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03-05-00
SECONDARY STRUCTURAL BONDING PROCEDURES

1. GENERAL
Secondary structural bonding procedure using epoxy or silicone adhesive is intended for use to make point attachments which are not part of the
primary structure of the helicopter.

NOTE: Adhesives used in this procedure are film and two-part components epoxy adhesives (refer to Table 03-05-00-1) and silicone adhesive
(refer to Table 03-05-00-2).
Materials that may be bonded in accordance with this procedure are metal, plastic, and rubber parts.
Fluorocarbons (teflon) may be bonded, but require a special surface treatment prior to bonding.

2. SURFACE PREPARATION
A. Input conditions.

(1) Support equipment: none.

(2) Consumable materials:

— Ink (LCM034).

— Abrasive cloth or paper (LCM019).

— Aliphatic naphtha (LCM018).

— Methylethylketone (MEK) (LCM004).

— Toluene (LCM035).

Table 03-05-00-1. Epoxy adhesives, mixing ratio, pot life and curing schedule
Adhesive Activator LCM Mix Ratio by Pot Life CURE CYCLE ALTERNATE CURE CYCLE
[1] Hardener Weight (Minutes)
or Time Pressure Temp Time Pressure Temp.
Catalyst Minimum kg/cm2 °C minimum kg/cm2 °C
(Hours) (Minutes)
Metalset A- Part “B” 47 Equal parts “A” 30 to 40 24 [3] Firm contact 21 to 30 Firm contact 63 to
4 and “B” 35 82
EA 9340 Part “B” 48 Equal parts “A” 30 to 40 24 [3] Firm contact 21 to 30 Firm contact 63 to
and “B” 35 82
RP 1258 Part “B” 49 Equal parts “A” 30 to 45 24 [3] Firm contact 21 to 30 Firm contact 63 to
and “B” 35 82
EA 9309 Part “B” 50 100 parts “A” 23 30 to 45 24 [3] Firm contact 21 to 60 Firm contact 60 to
parts “B” to 0.7 35 to 0.7 71
Epon 934 Part “B” 44 100 parts “A” 23 30 to 50 24 [4] Firm contact 21 to 60 Firm contact 79 to
parts “B” to 0.7 35 to 0.7 88
Epiibond Part “B” 51 100 parts “A” 30 40 24 [4] Firm contact 21 to 60 Firm contact 79 to
8510 parts “B” 35 to 0.7 88
Film 52 to None 7 days 1 [3] 0.7 to 3.5 127 to 120 0.7 to 3.5 94 to
adhesive 55 138 107
EC 2216 Part 56 100 parts “A” 140 110 to 24 [4] Firm contact 21 to 120 Firm contact 63 to
“A” [2] parts “B” 130 to 0.7 35 to 0.7 68
Epon 828 DTA 41 100 parts (828) 8 20 to 30 24 [4] Firm contact 21 to 120 Firm contact 79 to
(828) to 12 parts (DTA) to 0.7 35 88
43
(DTA)
NOTES:
[1] The adhesive specified in this table shall be stored and controlled as specified by the manufacturer.
[2] For EC 2216, Part “A” (grey) is the catalyst or hardener, Part “B” (white) is the basic resin.
[3] Maximum strength is obtained in 72 hours.
[4] Maximum strength is obtained in 6 to 7 days.

Table 03-05-00-2. Silicone adhesive, mixing ratio, pot life and curing schedule.

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Adhesive LCM Working Intended use Shelf life Mixing Ratio Pot Applicable Cure cycle
temperature life primer

Weight Volume Time Pressure Temperature

minimum
(Hours)
DAPCO 84 -55 to 150°C Bonding of 6 months 100 of 7.93 of 6 D Aircraft 24 Firm At least 12°C
3300 metals/glass/plastic (18-27°C, A[1] A[1] hours DAPCO contact
with silicone rubber relative 10 of B 10 of B [2] 1-100
humidity
max 75%)
NOTES:
[1] A: Basic resin B: hardener. Tolerance for ratio mixing 5%.
[2] It is preferable apply the adhesive immediately after mixing.

(3) Other recommendations:

NOTE: The faying surfaces of details and the mating interface shall be prefitted prior to cleaning and bonding when practical.
The faying surface shall have good contact over the entire area to be bonded, and shall be free of waves, burrs, and other surface
imperfections.

B. Cleanliness shall be carefully controlled through all phases of preparation and bonding.
Clean, dry, white gloves shall be worn when handling processed parts and during the bonding operation. The gloves shall be changed when
they become soiled. Contact with grease or mold release agent shall be avoided.

C. When necessary to mark detail parts or the location of bond areas prior to bonded, felt tip metal marking pens (LCM034) with non-permanent
ink shall be used.

CAUTION: DO NOT USE METAL SCRIBERS OR LEAD PENCILS FOR MARKING IN AREAS TO BE BONDED.

D. Faying surfaces shall be cleaned for bonding as follows:

WARNING: BEFORE USING SOLVENTS EXTINGUISH ALL FLAME AND PILOT LIGHTS. KEEP PRODUCT AND ITS VAPORS AWAY
FROM HEAT, SPARKS AND FLAME. DURING APPLICATION AND UNTIL VAPORS ARE GONE, AVOID USING SPARK-
PRODUCING ELECTRICAL EQUIPMENT SUCH AS SWITCHES, APPLIANCES, ETC. AVOID PROLONGED BREATHING OF
VAPORS AND REPEATED CONTACT WITH SKIN.

(1) All metals. When possible, all metals shall be chemically cleaned, or abraded lightly with No. 400 grit abrasive cloth or paper (LCM019)
and cleaned with naphtha (LCM018) or MEK (LCM004).
In the case of components or parts which cannot be cleaned by abrading, suitable solvents should be used to clean bond to ensure
minimum board strength for the particular adhesive specified.

NOTE: When using silicone adhesive on metal surfaces, application of primer is suggested, refer to Paragraph 3.

NOTE: The integrity of this bonded joint shall be qualified by proof load, when required by maintenance instructions.

(2) Rubber.
The area to be bonded shall be wiped clean with a cleaning agent (LCM018, LCM035 or LCM004), abraded with a wire brush or with
No. 80 grit abrasive cloth or paper (LCM019) and wiped with solvent. The parts shall be wiped dry with dry cloths.

(3) Plastics.
Plastic must be sanded lightly with 400-grit abrasive paper (LCM019) and cleaned with a dry cloth or jet of air to make surfaces
perfectly clean, dry and free of oil and grease prior to bonding.

(4) Fabrics, foams, etc.

These materials shall be clean and dry.

(5) Painted surfaces.

Painted surfaces shall have the faying area wiped with a clean cloth moistened with naphtha (LCM018).
The paint shall be removed in the faying area by sanding lightly with No. 100 grit abrasive cloth or paper (LCM019); remove the
sanding residue with a clean cloth moistened with naphtha (LCM018).
The parts shall be wiped dry with a clean, dry cloth before the naphtha evaporates. After bonding is complete, all exposed bare metal
surfaces shall be refinished the same as the surrounding painted areas.

NOTE: Protection of details.

Details that have been cleaned for bonding shall be protected or stored so as not to become contaminated during lag periods.

3. BONDING

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A. Input conditions.

(1) Support equipment: none.

(2) Consumable materials:

— Glass yarn string (LCM036).

— Methylethylketone (MEK) (LCM004).

(3) Other recommendations: none.

B. Film-type epoxy adhesive.

(1) After cleaning, parts and details to be bonded must be primed in accordance with the relevant procedure. The applicable primer shall
be applied to the faying surfaces and allowed to dry for not less than one hour at room temperature (21-27 °C).
Apply the film adhesive to the primed faying surface being careful to prevent air entrapment. Remove protective backing from the
applied adhesive. Assemble parts and cure in accordance with Table 03-05-00-1.

C. Two-part epoxy adhesive.

(1) Mixing instructions.

Mix the proper amount (by weight) of base resin to hardner or catalyst in accordance with Table 03-05-00-1.

(2) Pot life.

Refer to Table 03-05-00-1.

(3) Adhesive application.

After thoroughly mixing, the adhesive may be applied by spatula, knife coat, notched trowel, wood applicator, or by flowing into plate.
Adhesive shall be applied to all faying surfaces.

(4) In order to ensure a minimum cured adhesive thickness of 0.07 to 0.20 mm, spacers can be used as follows: place 0.1 mm glass yarn
thread (LCM036) in the bondline approximately 25 mm apart. Fabric may be used in lieu of thread.
Threads or fabric shall be spaced so that the edge of the bond surface is supported. When threads or fabric are used for spacing, they
shall not extend past the bond edge.

D. Silicone two-part adhesive.

NOTE: Silicone adhesive can be used only if the bonding area does not exceed 25 mm in width.

(1) Mix the proper amount of base resin to the hardener catalyst according to Table 03-05-00-2.

(2) Refer to Table 03-05-00-2 for the pot-life of adhesive.

(3) Mix the adhesive properly.

(4) Apply the adhesive to all the faying surfaces using a spatula, knife coat, notched trowel, wood applicator or by flowing it onto a plate.

(5) Use spacers to make sure that the minimum cured thickness of the adhesive is 0,08 to 0,20 mm.

(6) Place 0,01 mm of glass yarn thread (LCM036) in the bond-line, approximately 25 mm apart.
You can also use fabric in the place of thread.

(7) Space the thread of fabric so that the edge of the bonded surface is supported.

(8) Make sure that the thread or fabric does not go past the edge of the bonded edge.

NOTE: The bonded joint can be handled after 24 hours; maximum strength is obtained after 7 days at room temperature (24 °C).

(9) After 4 minutes, press the adherents together.

E. Injections and filleting.

When the configuration of parts requires this type of adhesive application, the mixed adhesive shall be injected by pressure gun, potting
syringes or other suitable methods of forcing the adhesive to fill the joint area. To lower the viscosity of the mixed adhesive for easier
injection, the adhesive may be heated to 52-54 °C and used within 10 minutes.

F. Detail joining with two-part epoxy adhesive.

Detail and part joining (and fixture loading where required) shall occur while adhesive is within its pot life time, as stated in Table 03-05-00-1.
Use care to ensure proper alignment and to avoid trapping air within the bondlines. Remove excessive adhesive squeezed-out prior to
curing.
Also clean off any adhesive that may have collected on the surfaces outside the bond regions using cheesecloth moistened with MEK
(LCM004).

4. CURING
A. Input conditions.

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(1) Support equipment: none.

(2) Consumable materials: none.

(3) Other recommendations: none.

NOTE: The procedure that follows is required only in case of bonding with epoxy adhesive.

B. Temperature cycle and time range.

The cure temperature cycles and times are specified in Table 03-05-00-1.
Heat may be attained from oven, autoclave, or infrared source when properly regulated. When heat is required, timing shall start after the
bondline reaches curing temperature.

C. Bondline pressure.
The bondline pressure, as stated in Table 03-05-00-1 of this section, shall be distributed over the full bond region throughout the cure cycle.
Bondline pressure shall not be used for spring-back or form retention on rigid or semi-rigid parts. When adhesive is used for filleting or is
injected into a cavity, pressure is not a requirement.

5. TEST
A. Input conditions.

(1) Support equipment: none.

(2) Consumable materials: none.

(3) Other recommendations: none.

B. Testing of bonded joints includes tapping and visual inspection for a continuous edge bond and quality.

Structural Repair Manual - SRM - 03-05-00 - Secondary structural bonding procedures Printed on 29/04/2016