Advances in Interconnect Technologies: An International Journal (AITIJ)

http://airccse.com/aitij/index.html
Scope & Topics

Advances in Interconnect Technologies: An International Journal (AITIJ) invites original

and significant contributions relating to the theory, design, performance and reliability of
interconnect, including materials, analysis, modeling and simulation of interconnect. The journal
proposes to stimulate the development of latest technology in industry and academia. High quality
review papers and short communications are also acceptable.

Research areas suitable for publication include, but are not limited to the following fields:

Topics of interest include, but are not limited to, the following

 Emerging Materials
 CNT/ Graphene Interconnects
 Modeling and Simulation
 Testing
 RFIC
 Optical Interconnects
 Wireless Interconnects
 Microstrip Lines
 Analog and Mixed Signals
 Dedicated Software and Systems for Developing Inter connect Technology
 On-Chip and Off-Chip Interconnects
 EMC/EMI
 FPGA/ASICs
 Fabrication Techniques
 Neural Networks
 Parasitics Issues
 Optimization Techniques

Paper Submission

Authors are invited to submit papers for this journal through Email aitijjournal@airccse.com or
Submission System. Submissions must be original and should not have been published previously
or be under consideration for publication while being evaluated for this Journal.

Important Dates

 Submission Deadline : December 10, 2022

 Notification : January 10, 2022
 Final Manuscript Due : January 18, 2022
 Publication Date : Determined by the Editor-in-Chief

Contact Us

Here's where you can reach us: aitijjournal@yahoo.com (or) aitijjournal@airccse .com