TECHNICAL

CATALOG

SENSOR
NODE

ZedBee Technologies
Table of
Contents

01 Application

02 Mechanical
Specification

03 Architecture

04 General Features

05 Specifications
01. APPLICATION

BMS OTHERS
Normal AHU (control and Data Monitoring and
monitoring) controls
Pump Controls - STP, WTP,
Fire

02. MECHANICAL SPECIFICATION

1.) Selecting the mounting location depends upon the device dimensional
information. (i.e. length, breadth & height etc.).
2.) Allocate 30% free space around the device necessary for cooling and
ventilation.
3.) Our device must be installed at least 150mm(min) from the contactor inside
the panel installation.
 03. ARCHITECTURE

Uplink / Cloud

Wi-Fi/LAN

RS-485
SESNOR NODE
For Downlink
(EM/external devices) 1-Day of data storage*

DIGITAL INPUT ANALOG INPUT

2 General Purpose I/O 5VDC MAX 1.) 5- (0-10)VDC OR (4-20Ma)
or NTC

DIGITAL OUTPUT ANALOG OUTPUT

1 RELAY OUTPUT 1- 0-10VDC WITH 256 STEPS
24VDC/5AMPS MAX

Sensors

*Note: Storage depends on the number data being fetched

04. GENERAL FEATURES

Arm® 32-bit Cortex®-M0 CPU, frequency up to 48 MHz

Memories – 16 to 256 Kbytes of Flash memory – 4 to 32 Kbytes of SRAM with HW
parity
Wi-Fi for uplink.
4 Channel NTC Thermistor or PT100 Temperature Sensor Input.
Internal Data Logging Memory 4MB for data storage.
Internal RTC with Battery Back
Local Debug Port UART.
MODBUS RTU for downlink.

05. SPECIFICATIONS

Input Socket Voltage (Rated) : 230 V (AC)

Input Socket Current (Rated) : 5A
Device Voltage (Rated) : 5 V (DC)
Device Current (Rated) : 500 mA
Temperature Range : 15 to 60 ℃
www.zedbee.in

sales@zedbee.in

‎+91 44 6646 9875

B3/4, B- Block, 3rd floor, IIT Madras research

park, Taramani, Chennai- 600113