 -548.189 270 "ADE08S04 (1-1825058-9) DIP Switch, 8
Position, SPST"
ANTENNA1 CAP TopLayer NFC_ANT1
708.691 -2104.161 360 "ANTENNA NEW"

X1 27.12Mhz TopLayer CRYSTAL-ECX-1637-2.0x1.6mm

1530.512 -1327.756 360 "ECX-137 ECS-271.2-10-37-CKM-TR 2.0x1.6mm"

U2 LF33CDT-TR BottomLayer DPAK

1259.815 242.248 270 "IC REGULATOR LDO 3.3V DPAK (TO-252-3)"

C19 0.1uF BottomLayer O6O3-ASIS

230.354 -415.827 90 "0603YC104KAT2A SMD CAP 0.1uF 16V 10% 0603
X7R"
C20 0.1uF BottomLayer O6O3-ASIS
235.748 -824.764 360 "0603YC104KAT2A SMD CAP 0.1uF 16V 10% 0603
X7R"
C21 0.1uF BottomLayer O6O3-ASIS
157.402 -691.418 90 "0603YC104KAT2A SMD CAP 0.1uF 16V 10% 0603
X7R"
R7 100K BottomLayer O6O3-ASIS
223.976 -577.717 180 "Res, 0603, 0.1W 5%, YAGEO:RC0603JR-071K"

R8 100K BottomLayer O6O3-ASIS

92.087 -799.173 180 "Res, 0603, 0.1W 5%, YAGEO:RC0603JR-071K"

R9 100K BottomLayer O6O3-ASIS

102.913 -869.055 180 "Res, 0603, 0.1W 5%, YAGEO:RC0603JR-071K"

R10 100K BottomLayer O6O3-ASIS

74.370 -577.717 180 "Res, 0603, 0.1W 5%, YAGEO:RC0603JR-071K"

R11 1k BottomLayer O6O3-ASIS

10.354 -668.268 360 "Res, 0603, 0.1W 5%, YAGEO:RC0603JR-071K"

R12 1k BottomLayer O6O3-ASIS

54.645 -735.197 360 "Res, 0603, 0.1W 5%, YAGEO:RC0603JR-071K"

R13 1k BottomLayer O6O3-ASIS

71.890 -972.874 270 "Res, 0603, 0.1W 5%, YAGEO:RC0603JR-071K"

R14 1k BottomLayer O6O3-ASIS

-25.551 -547.717 90 "Res, 0603, 0.1W 5%, YAGEO:RC0603JR-071K"

U3 "MC9S08AW60CPU/E LQFP64" BottomLayer TQFP_64(10X10MM)

729.307 -297.457 180 "MC9S08AW60CPU/E LQFP64"

C22 0.1uF BottomLayer O6O3-ASIS

241.693 -512.756 180 "0603YC104KAT2A SMD CAP 0.1uF 16V 10% 0603
X7R"
C23 0.1uF TopLayer 0603-ASIS-CAP
1427.638 279.528 360 "603YC104KAT2A SMD CAP 0.1uF 16V 10% 0603
X7R"
C24 0.1uF BottomLayer 0603-ASIS-CAP
805.591 295.276 180 "603YC104KAT2A SMD CAP 0.1uF 16V 10% 0603
X7R"
C25 12pF BottomLayer 0603-ASIS-CAP
512.795 140.236 90 "CC0603JRNPO9BN120 SMD 0603 12pF 50V"

C27 0.1uF BottomLayer 0603-ASIS-CAP

387.323 -218.504 180 "603YC104KAT2A SMD CAP 0.1uF 16V 10% 0603
X7R"
C28 0.1uF BottomLayer 0603-ASIS-CAP
1092.992 -540.354 360 "603YC104KAT2A SMD CAP 0.1uF 16V 10% 0603
X7R"
R15 330R BottomLayer O6O3-ASIS
208.189 -314.921 360 "Res, 0603, 0.1W 5%, YAGEO:RC0603JR-071K"
R16 330R BottomLayer O6O3-ASIS
208.189 -250.945 360 "Res, 0603, 0.1W 5%, YAGEO:RC0603JR-071K"

R17 4.7K BottomLayer O6O3-ASIS

52.205 -285.866 270 "Res, 0603, 0.1W 5%, YAGEO:RC0603JR-071K"

H1 "HDR 2x2W" BottomLayer HDR2X2

804.961 133.701 90 "Header, 2Way 2Row Male 2.54mm"

C26 12pF BottomLayer 0603-ASIS-CAP

662.402 146.142 90 "CC0603JRNPO9BN120 SMD 0603 12pF 50V"

J3 "SOLDER PT" TopLayer SIINGLE_PAD

-144.646 -1021.614 0 ""

J4 "SOLDER PT" TopLayer SIINGLE_PAD

-143.661 -1166.299 0 ""

J5 "SOLDER PT" TopLayer SIINGLE_PAD

-271.614 -1168.268 0 ""

J6 "SOLDER PT" TopLayer SIINGLE_PAD

-271.614 -876.929 0 ""

J7 "SOLDER PT" TopLayer SIINGLE_PAD

-143.661 -877.914 0 ""

J8 "SOLDER PT" TopLayer SIINGLE_PAD

-21.614 -1021.614 0 ""

J9 "SOLDER PT" TopLayer SIINGLE_PAD

-22.599 -877.914 0 ""

J10 "SOLDER PT" TopLayer SIINGLE_PAD

-271.614 -1022.599 0 ""

Q1 NPN BottomLayer Q_A1011321

109.449 -415.444 360 "BJT NPN - 30V, 100mA (SOT23) MMBT2222A
FAIRCHILD SEMI or BC848B,215 (SOT23) RECTRON"
Q2 NPN BottomLayer Q_A1011321
139.961 -149.696 360 "BJT NPN - 30V, 100mA (SOT23) MMBT2222A
FAIRCHILD SEMI or BC848B,215 (SOT23) RECTRON"
R18 4.7K BottomLayer O6O3-ASIS
-2.441 -157.441 360 "Res, 0603, 0.1W 5%, YAGEO:RC0603JR-071K"

R19 100R BottomLayer O6O3-ASIS

-28.504 -407.953 90 "Res, 0603, 0.1W 5%, YAGEO:RC0603JR-071K"

R20 100R BottomLayer O6O3-ASIS

-31.457 -260.315 90 "Res, 0603, 0.1W 5%, YAGEO:RC0603JR-071K"

R21 1K BottomLayer O6O3-ASIS

806.614 357.323 360 "Res, 0603, 0.1W 5%, YAGEO:RC0603JR-071K"

R22 1M BottomLayer O6O3-ASIS

630.394 54.134 180 "Res, 0603, 0.1W 5%, YAGEO:RC0603JR-071K"

BZ1 BUZZER,HCM0905A BottomLayer HCM0905A

379.961 -1205.669 270 ""
C30 0.1uF TopLayer O6O3-ASIS
-287.402 -219.961 270 "603YC104KAT2A SMD CAP 0.1uF 16V 10% 0603
X7R"
D2 BAT54 BottomLayer SOT-23
75.827 -1121.024 270 "SINGLE SOT23"

L1 BRPG1204W TopLayer LED2_SMT

264.683 305.933 0 "598-8610-207F Diallight"

L2 BRPG1204W TopLayer LED2_SMT

-30.433 306.103 0 "598-8610-207F Diallight"

L3 BRPG1204W TopLayer LED2_SMT

560.095 306.103 0 "598-8610-207F Diallight"

Q3 NPN BottomLayer Q_A1011321

346.338 164.538 180 "BJT NPN - 30V, 100mA (SOT23) MMBT2222A
FAIRCHILD SEMI or BC848B,215 (SOT23) RECTRON"
Q4 NPN BottomLayer Q_A1011321
189.842 163.554 180 "BJT NPN - 30V, 100mA (SOT23) MMBT2222A
FAIRCHILD SEMI or BC848B,215 (SOT23) RECTRON"
Q5 NPN BottomLayer Q_A1011321
217.717 -965.641 360 "BJT NPN - 30V, 100mA (SOT23) MMBT2222A
FAIRCHILD SEMI or BC848B,215 (SOT23) RECTRON"
R23 10K BottomLayer O6O3-ASIS
-245.079 218.976 90 "Res, 0603, 0.1W 5%, YAGEO:RC0603JR-071K"

R25 10K TopLayer O6O3-ASIS

-265.236 -383.858 0 "Res, 0603, 0.1W 5%, YAGEO:RC0603JR-071K"

R26 10K TopLayer O6O3-ASIS

-123.543 -382.874 180 "Res, 0603, 0.1W 5%, YAGEO:RC0603JR-071K"

R27 330R BottomLayer O6O3-ASIS

394.212 56.142 360 "Res, 0603, 0.1W 5%, YAGEO:RC0603JR-071K"

R28 330R BottomLayer O6O3-ASIS

222.953 56.142 360 "Res, 0603, 0.1W 5%, YAGEO:RC0603JR-071K"

R29 470R BottomLayer 8-1206

405.551 309.094 180 "SMT 5% 1206"

R31 330R BottomLayer O6O3-ASIS

336.653 -899.095 90 "Res, 0603, 0.1W 5%, YAGEO:RC0603JR-071K"

U4 SN65HVD75DR BottomLayer SOIC8

-218.110 -11.811 360 "RS-485 Transceivers, SOIC TI"

C31 0.1uF BottomLayer O6O3-ASIS

404.528 -530.984 270 "603YC104KAT2A SMD CAP 0.1uF 16V 10% 0603
X7R"
R30 220R BottomLayer 8-1206
101.417 311.063 180 "SMT 5% 1206"

R32 1K BottomLayer 8-1206

113.228 -1317.874 90 "SMT 5% 1206"

E1 "47uF 16V" BottomLayer 1206-ASIS-CAP

1637.795 158.504 270 "1206 CERAMIC 47uF 16V"

E2 "100uF 6.3V" BottomLayer 0805-ASIS-CAP

1093.504 -207.677 270 "GRM31CR60J107ME39L
or GRM31CR60J107ME39L CAP CER 100uF 6.3V 20% X5R 0805 MURATA"
J1 "SOLDER PT" TopLayer SIINGLE_PAD
-143.661 -732.244 0 ""

J2 "SOLDER PT" TopLayer SIINGLE_PAD

-271.614 -731.260 0 ""