EN IM EVO Series V10

Instruction Manual
ZEISS EVO
Scanning Electron Microscope
ZEISS EVO
Original Manual
Carl Zeiss Microscopy GmbH

Carl-Zeiss-Promenade 10
07745 Jena
Germany
info.microscopy.de@zeiss.com
www.zeiss.com/microscopy

Carl-Zeiss-Straße 22
73447 Oberkochen
Germany
Document Name: Instruction Manual ZEISS EVO

Order Number: 354706-0780-006
Revision: 10
Language: en-US
Effective from: 11/2021
© 2021 Without the prior written consent of ZEISS, this document or any part of it must neither be translated nor reproduced or
transmitted in any form or by any means - including electronic or mechanic methods, by photocopying, recording or by any in-
formation or filing system. The right to make backup-copies for archiving purposes shall remain unaffected thereby. Any viola-
tions may be prosecuted as copyright infringements.
The use of general descriptive names, registered names, trademarks, etc. in this document does not imply that such names are
exempt from the relevant intellectual property laws and regulations and therefore free for general use. This shall also apply if
this is not specifically referred to. Software programs shall entirely remain the property of ZEISS. No program or subsequent up-
grade thereof may be disclosed to any third party, copied or reproduced in any other form without the prior written consent of
ZEISS, even if these copies or reproductions are destined for internal use at the customer's only, the only exception being one
single back-up copy for archiving purposes.
ZEISS reserves the right to make modifications to this document without notice.
ZEISS Table of Contents
Table of Contents
1 General Information........................................................................ 6
1.1 Text Conventions and Link Types ........................................................................ 6
1.2 Explanation of Warning Messages and Additional Information............................ 7
1.3 Further Applicable Documents ............................................................................ 8
1.4 Contact............................................................................................................... 8
2 Safety ............................................................................................. 9
2.1 Intended Use ...................................................................................................... 9
2.2 General Safety Information ................................................................................. 10
2.2.1 Requirements for Operators .................................................................. 10
2.2.2 Safe Operating Condition...................................................................... 10
2.3 Prevention of Hazards ......................................................................................... 11
2.3.1 Mechanical Hazards .............................................................................. 11
2.3.2 Electrical Hazards .................................................................................. 11
2.3.3 Hazards generated by Materials and Substances ................................... 12
2.3.4 Hazards generated by Radiation............................................................ 13
2.3.5 Thermal Hazards ................................................................................... 13
2.4 Warning Labels and Lights .................................................................................. 13
2.4.1 Warning Labels ..................................................................................... 14
2.5 Safety Devices and Interlocks .............................................................................. 18
2.5.1 Protective Cover Panels ......................................................................... 18
2.5.2 Main Disconnect Device ........................................................................ 19
2.5.3 Circuit Breaker ...................................................................................... 19
2.5.4 Locking Devices .................................................................................... 20
3 Product and Functional Description ................................................ 21

3.1 Vacuum System .................................................................................................. 22
3.1.1 Variable Pressure Modes ....................................................................... 23
3.2 Electron Optical Column...................................................................................... 27
3.2.1 Optibeam Modes .................................................................................. 29
3.3 Detectors ............................................................................................................ 29
3.3.1 Principle of Signal Detection.................................................................. 30
3.3.2 Detectors Overview............................................................................... 32
3.3.3 SE Detector ........................................................................................... 33
3.3.4 Chamber CCD Camera .......................................................................... 37
3.4 Specimen Stage .................................................................................................. 38
3.5 Optional Components and Accessories................................................................ 39
3.5.1 Optional Detectors ................................................................................ 39
3.5.2 Dual Joystick ......................................................................................... 47
3.5.3 Control Panel ........................................................................................ 48
3.6 Software Description........................................................................................... 50
3.6.1 SmartSEM User Interface....................................................................... 50
3.6.2 Graphical Control Elements ................................................................... 51
3.6.3 User Access Levels and User Privileges................................................... 52
3.6.4 SmartSEM Program Suite ...................................................................... 53
4 Installation...................................................................................... 55
Instruction Manual ZEISS EVO | en-US | Rev. 10 | 354706-0780-006 3

Table of Contents ZEISS
5 First Operating Steps ...................................................................... 56

5.1 Prerequisites for Commissioning and Operation .................................................. 56
5.2 Switching On the Microscope System.................................................................. 56
5.2.1 Energizing the Microscope .................................................................... 56
5.2.2 Starting the Microscope ........................................................................ 58
5.3 Starting the Software .......................................................................................... 59
5.3.1 Calling up the Help................................................................................ 59
5.3.2 Keyboard Shortcuts............................................................................... 59
5.4 Acquiring an Image............................................................................................. 61
5.4.1 Preparing the Specimen Holder ............................................................. 61
5.4.2 Loading the Specimen Chamber............................................................ 63
5.4.3 Locating the Specimen .......................................................................... 67
5.4.4 Switching on the Gun | LaB₆ Filament ................................................... 68
5.4.5 Switching on the EHT | LaB₆ Filament .................................................... 68
5.4.6 Choosing the LaB₆ Mode ...................................................................... 69
5.4.7 Setting up the LaB₆ Source.................................................................... 70
5.4.8 Switching on the Gun and EHT | Tungsten Filament .............................. 72
5.4.9 Acquiring an Image............................................................................... 73
5.4.10 Optimizing the Image............................................................................ 76
5.4.11 Saving the Image .................................................................................. 79
5.5 Modifying Gun Parameters and Optibeam Mode ................................................ 79
5.5.1 Using the Automatic Gun Alignment Functions ..................................... 79
5.5.2 Using the Auto Aperture Alignment Function ........................................ 80
5.5.3 Setting the Probe Current...................................................................... 81
5.5.4 Measuring the Probe Current ................................................................ 81
5.5.5 Selecting the Optibeam Operation Mode .............................................. 81
5.6 Finding Appropriate Detector Settings................................................................. 82
5.6.1 Selecting a Detector .............................................................................. 82
5.6.2 Setting up the SE Detector .................................................................... 83
5.6.3 Setting up the C2D Detector ................................................................. 83
5.6.4 Setting up the C2DX Detector ............................................................... 84
5.6.5 Setting up the BSD Detector.................................................................. 85
5.6.6 Setting up the YAG BSD Detector.......................................................... 87
5.6.7 Using the Variable Stage Bias ................................................................ 88
5.7 Working with Specific Specimen Types................................................................ 91
5.7.1 Conductive Specimen............................................................................ 91
5.7.2 Non-conductive Specimen..................................................................... 93
5.7.3 Hydrated Specimen ............................................................................... 97
5.8 Switching Off the Microscope System .................................................................108
5.8.1 Finishing the Work Session | LaB₆ Filament............................................ 108
5.8.2 Finishing the Work Session | Tungsten Filament..................................... 108
5.8.3 Closing the SmartSEM User Interface .................................................... 109
5.9 De-energizing the Microscope.............................................................................110
5.10 Performing an Emergency Shutdown ..................................................................111
6 Care and Maintenance ....................................................................112

6.1 Safety During Cleaning and Maintenance............................................................112
6.2 Maintenance Schedule ........................................................................................112
6.3 Maintenance Work .............................................................................................113
6.3.1 Change of Consumables and Chemicals ................................................ 113
6.4 Care and Cleaning Work .....................................................................................113
6.4.1 Cleaning the Microscope....................................................................... 113
4 Instruction Manual ZEISS EVO | en-US | Rev. 10 | 354706-0780-006

ZEISS Table of Contents
7 Troubleshooting .............................................................................114
7.1 Chamber.............................................................................................................115
7.1.1 Initializing the Stage.............................................................................. 115
7.1.2 Defining the Post Initialization Position of the Stage.............................. 116
7.1.3 Changing the Joystick TV Angle ............................................................ 116
7.1.4 Resetting the Touch Alarm .................................................................... 117
7.1.5 Checking the Temperature .................................................................... 117
7.1.6 Replacing the Chamber Door Seal ......................................................... 117
7.1.7 Adjusting the Isolation Mounts ............................................................. 119
7.2 Column ...............................................................................................................120
7.2.1 Baking out the Gun Head...................................................................... 120
7.2.2 Replacing Filaments .............................................................................. 121
7.3 Power Circuit ......................................................................................................147
7.3.1 Checking the Position of the Circuit Breakers ........................................ 147
7.4 PC.......................................................................................................................147
7.4.1 Cleaning up the PC ............................................................................... 147
8 Decommissioning and Disposal.......................................................148

8.1 Decommissioning................................................................................................148
8.2 Transport and Storage ........................................................................................149
8.3 Disposal ..............................................................................................................151
8.4 Decontamination ................................................................................................151
9 Technical Data and Conformity.......................................................152

9.1 Layout and Connections......................................................................................152
9.2 System Layout.....................................................................................................153
9.3 Performance Data and Specifications | EVO 10 ....................................................153
9.6 Applicable Standards and Regulations.................................................................169
10 Parts and Tools ...............................................................................171

10.1 Consumables ......................................................................................................171
10.2 Spare Parts..........................................................................................................171
10.3 Tools and Accessories .........................................................................................171
Glossary ..........................................................................................173
Index...............................................................................................176

1 General Information | 1.1 Text Conventions and Link Types ZEISS
1 General Information
This Instruction Manual (further called "Manual") is considered to be part of the EVO workstation.
Herein after referred to as Microscope System.
This document contains basic steps and safety information that must be observed during opera-
tion and maintenance. Therefore, the document must be read by the operator prior to commis-
sioning and must always be available at the place of use of the Microscope System.
This document is an essential part of the Microscope System and, if the Microscope System is
resold, the document must remain with the Microscope System or be handed over to the new
owner.
1.1 Text Conventions and Link Types

The following text conventions and link types are used:
Text convention Meaning
Click Start. The names of controls and important infor-

Press the STANDBY button. mation are shown in bold letters.
Press [Enter] on the keyboard.
Press <Ctrl+Alt+Del> Press several keys on the keyboard simultane-

ously.
Select Tools > Goto Control Panel > Air- Follow a path in the software.
lock.
Text input Text to be entered by the user
Programming and Macros Anything typed in literally during program-

ming, including, for example, macro codes,
keywords, data types, method names, vari-
ables, class names, and interface names.
Tab. 1: Text convention
Link type Meaning
See: Text Conventions and Link Types [} 6]. Link to further information for this topic.
https://www.zeiss.com/corporate/int/ Link to a website on the internet.

home.html
Tab. 2: Link types

ZEISS 1 General Information | 1.2 Explanation of Warning Messages and Additional Information
1.2 Explanation of Warning Messages and Additional Information

DANGER, WARNING, CAUTION, and NOTICE are standard signal words used to determine the lev-
els of hazards and risks of personal injury and property damage. Not only the safety and warning
messages in the Safety chapter are to be considered also all safety and warning messages in
other chapters. Failure to comply with these instructions and warnings can result in both personal
injury and property damage and involve the loss of any claims for damages.
The following warning messages indicating dangerous situations and hazards are used in this doc-
ument.
DANGER
Type and source of danger
DANGER indicates an imminently hazardous situation which, if not avoided, will result in death
or serious injury.
WARNING
WARNING indicates a potentially hazardous situation which, if not avoided, may result in
death or serious injury.
CAUTION
CAUTION indicates a potentially hazardous situation which, if not avoided, may result in minor
or moderate injury.
NOTICE
NOTICE indicates a potentially harmful situation which, if not avoided, may result in property
damage.
Info
Provides additional information or explanations to help operator better understand the con-
tents of this manual.

1 General Information | 1.3 Further Applicable Documents ZEISS
1.3 Further Applicable Documents

Please also take note of the following documents:
Brochures and For Brochures, ISO certificates, CSA certificates and EU declarations of conformity ask your ZEISS
Certificates Sales & Service Partner.
Installation For more details on technical data, refer to the corresponding Installation Requirements.
Requirements
Local and National Local and national health and safety regulations should be adhered to for the site and the use of
health and safety the Microscope System.
regulations Please consult with your ZEISS Sales & Service Partner in the event of these regulations conflicting
with the installation requirements of the Microscope System.
Safety data sheets Observe the enclosed safety data sheets. The instructions and guidelines given in the respective
safety data sheets must be complied with.
Software For detailed information on how to use SmartSEM, please refer to its Online Help or ask your
ZEISS Sales & Service Partner.
System and 3rd Information about the individual components, enhancements and accessories can be obtained
Party Components, from your ZEISS Sales & Service Partner.
Accessories Also refer to the 3rd Party documentation of the manufacturer.
1.4 Contact
If you have any questions or problems, please contact your local ZEISS Sales & Service Partner or
one of the following addresses:
Headquarters
Phone: +49 1803 33 63 34
Fax: +49 3641 64 3439
Email: info.microscopy.de@zeiss.com
Courses and training
Email: courses.microscopy.de@zeiss.com
ZEISS Portal
The ZEISS Portal (https://portal.zeiss.com/) offers various services that simplify the daily work with
your ZEISS systems (machines and software). It is constantly improved and extended to meet your
needs and requirements better.
ZEISS Sales & Service Partner

You can find a ZEISS Sales & Service Partner in your area under https://www.zeiss.de/mikroskopie/
website/forms/sales-and-service-contacts.html.
Service Germany
Phone: +49 7364 20 3800
Fax: +49 7364 20 3226
Email: service.microscopy.de@zeiss.com

ZEISS 2 Safety | 2.1 Intended Use
2 Safety
This chapter contains general requirements for safe working practices. Any person using the Mi-
croscope System or commissioned with installation or maintenance must read and observe these
general safety instructions. Knowledge of basic safety instructions and requirements is a precondi-
tion for safe and fault-free operation. Operational safety of the supplied Microscope System is
only ensured if it is operated according to its intended use.
If any work is associated with residual risks, this is mentioned in the relevant parts of this docu-
ment in a specific note. When components must be handled with special caution, they are
marked with a warning label. These warnings must always be observed.
2.1 Intended Use

The microscope has been designed to generate an image or to analyze appropriate specimens,
which is achieved by scanning a focused electron beam across the specimen (SEM Imaging).
This application allows for the imaging and analysis of surface structures and near-surface struc-
tures of appropriate specimens. For this purpose, the specimen is placed in the evacuated speci-
men chamber.
Info
Not for therapeutic, treatment, or medical diagnostic evidence.
Info
Not all products are available in every country. Contact your local ZEISS representative for
more information.
PC The Zeiss SEM PC is supplied “as is” and is untested with any third-part software. It is not recom-
mended to install any third-part software on the Zeiss SEM PC as this might cause instabilities
and/or break Carl Zeiss software installations.
SmartSEM The SmartSEM software is intended for the operation of scanning electron microscopes (SEMs).
Software The SmartSEM software has to be run exclusively on a personal computer delivered by ZEISS. Any
other application is not allowed.
Regarding the operation of the microscope, the following regulations must be met:
§ Only operate the microscope according to the operating conditions after correct installation
by a ZEISS service representative.
§ The microscope is only to be used by operators who have been trained by a ZEISS service rep-
resentative. Basic operator training and safety instructions will be provided within the scope
of the initial start-up by ZEISS. Make sure that everyone who operates the microscope only
performs the tasks for which he/she is trained.
§ Operators of the microscope must not deviate from the instructions provided in this manual.
§ Only perform preventive maintenance tasks described in this manual. All tasks of mainte-
nance, service, and repair not described in this manual have to be performed by an authorized
ZEISS service representative.
§ The microscope is to be used in a laboratory environment for commercial and scientific pur-
poses only.
Using the microscope for any other purpose is not allowed and can be hazardous.
Improper use of the Microscope System can easily lead to impairment of its function or even dam-
age to the Microscope System. Damage caused by incorrect operation, negligence or unautho-
rized intervention, in particular by removing, modifying or replacing parts of the Microscope Sys-
tem, cannot be held liable by the device manufacturer. Third-party devices or components that
are not expressly approved by ZEISS may not be used.

2 Safety | 2.2 General Safety Information ZEISS
2.2 General Safety Information

This document must be read before commissioning in order to ensure safe and uninterrupted op-
eration. Pay particular attention to all listed safety notes. Make sure, that
§ the operating personnel has read and understood this manual, associated documents and
particularly all safety regulations and instructions, and applies them.
§ the local and national safety and accident prevention regulations must be observed, as well as
the applicable laws and regulations in your country.
§ this document is always available with/together with the Microscope System.
§ the Microscope System is always in perfect condition.
§ the Microscope System is secured against access by unauthorized persons.
§ maintenance and repair work, retrofitting, removal or replacement of components, as well as
any other intervention in the Microscope System not described in this document, may only be
carried out by the manufacturer ZEISS or persons expressly authorized by ZEISS to do so.
2.2.1 Requirements for Operators
The Microscope System, components and accessories may only be operated and maintained by
authorized and trained personnel. The Microscope System may only be used in accordance this
document. If the Microscope System is not used as described, the safety of the user may be im-
paired and/or the Microscope System may be damaged.
Any unauthorized intervention or use other than within the scope of the intended use shall void
all rights to warranty claims. The regional regulations on health protection and accident preven-
tion must be observed at all times and during all work on and with the Microscope System.
Training Authorized ZEISS personnel will provide basic training in operating the Microscope System. As
well as information on equipment safety and maintenance work that can be conducted by the op-
erator. The training will be documented by ZEISS and its completion is to be confirmed by the op-
erator.
Special application training is offered for a fee. Current training dates, additional information and
the registration form can be found at https://www.zeiss.com/microscopy/int/service-support/train-
ing-and-education.html.
2.2.2 Safe Operating Condition
If circumstances occur which impair safety and cause changes in operating behavior, the Micro-
scope System must be shut down immediately and a ZEISS service representative should be in-
formed. The Microscope System can only be operated after proper installation by a ZEISS service
representative and in compliance with the operating conditions. The Microscope System may only
be operated after correct installation by a ZEISS service representative and if the operating condi-
tions are adhered to.
§ Do not operate the Microscope System until you have completely read and understood the
entire documentation delivered with the Microscope System.
§ Make sure that all protective cover panels are installed and all warning labels are available and
legible.
§ Ensure conditions and take measures to prevent the build up of electrostatic charge on the
workplace.

ZEISS 2 Safety | 2.3 Prevention of Hazards
2.3 Prevention of Hazards

This section summarizes potential hazards and recommended safety precautions. Failure to follow
the safety instructions and instructions may result in personal injury and property damage.
2.3.1 Mechanical Hazards
Specimen Stage Fingers can be trapped by the moving specimen stage.

§ Always close the chamber door before moving the specimen stage.
§ To remove parts fallen into or near to the stage use a tool (e.g. tweezers) instead of your fin-
gers.
Chamber Door Fingers can be pinched when closing the chamber door.
§ Use the recessed grip or door handle to close the chamber door.
§ Ensure not to get your fingers caught in the chamber door gap.
Gas Cylinders Gas cylinders containing, for example, nitrogen or compressed air have a high internal pressure of
approximately 200 bar. If not properly handled, the contained gas can abruptly escape and cause
the gas cylinder to move in an uncontrollable manner.
§ Observe all safety labels on the gas cylinders and all safety instructions given by the gas cylin-
der manufacturer.
§ Always operate gas cylinders in an upright position and secure them so they will not tip over.
§ Before transporting gas cylinders, place protective caps on them.
Short Working When opening the chamber door, the microscope or specimen can be damaged if the specimen
Distance stage is at a short working distance. If a BSD detector is inserted, it can be damaged as well.
§ Always move the specimen stage to a long working distance before opening the chamber
door.
Isolation Mounts The isolation mounts are specified only up to 4.5 bar. If you pump up the isolation mounts above
4.5 bar, then the isolation mounts could be destroyed.
§ When pumping up the isolation mounts, avoid pressures above 4.5 bar.
2.3.2 Electrical Hazards
Hazardous Voltage High voltages are present inside the microscope. Contact may cause burn or electrical shock.
inside the § Ensure proper grounding. For more information, refer to the Installation Requirements docu-
Microscope ment.
§ Only authorized ZEISS service representatives are allowed to service the microscope.
§ Do not try to service the microscope yourself.
High Leakage High leakage currents are present in the microscope. Contact may cause burn or electrical shock.
Currents § Ensure proper grounding. For more information, refer to the Installation Requirements docu-
ment.
§ Do not operate the microscope without the separate ground connection.
Opening the Gun If you open the gun while the mains power is connected to the microscope, then contact may
cause electrical shock.
§ Always disconnected the mains power from the microscope before you open the gun.
Residual Voltage After unplugging the mains plug residual voltage is present at the pins of the plug which may
at the Mains Plug cause electrical shock.
§ After unplugging the mains plug wait at least 5 s before touching the pins of the mains plug.
Stage on Bias If you open the chamber door while the stage is still on bias voltage, then contact may cause elec-
Voltage trical shock.
§ Always switch off the beam deceleration before you open the chamber door.

2 Safety | 2.3 Prevention of Hazards ZEISS
Malfunction of Magnetic fields present at the ion getter pumps may disturb the function of medical devices. The
Medical Devices magnetic fields are also present if the microscope is switched off.
near Ion Getter If you wear medical implants that are susceptible to magnetic fields (e.g. cardiac pacemakers), do
Pumps the following:
§ Keep a distance of at least 30 cm from the ion getter pumps.
§ Follow the safety instructions provided by the pump manufacturer.
2.3.3 Hazards generated by Materials and Substances
Biological Biological substances may pose a threat to the health of humans and other living organisms.
Substances § Keep a logbook of the biological substances loaded into the microscope and show it to the
ZEISS service representatives before they perform any work on the microscope.
Lack of oxygen Gaseous dry nitrogen is used to vent the specimen chamber during specimen exchange and parts
exchange. Inhaling nitrogen may cause unconsciousness.
§ During specimen exchange, keep the chamber door open as short as possible.
§ Do not inhale the air from within the specimen chamber.
§ Ensure that the area around the microscope is sufficiently ventilated.
§ If you begin to experience symptoms of asphyxia (for example: rapid breathing, loss of mental
alertness and/or muscular coordination, depression of sensations, emotional instability, fa-
tigue) leave the room immediately and inform the facility’s safety officer.
Concerning the hazards of nitrogen installations and associated safety precautions refer to the
current version of the guideline IGC Doc 44/18: Hazards of Oxygen-Deficient Atmospheres, pub-
lished by EIGA (European Industrial Gases Association).
To download the document:
1. Go to EIGA homepage www.eiga.eu.
2. Select Publications > EIGA Documents.
3. From the list, select Doc. 44/18.
4. Click Download.
Aggressive or Aggressive or toxic chemicals can cause chemical burns.
Toxic Chemicals § When handling aggressive or toxic chemicals, wear suitable protective clothing, gloves, and
eye/face protection.
§ Do not eat, drink, or smoke while handling toxic chemicals.
§ Refer to local safety regulations.
§ Read and follow the instructions in the material safety data sheet of the chemical. The mate-
rial safety data sheet can be obtained from the supplier of the chemicals.
Oil Mist around The rotary pump RV12 may emit oil mist especially at high gas load (e.g. door accidently open).
the Rotary Pump Inhaled oil mist is harmful to health.
§ Regularly service the oil mist filter (refer to pump manual and material safety data sheets).
Recommended is the connection to an exhaust line.
Environmental When disposing of aggressive or toxic chemicals, there is a threat of damage to the environment.
risk: Disposal of § When disposing of waste that has been generated during a service operation (e.g. used rotary
aggressive or toxic pump oil), comply with all national and local safety and environmental protection regulations.
chemicals

ZEISS 2 Safety | 2.4 Warning Labels and Lights
2.3.4 Hazards generated by Radiation
X-rays X-rays are generated inside the microscope during operation. This is unavoidable because elec-
trons are accelerated by voltages up to 30 kV.
§ Do not remove any parts around the column and chamber that are essential for radiation pro-
tection.
§ Use genuine ZEISS parts exclusively.
§ Ensure that all local safety and X-ray protection regulations are met.
§ Only authorized ZEISS service representatives are allowed to service the microscope.
An electron microscope is a radiation source in the sense of the German regulations Strahlen-
schutzgesetz (StrlSchG) and Strahlenschutzverordnung (StrlSchV). This also applies if the X-ray ra-
diation generated is evaluated by detectors (WDX, EDX). The operation of an interfering emitter is
subject to the regulations of StrlSchG and StrlSchV.
The design of the scanning electron microscope ensures that the acceleration voltage of 30 kV
and a local dose rate of 1 µSv / h at a distance of 0.1 m from the outer surfaces of the device are
not exceeded. The operation of these devices does not require a permit in Germany according to
StrlSchG and StrlSchV.
Every single device is subjected to a routine test at Carl Zeiss Microscopy GmbH in Oberkochen. A
certificate of this test is enclosed with the device (test certificate). The routine test refers to the
device in the delivered configuration.
The following points must be observed:
§ A notice is attached to the device, which indicates that X-rays are generated inside the micro-
scope.
§ Subsequent changes to the device by the user usually result in a new assessment of the de-
vice's classification with regard to the StrlSchG and StrlSchV. The user is responsible for com-
plying with the limit values prescribed in the StrlSchG and StrlSchV and the necessary check-
ing of the local dose rate after modifications.
Outside Germany, the user of the microscope has to comply with the local regulations of the
country where the microscope is operated.
Contact Radiation For questions regarding radiation protection, contact the ZEISS Radiation Safety Officer, Carl Zeiss
Protection AG, 73447 Oberkochen, Germany
phone: +49 (0) 7364 20 0
2.3.5 Thermal Hazards
Bakeout Parts of the enclosure in the upper range of the column may become hot during bakeout, particu-
larly after a long bakeout cycle.
§ Do not place any combustible objects on the grids of the electron optical column during bake-
out.
§ After the bakeout procedure, let surfaces cool down before working around the column.
§ Only advanced operators are allowed to perform the bakeout procedure.
2.4 Warning Labels and Lights

All parts of the Microscope System that may pose specific hazards are marked with additional
warning labels (pictograms) on the Microscope System. These warning labels indicate potential
hazards and form part of this document. They are to be kept in clean and easily legible condition.
Check all the mandatory warning labels for: Availability, Legibility, Correctness. Damaged or illegi-
ble warning labels must be replaced immediately. Always observe all warning labels!

2 Safety | 2.4 Warning Labels and Lights ZEISS
2.4.1 Warning Labels
Appropriate safety labels on the microscope warn operators of hazards. Each safety label is af-
fixed close to the point where a particular hazard exists. Several labels also provide legal informa-
tion.
Front Side of
Microscope
1
2
3
4
Rear Side of
Microscope
6
7

Gun Head
underneath
Cladding
Rear Side of Plinth
10
11
12
13
14
15
CEE Connector
16
The safety labels always need to be attached to the correct spots at the microscope. If a safety la-
bel is lost or unreadable, it needs to be reordered via the following reorder numbers:
Position and Figure of the Safety La- Description

bel
1 At the front of the chamber door. Risk of injury

Fingers could be trapped. Always close the cham-
CAUTION ber door before you move the stage.
Risk of injury
Reorder no. 347800-0033-000-02en
Fingers could be trapped.
Always close the chamber door
before you move the stage.
347800-0033-000-02en

2 Safety | 2.4 Warning Labels and Lights ZEISS

bel
2 At the front of the chamber door. Suffocation hazard

The specimen chamber is ventilated with gaseous
WARNING nitrogen.
Suffocation hazard
The specimen chamber is
ventilated with gaseous nitrogen.
Ensure that the area around the electron micro-
Ensure that the area around the
electron microscope is sufficiently
scope is sufficiently ventilated.
ventilated.
347800-0033-000-08en
Reorder no. 347800-0033-000-08en
3 At the front of the chamber door. Damage by collision

Collision of internal parts possible at short work-
ing distances.
Move the stage to a long working distance be-
fore opening the chamber door.
Reorder no. 344700-0033-000-06en
4 At the front of the chamber door. Risk of electrical shock by stage on bias volt-
age
Make sure the beam deceleration is switched off
before opening the chamber door.
Reorder no. 344700-0033-000-05en
5 At the front of the plinth Avoid injury

Make sure you have read and understood the in-
CAUTION
struction manual before operating this product.
Avoid injury
Make sure you have read and
understood the instruction
Reorder no. 347800-0033-000-01en
manual before operating this
product.
347800-0033-000-01en
6 At the rear of the microscope Magnetic field

Can be harmful to pacemaker wearers.
WARNING
Magnetic field
Pacemaker wearers stay back 30cm (12 in.).
Can be harmful to pacemaker
wearers.
Pacemaker wearers stay back
Reorder no. 360735-0000-034en
30cm (12 in.).
H6048/6063-NCWHPU
7 At the rear of the microscope Hazardous voltage inside

Contact may cause burn or electric shock. Only
WARNING authorized service Staff is allowed to service the
Hazardous voltage inside
Contact may cause burn or electric
equipment.
shock. Only authorised service
Staff is allowed to service the
equipment.
Disconnect power before opening.
347800-0033-000-03en
Reorder no. 347800-0033-000-03en
8 At the gun head Risk of electrical shock

Before opening the gun make sure mains power
is disconnected from the microscope.
Reorder no. 360400-0000-215


bel
9 At the gun head Risk of burn

Before opening the gun leave the gun and fila-
ment cool down for 15 minutes after switching
off the microscope.
10 At the rear side of the plinth Radiation hazard

Do not remove any parts.
Observe local safety and X-ray protection regula-
tions.
Service only through authorized personnel.
Reorder no. 347800-0033-000-06en
11 At the rear side of the plinth Caution

X-rays are produced in this Scanning Electron Mi-
croscope!
The acceleration voltage is limited to 30 kV.
Observe local safety and X-ray protection regula-
tions.
Order no. 346000-0088-000
12 At the rear side of the plinth Hazardous voltage inside

Contact may cause burn or electric shock. Only
WARNING authorized service Staff is allowed to service the
Hazardous voltage inside
Contact may cause burn or electric
equipment.
shock. Only authorised service
Staff is allowed to service the
equipment.
347800-0033-000-03en
Reorder no. 347800-0033-000-03en
14 At the rear side of the plinth High leakage current

Ensure proper grounding.
WARNING
Do not operate the electron microscope without
High leakage current
Ensure proper grounding. a separate ground connection.
Do not operate the electron
microscope without a separate
ground connection. Reorder no. 347800-0033-000-07en
347800-0033-000-07en
15 At the rear side of the plinth Risk of electrical shock

Residual voltage at the mains plug after unplug-
ging.
Wait at least 5 s after unplugging the mains plug
before touching the pins of the mains plug.
Reorder no. 344700-0033-000-11en

2 Safety | 2.5 Safety Devices and Interlocks ZEISS

bel
16 At the CEE connector Risk of electrical shock

Residual voltage at the mains plug after unplug-
ging.
Wait at least 5 s after unplugging the mains plug
before touching the pins of the mains plug.
Position and Figure of the Type Plate Description
13 At the rear of the microscope The Type plate contains a unique serial number,
the EVO model designation with the according
Carl Zeiss Microscopy GmbH part number, the manufacturing year, and the
73447 Oberkochen, Germany
mains voltage for which the EVO is configured,
Serial number either 230 VAC or 120 VAC.
EVO15
354900-9041-000 Manufactured in year 2017 Order no. 354900-9040-000 (EVO10)
1/N/PE 230 VAC
50 - 60 Hz max. 16 A Order no. 354900-9041-000 (EVO15)
Order no. 354900-9042-000 (EVO25)
Made in UK/GB
2.5 Safety Devices and Interlocks

In order to prevent injuries and/or property damage, the Microscope System is equipped with sev-
eral safety devices and interlocks. In case of defect or damage, the affected parts and the Micro-
scope System must be taken out of operation immediately and must be secured against uninten-
tional use.
To verifying the safety of the Microscope System, please contact your ZEISS service representative.
Please keep the service logs and logbooks.
2.5.1 Protective Cover Panels
Due to hazardous voltages and X-rays inside the microscope, the microscope is equipped with
protective cover panels.

ZEISS 2 Safety | 2.5 Safety Devices and Interlocks
Fig. 1: Protective cover panels
1 Electron optical column protective cover 2 Specimen chamber protective cover

panels panels
3 Plinth protective cover panels
Operation of the microscope is only allowed with attached protective cover panels.
2.5.2 Main Disconnect Device
To disconnect the microscope with all its components from the mains supply, unplug the CEE con-
nector (blue for 230 VAC, yellow for 120 VAC).
Fig. 2: CEE connector

If the Emergency Off (EMO) Option is installed, the Main Switch of the EMO Option may be used
as Main Disconnect Device for the microscope and its components, refer to Emergency Off (EMO)
Option External.
2.5.3 Circuit Breaker
The circuit breaker (F10) at the rear of the plinth will disconnect the mains power from the elec-
tronics in the plinth in case of an over-current (including the first pre-vacuum pump and PC). The
other circuit breaker (F11) disconnects mains power from the heaters and the second pre-vacuum
pump.
However, some other components will still be connected to mains power.

2 Safety | 2.5 Safety Devices and Interlocks ZEISS
Fig. 3: Circuit breaker

The circuit breaker does not completely isolate the plinth from the mains power. This can only be
done using the Main Disconnect Device.
2.5.4 Locking Devices
The microscope is equipped with several locking devices.
2.5.4.1 Column Interlock Device
The column interlock device switches off the EHT.

This interlock device was introduced at the end of 2010 and is not optionally available for older
EVO models.
Fig. 4: Column interlock device
2.5.4.2 Vacuum Locking Device
The vacuum locking device ensures that gun vacuum and system vacuum are better than the re-
quired thresholds.
2.5.4.3 Beam Deceleration Kit Interlock
Several hardware and firmware measures ensure a safe operation of the beam deceleration kit.
Before a stage bias potential can be applied, a vacuum switch is checked, the turbo pump signal is
checked and the CAN bus communication is checked.

ZEISS 3 Product and Functional Description |
3 Product and Functional Description

1
5
2
6
3
7
8
Fig. 5: Main components of the microscope
1 EVO electron optical column 2 Specimen chamber

Refer to Electron Optical Column
[} 27]
3 Plinth with ON/STANDBY/OFF buttons 4 Monitors
5 Control panel (optional) 6 Work desk
7 Dual joystick (optional) 8 Personal Computer (PC)
Optional A range of options and accessories is available for the microscope. Examples of available options
Components and and accessories are the following:
Accessories
Detectors Detectors for variable pressure applications
Refer to VPSE Detector [} 39], C2D Detector [} 42], and C2DX de-
tector
BSD detectors for high efficiency and angle selective material charac-
terization.
Refer to BSD Detector (HDBSD, BSD1) [} 43] and YAG BSD Detector
STEM detector for transmission imaging of ultrathin sections

Refer to STEM Detector [} 45]
CL detector for the analysis of cathodoluminscent materials

Refer to CL Detector [} 46]
Specimen Current Detector
Stage accessories Peltier Coolstage for imaging of hydrated specimens with the Ex-
tended Pressure (EP) mode
Refer to Hydrated Specimen [} 97]
Faraday cup
Refer to Measuring the Probe Current [} 81]
Further options Additional chamberscope, stubscope, and external navigation camera

3 Product and Functional Description | 3.1 Vacuum System ZEISS
Column maintenance kit, O-ring kit
Dual joystick for stage control and specimen navigation

Refer to Dual Joystick [} 47]
Control panel that allows direct access to the most frequently used
functions
Refer to Control Panel
Emergency Off Circuit

Refer to Emergency Off (EMO) Option External
Software add-ins and enhancements
For full details about the available options and accessories, contact your local ZEISS service repre-
sentative, or sales representative.
3.1 Vacuum System

Purpose For operation of the microscope, the gun head, the column, and the specimen chamber have to
be evacuated. The vacuum is essential to operate the gun and to prevent collisions of electrons
with gas molecules.
5
1
2 6
7
3
8
4
Fig. 6: Schematics of the vacuum system, high vacuum, pre-vacuum
1 Penning gauge 2 Turbo isolation valve (TIV)

EVO with variable pressure option only
3 Turbo pump 4 Pre-vacuum pump
5 Gun head 6 Specimen chamber
7 Chamber shut off valve (CSOV) 8 Vent valve
EVO with variable pressure option only
System Vacuum The pre-vacuum pump 4 and the turbo pump 3

evacuate the specimen chamber 6 .
The vacuum in the specimen chamber is measured by a Penning gauge 1 . The detected vac-
uum values are displayed as System vacuum in the SmartSEM user interface. As long as the de-
tected pressure in the specimen chamber is not ready for operation, the chamber shut off valve
(CSOV) 7 is closed in order to separate the specimen chamber from the column.

ZEISS 3 Product and Functional Description | 3.1 Vacuum System
Gun Vacuum In the gun head, a high vacuum is maintained by an ion getter pump. The vacuum in the gun
head is displayed as Gun vacuum in the SmartSEM user interface. It should be below
5 × 10⁻⁷ mbar.
Venting The specimen is located in the evacuated specimen chamber. To open the specimen chamber for
specimen exchange, you have to break the vacuum in a controlled manner. This is done by the
Vent command via the SmartSEM user interface or by pressing the Exchange push button on the
optional control panel.
When the Vent command is received, gaseous nitrogen flows into the specimen chamber via the
vent valve 8 . As soon as the pressure equilibrium is obtained, the chamber door can be
opened to change the specimen.
Evacuating In order to continue operation, the Pump command makes the pre-vacuum pump and the turbo
pump evacuate the specimen chamber.
As soon as the vacuum in the specimen chamber is ready for operation, the column chamber
valve opens and the EHT Vac ready message is displayed in the SmartSEM user interface. Gun
and EHT can be switched on.
Vacuum Modes The microscope can be operated in different vacuum modes:
§ High vacuum (HV) mode
§ Variable pressure (VP) mode (optional)
§ EasyVP mode (optional)
§ Extended pressure (EP) mode (optional)
System Vacuum in In HV mode, both gun and chamber are at high vacuum. The 20 μm or 30 μm mid-column aper-
HV Mode tures are used for the beam profile control. No pressure limiting aperture is mounted under the
objective lens.
HV mode provides the means to obtain higher resolution and enables using the SE detector.
HV mode is the regular operation mode for standard applications and is recommended for imag-
ing conductive specimens.
System Vacuum in The configuration of the microscope needs to be changed to enable variable pressure modes (VP,
Variable Pressure EasyVP and EP Mode), refer to Variable Pressure Modes [} 23].
Modes
3.1.1 Variable Pressure Modes
Variable pressure (VP) modes enable imaging specimens that are non-conducting, strongly
gassing, or hydrated, without the need for vapor deposition or other preparation procedures.
This is made possible by using a differential pumping system. A pressure-limiting aperture (differ-
ential pumping aperture DPA) is mounted under the objective lens, which allows partial pressures
above 10 Pa to be set in the specimen chamber while maintaining high vacuum in the gun area.
Three different pressure-limiting aperture configurations are available:
§ VP mode with 100 μm VP aperture
§ EasyVP mode with 400 μm EasyVP aperture
§ EP mode with 100 μm EP aperture and 500 μm or 1000 μm beamsleeve aperture.
The following table summarizes the hardware, applications and pressure ranges of the different
vacuum modes:
Mode Application Pressure-lim- Mid-col- Filament Min/Max

iting aper- umn aper- Pressure in
ture ture Pa
VP mode Charge com- 100 μm VP 750 μm W 10–400

pensation
LaB₆ 10–273*

Mode Application Pressure-lim- Mid-col- Filament Min/Max

iting aper- umn aper- Pressure in
ture ture Pa
EasyVP Charge com- 400 μm 20 μm LaB₆ 10–133

mode pensation EasyVP
+ Possibility
to switch to
HV mode
EP mode Charge com- 100 μm EP 750 μm W, LaB₆ 10–400

pensation + 500 μm
+ Improved beamsleeve
image qual-
ity
+ High accu-
racy EDS
analysis
Hydrated 100 μm EP 750 μm W, LaB₆ 10–3000

specimen + 500 μm
imaging beamsleeve
Hydrated 100 μm EP 750 μm W, LaB₆ 10–1000

specimen aperture
imaging + 1000 μm
beamsleeve
* If your microscope is a VP type instrument with the through-the-lens pumping option, then
the maximum pressure in VP mode can be increased to 400 Pa.
Tab. 3: Comparison of Vacuum Modes EVO
For all charge compensation methods, both, air and water vapor can be introduced into the
chamber as a charge compensating gas.
3.1.1.1 Variable Pressure Mode and EasyVP Mode
Purpose VP mode and EasyVP mode allow partial pressures above 10 Pa to be set in the specimen cham-
ber while maintaining high vacuum in the gun area.
22
3
4
5
Fig. 7: Vacuum system in VP or EasyVP mode, high vacuum, variable pressure

ZEISS 3 Product and Functional Description | 3.1 Vacuum System
1 Water vapor kit (de-ionized), can be ni- 2 Gun at high vacuum

trogen or air
3 Chamber at variable pressure 4 Single pressure-limiting aperture
mounted under the objective lens
Either 100 μm VP aperture or 400 μm
EasyVP aperture
5 Turbo Isolation Valve closed
VP Mode The 100 μm VP aperture is mounted under the objective lens. The 750 μm mid-column aperture is
Configuration used for imaging. The beam first goes through the mid-column aperture and then passes through
the VP aperture before landing on the specimen surface. In VP mode configuration, only the Nor-
mal and Analysis Optibeam modes can be used for imaging. It is possible to switch between HV
mode and VP mode when using this configuration. The maximum pressure that can be achieved
in the VP mode configuration is 400 Pa for EVO W systems, 273 Pa for EVO LaB₆ and EVO HD mi-
croscopes.
In VP mode configuration, focus wobble is not available.
EasyVP Mode The 400 μm EasyVP aperture is mounted under the objective lens. The 20 μm mid-column aper-
Configuration ture is used for beam control. In EasyVP mode configuration, the beam first goes through mid-col-
umn aperture and then passes through the EasyVP aperture before landing on the specimen sur-
face. The maximum pressure that can be achieved in the EasyVP mode configuration is 133 Pa for
all EVO series microscopes.
In the EasyVP mode configuration, Optibeam modes such as Resolution, Depth, and Analysis
modes can be used for imaging. It is possible to switch between HV mode and EasyVP mode and
the beam alignment is optimum in both conditions without adjusting any gun or column parame-
ters.
In this EasyVP mode configuration, focus wobble is available.
Function The residual gas atmosphere in the specimen chamber creates an interaction region of electrons
and residual gas molecules between the objective lens and the specimen. In this region, high-en-
ergy electrons in the primary electron beam hit the residual gas molecules and ionize them. The
ions generated in these collisions contribute to the compensation of negative charge on the speci-
men.
However, another effect of these collisions is to scatter the electron beam. This is called the “skirt
effect”. The electrons that are lost from the primary beam as a result of this effect provide only a
resolution-limited background signal for imaging purposes. Although it is possible to tolerate
these leakage losses at chamber pressures up to a few hundred Pa, it is necessary to carefully se-
lect and control the important factors such as acceleration voltage, chamber pressure, and beam
path. The signal-to-noise ratio in variable pressure mode can also be improved via the noise re-
duction features of SmartSEM. For details refer to the Software Manual SmartSEM.
Fig. 8: Non-conducting specimen imaged with an acceleration voltage of 20 kV and a 30 μm aperture. Left: High vac-
uum (HV) mode, showing strong charging effects. The electron beam is distorted and high-quality imaging is not pos-
sible. Right: VP mode at 21 Pa. Charges are completely compensated, allowing easy imaging of the specimen.

3.1.1.2 Extended Pressure Mode
Purpose Extended Pressure (EP) mode is required for imaging hydrated specimens. This will enable the
study of hydrated specimens in their native state with little or no loss of water in the microscope
(the specimen is kept fully hydrated during the pump down). This pressure mode is typically used
with a Peltier coolstage.
3
4
5
1
Fig. 9: Extended pressure mode, high vacuum, extended pressure
1 Pre-vacuum pump directly pumping the 2 Gun at high vacuum

chamber
3 Chamber at extended pressure 4 Two pressure-limiting apertures
mounted under the objective lens:
100 μm EP aperture
Either 500 μm or 1000 μm beamsleeve
aperture
5 Isolation valve closed
When the microscope is configured for EP mode, the 750 μm mid-column aperture is used and
the 100 μm EP aperture is mounted under the objective lens in combination with one of the
beamsleeves apertures (500 μm or 1000 μm).
For achievable pressure ranges, refer to Variable Pressure Modes [} 23].

ZEISS 3 Product and Functional Description | 3.2 Electron Optical Column
3.2 Electron Optical Column

Purpose The EVO column is the area of the microscope, where electrons are emitted, accelerated, de-
flected, focused, and scanned.
1
2
7
8
Fig. 10: Schematics of the electron optics
1 W or LaB₆ filament 2 Gun alignment and emission display

coils
3 Double condenser system 4 Mid-column aperture changer
5 Scanning and stigmator coils 6 Objective lens with through-the-lens
pumping
7 Backscattered Electron Detector (BSD) 8 Specimen
or optional High Definition Backscat-
tered Electron Detector (HDBSD)
Gun A filament serves as gun 1 .The filament is heated by applying the filament current. The heated
filament emits electrons.
EHT The acceleration voltage (UEHT) accelerates the emitted electrons.
Gun Alignment The gun alignment and emission coils 2 center the electron beam.
and Display Coils
Condenser A double condenser system 3 allows the continuous regulation of the probe current.
Apertures The electron beam passes through the currently selected aperture in the mechanical mid-column
aperture changer 4 to ensure that the optimum quality of beam is maintained.
The design of the aperture changer allows for using 4 apertures. Three apertures are fitted as
standard (positions 0–2). The position of each aperture is marked on the mid-column aperture
changer.

3 Product and Functional Description | 3.2 Electron Optical Column ZEISS
Fig. 11: Mid-column aperture changer
Position Aperture diameter Typical application
0 750 μm Optional VP mode (with 100 μm VP aperture)

Optional EP mode (with 100 μm EP aperture)
1 30 μm HV mode
2 20 μm HV mode
Optional EasyVP mode (with 400 μm EasyVP
aperture in combination with a beamsleeve
aperture)
3 Apertures can be fit-

ted as an option
Stigmator The stigmator coils 5 compensate for astigmatism so that the electron beam becomes rota-
tionally symmetrical.
Deflection System The electron beam is focused by the objective lens 6 onto the specimen 8
while being de-
flected in a point-by-point scan (raster scan) over the specimen surface by the scanning coils 5
.
Signal Detection When the primary electron beam hits the specimen, certain interaction products are released,
which can be recorded by specific detectors, e.g. the BSD detector 7 . For more information
refer to Principle of Signal Detection [} 30].

ZEISS 3 Product and Functional Description | 3.3 Detectors
3.2.1 Optibeam Modes
The EVO column offers the following Optibeam modes:
Analysis mode Field mode Resolution Depth mode Fisheye mode

mode
The specimen A larger field of Smallest probe Largest depth Largest field of
remains in focus view for naviga- diameter for a of field for a view for naviga-
for any change tion and a large chosen probe chosen probe tion and a very
in probe cur- depth of field. current at any current, at any large depth of
rent. working dis- working dis- field.
tance or accel- tance or accel-
eration voltage. eration voltage.
Tab. 4: Optibeam modes and their beam paths
3.3 Detectors
This chapter describes the generation of secondary and backscattered electrons, and describes
how the detector types, that are available for use with the microscope, use these electrons to pro-
vide imaging, topographical, and other information. It also lists some characteristics of each de-
tector type.
For more information about any of the detectors, contact your local ZEISS service representative.

3 Product and Functional Description | 3.3 Detectors ZEISS
3.3.1 Principle of Signal Detection
When a primary electron (PE) beam hits a specimen, certain electron beam interaction processes
occur. The interaction products most frequently used for the generation of images in scanning
electron microscopy are secondary electrons (SEs) and backscattered electrons (BSEs).
Specific types of detectors are able to detect the SEs and BSEs. The detector signals can be used
to create images and produce information about the properties of the specimen.
Fig. 12: Interaction between primary electron beam and specimen
1 Objective lens 2 Interaction volume

3 Specimen
6
7
Fig. 13: Interaction between primary electron beam and specimen
1 Primary electrons 2 Auger electrons

3 Secondary electrons 4 Backscattered electrons
5 Characteristic X-rays 6 Continuum X-rays

7 Fluorescent X-rays
Primary Electrons Primary Electrons (PEs) are electrons forming the scanning beam before hitting the specimen.
Secondary Secondary electrons are emitted from the topmost layer of the specimen.
Electrons § SE1 Electrons
Electrons emitted at the point of impact between the beam and the specimen are known as
SE1 type electrons. The amount of electrons emitted at the point of impact is related to the
shape of the specimen.
Secondary electron detectors, such as the InLens SE detector, collect SE1 type electrons from
the surface layer of the specimen and are thus ideal for displaying surface structures.
§ SE2 Electrons
The emergence of backscattered electrons from the specimen excites further emission of sec-
ondary electrons. These are known as SE2 type electrons.
Detectors that collect SE2 type electrons are especially suitable where the working distance is
large. Surface detail as the effect of “lateral illumination” emphasizes the topography of the
specimen.
Backscattered All electrons with energy higher than 50 eV are known as backscattered electrons (BSEs). BSEs are
Electrons generated by elastic scattering in a much deeper range of the interaction volume (up to 1 µm) and
carry depth information. The backscatter coefficient increases with increasing atomic number of
the elements within the specimen. This allows the BSE detector to generate atomic number con-
trast, or compositional contrast images.
Fig. 14: Backscattered electron coefficient against atomic number

BSE detectors are used to display the materials contrast because the backscatter coefficient is de-
pendent on the mean atomic number of the material under investigation.
Transmitted This comprises primary electrons that are transmitted through an ultrathin specimen and weakly
Electrons scattered primary electrons with a small range of angles. Depending on the material, primary elec-
trons are scattered under different angles and can be detected by a STEM detector placed below
the specimen. Unscattered electrons are detected in the center of the STEM detector and give a
bright field image. Electrons scattered under higher angles are detected by outer areas of the
STEM detector and produce dark field images.
Cathodoluminesce Electrons impacting on luminescent materials cause the emission of photons (Cathodolumines-
nce cence, CL) which may have wavelengths in the visible spectrum and can be imaged by specialized
detectors.

3.3.2 Detectors Overview
The beam scans the specimen and initiates particles to be emitted. A detector collects the emis-
sion and produces an electric signal with an amplitude proportional to the number of particles at
any given time.
Standard Detectors Detected Signals Typical Application
SE Detector [} 33] SE2 Topography

Everhart-Thornley type Surface structure
Compositional contrast
Optional Detectors Detected Signals Typical Application
VPSE Detector [} 39] SE2 Variable pressure

on VP systems only Topography and surface
structure in VP mode
C2D Detector [} 42] Measures the current that re- Variable pressure
on VP systems only sults from the ionization of Topography and surface
gas by SEs structure in VP mode
C2DX Detector Measures the current that re- Extended pressure

on VP systems only sults from the ionization of Imaging of biological speci-
gas by SEs mens in a fully hydrated form
BSD Detector (HDBSD, BSD1) BSE Topography (crystal orienta-

[} 43] tion)
Compositional contrast
YAG BSD Detector BSE Compositional contrast
STEM Detector [} 45] Transmitted electrons Transmission imaging of ul-

Scanning Transmission Elec- trathin sections in biological
tron Microscopy detector and mineralogical examina-
tions
CL Detector [} 46] Light photons Mineralogy

Cathodoluminscence detec-
tor
Specimen current detector Absorbed electrons Electron beam induced cur-

(SCD) rent (EBIC)
Wavelength dispersive X-ray X-ray Materials elemental composi-

detector (WDX) tion evaluation
Energy dispersive X-ray de- X-ray Materials elemental composi-

tector (EDX) tion evaluation
For more details, refer to the document Product Specification of the microscope.

3.3.3 SE Detector
Purpose The SE detector is an Everhart-Thornley type detector. It detects SEs as well as BSEs.
Position The SE detector is mounted on the wall of the specimen chamber, and is therefore classified as a
“chamber detector”. Due to its position in the chamber, the SE detector views the specimen later-
ally.
11
3
4
Fig. 15: Schematics of the SE detector
1 Objective lens with through-the-lens 2 SE detector

pumping
3 Collector grid 4 Specimen
Function Electrons moving to the detector are attracted/repelled by the collector grid and directed to the
scintillator. The electrons gain energy from the scintillator and thus are able to interact with a
phosphor layer, which generates photons (light). The light travels up a light pipe to a photomulti-
plier. The photomultiplier multiplies the flashes of light and outputs a signal that can be used for
imaging.
The collector voltage can be varied in the range between −250 V and +400 V.
A positive collector voltage generates an electrical field in front of the detector, thus directing the
low energy SEs towards the scintillator.
A negative collector voltage generates a field deflecting the low energy SEs so that they cannot
reach the scintillator and do not contribute to the signal. Only high-energy BSEs reach the scintil-
lator contributing to the image generation. This produces a pseudo-backscattered image, which
shows pronounced material contrast, but largely cancels surface properties and topography.
Fig. 16: Comparison of SE detector images using positive and negative collector bias voltage: SE detector using
+300 V collector bias: Good display of surface structures and topography (left), SE detector using –150 V collector
bias: Extremely strong topography, including shadow generation (right)

§ Positive collector bias voltage

When using a positive collector bias voltage, surfaces that are tilted in the direction of the de-
tector are emphasized, but there are no shadowing effects.
§ Negative collector bias voltage
When using a negative collector bias voltage, the image shows enhanced topographical con-
trast, which arises mainly from the extreme shadowing effects. However, the fine surface de-
tails are less visible.
Info
For all standard applications, the collector bias should be set to +300 V.
Surface images that show enhanced topographical information can also be generated using
BSE detectors, but they do not show the shadows that can be created using the SE detector.
Applications Unlike the InLens SE detector, which can be used only with acceleration voltages up to 20 kV, the
SE detector can be used in the complete high-voltage range.
Fig. 17: Comparison of surface information at different acceleration voltages: Acceleration voltage = 1 kV: Good, sur-
face-sensitive imaging (left); Acceleration voltage = 10 kV: Thin layers are not seen (right)
Fig. 18: Comparison of surface information at different acceleration voltages: Acceleration voltage = 5 kV: Good, sur-
face-sensitive imaging (left); Acceleration voltage = 15 kV: Transparent surface caused by increased penetration
depth (right)
The working distance has a significant effect on the efficiency of the SE detector. Shadowing ef-
fects occur when the working distance is too short. If the specimen is too close to the objective
lens, most of the electrons will be deflected by the field of the electrostatic lens or move to the
objective lens itself. This means they cannot be detected by the SE detector.
Depending on the specimen material and on the specimen geometry, a minimum working dis-
tance of approximately 4 mm should be used. Extreme signal loss is likely to occur if shorter work-
ing distances than this are used. Conversely, the SE detector is very good when used for imaging

at long working distances. This is particularly important for low magnification imaging that is nec-
essary for adjusting the orientation of the specimen holder or locating a specific area on the speci-
men.
Optimal Initial The following settings provide a good field of view for navigating on the specimen at low magni-
Settings fications:
§ Initial working distance in the range of 10 mm to 20 mm.
§ Acceleration voltage of approximately 10 kV.
The imaging conditions can be readjusted for a desired application after identifying the area of in-
terest on the specimen.
Fig. 19: Field of view at different working distances: The smallest possible magnification depends on the working dis-
tance: Field of view at 30 mm WD: Reasonably good signal-to-noise ratio, minimum magnification levels can be set
(left); Field of view at 5 mm WD: Limits exist on the lowest magnification setting possible (right)
Although images produced by the SE detector always include some backscattered electron com-
ponents, most of the signal is generated by the secondary electrons and the fraction of backscat-
tered signal is negligible. The images obtained by the SE detector are therefore primarily sec-
ondary electron images.
Fig. 20: Comparison of material contrast using SE/BSE detectors on a polished specimen: WD = 5 mm using SE detec-
tor: Material contrast is very poor (left); WD = 9 mm using BSE detector: Clear image showing good material contrast
(right)
In the previous figure the SE image taken at 5 mm working distance shows relatively poor mate-
rial contrast. In this example the reduced yield of secondary electrons is caused by the specimen
preparation technique of polishing the specimen surface. The ratio of SE to BSE electrons is there-
fore altered in favor of backscattered electrons.
Because the SE detector is mounted on the chamber at a certain angle to the specimen, the speci-
men is always viewed laterally. The SE detector, therefore, provides good surface information. All
other detectors (InLens SE and BSE) view the specimen from above, providing only limited infor-

mation about the topography of the specimen. Surfaces tilted towards the detector provide more
surface detail with brighter edges; specimens tilted away from the detector display shadowing ef-
fects and less surface detail.
Fig. 21: Comparison of topographic contrast – SE/BSE detectors on a fracture surface: SE detector: Image with large
depth of field (left); BSE detector: Good material contrast but with limited topographical detail (right)
Some imaging applications require both, compositional and topographical details. The generation
of mixed SE and BSE images is recommended for such applications. The signal mixing option is
available in the Detectors tab in the SEM Controls panel.
Tilting the specimen increases the signal in the SE detector and sometimes improves the topo-
graphical information. Tilting the specimen towards the SE detector also results in a change of the
solid angle in which both the backscattered and secondary electrons are emitted from the speci-
men.
Parameter Description
Acceleration voltage
0.02 kV to 30 kV In principle suitable for the entire high-voltage range
1 kV to 5 kV Low-voltage applications for the compensation of charges and for
surface-sensitive imaging
5 kV to 20 kV The average voltage range is suitable for many different applications
20 kV to 30 kV Voltage range frequently used for analytical purposes
Working distance
≥ 4 mm If the working distance is too short, shadowing effects occur which
diminish the efficiency of the detector. Below 20 kV, the SEs are ab-
sorbed by the field of the electrostatic lens
4 mm to 6 mm For low-voltage applications (1 kV to 5 kV)
6 mm to 12 mm Useful for the average voltage range (5 kV to 20 kV)
12 mm to 30 mm Recommended only for low magnifications and to increase the depth
of field
Collector voltage
300 V Standard value of the collector voltage
0 V to 400 V Variation of the collector voltage at high magnifications to obtain the
mixed signal
−150 V to 0 V For pseudo-BSE images

Aperture
30 μm The standard aperture is recommended for many applications
20 μm Recommended for high magnification and high resolution imaging
750 μm For VP/EP mode only
Specimen tilt Tilting the specimen towards the detector increases collection effi-
ciency
Operation mode Only suitable in high vacuum
3.3.4 Chamber CCD Camera
Purpose The microscope contains a CCD camera (charge-coupled device camera) inside the specimen
chamber. It is referred to as the chamber CCD camera or chamberscope. It allows you to monitor
the position of the specimen stage and particularly the distance between the objective lens and
the specimen holder.
Position The default location of the chamber CCD camera is at the front of the specimen chamber. Other
positions are available optionally.
Fig. 22: Sample image from chamber CCD camera.
1 Objective lens 2 Specimen holder
NOTICE
Risk of collision
Use the chamber CCD camera to monitor the position of the specimen holder during stage
movements. Pay particular attention to the distance between the objective lens and the top of
the specimen. This applies to vertical movements, but also to horizontal movements, because a
thick specimen may collide with the objective lens from the side.
Function The chamber CCD camera has two illumination modes. The chamber can be illuminated either
with white light or with infrared light. Infrared light gives a grayscale image, whereas white light
gives a color image. In standard settings the mode is automatically selected, depending on the
imaging mode and the selected detectors. White light limits the performance of most detectors.
Therefore infrared illumination is a fallback if white light cannot be used. The performance of
diode detectors is negatively affected by infrared light. If a diode detector is selected, then by de-
fault the chamber CCD camera is disabled. The automatic selection of the illumination mode can
be manually overwritten by the user.

3 Product and Functional Description | 3.4 Specimen Stage ZEISS
Info
It is highly recommended that the CCD illumination control is set to Auto Detect. This avoids
any problems by the user forgetting to switch the illumination back for a different detector.
Fig. 23: Chamber CCD camera disabled as indicated by a pause sign (e.g. if a diode detector is
selected).
3.4 Specimen Stage

Purpose The 5-axes motorized Cartesian specimen stage is used to navigate the specimen inside the speci-
men chamber.
Position The specimen stage is mounted on the chamber door. If the chamber door is closed, the speci-
men stage is inside of the specimen chamber.
11
22
Fig. 24: Specimen stage with dovetail fitting for precise fitting
1 Specimen holder 2 Specimen stage
Function The stage can be operated using the dual joystick or using the SmartSEM software.
Axis Description Movement
X X-axis Movement towards or away from the cham-

ber door (horizontal movement in the image)
Y Y-axis Movement to the left or right seen from the

chamber door (horizontal movement in the
image)
Z Height Vertical movement (movement towards or

away from the focal plane of the image)

ZEISS 3 Product and Functional Description | 3.5 Optional Components and Accessories
Axis Description Movement
R Rotation Stage rotation parallel to the X-Y plane
T Tilt Stage tilt about an axis parallel to the X axis
The focus on the stage is not maintained when the specimen is tilted. This can be compensated
for by using the Compucentric function in SmartSEM.
3.5 Optional Components and Accessories
3.5.1 Optional Detectors
3.5.1.1 VPSE Detector
Purpose The Variable Pressure Secondary Electron (VPSE) detector is a specific type of SE detector for use
in Variable Pressure mode where a standard SE detector cannot be used. The VPSE detector is not
usable and will not operate in HV mode.
The Variable Pressure mode enables analyzing and imaging of non-conducting specimens without
charging artefacts. This is possible, because positively ionized gas molecules stabilize local charg-
ing. Variable Pressure mode can also be used for strongly gassing or moist specimens without any
need for specimen preparation.
Fig. 25: Schematics of the VPSE detector
1 VPSE detector
The images that are created with the VPSE detector are similar to images that are created with
conventional SE detectors.

3 Product and Functional Description | 3.5 Optional Components and Accessories ZEISS
Fig. 26: VPSE images, eye shadow (left), kitchen sponge (right)

On the surface of the specimen, secondary electrons are created. The secondary electrons acceler-
ate towards the VPSE detector due to the bias voltage that is applied to the collector of the VPSE
detector. On their way to the detector, the secondary electrons collide with residual gas mole-
cules (nitrogen, air molecules, or water). The collisions ionize the residual gas molecules and cre-
ate additional electrons. These additional electrons also accelerate towards the detector and col-
lide with further gas molecules, which are ionized.
The result is an “ion cascade” that amplifies the original SE signal and that creates photons as a
secondary product. The VPSE detector does not use the SEs themselves as a signal, but it uses the
photons that are created by the “ion cascade”.
Chamber Pressure For an optimum use of the VPSE detector, the pressure in the specimen chamber must be high
enough. If the pressure is too low, then too few gas molecules are present and the collision prob-
ability is too low. This reduces the efficiency of the detector.
The optimum chamber pressure depends on the specimen and the operating parameters. It is usu-
ally in the range between 20 Pa and 60 Pa.
Info
If the chamber pressure rises, then the scattering of electrons is increased and the resolution of
the microscope is reduced.
Try to find the optimal chamber pressure for each individual application.
Dwell Time The dwell time is the amount of time that the electron beam stays at one position on the speci-
men before it moves to the next position.
If the dwell time is too short (i.e. the scan rate is too fast), then there is not enough time for an
“ion cascade” to develop and to create the imaging photons. This reduces the efficiency of the
detector.
If the dwell time is too long (i.e. the scan rate is too slow), then the electron beam delivers a large
amount of energy to each individual spot on the specimen. This may result in charging artifacts on
the images.
The optimal dwell time depends on the specimen and needs to be determined by experiment.
Info
To reduce charging effects, use the Frame Averaging function of SmartSEM. Use fast scan
speeds and increase the number of frames (N).
Collector Bias The collector bias corresponds to the voltage that is applied to the VPSE collector. The collector
bias accelerates the secondary electrons from the specimen surface towards the VPSE detector.
Typical VPSE collector bias values are between 50 % and 80 %.
If the collector bias is too low, the efficiency of the detector is reduced.

If the collector bias is too high, the VPSE detector may receive too much signal and may get satu-
rated. In this case, very bright lines are visible on the image in periodic intervals and proper imag-
ing is no longer possible. Whether a given value for the collector bias is too high, depends on the
specimen, the acceleration voltage, the probe current, and the pressure in the specimen chamber.
Fig. 27: Saturation of the VPSE detector. Bright lines become visible in the microscope image
To eliminate the bright lines in the images, either reduce the collector bias or reduce the chamber
pressure. However, the detector efficiency is reduced by either of these adjustments. You need to
find the optimum parameters for imaging different specimens. It is generally better to reduce the
collector bias, because reducing the chamber pressure can cause new charging effects.
Fig. 28: Charge compensation by adjusting chamber pressure and collector bias. Left: Reducing the collector bias
from 82 % to 78 % results in the elimination of banding effects at 40 Pa. Right: Reducing the pressure in the speci-
men chamber from 40 Pa to 20 Pa results in the elimination of banding effects at a collector bias of 79 %.
Acceleration voltage
3 kV to 30 kV Possible application range for VPSE G4 detector. However, sufficient

contrast can be obtained only at higher voltages.
3 kV to 7 kV Low voltage application with VPSE G4 detector.
7 kV to 25 kV Standard application for VPSE G4 detector.
Working distance
6 mm to 8 mm For low voltage applications (3 kV to 7 kV)
8 mm to 15 mm For standard applications (7 kV to 25 kV)
Aperture

30 μm The standard aperture is recommended for many applications.
7.0 μm to 20 μm With these apertures, the probe current is frequently too low to ob-
tain a sufficient signal-to-noise ratio and the required contrast.
60 μm Higher probe currents frequently improve the contrast.
120 μm Only recommended for analytical applications.
Specimen tilt Avoid large angles of tilt, if possible. Slight tilting can improve effi-
ciency.
Operation mode The VPSE G4 detector is used mainly in the VP mode.

As the VPSE G4 detector detects light, it can be used as a simple
cathodoluminescence (CL) detector in high-vacuum mode.
3.5.1.2 C2D Detector
Purpose The cascade current detector (C2D) is a special type of detector that you can use instead of the SE
detector to create a secondary electron image under variable pressure conditions.
The SE detector cannot be used under variable pressure conditions: The high potential at the scin-
tillator would cause an electrical breakdown with a lightning flash that runs from the scintillator
to the outer body.
Fig. 29: C2D image of radiolaria

Function On the surface of the specimen, secondary electrons are created. The secondary electrons acceler-
ate towards the C2D detector due to the potential that is applied to the detector electrode.
On their way to the detector, the secondary electrons collide with residual gas molecules (nitro-
gen, air molecules, or water). The collisions ionize the residual gas molecules and create additional
electrons, as well as cations. The additional electrons also accelerate towards the detector and
collide with further gas molecules, which are ionized.
The result is a charge cascade that amplifies the original SE signal by a factor of up to 1000.
The electrons that result from the charge cascade are all collected by the electrode of the C2D de-
tector and the current is further amplified by the detector.
The cations that result from the charge cascade neutralize any negative charge on the specimen
that may have been created by the primary electron beam.

3.5.1.3 BSD Detector (HDBSD, BSD1)
Purpose The BSD is a semiconductor backscattered electron detector with exceptionally high sensitivity.
The detector consists of five diode segments, independently configurable. The BSD1 detector of-
fers faster speed and enhanced sensitivity, compared to the HDBSD detector. The BSD1 detector
is required for quantitative applications such as 3DSM.
Fig. 30: BSD detector with five segments in real life (left) and in SmartSEM (right)
In combination with low incident beam energies, the BSD detector can visualize very fine surface
details in high contrast.
Fig. 31: BSE images showing different contrast with different segment configuration of the BSD
detector; material contrast (left) and topography (right)
NOTICE
Motorized specimen stage
Risk of damaging the detector when operating the motorized specimen stage.
4 Retract the detector head completely after you have finished the work with the detector.
Info
Risk of malfunction: The diode segments are sensitive to the light that is used for illumination
in TV mode (infrared and white).
When you use a diode detector, always make sure that the TV illumination is switched off. If
the CCD Mode is set to Auto Detect, then the TV illumination is automatically switched off
when a diode detector is used.
The BSD detector has applications mainly in materials analysis and in the life sciences.
Material analysis:
§ Metallurgical sections
§ Geological sections
§ Complex materials

§ Printed circuit boards

§ Semiconductors
§ Bond pads
Life sciences:
§ Mineral deposits in plant structures
§ Biological sections
§ Bone structures
Another type of BSD detector is the YAG BSD. For more information on this detector, refer to
YAG BSD Detector.
Function On the surface of the specimen, some of the primary electrons are backscattered. The backscat-
tered electrons then move towards the silicon segments of the BSD detector. If the energy of the
backscattered electrons is high enough, then the electrons pass through the very thin dead layer
of the diode and create electron-hole pairs in the silicon segments.
In each individual segment, the charge separation due to the electron-hole pairs is measured as a
current, which is used as a signal for image generation. Only electrons that have an energy high
enough to create electron-hole pairs can contribute to image generation. Electrons that have a
lower energy (e.g. secondary electrons) are not detected by the BSD detector.
The emission of backscattered electrons from a specimen is related to the atomic number of the
involved material: Elements with high atomic numbers generate more backscattered electrons (i.e.
the backscatter coefficient is higher). When imaging, regions that contain elements with higher
atomic numbers appear brighter. Regions that contain elements with lower atomic numbers ap-
pear darker.
Since the detector has a limited speed, it is recommended to use scan speed 6 or higher (slower),
especially at small magnifications. The lower the gain is, the faster is the detector.
3.5.1.4 YAG BSD Detector
Purpose The YAG BSD detector is a scintillation type detector for backscattered electrons.
The YAG BSD detector has a high sensitivity and is specifically designed for high speed imaging.
It can be used in HV mode and in VP mode.
Function The YAG BSD detector uses yttrium aluminum garnet (YAG) as a fast scintillation material that is
mechanically and chemically resistant. Since it is a scintillation type detector, the YAG BSD detec-
tor does not have segments with changeable polarity and you can only use this detector for com-
position imaging. In comparison to segment based BSD detectors, the YAG BSD detector has a
faster response time.
Fig. 32: YAG BSD detector

Fig. 33: YAG BSD image of sandstone
3.5.1.5 STEM Detector
Purpose The optional STEM (Scanning Transmission Electron Microscopy) detector is an electron detector
that can be used to detect transmitted and scattered electrons underneath an ultrathin specimen.
The STEM unit consists of a pre-aligned specimen holder and a Bright-field STEM detector, which
is a diode detector for electrons.
Position The pre-aligned holder fits directly on the specimen stage and carries the specimen.
Fig. 34: Schematics of the STEM detector
1 STEM specimen holder 2 Bright-field STEM detector
In variable pressure mode, the STEM detector enables you to explore the nanostructure of non-
conducting specimens.

Info
Risk of malfunction: The diode segments are sensitive to the light that is used for illumination
in TV mode (infrared and white).
When you use a diode detector, always make sure that the TV illumination is switched off. If
the CCD Mode is set to Auto Detect, then the TV illumination is automatically switched off
when a diode detector is used.
Function To improve resolution, the STEM unit enables positioning of the thin specimen close to the objec-
tive lens. The collected signals are equivalent to bright field imaging.
The STEM detector is used in cases where the thickness of a specimen is similar to or less than the
dimensions of the interaction volume. The specimen must be mounted on a TEM grid with a thin
carbon-film support (approximately 10 nm thick). Electrons that pass through the target can then
be collected by the detector and used to form an image.
3.5.1.6 CL Detector
Purpose The Cathodoluminescence (CL) detector is an inclined detector that allows efficient visible or ultra-
violet light collection. The CL detector is ideal for use in geology, mineralogy, and materials sci-
ence applications where it can help in internal structural examination of rocks, ceramics, and
semiconductors.
Function The prerequisite for using this detector is that the specimen emits light when interacting with the
primary electron beam. Differences in crystal structure or the presence of impurities in a cathodo-
luminescent material result in variations in the energy gap between the filled valence bands and
the empty conduction bands, and consequently a change in the CL emission.
The light (photons) emitted by the specimen is collected by the CL detector and converted into a
signal for imaging.
The CL detector is fully integrated into the automatic brightness and contrast control of the micro-
scope and can be used simultaneously with any of the detectors without degrading their perfor-
mance.
The detector can be used during energy-dispersive X-ray spectrometer (EDX) measurements and
wavelength-dispersive spectrometer (WDS) measurements at any valid magnification.
Fig. 35: CL image of sandstone

3.5.2 Dual Joystick
Purpose The dual joystick is used for stage control and specimen navigation.
Position The dual joystick is placed on the microscope desk.
1 2 3
Fig. 36: Dual joystick
1 T/Z joystick 2 Break push button

Controls the Z axis and the stage tilt (T). Stops the stage in an emergency.
3 X/Y/R joystick
Controls the X- and Y-axes and the
stage rotation by turning.
Function All axes are deflection-compensated. When the joystick is moved only slightly, the respective axis
moves slowly. Larger movements of the joystick result in a faster movement of the stage.
The X-, Y-, and Z-axes are magnification-compensated. When working at a low magnification, the
stage moves relatively fast. At higher magnifications the stage movement is slower. The stage is
moving with its maximum speed when viewing the specimen with the CCD (Charge Coupled De-
vice) camera.
The different axes can also be moved simultaneously.

3.5.3 Control Panel
Purpose The control panel allows direct access to the most frequently used functions. It integrates a full
sized keyboard, 11 turning knobs, and 8 push buttons.
Info
The control panel facilitates daily routine tasks. All the functions can be applied by using the
mouse and by macro execution also.
Position The control panel is placed on the work desk.

1 2 3 4 5
6 7 8 9 10 11
Fig. 37: Control panel
1 Stigmator X | Stigmator Y
Shapes the beam roundness by changing the stigmation deflectors.
2 Aperture X | Aperture Y
Adjusts the mid column shift and tilt deflectors for aligning the beam along the column
axis.
3 Scan Rotate
Rotates the scanning pattern 360° continuously.
This turning knob has a push button function to deactivate the scan rotate function and
reset the scan rotation to 0°.
4 Shift X | Shift Y
Shifts the scanned region of the specimen in the X and Y directions.
5 Brightness | Contrast
§ Brightness
Adjusts the image acquisition chain offset for the currently selected detector. Each
configured detector stores its own brightness.
§ Contrast
Adjusts the gain of the currently selected detector.

6 Magnification | Reduced
§ Magnification
Adjusts the magnification of the system.
§ Reduced
Changes the scan field to a reduced area. The size of the area is determined by the
current sub scan area settings.
7 Wobble
Sweeps the acceleration voltage. If the aperture is slightly misaligned, a shift in X and/or
Y direction can be observed.
8 Freeze
Stops the scan and grabs one complete frame at the current imaging conditions.
9 Exchange | Resume
§ Exchange
Starts the pre-defined macro for specimen exchange with the airlock.
§ Resume
Starts the pre-defined macro to finish specimen exchange with the airlock.
10 Camera
Switches to chamber view.
11 Focus | Scan Speed +/−
§ Focus
Changes the focal point of the column by adjusting the magnitude of the objective
lens.
§ Scan Speed +/−
Increases (+) or decreases (−) the scan speed by doubling or halving the beam dwell
time with each click step.

3 Product and Functional Description | 3.6 Software Description ZEISS
3.6 Software Description
3.6.1 SmartSEM User Interface
The SmartSEM software graphical user interface (GUI) allows you to monitor and operate most of
the active components of the microscope.
The following screenshot indicates the main elements of the SmartSEM user interface:
1 2 3 4 5
12 11 10 9 8 7 6
Fig. 38: Screen layout of the user interface
1 Title Bar
Displays the name of the user interface and the logged-on user.
2 Menu Bar
Enables you to access SmartSEM features via sub-menus.
3 AVI Toolbar
Contains the controls to set up, record, and playback video sequences of scanned images.
4 Toolbar
Provides quick access to SmartSEM tools.
5 Image Area with Data Zone
Displays image information and acquisition parameters from the microscope.
6 Thumbnails Panel

ZEISS 3 Product and Functional Description | 3.6 Software Description
Displays thumbnail views of the contents of the eight image buffers.

7 Status Bar
Displays the current machine state and contains the SEM Control Buttons.
8 Data Zone
Displays image information and acquisition parameters from the microscope.
9 Annotation Bar
Enables you to add information to the SEM image and provides several measurement
functions.
10 Panel Configuration Bar
Enables you to choose the panels to be placed in the Docking Panel.
11 Docking Panel
Enables you to arrange frequently used SmartSEM panels for convenient access.
12 Mini Bar
Provides quick access to recently used dialogs and to the recipe management.
3.6.2 Graphical Control Elements
The following graphical control elements are used in the SmartSEM GUI.
Screenshot Control Function

Element
Tab Provides a group of graphical control elements.
Section Forms a group of control elements with related

functions.
Button Enables you to start an action.
Check- Enables you to activate or deactivate a function.

box
Drop- Enables you to select the desired element.

down list
Radio Enables you to activate the desired option.

button
Scroll bar Enables you to adjust a value by moving the scroll

bar or pressing the arrow button until the desired
value is set.
Readout Displays the status of a system entity.

Screenshot Control Function

Element
Enables you to select an action or a value by

opening a dialog with an input field.
Input Enables you to enter the desired value.

field
Progress Displays the progress of an action.

bar
Slider Enables you to adjust the corresponding function.
Naviga- Provides visual indication of the range and current

tion box value of one- and two-dimensional parameters
such as Beam Shift or Stigmation.
3.6.3 User Access Levels and User Privileges
The user access level defines which parameters are displayed for selection purposes, e.g. in the
status window or annotation parameter selection.
SmartSEM distinguishes different user access levels. Depending on the user access level, different
parameters are accessible. User profiles are defined by the administrator.
Access: Menu Bar > Tools > Administrator
User Access Level Description
Novice Only the items assigned to the novice category are accessible. These
include most frequently used parameters.
Expert Items assigned to the novice and expert category are accessible.
These include parameters useful for advanced operators.
Service All items are accessible, also including infrequently used items and cal-
ibrations.
Additional to the user access levels there are user privileges which are part of the user profile:
User Privilege Description
Calibration Enables the user to perform instrument calibration operations.
Change Image Di- Enables the user to change the location where all images are saved.
rectory
Change Toolbar Enables the user to change the toolbar.
Change User Direc- Enables the user to change the location where all user specific param-
tory eters and configurations are saved.

ZEISS 3 Product and Functional Description | 3.6 Software Description
User Privilege Description
Stage Initialise Enables the user to initialize the motorized stage.
Supervisor Enables the user to perform the following actions:

§ Start the Administrator, create and edit users
§ Set User Max EHT
§ Modify the filament current
§ Set up, edit, and delete global stage coordinates
§ Save common macros and toolbars
§ Save common recipes
§ Activate Partial Vent on Standby, Z Move on vent, Protect Z,
Go to HV@Shutdown, EHT Off & Log Off, and Leave Gun
ON at Shutdown.
§ Use the bakeout function
3.6.4 SmartSEM Program Suite
The SmartSEM Program Suite comprises the EM server, which implements the internal communi-
cation between control software and microscope hardware, plus several programs and utilities.
The main purpose of the SmartSEM Program Suite is to access all necessary microscopy parame-
ters and software features to capture SEM data and optimize image acquisition.
Access: Windows start menu > SmartSEM
Program Description
LaB6_Setup Contains information about the LaB₆ filament.
ReadMe Contains important information on the currently installed version.
Release Notes Contains an overview of all SmartSEM versions including new devel-
opments and specific details.
RemCon32 Serial interface for remote operation via RS232, e.g. for EDX
License: REMCON
SampleHolder- Enables you to inspect the dimensions of all possible specimen holders
Gallery as well as to set the dimensions of the custom specimen holders.
Enables you to activate the available specimen holders for SmartSEM.
SEM Drift Correc- Enables you to compensate for the drift of the specimen by using a
tion reference image and by controlling the beam shift.
License: DRIFT-CORR
Slideshow speed Enables you to adjust the slideshow speed for the Windows Photo
setting Viewer.
SmartSEM Admin- Enables you to manage user profiles and configure instruments.
istrator
SmartSEM User Enables you to record important information during individual work-
Accounting ing sessions, e.g. logon/logoff time, number of TIFF files exported etc.
SmartSEM User In- Main software application

terface

Access: Windows start menu > SmartSEM Service
Program Description
Cal2000 Service activities, for ZEISS service representatives only
Calibration Wizard Service activities, for ZEISS service representatives only
Gun Monitor Enables you to monitor important parameters of the microscope.
GUN Service Service activities, for ZEISS service representatives only
Multi GIS Service Not relevant for this type of microscope
Pivot Point Call Not relevant for this type of microscope
Service Centre Provides an overview of the state of the microscope.
Smart Stage Map- Service activities, for ZEISS service representatives only
ping
SmartBackup Tool Service activities, for ZEISS service representatives only
Stage Administra- Service activities, for ZEISS service representatives only

tor
Upgrade Server Service activities, for ZEISS service representatives only

Database

ZEISS 4 Installation
4 Installation
Installation and commissioning are carried out by authorized ZEISS service representative. The in-
stallation requirements are to be observed and adhered to. After installation or retrofitting, thor-
oughly check that the Microscope System is in a safe operational state, making sure in particular
that all protective covers (e.g. protection against laser radiation) have been installed.

5 First Operating Steps | 5.1 Prerequisites for Commissioning and Operation ZEISS
5 First Operating Steps

This chapter describes the switching on/off as well as the first operating steps with the Micro-
scope System.
Info
Additional information and detailed descriptions are available in the further applicable docu-
ments, or ask your ZEISS Sales & Service Partner.
Info
Further information on the software and its operation is available in the software’s online help.
5.1 Prerequisites for Commissioning and Operation

Read the instruction manual carefully before commissioning and keep the manual for further use.
§ Basic training and safety briefing successfully completed.
§ Chapter Safety read and understood.
§ Familiar with general Windows® based programs.
§ Familiar with SmartSEM.
5.2 Switching On the Microscope System
5.2.1 Energizing the Microscope
Before energizing the microscope make sure that the following safety warnings have been read
and fully understood by each person who is in the same room as the microscope at any time:
WARNING
Suffocation hazard due to lack of oxygen
Gaseous dry nitrogen is used to vent the specimen chamber during specimen exchange. Inhal-
ing nitrogen may cause unconsciousness.
4 During specimen exchange, keep the chamber door open as short as possible.
4 Do not inhale the air from within the specimen chamber.
4 Ensure that the area around the microscope is sufficiently ventilated.
4 If you begin to experience symptoms of asphyxia (for example: rapid breathing, loss of
mental alertness and/or muscular coordination, depression of sensations, emotional insta-
bility, fatigue) leave the room immediately and inform the facility’s safety officer.
WARNING
Reaction products
Dangerous reaction products can be present in the specimen chamber during or after opera-
tion.
4 Ensure that there is an appropriate exhaust gas line to remove the waste gas of the pre-
vacuum pump and to transmit it to the outside.
4 Wear lint-free gloves when touching the inner parts of the specimen chamber or the speci-
men.

ZEISS 5 First Operating Steps | 5.2 Switching On the Microscope System
Before energizing the microscope make sure that the following safety warnings have been read
and fully understood by the person operating the microscope:
WARNING
Residual voltage at the mains plug
After unplugging the mains plug residual voltage is present at the pins of the plug which may
4 After unplugging the mains plug wait at least 5 s before touching the pins of the mains
plug.
WARNING
High leakage currents are present in the microscope. Contact may cause burn or electrical
shock.
4 Ensure proper grounding. For more information, refer to the Installation Requirements
document.
4 Do not operate the microscope without the separate ground connection.
WARNING
Hazardous voltages inside the microscope
Contact may cause electrical shock or burn.
Hazardous voltages are present inside the microscope as long as the power cord is plugged in
or as long as the Main Switch of the EMO Circuit is in the ON position.
To completely cut off the microscope from any mains power:
4 with installed EMO Circuit set the Main Switch to the OFF position.
4 without EMO Circuit unplug the power cord by unplugging the CEE connector from the
CEE FEMALE RECEPTACLE of the mains supply.
WARNING
Restart after emergency off
If the reason for the emergency off is not eliminated, it may be dangerous to restart the micro-
scope.
4 If the microscope has been de-energized due to an emergency, ensure that the reason for
the emergency off does not exist anymore.
4 Make sure it is safe to energize the microscope.
Prerequisite ü If the Emergency OFF (EMO) circuit is not installed:

The microscope was de-energized by unplugging the CEE connector from the mains supply.
ü If the EMO circuit is installed:
The microscope was de-energized either by turning the Main Switch to the OFF position or
by pressing the EMO button.
Procedure 1. Verify that the main shut-off valves for nitrogen at the facility installation are operable.
à Otherwise unlock and open the main shut-off valves.

5 First Operating Steps | 5.2 Switching On the Microscope System ZEISS
2. Make sure the circuit breakers (F10, F11) are in

the upper position.
3. If the EMO circuit is not installed, plug the CEE

connector into the CEE FEMALE RECEPTACLE of
the mains supply.
4. If the EMO circuit is installed, pull the EMO

button to release it.
5. Turn the Main switch counter-clockwise to the

Reset position and then back via OFF to the
ON position.
6. Press the green Start button.
5.2.2 Starting the Microscope
Info
If the system was powered off for a longer time period, the ion getter pump might fail to start.
In this case, bake-out the gun head (supervisor user rights required) or contact your local ser-
vice center. Refer to Baking out the Gun Head [} 120].
To start the microscope, you need to use the buttons at the front of the plinth and follow a de-
fined procedure.

ZEISS 5 First Operating Steps | 5.3 Starting the Software
Prerequisite ü The microscope is energized.

ü The microscope is in OFF mode. The OFF button is illuminated.
Procedure 1. Press the STANDBY button at the front of the plinth.
à The STANDBY button lights up yellow and the microscope starts pumping the chamber.
2. Wait for 10 seconds.
3. Press the ON button.
à The ON button lights up green and the mi-
croscope PC starts.
5.3 Starting the Software
Procedure 1. Power up the computer and log in.

2. Start the SmartSEM user interface via the ZEISS SmartSEM icon on the desktop.
Alternatively, select Windows start menu > SmartSEM > SmartSEM User Interface.
à The EM Server opens while loading various drivers. The EM Server implements the inter-
nal communication between software and hardware of the microscope.
à The EM Server Log On dialog is displayed.
3. Enter the user name and password.
4. Click OK.
à The SmartSEM user interface opens and is ready to operate the microscope.
5.3.1 Calling up the Help
There are different ways to access topics in the Online Help.
Function Menu Shortcut Control Elements
Startup page Help F1 –
Table of Contents Help > Contents Ctrl+F1 –
Context-sensitive – § Shift+F1 Question mark icon

§ F1 on focus in the main window
and in modal dialogs
Detailed information about using the help system is given in the Online Help directly.
5.3.2 Keyboard Shortcuts
The following keys are shortcut keys and have special meaning.
Shortcut Function
<F2> Toggles Tool Bar on/off
<F2 + SHIFT> Hysteresis removal
<F3> Closes all windows except the Tool Bar and Status Bar
<F3 + SHIFT> Toggles PC Plane ON/OFF

5 First Operating Steps | 5.3 Starting the Software ZEISS
Shortcut Function
<F4> Step to next Magnification Table entry, or Undo Centre Feature Mag-
nification
<F4 + CTRL> Step to previous Magnification table entry
<F4 + SHIFT> Exit from Magnification Table mode
<F5>, <F5 + User defined macros

SHIFT>
<F6>, <F6 +
SHIFT>
<F7>, <F7 +
SHIFT>
<F8>, <F8 +
SHIFT>
<F9> Keys help (displays this information)
<F11>, <F11 + User defined macros

SHIFT>
<F12>, <F12 + Aborts Stage Movement

SHIFT>
<TAB> Toggle coarse/fine
<CTRL + TAB> Performs Centre Point
<CTRL + SHIFT + Performs Centre Feature

TAB>
<HOME> Resets Beam Shift to zero
<SCROLL LOCK> Toggles Freeze/Unfreeze
<PAUSE> Causes currently executing macro to continue
<*> Performs Find Image function
<CTRL + 2> Loads Second Image Window from display
<CTRL + A> Switches Annotation panel ON
<CTRL + B> Display Toolbar View dialog
<CTRL + D> Toggle Data Zone ON/OFF
<CTRL + E> Calls the Export TIFF dialog
<CTRL + F> Starts Auto Focus fine
<CTRL + SHIFT + Starts Auto Focus coarse

F>
<CTRL + G> Switches SEM Controls Panel ON
<CTRL + I> Switches SEM Status Panel ON
<CTRL + M> Switches to Annotation and inserts Point to Point Marker
<CTRL + ALT + M> Enable/Disable the Movable Crosshairs Marker
<CTRL + ALT + F> Enable/Disable Mouse Following for Movable Crosshairs Marker

ZEISS 5 First Operating Steps | 5.4 Acquiring an Image
Shortcut Function
<CTRL + O> Calls the Import TIFF dialog
<CTRL + P> Performs the Print Image function
<CTRL + S> Calls the Export TIFF dialog to save the image
<CTRL + ALT + S> Performs Auto Astigmatism Correction
<CTRL + SHIFT + Performs Auto Astigmatism Correction with Auto Focus

S>
<CTRL + T> Calls Text Annotation
<CTRL + V> Displays the Vacuum status information
Keypad <+> Faster Scan
Keypad <-> Slower Scan
ARROW Keys Refer to Use of ARROW Keys
Image Buffer keys Refer to Image Buffer
<SHIFT> and dou- Performs Centre Point function

ble click
5.4 Acquiring an Image
Info
Mobile phones in the microscope room can cause image quality infringements and in worst
case workflow interruptions.
This section describes basic procedures to obtain an image using the SE detector. To simplify the
procedure, the description uses the SEM Controls panel and status bar functions in the SmartSEM
software.
This procedure consists of the following steps:
1. Preparing the Specimen Holder [} 61]
2. Loading the Specimen Chamber [} 63]
3. Locating the Specimen [} 67]
4. Switching on the Gun | LaB₆ Filament [} 68]
5. Switching on the EHT | LaB₆ Filament [} 68]
6. Switching on the Gun and EHT | Tungsten Filament [} 72]
7. Acquiring an Image [} 73]
8. Optimizing the Image [} 76]
9. Saving the Image [} 79]
5.4.1 Preparing the Specimen Holder
Parts and Tools  Hex key, 1.5 mm

 Stub (delivered with microscope)
 Conducting tape: carbon tape, conductive carbon, adhesive metal tape, or similar
 Tweezers

5 First Operating Steps | 5.4 Acquiring an Image ZEISS
 Stub pliers
 Lint-free gloves
WARNING
Biological hazards
Biological substances may pose a threat to the health of humans and other living organisms.
4 Keep a logbook of the biological substances loaded into the microscope and show it to
the ZEISS service representatives before they perform any work on the microscope.
WARNING
Aggressive or toxic chemicals
Aggressive or toxic chemicals can cause chemical burns.
4 When handling aggressive or toxic chemicals, wear suitable protective clothing, gloves,
and eye/face protection.
4 Do not eat, drink, or smoke while handling toxic chemicals.
4 Refer to local safety regulations.
4 Read and follow the instructions in the material safety data sheet of the chemical. The ma-
terial safety data sheet can be obtained from the supplier of the chemicals.
NOTICE
Environmental risk due to disposal of aggressive or toxic chemicals
When disposing of aggressive or toxic chemicals, there is a threat of damage to the environ-
ment.
4 When disposing of waste that has been generated during a service operation (e.g. used ro-
tary pump oil), comply with all national and local safety and environmental protection reg-
ulations.
NOTICE
Contamination caused by fingerprints
Contamination caused by fingerprints can lead to vacuum deterioration or prolonged pumping
times.
4 Always wear lint-free gloves when touching the specimen, specimen holder, or stage.
Prerequisite ü Appropriate specimen (with conducting properties, e.g. gold on carbon)

Procedure 1. To attach a specimen to the stub, use tweezers
and conductive carbon, adhesive metal tape,
carbon tape, or similar.
Ensure that the specimen area that you want to
analyze is in proper contact with the stub.

2. To insert the stub into the specimen holder, use

stub pliers.
3. To fix the stub to the specimen holder, tighten

the location screw with the hex key.
4. Note down which fix position is occupied by the specimen.
5.4.2 Loading the Specimen Chamber

1. Displaying the SEM Control Panel [} 63]
2. Driving the Stage to a Low Position [} 63]
3. Venting the Specimen Chamber [} 64]
4. Installing the Specimen Holder [} 65]
5. Evacuating the Specimen Chamber [} 66]
5.4.2.1 Displaying the SEM Control Panel
Prerequisite ü The SmartSEM user interface is started.

Procedure 1. From the Menu Bar, select Tools > Goto panel.
à The Panel Configuration Bar is displayed. It contains an alphabetical list of functions.
2. Double-right-click SEM Controls.
à The SEM Controls panel is added to the docking panel.
5.4.2.2 Driving the Stage to a Low Position
CAUTION
Moving the specimen stage
Fingers can be trapped by the moving specimen stage.
4 Always close the chamber door before moving the specimen stage.
4 To remove parts fallen into or near to the stage use a tool (e.g. tweezers) instead of your
fingers.
Prerequisite ü The stage is initialized.

Procedure 1. To activate the navigation camera, activate the Stage Navigation Bar checkbox from
Menu Bar > View > Toolbars and navigate to the Camera tab.
à The inside of the specimen chamber is visible in the Stage Navigation Bar.

2. Alternatively, to activate the chamberscope, click the TV icon in the Toolbar or press the
Camera button on the control panel.
à The inside of the specimen chamber is visible

in the Image Area.
3. In the SEM Controls panel, select the Stage tab.

4. Activate the Track Z checkbox.
à The current working distance (WD) is displayed in the Data Zone.
INFO: If the Data Zone is disabled, enable it via Menu Bar > View > Data Zone >
Show Data Zone.
5. Use the dual joystick to drive the specimen stage downwards to a low position.
Alternatively, use the soft joystick via Tools > Goto Panel > Soft Joystick.
NOTICE Observe the stage movement via camera to avoid crashing.
5.4.2.3 Venting the Specimen Chamber
WARNING
Procedure 1. In the SEM Controls panel, select the Vacuum tab.

2. Click Vent.
à The Vent message box is displayed.
3. To start venting, click Yes.
INFO: If the Stage is not initialized system message is displayed, refer to Initializing the
Stage [} 115].
à The specimen chamber is purged with gaseous nitrogen.

5.4.2.4 Installing the Specimen Holder
WARNING
CAUTION
Risk of electrical shock by stage on bias voltage
If you open the chamber door while the stage is still on bias voltage, then contact may cause
electrical shock.
4 Always switch off the beam deceleration before you open the chamber door.
CAUTION
fingers.
CAUTION
Closing the chamber door
Fingers can be pinched when closing the chamber door.
4 Ensure not to get your fingers caught in the chamber door gap.
NOTICE
Driving the stage
While the stage is driven manually, there is a risk of damaging the objective lens and/or the
specimen.
4 Ensure not to hit the objective lens while driving the stage.
4 Monitor the moving stage in TV mode.
4 To stop the moving stage immediately, press F12 or press the Break push button of the
dual joystick panel.
4 Manually lower the stage before you open the chamber door. Alternatively, activate the Z
move on Vent checkbox in the Stage tab of the SEM Controls panel.

NOTICE
times.
Procedure 1. Take hold of the recessed grip.

2. Carefully open the chamber door.
3. If a specimen holder is mounted onto the specimen stage, remove it by sliding it out of the
dovetail rails.
4. Install the prepared specimen holder by sliding
it into the dovetail rails.
Make sure that the dovetail is placed in the cor-
rect orientation so that the flat side of the
dovetail of the specimen holder is flush with
the milled edge of the specimen stage.
5. Check the chamber view to ensure the specimen does not hit any components when it is
introduced into the specimen chamber.
6. Carefully close the chamber door.
à The specimen holder and the specimen inside the chamber are visible in the Image
Area.
5.4.2.5 Evacuating the Specimen Chamber

2. Click Pump.
à Several vacuum status messages display the current vacuum levels.
à INFO: A change macro is also available which automates the specimen change proce-
dure and prompts the user to carry out specific actions. The final steps of the macro runs
up the electron beam ready for the user to start imaging.

5.4.3 Locating the Specimen

1. Positioning the Stub under the Electron Beam [} 67]
2. Moving the Specimen to the Proper Height [} 67]
5.4.3.1 Positioning the Stub under the Electron Beam
NOTICE
Driving the stage
While the stage is driven manually, there is a risk of damaging the objective lens and/or the
specimen.
4 Ensure not to hit the objective lens while driving the stage.
4 Monitor the moving stage in TV mode.
4 To stop the moving stage immediately, press F12 or press the Break push button of the
dual joystick panel.
4 Manually lower the stage before you open the chamber door. Alternatively, activate the Z
move on Vent checkbox in the Stage tab of the SEM Controls panel.
Procedure 1. In the Stage Navigation Bar, select Stage Sideview from the upper drop-down list and
Stage Topview from the lower drop-down list.
INFO: To open the Stage Navigation Bar, navigate to View > Toolbars and activate
Stage Navigation Bar (for Widescreen users). Alternatively, you can access the Stage
Navigation Bar via Stage > Navigation.
2. Click Settings.
à The Stage Navigation Settings dialog is displayed.
3. In the Stage Navigation Settings dialog, click Show Holder Gallery.
à The Sample Holder Gallery dialog is displayed.
4. In the Sample Holder Gallery dialog, select the installed specimen holder.
5. Activate the Is Available checkbox.
6. Close the Sample Holder Gallery dialog.
7. Close the Stage Navigation Settings dialog.
8. In the Stage Topview section of the Stage Navigation Bar, spot the stub with the speci-
men you want to observe.
9. To drive the stub directly under the electron beam, double-click the stub.
5.4.3.2 Moving the Specimen to the Proper Height
Procedure 1. In the Stage Navigation Bar, drag the Zoom View slider to the right end, so that the
schematics are zoomed in.
2. In the SEM Controls panel, select the Detectors tab.
3. In the Detectors section, select USB TV1 from the Signal A drop-down list.
à The inside of the specimen chamber is visible in the Image Area.
4. Use the dual joystick to carefully move up the stage so that the stub you are using is in the
center of the upper schematic.
NOTICE Observe the camera image in order not to crash into the pole piece.
à INFO: After loading the specimen, there is the possibility to use the Sample Type Selec-
tion Function to automatically set a number of key parameters. Refer to Using the Sam-
ple Type Selection Function [} 92].

5.4.4 Switching on the Gun | LaB₆ Filament
Info
If you operate the microscope with a LaB₆ filament, then you need to switch on or switch off
the gun and the EHT separately.
Prerequisite ü The chamber and the gun head have been evacuated.
Procedure 1. In the right part of the Status Bar, verify whether the gun is switched on or off.
à If or is displayed, the gun is already switched on and you can skip the fol-
lowing steps.
à If is displayed, the gun is switched off.
2. In the SEM Controls panel, select the Vacuum tab.
3. Verify that the EHT Vac ready readout is EHT Vac ready = Yes.
If not, the correct vacuum is not achieved. Check if the Pump procedure has been com-
pleted.
4. In the right part of the Status Bar, click .
à The pop-up menu for vacuum, gun and EHT activation is displayed.
5. Click Beam On.
à The gun runs up.
5.4.5 Switching on the EHT | LaB₆ Filament
When you switch on the EHT, the gun starts emitting electrons.
Info
ü The gun has been switched on.
2. Check that Vac Status = Ready is displayed.
3. In the SEM Controls panel, select the Gun tab.
4. Double-click the Fil I Target readout.
à The Fil I Target window is displayed.
5. In the input field, enter the required filament current in mA and click OK.
INFO: For a LaB₆ filament, you may start with a filament current of approximately
1800 mA.
7. Double-click the EHT Target readout.
à The EHT Target window is displayed.
8. In the input field, enter the required acceleration voltage in kV and click OK.
10. Click EHT On.
à The EHT runs up to the set voltage.

à In the right part of the Status Bar, the vacuum, gun and EHT status buttons merge to
.
5.4.6 Choosing the LaB₆ Mode
SmartSEM offers two modes for running the LaB₆ filament:

§ Normal mode for ultimate resolution
Normal mode is mainly used by experienced users to achieve the ultimate resolution and/or
to have continuous control of the beam settings. The filament lifetime will however be gener-
ally reduced in this mode, due to the use of relatively high acceleration voltages, beam and fil-
ament currents (up to 30 kV, 40 µA and 2.050 A).
§ Long Fil. Life mode for longer filament lifetime
Long Fil. Life mode has a slightly reduced resolution but the filament lifetime is increased
due to the use of lower filament currents (around 1.950 A). The Long Fil. Life mode is the
preferred mode for most applications.
Procedure 1. Toggle the Long Fil. Life checkbox to switch
between the two modes.
INFO: This applies to both LaB₆ variants (1 mm
and 1.5 mm Wehnelt bore diameter).

5.4.7 Setting up the LaB₆ Source
Procedure 1. From the Panel Configuration Bar, select Aperture Align.

à The Aperture Align window is displayed.
2. To set the Aperture Align value to zero, click the 0 button.

3. From the SEM Controls panel, select the Apertures tab.
4. From the Optibeam drop-down list, select Optibeam = Resolution.
5. Select the correct mid-column aperture from the Aperture Size drop-down list.
Info: For VP and EP systems make sure that the EasyVP aperture is fitted. The EasyAlign
aperture needs to be fitted on HV tools.
6. In the Gun tab set the EHT Target to 20 kV.
7. Set the I Probe value to 100 pA.
8. If using the long filament life mode is preferred:
– Set the Beam Current value to 40 µA.
– Set the Filament I target to 2.050 A.
– Switch to the long filament life mode by ticking the Long Fil. Life box on the Gun tab.
– Turn the Beam = On.
– Go to the Apertures tab and click Emission.
– Adjust the Contrast until the emission can clearly be seen.
– Then go to step 17 and continue with the alignment of the beam.
9. If using the normal mode is required, ensure that checking the filament saturation and the
beam alignment is done frequently (once per day) and follow the steps below.
10. Set the Beam Current value to 20 µA (requires changing the default value, i.e. 40 µA).
11. Set the Filament I target around or below the first peak such as 1.55 A (1550 mA).
12. Turn the Beam=On.
13. Go to the Apertures tab and click Emission.
Fig. 39: Emission image when LaB₆ is un-

dersaturated at 1.539 A
14. Adjust the Contrast until the emission can clearly be seen.

15. Adjust the Filament I target by increasing or decreasing the value using the fine adjust op-
tions, i.e. small arrows: Increase the Filament I target in small steps and check the emission
image until close to the second peak. The signal increases and the emission image becomes
brighter. At first five regions can be seen on the emission image, i.e. the electron emission
from all the five crystal planes of the LaB₆ (pyramid shape filament). As the current is in-
creased the four symmetrical off axis emission areas collapse into a central spot, i.e. the
emission will be mainly from the tip of the filament and not from the other four planes of
the LaB₆ filament. The best performance of the LaB₆ can be achieved when the tip is fully
saturated and at the second peak. For a new LaB₆ filament the filament current value will
be between 1.95 A to 2.0 A. The Filament I target should never be higher than 2.050 A.
a LaB6 is saturated at first peak
The spot is very well defined and bright but
there is clearly some emission from the side
planes. At first peak, does not provide the
means for obtaining the optimal resolution
and the beam intensity decreases quite dra-
matically, as the filament ages.
b Fully saturated at second peak

Filament is fully saturated because there is
a little bit of emission on the sides of the
central spot. This is the emission image for
best performance providing optimal resolu-
tion.
16. Adjust the Gun Shift and Gun Tilt: Center the emission image, obtain a symmetrical shape
with the brightest point at the middle of the crosshairs (shift for adjusting and checking the
edges and tilt for moving the brightest point of the emission image to the middle.
17. Set the WD=8.5 mm.
18. On the Apertures tab, activate Focus Wobble and Wobble Fast. Find a feature which is
outstanding (preferably round shape). Change the wobbling amplitude to appropriate val-
ues, adjust the contrast, and set to an appropriate magnification.
19. Adjust the Mid-column aperture by fine-adjusting knobs X and Y. Work with both X and
Y knobs, finding the crossovers, until the image is just wobbling in and out of the screen.
When finished with the adjustments, deactivate Focus Wobble.
20. Do a Hysteresis correction by using Shift + F2 keys on the keyboard.
21. Adjust the Mag and Focus. Increase the magnification to the desired values and adjust the
focus (in several steps).
22. Adjust Stigmation in both X and Y directions in several steps.
23. Re-adjust the Focus, when necessary.
à The beam is now aligned and further adjustments of the mid-column apertures or the
fine-adjustment knobs is no longer required (use only the Auto Aperture Align from
now on).
24. Start imaging different specimens and if necessary change/adjust the EHT, I Probe, WD
and repeat with the Mag, Focus, and Stigmation adjustments.

25. On the Aperture Align window, click on Auto Aperture Align after changing parameters
such as EHT, I Probe, WD.
5.4.8 Switching on the Gun and EHT | Tungsten Filament
When you switch on the gun and the EHT, the gun starts emitting electrons.
Info
If you operate the microscope with a tungsten filament, then the EHT and the gun are always
switched on or switched off together. You cannot separately switch on or off the EHT or the
gun.
Info
Tungsten filaments have only a limited lifetime of 100–300 operating hours. If you operate the
microscope with a tungsten filament, then do the following:
4 If the microscope is not in operation, then always switch off the EHT and gun to preserve
the filament.
4 Enable Auto Saturation at shutdown.
2. Check that Vac Status = Ready is displayed.
4. Double-click the Fil I Target readout.
à The Fil I Target window is displayed.
5. In the input field, enter the required filament current in mA and click OK.
INFO: Depending on the exact type of tungsten filament, you may start with the following
values for the filament current:
For standard tungsten filaments (Agar A054), use 2500 mA.
For longlife tungsten filaments (Agar A054L), use 3200 mA.
7. Double-click the EHT Target readout.
à The EHT Target window is displayed.
8. In the input field, enter the required acceleration voltage in kV and click OK.
10. Click Beam On.
à The gun is switched on and the EHT runs up to the set voltage.
à In the right part of the Status Bar, the vacuum, gun and EHT status buttons merge to
.

5.4.9 Acquiring an Image
Info
The following procedure describes the best way to quickly obtain an image without the con-
trol panel. You can also use the control panel to adjust aperture alignment, magnification/fo-
cus and brightness/contrast.
The following procedure describes how to acquire an image in high vacuum (HV) mode.
For further information on pressure and operating modes, refer to Selecting the Optibeam Opera-
tion Mode [} 81].
Info
You can also use the Automated or Semi-automated Functions to help you with these tasks.

1. Selecting the Optibeam Mode and the Apertures [} 73]
2. Setting EHT and Probe Current [} 74]
3. Selecting the SE Detector [} 74]
4. Setting a Fast Scan Speed [} 75]
5. Setting a Low Magnification [} 75]
6. Setting a Long Working Distance [} 75]
7. Adjusting Brightness and Contrast [} 75]
8. Visualizing Details on the Specimen Surface [} 76]
5.4.9.1 Selecting the Optibeam Mode and the Apertures
Procedure 1. In the SEM Controls panel, select the Apertures tab.

2. From the Optibeam drop-down list, select
Optibeam = Resolution.
à The Optibeam mode is set.

3. Click Select Aperture and select the EasyVP Aperture.
à The pressure-limiting aperture is set.

4. Turn the knob of the mid-column aperture

changer to select the 20 µm aperture.
5. In the Apertures tab of the SEM Controls panel, select the 20.00 µm from the Aperture
Size drop-down list.
à The 20 µm aperture is set.
5.4.9.2 Setting EHT and Probe Current
Procedure 1. In the SEM Controls panel, select the Gun tab.
2. Double-click the I Probe readout and enter 100.

à The probe current is set to 100 pA.
3. Double-click the EHT Target readout and enter 20.
à The EHT is set to 20.00 kV.
5.4.9.3 Selecting the SE Detector
Procedure 1. In the SEM Controls panel, select the Detectors tab.

2. In the Detectors section, select Signal A = SE2
from the Signal A drop-down list.
INFO: We recommend using the SE detector to
obtain the first image. This detector provides a
good signal-to-noise ratio even at long working
distances.

5.4.9.4 Setting a Fast Scan Speed
Procedure 1. In the SEM Controls panel, select the Scanning tab.

2. From the Scan Speed drop-down list, select a
fast scan speed, e.g. Scan Speed = 3.
INFO: The lower the scan speed number, the
faster the electron beam scans across the speci-
men. Scan Speed = 3 allows you to get an im-
age quickly.
à If the image is noisy, then change the scan speed to 4 or 5, but no higher than 6, as it
slows down the specimen navigation process.
5.4.9.5 Setting a Low Magnification
Procedure 1. To move the specimen stage to a suitable location for imaging, use the X and Y controls on
the joystick.
2. In the Toolbar, select the MAGWD icon.
à The Status Bar displays the values for magnification and focus.
3. In the Status Bar, click .
à The Mag window is displayed.
4. In the Mag input field, enter 500.
5. Click OK.
à The magnification is set to Mag = 500 x.
5.4.9.6 Setting a Long Working Distance
Procedure 1. In the Status Bar, click .

à The WD window is displayed.
2. In the WD input field, enter 8.5.
3. Click OK.
à The working distance is set to WD = 8.5 mm.
5.4.9.7 Adjusting Brightness and Contrast

2. In the Signal Adjust section, use the scroll
bars to adjust brightness and contrast.

5.4.9.8 Visualizing Details on the Specimen Surface
Procedure 1. Select a detail on the specimen surface.

2. Verify the Magnification/Focus function is activated.
3. To adjust the magnification, hold down the left mouse button and drag the mouse within
the Image Area in left/right direction.
à The current magnification is indicated in the Status Bar.
4. To adjust the focus, change the working distance. Hold down the mouse wheel and drag
the mouse within the Image Area in left/right direction.
à Alternatively, you can press <Ctrl+F> to use the fine autofocus or you can press <Ctrl
+Shift+F> to use the coarse autofocus.
à The current working distance is indicated in the Status Bar.
5. Adjust contrast and brightness again.
5.4.10 Optimizing the Image
Once you have generated an initial image, you can adjust various parameters to optimize the im-
age.
Info
The following procedure describes how to manually improve the image quality. You can also
use the Auto Aperture Alignment Function.
Info
The following procedure describes the best way to quickly optimize the image without the
control panel. You can also use the control panel to adjust aperture alignment, magnification/
focus and brightness/contrast.

1. Adjusting the Magnification [} 76]
2. Limiting the Scan Field [} 77]
3. Aligning the Aperture [} 77]
4. Selecting the Scan Speed [} 78]
5. Correcting Astigmatism [} 78]
6. Adjusting Final Magnification, Contrast and Brightness [} 79]
5.4.10.1 Adjusting the Magnification
Procedure 1. Step by step, raise the magnification to about twice the desired final magnification (e.g.
50,000 x) and focus in between.
Use the Coarse mode or the Fine mode of adjustment, as appropriate. To toggle between
Fine and Coarse mode, in the Status Bar, click or .
2. To adjust the magnification and the focus, hold down the left mouse button or the mouse
wheel, respectively, and drag the mouse within the Image Area.

5.4.10.2 Moving the Field of View at High Magnifications
If you want to move the field of view at high magnifications, use the Beam Shift function instead
of moving the stage.
Procedure 1. In the Panel Configuration Bar, double-click Beam Shift.
2. To shift the beam, in the Beam Shift navigation
box, use the scroll bars or the red marker.
5.4.10.3 Limiting the Scan Field
Prerequisite ü Adjusting the size and position of the small frame (reduced raster) requires the license RE-
DUCED.
Procedure 1. In the Toolbar, click the REDUCE icon.
à A small scan frame is displayed. This frame defines the specimen area to be scanned by
the electron beam.
à The image outside the scan frame is frozen.
2. To change the position of the scan frame, click on the green border line and use the mouse
to drag and drop the frame.
3. To change the size of the scan frame, click on the small blue squares on the green border
line and drag them to the desired size.
4. Focus the image in the reduced raster.
5.4.10.4 Aligning the Aperture
Info
If the VP 100 μm aperture is fitted under the objective lens, focus wobble is not available.

2. Activate the Focus Wobble checkbox.
INFO: Focus wobble is a function that sweeps the acceleration voltage. If the aperture is
misaligned, a lateral and vertical shift can be observed.
à The Focus Wobble window is displayed.
3. To adjust the wobble intensity, use the Wobble Amplitude scroll bar. Set a value between
60 % and 70 %.

4. To accelerate the wobble speed, activate the Wobble Fast checkbox.

5. From the Panel Configuration Bar, select Aperture Align.

7. Carefully adjust the X and Y micrometers gauges to align the mid-column aperture and
eliminate any lateral image shift.
INFO: The specimen detail should just be pulsating without shifting.
8. Deactivate the Focus Wobble checkbox.
INFO: Once the alignment is optimized, DO NOT change the position of the X and Y mi-
crometer gauges on the mid-column aperture changer. It is now possible to work at any ac-
celeration voltage (EHT), probe current (I Probe) and working distance without the need to
change the position of the X and Y micrometer gauges on the mid-column aperture
changer.
INFO: If you change the EHT or the I Probe later during imaging, align the beam via Auto
Aperture Align in the Aperture Align window.
9. Refocus the image.
5.4.10.5 Selecting the Scan Speed
Procedure 1. In the Toolbar, from the Faster/Slower drop-down list, select Scan Speed = 7.
Alternatively, in the SEM Controls panel, select the Scanning tab, and from the Scan Speed
drop-down list, select Scan Speed = 7.
à The scan speed is set to Scan Speed = 7.
2. Bring the image into focus.
5.4.10.6 Correcting Astigmatism
Procedure 1. Ensure that the Reduced Raster function is active.

2. Select a detail (e.g. a mark or an edge) on the specimen surface.
Ensure that the selected detail is in the raster. You can move the stage or shift the beam for
this purpose.
3. In the SEM Controls panel, select the Apertures tab.
4. Click Stigmation.

ZEISS 5 First Operating Steps | 5.5 Modifying Gun Parameters and Optibeam Mode
5. In the Stigmation navigation box, use the

scroll bars or the red marker to obtain the
sharpest possible image.
INFO: The specimen detail should just be pul-
sating without shifting.
INFO: To obtain optimum results, alternately
correct focus and astigmatism.
6. To deactivate the reduced raster, in the Toolbar, click the REDUCE icon.
5.4.10.7 Adjusting Final Magnification, Contrast and Brightness
Procedure 1. Reduce the magnification to the required value (e.g. 25,000 x).

2. To activate auto contrast and brightness, click the LEVELS icon in the Toolbar.
5.4.11 Saving the Image
Procedure 1. Once a steady contrast and brightness level is reached, click the PHOTO icon in the Tool-
bar.
INFO: This runs a macro that automatically changes the scan speed to 8, the noise reduc-
tion to line integration with 4 lines and freezes the image at the end of the frame.
à A red dot at the right bottom of the image area indicates that the image is frozen.
2. From the Menu Bar, select File > Save Image.
à The Export TIFF dialog is displayed.
3. To change the save path, click Change Directory.

à A file explorer window is displayed.
4. To confirm the selected path, click Select Folder.
5. Enter the file name in the Filename input field.
6. Click Save <file name>.tif.
7. To continue imaging, middle-click the PHOTO icon.
5.5 Modifying Gun Parameters and Optibeam Mode
5.5.1 Using the Automatic Gun Alignment Functions
Automatic gun align is used to automatically align the shift and/or the tilt of the beam, to the cen-
ter of the column.
Two automatic gun align functions are available:

5 First Operating Steps | 5.5 Modifying Gun Parameters and Optibeam Mode ZEISS
§ Standard Align uses the normal imaging mode to align the gun.
§ Advanced Align uses the emission image to align the gun.
Procedure 1. From the Panel Configuration Bar, select Gun Alignment.
à The Gun Alignment dialog is displayed.
2. To automatically align the gun with the help of the emission image, click Advanced Align.
3. To automatically align the gun with the help of the normal imaging mode, click Standard
Align.
5.5.2 Using the Auto Aperture Alignment Function
Auto aperture align is used to improve the quality of the images. When the aperture align is se-
lected the software automatically aligns the beam with respect to the EasyVP aperture.
Prerequisite ü The EasyVP aperture is fitted.

Procedure 1. From the Panel Configuration Bar, select Aperture Align.
à The Aperture Align dialog is displayed.
2. Set the preferred imaging conditions (example EHT = 10 kV, WD = 8.5 mm, and

Iprobe = 300 pA) and obtain an image.
3. Click Auto Aperture Align button.
à The software starts aligning the beam and the progress bar is displayed on the panel. A
full size image is displayed when the alignment is completed.

ZEISS 5 First Operating Steps | 5.5 Modifying Gun Parameters and Optibeam Mode
5.5.3 Setting the Probe Current
Info
The maximum achievable probe current depends on the currently selected EHT and the in-
stalled aperture configuration.
Procedure 1. In the SEM Controls panel, select the Gun tab.

2. Double-click the I Probe readout.
à The I Probe window is displayed.
3. In the input field, enter the desired value.
5.5.4 Measuring the Probe Current
Measuring the probe current using the Faraday cup ensures that the current displayed in the soft-
ware equals the incident probe current. The Faraday cup consists of a strongly absorbing material
with a cavity covered by a small aperture. If the beam is focused in this cavity, no secondary elec-
trons and no backscattered electrons leave the Faraday cup.
Parts and Tools  Faraday cup (348342-8055-000)

Procedure 1. Load the Faraday cup into the specimen chamber.
2. Evacuate the specimen chamber.
3. Switch on the gun.
4. Switch on the EHT.
5. Set a magnification that allows transmission of the complete electron beam through the
aperture into the cavity of the Faraday cup.
6. From the Panel Configuration Bar, select Specimen Current Monitor.
à The Specimen Current Monitor window is
displayed.
7. Move the stage to the position of the Faraday cup.

8. Acquire an image of the Faraday cup.
9. Activate the Spot checkbox.
à Green crosshairs are displayed on the image. The crosshairs indicate the position of the
beam spot.
10. Grab the crosshairs and move them into the hole of the Faraday cup.
11. Activate the SCM On checkbox.
à The probe current is measured continuously.
à The measured probe current is displayed in the Specimen I readout.
5.5.5 Selecting the Optibeam Operation Mode
EVO can be operated in different Optibeam operation modes, depending on the type of applica-
tion. Based on the requirements for probe current, working distance, etc., Optibeam determines
the optimum lens settings to achieve the best performance from the column.
The following modes are accessible in HV mode (when no aperture is fitted) or when the EasyVP
aperture is fitted:

5 First Operating Steps | 5.6 Finding Appropriate Detector Settings ZEISS
§ Analysis mode: Specimen remains in focus for any change in probe current.
§ Field mode: A large field of view for navigation with a long depth of field.
§ Resolution mode: Smallest probe diameter for a chosen probe current at any working dis-
tance or acceleration voltage.
§ Depth mode: Largest depth of field or a chosen probe current at any working distance or ac-
celeration voltage.
§ Fisheye mode: Extreme field of view for navigation and a very large depth of field.
If the fixed aperture is fitted, some Optibeam modes may not be available. The fixed apertures are
apertures, which are screwed into the column of the microscope and which you need to distin-
guish from the click-stop apertures.
Prerequisite ü Fisheye mode requires the optional SmartSEM software license FISHEYE.
2. Use the drop-down list and the checkboxes to
select the operation mode.
5.6 Finding Appropriate Detector Settings
5.6.1 Selecting a Detector
You need to select an appropriate detector depending on the application and the pressure mode.
In addition to the standard SE detector, several optional detectors are available.
Detector Pressure mode
SE HV
C2D VP
C2DX VP, EP
BSD HV, VP
YAG BSD HV, VP
STEM HV, VP
CL HV, VP

ZEISS 5 First Operating Steps | 5.6 Finding Appropriate Detector Settings
Detector Pressure mode
The variable pressure mode can either be normal VP or extended EP. This depends on the fac-
tory configuration. If EP is enabled the VP is replaced by EP.
For information on special set-up procedures for the detectors, refer to:
§ Setting up the SE Detector [} 83]
§ Setting up the C2D Detector [} 83]
§ Setting up the C2DX Detector [} 84]
§ Setting up the BSD Detector [} 85]
§ Setting up the YAG BSD Detector [} 87]
Procedure 1. Select the Detectors tab of the SEM Controls panel.
2. Select the detector from the Signal A drop-
down list.
5.6.2 Setting up the SE Detector
Procedure 1. In the Detectors tab of the SEM Controls panel, select SE2 from the Signal A drop-down
list.
2. Use the Collector Bias scroll bar to adjust the
collector bias.
INFO: The default value is 300 V.
5.6.3 Setting up the C2D Detector
Fig. 40: C2D image of radiolaria

Info
The C2D detector requires VP pressures of at least 20 Pa to acquire a good signal.
A good starting point is EHT = 20 kV, I Probe = 500 pA, Chamber pressure = 30 Pa,
WD = 10 mm, and scan speed = 5.

2. From the Signal A drop-down list, select C2D F2.
3. In the Panel Configuration Bar, select C2D Control.
à The C2D Control panel is displayed.
4. Select C2D Gain = Low.

5. Adjust the C2D Bias scroll bar to 80 %. This is usually a good starting value.
INFO: Too high bias can cause electrical breakdown in the detector. If you observe bright
lines or flashing in the image reduce the C2D Bias until the artifacts disappear.
6. Click C2D Auto Level.
INFO: The brightness offset is canceled out and the image is readjusted to a centered his-
togram, at a brightness value of 50 %
7. Adjust the contrast of the image.
8. If you are unable to reach saturation or if the image quality is not good, increase C2D Bias
or set C2D Gain = High. Repeat steps 6 and 7.
5.6.4 Setting up the C2DX Detector
NOTICE
Inserting the C2DX detector
When you manually insert the detector, there is a risk to damage the C2DX detector.
4 Use the chamberscope image to observe if there is enough space between the objective
lens and the specimen.
4 If there is not enough space between the objective lens and the specimen, then lower the
stage position before you insert the detector.
4 Insert the C2DX detector carefully and observe the moving C2DX detector via the cham-
berscope.
4 If the BSD detector is mounted on the lens, then ensure that the C2DX can be inserted
without touching the BSD. This is best done with the chamber vented so that it can be ob-
served directly.

Info
The C2DX detector requires VP pressures of at least 20 Pa to acquire a good signal.
A good starting point is EHT = 20 kV, I Probe = 500 pA, Chamber pressure = 30 Pa,
WD = 8.5 mm, and scan speed = 5.

2. From the Signal A drop-down list, select C2DX.
3. In the Panel Configuration Bar, select C2DX Control.
à The C2DX Control panel is displayed.
4. Select C2DX Gain = Low.

5. Adjust the C2DX Bias scroll bar until you obtain a good and stable image.
INFO: A typical value for C2DX Bias is 50 %. Contrast and brightness should also be ad-
justed to obtain an image.
6. Click C2DX Auto Level.
7. If you are unable to reach saturation or if the image quality is not good, select C2DX Gain
= High and repeat the procedure.
5.6.5 Setting up the BSD Detector
Prerequisite ü Chamber door is open.

Procedure 1. Check that the lens-mounted BSD detector is fitted.
2. If it is in the parked position, remove the BSD
detector from the parked position.

3. Carefully fit the BSD in the working position.

NOTICE Avoid any contact with the
diode surface as it can easily damage the
detector.
4. Carefully close the chamber door.

5. Pump the specimen chamber.
6. In the Detectors tab of the SEM Controls panel, select BSD from the Signal A drop-down
list.
7. From the Panel Configuration Bar, select BSD Control.
The BSD Control panel enables you to change the polarity of the segments, select BSD
modes, and set the BSD gain.
à The BSD Control panel is displayed.
8. Click a segment symbol to toggle its status between on (white), inverted (black), and off
(gray).
9. To confirm the settings, click Apply.
10. To select compositional mode, click BSD: COMPO.
11. To select topography mode, click BSD: TOPO.
INFO: The topography mode has a default setting that can be changed by the user. To
change the default setting, select the desired segment combination and click BSD: Set
Topo.

12. Activate BSD Auto Range. Optimize the image by adjusting brightness and contrast.
INFO: The BSD detector has four amplification ranges (BSD Gain: Low, Medium, High, Very
High). Activating BSD Auto Range automatically switches the ranges, depending on the
contrast setting of the detector. Alternatively, the BSD Gain can be manually selected from
the drop-down list when BSD Auto Range is not activated. The suitable BSD Gain depends
on the signal strength (acceleration voltage, probe current, WD and sample material com-
position).
INFO: Risk of malfunction: the diode segments are sensitive to the light used for illumina-
tion in TV mode (infrared and white). When using a diode detector, always ensure that the
TV illumination is switched off. If the CCD Mode is set to Auto Detect, the TV illumination
is automatically switched off when a diode detector is used.
5.6.6 Setting up the YAG BSD Detector
NOTICE
Inserting the YAG BSD detector
When you manually insert the detector, there is a risk to damage the YAG BSD detector.
4 Use the chamberscope image to observe if there is enough space between the objective
lens and the specimen.
4 If there is not enough space between the objective lens and the specimen, then lower the
stage position before you insert the detector.
4 Insert the YAG BSD detector carefully and observe the moving YAG BSD detector via the
chamberscope.
Procedure 1. Insert the detector.

If there is any resistance, make sure the silver
knob is untightened.
2. In the SEM Controls panel, select the Detectors tab.

3. From the Signal A drop-down list, select YAG BSD.
4. To optimize the image, adjust brightness and contrast. There are no further parameters to
change.
5. After use, retract the detector.
INFO: Because of the detector’s weight, there is only little risk for it to accidentally slide in.
Therefore, you do not have to fix the silver knob.

5.6.7 Using the Variable Stage Bias
5.6.7.1 Setting up the Beam Deceleration for BSD Imaging
Beam deceleration is mostly used when imaging specimens with BSE detectors. By means of stage
biasing, a negative potential is applied to the specimen. This reduces the electron beam’s landing
energy, which enables you to obtain more specimen surface detail, especially at low magnifica-
tions. At high magnifications, you can obtain better image resolutions. The effectiveness strongly
depends on the specimen type. For metallic specimens, image improvements can easily be
achieved.
Beam deceleration can only be applied in HV mode. A potential in the range of 0 to −5 kV is used.
If the EHT voltage is set to 5 kV and a stage bias potential of −4 kV is applied, the landing energy
of the primary electrons is reduced to 1 kV.
The beam deceleration kit is mounted through a plate on the chamber door. A specially designed
specimen holder is generally used. This is to isolate the specimen holder, i.e. the bias is only ap-
plied to the specimen.
Fig. 41: Beam deceleration kit (left) and 9-stub beam deceleration specimen holder (middle and right)
CAUTION
electrical shock.
NOTICE
Touch alarm disabled
When beam deceleration or stage bias is activated, the stage touch alarm is automatically de-
activated. A warning is displayed to inform you that the touch alarm is not enabled. This
means that any stage collisions will not be detected.
4 Move the stage carefully.
Prerequisite ü The stage has been initialized before fitting the beam deceleration specimen holder.
ü HV mode is active.
ü The beam deceleration specimen holder is fitted.
Procedure 1. In the Stage Navigation Bar, click Settings.
2. Activate the Safe Navigation checkbox.
3. In the Stage Navigation Settings dialog, click Sample Holder Gallery.


On the left hand side, a list of icons represents the specimen holders.
4. In the Sample Holder Gallery dialog, select the installed beam deceleration specimen
holder, e.g. Stage Bias 9 Stub.
8. From the Panel Configuration Bar, select Variable Stage Bias.
à The Variable Stage Bias window is displayed.
9. Activate the Beam deceleration carousel checkbox.
10. Activate the Beam deceleration checkbox.
à The Beam deceleration volts scroll bar be-
comes available.
11. Use the Beam deceleration volts scroll bar to adjust the stage bias potential until you are
satisfied with the results.
5.6.7.2 Setting up the Stage Bias Low Voltage
Stage biasing can also be used for applying low voltages in the range of +20 V to −20 V to speci-
mens. This low-voltage specimen biasing is normally used in combination with the SE detector
and enables you to achieve an improvement in the image contrast.
Low-voltage specimen biasing can be applied under HV and VP conditions.
Info
Low-voltage biasing works with any standard, conducting, dovetail mounted specimen holder.
It does not work with lens-mounted specimen holders and other non-dovetail mountings.
If the Beam deceleration carousel checkbox is fitted and activated in SmartSEM, only high-
voltage beam deceleration can be used and low-voltage biasing is disabled.
CAUTION
electrical shock.

NOTICE
Touch alarm disabled
When beam deceleration or stage bias is activated, the stage touch alarm is automatically de-
activated. A warning is displayed to inform you that the touch alarm is not enabled. This
means that any stage collisions will not be detected.
4 Move the stage carefully.
Prerequisite ü Stage is initialized.

ü HV mode is active.
ü Standard conducting dovetail-mounted specimen holder is fitted.
Procedure 1. In the Stage Navigation Bar, click Settings.
2. Activate the Safe Navigation checkbox.
3. In the Stage Navigation Settings dialog, click Sample Holder Gallery.
On the left hand side, a list of icons represents the specimen holders.
4. In the Sample Holder Gallery dialog, select the installed specimen holder.
8. From the Panel Configuration Bar, select Variable Stage Bias.
à The Variable Stage Bias window is displayed.
9. Deactivate the Beam deceleration carousel checkbox.
10. Activate the Stage bias low voltage check-
box.
11. Use the Stage bias Low Volts scroll bar to adjust the voltage until you are satisfied with
the result.

ZEISS 5 First Operating Steps | 5.7 Working with Specific Specimen Types
5.7 Working with Specific Specimen Types

The following general factors need to be considered during any kind of specimen preparation:
§ You may need to reduce the size and weight of the specimen to fit it on the holder and to
ease specimen manipulation for observation.
§ Mineral and metallurgical specimens may require polishing. Etching and electro polishing may
also be required.
§ The specimen should be able to withstand the vacuum of the microscope as it might become
damaged or deformed.
§ If you want to use the specimen in High Vacuum (HV) mode, it needs to be clean and dry. The
presence of dust, moisture, oils, and grease can lead to charging, contamination, and longer
pump down times. Otherwise use VP or EP vacuum mode.
§ Porous specimens take a long time to pump out in High Vacuum mode.
§ The specimen should be firmly attached to the specimen stub or holder either mechanically or
by gluing. Silver dag and carbon dag can be used as conductive glues for small specimens.
Carbon tabs/tape are also convenient but may not provide good mechanical stability.
§ Health and safety procedures regarding the handling of the specimen during its preparation
need to be observed.
§ There should be good electrical connection between the surface of the specimen and speci-
men stub, especially for non-conductors.
Specimens can be divided into three main categories:
§ Conductive Specimen [} 91]
§ Non-conductive Specimen [} 93]
§ Hydrated Specimen [} 97]
5.7.1 Conductive Specimen
Conductive specimens (conductors) can be easily observed in a “conventional” SEM.

Conductive specimens are imaged in High Vacuum (HV) mode. For HV mode, only use the 20 μm
or 30 μm mid-column apertures.
Recommended The following parameters are recommended for conductive specimens. The values given are only
Parameters suggestions. The operator may find that different values give better information for the types of
specimens that are being investigated.
Parameter General Mi- EDS High Resolution

croscopy
EHT 20 kV § 20 kV for metals 30 kV

and minerals
§ 8 kV to 10 kV
for semiconduc-
tors and organic
materials
I Probe 200 pA 1000 pA or adjust 10 pA

for 30 % deadtime
WD 8.5 mm 8.5 mm for a 35° 5 mm

take off (elevation)
angle
Filament § Long Fil. Life § Fil I set to first § Long Fil. Life
activated peak for qualita- deactivated
tive analysis

5 First Operating Steps | 5.7 Working with Specific Specimen Types ZEISS
Parameter General Mi- EDS High Resolution

croscopy
§ Fil I set to first § Fil I set to sec- § Fil I set to sec-

peak for magni- ond peak for ond peak
fications quantitative
< 10,000 x (gives analysis
longer filament
life)
§ Fil I set to sec-
ond peak for
magnifications
> 10,000 x (for
better resolu-
tion)
Mid-column aperture 30 μm 30 μm 20 μm
Pressure-limiting – – –
aperture
Detector SE with collector bias BSD SE with collector bias

> +300 V INFO: If not in use, +400 V
retract any re-
tractable detectors
from the chamber.
Scanning parameters Cycle time = 20 s to Cycle time ≥ 20 s for Cycle time ≥ 1.3 min
reduce noise X-ray mapping to reduce noise
5.7.1.1 Using the Sample Type Selection Function
The sample type selection function enables the user to obtain an image of any specimen quickly,
i.e. a reference image, without putting any effort in selecting the operating parameters (vacuum
mode, acceleration voltage, probe current, and detector). The quality of the initial image can sub-
sequently be improved, if necessary, by modifying the imaging parameters.
Procedure 1. From the Panel Configuration Bar, select Sample Type Selection.
à The Sample Type Selection menu is dis-
played.
2. Select a sample type that is similar to the sample under analysis.

à A dialog is displayed asking you to provide more information about the sample under
analysis.
3. Enter the relevant parameters.
à When the information regarding the specimen status is provided, the software runs
macros that are assigned to the different specimen types, with predefined parameters
and vacuum settings.

5.7.2 Non-conductive Specimen
Non-conductive specimens can be imaged in one of the following vacuum modes:

HV mode If possible, coat non-conductors to prevent charging.
Observation of the specimen at low kV (start at 1 kV) is another good option to obtain a “charge
balance”.
VP Mode (optional) You can use variable pressure modes (VP mode), where a gas can be introduced into the speci-
men chamber. The gas molecules are ionized by collisions with secondary, backscattered, and pri-
mary electrons. The positively charged ions neutralize the negative charge that builds up on the
specimen surface due to the impact of high-energy primary electrons. This enables you to image
the specimen without the necessity to coat.
For VP mode, the 100 μm VP aperture is fitted under the objective lens and the 750 μm mid-col-
umn aperture is used.
Refer to Installing and Deinstalling the VP or EasyVP Apertures [} 93].
EasyVP Mode EasyVP is the recommended configuration for EVO series systems. EasyVP enables the use of all
(optional) Optibeam modes and switching between the HV and VP conditions, allowing a maximum cham-
ber pressure of 133 Pa. If higher chamber pressures are required for the charge compensation of
non-conductive specimen, the VP mode needs to be used.
For EasyVP mode, the 400 μm EasyVP aperture is fitted under the objective lens and the 20 μm
mid-column aperture is used.
Refer to Installing and Deinstalling the VP or EasyVP Apertures [} 93] and Aligning the Gun and
Mid-column Aperture for EasyVP Mode [} 96].
Recommended The following parameters are recommended for non-conductive specimens. The values given are
Parameters only suggestions and the operator may find that different values will give better information for
the types of specimens that are being investigated.
Parameter HV mode EasyVP mode
EHT 1 kV 25 kV
I Probe 10 pA 250 pA
WD 5 mm 8.5 mm
Filament Fil I set to second peak Fil I set to second peak
Mid-column aperture 20 μm 20 μm
Pressure-limiting aperture – 400 μm EasyVP aperture
Detector SE with collector bias +400 V BSD or VPSE
Scaning parameters Scan speed = 3 with frames Cycle time ≥ 20 s

to average = 30 to reduce
noise
Chamber pressure HV 10 Pa for BSD detector,

40 Pa for VPSE detector or
adjust to eliminate charge
disturbances
5.7.2.1 Installing and Deinstalling the VP or EasyVP Apertures
To use the optional VP mode or EasyVP mode, you need to install the VP or the EasyVP pressure-
limiting aperture under the objective lens.
Additionally, you need to select the mid-column aperture according to the pressure mode and the
pressure-limiting aperture and adjust some settings in SmartSEM.

Pressure-limiting aperture Mid-column aperture
None (HV mode) 20 μm or 30 μm
400 μm EasyVP aperture 20 μm or 30 μm
100 μm VP aperture 750 μm
Fig. 42: 100 μm VP aperture or 400 μm EasyVP aperture
Parts and Tools  400 μm EasyVP aperture (354720-1464-000)

 Alternatively: 100 μm VP aperture (350700-0700-000)
 Aperture removal tool (350700-0692-000)
 VP aperture tool (350700-0859-000)
Prerequisite ü The microscope is equipped with the VP mode or EasyVP mode option.
2. To vent the specimen chamber, click Vent.
3. If a lens-mounted BSD is fitted, remove the BSD
and place it in the parked position.
4. Retract all retractable detectors.

5. If another pressure-limiting aperture is fitted,

remove the aperture with the aperture removal
tool.
6. Use the VP aperture tool to either install the VP aperture or the EasyVP aperture.
INFO: This should be finger-tight only.
7. Refit the lens-installed BSD detector.
9. Click Select Aperture and select the appropri-
ate aperture.
10. To evacuate the specimen chamber, click Pump in the Vacuum tab.
changer, to select the appropriate aperture:
Select the 20 μm aperture (position 1) for
EasyVP mode.
Select the 750 μm aperture (position 3) for VP
mode.
12. In the Apertures tab, match the aperture size from the Aperture Size drop-down list to
the selected aperture.
13. In the Vacuum tab, click Go To VP.
14. To adjust the working pressure, use the VP Target scroll bar.

15. Adjust the working parameters, refer to Non-conductive Specimen [} 93].

16. To return to HV mode, repeat steps 1 to 5 and step 7 to dismount the aperture, deselect
the aperture in the Apertures tab and click Go To HV in the Vacuum tab.
5.7.2.2 Aligning the Gun and Mid-column Aperture for EasyVP Mode
To achieve an optimal alignment of the beam through the 20 μm mid-column aperture, you need
to perform an alignment procedure.
Info
You can refer to Using the Automatic Gun Alignment Functions [} 79] and Using the Auto
Aperture Alignment Function [} 80] to help you with these tasks.
Info
Once the alignment is optimized, do not change the position of the X and Y micrometer
gauges on the mid-column aperture changer.
Prerequisite ü The EasyVP aperture is fitted.

ü The 20 µm aperture is selected at the mid-column aperture changer (position 2).
Procedure 1. From the Menu Bar, select Tools > User Preferences.
à The User Preferences dialog is displayed.
2. Check that Auto Calibration and User Align are set to Yes.
3. Adjust the following settings in the SEM Controls panel:
Select the EasyVP Aperture
Optibeam = Resolution
Aperture Size = 20.00 µm
EHT Target = 20.00 kV
I Probe = 100 pA
WD = 8.5 mm
Signal A = SE1
Operating Mode = Normal
INFO: For details on where to adjust these settings, refer to Acquiring an Image [} 73].
4. To carry out a C1/C2/C3 lens hysteresis removal, press <Shift + F2>.
5. To create an emission image, select Beam > Gun Align from the Menu Bar.
à The Gun Alignment window is displayed.

6. Click Emission.
7. Adjust the Emission Zoom to 35.
8. To zero the aperture alignment, select Aperture Align from the Panel Configuration
Bar.
10. Make sure that the filament is saturated.
11. Set Brightness and Contrast to 50 %.
12. Adjust Contrast to make the outer region of the emission image visible around the brighter,
central part of the emission image.
13. Adjust the Brightness and Emission Zoom to improve the visibility.
14. Adjust the emission image with Gun Shift and Gun Tilt so that the bright part is at the cen-
ter of the image.
15. Focus a feature on the specimen.

16. Select a fast scan speed, e.g. Scan Speed = 1.
17. To align the mid-column aperture, select the Apertures tab in the SEM Controls panel.
18. Activate the Focus Wobble checkbox.
19. Adjust the Wobble Amplitude and activate the Wobble Fast checkbox.
20. Carefully adjust the X and Y micrometers gauges of the mid-column aperture changer to
align the mid-column aperture and eliminate any lateral image shift.
21. To carry out a hysteresis correction, press <Shift + F2>.
22. If necessary, repeat steps 14 to 21.
5.7.3 Hydrated Specimen
Observation of hydrated (moist) specimen at low kV (start at 1 kV) slows down the dehydration of
moist specimens that leads to structural collapse.
Optimum imaging of moist specimens, requires an EVO microscope with the options Peltier cool-
stage and Extended Pressure (EP) mode. This setup enables you to study hydrated specimen in
their native state with little or no loss of water. For EP mode, the 100 μm EP aperture is installed
as well as the 500 or 1000 μm beamsleeve.
The imaging in EP mode consists of the following steps:
§ Installing or Deinstalling the EP and Beemsleeve Apertures [} 98]
§ Mounting the Peltier Coolstage [} 101]
§ Activating the Peltier Coolstage [} 105]
§ Purging the Chamber [} 106]
§ Setting Initial Operating Parameters [} 106]
§ Adjusting Operating Parameters [} 107]

Recommended The following parameters are recommended for hydrated specimens. The values given are only
Parameters suggestions and the operator may find that different values will give better information for the
types of specimens that are being investigated.
Parameter EP mode for cooled hy- EP mode for hydrated

drated specimens specimens
EHT 20 kV 20 kV
I Probe 300 pA 300 pA
WD 8.5 mm 5 mm
Filament Fil I set to second peak Fil I set to second peak
Mid-column aperture 750 μm 750 μm
Pressure-limiting aperture 100 μm EP aperture 100 μm EP aperture
Beamsleeve aperture 500 μm 500 μm
Detector BSD or C2DX BSD or C2DX
Scanning parameters Cycle time ≥ 20 s Cycle time ≥ 20 s
Chamber pressure 650 Pa to slow dehydration 2500 Pa to 3000 Pa to retain

water at ambient tempera-
ture (20 °C to 30 °C)
Temperature Temperature of the speci- –

men to retain water at
650 Pa = 1 °C (controlled by
the Peltier coolstage)
5.7.3.1 Installing or Deinstalling the EP and Beemsleeve Apertures
To use the optional EP mode, you need to install the EP and beamsleeve pressure-limiting aper-
tures under the objective lens.
Additionally, you need to select the 750 μm mid-column aperture and adjust some settings in
SmartSEM.
Pressure-limiting aperture mid-column aperture
None (HV mode) 20 μm or 30 μm
100 μm EP aperture 750 μm

and 500 μm or 1000 μm beamsleeve aper-
ture
Parts and Tools  100 μm EP aperture (upper aperture assembly, 354720-9309-000)

 Beamsleave aperture 500 μm (lower aperture assembly, 354720-0266-000), recommended
 Beamsleave aperture 1000 μm (lower aperture assembly, 354720-0267-000), alternatively
 Aperture removal tool (350700-0692-000)
 Upper aperture tool (354720-9310-009)
 Lower aperture tool (354720-9297-009)

Info
The 500 µm beamsleeve allows EP pressures up to 3000 Pa, but only 0.5 mm maximum field
of view.
The 1000 µm beamsleeve allows EP pressures up to 1000 Pa, and 1 mm maximum field of
view.
Fig. 43: 100 μm EP aperture and 500 μm beamsleave aperture
Prerequisite ü The microscope is equipped with the EP mode option.

2. To vent the specimen chamber, click Vent.
3. If a lens-installed BSD is fitted, remove the BSD
and place it in the parked position.
4. Retract all retractable detectors.

5. If another pressure-limiting aperture is fitted,

remove the aperture with the aperture removal
tool.
6. Use the red upper aperture tool to install the EP

aperture.
INFO: This should be finger-tight only.
7. Use the black lower aperture tool to insert the

beamsleeve aperture.
INFO: Screw in until the O-ring is completely
inserted (cannot be seen) and the beamsleeve
aperture hits a hard stop. Do not over tighten.
The O-ring will give some resistance which is
normal.

9. Click Select Aperture.
10. Select EP Aperture and select the appropriate beamsleeve aperture.
changer, to select the 750 μm aperture (posi-
tion 3).
à In the Apertures tab, the 100 μm EP aperture is automatically selected.

5.7.3.2 Mounting the Peltier Coolstage
Parts and Tools  Hex key, 1.5 mm (000000-0151-883)

 Hex Key, 2.5 mm
 Hex Key, 3.0 mm
 Stub tool
Procedure 1. Use a hex key 3 mm to remove the round right

hand blanking plate from the chamber door.
2. To detach the Peltier-coolstage assembly from

its holder plate, undo the cable ties.

3. Feed the Peltier-coolstage holder through the

hole in the chamber door and carefully rest it
with its pipe work on the stage.
4. Attach the Peltier head to the stage via the

dovetail fitting used for all other specimen
holder types.
5. To ensure the Peltier cable is not too bent,

twisted, or strained, adjust the stage via stage
rotation to a suitable position.

6. Use a hex key 2.5 mm to attach the Peltier-

coolstage holder to the microscope stage.
7. Use a hex key 3 mm to fix the Peltier vacuum

flange to the chamber door.

8. Use the stub tool to place the plain stub on the

Peltier-coolstage specimen holder. Ensure that
the stub is positioned horizontally (is not tilted)
to ensure good contact to the cooling area.
INFO: For wet imaging of hydrated specimens,
it is essential to maintain a constant cooling
temperature on the stub.
9. Use a hex key 1.5 mm to carefully tighten the

clamp screw.
10. Re-fit the BSD if required.

11. Carefully close the chamber door without trap-
ping the pipe work of the Peltier coolstage.

5.7.3.3 Activating the Peltier Coolstage
You need to activate the stage and the EP option in the software and set the working pressure
before you can use the EP mode.
NOTICE
Rotating the Peltier coolstage
The Peltier coolstage can be damaged when stage rotation is used.
4 Only move the stage in X and Y direction.
Procedure 1. Switch on the Peltier coolstage power supply.
2. To evacuate the system, click Pump in the Vacuum tab of the SEM Controls panel.
3. Wait until Vac Status = Ready and EHT Vac ready = Yes are displayed.
This can take some time.
4. From the Menu Bar, select Stage > Navigation.
à The Stage Navigation panel is displayed.
5. Click Settings.
6. In the Stage Navigation Settings dialog, click Show Holder Gallery.
7. In the Sample Holder Gallery dialog, click CoolStage MK3.

11. Select Tools > Administrator and log in with your username and password.
12. Select Other and activate the Peltier Fitted checkbox.

13. Select the USB connection and activate the Humidity Option checkbox.
14. In the Vacuum tab of the SEM Controls panel, select Go to EP.
15. Use the EP Target scroll bar to adjust the working pressure to 10 Pa.
16. Adjust the other working parameters. For information on working parameters for different
specimens, refer to Hydrated Specimen [} 97].
5.7.3.4 Purging the Chamber
You need to purge the chamber to remove air from the water bottle and to fill the chamber with
pure water vapor.
Procedure 1. From the Panel Configuration Bar, select Extended Pressure.
à The Extended Pressure window is displayed.
2. Activate the Peltier checkbox.
3. Click Purge Settings.
à The Purge Control window is displayed.
4. Check that EP Gas = Air is selected.
5. If the water kit has recently been fitted, filled with water, or has not been used for a while,
set Purge cycles to 10.
6. If the system has recently been used in the wet mode, set Purge cycles to 3.
7. Set Purge Max to 1000 Pa.
8. Set Purge Min to 100 Pa.
9. Click EP Gas = Air to toggle the vacuum status to EP Gas = Water vapour.
10. To start purging, click Manual Purge H2O.
à The pressure in the chamber varies between the set maximum and minimum levels. Bub-
bles may be seen in the water bottle. All air is eventually removed from the water bottle.
à The process can take a while to be completed. The progress is displayed in the status bar.
5.7.3.5 Setting Initial Operating Parameters
Procedure 1. In the Extended Pressure window, set the Peltier Target to 1 °C.
2. Adjust Humidity Target to a suitable value.
3. Adjust the position of the green cross on the phase diagram to change the environment of
the specimen between water vapor, water, or ice.
4. Switch on the beam.
5. Use the stage navigation to position the specimen under the beam.
INFO: Use the Stage Navigation Bar or the chamberscope to monitor stage movement.

6. Adjust the imaging parameters.

INFO: The parameters depend on the type of specimen being examined and the nature of
the detail you are expecting to see.
It is recommended to start with:
EHT = 20 kV
I Probe = 400 pA or higher
Chamber pressure = 650 Pa
Peltier temperature = 1 °C
WD = 6.0 mm
Detector = BSD or C2DX
7. Center and focus a distinguishable feature on the specimen.
5.7.3.6 Adjusting Operating Parameters
Procedure 1. Increase the pressure to 550 Pa and keep the temperature constant at 1 °C.
2. Increase the pressure in steps of 20 Pa and review the image.
à The water droplets start to appear around 600 Pa.
3. Once the water droplets are clearly visible on the stub, make a note of the pressure.
INFO: The rate of water condensation from the chamber on the stub and the evaporation
of the droplets from the stub to the chamber should be at equilibrium.
4. In the Purge Control window, set Purge Min to the pressure value obtained in the previ-
ous step.
5. Set Purge Max to a pressure value that is around 100 Pa higher than the Purge Min
value.
6. Adjust the Purge Cycle to 3.
7. Vent the chamber without changing any of the parameters.
8. Remove the plain stub and dry the area underneath the stub on the Peltier coolstage.
9. Carefully install the specimen on a new stub, place and tighten the stub on the Peltier cool-
stage.
10. Use a pipette for putting a few droplets of distilled water on the Peltier coolstage holder.
INFO: Do not put any water droplets on the stub or directly on the specimen as the water
droplets can cover the specimen surface and prevent viewing the areas of interest.
11. Move the Peltier coolstage slightly to the right or left of the chamber before closing the
chamber door.
This prevents any droplets splattering up on the C2D, BSD, or the objective lens area during
the pump down process.
12. Close the chamber door and pump down the system.
13. Switch on the beam.
14. Use the stage navigation to position the specimen under the beam.
INFO: Use the Stage Navigation Bar or the chamberscope to monitor the stage move-
ment.
15. If necessary, increase the pressure, but in very small steps.
INFO: If you increase the pressure in large steps, water can accumulate on the specimen
and prevent imaging.
16. If necessary, adjust the humidity level to achieve 100 % humidity.
INFO: This changes both the Peltier temperature and the chamber pressure.
17. If necessary, increase the EHT.
INFO: This increases the signal strength but can damage the specimen.
18. If necessary, reduce the spot size.
INFO: This provides higher resolution but means loss of signal.
19. If necessary, reduce the WD.
INFO: This increases the signal strength but reduces the field of view, which means that a
montage of specimen images may be required.

5 First Operating Steps | 5.8 Switching Off the Microscope System ZEISS
5.8 Switching Off the Microscope System
5.8.1 Finishing the Work Session | LaB₆ Filament
To obtain the maximum lifetime of a LaB₆ emitter, switch off the EHT when the microscope is not
in use and switch the gun to STANDBY mode when the microscope is not used for longer peri-
ods of time. In STANDBY mode, the filament continues to be heated, and the vacuum in the
electron column and in the specimen chamber are maintained. It is recommended that you do not
turn off the gun during its service lifetime.
The STANDBY mode is also the recommended mode to store the microscope. In this case, acti-
vate the Partial Vent on Standby checkbox in the Vacuum tab of the SEM Controls panel. This
can help to prevent oil vapors from penetrating into the specimen chamber during the period of
storage.
To further extend the service life time, you can activate the Long Fil. Life checkbox in the Gun
tab of the SEM Controls panel. This reduces the filament current to “first peak” conditions,
which provides satisfactory operating conditions for general microscopy. If optimum performance
is required, the Long Fil. Life checkbox should be deactivated.
Prerequisite ü The microscope is in ON mode.

Procedure 1. Click the All: button in the status bar.
2. Select EHT Off from the pop-up menu.

3. Only when interrupting work for longer periods between 2 and 7 days: In the Vacuum tab
activate the Partial Vent on Standby checkbox.
à This maintains the gun vacuum, and switches off and protects the turbo pump.
4. Exit the SmartSEM user interface. Refer to Closing the SmartSEM User Interface [} 109].
5. Close all programs and software.
6. Select Windows start button > Power icon > Shut down.
7. At the front of the plinth, press the Standby button.
à The microscope switches to Standby mode.
5.8.2 Finishing the Work Session | Tungsten Filament
Info
gun.
Info
The tungsten filaments have only a limited lifetime of 100–300 operating hours. If you operate
the microscope with a tungsten filament, then do the following:
the filament.
Prerequisite ü The microscope is in ON mode.

ZEISS 5 First Operating Steps | 5.8 Switching Off the Microscope System
Procedure 1. Click the All: button in the Status Bar.
2. Select Shutdown Gun from the pop-up menu.

3. Exit the SmartSEM user interface. Refer to Closing the SmartSEM User Interface [} 109].
4. Close all programs and software.
5. Select Windows start button > Power icon > Shut down.
6. At the front of the plinth, press the STANDBY button.
à The microscope switches to Standby mode.
7. Only when interrupting work for longer periods: Press the OFF button.
à The microscope switches to OFF mode.
à The electron column is partially vented.
à Computer, electronic components, and vacuum system are switched off.
à A 24 V auxiliary voltage is still present to
restart the microscope.
5.8.3 Closing the SmartSEM User Interface
5.8.3.1 Logging off from the SmartSEM User Interface
Procedure 1. From the Menu Bar, select File > Log Off.
à A system message is displayed.
2. Click Yes.
3. Close the EM Server.
4. Click Yes.
INFO: The EM server remains active.
5.8.3.2 Closing the SmartSEM User Interface
Procedure 1. From the Menu Bar, select File > Exit.

2. Click Yes.
3. Close the EM Server.
4. Click Yes.

5 First Operating Steps | 5.9 De-energizing the Microscope ZEISS
5.9 De-energizing the Microscope

This procedure completely cuts off the microscope from the electrical main supply.
WARNING
plug.
Prerequisite ü The microscope is in Standby mode or in OFF mode, refer to Finishing the Work Session | LaB₆
Filament [} 108] or Finishing the Work Session | Tungsten Filament [} 108].
Procedure 1. If the microscope is not yet in OFF mode, press the Off button at the front of the plinth.
à When all subsystems are fully deactivated,
the Off button lights up red permanently.
2. Close and lock the main shut-off valves at the installation site.
3. If the EMO circuit is not installed, unplug the
power cord by unplugging the CEE connector
from the CEE FEMALE RECEPTACLE of the
mains supply.
4. If the EMO circuit is installed, switch the Main

Switch to its OFF position.
9 The microscope is completely cut off from the electrical main supply.

ZEISS 5 First Operating Steps | 5.10 Performing an Emergency Shutdown
5.10 Performing an Emergency Shutdown

If an emergency occurs and you quickly must shut down the microscope, then you need to per-
form an emergency shutdown.
WARNING
plug.
NOTICE
Components in the high voltage circuitry
When the microscope, especially the gun, is fully on, an abrupt shutdown of all electrical sup-
plies may damage some components in the high voltage circuitry, mainly the cathode.
4 Use the emergency off only in an emergency situation with personnel injury.
Procedure 1. If the EMO circuit is not installed, unplug the

mains supply.
2. If the EMO circuit is installed, press the EMO

button on the top of the plinth.

6 Care and Maintenance | 6.1 Safety During Cleaning and Maintenance ZEISS
6 Care and Maintenance

To ensure the best possible performance of the Microscope System, maintenance must be per-
formed on a regular basis. To maintain operational safety and reliability of the Microscope Sys-
tem, we recommend entering into a ZEISS Protect service agreement. Please keep the service
logs for your Microscope System.
Info
Additional information and detailed descriptions are available in the further applicable docu-
ments, or ask your ZEISS Sales & Service Partner.
6.1 Safety During Cleaning and Maintenance

Only conduct preventive measures described here. All tasks of maintenance, service and cleaning
not described must only be performed by an authorized ZEISS service representative.
Any unauthorized intervention or any operation outside the scope of the intended use can lead to
injuries and property damage and voids all rights to warranty claims. Only original spare parts
from ZEISS may be used.
DANGER
Electric shock due to live parts
When the Microscope System is still switched on, coming in contact with live parts can lead to
electric shock or burn.
4 Switch off Microscope System prior to opening or cleaning.
4 Disconnect live parts from the power supply.
6.2 Maintenance Schedule

To maintain best possible performance of the Microscope System, it is essential to perform pre-
ventive maintenance on a regular basis.
In order to ensure optimum performance, it is essential to perform preventive maintenance at reg-
ular intervals. The recommended intervals for maintenance depend on the total uptime of the Mi-
croscope System.
§ 24 hours, 7 days a week: semiannually
§ 8 hours, 5 days a week: annually
Info
Keep track of maintenance work and contact the ZEISS service representative in time.
A list of ZEISS locations and authorized service partners can be found at:
http://www.zeiss.com/microscopy

ZEISS 6 Care and Maintenance | 6.3 Maintenance Work
6.3 Maintenance Work

Only conduct maintenance work described in this document. All tasks of maintenance, service and
repair not described here must only be performed by an authorized ZEISS service representative.
6.3.1 Change of Consumables and Chemicals
The change of consumables and chemicals has to be performed by a ZEISS service representative
at mandatory intervals.
The times scheduled are designed for the maximum equipment performance level (i.e. 24 h per
day of permanent operation).
Interval Component/Part
As required Filament
Yearly or as required Tip seal and tip O-ring of the pre-vacuum

pump
Yearly performance check § SE detector

§ All optional detectors
Tab. 5: Schedule for the change of consumables
6.4 Care and Cleaning Work

All care and cleaning work not described here must only be performed by an authorized ZEISS ser-
vice representative.
NOTICE
Functional impairment due to dirt and moisture
Dirt, dust and moisture can impair the Microscope System’s functionality and can cause short-
circuits.
4 The ventilation slots must be unobstructed at all times.
4 Perform regular maintenance and cleaning according to the instructions in this document
and according to the instructions in the applicable documents.
4 Make sure that no cleaning liquid or moisture gets inside the Microscope System.
4 In case of damage, the affected parts of the Microscope System must be taken out of op-
eration.
6.4.1 Cleaning the Microscope
If required, use a moistened lint-free cloth to clean the outside of the microscope.

7 Troubleshooting | ZEISS
7 Troubleshooting
The following table provides information about solving common problems.
Info
If you cannot solve the problem or if you are unsure about a certain technical difficulty, con-
tact your local ZEISS service representative.
Symptom Cause Measure
Chamber does not Isolation mounts Refer to Adjusting the Isolation Mounts
move freely have lost air [} 119]
Drift: Specimen § Charging effects § Ensure proper conduction of the speci-

seems to be moving § Nonconductive men
specimen § Optimize specimen preparation
§ Apply a charge compensation method
Stub not correctly Fix the stub correctly

fixed by screw
After an emergency Stage needs to be Refer to Initializing the Stage [} 115]

off, the stored stage initialized
position cannot be
approached correctly
Gun is switched off Gun has been Refer to Baking out the Gun Head [} 120]
automatically switched off for
safety reasons since
gun vacuum is worse
than the pressure
threshold
Image is bad at low Working distance is Reduce the working distance to a maximum
EHT (e.g. 1 kV) too long of 7 mm
Image resolution is Saturation values of Correct saturation values

low the filament are
wrong
Lifetime of the fila- Refer to Replacing Filaments [} 121]

ment is exceeded
Microscope is dead Circuit breaker is Refer to Checking the Position of the Circuit
tripped (lower posi- Breakers [} 147]
tion)
Stored position of PC has crashed. Restart the PC

the specimen stage
cannot be ap- Stage needs to be Refer to Initializing the Stage [} 115]
proached correctly driven to a well-de-
fined position
After a power fail- Stage needs to be Refer to Initializing the Stage [} 115]
ure, the stored stage initialized
position cannot be
approached correctly
SE image is noisy Scintillator is used up Contact your local ZEISS service representa-
tive to have the scintillator replaced

ZEISS 7 Troubleshooting | 7.1 Chamber
Symptom Cause Measure
Stage does not move Stage needs to be Refer to Initializing the Stage [} 115]
initialized
Stored position of Absolute stage Refer to Initializing the Stage [} 115]

the specimen stage movement is re-
cannot be ap- quired, stage needs
proached correctly to be driven to a
well-defined position
Microscope does not No nitrogen Check nitrogen supply

vent
No compressed air Check compressed air supply
Vac ready = OK is System vacuum is Check the chamber door seal for cleanliness.
not displayed after bad due to a vac- If required, refer to Replacing the Chamber
specimen exchange uum leak at the Door Seal [} 117]
chamber door
Vac ready = OK is Gas ballast at rotary Deactivate gas ballast at the pre-vacuum
displayed very late pump or scroll pump pump
after specimen ex- is activated
change
Vac ready = OK is Penning gauge has Restart the microscope.

displayed abnormally not been identified If this does not solve the problem, contact
fast correctly your local ZEISS service representative
If you use a LaB₆ fila- The pumping capac- Refer to Baking out the Gun Head [} 120]
ment and gun vac- ity of the ion getter
uum is worse than pump decreases in
1 × 10⁻⁶ mbar the course of time,
thus deteriorating
the gun vacuum
Tab. 6: Troubleshooting
7.1 Chamber
7.1.1 Initializing the Stage
If a stored stage position cannot be approached or if the stage does not move or does not move
accurately, the stage needs to be initialized.
CAUTION
fingers.
Prerequisite ü The specimen chamber has been evacuated, refer to Loading the Specimen Chamber [} 63].
ü Requires the Stage Initialise privilege.
ü If there are any large specimens inside the chamber, remove them before initializing.

7 Troubleshooting | 7.1 Chamber ZEISS
Procedure 1. From the Menu Bar, select Stage > Stage Initialise.
à The Initialise Stage window is displayed.
2. Confirm via Yes.
à The stage initialization process takes a few minutes.
à INFO: If initialization of the stage does not solve the stage problem, contact your local
ZEISS service representative.
7.1.2 Defining the Post Initialization Position of the Stage
You can configure the position to which the stage drives after the initialization procedure. Other-
wise, the stage drives to the center position.
CAUTION
fingers.
Prerequisite ü Requires the Supervisor privilege.

Procedure 1. From the Windows start menu, select SmartSEM > SmartSEM Administrator.
à The SmartSEM Administrator Log on window is displayed.
2. Enter user name and password.
3. To confirm, click OK.
à The SmartSEM Administrator window is displayed showing the user list.
4. Click Column/Stage.
5. In the Stage Post Initialisation Position input fields, enter the desired position.
Alternatively, use the dual joystick to navigate to the desired position and click Set to cur-
rent position.
6. To activate the function, activate the Post Init. Posn Valid checkbox.
7.1.3 Changing the Joystick TV Angle
In TV mode (chamberscope), the dual joystick and stage may appear to move in opposite direc-
tions. This is because the selected CCD camera is installed at a certain angle relative to the stage.
Thus, the camera shows a side-inverted view. To remedy this, you need to change the joystick TV
angle setting in the software.
Info
If you are working with two CCD cameras: The joystick TV angle can only be set for one CCD
camera. When selecting the other CCD camera, you have to change the setting.
CAUTION
fingers.

Prerequisite ü Requires the Supervisor privilege.

Procedure 1. From the Windows start menu, select SmartSEM > SmartSEM Administrator.
à The SmartSEM Administrator Log on window is displayed.
2. Enter user name and password.
3. To confirm, click OK.
à The SmartSEM Administrator window is displayed showing the user list.
4. Click Column/Stage.
5. In the Stage Options section, double-click the Joystick TV Angle input field.
6. Enter an angle depending on the installation lo-
cation of the CCD camera.
If the CCD camera is installed at the front, enter
0°.
If the CCD camera is installed at the side, enter
90°.
7.1.4 Resetting the Touch Alarm
To prevent damage, a touch alarm is integrated in the microscope. If the specimen or the speci-
men holder touches the chamber walls, the detectors, or the objective lens, the stage is stopped
immediately. An audible warning sounds and an on-screen message is displayed.
Prerequisite ü The EM server shows the message WARNING Stage Touching.

Procedure 1. To accept the warning, click OK.
2. Move the stage in the reverse direction away from the touch.
7.1.5 Checking the Temperature
Procedure 1. In the Panel Configuration Bar, double-click Water Flow/Temperature.

à The Water Flow/Temperature panel is displayed.
2. Check the entries.
à If a value is critical, it is displayed in red.
7.1.6 Replacing the Chamber Door Seal
Possible reasons for replacing the chamber door seal are the following:
§ Chamber door does not close tightly
§ Bad chamber vacuum
1. Venting the Specimen Chamber [} 64]
2. Replacing the O-ring [} 118]
3. Evacuating the Specimen Chamber [} 66]

7 Troubleshooting | 7.1 Chamber ZEISS
7.1.6.1 Replacing the O-ring
WARNING
CAUTION
fingers.
CAUTION
Closing the chamber door
Fingers can be pinched when closing the chamber door.
4 Ensure not to get your fingers caught in the chamber door gap.
NOTICE
times.
Procedure 1. Carefully open the chamber door.

2. On the inside of the chamber door, remove the
chamber door O-ring.
NOTICE If you use a metal tool to re-
move the O-ring, then you may damage
the sealing surface. If necessary, then only
use a plastic or wooden tool to remove
the O-ring.
3. Inspect the groove that holds the O-ring and remove any contamination.
4. Insert the new chamber door O-ring.
5. Close the chamber door.

7.1.7 Adjusting the Isolation Mounts
If the column is unable to move freely, adjust the isolation mounts.
Parts and Tools  Isolation mounts setting tool (350600-1476-000), delivered with the microscope
CAUTION
Crushing fingers between table and microscope chamber
The gap between table and microscope chamber is designed to allow the specimen chamber
to swing freely. The size of the gap varies during operation and can cause crushing injuries.
4 Do not place your fingers between table and microscope chamber.
NOTICE
Isolation mounts
The isolation mounts are specified only up to 4.5 bar. If you pump up the isolation mounts
above 4.5 bar, then the isolation mounts could be destroyed.
4 When pumping up the isolation mounts, avoid pressures above 4.5 bar.
Procedure 1. To check if the isolation mounts need to be adjusted, give the column a gentle nudge:
If the column is able to move freely, then skip the subsequent steps; no further action is re-
quired.
If the column is unable to move freely, then adjust the isolation mounts as described in the
following steps.
2. To adjust the isolation mounts, remove the
caps from the inlet valves at the back of the
plinth.
3. Attach a foot pump to one the inlet valves.

4. Pump the inlet valve so that the gap between
chamber and table is 10 mm (for EVO 25) or
7.5 mm (for EVO 10 und EVO 15).
Use the isolation mounts setting tool to check
the correct height.
5. Repeat steps 3 and 4 for the remaining inlet valves.

6. Ensure that the gap has the same height all around the isolated table.
7. Check that the column is able to move freely.
If the column is not able to move freely, then repeat steps 3 to 7 until the column is able to
move freely.

7 Troubleshooting | 7.2 Column ZEISS
7.2 Column
7.2.1 Baking out the Gun Head
The gun vacuum deteriorates with time. For an optimum use of the LaB₆ filament it is essential
that the gun vacuum is always in the 10⁻⁷ mbar region. If the pressure rises above this value, it is
strongly recommended to bake out the gun head.
1. Switching off the Gun | LaB₆ Filament [} 120] or Switching off the Gun and EHT | Tungsten Fil-
ament [} 120]
2. Starting the Bakeout [} 121]
3. Switching on the Gun | LaB₆ Filament [} 68] or Switching on the Gun and EHT | Tungsten Fila-
ment [} 72]
7.2.1.1 Switching off the Gun | LaB₆ Filament
Info
Procedure 1. In the right part of the Status Bar, click .

à The pop-up menu for vacuum, gun, and EHT activation is displayed.
2. Click Shutdown Gun.
3. Wait until the gun has ramped down.
à This may take up to 5 minutes.
7.2.1.2 Switching off the Gun and EHT | Tungsten Filament
Info
gun.
Info
Tungsten filaments have only a limited lifetime of 100–300 operating hours. If you operate the
microscope with a tungsten filament, then do the following:
the filament.
4 Enable Auto Saturation at shutdown.
Procedure 1. In the right part of the Status Bar, click .

à The pop-up menu for vacuum, gun, and EHT activation is displayed.
2. Click Shutdown Gun.
3. Wait until the gun has ramped down.
à This may take up to 5 minutes.

ZEISS 7 Troubleshooting | 7.2 Column
7.2.1.3 Starting the Bakeout
Info
You cannot work with the microscope while the bakeout procedure runs.
NOTICE
Hot surfaces during bakeout
Parts of the enclosure in the upper range of the column may become hot during bakeout, par-
ticularly after a long bakeout cycle.
4 Do not place any combustible objects on the grids of the electron optical column during
bakeout.
4 After the bakeout procedure, let surfaces cool down before working around the column.
4 Only advanced operators are allowed to perform the bakeout procedure.
Prerequisite ü Requires the Supervisor privilege and the user level Service.
ü Only advanced operators are allowed to perform the bakeout procedure.
Procedure 1. In the Panel Configuration Bar, double-click Bakeout.
à The Bakeout dialog is displayed.
2. If the Full service bakeout checkbox is available, deactivate the Full service bakeout
checkbox.
INFO: Full service bakeout includes column heating that may lead to column misalignment.
3. From the Bakeout drop-down list, select a bakeout cycle.
For 2 hours heating / 1 hours cooling, select Quick.
For 8 hours heating / 2 hours cooling, select Overnight.
For 40 hours heating / 3 hours cooling, select Weekend.
For a cycle defined by the operator, select User.
INFO: You can switch to Standby mode while the bake-out procedure is running. Before
you switch to Standby mode, ensure that the Partial Vent on Standby checkbox is deacti-
vated in the SEM Controls panel.
4. To start the bakeout procedure, click Bakeout Start.
5. After bakeout, allow the column to cool down.
INFO: The pressure changes due to residual heat in the gun area. A cooling period is neces-
sary to allow the vacuum to improve. The cooling period depends on the room tempera-
ture. The gun monitor monitors the pressure improvement as the cooling time progresses.
7.2.2 Replacing Filaments
The filament is the electron source of the microscope. To extract electrons from the filament, it is
heated up and a high voltage is applied. During operation, the filament slowly degrades. The fila-
ment must be replaced if it is used up or damaged.
Info
To display the operating hours of the filament, select View > SEM Status > Select > Fila-
ment Age.
Info
ZEISS encourages all customers to keep a record on the filament exchanges. Such a record
simplifies maintenance.

With the EVO microscope, you can use the following types of filaments:
§ Tungsten filaments (pre-aligned)
§ Tungsten filaments (not pre-aligned)
§ LaB₆ filaments
The procedure for replacing the filament is similar for all types of filaments. For details and differ-
ences, refer to the lists for the different types of filaments after the overview figure.
Venting the Gun and the Specimen Chamber
De-energizing the Microscope
Disassembling the Gun
Disassembling the Firing Unit
Cleaning the Firing Unit
Cleaning the Anode
Tungsten, pre-aligned - Tungsten, not pre-aligned

- LaB₆
- Exchange LaB₆ to Tungsten
Unpacking a New Filament Holder Disassembling the Filament Holder
Unpacking a New Filament
Installing the Filament to the

Filament Holder
Installing the Filament Holder to the Firing Unit
Installing the Brass Retaining Washer
Reinstalling the Firing Unit to the Gun
Reinstalling the Gun to the Microscope
Starting the Microscope
Only LaB₆:
Starting up the Filament
Aligning the Emission Image
Fig. 44: Overview of the procedure for replacing the different types of filament


Tungsten 1. Venting the Gun and the Specimen Chamber [} 124]
Filaments pre- 2. De-energizing the Microscope [} 125]
aligned
3. Disassembling the Gun [} 126]
4. Disassembling the Firing Unit [} 127]
5. Cleaning the Firing Unit [} 128]
6. Cleaning the Anode [} 130]
7. Unpacking a New Filament Holder | Tungsten Filament (Pre-Aligned) [} 132]
8. Installing the Filament Holder to the Firing Unit [} 137]
9. Installing the Brass Retaining Washer | Tungsten (Pre-Aligned) [} 138]
10. Reinstalling the Firing Unit to the Gun [} 142]
11. Reinstalling the Gun to the Microscope [} 143]
Tungsten This procedure also applies to the replacement of LaB₆ filaments with tungsten filaments.
Filaments not-pre- 1. Venting the Gun and the Specimen Chamber [} 124]
aligned
2. De-energizing the Microscope [} 125]
7. Disassembling the Filament Holder | Tungsten (Not Pre-Aligned) and LaB₆ [} 133]
8. Unpacking a New Filament | Tungsten (Not Pre-Aligned) [} 134]
9. Installing the Filament to the Filament Holder | Tungsten (Not Pre-Aligned) and LaB₆ [} 136]
11. Installing the Brass Retaining Washer | Tungsten (Not Pre-Aligned) [} 139]
LaB₆ Filaments 1. Venting the Gun and the Specimen Chamber [} 124]
7. Disassembling the Filament Holder | Tungsten (Not Pre-Aligned) and LaB₆ [} 133]
8. Unpacking a New Filament | LaB₆ [} 135]
9. Installing the Filament to the Filament Holder | Tungsten (Not Pre-Aligned) and LaB₆ [} 136]
11. Installing the Brass Retaining Washer | LaB₆ [} 141]
14. Starting up the LaB₆ Filament for the First Time [} 144]
15. Aligning the Emission Image [} 145]

7.2.2.1 Preparing Filament Exchange
The preparations for filament exchange are the same for all filament types.
1. Venting the Gun and the Specimen Chamber [} 124]
7.2.2.1.1 Venting the Gun and the Specimen Chamber
In order to replace the filament, you need to disassemble the gun. Before you can disassemble the
gun, you need to prepare the microscope: You need to switch off the gun and to vent the micro-
scope. In SmartSEM, you need to select the filament type that you want to install.
Prerequisite ü The vacuum system is operating.

Procedure 1. In the SEM Controls panel, select the Gun Vacuum tab.
2. Click Vent Gun.
à The Vent Gun window is displayed.

3. Click Yes to completely vent the system.
4. In the Gun tab, select the correct Filament Type.
5. Activate the New Filament checkbox.

6. Vent the specimen chamber. Refer to Venting the Specimen Chamber [} 64].
7.2.2.1.2 De-energizing the Microscope
This procedure completely cuts off the microscope from the electrical main supply.
WARNING
plug.
Prerequisite ü The microscope is in Standby mode or in OFF mode, refer to Finishing the Work Session | LaB₆
Filament [} 108] or Finishing the Work Session | Tungsten Filament [} 108].
Procedure 1. If the microscope is not yet in OFF mode, press the Off button at the front of the plinth.
à When all subsystems are fully deactivated,
the Off button lights up red permanently.
2. Close and lock the main shut-off valves at the installation site.
3. If the EMO circuit is not installed, unplug the
mains supply.
4. If the EMO circuit is installed, switch the Main

Switch to its OFF position.
9 The microscope is completely cut off from the electrical main supply.

7.2.2.1.3 Disassembling the Gun
You need to disassemble the gun so that you can dismount the filament holder and replace the
filament.
WARNING
Malfunction of medical devices near ion getter pumps
Magnetic fields present at the ion getter pumps may disturb the function of medical devices.
The magnetic fields are also present if the microscope is switched off.
If you wear medical implants that are susceptible to magnetic fields (e.g. cardiac pacemakers),
do the following:
4 Keep a distance of at least 30 cm from the ion getter pumps.
4 Follow the safety instructions provided by the pump manufacturer.
CAUTION
Hot firing unit
During operation, the firing unit gets hot. If you touch the hot firing unit, you may burn your-
self.
4 After you switch off the microscope, wait for 15 minutes before you touch any parts of
the firing unit.
WARNING
Risk of electrical shock
If you open the gun while the mains power is connected to the microscope, then contact may
4 Always disconnected the mains power from the microscope before you open the gun.
Parts and Tools  Lint-free gloves

 Hex key, 1.5 mm
Prerequisite ü The system is completely vented.

ü The microscope is powered down.
Procedure 1. Remove the top cover.
2. Wait at least fifteen minutes for the firing unit to cool down.

3. Open the gun.
7.2.2.1.4 Disassembling the Firing Unit
Before you can replace the filament, you need to disassemble the firing unit, which contains the
filament holder.
NOTICE
Contamination by dust particles or fingerprints
Dust particles or skin grease can cause contaminations, which lead to flashovers or to bad vac-
uum.
4 Wear lint-free gloves throughout the whole procedure of replacing the filament.

 Hex key, 1.5 mm
Prerequisite ü The gun is disassembled.

Procedure 1. Use a hex key 1.5 mm to loosen the three
screws of the firing unit.
INFO: If possible, only loosen the screws and
do not completely remove them from their
holes.
2. Carefully remove the firing unit.

3. Put the firing unit onto a clean surface.
4. Insert the adjust key into the slots in the brass
retaining washer.

5. Carefully turn the adjust key anticlockwise to

unscrew the brass retaining washer.
6. Remove the brass retaining washer.
7. Put the brass retaining washer onto a clean surface.

8. Put your hand closely underneath the firing unit and turn it upside down.
à The filament holder and the tensator spring
washer (if fitted) slide out and drop into your
hand.
7.2.2.1.5 Cleaning the Firing Unit
Over time, the filament deposits material on the firing unit and the anode. This can damage the
aperture and reduce the filament life time. You need to remove these deposits during every fila-
ment exchange.
NOTICE
uum.


 Dust and lint-free surface for polishing, e.g., clean printing paper
 Wooden toothpicks
 Pieces of cotton
 Hex key, 1.5 mm
 Stereo light microscope or a magnifying glass
 Silicon-free metal polish, e.g., Wenol
Procedure 1. Put a small amount of polish on a piece of

printing paper.
2. Polish the top of the firing unit in a circular mo-

tion.
3. Wrap a piece of cotton around the tip of a

toothpick.
4. Use the wrapped side of the toothpick to polish

the inside of the firing unit.
5. Use the other side of the toothpick to clean the

aperture of the firing unit.
Remove any discoloration.
INFO: Only use wooden toothpicks. To avoid
scratching the aperture, do not use not steel
pins. Scratched apertures introduce astigma-
tism.
6. Turn the firing unit upside down and use the

toothpick to clean the other side of the aper-
ture.

7. Remove all traces of polish visible to the eye.

Either rinse the firing unit with warm water containing a few drops of mild (non-abrasive)
detergent OR wipe off all polish with cotton. Do not forget to clean the inside of the aper-
ture. Use a toothpick and cotton to remove as much polishing paste as possible.
Clean until metal parts look shiny and polished. No trace of polish paste should be visible to
the eye.
INFO: If a light microscope is available, check around the aperture to ensure the aperture is
completely free from any polishing paste.
8. Completely remove any remaining traces of polish and surface contamination in an ultra-
sonic bath.
Completely immerse the firing unit in Isopropanol or Ethanol. Do not use Acetone.
Clean for 3-5 minutes.
INFO: If an ultrasonic bath is not available, clean the firing unit with plenty of solvent and a
clean piece of cotton. Repeat for at least 3 times.
7.2.2.1.6 Cleaning the Anode
Over time, the filament deposits material on the firing unit and the anode. This can damage the
aperture and reduce the filament life time. You need to remove these deposits during every fila-
ment exchange.
NOTICE
uum.

 Dust and lint-free surface for polishing, e.g., clean printing paper
 Wooden toothpicks
 Pieces of cotton
 Hex Key, 3.0 mm
 Long reach flexible tweezers
 Silicon-free metal polish, e.g., Wenol

Procedure 1. Locate and unscrew the retaining screws using

a hex key 3 mm.
INFO: Do not remove the screws as they will
be removed with the anode later.
2. Use long reach flexible tweezers to carefully re-

move the anode along with the retaining
screws.
3. Close the gun lid to prevent ingress of dust.

4. Put a small amount of polish on a piece of
printing paper.

5. Polish the top of the anode.
6. Clean the top and bottom side of the anode

aperture with a toothpick and polishing paste.
7. Remove all traces of polish visible to the eye.

Either rinse the firing unit with warm water containing a few drops of mild (non-abrasive)
detergent OR wipe off all polish with cotton. Do not forget to clean the inside of the aper-
ture. Use a toothpick and cotton to remove as much polishing paste as possible.
Clean until metal parts look shiny and polished. No trace of polish paste should be visible to
the eye.
INFO: If a light microscope is available, check around the aperture to ensure the aperture is
completely free from any polishing paste.
8. Completely remove any remaining traces of polish and surface contamination in an ultra-
sonic bath.
Completely immerse the firing unit in Isopropanol or Ethanol. Do not use Acetone.
Clean for 3-5 minutes.
INFO: If an ultrasonic bath is not available, clean the firing unit with plenty of solvent and a
clean piece of cotton. Repeat for at least 3 times.
7.2.2.2 Tungsten (Pre-Aligned)
7.2.2.2.1 Unpacking a New Filament Holder | Tungsten Filament (Pre-Aligned)
When you unpack a new filament holder, you need to use compressed air to clean it from any
dust particles.

 Tungsten filament cartridge (stainless steel): Pack of 10 pre-centered filaments cartridges
(354720-9919-000)
 Can of compressed air

Procedure 1. Take a new pre-aligned filament holder from

the box.
2. Use the can of compressed air to blow out any

dust particles from the filament holder and the
firing unit.
9 The new filament holder is ready for installation.
7.2.2.3 Tungsten (Not-Pre-Aligned) and LaB₆
7.2.2.3.1 Disassembling the Filament Holder | Tungsten (Not Pre-Aligned) and LaB₆
Before you can install a new filament to the filament holder, you first need to disassemble the fila-
ment holder.
NOTICE
uum.

 Hex key, 1.5 mm (000000-0151-883)
 Adjust key (350061-1904-000)
Prerequisite ü The firing unit is disassembled.

Procedure 1. Use a hex key 1.5 mm to remove the four
screws.
INFO: These screws have rounded ends.

2. Remove the top section of the filament holder.
3. Remove the four grub screws at the top section

of the filament holder.
INFO: The grub screws have pointed ends.
4. Use the adjust key to remove the filament.
5. Put all parts of the filament holder on a clean surface.

6. Remove any deposits from the filament holder.
INFO: Over time, the filaments create deposits of tungsten or sublimed material on the fila-
ment holder. You need to remove these deposits during every filament exchange. For gen-
eral guidelines on polishing metal parts refer to Cleaning the Firing Unit [} 128].
7.2.2.3.2 Unpacking a New Filament | Tungsten (Not Pre-Aligned)
NOTICE
uum.
Parts and Tools  Tungsten filament (not pre-aligned): Pack of 10 filaments (350010-2079-000)
 Adjust key (350061-1904-000)
Procedure 1. Open the box that contains the not pre-aligned

tungsten filaments.

2. Use the adjust key to take a new filament out

of the box.
7.2.2.3.3 Unpacking a New Filament | LaB₆
NOTICE
uum.
Parts and Tools  LaB₆ filament (350010-2180-000)

 Filament tweezers
Procedure 1. To unpack the new LaB₆ filament, unscrew the

plastic cover.

2. Press the metallic pin to unlock the filament.
3. Use the filament tweezers to remove the new

LaB₆ filament from its holder.
7.2.2.3.4 Installing the Filament to the Filament Holder | Tungsten (Not Pre-Aligned) and LaB₆
After you have disassembled the filament holder and removed the old filament, you can install a
new filament.
NOTICE
uum.

 Hex key, 1.5 mm
 Adjust key (350061-1904-000)
Procedure 1. Use the adjust key to insert the new filament

into the top section of the filament holder.

2. Insert the four grub screws into their holes.

3. To center the filament, use a hex key 1.5 mm
to equally tighten the grub screws.
4. Attach the top section of the filament holder to

the bottom section of the filament holder.
Pay attention to correctly align the pin and the
hole.
7.2.2.4 Reassembling the Gun
7.2.2.4.1 Installing the Filament Holder to the Firing Unit
To assemble the firing unit, you need to reinstall the filament holder.
If you do not use a pre-aligned filament, you also need to install the tensator spring washer.
Fig. 45: Filament holder and tensator spring washer
1 Filament holder 2 Tensator spring washer
The firing units for LaB₆ and tungsten filaments are different. If you want to replace a LaB₆ fila-
ment with a tungsten filament, you have to replace the firing unit as well.
Info
Without further ado, you cannot install a firing unit for LaB₆ filaments to a microscope that is
designed for tungsten filaments. This can only be achieved by an upgrade of the microscope at
the factory.
At the customer’s location, this upgrade cannot be performed.

NOTICE
uum.
Parts and Tools  EVO firing unit for tungsten filaments (350071-2832-000) including a Wehnelt assembly and a
box of ten standard tungsten filaments. Only used when replacing LaB₆ with tungsten fila-
ments.
 Can of compressed air
 Adjust key (350061-1904-000)
 Hex key, 1.5 mm
Procedure 1. If the filament is not pre-aligned, insert the tensator spring into the firing unit.
INFO: The tensator spring washer is not designed to be used in combination with pre-
aligned filaments. If you install the tensator spring washer in combination with a pre-
aligned filament, then the filament height is incorrect. If you install a pre-aligned filament,
then do not install the tensator spring washer.
2. Align the slot at the side of the filament holder
with the pin inside the firing unit.
3. Insert the new filament holder into the firing

unit.
7.2.2.4.2 Installing the Brass Retaining Washer | Tungsten (Pre-Aligned)
NOTICE
uum.


 Adjust key (350061-1904-000)
Prerequisite ü The filament holder is inserted into the firing unit.

Procedure 1. Insert the brass retaining washer.
2. Use the adjust key to tighten the brass retain-

ing washer.
3. Slightly shake the firing unit to check that the brass retaining washer is mounted correctly.
4. If the brass retaining washer makes any sound when shaking, then tighten the brass retain-
ing washer a bit more.
7.2.2.4.3 Installing the Brass Retaining Washer | Tungsten (Not Pre-Aligned)
When you install the brass retaining washer, you need to screw it in with the correct number of
turns. The number of turns affects the filament distance and the possible applications according
to the following table:
Number of turns Filament distance Application

(mm)
¾ 0.4 High resolution

Short filament lifetime
1 ¼ 0.6 General use

Extended filament lifetime
1 ¾ 0.9 X-ray analysis
Tab. 7: Tightening the brass retaining washer with the correct number of turns.
You need to check the correct filament distance and the centering of the filament with a stereo
microscope or with a hand lens.
Info
If the filament is not accurately centered or if the filament distance is not correctly adjusted,
then this may negatively affect the filament lifetime and the performance.

NOTICE
uum.


2. Use the adjust key to gradually tighten the

brass retaining washer until the filament is flush
with the top of the firing unit.
3. Use a stereo light microscope or hand lens to

check that the filament is centered and is flush
4. If the filament is not centered, then turn the grub screws to center the filament.
5. If the tip of the filament is not flush with the top of the firing unit, then turn the brass re-
taining washer to adjust the tip of filament distance.
6. Once the filament is flush with the top of the firing unit, turn the brass retaining washer in
anticlockwise direction.
Choose the number of turns according to the table above.
9 The filament distance is correctly adjusted.

7.2.2.4.4 Installing the Brass Retaining Washer | LaB₆
The tip of the LaB₆ filament needs to be located at a distance of 0.375 mm below the top of the
firing unit (Wehnelt cap).
To adjust the filament tip to this position, you need to install and tighten the brass retaining
washer. You also need to adjust the grub screws to center the filament.
You need to check the correct filament distance and the centering of the filament with a stereo
microscope or with a hand lens.
Info
If the filament is not accurately centered or if the filament distance is not correctly adjusted,
then this may negatively affect the filament lifetime and the performance.
NOTICE
uum.


2. Use the adjust key to gradually tighten the

brass retaining washer until the filament is flush

3. Use a stereo microscope or a hand lens to

check wether the filament is flush with the top
of firing unit.
4. Once the filament is flush with the top of the firing unit, turn the brass retaining washer by
270° in anticlockwise direction.
INFO: Now the filament tip is correctly aligned and is located approximately 0.375 mm be-
low the top of the firing unit.
5. Tighten or untighten the grub screws until the filament is centered.
Use a stereo microscope or a hand lens to check wether the filament centered.
7.2.2.4.5 Reinstalling the Firing Unit to the Gun
Before you can reinstall the gun to the microscope, you need to install the firing unit to the gun.
NOTICE
uum.

 Adjust key (350061-1904-000)
 Hex key, 1.5 mm
Prerequisite ü The brass retaining washer is installed to the firing unit.

Procedure 1. Align the slot at the side of the firing unit with
the pin inside the firing unit holder.
2. Carefully insert the firing unit into the gun.

3. Use an hex key 1.5 mm to tighten the screws.
7.2.2.4.6 Reinstalling the Gun to the Microscope
To reassemble the microscope, you need to reinstall the gun.
Parts and Tools  Can of compressed air
Prerequisite ü The firing unit is installed to the gun.

Procedure 1. If your microscope is equipped with a column
safety switch, check that the safety switch is
correctly lined up when you close the gun.
2. Check the O-ring and use the can of com-

pressed air to blow away any dust particles
from the column O-ring.
3. If your microscope is equipped with a column safety switch, check that the safety switch is
correctly lined up when you close the gun.

4. Close the gun.
5. Reinstall the top cover.
à The microscope is completely reassembled.

6. Energize the microscope, start the microscope and SmartSEM, refer to Switching On the Mi-
croscope System [} 56].
7.2.2.5 Startup of a LaB₆ Filament
7.2.2.5.1 Starting up the LaB₆ Filament for the First Time
Before you can use the filament for SEM imaging, you need to evacuate the microscope and start
up the filament.
Prerequisite ü You have energized and started the microscope.

Procedure 1. In the SEM Controls panel, select the Gun Vacuum tab.
2. Evacuate the microscope via Pump.
3. Wait until the messages Vac Status = Ready and EHT Vac ready = Yes are displayed.
INFO: It may take some time until the vacuum is established and the messages are dis-
played.
4. In the Gun tab of the SEM Controls panel, deactivate Long Fil. Life.
5. Switch on the electron beam.
6. Set the following values:
EHT = 10.00 kV
Spot Size = 500
Fil I Target = 1950 mA

7. Check that New Filament is activated.
8. In the Apertures tab of the SEM Controls panel, click Emission.

à The Emission button changes to Normal.
9 The filament starts running up.

INFO: If you start up a new filament for the first couple of times, then the start-up may take a
bit of time. This is intended and does minimize damage to the new filament due to thermal
shock.
7.2.2.5.2 Aligning the Emission Image
To achieve an optimal alignment of the beam, you need to align the emission image to the center
of the image area.
Prerequisite ü The filament is started up.

Procedure 1. Switch on the crosshairs via Menu Bar > View > Crosshairs.

3. Click the arrow of the Fil I Target slider to

slowly increase Fil I Target by increments of
0.01 A until the first emission peak becomes
visible.
4. Adjust Brightness and Contrast to optimize the visualization.

5. Slowly increase Fil I Target further until the
second (and final) emission peak becomes visi-
ble.
Adjust Brightness and Contrast to optimize
the visualization.
6. In the Apertures tab of the SEM Controls

panel, use Gun Tilt and Gun Shift to center
the emission image in the image area.
INFO: You can refer to Using the Automatic
Gun Alignment Functions [} 79] to help you
with these tasks.
7. To enable SEM imaging, click Normal.
9 The microscope is ready for imaging.

ZEISS 7 Troubleshooting | 7.3 Power Circuit
7.3 Power Circuit
7.3.1 Checking the Position of the Circuit Breakers
NOTICE
Persisting electrical problems
Tripped circuit breakers or blown fuses may be a hint for an electrical problem in the micro-
scope.
4 If a circuit breaker keeps tripping or a fuse keeps blowing, de-energize the microscope
completely and contact your ZEISS service representative for assistance.
No. Value Type Circuit
F10 10 A Circuit breaker Plinth electronics, pre-vacuum

pump 1, PC
F11 10 A Circuit breaker Pre-vacuum pump 2, heaters
Procedure 1. Check if the circuit breakers (F10, F11) on the

rear side of the plinth are tripped.
2. If the circuit breaker is tripped, push the circuit breaker upwards.
7.4 PC
7.4.1 Cleaning up the PC
It is important to periodically clean up the PC. This shortens the boot sequence and loading times.
If necessary, refer to standard Windows manuals for instructions to do this.
Procedure 1. Backup the database to the server or to other storage.
2. Delete the temporary files.
3. Check for adequate free space on the hard drives.
4. Backup the log file (EMServer.log).
5. Erase the original log files in the LOG folders.
6. Check that Windows updates are applied and that service packs are applied.
INFO: Each service pack includes all the patches since the last major release.

8 Decommissioning and Disposal | 8.1 Decommissioning ZEISS
8 Decommissioning and Disposal

This chapter contains information on the decommissioning and disposal of the Microscope System
and its expansions/components or accessories.
8.1 Decommissioning
If the Microscope System is not used for an extended period such as several months, it should be
shut down completely and secured against unauthorized access. Complete decommissioning of
the Microscope System should be executed by your ZEISS service representative.
WARNING
Malfunction of medical devices near ion getter pumps
Magnetic fields present at the ion getter pumps may disturb the function of medical devices.
The magnetic fields are also present if the microscope is switched off.
If you wear medical implants that are susceptible to magnetic fields (e.g. cardiac pacemakers),
do the following:
4 Keep a distance of at least 30 cm from the ion getter pumps.
4 Follow the safety instructions provided by the pump manufacturer.
WARNING
Biological hazards
Biological substances may pose a threat to the health of humans and other living organisms.
4 Keep a logbook of the biological substances loaded into the microscope and show it to
the ZEISS service representatives before they perform any work on the microscope.
WARNING
High leakage currents are present in the microscope. Contact may cause burn or electrical
shock.
4 Ensure proper grounding. For more information, refer to the Installation Requirements
document.
4 Do not operate the microscope without the separate ground connection.
WARNING
Radiation hazard due to X-rays
X-rays are generated inside the microscope during operation. This is unavoidable because elec-
trons are accelerated by voltages up to 30 kV.
4 Do not remove any parts around the column and chamber that are essential for radiation
protection.
4 Use genuine ZEISS parts exclusively.
4 Ensure that all local safety and X-ray protection regulations are met.
4 Only authorized ZEISS service representatives are allowed to service the microscope.

ZEISS 8 Decommissioning and Disposal | 8.2 Transport and Storage
WARNING
Reaction products
Dangerous reaction products can be present in the specimen chamber during or after opera-
tion.
4 Ensure that there is an appropriate exhaust gas line to remove the waste gas of the pre-
vacuum pump and to transmit it to the outside.
4 Wear lint-free gloves when touching the inner parts of the specimen chamber or the speci-
men.
WARNING
Procedure 1. Switch off the Microscope System.

2. Pull the mains plug.
8.2 Transport and Storage
WARNING
Tilting hazard when removing the microscope from the crate
When removing the microscope from the wooden crate, it can tilt and crush a person.
4 Use a forklift to remove the microscope from the wooden crate.
WARNING
Crushing hazard when lowering the microscope
The microscope and its components are heavy. When the load is lowered during transport and
positioning, body parts can be crushed.
4 Maintain a safe distance.
4 Do not walk or place your hands or feet under the load while it is being lowered.
4 Wear safety shoes and gloves.

8 Decommissioning and Disposal | 8.2 Transport and Storage ZEISS
NOTICE
Damage during transport
Sensitive components of the microscope can get damaged during transport.
4 The microscope may only be transported in air-suspended vehicles.
4 Moving parts must be secured during transport to prevent them from slipping or tipping
over.
4 Install shock/tilt watches.
4 Avoid rocking the crates back and forth.
4 Devices for transporting the microscope must be rated to handle its full weight and dimen-
sions. Note the weight information on the package and on the shipping document.
4 Check that none of the items has been damaged during shipment.
4 Otherwise contact your local ZEISS service representative.
The following regulations must be observed before and during transport:

§ Check if there is any moving equipment available on-site that can be used to transport the Mi-
croscope System safely to the installation room. In clean-room environments, this check is
mandatory.
§ The Microscope System may only be transported in air-suspended vehicles.
§ Moving parts must be secured during transport to prevent them from slipping or tipping over.
§ Avoid rocking the crates back and forth.
§ Devices for transporting the Microscope System must be rated to handle its full weight and di-
mensions.
§ Note the weight information on the package and on the shipping document.
§ Where possible, the original packaging must be used for shipping or transport.
Forklift and hand For on-site transport and unloading, a forklift and/or a hand pallet truck are necessary.
pallet truck § Ensure all hallways and corners are wide enough to be passed by.
§ Please check the location requirements for door and hallway widths.
§ Check the entrance to the building and to the final site for suitable ramps and compliant ele-
vators that can match the weights of the Microscope System where necessary.
§ Some components, such as the tables, are large, heavy or bulky and may require extra assis-
tance to get the units into the allocated site.
Maximum shock § Do not drop or bump the boxes during movement or storage. Any acceleration shall be
resistance < 10 g.
§ Evaluate packaging shock and tilting sensors on delivery and after internal transport.
Packaging The microscope is delivered in two containers:
§ Reusable wooden crate
Dimensions and weight of crate:
1480 × 1480 × 2070 mm³ (W × D × H), appr. 878 kg
§ Cardboard box on Euro pallet
1400 × 1220 × 1350 mm³ (W × D × H), appr. 340 kg
Dimensions of plinth un-crated:
784 × 1015 × 1780 mm³ (W × D × H, depth is 1215 mm with PSU on transit clamp fitted to
the rear of plinth), appr. 650 kg
Check that none of the items has been damaged during shipment.

ZEISS 8 Decommissioning and Disposal | 8.3 Disposal
Guidelines for Due to the heavy weight of microscopes, a forklift has to be used to remove the microscopes
Unpacking from the wooden crate:
§ The forklift used must have a sufficient load capacity.
§ Refer to the weights of the microscope stated in this chapter.
Conditions during The packed microscope has to be stored in a dry place.
Storage and
Transport
Allowable Allowable temperature during on-site storage and transport:
temperature § Between −10 °C and +70 °C
Info
24 hours before installation of the Microscope System it is required that the boxes be at
recommended room temperature to avoid ingress of humidity, which is very harmful to optical
paths, and to ensure effective stability of the Microscope System during installation and test-
ing.
8.3 Disposal
The Microscope System and its components must not be disposed of as domestic waste or
through municipal disposal companies. They must be disposed of in accordance with applicable
regulations (WEEE Directive 2012/19/EU). ZEISS has implemented a system for the return and recy-
cling of devices in member states of the European Union that ensures suitable reuse according to
the EU Directives mentioned. The customer is responsible for decontamination.
Info
Detailed information on disposal and recycling is available from your ZEISS Sales & Service Part-
ner.
8.4 Decontamination
A decontamination statement must be submitted before returning any used objects to the ZEISS
location.
If reliable decontamination cannot be guaranteed, the hazard must be marked according to appli-
cable regulations. In general, a well-visible warning sign must be affixed to the article itself and to
the outside of the packaging, together with detailed information on the type of contamination.

9 Technical Data and Conformity | 9.1 Layout and Connections ZEISS
9 Technical Data and Conformity

This chapter contains important technical data as well as information on the conformity.
9.1 Layout and Connections
B C D E
F
1 2
G
A
5
3
6 4
1 Static vibration damper A Mains power supply

120 V, 50–60 Hz, 16 A, 1/N/PE or
230 V, 50–60 Hz, 16 A, 1/N/PE
2 Pre-vacuum pump Equipotential bonding bar /

grounding screw terminal (Ø 8 mm)
3 Pre-vacuum pump 2 (optional) Additional standard local mains

power sockets, max. 13 A
4 Computer workplace Pressure reducer (nitrogen)
5 Emergency Off (EMO) box (optional) Main shut-off valve
6 Emergency Off (EMO) button (optional) Nitrogen supply
Exhaust line (optional)

ZEISS 9 Technical Data and Conformity | 9.2 System Layout
9.2 System Layout
Fig. 46: System layout
9.3 Performance Data and Specifications | EVO 10

The Microscope System must only be operated in closed rooms. It is recommended to install the
Microscope System in a dark room where artificial illumination, sunlight or other light sources
cannot interfere with image acquisition. The Microscope System should not be installed near win-
dows with direct sunlight or radiators. Compliance with the installation requirements of the Mi-
croscope System and the availability of the requested supplies is the responsibility of the customer
and has to be provided at the time of installation. Due to continuous development, we reserve the
right to change specifications without notice.
The Microscope System must be plugged into a properly installed power socket with protective
earth contact using the supplied mains cable. The protective earth connection must not be im-
paired by the use of extension cables.
Info
Your ZEISS Sales & Service Partner will provide you with the detailed installation requirements.
Weight and Sizes Main Components Length Width (mm) Height Weight (kg)
(mm) (mm)
Plinth + column 807 1031 1780 650
Overall 1930 1781 1780 720

9 Technical Data and Conformity | 9.3 Performance Data and Specifications | EVO 10 ZEISS
Air Conditioning Parameter Value

and Quality
Temperature range for operation with indi- 20–30 °C
cated performance (24 h per day, regardless It is recommended that for operator comfort
of whether the microscope is in operation or the room temperature is maintained between
switched off) 22 °C and 24 °C.
Recommended best temperature stability ± 0.5 °C/h
Long-term recommended stability not more than ± 2 °C/24 h
Relative humidity < 65 %
Altitude ≤ 2000 m above sea level to guarantee an

undisturbed operation
Pollution degree 2
Mains Connection Parameter Value
Nominal AC voltage 120 VAC (single phase) or 230 VAC (single

phase)
The provided electrical connection must be in
accordance with the applicable electrical
codes for the country of installation. In order
to avoid disturbance from other installed ma-
chines, ZEISS recommends using a separate
power connection to the main distribution
panel.
Nominal frequency 50–60 Hz
Main Power Plug The microscope is delivered with a power

cord 3 m long equipped with a CEE plug 1/N/
PE according to IEC 60309 depending on the
customers site supply: either for 120 VAC a
CEE MALE PLUG 2P3W 4 h 20 A (yellow) or
for 230 VAC a CEE MALE PLUG 2P3W 6 h
16 A (blue).
The building installation should provide the
corresponding CEE socket 1/N/PE with de-
sired approvals of the country used: either for
120 VAC a CEE FEMALE RECEPTACLE 2P3W
4 h 20 A (yellow) or for 230 VAC a CEE FE-
MALE RECEPTACLE 2P3W 6 h 16 A (blue).
To avoid disturbance from other installed ma-
chines Carl Zeiss Microscopy recommends to
use a separate power connection to the main
distribution panel.
Power consumption max. 3000 VA, dependent on accessories
Protective ground High leakage currents are present in the mi-

croscope. Therefore, the microscope has to
be connected to a separate protective
ground.
An exclusive grounding connection to earth
must be provided as part of the building in-
stallation, i.e. a grounding screw terminal (Ø

ZEISS 9 Technical Data and Conformity | 9.3 Performance Data and Specifications | EVO 10
Parameter Value
8 mm) which is directly connected to the PE

of the FEMALE RECEPTACLE as short as possi-
ble.
This grounding connection must not be com-
mon to other electrical equipment.
A grounding wire AWG10 (≥ 5 m) is delivered

with the microscope. It serves as connection
between the grounding screw terminal (Ø
8 mm) and the microscope (Ø 6 mm).
Cross section: Min. AWG10 (between
grounding screw terminal and PE of the CEE
FEMALE RECEPTACLE)
Circuit breaker type (at house installation) 16 A Type C
Protection class Class I
Momentary interruption Less than a half cycle
Ampere interrupting capacity (AIC) Min. 10,000 Arms
Location Parameter Requirement

Requirements
Installation site Exclusively inside buildings
Recommended Min. 3.6 m × 4.0 m × 2.3 m

room size
Service area Min. 0.8 m at each side
Entrance Min. 0.8 m wide
Hallways Min. 1.0 m wide
Corners Min. 1.2 m wide
Transport ways Free of staircases
Installation cate- II
gory
Floor stability > 1000 kg/m²
Exhaust Line If toxic chemicals or biological specimens are used an exhaust line is recommended to remove the
waste gas of the pre-vacuum pump and to transmit it to the outside.

Nitrogen Gaseous dry nitrogen is used to vent the specimen chamber during specimen exchange. The nitro-
gen can be taken either from a gas cylinder or from an in-house supply system.
Parameter Requirement
Flow rate Approx. 3 l/min for ventilation of specimen chamber with chamber
door open
Pressure 0.2–3.3 bar
Quality 4.6 with nitrogen content > 99.996 %
Connection hose 4 mm inside diameter. 10 m are delivered with the microscope.
Instrument con- Quick exchange connector. One is delivered with the microscope.
nection
Compressed Air Compressed air is used to operate several valves and the auto leveling system. The necessary com-
Supply pressed air can be either generated by a compressor (part no. 345596-0000-000) or taken from a
gas cylinder or from an in-house supply system.
Environmental Parameter Requirement

Requirements
Electrical field The microscope is a class A device (industrial). The microscope is de-
signed to operate in a controlled electromagnetic environment. This
means that devices with RF transmitters such as mobile phones or
DECT phones must not be used in close proximity.
Vibrations Less than 6 μm/sec rms from 0–30 Hz

Less than 12 μm/sec rms above 30 Hz
Magnetic stray Max. 3 × 10⁻⁷ T (peak to peak) = 3 mG (peak to peak)

fields
Acoustic noise Less than 53 dB for frequencies up to 200 Hz

Less than 42 dB for frequencies from 200 up to 300 Hz
Less than 50 dB for frequencies higher than 300 Hz
Electron Optics Parameter Description
SEM resolution EVO column at optimum working distance:

SE detector, W or LaB₆ filament:
§ 3 nm at 30 kV with W
2 nm at 30 kV with LaB₆
§ 3.4 nm at 30 kV, VP mode
§ 8 nm at 3 kV
HDBSD detector and beam deceleration, W or LaB₆ filament
§ 6 nm at 3 kV
Acceleration volt- 0.2 to 30 kV

age
Probe current 0.5 pA to 5 μA
Magnification Range: <7x – 1,000,000x referenced to Polaroid 5" × 4.5" image for-
mat

Electron source Filament: W or LaB₆
Field of View § Maximum 6 mm diameter

at the analytical working distance (AWD) of 8.5 mm
§ Maximum 20 mm diameter
at the longest working distance
X-ray analysis 8.5 mm AWD and 35° take-off angle
Optibeam modes Resolution, Depth, Analysis, Field, Fisheye
Image framestore 32768 × 24576 pixel, signal acquisition by pixel, line and frame inte-
gration and averaging, including drift compensated frame averaging
(limitations may apply to averaging mode and maximum scan speed
for large images)
System control SmartSEM user interface operated by mouse and keyboard

Windows 10 multilingual operating system
Specimen Chamber Parameter Description

and Stage
Specimen chamber § 310 mm inner diameter
dimensions § 220 mm height
Analytical working 8.5 mm

distance
Specimen stage Type: 5-axes motorized Cartesian controlled via the SmartSEM user
interface or operated by a dual joystick control box
Mounting: Drawer-type door
Movements:
§ X = 80 mm
§ Y = 100 mm
§ Z = 35 mm
§ T = −10° to 90°
§ R = 360° continuous
INFO: The movements may be reduced by specimen size, operating
conditions, and accessories attached.
Specimen height: max. 100 mm (with the ZTR module removed)
Specimen diameter: max. 230 mm
Specimen weight:
Standard stage
§ 0.5 kg (full motion)
§ 2 kg (not tilted)
§ 5 kg (only XY motion)
Large Z stage (optional)

Specimen current monitor with integrated Touch Alarm (audible

touch alarm warning with on-screen message)
Specimen mounts: One 9x specimen holder for 13 mm diameter

stubs included in base tool configuration, various specimen holders
available as option
Vacuum range Vacuum modes

§ HV mode: lower than 2 mPa (2 × 10⁻⁵ mbar)
§ VP mode (optional): 10–400 Pa
§ EasyVP mode (optional): 10–133 Pa
§ EP mode (optional): 10–3000 Pa
Detection System Parameter Description
Chamber detectors SE detector:

Everhart-Thornley SE detector with optically coupled photomultiplier;
collector bias adjustable from −250 to +400 V
VPSE detector (optional) (only for VP mode):

Fourth generation variable pressure secondary electron detector for
imaging in VP mode with up to 85 % improvement in Weber contrast
ratio
C2D detector (optional) (only for VP mode):

Cascade Current Detector with floating amplifier electronics, for en-
hanced imaging in Variable Pressure mode up to 133 Pa. Delivers de-
tail at low kV for specimens that demand higher pressures, e.g. poly-
mers, bio specimens, pharmaceuticals, powders, and fibers. Enhanced
signal-to-noise ratio versus VPSE detector.
C2DX (optional) (only for VP mode):

Extended Cascade Current Detector
HDBSD detector (optional):

BSE imaging at low kV of metals, polymers, minerals, etc. both in HV
and VP modes.
YAG BSD detector (optional):

Robust, fully retractable, YAG-crystal-based BSE scintillator detector
with rise time ~200 ns. Easy to use with no amplifier gain adjustment
required.
STEM detector (optional):

Scanning Transmission Electron Microscopy (STEM) detector, with pre-
aligned specimen holder and Bright-field (BF) STEM detector
CL detector (optional):
Cathodoluminiscence (CL) chamber detector (option for non-VP con-
figurations, included in VP option)
SCD (optional)
Specimen current detector
For more details refer to the document Product Specification.


Info
(mm) (mm)
Plinth + column 807 1031 1780 650
Overall 1930 1781 1780 720

and Quality

Pollution degree 2

phase)
panel.


Parameter Value

16 A (blue).
distribution panel.

ground.
ble.

FEMALE RECEPTACLE)

Parameter Value

Requirements

room size
gory
door open
nection

Requirements


fields



§ 8 nm at 3 kV
§ 6 nm at 3 kV
mat

for large images)


and Stage

distance
Movements:
§ X = 125 mm
§ Y = 125 mm

§ Z = 50 mm
§ T = −10° to 90°
Specimen height: max. 145 mm (with the ZTR module removed)
Specimen weight:
Standard stage


available as option



ratio




and VP modes.

required.

SCD (optional)

Info
(mm) (mm)
Plinth + column 807 1031 1780 650
Overall 1930 1781 1780 720

and Quality

Parameter Value

Pollution degree 2

phase)
panel.

16 A (blue).
distribution panel.

ground.
ble.

Parameter Value

FEMALE RECEPTACLE)

Requirements

room size
gory

door open
nection

Requirements


fields


§ 8 nm at 3 kV
§ 6 nm at 3 kV
mat


for large images)


and Stage

distance
Movements:
§ X = 130 mm
§ Y = 130 mm
§ Z = 50 mm
80 mm with large stage (option)
§ T = −10° to 90°
Specimen height: max 210 mm (with the ZTR module removed)
Specimen weight:
Standard stage


available as option

ZEISS 9 Technical Data and Conformity | 9.6 Applicable Standards and Regulations



ratio



and VP modes.

required.

SCD (optional)
9.6 Applicable Standards and Regulations

Observe all general and country-specific safety regulations as well as applicable environmental
protection laws and regulations.

9 Technical Data and Conformity | 9.6 Applicable Standards and Regulations ZEISS
The Microscope System is in compliance with the requirements of the following regulations and
directives:
2006/42/EC Machine Directive
2011/65/EU RoHS Directive
98/79/EC Annex 1 IvD Directive
2014/30/EU Electromagnetic Compatibility
KN 61000-6-2, KN 11 Korean EMC standards
2014/35/EU Low Voltage Directive
EN 55011 Noise emission according to CISPR 11

intended use in industrial environment
EN 60204-1:2006/A1:2009 Safety of machinery – Electrical equipment of

machines – Part 1: General requirements
EN 61010-1 Safety requirements for electrical equipment

for measurement, control, and laboratory use
– Part 1: General requirements
EN 61326-1 Electrical equipment for measurement, con-

trol and laboratory use – EMC requirements –
Part 1: General requirements
EN ISO 12100 Safety of machinery – General principles for

design – Risk assessment and risk reduction
EN ISO 13849-1:2008 Safety of machinery – Safety related parts of

control systems – Part 1: General principles
for design
The Microscope System and its accessories have been classified as instrument category 9 (labora-
tory equipment or comparable standard). It also comply, as applicable, with the EU-regulations
2011/65/EU (RoHS) and 2012/19/EU (WEEE).
The resulting EMC environment can change through the use / installation of 3rd party compo-
nents (e.g. detectors / plasma cleaners). As soon as the EMC environment of a 3rd party compo-
nent is "domestic environment" or "EMC controlled environment", the entire Microscope System
must be classified as an "EMC controlled environment". Due to the lower immunity requirement,
the user must take suitable protective measures with regard to electromagnetic fields in the instal-
lation room as well as interferences from the mains power supply.
In addition to the European and international guidelines and standards, the 21 CFR §1040.10:
"Performance Standards for light emitting products - laser products" applies for the USA.
The following EMC user notice is for Korea only:
기종별 사용자안내문
A급기기(업무용방송통신기자재) 이기기는업무용(A급) 전자파적합기기로서

판매자또는사용자는이점을주의하시기바라
며, 가정외의지역에서사용하는것을목적으
로합니다.
European and International Directives / Standards: For more information on ISO, CSA, SEMI certifi-
cates or CE Declarations of Conformity, contact your ZEISS Sales & Service Partner.
ZEISS works according to a certified Environment Management System according to ISO 14001.
The Microscope System was developed, tested and produced in accordance with the valid regula-
tions and guidelines for environmental law of the European Union.

ZEISS 10 Parts and Tools | 10.1 Consumables
10 Parts and Tools

NOTICE
Spare parts and consumables
Using spare parts or consumables that are not provided by ZEISS can lead to property damage.
4 Only genuine spare parts and consumables supplied by ZEISS are to be used in servicing
the microscope.
4 Contact your ZEISS service representative for information regarding how to order spare
parts and consumables.
4 Unless otherwise authorized by ZEISS, all spare parts and consumables must be installed by
a ZEISS service representative.
10.1 Consumables
Required Parts/Tools Part Number
100 µm VP aperture 350700-0700-000
400 µm EasyVP aperture 354720-1464-000
Tungsten filaments (set of 10) 350010-2079-000
Tungsten filaments, longlife (set of 10) 350010-2080-000
Pre-aligned tungsten filaments (set of 10) 354720-9919-000
LaB₆ filament 350010-2180-000
10.2 Spare Parts
Gun O-ring 350030-7599-000
O-ring stage 350500-0021-000
10.3 Tools and Accessories
Faraday cup 348342-8055-000
Hex key 3 mm 000000-0015-247
Hex key 1.5 mm 000000-0151-883
Small pliers –
Specimen holders Refer to specimen holder catalog.
Stubs –
Tweezers –
Lint-free gloves –

10 Parts and Tools | 10.3 Tools and Accessories ZEISS
Toolbox including VP apertures and removal 350600-0926-000

tools

ZEISS Glossary
Glossary
aBSD Condenser
Annular Backscattered Electron Detector Device that collects and focuses the elec-
tron beam onto the specimen.
Aperture
Mechanical limitation of an opening ori- D
ented perpendicular to the optical axis, Depth
which filters out electrons whose trajec-
tories (tracks) do not run close to the op- DECT
tical axis.
Digital Enhanced Cordless Telecommuni-
cations
Astigmatism
Lens aberration that distorts the shape of Depth of field
the electron beam, compensated by the
Distance along the optical axis which an
stigmator.
object in the specimen can be moved
while remaining in focus.
AWD
Analytical Working Distance DPA
Differential Pumping Aperture
Backscattered electrons
High-energy electrons that are liberated EBIC
from the specimen surface when the
Electron Beam Induced Current
specimen is hit by the primary electron
beam.
EC
Bakeout European Community
Degassing of surfaces of a vacuum sys-
tem by heating during the pumping EDS
process. Energy Dispersive X-ray Spectroscopy
BSD EDX
Backscattered Electron Detector Energy Dispersive X-ray Spectroscopy
BSE EHT
Backscattered Electron Extra High Tension
C2D EIGA
Cascade Current Detector European Industrial Gases Association
C2DX EM server
Extended Cascade Current Detector A server that implements the internal
communication between control soft-
CAN ware and microscope hardware.
Controller Area Network
EMO
CCD Emergency Off
Charge-Coupled Device
EP
CL Extended Pressure
Cathodoluminescence

Glossary ZEISS
Faraday cup R
Small insulated metal container, R-axis (Rotation)
equipped with an aperture where elec-
trons can enter but not escape. Used to RF
measure the specimen current in the mi-
Radio Frequency
croscope.
SCD
Focus wobble
Specimen Current Detector
Function that sweeps the focus of the
objective lens backwards and forward
through the focus on the specimen Scintillator
plane. When the aperture is misaligned a Substance that absorbs electrons and in
lateral shift is observed. response, fluoresces photons while re-
leasing the previously absorbed energy.
GUI
Graphical User Interface SE
Secondary Electron
H
Height Secondary electrons
Low-energy electrons that are emitted
HDBSD from the specimen surface when the
specimen is hit by the primary electron
High Detection Backscattered Electron
beam. Secondary electrons are generated
Detector
by inelastic scattering.
HV
SEM
High Vacuum
Scanning Electron Microscope
IGC
SEMI
Industrial Gases Council
Semiconductor Equipment and Materials
International (SEMI) is a industry associa-
LaB₆ tion comprising companies involved in
Lanthanum hexaboride the electronics design and manufacturing
supply chain.
PC
Personal Computer STEM
Scanning Transmission Electron Micro-
PE scope
Protective Earth (ground)
Stigmator
PE Compensates astigmatism (lens aberra-
tion), so that the electron beam becomes
Primary Electron
rotationally symmetrical.
Penning gauge
T
Device for measuring high vacuum in the
T-axis (Tilt)
vacuum system.
TEM
Pre-vacuum pump
Transmission Electron Microscope
A pump for generating a pre-vacuum.
User
Primary electron beam
Person examining a sample under the mi-
Narrowly bundled beam of accelerated
croscope.
electrons that hit the specimen surface.

ZEISS Glossary
VP ZEISS service representative

Variable Pressure Specially trained service expert, either
ZEISS staff or authorized service partner
VPSE of ZEISS.
Variable Pressure Secondary Electron
ZTR
W Stage Z movement, tilt and rotation
Width
Warning label
A label or sign that provides safety-re-
lated information (e.g. safety signs) and
informs about possible risks and hazards.
WD
Working Distance
WDS
Wavelength Dispersive X-ray Spec-
troscopy
WDX
Wavelength Dispersive X-ray Spec-
troscopy
X
X-axis
X-ray
Type of high energy electromagnetic ra-
diation, that is generated during the op-
eration of electron microscopes.
Y
Y-axis
YAG
Yttrium Aluminum Garnet
Z
Z-axis
ZEISS
ZEISS is an internationally leading tech-
nology enterprise operating in the fields
of optics and optoelectronics. Further in-
formation about ZEISS can be found at
www.zeiss.com.
ZEISS Sales & Service Partner

The Sales & Service Partner is generally in
the field for customer support in a re-
gional area and / or a clearly defined cus-
tomer group.

Index ZEISS
Index
A BSD 43, 85
C2D 42, 83
Acceleration voltage 27 C2DX 85
Accessory 172 CL 46
Air Conditioning and Quality 154, 159, 164 Everhart-Thornley 33
Alignment SE 33, 83
Aperture 80 STEM 45
Gun 79 VPSE 39
Analysis mode 29 YAG BSD 44, 87
Aperture 23, 27, 113 Differential pumping aperture 23
Automated function Disposal 148, 151
Auto aperture alignment 80 DPA 23
Auto gun alignment 79 Dual joystick 47
B E
Backscattered electron 31, 43 EasyVP mode 23
Bakeout 120 EHT 27
Baking out the gun head 120 Electron optical column 27
Beam deceleration 88 Electron Optics 156, 162, 167
BSD detector 43, 85 Emergency shutdown 111
BSE 43 Emitter life 113
Environmental Requirements 156, 161, 167
C EP mode 23, 26
Everhart-Thornley detector 33
C2D detector 42, 83
EVO column 27
C2DX detector 85
Exhaust Line 155, 161, 166
Cathodoluminescence 31, 46
Extended pressure mode 23, 26
CCD camera 37
Chamber door seal 117
Chamberscope 37 F
Checking Faraday cup 81
Position of the circuit breaker 147 Field mode 29
Temperature 117 Filament 27, 122
Chemical 113 Fisheye mode 29
Circuit breaker 147 Focus wobble 76
CL detector 46
Comissioning 56
Compressed Air Supply 156, 161, 167 G
Consumable 113, 171 General Safety Information 10
Consumable and chemical 113 GUI 50
Contamination 151 Gun head, bakeout 120
Control panel 48
Cover panel, protective 18
H
Hazard
D Electrical hazard 11
Decontamination 151 Generated by materials and substances 12
Depth mode 29 Generated by radiation 13
Detection System 158, 163, 169 Mechanical hazard 11
Detector 32, 82 Radiation hazard 13
Thermal hazard 13
Hazards 11
Prevention 11
HD BSD 43

ZEISS Index
I Requirements
for Operators 10
Image Resetting the touch alarm 117
Acquisition 61, 73 Resolution mode 29
Optimization 76
Saving 79
Initializing the stage 115 S
Installation 55 Safe Operating Condition 10
Intended use 9 Safety 9, 112
devices 18
J interlocks 18
Safety label 14
Joystick TV angle 116 Sample type selection 92
Saving images 79
K Scintillator 113
SE detector 33, 83
Keyboard shortcut 59
Secondary electron 31
Shortcuts 59
L Shutdown
License Emergency 111
REDUCED 77 Finishing the work session 108
Location Requirements 155, 161, 166 Microscope 148
Locking device 20 Signal detection 30
SmartSEM
User interface 50
M SmartSEM program suite 53
Mains Connection 154, 159, 165 SmartSEM user interface 50
Maintenance 112 Software 8, 50
Consumable and chemical 113 Spare part 171
interval 112 Special keys 59
schedule 112 Specimen Chamber 157, 162, 168
work 113 Specimen current 81
Microscope Stage 157, 162, 168
De-energizing 110, 125 Post initialization position 116
Shutdown 148 Stage bias
Switching on 57, 58 High voltage 88
Mid-column aperture 27 Low voltage 89
Stage control 47
Stage initialization 115
N Starting SmartSEM 59
Nitrogen 156, 161, 166 Starting the microscope 58
STEM detector 45
Switching off
O Gun 120
ON/OFF switch 19 Gun and EHT 120
Online help 59 Microscope 108, 110, 125
Operation 56 Switching on
Operation modes 29, 81 EHT 68
Optimizing the image 76 Gun 68
Gun and EHT 72
P Microscope 57, 58
Switching to standby 108
Performance data 153, 159, 164
Pressure-limiting aperture 23
Primary electron 31 T
Probe current 81 Temperature 117
Tool 172
R Touch alarm, reset 117
Training 10
Replacing the chamber door seal 117 Transmitted electron 31

Index ZEISS
Troubleshooting 114
Type plate 18
U
User access level 52
User interface 50
User privilege 52
V
Vacuum system 22
Variable pressure mode 23
VP mode 23
VPSE detector 39
W
Warning
labels 13
lights 13
Weight and Sizes 153, 159, 164
Y
YAG BSD detector 44, 87
Z
ZEISS
Portal 8
Service agreements 112

Instruction Manual ZEISS EVO | en-US | Rev. 10
Modifications reserved. | Printed in Germany

Carl-Zeiss-Promenade 10 phone: +49 1803 33 63 34
07745 Jena fax: +49 3641 64 3439
Germany
info.microscopy.de@zeiss.com
www.zeiss.com/microscopy

EN IM EVO Series V10

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Instruction Manual

Carl Zeiss Microscopy GmbH

Carl Zeiss Microscopy GmbH

Document Name: Instruction Manual ZEISS EVO

3 Product and Functional Description ................................................ 21

Instruction Manual ZEISS EVO | en-US | Rev. 10 | 354706-0780-006 3

5 First Operating Steps ...................................................................... 56

6 Care and Maintenance ....................................................................112

4 Instruction Manual ZEISS EVO | en-US | Rev. 10 | 354706-0780-006

8 Decommissioning and Disposal.......................................................148

9 Technical Data and Conformity.......................................................152

10 Parts and Tools ...............................................................................171

Instruction Manual ZEISS EVO | en-US | Rev. 10 | 354706-0780-006 5

1.1 Text Conventions and Link Types

Text convention Meaning

Click Start. The names of controls and important infor-

Press [Enter] on the keyboard.

Press <Ctrl+Alt+Del> Press several keys on the keyboard simultane-

Text input Text to be entered by the user

Programming and Macros Anything typed in literally during program-

Tab. 1: Text convention

Link type Meaning

https://www.zeiss.com/corporate/int/ Link to a website on the internet.

Tab. 2: Link types

6 Instruction Manual ZEISS EVO | en-US | Rev. 10 | 354706-0780-006

1.2 Explanation of Warning Messages and Additional Information

Instruction Manual ZEISS EVO | en-US | Rev. 10 | 354706-0780-006 7

1.3 Further Applicable Documents

Phone: +49 1803 33 63 34

Fax: +49 3641 64 3439

Courses and training

ZEISS Sales & Service Partner

Phone: +49 7364 20 3800

Fax: +49 7364 20 3226

8 Instruction Manual ZEISS EVO | en-US | Rev. 10 | 354706-0780-006

2.1 Intended Use

Instruction Manual ZEISS EVO | en-US | Rev. 10 | 354706-0780-006 9

2.2 General Safety Information

2.2.1 Requirements for Operators

2.2.2 Safe Operating Condition

10 Instruction Manual ZEISS EVO | en-US | Rev. 10 | 354706-0780-006

2.3 Prevention of Hazards

2.3.1 Mechanical Hazards

Specimen Stage Fingers can be trapped by the moving specimen stage.

2.3.2 Electrical Hazards

Instruction Manual ZEISS EVO | en-US | Rev. 10 | 354706-0780-006 11

2.3.3 Hazards generated by Materials and Substances

12 Instruction Manual ZEISS EVO | en-US | Rev. 10 | 354706-0780-006

2.3.4 Hazards generated by Radiation

2.3.5 Thermal Hazards

2.4 Warning Labels and Lights

Instruction Manual ZEISS EVO | en-US | Rev. 10 | 354706-0780-006 13

2.4.1 Warning Labels

14 Instruction Manual ZEISS EVO | en-US | Rev. 10 | 354706-0780-006

Rear Side of Plinth

Position and Figure of the Safety La- Description

1 At the front of the chamber door. Risk of injury

Instruction Manual ZEISS EVO | en-US | Rev. 10 | 354706-0780-006 15

Position and Figure of the Safety La- Description

2 At the front of the chamber door. Suffocation hazard

3 At the front of the chamber door. Damage by collision

5 At the front of the plinth Avoid injury

6 At the rear of the microscope Magnetic field