2018 Seminar HU

Soldering Seminar
19-21. February 2018. Dunaharaszti
©2016 Alpha Assembly Solutions – Confidential

PRESENTATION OVERVIEW
ALPHA ASSEMBLY SOLUTIONS ALLOYS
INTRODUCTION PHYSICAL METALLURGY
EFFECT OF ADDITIVES ON SN-BASED ALLOYS
TESTING AND EVALUATION METHODS OF ALLOY
TRENDS IN THE INDUSTRY
TRENDS IN THE INDUSTRY – LOW SILVER SOLUTIONS
TRENDS IN THE INDUSTRY – HIGH RELIABILITY SOLUTIONS
TRENDS IN THE INDUSTRY – LOW MP SOLUTIONS EUTECTIC
TRENDS IN THE INDUSTRY – LOW MP HRL1 ALLOY
THE IMPORTANCE OF USING THE RIGHT CHEMISTRY
NEW SOLDER PASTES
NEW SOLDER WIRES
TENSORED FRAMES
APPENDIX: PHYSICAL PROPERTIES OF ALLOYS

ALPHA ASSEMBLY SOLUTIONS ALLOYS
ALPHA ASSEMBLY SOLUTIONS™ ALLOYS
IP Portfolio Introduction
Alpha IP Portfolio is Focused on Key Customer/Market Needs

INTRODUCTION OF PHYSICAL METALLURGY
Alpha Assembly Solutions™ Publications

Patent Application 2013 APEX 2013 SMTAI
ALPHA® CVP520
ALPHA®
2013 IEEE EPTC 2014 IEEE EPTC 2015 SMTAI
OM535
ALPHA®
ECOSOL
INTRODUCTION OF PHYSICAL
METALLURGY
Plastic deformation
• Dislocations are present in most crystalline structures and can
be described as defects.
• Plastic deformation is caused by movement of dislocations.
Edge
Screw

Diffusion
• A phenomenon of material
transport by atomic motion.
• Diffusion mechanisms:
- Self diffusion
- Vacancy
- Interstitial
• Diffusion occurs in the formation of alloy phases.

• It depends on a diffusion coefficient that varies with the material.
• Certain alloying additions may facilitate or impede diffusion through the
matrix.
Phases in metal
• Solid solutions: When in a solid, the atoms of solute are present in the lattice of the solvent, it
is known as solid solution.
-The crystal structure of the solvent remains unchanged by addition of the solutes
-Bonding is metallic
-Substitutional solid solutions Ordered <=> Disordered
 Most of the cases Disordered.
-Interstitial solid solutions

Phases in metal
• Intermetallic compound: compound formed by two or
more metals such as Cu3Sn, Cu6Sn5, Ag3Sn…
-Can be formed from the secondary phase when the solute
more than limit of solubility
-Different crystal structure than the primary element’s CS
-Bonding is metalic-covalent
-Hard and brittle, like ceramics
-The components should have opposit electrochemical nature
-Generally, formed between strong & weakly metallic atoms

Hume Rothery’s Rule

• Four conditions of extensive substitutional solid solubility.
-(1)The size difference between solute and solvent atoms ~ 15%
-(2)The crystal structure of metal must be same.
-(3)The electronegativity difference between the metal must be small.
-(4) Maximum solubility occurs when the solvent and solute have the
same valency.
• Strengthening Mechanisms Depends On,

-Difference in size between solute and solvent atoms
- Amount of solute added
-Nature of distortion produced by solute atoms.

How this parameter affects Strengthening Mechanisms.

• As the size difference between solute and solvent atoms increases ,the
intensity of stress field around solute atom increases and resistance to
dislocation is increases, so strength of metal is also increases.
• A large concentration of solute atoms are added it means more frequent
obstacles to dislocation. The strength increases in proportion of where
C is a concentration of solute atoms.
• The nature of distortion produced by solute atoms are also important.

-Spherical distortion produced by Substitutional solute atoms.
-Non spherical distortion produced by Interstitial solute atoms.
• Non spherical distortion produced maximum effect i.e. it increases yield
strength.

EFFECT OF ADDITIVES ON SN-
BASED ALLOYS
ALLOY DEVELOPMENT TECHNICAL APPROACH
Solid Solution
Diffusion Modifiers
Strengthening
Solder Alloy
Grain Refinement / Precipitate

Grain Modifiers Strengthening

Properties of different elements

Element Pb Sb Bi Ge Sn Ag Ni Cu Si Co Fe In Zn Cr Ti Mn Ce
Electronegativity 2,192,052,022,011,961,931,911,9 1,9 1,881,831,781,651,6 1,541,5 1,12
Element (Empirical) Ce Pb Ag Bi In Sb Sn Cr Fe Mn Ti Co Cu Ni Zn Ge Si
Atomic radius [pm] 185 180 160 165 155 145 145 140 140 140 140 135 135 135 135 125 110
Element (Calculated) Ce Ti Cr Ag Mn In Fe Pb Co Ni Sn Cu Bi Zn Sb Ge Si
Atomic radius [pm] N/A 176 166 165 161 156 156 154 152 149 145 145 143 142 133 125 111
Element Cr Bi Sb Ce Co Ge Mn Pb Si Sn Ti Fe In Cu Ni Zn Ag
Valence 6 5 5 4 4 4 4 4 4 4 4 3 3 2 2 2 1
• Electronegativity: the more electropositive element and electronegative
elements means higher tendency to form intermetallic than solid solutions
• Valences: metal with higher valency will dissolve another metal with
higher tendency than the metal with lower valency
1. Solid Solution Strengthening
• When the atoms of base metal (solvent) and the alloying elements (solute) completely dissolve
in each other and become an integral part of the solid phase of alloy
• Atoms in solid solution generate local stress fields that interact with dislocations.
• Strengthening arises from impeding dislocation motion.
 Example: Bi solute atoms in Sn lattice result in higher strength.

2. Grain Refinement
• Dislocation movement is interrupted by grain boundaries.
 Example: Reducing grain size with Bi addition increases the strength as
it prevents dislocation movement.
Motion of a dislocation
as it encounters a GB

2. Grain Refinement
• Difficult for a dislocation to pass through two different grain orientation (need to
change direction at the grain boundary).
• Atomic disorder within a grain boundary region contributes to the discontinuity of
slip planes from one grain to another.
• Fine grain materials are harder due to the higher number of grain boundaries.
• Grain boundary built up from disordered atoms
Hall-Petch relation:
− /
= +
• =Yiled stress (stensile strenght)
• =‚Friction stress’ or resistance to the dislocation’s movement
• k=‚locking parameter’ or hardening contribution from grain boundary
• D=grain diameter

3. Precipitate Hardening
• Two-phase dispersoids impede dislocation motion.
 Precipitate hardening is a very important mechanism used in ALPHA® new alloys.
Controlled precipitation of
α-phase within β-grains Obstacles to
hardens the metals dislocation slip
Particles should
be strong enough
to not be sheared
by dislocation

The Process:
• A composition that can be precipitation hardened
contains two phases at room temperature, but can
be heated to a temperature that dissolves the
second phase.
• Solution treatment, in which the alloy is heated to a
temperature above the solvus line into the alpha
phase and held for a period sufficient to dissolve
the beta phase.
• Quenching to room temperature to create a
supersaturated solid solution
• Precipitation Treatment; alloy is heated to a
temperature below Ts to cause precipitation of fine
particles of beta phase.
• With increasing time, the strength or hardness increases, reaches a maximum, and finally
decreases.
• This reduction in strength and hardness that occurs after long time periods is known as
overaging.
• Diagram shows strength & ductility as a function of the logarithm of aging time at constant
temperature during the precipitation heat treatment.

Graphical Summary of Vacancies, Precipitates and Solid Solution

4. Dispersion strengthening
• Dispersoid can not be dissolved => high temperature strengthening.
• Due to incoherency particle cuttung can not occur.
• The homgenous distribution of particles is difficult.
• Coherency occur in PS, but not in DS.
• DS stable at al temperature, PS isn’t it.
• Time factor isn’t important for DS, but
important for PS.
• Any alloy can made in case of DS
• Chemical stability of DS is higher than PS.
• PS-isotropic, DS-anisotropic

5. Diffusion Modifiers
Short term baking Long term baking >100

Initial After soldering >100 Celsius Celsius
•When Cu and Sn inter-diffuse, IMCs form (Cu6Sn5 near the Sn and Cu3Sn near the Cu) (Cu6Sn5 +
9Cu -> 5 Cu3Sn)
•Cu diffusion via Cu/Cu3Sn interface to Cu3Sn is slower than Cu diffusion from Cu3Sn to Cu6Sn5 it
is not corrected with the revers diffusion of Sn from Cu6Sn5 through Cu6Sn5/Cu3Sn interface.
•Unequal Cu-Sn inter-diffusion through interface, leave atomic-level vacancies on the copper side
•These vacancies coalesce into the Kirkendall voids within the IMC at the Cu-Sn interface

5. Diffusion Modifiers
• The growth of interfacial IMC and interfacial voids can be controlled through
addition of diffusion modifiers to the solder.
 The choice of which alloying element(s) to add depends on its relation with
the alloy system and the resulting properties.
6. SAC alloys
Projected Liquidus of Sn-Ag-Cu system
The Sn rich corner

6. SAC alloys
•Hardness of the alloy increasing by the Ag%

•Increasing of Ag% Ag3Sn and Cu6Sn5 quantity will be increased in the β-Sn
•Grain structure will be finer, less β-Sn
• volume % of Cu6Sn5 IM is bigger than Ag3Sn IM @ same Ag% or Cu%
•Hardness of Cu6Sn5 IM is bigger (~4,5GPa) than phase Ag3Sn IM (~1,5GPa)
•Mechanical strength and fatigue resistance will be increased
•Strenghtening effect of copper is higher than Ag
6. SAC alloys
SAC 205 SAC 305
SAC 405 SAC 405

•Optical images (DF: Dark field & BR: Bright Field) with different Ag%
6. SAC alloys
SAC 205 SAC 305
SAC 405
•SEM images with different Ag%
6. SAC alloys Sn-Ag-Cu Phase Diagram
• Eutectic Sn-3.73Ag-0.85Cu, 216oC MP

(Ag3Sn+Cu6Sn5+(Sn))
• SAC305 near eutectic:

SAC405
– Solidus: 217oC
Eutectic
– Liquidus: 220oC
SAC305
– Solidus: 217oC
– Liquidus: 224oC

6. SAC305 alloy
Bulk Alloy Solder Joint
Ag3Sn
Cu6Sn5
Ag3Sn
Sn
SAC405
Cu6Sn5
Eutectic (Ag3Sn+Cu6Sn5+Sn) HT Storage 150oC
Cu 1000 hrs
• Intermetallics (IMCs) on the solder joint interface depend on surface finish.
• IMCs are brittle and may acts as stress concentrators.
• Ag3Sn needles are examples of stress concentrators.

7. SACX alloys Sn-Ag-Cu Phase Diagram
• Eutectic Sn-3.73Ag-0.85Cu, 216oC MP.
• SACX0307 near eutectic:

– Solidus: 217oC
– Liquidus: 228oC
Eutectic
• SACX0807 near eutectic:
– Solidus: 217oC
– Liquidus: 226oC SACX0807
SACX0307

7. SACX0307 alloys
Bulk Alloy Solder Joint
Cu6Sn5
Sn
Cu6Sn5
Ag3Sn+Cu6Sn5+Sn Cu
• Drastic reduction in Ag3Sn; needles are not observed.

• Improved interfacial IMC control results in higher drop shock performance.
• Ni & BiSACX Plus

8. SnCx Plus 07 alloy Sn-Ag-Cu Phase Diagram
• Eutectic Sn-0.89Cu, 227oC MP.
LCu6Sn5 +(Sn)
• SnCX Plus 07 near eutectic:

– Solidus: 227oC
– Liquidus: 229oC
• Ni blocked allotrop phase change from η-

Cu6Sn5 to η’-Cu6Sn5@186 °C η- Cu6Sn5
hexagonal SnCX Plus 07
• The allotrop phase change means η’- Cu6Sn5 monoclinic

increases in volume ~+2,15vol%

8. SnCx Plus 07 alloy
Bulk SnCx Plus 07 Sn99,3Cu0,7 Sn100C
Microstructure refinement
• Alloying micro-additions refine SnCX Plus 07 alloy microstructure.
• Refined microstructures are generally desirable, but are not enough to indicate higher strength.
• E.g.: All three above alloys have identical tensile strength
9. Innolot alloy Sn-Ag-Cu Phase Diagram
LAg3Sn+Cu6Sn5+(Sn)

– Solidus: 217oC SAC387
Eutectic
– Liquidus: 219oC
• Innolot: Sn-3.8Ag-0.7Cu-3.0Bi-1.5Sb-0.175Ni
– Solidus: 212oC
– Liquidus: 220oC

9. Innolot alloy
Effect of Bi, Ni and Sb addition on the Melting Point.

9. Innolot alloy Bulk Alloy Solder Joint
Cu
Ag3Sn Cu6Sn5
Cu6Sn5
Cu6Sn5
Cu
• Ag3Sn and Cu6Sn5 intermetallics dispersed in the metal matrix.
• On the solder joint, Cu6Sn5 intermetallics are also formed near to the IMC interfacial
layer.

10. MaxRel Plus Sn-Ag-Cu Phase Diagram
LAg3Sn+Cu6Sn5+(Sn)

– Solidus: 217oC SAC387
Eutectic
– Liquidus: 219oC
• MaxRel Plus: Antimony free Innolot

Sn-3.85Ag-0.7Cu-3.05Bi-0.105Ni-X
– Solidus: 211oC
– Liquidus: 216oC

10. MaxRel Plus AlloyBulk Alloy Solder Joint
Cu6Sn5
Cu6Sn5
Ag3Sn
Cu6Sn5
• Ag3Sn dispersed in the matrix. Average size of needles is smaller.

• IMC precipitates along the grain boundaries, which contributes to improve its creep strength.

11. Low Melting Point Alloys

Projected Liquidus of Sn-Bi-Ag system
The Bi rich part

Sn-Bi Phase Diagram
• Eutectic Sn-58Bi, MP. 138oC
• Near Eutectic Sn-57.6Bi-0.4Ag: liquidus
– Solidus: 137.2oC
Low Temp Solders
– Liquidus: 141.7oC
• SBX02 :
138oC
– Solidus: 137.9oC Eutectic
– Liquidus: 142.5oC solidus
• HRL1 :
– Solidus: 138oC
– Liquidus: 151.1oC

Sn42-Bi58 Sn42-Bi57.6-Ag0.4 SBX02 SAC305
HRL1
• Sn42-Bi58 eutectic lamellar microstructure. Bi-rich phase (white).

• Upon Ag or X addition the continuity of the brittle Bi phase is intercalated with larger areas of the
ductile Sn phase (SBX02 & HRL1)
• Even diffusion at BGA ball and copper pad.

TESTING AND EVALUATION
METHODS OF ALLOYS
TESTING OR EVALUATION METHOD OF ALLOYS
1. Mechanical Properties – Tensile Test
Specimen Tested
Diameter (D) Gage Length Shoulder

(L) radius (R)
4mm 16mm 3mm

• Stress
• Strain
• Ultimate Strength/Tensile Strength
• Yield Strength
• Young’s / Elastic Modulus
• Elongation

Deformations
• Elastic
• Plastic (movement of dislocations)

1. Mechanical Properties – Creep Test
Specimen Tested: ASTM E8

Creep:
!"#$%#
• Condition: Homologous Temperature = &' !"#$%#
> 0.5
• Occur: when a metal is subjected to a constant tensile load at an elevated temperature, time-dependent
increase in length.
• Primary creep: a period of transient creep. The
creep resistance of the material increases due to
material deformation. Predominate at low
temperature test such as in the creep of lead at RT.
• Secondary creep provides a nearly constant creep
rate. The average value of the creep rate during
this period is called the minimum creep rate.
• Tertiary creep shows a rapid increase in the creep
rate due to effectively reduced cross-sectional area
of the specimen.

Creep / Stress Rupture Test vs Creep Test Rupture Time of Sn-Ag3.5
Creep Test Rupture Test

Load Low High
Creep Rate Minimum High
Test Period 2000-10000 <1000
Total Strain 0.5% 50%
Strain Gauge More Precise Simple

1. Mechanical Properties – Others
• Shear Strength
• Compressive Properties:
• Young’s Modulus
• Yield Strength
• Hardness

1. Impact & Vibration Tests – Drop Shock Test
LANSMONT HC18 • JESD22-B111 standard.
Test Conditions • Condition B (1500 Gs, 0.5 millisec
duration, half-sine pulse).
1500g, 0.5 msec
Alpha Drop Test Wehicle
• CTBGA84
• Daisy Chain
1. Impact & Vibration Tests – Impact Bending Test
Dinamic Bending Test: Cyclic Bending Test:

• Board strain @ 1st • 1Hz / 2mm
fail.
• Dye & Pry

2. Impact & Vibration Tests – Vibration Test
Types: • Variable Frequency

• Single- or multi axes • Variable Amplitude
• Electromechanical or
hidraulic movement • Based on the
• Various sizes targeted application

3. Wettability Solderability – Wetting Balance Test
A B C D E F
Alpha R&D
3. Wettability Solderability – Copper Dissolution Test
Time required for 50μm

copper wire to dissolve
in 260ºC molten alloy
bath.

4. Thermal Analysis – DSC
DSC can measure:
• Glass transitions
• Melting and boiling points
• Crystallisation time and temperature
• Percent crystallinity
• Heats of fusion and reactions
• Specific heat capacity
• Oxidative/thermal stability Heat Flux DSC
• Reaction kinetics
• Purity
Heat Capacity:
/012 6 Power Compensated DSC
Heating Rate = =
3450 2
89:;9<=<><9 ?@A<9=B9 C8 H
Heating 7120 = = Heat Capacity = = IJ
8?:9 D C8

4. Thermal Analysis – DSC
DSC Graphs

4. Thermal Analysis – CTE
DSC CAN MEASURE:
• With low constant load:
• Linear thermal expansion evaluation
• Change of volume
• Phase transformation
• Sinter process evaluation
• Softening point determination
• Transformation points
• Swelling behavior
• Tension
• With increased constant load:

• Penetration
• Transition and comparison tests
• 3 point bending test

4. Thermal Analysis – Thermal Conductivity
Properties Measured
• Specific Heat
• Thermal Diffusivity
• Thermal Conductivity
Test Conditions
• RT to 300oC
Samples
• Solid or liquid
Graphite coated sample
PQ
-α = 0.1388 ∗ -T 3 = α 3 ∗ IJU3V ∗ ρU3V
DR Q
/ X
• α – Thermal diffusivity of the sample • k – Thermal conductivity of the sample [ [
Y\ Y∗Z
• d – Thickness of the sample • d – Thermal diffusivity of the sample [ [
] `
• S/- = time at 50% of the temperature increase • ^_- = specific heat capacity of the sample [ [
\∗Z
\
• ρ – Density of the sample [ a[
Y

CAN BE FULFILLED EVERYTING FROM THE ABOVE SAME TIME?

D E A M
R
CAN BE FULFILLED EVERYTING FROM THE ABOVE SAME TIME?
LOW SILVER SOLUTIONS
1. REDUCED MATERIAL COST – LOW SILVER 1 OF 5
Adobe Acrobat
Document

HIGH RELIABILITY SOLUTIONS
2. LONG TERM RELIABILITY – INNOLOT/MAXREL 1 FROM 5
Introduction
• German Consortium based development
• Defined requirements and then development of a lead free alloy for high reliability
applications
• Defining the final alloy composition
• Creep performance cp. existing alloys
• Microstructure
• Process performance (wetting or solderability)
• Thermal Cycling
• Vibration

2. LONG TERM RELIABILITY – INNOLOT/MAXREL 1 OF 5
Project Background
• Future requirements Automotive Electronic Modules
to be located closer to the point of use, reduced wiring
• Higher temperatures / vibration levels
• Available Materials in 2000
SnPb37, SnPb36Ag2 Limited HT resistance

Contains Pb
SnAg3.5, SnCu0.7 High Processing T

Limited rel in High T
Conditions
SAC (Ag3-4, Cu0.5-0.9) Limited rel in High T

Conditions

Partners
• Leader • Suppliers
• Siemens ZT Berlin • Alpha (MaxRel, Innolot)
• Multicore (90iSC)
• Users • Stannol >>> Heraeus (Innolot)
• Siemens • Seho
• Bosch • Infineon
• Motorola • TI
• Epcos
• Microtech
• Academic Partners
• Ruwel
• Univ. of Bayreuth
• Fraunhofer institute

Alloy Requirements
• To conform with lead-free legislature (RoHS etc)
– <0.1% Pb by weight
• 150°C operating temperature
• Survive 1000 cycles -55°C to 150°C
• Superior Thermal Cycling and Vibration Resistance vs. SAC
• Reflow peak < 230°C
• No exotic or toxic elements

Alloying Element Choices
$
$
$
Choice of Suitable Alloying Elements
Bi ☺ Solid solution hardening

☺ Lowers Melting Temperature
Ni ☺ Dispersion hardening by
intermetallic phase formation
Sb ☺ Solid solution hardening

 Raises melting temperature

True Stress (Nmm2)
Mechanical Effect of Single Element Additions
True Strain (%)

Determining Maximum Operating Temperature
σK New Alloy ≥ σK (SnPb37, 80 °C) ≥ σK (SAC387, 120 °C)

Alloy Optimisation
180
Maximum operating temperature [°°C]
Target Quadrant
160
Creep Resistance
140
120
100
80
180 200 220 240 260 280
Optimum soldering temperature [°°C]

Then Current State - SnPb
180
160
Creep Resistance
140
120
100
SnPb
80
180 200 220 240 260 280

SnPb & SAC387
180
160
Creep Resistance
140
120 SAC387
100
SnPb
80
180 200 220 240 260 280

2. LONG TERM RELIABILITY – INNOLOT/MAXREL 1 OF M 5
SAC387 + Single Element Additions
180
160
Creep Resistance
5.0%
140
8% 3.75%
6% 2.5%
4%
120 SAC387
100
0.2%
SnPb
80
180 200 220 240 260 280

2. LONG TERM RELIABILITY – INNOLOT/MAXREL 1 OF M 5
SAC387+Bi+Sb+Cu = InnoLot
180
SAC+Bi+Sb+Ni
160
Creep Resistance
5.0%
140
8% 3.75%
6% 2.5%
4%
120 SAC387
100
0.2%
SnPb
80
180 200 220 240 260 280

InnoLot Composition
Sn 90.95
Ag 3.8
Cu 0.7
Bi 3.0
Sb 1.4
Ni 0.15
Creep Performance of InnoLot vs. Benchmarks
25°C
150°C

Creep Performance of InnoLot vs. Benchmarks
Test Temperature 100°C

InnoLot Physical Comparison with SAC

Allo y Co mpo sitio n
Attribute units Test Metho d
Inno lo t S AC3 0 5
S o lidus ℃ 206 217 DSC

Liquidus ℃ 218 220
Density - 7.45 7.4
Tensile strength Mpa 83 44 Strain rate of 10^-2 per sec
Y ield strenth Mpa 60 38 To ASTM E8
Elo ngatio n % 19 48.4
-3
RT, strain rate = 10
Y o ung' s mo dulus Gpa 26 50 To ASTM E8
S pecific heat J/g.K 0.23

Heat co nductiv ity W /m.K 55.19 63.2
Thermal
-6
ex pansio n 2 0 ~1 0 0 ℃ 10 /℃ 23.9 21.6 Range of 0 to 100℃
co efficient
Hardness HV 32 16

Microstructure SAC387 Alloy
Sn Matrix
Ag3Sn IMC
Cu6Sn5 IMC

Microstructure InnoLot (SAC387+Sb+Bi+Ni)
(Cu,Ni6)Sn5 IMC Ag3Sn IMC
Sn Matrix with Sb, Bi

Reduced Reflow Profile Requirement
Melting range from 206 to 218°

°C
Alloy Performance Wetting
• Wetting balance testing on Cu

OSP PCB’s
– New Cu OSP Coupons
– Aged Cu OSP Coupons
– Air or N2 Atmosphere
– Constant flux type
– Varying temperature
Wetting Behaviour Characterisation
Wetting force (F max) is

shown by position “D”
Time to zero wetting force

(T zero) is shown as point
“C”.

Wetting Test Results

Cu OSP PCB Alloy Temperature
Alloy Atmosphere 225 235 260
T0 Tmax T0 Tmax T0 Tmax
InnoLot Air 5.42 37 1.56 64 1.33 76
Innolot N2 3.21 48 1.31 77 0.99 87
SAC387 Air 7.85 20 1.44 62 1.12 65
SAC387 N2 5.77 34 1.21 75 0.82 81
Cu OSP 4Hrs/155°° Alloy Temperature

Alloy Atmosphere 225 235 260
T0 Tmax T0 Tmax T0 Tmax
InnoLot Air Abort / 4.54 21 3.01 46
Innolot N2 Abort / 3.21 34 2.29 59
Wetting Test Results

Wetting Test Results Cross Print Test

Wetting Results Real World 230-245°C

Thermal Cycling Performance

First failures on SAC at
750 cycles.
First failures on
InnoLot at 1500 Cycles

Shear Testing Of Capacitors After Thermal Cycling

Force to Failure (N)
Shows that Innolot

100 at -40C/+150°°C is
equivalent to
80 SAC387 at -
SAC 387 InnoLot 40/+125°°C
60
40
20
0
000 000 000 000 000 000
x1 x2 x1 x1 x2 x1
25 25 50 /12
5
/12
5 50
-40
/1
-40
/1
-40
/1 40 40 0/1
C C C ot - ot - t -4
SA SA SA noL noL nol o
In In In
Condition

Shear Testing at Elevated Temperature After Thermal Cycling

45
Shows effects of
40
alloying elements at
elevated temperature
Shaer Strength at 125C
35
30
25 SnPb
SAC387
20
InnoLot
15
10
0
1 2 3
0 Cycles 250 Cycles 500 Cycles 4 750 Cycles5 1000
Cycles Numbe of Cycles -40/+125C

Vibration Testing vs. SAC 387

0603 (5.3mg each) Failure characteristics under vibration
Test i ii iii iiia iv v vi vii viii ix x
V.force 2g 5g 10g 15g 15g 15g 15g 15g 20g 20g 30g
Time (min) 3 3 3 3 15 15 45 60 15 60 60
1st SAC387 Failure 1st Innolot Failure

Current InnoLot Automotive Areas Of Use
Power train/Chassis
(Under hood)
Increased Stress due to

Higher Operating
Temperatures
Exterior Lighting
Increased Utilisation of LED

and HID

Oportunities to use InnoLot in Automotive Electronics

Sensors in Automotive Electronics

2. LONG TERM RELIABILITY – MAXREL PLUS 1 OF 5
Creep Behavior
Maxrel Plus:
• Higher creep strength than Innolot (20%) and SAC305 (140%).
• Higher creep elongation than Innolot (15%) and SAC305 (200%).

Thermal Profile: -40oC (30min) ↔ +150oC

(30min), 2000 cycles Temperature Cycling Test after 2000 Cycles
Type 1 (Time) Censored at 2000 - LSXY Estimates
-40C to +150C, 30min Dwell (Weibull)
40% Maxrel Plus BGAs did not fail after 99
Variable
2000 cycles vs. 22% Innolot vs. 0% SAC305. 90 SAC305
Innolot
70 Maxrel Plus
Maxrel Plus characteristic life is 20-22% 50 Table of Statistics
Failures, %
Shape Scale Corr F C
longer than Innolot and SAC305. 30
7.50456 1591.09 0.896 31 0
20
2.99824 1556.02 0.979 30 2
3.18091 1906.06 0.912 22 10
SAC305 Innolot Maxrel
 Plus 10
5
3
2
1
100 1000
Number of Cycles
Crack initiation (onset): Maxrel Plus and Innolot start at 1000 cycles vs. SAC305 at 500 cycles.

Effect of Thermal Cycling on Solder Joint Degradation
• Maxrel Plus shear force after 2000 cycles is equivalent to Innolot

and 97% higher than SAC305.

Effect of Thermal Cycling on Solder Joint Degradation
 Vibration Test as per ICE

60068-2-64 standard Part 2-64
for under-the-hood
applications.
• Failure analysis performed on
chip resistors #1206.
• Cracks extension: Best,
Maxrel Plus, Innolot,
SAC305, Worst.

Effect of Thermal Cycling on IMC Growth
Cu3Sn IMC Growth during HTS
SAC405 MAXREL Plus
4
3.5
IMC thickness (um)

3
2.5
2
1.5
1
0.5
0
0 500 1000 1500
HTS (Hrs)
• Reduction in the growth of Cu3Sn IMC reduce probability of brittle failure.

• Maxrel Plus has lower growth of brittle IMC.
2. LONG TERM RELIABILITY – MAXREL PLUS 1 FROM 5
• IMC measurements performed after

2000 cycles.
• IMC thickness: SAC405 > Maxrel Plus.
• Maxrel Plus superior thermal cycling
performance is supported by its smaller
IMC growth on both PCB and wafer sides.
IMC
IMC Thickness
Alloy Thickness
µm)
@Wafer (µ
@PCB (µµm)
SAC405 3.15 (±0.96) 3.54 (±1.08)
Maxrel
1.97 (±0.44) 2.58 (±0.50)
Plus
3. REDUCED COSTS–LOW MELTING POINT ALLOYS 4 OF 5

LOW MP SOLUTIONS
EUTECTIC SN-BI SOLDERS
3. REDUCED COSTS–LOW MP ALLOYS 4 OF 5
Applications ~215oC
183oC
SAC Alloys
Sn37Pb
138oC
Sn58Bi
Next Generation Low Temperature Alloys
How Mechanical Fatigue
Good? Shock Properties
Resistance
Low Temp. Eutectic Alloys  Bi and In are the most common

“green” low temperature metals
Bi26In17Sn (79oC) used in electronic assemblies.
Bi33In (109oC)  Sn-Bi alloys are preferred, as
Sn52In (118oC) compared to Sn-In, especially due
Sn58Bi (138oC) to their lower cost.
 Sn42Bi58 and Sn42Bi57.6Ag0.4 are
Melting Point (oC) the most commonly used alloys in
PCB assembly and other electronic
In  157 Pb  327.5 applications.
Sn  232 Ag  961
Bi  271 Cu  1084
Historical Sn-Bi Alloy Drawbacks Opportunities for Improvement

Brittleness Mechanical Strength
Poor thermal fatigue Thermal Cycling
Poor resistance to shock and Drop Shock Resistance
vibration Lower Cost

Thermodynamics of the Alloys: Sn-Bi Phase Diagram
http://www.metallurgy.nist.gov/phase/solder/bisn.html
liquidus
• Low temperature solder alloys
Low Temp Solders
– Lower reflow temperature
– SAC305 cost or lower
138oC
Eutectic • Eutectic Sn-58Bi
solidus Non-Eutectic • Non-eutectic Sn-Bi
• Bi forms solid solution with Sn

-20 (10min) ↔ +110oC (10min)

F. Hua et al., “Eutectic Sn-Bi as an alternative to Pb-free solder”,
Proceedings of IPC (1999).
Effect of Ag addition: -40 (30min) ↔ +125oC (30min)
• Improved thermal fatigue properties ALPHA® CVP-520 Solder Paste

Product Guide
• Higher and constant shear force up to 500 thermal cycles
4. REDUCED COSTS & HIGH REL.–LOW MP ALLOYS 4.5 OF 5
ALPHA®SBX02 SOLDER ALLOY

• Alpha® patented eutectic Sn-Bi alloy (SBX02) is capable of
delivering high levels of reliability performance at low soldering
temperatures.
• By means of various alloying additions, we improved drop shock
and thermal cycling performance of Sn-Bi alloys.
• SBX02 offers superior –
- Mechanical properties
- Thermal cycling
- Drop shock resistance
- Creep resistance

• Narrow solidus and liquidus temperature also helps in
Solder Joint Cosmetics
• CTE value provides info of how solder joint integrity will behave under
thermal fatigue
• Excessive mismatch between the solder and board/components CTE can
lead to poor thermal reliability due to premature joint failure
Increasing thermal conductivity, is a difficult approach, as it depends

not only on the conductivity of the added elements but also on how
they affect the alloy microstructure and the final conductive paths
Thermal properties approach:

Develop Low Temp Alloy with desired thermal properties
Melting CTE Thermal Conductivity

Alloy
Temp (oC) (ppm/oC) (W/mK)
Sn42-Bi58 138.1 16.7 21.6
Sn-Bi57.6-Ag0.4 137.4 17.1 24.5
A 138.6 16.7 25.6
B = SBX02 138.5 17.1 25.5
C 137.4 17.6 24.6
• Sn-Bi57.6-Ag0.4: 13% higher thermal conductivity than Sn42-Bi58 alloy.
• Alloy C: Has thermal conductivity similar to Sn-Bi57.6-Ag0.4.
• Alloys A and B: Thermal conductivity is ~18% higher than Sn42-Bi58.
In general, an alloy with higher modulus will be

stiffer, i.e., less flexible under tension and will have
lower elongation
Develop an ideal alloy composition which will

have high enough modulus with balanced ductility
and elongation
Mechanical properties approach:

Develop an alloy with an ideal composition that enables desired Tensile
Properties
UTS YS Elongation E#
Alloys (MPa)
(MPa) (%) (GPa)
Sn42Bi58 63.6 53.0 48.2 39.0
SnBi57.6Ag0.4 67.4 58.3 52.6 39.3
A 73.0 59.4 69.8 38.8
B 70.2 60.1 66.1 39.1
C 69.4 58.2 #Measured by ultrasonic39.0
51.8 method
Tensile test results

• Alloying additions in alloys A and B result in higher UTS and elongation.
• Only minor variations were observed in the Modulus (~39GPa).
• Creep rupture time evaluates creep strength

• Creep strain evaluates the creep elongation
Elongation and Resistance are often in opposite

sides of a balance, i.e., increase in strength quite
often results in loss of elongation
Creep properties approach: Develop an alloy with ideal composition and

ensure that the new alloys do not trade much of their elongation for strength
Alloys Creep Rupture Time (hrs) Creep Strain (%)
Sn42Bi57.6Ag0.4 14.0 99.3
A 20.5 112.9
B 25.4 107.4
C 18.8 110.6
150
Creep Results 125
Creep Strain (%)

100
• Remarkable improvement of creep strength 75
50
with the minor alloying additions. 25
0
0 5 10 15 20 25 30 35
• A, B and C, resulted in 46%, 81% and 34% Creep Rupture Time (hrs)
Sn42Bi57.6Ag0.4 Alloy A Alloy B Alloy C
higher creep rupture time, respectively. Creep Curves

Target higher strength, % elongation and impact energy, and
lower modulus.
Microstructure modification:
 Break continuity of large brittle Bi phase with minor
additions of alloying elements.
 Further, with minor additions contribute to precipitate
strengthening of the Sn-Bi matrix.
Continuous and thickness controlled intermetallics formation.
Drop shock approach: Engineer the alloy microstructure with inhibitors

and additives to improve the joint strength
Drop Shock of Sn-Bi58 Plus Alloys
Drop shock results
Weibull • Characteristic life higher than
99
Variable
SnBi58:
90 Alloy A
Alloy B
- SnBiAg0.4: 25%
70
50
Sn-Bi58 - Alloy A: 60%
Sn-Bi57.6-Ag0.4
Failures, %
30 Shape Scale N AD P
- Alloy B: 160%.
20 1.358 191.4 29 0.744 0.047
1.088 306.2 45 0.716 0.058
10
1.277 117.7 26 0.293 >0.250
5 1.040 147.2 30 1.241 <0.010 Would such remarkable
3
2 strengthening of Sn-Bi solder
1 joint affect thermal cycling
1 10 100 1000
Number of Drops
performance?

SBX02 Sn58Bi-0.5Ag-0.03Ni
Drop shock failure mode of Sn-Bi

• Cross sectional analysis of the BGAs after the drop shock test shows that the cracks
develop and propagate mostly through the Bi-rich areas (lighter color), near the
intermetallics region.
Target lower CTE, higher creep resistance/elongation.
Microstructure modification:
Use alloy additions that favor solid solution and
precipitate strengthening, and grain refinement.
IMC precipitated along the grain boundaries, which

contributes to improve its creep strength and controlled
intermetallics formation.
Thermal cycling approach: Engineer the alloy microstructure with alloying additions
to improve thermal reliability
Thermal Cycling Results
• TC Profile: -40oC (10min) to +125oC
(10min) for 1000 cycles.
• After 800 cycles, Sn-Bi57.6-Ag0.4 has eight
times more failures than SBX02.
• Cross-sections of the BGAs revealed that
cracks started:
-Before 200 cycles for Sn-Bi57.6-Ag0.4
-Between 500 and 800 cycles for SBX02.
Alloys 200 Cycles 500 Cycles 800 Cycles

Sn-Bi57.6-Ag0.4 17.7% 20.6% 23.5%
Alloy B = SBX02 0 2.8% 2.8%
CR1206 Shear Strength
9000
Sn57.6Bi0.4Ag Alloy B
8500
-8%
↓14%
Shear Force, gf
8000
7500 ↓8%
-14%
7000
6500
0 200 500 800 1000
Number of Cycles
Thermal Cycling Results
• At 800 cycles, Sn-Bi57.6-Ag0.4 has a 14% decrease in shear strength, whereas alloy B has an 8%
decrease.
• Cracks initiation on 0603 chip resistors: Between 800 and 1000 cycles for Sn-Bi57.6-Ag0.4. No
cracks were observed using alloy B up to 1000 cycles.
LOW MP SOLUTIONS
HRL1 SOLDER ALLOY
5. REDUCED COSTS & HIGH REL.–LOW MP ALLOYS 5 OF 5
138oC
M. Ribas et al., Development of Low-Temperature Drop Shock Resistant

Solder Alloys for Handheld Devices, EPTC 2013.
 Decreasing the Bi level increases the
ductility, but results in wide melting range
http://www.metallurgy.nist.gov/phase/solder/bisn.html and tendency to harden upon aging.
Low melting range enables lower temp soldering
Temperature HRL1
Solidus, oC 138.0
Liquidus, oC 151.1
ALPHA® HRL1 = AAS Patented Alloy

Melting Range
Alloy ID Solidus Temperature, oC Liquidus Temperature, oC
Sn-57.6Bi-0.4Ag 137.2 141.7

SBX02 137.9 142.5
HRL1 138.0 151.1
SAC305 217 220

Mechanical Properties
Sn-57.6Bi-
Property HRL1 SBX02 SAC305
0.4Ag
UTS, MPa 62.2 70.2 67.4 44.5
Yield Strength, MPa 37.5 60.1 58.3 39.6
Elongation, % 40.8 51.2 52.6 46.1
Elastic Modulus, GPa 41.4 39.1 39.3 49.8
Vickers Hardness (Hv 0.5) 20.2 19.0 NA 14.0
Creep Rupture Time @80oC (hrs) 19.6 25.4 14.0 *
 HRL1 Alloy has excellent mechanical properties
Re-flow profile

Solder Joint Appearance

UCSP98 10 mil QFPN208 100% BGA36 12 mil

HRL1 Cross-section (190oC Peak)
SAC305
HRL1

SAC305
HRL1

SAC305
HRL1
 HRL1 forms solder joint with SAC305 <190oC

 HRL1 + SAC305 ball collapse at 200oC

HRL1 Stand Off Height vs Re-flow Peak Temperature
169 µm
195 µm
225 µm
Peak Temp 180oC 190oC 200oC

 SAC305 + HRL1 complete collapse at 200oC
HRL1 Has Excellent Mechanical Shock Performance
Drop Shock Results
Weibull
99.9
99 Variable
Sn-57.6Bi0.4Ag
90
80 SBX02
70 HRL1
Drop Shock Results
Cumulative Failures, %
60
50 SAC305
40
30
20
Shape Ch.Life N AD P First failure
1 .040 1 47.2 30 1 .241 <0.01 0
10 1 .037 321 .9 45 1 .432 <0.01 0 Sn-57.6Bi-0.4Ag: 20 drops
5 1 .303 951 .2 45 0.447 >0.250
3 1 .435 874.6 85 0.573 0.1 47 SBX02: 20 drops
2
1 HRL1: 80 drops
SAC305: 88 drops
0.1
0.1 1 10 1 00 1 000 1 0000
Number of Drops

SAC305 T4: Example with High Performance
2nd Ball, left 2nd Ball, right
 Bulk failure @Component Side

HRL1 T4: Example with High Performance
2nd Ball, left 2nd Ball, right
 IMC failure @Component or PCB Side

Competitor Low Temp T4: Example with High Performance
Larger the melting range,

more “unusual” is the solder
joint behaviour during the
solidification.

HRL1 High Thermal Cycling Reliability
% Failures (-40oC ↔ +125oC TC profile)
Alloy
0- 250 TC 0-500 TC 0-750 TC 0-1000 TC 0-1500 TC 0-1750 TC
SBX02 0 0 0 0 6.7 22.2
HRL1 0 0 0 0 2.2 6.7
SAC305 0 0 0 0 2.2 4.4
Evaluated for CTBGA84
• Legend • First failure
– Green: No failures – HRL1: 1459 cycles
– Yellow: Failures <20% – SAC305: 1003 cycles
– Orange: Failures between 20 and 99%
THE IMPORTANCE OF USING THE
RIGHT CHEMISTRY
The Importance of Using Right Chemistry!
 Non-eutectic Sn-Bi alloys are more prone to soldering defects due to their wide
solidus-liquidus melting range.
 Defects such as head in pillow (HIP), non-wetting open (NOW) and hot tearing
can be completely eliminated using the right paste flux!
New tensioning Frame - ALPHA® TensoRED™


Tension Different Frame types

- Alpha Tetra and DEK VG:
Typical tension 30 - 35 N/cm
- VG “High” tension: 40 - 45 N/cm
- Alpha TensoRED: 40 - 45 N/cm
- High Tension frames intend to have less “snap back” or “stencil bounce”
improves release at critical area ratio’s
- Feedback from customers confirms that HT frames delivers sharper paste
deposits for fine features

Impact of high tension Alpha TensoRED frame on transfer efficiency
Paste volume measurements of fine features in a 100 um stencil
AR 0.8 AR 0.63

New tensioning Frame - ALPHA® tensoRED™
Impact of high tension Alpha TensoRED frame on transfer efficiency
Paste volume measurements of fine features in a 100 um stencil
AR 0.63 AR 0.50

• High tension improves Transfer efficiency for small features
• Test shown that TensoRED frame has the lowest variation in X and Y offset during printing, lowest float in
the stencil results in improved positional alignment on volume deposits
• Improved manual handling for operators, lower weight
• More even tension resulting in less paste smearing
• Reduced variation in volume deposits
• No need to replace your Alpha® Tetrabond foils or VG foils
• 3 year warranty
-TensoRED frame had 5.000 cycles without any problem
-Loading station had 50.000 cycles without any problem
• LCI-LCO compared with HT VG
-Investment cost
 Similar as VG HT system for 1 system, multiple frames would be lower in cost
-Maintenance cost
 Investment in repair kit 2.000 € for VG HT or send out frame for repair at min 200 -300 € per repair
 TensoRED is maintenance free if used correctly as demonstrated in the endurance test
• Currently available :
-2323/2422*/2329/2929 outside dimensions * 600 x 550 mm
-2323 centered full size 2929 and 2329 full size 2929
standard sizes 2323 -2422-2329-2929

Fixed sidebars to get to size 2929

Tension TensoRED frame 2323 centered full size 2929 foil 130 um

ALPHA® TensoRED™ Loading Station
By changing the position of the red corner blocks you

can use it for all frame sizes 2323-2422-2329-2929
ALPHA® TensoRED™ Loading Process

Latest developments- ALPHA® TensoRED™
• Add openings on frames with side bars to ease handling of frames

• VG compatibility – remove height difference
-Increase height inner edge profile with 0,5 mm A
-Reduce height outer edge profile and corner with 0,8 mm B
-Reduce length of comb with 3 mm so we can load latest VG foil C
A B
C
VG foil is the lowest point in

the printer
• Tool to improve loading of foils – if foils are un flat
-Push down corner blocks

• Tool to improve loading of foils – if foils are un flat
-Push down jig : press down the entire foil

• Loading/unloading foil with electrical screwdriver instead of manual handle

THANK YOU!
APPENDIX
PHYSICAL PROPERIES OF ALLOYS
Sn-Pb Solder Alloys
Physical Property Sn-37Pb Sn-36Pb-2Ag

Melting Point, oC# 183 179-182
Density, g/cm3 8.41 -
Thermal Conductivity, W/mK 50 -
Electrical Resistivity, µΩ.cm 14.5 -
CTE (30-100 oC), 10-6/oC 24 -
Young’s Modulus, GPa* 15.7 18
Yield Strength, MPa* 27.2 43.3
Tensile Strength, MPa* 30.6 47.6
Elongation, %* 48 31
Creep Strength (MPa) for life of 4.5 27
1,000h at 100oC #
Sources: #Smithells Metals Reference Book, *Lead Free Solder Project, National Center for Manufacturing Sciences, 1998.

SAC305 Solder Alloy
Physical Property* SAC305
Density, g/cm3 7.43
Thermal Conductivity, W/mK 64.0
Electrical Resistivity, µΩ.cm 11.80
CTE (30-100oC), 10-6/oC 22.3
CTE (100-180oC), 10-6/oC 23.7
Hardness, HV 0.2 15.0
Young’s Modulus, GPa# 27.8
Yield Strength, MPa 44.5
Tensile Strength, MPa 50.1
Elongation, % 51.6
Creep Rupture Time, h (125oC, 200N) 66.20
Creep Elongation, % (125oC, 200N) 55.30
*Data obtained by the Metals Group at Alpha India Research Centre.

#Obtained from tensile test. Should not be compared with ultrasonic measurements.

SACX Plus Alloys
Physical Property* SACX Plus 0307 SACX Plus 0807
Density, g/cm3 7.33 7.35
Thermal Conductivity, W/mK 65 63.9
Electrical Resistivity, µΩ.cm 11.98 11.99
CTE (20-100oC), 10-6/oC 20 21.5
CTE (100-180oC), 10-6/oC 20.2 21.5
Hardness, HV 2.5 12.1 14.7
Young’s Modulus, GPa# 48.92 49.43
Yield Strength, MPa 28.9 30.2
Tensile Strength, MPa 36.5 38.4
Elongation, % 37.4 38.7
Creep Rupture Time, h (125oC, 200N) 7.8 6.0
Creep Elongation, % (125oC, 200N) 24.4 29.0

#Ultrasonic measurements.

SnCX Plus 07 Solder Alloy
Physical Property* SnCX Plus 07 Sn0.7Cu

Thermal Conductivity, W/mK 57.0 60.5
Electrical Resistivity, µΩ.cm
CTE (30-100oC), 10-6/oC 23.8 20.5
CTE (100-180oC), 10-6/oC 24.3 26.0
Hardness, HV 0.2 9.4 10.0

SnCX Plus 07 Solder Alloy
Physical Property* SnCX Plus 07 Sn0.7Cu

As Cast Aged As Cast Aged
Young’s Modulus, GPa# 27.0 26.1 14.1 6.3
Yield Strength, MPa 33.4 25.7 27.6 17.7

Tensile Strength, MPa 42.0 30.1 33.8 22.0
Tensile Strain, % 7.6 6.6 6.4 7.6

Elongation, % 33.1 53.9 33.5 62.1


Maxrel Plus and Innolot Solder Alloys
Physical Property* Maxrel Plus Innolot
Thermal Conductivity, W/mK 59.2 55.2
Electrical Resistivity, µΩ.cm 14.2 16.4
CTE (30-100oC), 10-6/oC 23.8 22.5
Hardness, HV 1 28 31
Young’s Modulus, GPa# 49.7 46.5
Yield Strength, MPa 63.4 60.2
Tensile Strength, MPa 83.0 83.0
Elongation, % 18.2 17.8
Max Creep Rate (%/h) 6.08 7.16


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2018 Seminar HU

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Soldering Seminar

19-21. February 2018. Dunaharaszti

©2016 Alpha Assembly Solutions – Confidential

INTRODUCTION PHYSICAL METALLURGY

EFFECT OF ADDITIVES ON SN-BASED ALLOYS

TESTING AND EVALUATION METHODS OF ALLOY

TRENDS IN THE INDUSTRY

TRENDS IN THE INDUSTRY – LOW SILVER SOLUTIONS

TRENDS IN THE INDUSTRY – HIGH RELIABILITY SOLUTIONS

TRENDS IN THE INDUSTRY – LOW MP SOLUTIONS EUTECTIC

TRENDS IN THE INDUSTRY – LOW MP HRL1 ALLOY

THE IMPORTANCE OF USING THE RIGHT CHEMISTRY

NEW SOLDER PASTES

NEW SOLDER WIRES

APPENDIX: PHYSICAL PROPERTIES OF ALLOYS

©2016 Alpha Assembly Solutions – Confidential

Alpha IP Portfolio is Focused on Key Customer/Market Needs

Alpha Assembly Solutions™ Publications

©2016 Alpha Assembly Solutions – Confidential

• Diffusion occurs in the formation of alloy phases.

©2016 Alpha Assembly Solutions – Confidential

©2016 Alpha Assembly Solutions – Confidential

Hume Rothery’s Rule

• Strengthening Mechanisms Depends On,

©2016 Alpha Assembly Solutions – Confidential

How this parameter affects Strengthening Mechanisms.

• The nature of distortion produced by solute atoms are also important.

©2016 Alpha Assembly Solutions – Confidential

Grain Refinement / Precipitate

©2016 Alpha Assembly Solutions – Confidential

Properties of different elements

 Example: Bi solute atoms in Sn lattice result in higher strength.

©2016 Alpha Assembly Solutions – Confidential

©2016 Alpha Assembly Solutions – Confidential

©2016 Alpha Assembly Solutions – Confidential

©2016 Alpha Assembly Solutions – Confidential

©2016 Alpha Assembly Solutions – Confidential

©2016 Alpha Assembly Solutions – Confidential

Short term baking Long term baking >100

©2016 Alpha Assembly Solutions – Confidential

The Sn rich corner

©2016 Alpha Assembly Solutions – Confidential

•Hardness of the alloy increasing by the Ag%

SAC 205 SAC 305

SAC 405 SAC 405

SAC 205 SAC 305

• Eutectic Sn-3.73Ag-0.85Cu, 216oC MP

• SAC305 near eutectic:

©2016 Alpha Assembly Solutions – Confidential

©2016 Alpha Assembly Solutions – Confidential

• SACX0307 near eutectic:

©2016 Alpha Assembly Solutions – Confidential

• Drastic reduction in Ag3Sn; needles are not observed.

©2016 Alpha Assembly Solutions – Confidential

• SnCX Plus 07 near eutectic:

• Ni blocked allotrop phase change from η-

• The allotrop phase change means η’- Cu6Sn5 monoclinic

©2016 Alpha Assembly Solutions – Confidential

• SAC387 near eutectic:

©2016 Alpha Assembly Solutions – Confidential

©2016 Alpha Assembly Solutions – Confidential

©2016 Alpha Assembly Solutions – Confidential

• SAC387 near eutectic:

• MaxRel Plus: Antimony free Innolot