Tutorial Speaker - II (Tuesday)

Title: Design and Test of 2.5D and 3D stacked ICs

Speaker: Paul Franzon, North Carolina State

Time: Tuesday, 8:30am – 10:10am

Abstract: Three dimensional chips stacked using Through Silicon Via

(TSV) technology has been under consideration and the subject of
intensive research for several years now. Soon the technologies will become available through
standard fabs. Will the technology be an instant hit, a niche, or a flop? What is needed to ensure
it reaches hit status? What are the basic manufacturing steps and flows? This tutorial will
discuss these question mainly in the context of the opportunities and challenges that face the
designer. What are the significant opportunities presented by 3DIC? What problems will the
designer face that will need clever solutions? What are the potential solution paths?

Bio: Paul D. Franzon is currently a Distinguished Alumni Professor of Electrical and Computer
Engineering at North Carolina State University. He earned his Ph.D. from the University of
Adelaide, Adelaide, Australia in 1988. He has also worked at AT&T Bell Laboratories, DSTO
Australia, Australia Telecom and two companies he cofounded, Communica and LightSpin
Technologies. His current interests center on the technology and design of complex
microsystems incorporating VLSI, MEMS, advanced packaging and nano-electronics. He has
lead several major efforts and published over 200 papers in these areas. In 1993 he received an
NSF Young Investigators Award, in 2001 was selected to join the NCSU Academy of
Outstanding Teachers, in 2003, selected as a Distinguished Alumni Professor, and received the
Alcoa Research Award in 2005. He served with the Australian Army Reserve for 13 years as an
Infantry Solider and Officer. He is a Fellow of the IEEE.

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