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DATA SHEET
M3D124
BFU540
NPN SiGe wideband transistor
Product specification 2003 Jun 12
Supersedes data of 2002 Jan 28
Philips Semiconductors Product specification
FEATURES PINNING
• Very high power gain PIN DESCRIPTION
• Very low noise figure 1 emitter
• High transition frequency 2 base
• Emitter is thermal lead 3 emitter
• Low feedback capacitance 4 collector
• 45 GHz SiGe process.
APPLICATIONS
• RF front end
handbook, halfpage 3 4
• Wideband applications, e.g. analog and digital cellular
telephones, cordless telephones (PHS, DECT, etc.)
• Radar detectors
• Pagers 2 1
• Satellite television tuners (SATV) Top view MSB842
CAUTION
This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport
and handling. For further information, refer to Philips specs.: SNW-EQ-608, SNW-FQ-302A and SNW-FQ-302B.
2003 Jun 12 2
Philips Semiconductors Product specification
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCBO collector-base voltage open emitter − 9 V
VCEO collector-emitter voltage open base − 2.3 V
VEBO emitter-base voltage open collector − 2.5 V
IC collector current (DC) − 50 mA
Ptot total power dissipation Ts ≤ 98 °C; note 1; see Fig.2 − 115 mW
Tstg storage temperature −65 +150 °C
Tj operating junction temperature − 150 °C
Note
1. Ts is the temperature at the soldering point of the emitter pins.
THERMAL CHARACTERISTICS
MLE151
150
handbook, halfpage
Ptot
(mW)
100
50
0
0 40 80 120 160
Ts (°C)
2003 Jun 12 3
Philips Semiconductors Product specification
CHARACTERISTICS
Tj = 25 °C; unless otherwise specified.
Notes
1. Gmax is the maximum power gain, if K > 1. If K < 1 then Gmax = MSG.
2. ZS and ZL are optimized for gain.
2003 Jun 12 4
Philips Semiconductors Product specification
MLE152 MLE153
250 50
handbook, halfpage handbook, halfpage
IC (1)
hFE
(mA) (2)
200 40
(3)
(4)
150 30 (5)
(6)
100 20 (7)
(8)
50 10
0 0
0 10 20 30 40 50 0 1 2 3
IC (mA) VCE (V)
MLE154 MLE155
50 40
handbook, halfpage handbook, halfpage
fT
gain
(GHz) (dB)
40
30
MSG
30
20
s21
Gmax
20
10
10
0 0
1 10 102 102 103 104
IC (mA) f (MHz)
2003 Jun 12 5
Philips Semiconductors Product specification
MLE156 MLE157
200 25
handbook, halfpage handbook, halfpage
Cre ITO
(fF) (dBm)
160 20
120 15
80 10
40 5
0 0
0 0.5 1 1.5 2 1 10 102
VCB (V) IC (mA)
Fig.7 Feedback capacitance as a function of Fig.8 Third order intercept point as a function of
collector-base voltage; typical values. collector current.
MLE158
12
handbook, halfpage
PL 1dB
(dBm)
−4
1 10 102
IC (mA)
2003 Jun 12 6
Philips Semiconductors Product specification
0.6
5 GHz 5 GHz
0.4
+0.2 +5
0.2
2.5 GHz
0.2 0.5 2 5
180° 0 0° 0
4 mA
1 GHz 40 mA
−0.2 2.5 GHz −5
1 GHz
−0.5 −2
−135° −45°
−1
MLE159 1.0
−90°
IC = 4 mA and 40 mA; VCE = 2 V; Zo = 50 Ω.
135° 45°
40 mA 1 GHz
1 GHz
4 mA
25 20 15 10 5
180° 0°
10 GHz
−135° −45°
−90° MLE160
2003 Jun 12 7
Philips Semiconductors Product specification
135° 45°
1 GHz
10 GHz
−135° −45°
−90° MLE161
10 GHz 0.6
0.4
+0.2 +5
0.2
5 GHz
0.2 0.5 2 5
180° 0 0° 0
40 MHz
−0.2 1 GHz 40 mA −5
2.5 GHz
4 mA 1 GHz
−0.5 −2
−135° −45°
−1
MLE162 1.0
−90°
IC = 4 mA and 40 mA; VCE = 2 V; Zo = 50 Ω.
2003 Jun 12 8
Philips Semiconductors Product specification
MLE163 MLE164
4 3
handbook, halfpage handbook, halfpage
NFmin
NFmin
(dB)
(dB)
3
2
2
f = 5 GHz
f = 2 GHz 1
1
0 0
0 4 8 12 16 20 0 2 4 6
IC (mA) f (GHz)
Fig.14 Minimum noise figure as a function of Fig.15 Minimum noise figure as a function of
collector current. frequency.
f Fmin Γopt rn
(GHz) (dB) (mag) (deg) (Ω)
2003 Jun 12 9
Philips Semiconductors Product specification
2 BF 271.5 −
E'
3 NF 1.061 − Cbe Ccs
8 BR 50 − E
9 NR 1.01 −
10 VAR 1 MV
Fig.16 Package equivalent circuit SOT343R2.
11 IKR 6.4 mA
12 ISC 1.2 fA
13 NC 1.21 − List of components (see Fig.16)
14 RB 8.75 Ω DESIGNATION VALUE UNIT
15 (1) IRB − −
Lb 1.18 nH
16 RBM 5 Ω
Lc 1.04 nH
17 RE 0.9 mΩ
Le 0.32 nH
18 RC 9.25 Ω
Cbe1 146 fF
19 XTB −2.2 −
Cbe2 55 fF
20 EG 1.014 eV
Cce 56 fF
21 XTI 3 −
Ccs 100 fF
22 CJE 222 fF
Rcs 170 Ω
23 VJE 918 mV
24 MJE 0.27 −
25 TF 2.1 ps
26 XTF 10 −
27 VTF 1.5 V
28 ITF 0.92 A
29 PTF 30 deg
30 CJC 147 fF
31 VJC 587 mV
32 MJC 0.246 −
33 XCJC 0.44 −
34 TR 20 ps
35 CJS 51 fF
36 VJS 441 mV
37 MJS 0.313 −
38 FC 0.7 −
Note
1. Not used.
2003 Jun 12 10
Philips Semiconductors Product specification
PACKAGE OUTLINE
D B E A X
y HE v M A
3 4
A1
c
2 1
w M B bp b1 Lp
e1
detail X
0 1 2 mm
scale
SOT343R 97-05-21
2003 Jun 12 11
Philips Semiconductors Product specification
DEFINITIONS DISCLAIMERS
Short-form specification The data in a short-form Life support applications These products are not
specification is extracted from a full data sheet with the designed for use in life support appliances, devices, or
same type number and title. For detailed information see systems where malfunction of these products can
the relevant data sheet or data handbook. reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
Limiting values definition Limiting values given are in
for use in such applications do so at their own risk and
accordance with the Absolute Maximum Rating System
agree to fully indemnify Philips Semiconductors for any
(IEC 60134). Stress above one or more of the limiting
damages resulting from such application.
values may cause permanent damage to the device.
These are stress ratings only and operation of the device Right to make changes Philips Semiconductors
at these or at any other conditions above those given in the reserves the right to make changes in the products -
Characteristics sections of the specification is not implied. including circuits, standard cells, and/or software -
Exposure to limiting values for extended periods may described or contained herein in order to improve design
affect device reliability. and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
Application information Applications that are
communicated via a Customer Product/Process Change
described herein for any of these products are for
Notification (CPCN). Philips Semiconductors assumes no
illustrative purposes only. Philips Semiconductors make
responsibility or liability for the use of any of these
no representation or warranty that such applications will be
products, conveys no licence or title under any patent,
suitable for the specified use without further testing or
copyright, or mask work right to these products, and
modification.
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
2003 Jun 12 12
Philips Semiconductors Product specification
NOTES
2003 Jun 12 13
Philips Semiconductors Product specification
NOTES
2003 Jun 12 14
Philips Semiconductors Product specification
NOTES
2003 Jun 12 15
Philips Semiconductors – a worldwide company
Contact information
Printed in The Netherlands 613516/04/pp16 Date of release: 2003 Jun 12 Document order number: 9397 750 11468
www.s-manuals.com