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1FEATURES DESCRIPTION
2(Typical Unless Otherwise Stated) The LMC6084 is a precision quad low offset voltage
operational amplifier, capable of single supply
• Low Offset Voltage: 150 μV operation. Performance characteristics include ultra
• Operates from 4.5V to 15V Single Supply low input bias current, high voltage gain, rail-to-rail
• Ultra Low Input Bias Current: 10 fA output swing, and an input common mode voltage
range that includes ground. These features, plus its
• Output Swing to within 20 mV of Supply Rail,
low offset voltage, make the LMC6084 ideally suited
100k Load for precision circuit applications.
• Input Common-Mode Range Includes V−
Other applications using the LMC6084 include
• High Voltage Gain: 130 dB precision full-wave rectifiers, integrators, references,
• Improved Latchup Immunity and sample-and-hold circuits.
This device is built with National's advanced Double-
APPLICATIONS Poly Silicon-Gate CMOS process.
• Instrumentation Amplifier
For designs with more critical power demands, see
• Photodiode and Infrared Detector Preamplifier the LMC6064 precision quad micropower operational
• Transducer Amplifiers amplifier.
• Medical Instrumentation For a single or dual operational amplifier with similar
• D/A Converter features, see the LMC6081 or LMC6082 respectively.
• Charge Amplifier for Piezoelectric Transducers PATENT PENDING
Connection Diagram
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2000–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LMC6084
SNOS657D – AUGUST 2000 – REVISED MARCH 2013 www.ti.com
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test
conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) Do not connect output to V+, when V+ is greater than 13V or reliability will be adversely affected.
(4) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30 mA over long term may adversely
affect reliability.
(5) Human body model, 1.5 kΩ in series with 100 pF.
(6) The maximum power dissipation is a function of TJ(Max), θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(Max) − TA) /θJA.
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test
conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed.
(2) All numbers apply for packages soldered directly into a PC board.
(3) For operating at elevated temperatures the device must be derated based on the thermal resistance θJA with PD = (TJ − TA)/θJA. All
numbers apply for packages soldered directly into a PC board.
DC Electrical Characteristics
Unless otherwise specified, all limits guaranteed for TJ = 25°C. Boldface limits apply at the temperature extremes. V+ = 5V,
V− = 0V, VCM = 1.5V, VO = 2.5V and RL > 1M unless otherwise specified.
LMC6084AM LMC6084AI LMC6084I
Symbol Parameter Conditions Typ (1) (2) (2)
Units
Limit Limit Limit (2)
VOS Input Offset Voltage 150 350 350 800 μV
1000 800 1300 Max
TCVOS Input Offset Voltage 1.0 μV/°C
Average Drift
IB Input Bias Current 0.010 pA
100 4 4 Max
IOS Input Offset Current 0.005 pA
100 2 2 Max
(3) V+ = 15V, VCM = 7.5V and RL connected to 7.5V. For Sourcing tests, 7.5V ≤ VO ≤ 11.5V. For Sinking tests, 2.5V ≤ VO ≤ 7.5V.
(4) Do not connect output to V+, when V+ is greater than 13V or reliability will be adversely affected.
Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LMC6084
LMC6084
SNOS657D – AUGUST 2000 – REVISED MARCH 2013 www.ti.com
AC Electrical Characteristics
Unless otherwise specified, all limits guaranteed for TJ = 25°C, Boldface limits apply at the temperature extremes. V+ = 5V,
V− = 0V, VCM = 1.5V, VO = 2.5V and RL > 1M unless otherwise specified.
LMC6084AM LMC6084AI LMC6084I
Symbol Parameter Conditions Typ (1) Units
Limit (2) Limit (2) Limit (2)
SR Slew Rate See (3) 1.5 0.8 0.8 0.8 V/μs
0.5 0.6 0.6 Min
GBW Gain-Bandwidth Product 1.3 MHz
φm Phase Margin 50 Deg
(4)
Amp-to-Amp Isolation See 140 dB
en Input-Referred Voltage Noise F = 1 kHz 22 nV/√Hz
in Input-Referred Current Noise F = 1 kHz 0.0002 pA/√Hz
T.H.D. Total Harmonic Distortion F = 10 kHz, AV = −10
RL = 2 kΩ, VO = 8 VPP 0.01 %
±5V Supply
Figure 3. Figure 4.
Distribution of LMC6084
Input Offset Voltage Input Bias Current
(TA = +125°C) vs Temperature
Figure 5. Figure 6.
Figure 7. Figure 8.
Stability Stability
vs vs
Capacitive Load, RL = 600Ω Capacitive Load RL = 1 MΩ
APPLICATIONS HINTS
AMPLIFIER TOPOLOGY
The LMC6084 incorporates a novel op-amp design topology that enables it to maintain rail-to-rail output swing
even when driving a large load. Instead of relying on a push-pull unity gain output buffer stage, the output stage
is taken directly from the internal integrator, which provides both low output impedance and large gain. Special
feed-forward compensation design techniques are incorporated to maintain stability over a wider range of
operating conditions than traditional micropower op-amps. These features make the LMC6084 both easier to
design with, and provide higher speed than products typically found in this ultra-low power class.
(1)
or (2)
R1 CIN ≤ R2 Cf (3)
Since it is often difficult to know the exact value of CIN, Cf can be experimentally adjusted so that the desired
pulse response is achieved. Refer to the LMC660 and LMC662 for a more detailed discussion on compensating
for input capacitance.
Figure 26. LMC6084 Noninverting Gain of 10 Amplifier, Compensated to Handle Capacitive Loads
In the circuit of Figure 26, R1 and C1 serve to counteract the loss of phase margin by feeding the high frequency
component of the output signal back to the amplifier's inverting input, thereby preserving phase margin in the
overall feedback loop.
Capacitive load driving capability is enhanced by using a pull up resistor to V+ Figure 27. Typically a pull up
resistor conducting 500 μA or more will significantly improve capacitive load responses. The value of the pull up
resistor must be determined based on the current sinking capability of the amplifier with respect to the desired
output swing. Open loop gain of the amplifier can also be affected by the pull up resistor (see Electrical
Characteristics).
Figure 27. Compensating for Large Capacitive Loads with a Pull Up Resistor
Inverting Amplifier
Non-Inverting Amplifier
Follower
The designer should be aware that when it is inappropriate to lay out a PC board for the sake of just a few
circuits, there is another technique which is even better than a guard ring on a PC board: Don't insert the
amplifier's input pin into the board at all, but bend it up in the air and use only air as an insulator. Air is an
excellent insulator. In this case you may have to forego some of the advantages of PC board construction, but
the advantages are sometimes well worth the effort of using point-to-point up-in-the-air wiring. See Figure 30.
Latchup
CMOS devices tend to be susceptible to latchup due to their internal parasitic SCR effects. The (I/O) input and
output pins look similar to the gate of the SCR. There is a minimum current required to trigger the SCR gate
lead. The LMC6084 is designed to withstand 100 mA surge current on the I/O pins. Some resistive method
should be used to isolate any capacitance from supplying excess current to the I/O pins. In addition, like an SCR,
there is a minimum holding current for any latchup mode. Limiting current to the supply pins will also inhibit
latchup susceptibility.
(Input pins are lifted out of PC board and soldered directly to components. All other pins connected to PC board).
REVISION HISTORY
www.ti.com 10-Dec-2020
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
LMC6084IMX/NOPB ACTIVE SOIC D 14 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LMC6084IM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Jan-2022
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
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Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
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TUBE
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