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SK6812RGBW-BW
ACKNOWLEDGMENT
CHIP-ON-TOP SMD TYPE LED
Checked by 周凯
Approved by 朱更生
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SK6812RGBX-XX
ELECTROSTATIC
SENSITIVE DEVICES
Change History
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CONTENTS
1、 Product overview........................................................................Three
2、 Main Application Field..............................................................Three
3、 Description...................................................................................Three
4、 Mechanical Dimensions............................................................... Three
5、 PIN configuration......................................................................... Four
6、 Recommended dimensions for PCB products............................ Four
7、General description of product naming........................................ Four
8、 Electrical parameters.................................................................... Five
9、 Electrical/Optical Characteristics................................................. Five
10、 The IC electrical parameters...................................................... Five
11、 Switching characteristics............................................................ Six
12、 The data transmission time ........................................................ Six
13 、 Timing waveform..................................................................... Seven
14、 The method of data transmission............................................... Sevem
15、 The data structure of 24bit.......................................................... Eight
16、 The typica l application circuit....................................................Eight
17、Hue Bin Specification for Yellow/Red/Green/Blue..... Nine
18、 White Color Temperature Ranks......................................Ten~Thriteen
19、 Standard LED Performance Graph.............................................. Fourteen
20、 Packaging Standard....................................................................... Fifteen
21、 Reliability Test..............................................................................Sixteen
Appendix 1、 TOP SMD LED Application Notes................................
....................................................................................................Seventeen~Twenty-two
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1. Product Overview :
SK6812RGBW is a smart LED control circuit and light emitting circuit in one controlled LED source,
which has the shape of a 5050 LED chip. Each lighting element is a pixel, and the intensities of the
pixels are contained within the intelligent digital interface input. The output is driven by patented PWM
technology, which effectively guarantees high consistency of the color of the pixels. The control
circuit consists of a signal shaping amplification circuit, a built-in constant current circuit, and a high
precision RC oscillator.
The data protocol being used is unipolar RZ communication mode. The 32-bit data is transmitted
from the controller to DIN of the first element, and if it is accepted it is extracted pixel to pixel. After an
internal data latch, the remaining data is passed through the internal amplification circuit and sent out
on the DO port to the remaining pixels. The pixel is reset after the end of DIN. Using automatic
shaping forwarding technology makes the number of cascaded pixels without signal transmission only
limited by signal transmission speed.
The LED has a low driving voltage (which allows for environmental protection and energy saving),
high brightness, scattering angle, good consistency, low power, and long life. The control circuit is
integrated in the LED above.
3. Description:
● Top SMD internal integrated high quality external control line serial cascade constant current IC;
● control circuit and the chip in SMD 5050 components, to form a complete control of pixel, color
mixing uniformity and consistency;
●built-in data shaping circuit, a pixel signal is received after wave shaping and output waveform
distortion will not guarantee a line;
●The built-in power on reset and reset circuit, the power does not work;
●gray level adjusting circuit (256 level gray scale adjustable);
● red drive special treatment, color balance;
● line data transmission;
● plastic forward strengthening technology, the transmission distance between two points over 10M;
●Using a typical data transmission frequency of 800 Kbps, when the refresh rate of 30 frames per sec
4. Mechanical Dimensions:
1 VDD 4 DIN
5.0
4.2
1.0
2 DOUT 3 VSS
5.4
Notes:
1. All dimensions are in millimeters.
2. Tolerance is ±0.1mm unless otherwise noted
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5. PIN configuration
NO. Symbol Function description
1 VDD Power supply LED
2 DOUT Control data signal output
3 VSS Ground
4 DIN Control data signal input
1 VDD 4 DIN
2 DOUT 3 VSS
SK 6812RGBX-XX
① ② ③
① ② ③
XX:
BW Blue White 5500-
The default is to integrate 10000K
the RGB and X chip with NW Natural White 3800-
Refers to the 68 series IC
the IC 4500K
12MA current version
X: W White Color WS Warm Sunlight 2700-
A 585-595nm 3200K
GW GOLD White 2400-
2700K
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8. Electrical Parameters(Ta=25℃,VSS=0V) :
9. Electrical/Optical Characteristics:
SK6812RGBX-XX
Color
Dominate avelength(nm) Luminance(mcd) luminous flux(lm)
10. The IC electrical parameters (unless otherwise specified, TA=-20 ~ +70 ℃, VDD=4.5 ~
5.5V, VSS=0V):
Parmeter Symbol Min Typical Max Unit Test conditions
The chip
VDD --- 5.2 --- V ---
supply voltage
0.7*
The signal VIH --- --- V
VDD
input flip VDD=5.0V
threshold 0.3*V
VIL --- --- V
DD
The frequency
FPWM --- 1.2 --- KHZ ---
of PWM
Static power
IDD --- 1 --- mA ---
consumption
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Symbo
Parameter Min Typical Max Unit Test conditions
l
Standard
Name Min. Max. Unit
value
T Code period 1.20 -- -- µs
1. The protocol uses a unipolar zeroing code. Each symbol must have a low level. Each
symbol in this protocol starts with a high level. The high time width determines the "0" or
"1" code. .
2. When writing programs, the minimum symbol period is 1.2μs.
3. The high time of “0” code and “1” code should be in accordance with the
stipulated range in the above table. The low time requirement of “0” code and “1”
code is less than 20μs.
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Symbol period T
0 code T0L
T0H
1 code T1L
T1H
Trst
Reset code
Connection mode:
D1 D2 D3 D4
DIN DO DIN DO DIN DO
Note: the D1 sends data for MCU, D2, D3, D4 for data forwarding automatic shaping cascade circuit.
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In the practical application circuit, the signal input and output pins of the IC signal input and output pins should be connected
to the signal input and output terminals. In addition, in order to make the IC chip is more stable, even the capacitance between
beads is essential back;
Application: used for soft lamp strip or hard light, lamp beads transmission distance is short, suggested in signal in time the
clock line input and output end of each connected in series protection resistors, R1=R0 of about 500 ohms.
Application: for module or general special-shaped products, lamp beads transmission distance is long, because of different
wire and transmission distance, in the signal in time clock at both ends of the line on grounding protection resistance will be
slightly different; to the actual use of fixed;
9 / 23 Document No.: SPC / SK6812RGBX-XX Rev. No.: 07
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18. White Color Temperature Ranks & CIE Color Rank (Refer to CIE 1931 chromaticity diagram)
Name X1 Y1 X2 Y2 X3 Y3 X4 Y4
BW-A 0.2928 0.2822 0.2802 0.2895 0.2885 0.3007 0.3011 0.2934
0.35
6000K
0.34 BW-D
0.33
7000K BW-C
0.32
Y
0.31
8300K
0.30 BW-B
10000K
0.29
BW-A
0.28
0.27 0.29 X
0.31 0.33 0.35
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名称 X1 Y1 X2 Y2 X3 Y3 X4 Y4
N0-A 0.358 0.3445 0.3461 0.3521 0.3531 0.36 0.3651 0.3524
NA-A 0.3651 0.3524 0.3531 0.36 0.3602 0.3679 0.3722 0.3603
NB-A 0.3722 0.3603 0.3602 0.3679 0.3659 0.3743 0.3779 0.3667
NC-A 0.3779 0.3667 0.3659 0.3743 0.3716 0.3807 0.3836 0.373
ND-A 0.3836 0.373 0.3716 0.3807 0.3773 0.3871 0.3893 0.3794
NE-A 0.3893 0.3794 0.3773 0.3871 0.3844 0.3949 0.3963 0.3873
0.40
Normand Natural White Graph
3900-4150K
0.39
4000-4200K
0.38
4050-4200K NE-A
4100-4400K ND-A
Y
0.37
4200-4500K NC-A
0.36 4400-4750K NB-A
NA-A
0.35
N0-A
0.34
0.34 0.35 0.36 X
0.37 0.38 0.39 0.40
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名称 X1 Y1 X2 Y2 X3 Y3 X4 Y4
K1-A 0.4344 0.4032 0.4221 0.3984 0.4147 0.3814 0.426 0.3853
K2-A 0.443 0.4212 0.4299 0.4165 0.4221 0.3984 0.4344 0.4032
K3-A 0.4562 0.426 0.443 0.4212 0.4344 0.4032 0.4465 0.4071
K4-A 0.4465 0.4071 0.4344 0.4032 0.426 0.3853 0.4373 0.3893
L1-A 0.4586 0.4103 0.4465 0.4071 0.4373 0.3893 0.4483 0.3918
L2-A 0.4687 0.4289 0.4562 0.426 0.4465 0.4071 0.4586 0.4103
ANSI Warm White Color bin structures
L1-A
0.40 K4-A
K1-A
0.39
0.38
0.41 0.42 0.43 0.44 0.45 0.46 0.47
X
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CA X1 Y1 X2 Y2 X3 Y3 X4 Y4
GA 0.459741 0.3982 0.4548 0.4045 0.4613 0.4096 0.4662 0.4033
GB 0.466212 0.4033 0.4613 0.4096 0.4677 0.4147 0.4727 0.4084
GC 0.472682 0.4084 0.4677 0.4147 0.4742 0.4198 0.4792 0.4135
GD 0.479152 0.4135 0.4742 0.4198 0.4807 0.4248 0.4856 0.4185
GE 0.485622 0.4185 0.4807 0.4248 0.4872 0.4299 0.4921 0.4236
GA1 0.462676 0.3945 0.4597 0.3982 0.4662 0.4033 0.4693 0.3994
GB1 0.469255 0.3994 0.4662 0.4033 0.4727 0.4084 0.4758 0.4044
GC1 0.475835 0.4044 0.4727 0.4084 0.4792 0.4135 0.4824 0.4093
GD1 0.482415 0.4093 0.4792 0.4135 0.4856 0.4185 0.489 0.4142
GE1 0.488995 0.4142 0.4856 0.4185 0.4921 0.4236 0.4956 0.4192
GE 2300K
0.42 2700K GD GE1
GC GD1
Y
0.41
GB GC1
GA GB1
0.40
GA1
0.39
0.45 0.46 0.47 0.48 X 0.49 0.50 0.51
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T h e r m a l P a d T e m p e r a t u r e v s . R e la t iv e L ig h t O u t p u t
120%
B L U E \G R E E N
Normalized Luminous Flux
100%
80%
60%
R E D /Y E L L O W
40%
20%
0 .0 0
0 20 40 60 80 100 120
T h e r m a l P a d T e m p e r a tu r e ( T = 2 5 ° C )
W a v e l e n g t h C h a r a c t e r is t ic s
YELLO W
100%
GREEN RED
Relative Emission Distribution
BLUE GW
80%
WS
60%
NW
BW
40%
20%
0 .0 0
400 450 500 550 600 650 700 750 800
W a v e le n g t h ( n m )
T y p i c a l R a d ia t io n P a t t e r n 120°
0
30°
60°
90°
90 75 60 45 30 15 0 0 .2 0 .4 0 .6 0 .8 1 .0
R a d ia t io n A n g le
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S K 6 8 1 2 R G B W -X X
C A T H O D E ID E N T IF IC A T IO N
T A P E F E E D D IR E C T IO N C A R R IE R T A P E
C O VER TAPE
R E E L (1 7 8 x 1 2 m m )
( IN N E R 1 0 0 0 p c s L E D M A X )
S M D
P R O D U C T N O .: S K 6 8 1 2 R G B W -W S
L o t N o .: L W 2 0 1 7 0 7 0 9 0 2 -1 0
W S : 2 7 0 0 -3 2 0 0 K
D A T E :2 0 1 7 -0 8 -0 4
L A B E L S K E T C H IN G
C A R D B O A R D (IN N E R 4 0 B A G M A X .)
The reel pack is applied in SMD LED. The LEDs are packed in cardboard boxes after packaging in normal or anti-
electrostatic bags. cardboard boxes will be used to protect the LEDs from mechanical shocks during transportation. The
boxes are not water resistant and therefore must be kept away from water and moisture.
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High Temperature
JEITA ED-4701
4 High Humidity Ta=60ºC RH=90% 1000hrs 0/22
Storage
100 103
-55ºC~25ºC~100ºC~25ºC
Temperature 30min~5min~30min~5mi JEITA ED-4701
5 0/22
Cycle n 100 105
100 cycles
Limit
Item Symbol Test Condition
Min Max
Luminous DC=5V, Typical
IV Init. Value*0.7 ---
Intensity current
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1. Features
The Purposes of making Normand’s customers and users to have a clear understanding on the ways how
2. Description
Generally. The LED can be used the same way as other general purposed semiconductors. When using
Normand’s TOP SMD LED, the following precautions must be taken to protect the LED.
3. Cautions
3.1. Dust & Cleaning
This emitter has a silicone surface, There are many benefits to the silicone surface in terms of optical
properties and improved reliability. However, silicone is a softer material and prone to attract dust. While a
minimal amount of dust and debris on the LED will not cause significant reduction in illumination, steps
should be taken to keep the emitter free of dust.
These include keeping the LEDs in the manufacturer’s package prior to assembly and storing assemblies in
an enclosed area after installing the emitters.
Surface condition of this device may change when organic solvents such as trichloroethylene or acetone
were applied.
Avoid using organic solvent, it is recommended that isopropyl be used as a solvent for cleaning the LEDs.
When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the
package and the resin of not.
Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence as ultrasonic
cleaning on the LEDs depends on factors such as ultrasonic power. Baking time and assembled
condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will
occur.
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3.6. Unwanted material moisture-proof storage and moisture-proof control of finished material
If a roll of SMDs is not used at once and the plant temperature and humidity are within the defined conditions
(<30 ° C / 60% RH), the exposure time of the element in the air does not exceed 2H, the remaining material
should be carried out together with the desiccant Vacuum sealed, otherwise, the material must be low-wet
baking dehumidification; dehumidified material can be re-packaged to re-start the calculation time;
Perform moisture control on SMDs components that have been assembled
A. After the components have been assembled to the PCB board no longer need to go through the high
temperature process or reflow process, it will not be special treatment;
B. Do not need to do the necessary dehumidification work before making the appropriate protection process,
bake in 70 ℃ ± 5 ℃ oven baking for less than 12 hours, To remove the product in the detection and aging
process exposed to moisture in the air to avoid the product in the protective treatment, the package in the
material surface of the moisture will slowly invade the product, will cause product failure;
C. For products that require secondary SMT process or high temperature, they should be subjected to the
necessary moisture treatment before secondary welding, after exposure to (<30 ° C / 60% RH) , The maximum
length of not more than 2H, Connaught second high temperature process separated by a long time, then a
welding material must be necessary dehumidification work (70 ℃ ± 5 ℃ oven baking no less than 12 hours),
and then pumping Vacuum storage; or the first product stored in the oven or with a desiccant container, the
second high-temperature process before doing dehumidification work (70 ℃ ± 5 ℃ in the oven baking no less
than 12 hours) , To ensure that products in the high temperature before the process is not damp;
Low-temperature baking conditions: 70 ° C ± 5 ° C baking not less than 12 hours high temperature baking
conditions: 130 ° C ± 5 ° C baking not less than 6 hours (lamp beads must be split into particles)
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Critical Zone T L to T P
amp-up
L L
Temperature (°C)
s max
MIN
Ramp down
ts
(Preheat)
T 25°C to Peak
Times
Profile Feature Lead-Based Solder Lead-Free Solder
Time Within 5℃ of Actual Peak Temperature ( tp) <10 seconds <10 seconds
Note: All temperatures refer to topside of the package, measured on the package body surface.
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OK (nozzle diameter is greater than the NG (nozzle diameter is less than the light
light bulb area beads light area)
. Material to take way: with tweezers folder material, can not press the colloid or sharp objects to touch the colloid,
the material can not be stacked;
. Products in the PCB layout design, for the soft sheet, and 0.5T below the plate, the pad direction should be
perpendicular to the direction of PCB extension to reduce the PCB board bending stress generated in the LED pin,
resulting in LED products Due to stress acting tensile failure;
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