Solder paste types

April 2022

Norbert Süli
INGREDIENTS OF SOLDER PASTE
METAL POWDER

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METAL POWDER
 Alloy
• It defines the electro-mechanical properities of
the solder joint.
• Main factor of the mechanical reliability
• Initial mechanical properties
• Aging properties

• Determines the soldering parameters

• Temperature
*JIS Classification is different
• Time
 Powder particles size and distribution
• Detemines the printing capabilities from the
size of the apertures and paste paste
transfer point of view.
• It classified by IPC J-STD005A into classes.

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METAL POWDER
 Different powder’s sizes
comparison by the ball’s surfaces.
• Determines:
• Stencil’s life
• Re-flow parameters
• Re-oxidation & flux activity
• Susceptible to graping and
random solder balling

• Reactivity vs surface area

(coffe example)

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INGREDIENTS OF SOLDER PASTE
FLUX

5
FLUX (Thixotropic Agents + Activators + Solvents)

 Thixotropic/rheological agents  Activators

• It define the rheology of the solder
paste (like viscosity and rheology)
• Main factor from applying method of
solder paste and post re-flow residues
• Chemically active ingredients which are
removing oxide from the powder and
surfaces to be soldered.
• Determine the classification of the flux
by the activity and electro-chemical
reliability point of view.

 FLUX
• Special and complex mixture of Rosins, Activators,
Thixotropic/Rheological Agents, Solvents and Other Ingredients.
• It means the backbone of the solder paste from applying method,
activity and electro-chemical reliability point of view

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CLASSIFICATION OF SOLDER PASTES
BY FORMULATIONS IPC J-STD-004(A) & ACTIVITY LEVELS

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IPC J-STD-004(A)
Flux Materials Flux/Flux Residue % Halide Flux Flux
of Composition Activity Levels (by weight) Type Designator
0.0%* L0 ROL0 NC
Low
< 0.5% L1 ROL1
ROSIN 0.0% M0 ROM0 NC
Moderate
(RO) 0.5-2.0% M1 ROM1
0.0% H0 ROH0
High
>2.0% H1 ROH1
0.0% L0 REL0
Low
< 0.5% L1 REL1
RESIN 0.0% M0 REM0
Moderate
(RE) 0.5-2.0% M1 REM1
0.0% H0 REH0
High
>2.0% H1 REH1
0.0% L0 ORL0
Low
< 0.5% L1 ORL1
ORGANIC 0.0% M0 ORM0
Moderate
(OR) 0.5-2.0% M1 ORM1
0.0% H0 ORH0 WS
High
>2.0% H1 ORH1
0.0% L0 INL0
Low
< 0.5% L1 INL1
INORGANIC 0.0% M0 INM0
Moderate
(IN) 0.5-2.0% M1 INM1

High
0.0% H0 INH0 NC: No-Clean
>2.0% H1
* 0.0% is defined as <0.05% by weight
INH1
WS: Water Soluble

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ACTIVITY LEVELS

QUANTITATIVE
QUALITATIVE HALIDE HALIDE CONDITIONS FOR
SILVER SPOT PASSING 100 CONDITIONS FOR
FLUX COPPER CHROMATE TEST CORROSION MEGOHM SIR PASSING ECM
TYPE MIRROR (Cl, Br) (F) (Cl, Br, F) TEST REQUIREMENTS REQUIREMENTS
L0 No evidence of Pass Pass 0.0% No evidence of
Uncleaned Uncleaned
L1 mirror breakthrough Pass Pass <0.5% corrosion
M0 Breakthrough in Pass Pass 0.0% Minor corrosion Cleaned or Cleaned or
M1 < 50% of test area Fail Fail 0.5 to 2.0% accpetable Uncleaned Uncleaned
H0 Breakthrough in Pass Pass 0.0% Major corrosion
Cleaned Cleaned
H1 > 50% of test area Fail Fail > 2.0% acceptable

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CLASSIFICATION OF SOLDER PASTES
BY ALLOYS

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 ALLOYS (THE TIPICAL ALLOYS IN OUR SP)
 LEADED  LEAD-FREE Alloys  LEAD-FREE
• Sn63Pb37 (183) • Conventional SAC: • High Reliablity:
• Sn62Pb36Ag2 (179-182) • SAC305 (217-220) • Innolot/MaxRel (212-220)
• SAC387 (217-219) • MaxRel Plus (211-216)*
• SAC405 (217-224) • Low Melting Point:
• Low Silver • Sn57.6Bi0.4Ag
(137.2-141.7)
• SACX0807 (217-226)
• SBX02 (137.9-142.5)
• SACX0307 (217-228)
• HRL1 (138-151.1)*
 MARKINGs
• Bold & Underlined: High runners
• (X) melting point (EUTECTIC) or (X-Y)melting range (NON –EUTECTIC)
• All of the alloys& powders (T2-T5) combinations produced in Duna except the *-marked there are
produced different ALPHA sites as well as T6 too.

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MARKING OF THE SOLDER PASTES

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Rheology of the solder paste (Thixotopic material)
 This graph represent the solder
paste’s behaviour.
 During the printing the shear stress
increasing because it is
proportional with the printing
speed. IDEAL PRINTING
SPEED
 Under the shear stress the paste
can easier fill the apertures due to
its lowered viscosity.
 After the printing shear stress = 0,
paste form uniform deposits.
*Our solderpaste optimal printing
speeds >~50mm/s

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Classification of solder paste
BY APPLICATION’S METHODS

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 APPLICATION’S METHODS
 Metal Loads  Powder Type vs Component’s size
• 88-90% Normal Stencil printig • T3 - down to 0402 (0201)
• 83-87% Normal dispensing and Jetting • T4 - down to 0201, (0.4mm μBGA)
• 78% PoP (Package on Package) Application • T4.5 - 0.4mm μBGA
• T5 - down to 01005, jet dispensing. PoP
• T6 - jet dispensing, PoP
other ultra-fine feature applications
• T7 - special, future applications

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STENCIL PRINTING

F=x kg
V= y mm/s

Squeege holder

Stencil Aperture
PWB

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STENCIL PRINTING

F=x kg
V= y mm/s

Squeege holder

Stencil Aperture
PWB

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STENCIL PRINTING Squeege holder

Stencil Aperture

PWB

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DISPENSING METHODS
• Time/ Pressure:
Fluid pressure

Pressure is applied on the topside of the syringe where a plugner (follower) is

placed on top of the fluid.This way material will be forced down to be applied on a
substrate through a needle. Most simple and less accurate dispense technique.
The volume of the syringe, the material viscosity and the needle ID will determine
Fluid
the flowrate.

P2

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DISPENSING METHODS
• Auger dispense systems (Archimedis screw):

A motor will rotate the auger screw for a certain “on time”, during this “on time” a
specific volume will be dispensed trough the needle.
Flowrate is determined by the pitch and depth of the auger, Syringe
at P1

needle ID and the motor speed. DC Servo Motor

This system is more accurate than T/P dispense techniques Tube

as the applied fluid pressure has no impact on the dispensed volume. Auger

P2 at
Auger
Output
Needle

Needle Output
at P3

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DISPENSING METHODS
• Positive displacement dispense technique (psiton pumps):

Material is applied trough the needle by the movement of the linear pistion.
This piston is driven downwards by a motor and a gearbox to transfer the
rotarty movement into a linear movement The volumetric resolution is DC Servo Motor

determined by the psiton size.The flowrate is determined by the piston size,

lenght of the linear movement per shot.
Syringe
Linear
Piston

Rotary Valve

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DISPENSING METHODS
• Jet Dispense Technique (non contact):

A needle which travels up and down in a chamber will hit material

trough a seat and nozzle combination out of the jet valve.
The pulse of the needle movement can varie from 4 till >15ms,
depending on the solenoid and controller type.
Flowrate is determined by the needle ball size, seat size,
nozzle size and retract distance of the needle.

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 PoP APPLICATION

BLADE w Variable height

BLADE

Pick up Mounting Rotary reservoir

RESERVOIR STOPPED DIP & HOLD PULL OUT
from to
feeder DIPPING FEEDER OPERATION WITH PICKED COMPONENT PWB

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DIPPING APPLICATION

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DIPPING APPLICATION

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DIPPING APPLICATION

Mounted components

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PRODUCTION OF SOLDER PASTE
POWDER PRODUCTION

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 METAL POWDER PRODUCTION

 Metal Powder Manufacturing

Furnace

Atomizer

Cyclone

Recycler

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PRODUCTION OF SOLDER PASTE
FLUX PRODUCTION & PASTE MIXING

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 FLUX PRODUCTION & PASTE MIXING

 Flux Production:  Paste Mixing:

• Mixing of the • Blending the flux with the
ingredients according metal powder
the recipe (Weight,
• According the recipe
Dosing, Conditions)
(Dosing, Conditions, etc.)
• Milling of the finished
• QC (Viscosity, Metal load,
flux avoid the big
Solder Balling, Wetting)
particles. (<10μm).
• Quality check of it
(Viscosity, Acid Nr.,
Water content) fine
Planetary Mixer
tune if it necessary.

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