T200N Nitrogen Ready, Lead-Free Reflow Oven Page 1 of 2

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Manncorp Model T200N

Nitrogen Ready, Lead-Free Batch Reflow System
w/PC Interface and Profiling Software
An Inert Gas Delivery System with Built-In Flow Control and Windows® Based
Control Software Provide the Ultimate in Batch Reflow Flexibility

While many studies show that lead-free

soldering in a nitrogen atmosphere allows
reduction of peak temperatures and/or time
above liquidus, does this mean that you
should specify an inert gas environment for
all your reflow processes? Well, now you can
demonstrate for yourself or your customers
how much nitrogen improves paste spread,
increases wettability, and produces shinier,
more aesthetically pleasing solder joints.
Manncorp's T200N Nitrogen Ready Lead-Free
Batch Reflow System includes an integrated
gas delivery system with built-in flow control
that will allow you to process boards in an
inert, oxygen-free atmosphere. Simply
connect your gas supply to the T200N's
input connection and you will have your own,
self-contained, bench-top testing center to
simulate virtually any reflow processing
environment. MSRP: $5,195

Features More Info Specifications Photos Show All

Model T200N Key Features

z Lead-Free, bench-top, batch processing of PCBs

up to 360 mm (14") x 230 mm (9")
z Energy-efficient, combination quartz infrared and forced hot-air convection
heating with low turbulence air flow design
z Inert gas supply inlet connection and integrated gas delivery system
with built-in flow control for oxygen-free reflow processing
z Serial communications interface and control software for recording, saving,
printing real-time process data and parameter settings
(Computer not included)
z Unlimited storage/retrieval of precison solder profiles constructed
of 20-40 user adjustable time/temperature segments
z PID temperature controls for (±2°C) accuracy;
uniform (±1°C) ΔT across PCB surface
z Viewing window allows visual inspection of reflow
z Transverse flow cooling fans
z Ideal for short runs, laboratory testing, and training

Like the other members of the Manncorp T200 Series, its low-turbulence air flow design, the T200N provides
the Model T200N is designed to meet the basic needs of

https://www.manncorp.com/reflow-ovens/t200n/index.php?auto=done 9/23/2008
T200N Nitrogen Ready, Lead-Free Reflow Oven Page 2 of 2

low volume assemblers, laboratories, or schools in need of
an affordable yet very reliable solution to their lead-free
reflow soldering requirements. It is also suitable for a wide
range of other curing and drying applications. An energy
efficient combination of quartz infrared and hot-air
convection under PID intelligent temperature control
provides accurate (±2°C) heating at the higher
temperatures required for lead-free soldering, with a ΔT of
only ±1°C across a generous 360 mm (14") x 230 mm
(9") processing area. In conjunction with
excellent results when soldering even the smallest, most
delicate 0201 devices and the most advanced CSPs,
BGAs, and fine-pitch QFPs. Twenty to forty (20-40)
sequential time and temperature settings allow generation
of precise temperature profiles for prototyping, pilot runs,
and small scale production. The T200N also includes a
serial communications interface and advanced control
software that allows students, technicians, and
manufacturing engineers to record, save, and print real-
time process data and parameter settings.

Model T200N - Specifications

Applicable Solder Types Lead-Free and Leaded
Maximum PCB Size 360 mm (14") x 230 mm (9")
Heating Method Quartz IR & Forced Hot Air Convection
Temperature Range Ambient - 300 °C
Temperature Control PID Control; ±2%
Method SSR
Temp Control Setting 20-40 Time/Temperature Segments per Profile
Warm-up Time approx. 2 min.
Programming Windows® Compatible Software
PC Interface RS-232, RS-485, RS-422 (Computer not included)
220 V, Single Phase, 50/60 Hz
Power
1.7 KW; 4.1 KW (max.)
820 mm L x 460 mm W x 310 mm H
Dimensions
(32.2" L x 18.1" W x 12.2" H)
approx. 100 lbs.
Weight
(45 Kg)

Time/Temperature Control Segments Allow Real-Time Temperature Monitoring

Simulation of In-Line Reflow and Data Acquisition
The ability to divide a single processing cycle into as Real-time monitoring of the T200N temperature during
many as 40 different time/temperature... the process cycle allows...
(more information and larger photo) (more information and larger photo)

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©2008 By Manncorp. All Rights Reserved.

Information contained herein has been prepared to the best of our knowledge at the
time of publication and is subject to corrections and updates. Prices and
specifications subject to change without notice.

https://www.manncorp.com/reflow-ovens/t200n/index.php?auto=done 9/23/2008