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SK6812-EC20
ELECTROSTATIC
Change History SENSITIVE DEVICES
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CONTENTS
1、 Product overview........................................................................3
2、 Main Application Field...............................................................3
3、 Description...................................................................................3
4、 Mechanical Dimensions...............................................................4
5、 PIN configuration.........................................................................4
6、 Recommended dimensions for PCB products............................4
7、General description of product naming........................................5
8、 Electrical parameters...................................................................5
9、 Electrical/Optical Characteristics................................................. 5
10、 IC The electrical parameters......................................................6
11、 Switching characteristics............................................................6
12、 The data transmission time .......................................................7
13 、 Timing waveform..................................................................... 7
14、 The method of data transmission............................................... 8
15、 The data structure of 24bit.......................................................... 9
16、 The typica l application circuit....................................................9
17、 Standard LED Performance Graph..............................................10
18、 Packaging Standard..................................................................... 11
19、 Reliability Test............................................................................. 12
Appendix 1.EC LED Application Notes.................. .......... .................13~17
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1. Product Overview :
SK6812-EC20(SK6812-2020) is a smart LED control circuit and light emitting circuit in one controlled
LED source, which has the shape of a 2020 LED chip. Each lighting element is a pixel, and the
intensities of the pixels are contained within the intelligent digital interface input. The output is driven
by patented PWM technology, which effectively guarantees high consistency of the color of the pixels.
The control circuit consists of a signal shaping amplification circuit, a built-in constant current circuit,
and a high precision RC oscillator.
The data protocol being used is unipolar RZ communication mode. The 24-bit data is transmitted
from the controller to DIN of the first element, and if it is accepted it is extracted pixel to pixel. After an
internal data latch, the remaining data is passed through the internal amplification circuit and sent out
on the DO port to the remaining pixels. The pixel is reset after the end of DIN. Using automatic
shaping forwarding technology makes the number of cascaded pixels without signal transmission only
limited by signal transmission speed.
The LED has a low driving voltage (which allows for environmental protection and energy saving),
high brightness, scattering angle, good consistency, low power, and long life. The control circuit is
integrated in the LED above.
3. Description:
● Top SMD internal integrated high quality external control line serial cascade constant current IC;
● control circuit and the RGB chip in EC2020 components, to form a complete control of pixel, color
mixing uniformity and consistency;
●built-in data shaping circuit, a pixel signal is received after wave shaping and output waveform
distortion will not guarantee a line;
●The built-in power on reset and reset circuit, the power does not work;
●gray level adjusting circuit (256 level gray scale adjustable);
● red drive special treatment, color balance;
● line data transmission;
● plastic forward strengthening technology, the transmission distance between two points over 10M;
●Using a typical data transmission frequency of 800 Kbps, when the refresh rate of 30 frames per sec
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4. Mechanical Dimensions:
BOTOOM VIEW
Notes:
1. All dimensions are in millimeters.
2. Tolerance is ±0.1mm unless otherwise noted
5. PIN configuration
TOP VIEW
3 GND 2 DOUT
4 DIN 1 VDD
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SK 68XX-EC20
① ② ③
① ② ③
9. Electrical/Optical Characteristics:
Dominate
Luminan luminou Luminance luminous
Wavelengt
ce(mcd) s flux(lm) (mcd) flux(lm)
h(nm)
Gree
520-535 300-500 1.0-2.0 400-700 2.0-3.5
n
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10. IC The electrical parameters (unless otherwise specified, TA=-20 ~ +70 ℃, VDD=4.5 ~
5.5V, VSS=0V):
Parmeter Symbol Min Typical Max Unit Test conditions
The chip
VDD --- 5.2 --- V ---
supply voltage
0.7*
The signal VIH --- --- V
VDD
input flip VDD=5.0V
threshold 0.3*V
VIL --- --- V
DD
The frequency
FPWM --- 1.2 --- KHZ ---
of PWM
Static power
IDD --- 1 --- mA ---
consumption
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Standard
Name Min. Max. Unit
value
T Code period 1.20 -- -- µs
1. The protocol uses a unipolar zeroing code. Each symbol must have a low level. Each
symbol in this protocol starts with a high level. The high time width determines the "0" or
"1" code. .
2. When writing programs, the minimum symbol period is 1.2μs.
3. The high time of “0” code and “1” code should be in accordance with the
stipulated range in the above table. The low time requirement of “0” code and “1”
code is less than 20μs.
Symbol period T
0 code T0L
T0H
1 code T1L
T1H
Trst
Reset code
Connection mode:
D1 D2 D3 D4
DIN DO DIN DO DIN DO
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Note: the D1 sends data for MCU, D2, D3, D4 for data forwarding automatic shaping cascade circuit.
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In the practical application circuit, the signal input and output pins of the IC signal input and output pins should be connected
to the signal input and output terminals. In addition, in order to make the IC chip is more stable, even the capacitance between
beads is essential back;
Application: used for soft lamp strip or hard light, lamp beads transmission distance is short, suggested in signal in time the
clock line input and output end of each connected in series protection resistors, R1 of about 500 ohms.
Application: for module or general special-shaped products, lamp beads transmission distance is long, because of different
wire and transmission distance, in the signal in time clock at both ends of the line on grounding protection resistance will be
slightly different; to the actual use of fixed;
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120%
BLUE/GREEN
Normalized Luminous Flux
100%
80%
60% RED
40%
20%
0.00
0 20 40 60 80 100 120
Thermal Pad Temperature (T=25°C)
Wavelength Characteristics
100%
GREEN
Relative Emission Distribution
BLUE
80% RED
60%
40%
20%
0.00
400 450 500 550 600 650 700 750 800
Wavelength (nm)
30°
60°
90°
90 75 60 45 30 15 0 0.2 0.4 0.6 0.8 1.0
Radiation Angle
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S K 6 8 1 2 -E C 2 0
C A T H O D E ID E N T IF IC A T IO N
T A P E F E E D D IR E C T IO N C A R R IE R T A P E
CO VER TAPE
R E E L (1 7 8 x 1 2 m m )
(IN N E R 5 0 0 0 p c s L E D M A X )
S M D
P R O D U C T N O .: S K 6 8 1 2 -E C 2 0
ES D PO LYE TH Y LENE BAG Q U A N T IT Y .: 5 0 0 0 P C S
L o t N o .: L W 2 0 1 8 0 7 1 3 0 0 2 -1
D A T E :2 0 1 8 -0 7 -1 3
L A B E L S K E T C H IN G
C A R D B O A R D (IN N E R 4 0 B A G M A X .)
The reel pack is applied in SMD LED. The LEDs are packed in cardboard boxes after packaging in normal or anti-
electrostatic bags. cardboard boxes will be used to protect the LEDs from mechanical shocks during transportation. The
boxes are not water resistant and therefore must be kept away from water and moisture.
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High Temperature
JEITA ED-4701
4 High Humidity Ta=60ºC RH=90% 1000hrs 0/22
Storage
100 103
-55ºC~25ºC~100ºC~25ºC
Temperature 30min~5min~30min~5mi JEITA ED-4701
5 0/22
Cycle n 100 105
100 cycles
Limit
Item Symbol Test Condition
Min Max
Luminous DC=5V, Typical
IV Init. Value*0.7 ---
Intensity current
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The Purposes of making Normand’s customers and users to have a clear understanding on the ways how
to use the LED.
2. Description
Generally. The LED can be used the same way as other general purposed semiconductors. When using
Normand’s TOP SMD LED, the following precautions must be taken to protect the LED.
3. Cautions
3.1. Dust & Cleaning
This emitter has a silicone surface, There are many benefits to the silicone surface in terms of optical
properties and improved reliability. However, silicone is a softer material and prone to attract dust. While a
minimal amount of dust and debris on the LED will not cause significant reduction in illumination, steps
should be taken to keep the emitter free of dust.
These include keeping the LEDs in the manufacturer’s package prior to assembly and storing assemblies in
an enclosed area after installing the emitters.
Surface condition of this device may change when organic solvents such as trichloroethylene or acetone
were applied.
Avoid using organic solvent, it is recommended that isopropyl be used as a solvent for cleaning the LEDs.
When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the
package and the resin of not.
Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence as ultrasonic
cleaning on the LEDs depends on factors such as ultrasonic power. Baking time and assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.
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3.6. Unwanted material moisture-proof storage and moisture-proof control of finished material
If a roll of SMDs is not used at once and the plant temperature and humidity are within the defined conditions (<30 ° C /
60% RH), the exposure time of the element in the air does not exceed 2H, the remaining material should be carried
out together with the desiccant Vacuum sealed, otherwise, the material must be low-wet baking dehumidification;
dehumidified material can be re-packaged to re-start the calculation time;
Perform moisture control on SMDs components that have been assembled
A. After the components have been assembled to the PCB board no longer need to go through the high temperature
process or reflow process, it will not be special treatment;
B. Do not need to do the necessary dehumidification work before making the appropriate protection process, bake in 70
℃ ± 5 ℃ oven baking for less than 48 hours, To remove the product in the detection and aging process exposed to
moisture in the air to avoid the product in the protective treatment, the package in the material surface of the moisture
will slowly invade the product, will cause product failure (Specific desiccant baking parameters refer to 3.6.2 items);
C. For products that require secondary SMT process or high temperature, they should be subjected to the necessary
moisture treatment before secondary welding, after exposure to (<30 ° C / 60% RH) , The maximum length of not more
than 4H, Connaught second high temperature process separated by a long time, then a welding material must be
necessary dehumidification work (70 ℃ ± 5 ℃ oven baking no less than 48 hours), and then pumping Vacuum storage;
or the first product stored in the oven or with a desiccant container, the second high-temperature process before doing
dehumidification work (70 ℃ ± 5 ℃ in the oven baking no less than 48 hours) , To ensure that products in the high
temperature before the process is not damp (Specific desiccant baking parameters refer to 3.6.2 items);
Low-temperature baking conditions: 70 ° C ± 5 ° C baking not less than 48 hours high temperature baking conditions:
130 ° C ± 5 ° C baking not less than 6 hours (lamp beads must be split into particles)
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3.6.2 The relationship between ambient humidity and dehumidification time for low temperature/high temperature dehumidification:
Ambient Oven
baking time Baking method
humidity temperature
Critical Zone T L to TP
amp-up
L L
Temperature (°C)
s max
MIN
Ramp down
ts
(Preheat)
T 25°C to Peak
Times
Profile Feature Lead-Based Solder Lead-Free Solder
Time Within 5℃ of Actual Peak Temperature ( tp) <10 seconds <10 seconds
Note: All temperatures refer to topside of the package, measured on the package body surface.
16 / 17 Document No.: SPC / SK68XX-EC20 Rev. No.: 04
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