Green AP2501/AP2511

2.5A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH

Description Pin Assignments

The AP2501 and AP2511 are single channel current-limited
integrated high-side power switches optimized for Universal Serial (Top View) (Top
( Top View)
View )
Bus (USB) and other hot-swap applications. The family of devices
GND 1 8 NC
complies with USB standards and is available with both polarities of
Enable input. IN 2 7 OUT

The devices have fast short-circuit response time for improved IN 3 6 OUT

overall system robustness, and have integrated output discharge EN 4 5 FLG

function to ensure completely controlled discharging of the output
U-DFN3030-8 (Type E)
voltage capacitor. They provide a complete protection solution for SO-8
SO-8
applications subject to heavy capacitive loads and the prospect of
(Top View) (Top View)
short circuit, and offer reverse current blocking, over-current, over-
temperature and short-circuit protection, as well as controlled rise
time and under-voltage lockout functionality. A 7ms deglitch
capability on the open-drain Flag output prevents false over-current
reporting and does not require any external components.

All devices are available in SO-8, MSOP-8, MSOP-8EP, MSOP-8 /MSOP-8EP

U-DFN2020-6 Note: latter with exposed pad
U-DFN3030-8 (Type E) and U-DFN2020-6 packages.
(dotted line)

Features
 Single Channel Current-limited Power Switch Applications
 Output Discharge Function  LCD TVs & Monitors
 Fast Short-circuit Response Time: 2µs  Set-Top-Boxes, Residential Gateways
 3.7A Accurate Current Limiting (Typ)  Laptops, Desktops, Servers, e-Readers
 Reverse Current Blocking  Printers, Docking Stations, HUBs
 70mΩ On-resistance (Typ)
 Input Voltage Range: 2.7V to 5.5V
 Built-in Soft-start with 0.6ms Typical Rise Time
 Over-current and Thermal Protection
 Fault Report (FLG) with Blanking Time (7ms Typ)
 ESD Protection: 2kV HBM, 200V MM
 Active Low (AP2501) or Active High (AP2511) Enable
 Ambient Temperature Range: -40°C to +85°C
 SO-8, MSOP-8, MSOP-8EP, U-DFN3030-8 (Type E) and
U-DFN2020-6:
Available in “Green” Molding Compound (No Br, Sb)
 Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
 Halogen and Antimony Free. “Green” Device (Note 3)
 UL Recognized, File Number E322375
 IEC60950-1 CB Scheme Certified

Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.

AP2501/AP2511 1 of 18 May 2016

Document number: DS35577 Rev. 7 - 2 www.diodes.com © Diodes Incorporated
 AP2501/AP2511

Typical Applications Circuit

Enable Active High (AP2511)
Power Supply IN OUT Load
2.7V to 5.5V

10k 0.1µF 0.1µF

120µF

FLG

EN GND
ON

OFF

Available Options
Enable Pin Recommended Maximum Typical Current Limit
Part Number Channel Package
(EN) Continuous Load Current (A) (A)
SO-8
AP2501 1 Active Low MSOP-8
2.5A 3.7A MSOP-8EP
AP2511 1 Active High U-DFN3030-8 (Type E)
U-DFN2020-6

Pin Descriptions

Pin Number
Pin Name MSOP-8EP, Function
SO-8,
U-DFN3030-8 U-DFN2020-6
MSOP-8
(Type E)
GND 1 1 2 Ground
Voltage Input Pin. Connect a 0.1µF or larger ceramic capacitor from IN to
IN 2, 3 2, 3 1
GND as close as possible. (all IN pins must be tied together externally)
EN 4 4 3 Enable Input. Active low (AP2501) or active high (AP2511).
Over-temperature and over-current fault reporting with 7ms deglitch; active
FLG 5 5 4
low open-drain output. FLG is disabled for 7ms after turn-on.
OUT 6, 7 6, 7 5 Voltage Output Pin (all OUT pins must be tied together externally)
NC 8 8 6 No internal connection; recommend tie to OUT pins.
Exposed pad. It should be externally connected to GND and thermal mass for
Exposed Pad Exposed Pad Not Applicable Exposed Pad enhanced thermal impedance. It should not be used as electrical ground
conduction path.

AP2501/AP2511 2 of 18 May 2016

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 AP2501/AP2511

Functional Block Diagram

Current
IN Sense OUT

UVLO Discharge
Control
Current
EN Driver
Limit
FLG

Deglitch
Thermal
Sense

GND

Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)

Symbol Parameter Rating Unit

ESD HBM Human Body Model ESD Protection 2 kV
ESD MM Machine Model ESD Protection 200 V
VIN Input Voltage (Note 4) -0.3 to +6.5 V
VOUT Output Voltage (Note 4) -0.3 to 6.5 or VIN +0.3 V
VEN , VFLG Enable Voltage (Note 4) -0.3 to 6.5 or VIN +0.3 V
ILOAD Maximum Continuous Load Current Internal Limited A
TJMAX Maximum Junction Temperature +150 °C
TST Storage Temperature Range (Note 5) -65 to +150 °C
Notes: 4. All voltages referred to GND pin. Maximums are the lower of VIN + 0.3 and 6.5V.
5. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C).
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings
only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may
be affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and
transporting these devices.

Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)

Symbol Parameter Min Max Unit

VIN Input Voltage 2.7 5.5 V
IOUT Output Current 0 2.5 A
VIH High-Level Input Voltage on EN 2.0 VIN V

VIL Low-Level Input Voltage on EN 0 0.8 V

TA Operating Ambient Temperature (Note 6) -40 +85 °C

Note: 6. TA(MAX) = +70°C if VIN ≤ 4.1V and IOUT = 2.5A to keep device from going into thermal protection.

AP2501/AP2511 3 of 18 May 2016

Document number: DS35577 Rev. 7 - 2 www.diodes.com © Diodes Incorporated
 AP2501/AP2511

Electrical Characteristics (@ TA = +25°C, VIN = +5.0V, CIN = 0.1µF, CL = 1µF, unless otherwise specified.)

Symbol Parameter Conditions (Note 7) Min Typ Max Unit

VUVLO Input UVLO VIN Rising 1.6 2.0 2.4 V
ΔVUVLO Input UVLO Hysteresis VIN Decreasing – 50 – mV
ISHDN Input Shutdown Current Disabled, OUT = Open – 0.1 1.0 µA
IQ Input Quiescent Current Enabled, OUT = Open – 60 100 µA
ILEAK Input Leakage Current Disabled, OUT Grounded – 0.1 1.0 µA
IREV Reverse Leakage Current Disabled, VIN = 0V, VOUT = 5V, IREV at VIN – 0.01 1.00 µA
TA = +25oC – 70 78
VIN = 5V, IOUT = 1A
-40°C ≤ TA ≤ +85°C – – 105
RDS(ON) Switch On-resistance mΩ
TA = +25 Co
– 90 108
VIN = 3.3V, IOUT = 1A
-40°C ≤ TA ≤ +85°C – – 135
ILIMIT Over-Load Current Limit (Note 7) VIN = 5V, VOUT = 4.5V -40°C ≤ TA ≤ +85°C 2.8 3.7 4.6 A
ITRIG Current Limiting Trigger Threshold Output Current Slew Rate (<100A/s) – 3.7 – A
ISHORT Short-Circuit Current Limit Enabled into Short Circuit – 3.7 – A
tSHORT Short-Circuit Response Time VOUT = 0V to IOUT = ILIMIT (OUT Shorted to Ground) – 2 – µs
VIL EN Input Logic Low Voltage VIN = 2.7V to 5.5V – – 0.8 V
VIH EN Input Logic High Voltage VIN = 2.7V to 5.5V 2 – – V
ILEAK-EN EN Input Leakage VIN = 5V, VEN = 0V and 5.5V – 0.01 1.00 µA
ILEAK-O Output Leakage Current Disabled, VOUT = 0V – 0.5 1 µA
tD(ON) Output Turn-on Delay Time CL = 1µF, RLOAD = 5Ω – 0.1 – ms
tR Output Turn-on Rise Time CL = 1µF, RLOAD = 5Ω – 0.6 1.5 ms
tD(OFF) Output Turn-off Delay Time CL = 1µF, RLOAD = 5Ω – 0.1 – ms
tF Output Turn-off Fall Time CL = 1µF, RLOAD = 5Ω – 0.05 0.10 ms
RFLG FLG Output FET On-resistance IFLG = 10mA – 20 40 Ω
IFOH FLG Off Current VFLG = 5V – 0.01 1.00 µA
Assertion or deassertion due to overcurrent and
tBLANK FLG Blanking Time 4 7 15 ms
over-temperature condition
tDIS Discharge Time CL = 1µF, VIN = 5V, Disabled to VOUT < 0.5V – 0.6 – ms
RDIS Discharge Resistance (Note 8) VIN = 5V, Disabled, IOUT = 1mA – 100 – Ω
TSHDN Thermal Shutdown Threshold Enabled – +140 C
THYS Thermal Shutdown Hysteresis – – +20 – C
SO-8 (Note 9) – 96 – C/W
MSOP-8 (Note 9) – 130 – C/W
Thermal Resistance Junction-to-
θJA MSOP-8EP (Note 10) – 92 – C/W
Ambient
U-DFN3030-8 (Type E) (Note 10) – 84 – C/W
U-DFN2020-6 (Note 11) – 90 – C/W
Notes: 7. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.
8. The discharge function is active when the device is disabled (when enable is de-asserted or during power-up power-down when VIN < VUVLO). The
discharge function offers a resistive discharge path for the external storage capacitor for limited time.
9. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout.
10. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground
plane.
11. Device mounted on 1" x 1" FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground.

AP2501/AP2511 4 of 18 May 2016

Document number: DS35577 Rev. 7 - 2 www.diodes.com © Diodes Incorporated
 AP2501/AP2511

Typical Performance Characteristics

VEN 50% 50% VEN 50%

50%

tD(OFF) tD(OFF)
tR tR
tF tF
tD(ON) 90% 90%
tD(ON) 90% 90%
VOUT VOUT
10% 10% 10% 10%

Figure 1. Voltage Waveforms: AP2501 (Left), AP2511 (Right)

All Enable Plots are for Enable Active Low

Turn-On Delay and Rise Time Turn-Off Delay and Fall Time

TA=25°C
VOUT TA=25°C VOUT VIN=5V
2V/div VIN=5V 2V/div CL=1µF
CL=1µF ROUT=2.5Ω
ROUT=2.5Ω
VEN VEN
5V/div 5V/div
Device Enable
Device Disable

IIN IIN
1A/div 1A/div

Turn-On Delay and Rise Time Turn-Off Delay and Fall Time

TA=25°C
TA=25°C
VOUT VIN=5V
VIN=5V
VOUT 2V/div CL=120µF
CL=120µF
2V/div ROUT=2.5Ω
ROUT=2.5Ω
VEN
5V/div
Device Enable
VEN Device Disable
5V/div
IIN
IIN 1A/div
1A/div

AP2501/AP2511 5 of 18 May 2016

Document number: DS35577 Rev. 7 - 2 www.diodes.com © Diodes Incorporated
 AP2501/AP2511

Typical Performance Characteristics (Cont.)

Device Enabled Into Short-Circuit Inrush Current

TA=25°C TA=25°C
VEN VIN=5V VEN VIN=5V
5V/div CL=120µF 5V/div CL=120µF,220µF,470µF
ROUT=1Ω CL=470µF ROUT=2.5Ω

CL=220µF

IIN IIN
CL=120µF
1A/div 1A/div

Full-Load to Short-Circuit Short-Circuit to Full-Load

Transient Response Recovery Response

TA=25°C
Output Short Circuit Removed
VIN=5V
Output Short Circuit
VOUT ROUT=2Ω
2V/div TA=25°C
VOUT VIN=5V
2V/div ROUT=2Ω

IIN Device Turns off and Re-enables

2A/div Into Current-Limit
IIN Short Circuit Present Device
FLG 2A/div Thermal Cycles
5V/div
FLG
5V/div

No-Load to Short-Circuit Short-Circuit to No-Load

Transient Response Recovery Response
VOUT
TA=25°C Output Short Circuit Removed
2V/div
Output Short Circuit VIN=5V
VOUT
2V/div
TA=25°C
VIN=5V
Device Enable Current-Limit
IIN
2A/div IIN
2A/div
Short Circuit Present Device
FLG FLG Thermal Cycles
5V/div 5V/div

AP2501/AP2511 6 of 18 May 2016

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 AP2501/AP2511

Typical Performance Characteristics (Cont.)

Power ON Short-Circuit with Blanking Time and

Recovery

FLG
5V/div TA=25°C FLG TA=25°C
VIN=5V 5V/div VIN=5V
ROUT=2.5Ω
IOUT
CL=120µF VOUT
1A/div
5V/div

VOUT
5V/div IOUT
2A/div
VIN
5V/div

UVLO Increasing UVLO Decreasing

VOUT
2V/div
TA=25°C TA=25°C
VIN=5V VIN=5V
VOUT ROUT=33Ω ROUT=33Ω
2V/div VIN CL=120µF
CL=120µF 2V/div

VIN
2V/div

AP2501/AP2511 7 of 18 May 2016

Document number: DS35577 Rev. 7 - 2 www.diodes.com © Diodes Incorporated
 AP2501/AP2511

Typical Performance Characteristics (Cont.)

150 200
140 C L = 1µF
180
130 RL = 5 
120 160 TA = 25°C

)s 110 )s 140
TURN-ON TIME (µs)

TURN-OFF TIME (µs)

µ 100 µ
( (
E 90 E 120
M M
TI 80 IT
N
O 70 F 100
F
-N 60 O
R -N 80
U 50 R
T 40 U 60
T
30 CL = 1µF
40
RL = 5 
20
TA = 25°C
10 20
0 0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
INPUT VOLTAGE (V)
Turn-On Time vs. Input Voltage INPUT VOLTAGE (V)
Turn-Off Time vs. Input Voltage
1000 100
CL = 1µF
900 90 RL = 5
TA = 25°C
800 80
)s
TURN-ON TIME (µs)

700 70
µ )s
(
FALL TIME (µs)

E 600 µ 60
M (
I E
T M 50
N 500 I
O T
-N 400 L 40
L
R A
U F
T 300 30
CL = 1µF
200 RL = 5  20
TA = 25°C
100 10

0 0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
INPUT
INPUT VOLTAGE
VOLTAGE (V)(V) INPUT VOLTAGE (V)
Turn-on
Turn-on TimeTime vs. Input
vs. Input Voltage
Voltage Fall Time vs. Input Voltage
SUPPLY CURRENT OUTPUT DISABLED (µA)

100 0.30
SUPPLY CURRENT OUTPUT ENABLED (µA)

VIN = 5.5V 0.25

90
VIN = 5V
0.20
80 VIN = 5.5V
0.15
70 VIN = 5V
0.10
60 0.05
VIN = 2.7V
50 0.00
VIN =3.3V VIN =3.3V
40 -0.05 VIN = 2.7V

-0.10
30
-0.15
20
-0.20
10 -0.25
0 -0.30
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
TEMPERATURE (C) TEMPERATURE (C)
Supply Current, Output Enabled vs. Temperature Supply Current, Output Disabled vs. Temperature

AP2501/AP2511 8 of 18 May 2016

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 AP2501/AP2511

Typical Performance Characteristics (Cont.)

180 4.5

SHORT-CIRCUIT OUTPUT CURRENT(A)

170 4.4
160 4.3
150 VIN =3.3V VIN = 2.7V
VIN = 2.7V 4.2
140
130 4.1
VIN =3.3V
120 4.0
R DS(ON) (m)

110 3.9
100 3.8
90 VIN = 5V
VIN = 5.5V
80 3.7
70 3.6
60 VIN = 5.5V 3.5
50 VIN = 5V 3.4
40 33
30
20 3.2
10 3.1
0 3.0
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
TEMPERATURE (C) TEMPERATURE (C)
RDS(ON) vs. Temperature Short-Circuit Output Current vs. Temperature

2.2 4.5
CL = 120µF
4.4 TA = 25°C
)A
THRESHOLD TRIP CURRENT (A)
UNDERVOLTAGE LOCKOUT (V)

2.1 (T 4.3
N
E
R 4.2
2.0 R
U
UVLO Rising C 4.1
P
1.9 I
R 4.0
T
UVLO Falling D 3.9
L
O
1.8 H 3.8
S
E
R 3.7
H
1.7 T
3.6

1.6 3.5
-50 -25 0 25 50 75 100 125 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
TEMPERATURE (C) INPUT VOLTAGE (V)
Undervoltage Lockout vs. Temperature Threshold Trip Current vs. Input Voltage

AP2501/AP2511 9 of 18 May 2016

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 AP2501/AP2511

Application Note
Power Supply Considerations
A 0.1μF to 2.2μF X7R or X5R ceramic bypass capacitor placed between IN and GND, close to the device, is recommended. When an external
power supply is used, or an additional ferrite bead is added to the input, high inrush current may cause voltage spikes higher than the device
maximum input rating during short circuit condition. In this case a 2.2μF or bigger capacitor is recommended. Placing a high-value electrolytic
capacitor on the input and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply transients that
may cause ringing on the input. Additionally, bypassing the output with a 0.1μF to 1.0μF ceramic capacitor improves the immunity of the device
to short circuit transients.

Over-Current and Short Circuit Protection

An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the
series resistance of the current path. When an over-current condition is detected, the device maintains a constant output current and reduces
the output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.

Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before
VIN has been applied. The AP2501/AP2511 senses the short circuit and immediately clamps output current to a certain safe level namely I LIMIT.

In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher inrush
current may flow for a very short period of time before the current limit function can react. The input capacitor(s) rapidly discharge through the
device, activating current limit circuitry. Protection is achieved by momentarily opening the P-MOS high-side power switch and then gradually
turning it on. After the current limit function has tripped (reached the over-current trip threshold), the device switches into current limiting mode
and the current is clamped at ILIMIT.

In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until
the current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2501/AP2511 is capable of delivering
current up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current
limiting mode and is set at ILIMIT.

FLG Response
When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7ms
deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed.

Connecting a heavy capacitive load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG
due to the 7ms deglitch timeout. The AP2501/AP2511 is designed to eliminate false over-current reporting without the need of external
components to remove unwanted pulses.

Power Dissipation and Junction Temperature

The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by:
2
PD = RDS(ON) × I

Finally, calculate the junction temperature:

TJ = PD x RJA + TA

Where:
TA = Ambient temperature C
RJA = Thermal resistance
PD = Total power dissipation

Thermal Protection
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The
AP2501/AP2511 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die
temperature rises to approximately +140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal
sense circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit
allowing the device to cool down approximately +20°C before the switch turns back on. The switch continues to cycle in this manner until the
load fault or input power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with
7ms deglitch.

AP2501/AP2511 10 of 18 May 2016

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 AP2501/AP2511

Application Note (Cont.)

Under-voltage Lockout (UVLO)
Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 2V,
even if the switch is enabled. Whenever the input voltage falls below approximately 2V, the power switch is quickly turned off. This facilitates the
design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.

Discharge Function
The discharge function of the device is active when enable is disabled or de-asserted. The discharge function with the N-MOS power switch
implementation is activated and offers a resistive discharge path for the external storage capacitor. This is designed for discharging any residue
of the output voltage when either no external output resistance or load resistance is present at the output.

Dual-Purpose Port Applications

The AP2501/AP2511 is not recommended for use in dual-purpose port applications in which a single port is used for data communication between
the host and peripheral devices while simultaneously maintaining a charge to the battery of the peripheral device. An example of such a non-
recommended application is a shared HDMI/MHL (Mobile High-definition Link) port that allows streaming video between an HDTV or set-top box
and a smartphone or tablet while maintaining a charge to the smartphone or tablet battery. Since the AP2501/AP2511 includes an embedded
discharge feature that discharges the output load of the device when the device is disabled, the batteries of the connected peripheral device will
be subject to continual discharge whenever the AP2501/AP2511 is disabled. An overstress condition to the device's discharge MOS transistor
may result. In addition, if the output of the AP2501/AP2511 is subjected to a constant voltage that would be present during a dual-purpose port
application such as MHL, an overstress condition to the device may result.

Ordering Information

AP25X1 XXX - XX

Product Name Enable Channel Package Packing

0 : Active Low 1 : 1 Channel S: SO-8 7 : 7" Tape & Reel
1 : Active High M8 : MSOP-8 13 : 13" Tape & Reel
MP : MSOP-8EP
FGE : U-DFN3030-8
(Type E)
SN : U-DFN2020-6

7”/13” Tape and Reel

Part Number Package Code Packaging
Quantity Part Number Suffix
AP25X1S-13 S SO-8 2500/Tape & Reel -13
AP25X1M8-13 M8 MSOP-8 2500/Tape & Reel -13
AP25X1MP-13 MP MSOP-8EP 2500/Tape & Reel -13
AP25X1FGE-7 FGE U-DFN3030-8 (Type E) 3000/Tape & Reel -7
AP25X1SN-7 SN U-DFN2020-6 3000/Tape & Reel -7

Marking Information
(1) SO-8

AP2501/AP2511 11 of 18 May 2016

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 AP2501/AP2511

Marking Information (Cont.)

(2) MSOP-8

(3) MSOP-8EP

(4) U-DFN3030-8 (Type E)

( Top View )
XX : Identification Code
XX Y : Year : 0~9
W : Week : A~Z : 1~26 week;
YW X a~z : 27~52 week; z represents
52 and 53 week
X : A~Z : Internal Code

Part Number Package Identification Code

AP2501FGE-7 U-DFN3030-8 (Type E) BP
AP2511FGE-7 U-DFN3030-8 (Type E) BR

(5) U-DFN2020-6
( Top View )
XX : Identification Code
XX Y : Year : 0~9
W : Week : A~Z : 1~26 week;
YW X a~z : 27~52 week; z represents
52 and 53 week
X : A~Z : Internal Code

Part Number Package Identification Code

AP2501SN-7 U-DFN2020-6 DP
AP2511SN-7 U-DFN2020-6 DR

AP2501/AP2511 12 of 18 May 2016

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 AP2501/AP2511

Package Outline Dimensions

Please see http://www.diodes.com/package-outlines.html for the latest version.

(1) Package Type: SO-8

SO-8
Dim Min Max
A - 1.75
A1 0.10 0.20
A2 1.30 1.50
A3 0.15 0.25
b 0.3 0.5
D 4.85 4.95
E 5.90 6.10
E1 3.85 3.95
e 1.27 Typ
h - 0.35
L 0.62 0.82
 0 8
All Dimensions in mm

(2) Package Type: MSOP-8

D MSOP-8
Dim Min Max Typ
A - 1.10 -
4x A1 0.05 0.15 0.10
10
° A2 0.75 0.95 0.86
0.25 A3 0.29 0.49 0.39
E Gauge Plane b 0.22 0.38 0.30
x
Seating Plane c 0.08 0.23 0.15
y D 2.90 3.10 3.00
a

L E 4.70 5.10 4.90

4x10°
E1 2.90 3.10 3.00
Detail C E3 2.85 3.05 2.95
1 b
E3 e - - 0.65
L 0.40 0.80 0.60
A3
a 0° 8° 4°
A2 A x - - 0.750
e y - - 0.750
A1 E1 c All Dimensions in mm
See Detail C

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 AP2501/AP2511

Package Outline Dimensions (Cont.)

Please see http://www.diodes.com/package-outlines.html for the latest version.

(3) Package Type: MSOP-8EP

MSOP-8EP
D Dim Min Max Typ
A - 1.10 -
A1 0.05 0.15 0.10
4X A2 0.75 0.95 0.86
10
D1 ° A3 0.29 0.49 0.39

0.25
x b 0.22 0.38 0.30
E E2 c 0.08 0.23 0.15
Gauge Plane
Seating Plane
D 2.90 3.10 3.00
y D1 1.60 2.00 1.80

a
4X E 4.70 5.10 4.90
10 L
° E1 2.90 3.10 3.00
1
e 8Xb E2 1.30 1.70 1.50
E3 Detail C E3 2.85 3.05 2.95
A1 A3 e - - 0.65
c
A A2 L 0.40 0.80 0.60
a 0° 8° 4°
D E1 x - - 0.750
y - - 0.750
See Detail C All Dimensions in mm

(4) Package Type: U-DFN3030-8 (Type E)

A
A3 U-DFN3030-8
A1 Type E
Dim Min Max Typ
D A 0.57 0.63 0.60
D2 A1 0 0.05 0.02
A3   0.15
L (x8)
b 0.20 0.30 0.25
D 2.95 3.05 3.00
D2 2.15 2.35 2.25
E E2 E 2.95 3.05 3.00
e   0.65
E2 1.40 1.60 1.50
L 0.30 0.60 0.45
Z   0.40
Z (x4) e b (x8) All Dimensions in mm

(5) Package Type: U-DFN2020-6

A1
A3 U-DFN2020-6
A Dim Min Max Typ
Seating Plane A 0.57 0.63 0.60
A1 0 0.05 0.03
D A3 - - 0.15
D2 b 0.20 0.30 0.25
D2/2 D 1.95 2.075 2.00
D2 1.45 1.65 1.55
0 e - - 0.65
.10
R0
E 1.95 2.075 2.00
E2/2 E2 0.76 0.96 0.86
E E2 L 0.30 0.40 0.35
Pin #1 ID
All Dimensions in mm

e b

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 AP2501/AP2511

Suggested Pad Layout

Please see http://www.diodes.com/package-outlines.html for the latest version.

(1) Package Type: SO-8

Dimensions Value (in mm)

X 0.60
C1 Y 1.55
C1 5.4
C2
C2 1.27

(2) Package Type: MSOP-8

X C

Dimensions Value (in mm)

Y1 C 0.650
X 0.450
Y 1.350
Y1 5.300

(3) Package Type: MSOP-8EP

X C
Value
Dimensions
(in mm)
Y C 0.650
G
G 0.450
X 0.450
X1 2.000
Y 1.350
Y2 Y1 Y1 1.700
X1 Y2 5.300

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 AP2501/AP2511

Suggested Pad Layout (Cont.)

Please see http://www.diodes.com/package-outlines.html for the latest version.

(4) Package Type: U-DFN3030-8 (Type E)

X (x8) C

Y
(x8)

Dimensions Value (in mm)

C 0.65
Y1 Y2 C1 2.35
X 0.30
Y 0.65
Y1 1.60
Y2 2.75

C1

(5) Package Type: U-DFN2020-6

X
C

G
Y
Value
Dimensions
(in mm)
C 0.65
Y1 G 0.15
X 0.37
X1 1.67
Y 0.45
Y1 0.90
G

X1

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 AP2501/AP2511

Taping Orientation (Note 12)

For U-DFN2020-6 and U-DFN3030-8 (Type E)

Note: 12. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf.

AP2501/AP2511 17 of 18 May 2016

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 AP2501/AP2511

IMPORTANT NOTICE

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.

This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.

LIFE SUPPORT

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

Copyright © 2016, Diodes Incorporated

www.diodes.com

AP2501/AP2511 18 of 18 May 2016

Document number: DS35577 Rev. 7 - 2 www.diodes.com © Diodes Incorporated