RF3315DS

RF3315Broad-
band High Lin-

earity Amplifier
RF3315
BROADBAND HIGH LINEARITY AMPLIFIER
Package Style: SOT89
GND
Features
200MHz to 3GHz 4
+41dBm Output IP3

18dB Gain at 900MHz
+25dBm P1dB
2.5dB Typical Noise Figure at 1 2 3
900MHz
RF OUT
GND
RF IN
Single 5V Power Supply
Class 1A ESD Rating (All Pins)
Applications
Broadband MoCA PA Functional Block Diagram
Linear Driver with Low NF
High Linearity IF Amplifier Product Description
The RF3315 is a high-efficiency GaAs Heterojunction Bipolar Transistor
(HBT) amplifier packaged in a low-cost surface-mount package. This
amplifier is ideal for use in applications requiring high-linearity and low
noise figure over the 200MHz to 3GHz frequency range. This part offers
exceptional broadband performance for MoCA applications in the
400MHz to 700MHz and 800MHz to 1500MHz bands. The RF3315 oper-
ates from a single 5V power supply.
Ordering Information
RF3315 Broadband High Linearity Amplifier
RF3315PCBA-413 Fully Assembled Board (900MHz)
Optimum Technology Matching® Applied

9GaAs HBT SiGe BiCMOS GaAs pHEMT GaN HEMT
GaAs MESFET Si BiCMOS Si CMOS RF MEMS
InGaP HBT SiGe HBT Si BJT LDMOS
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-
mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

Rev A13 DS091103 support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 1 of 16
RF3315
Absolute Maximum Ratings
Parameter Rating Unit Caution! ESD sensitive device.
RF Input Power +20 dBm Exceeding any one or a combination of the Absolute Maximum Rating conditions may
cause permanent damage to the device. Extended application of Absolute Maximum
Device Voltage -0.5 to +6.0 V Rating conditions to the device may reduce device reliability. Specified typical perfor-
mance or functional operation of the device under Absolute Maximum Rating condi-
Device Current 225 mA tions is not implied.
RoHS status based on EUDirective2002/95/EC (at time of this document revision).

Operating Temperature -40 to +85 °C
The information in this publication is believed to be accurate and reliable. However, no
Storage Temperature -40 to +150 °C responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any
infringement of patents, or other rights of third parties, resulting from its use. No
Max. TJ (MTTF>100years) 165 °C license is granted by implication or otherwise under any patent or patent rights of
RFMD. RFMD reserves the right to change component circuitry, recommended appli-
cation circuitry and specifications at any time without prior notice.
Specification
Parameter Unit Condition
Min. Typ. Max.
Overall
VCC =5V, RFIN =-10dBm, Freq=2.0GHz, with
AC Specifications (2GHz)
2GHz application schematic.
Frequency MHz
Gain (Small Signal) 12.5 dB F=2GHz
Input Return Loss 15 dB F=2GHz
Output Return Loss 15 dB F=2GHz
Output IP3 +40.0 dBm F1 = 1.99GHz, F2 =2.00GHz, PIN =-5dBm
Output P1dB +23.0 dBm
Noise Figure 3.0 dB
VCC =5V, RFIN =-10dBm, Freq=900MHz, with

AC Specifications (900MHz)
900MHz application schematic.
Frequency MHz
Gain (Small Signal) 17 18 dB
Input Return Loss 20 dB
Output Return Loss 15 dB
Output IP3 +38.5 +41 dBm F1 = 900MHz, F2 =901MHz, PIN =-10dBm
Output P1dB +23.5 +25.0 dBm
Noise Figure 2.5 dB
Thermal ICC =150mA, PDISS =750mW. (See Note.)
ThetaJC 76 °C/W
Maximum Measured Junction 142 °C TCASE =+85°C
Temperature at DC Bias Condi-
tions
Mean Time To Failure >100 years TCASE =+85°C
DC Specifications
Device Voltage 5.0 V ICC =150mA
Operating Current Range 115 150 170 mA VCC =5V
Note: The RF3315 must be operated at or below 170mA to ensure the highest possible reliability and electrical performance.

2 of 16 support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Rev A13 DS091103
RF3315
Pin Function Description Interface Schematic
1 RF IN RF input pin. This pin is not internally DC-blocked. A DC blocking capacitor,
VCC
suitable for the frequency of operation, should be used.
R F IN
2 GND Ground connection.

3 RF OUT RF output and bias pin. For biasing, an RF choke is needed. Because DC is
VCC
present on this pin, a DC blocking capacitor, suitable for the frequency of
operation, should be used. See application schematic for configuration RF OUT
and value.
4 GND Ground connection.

Pkg GND Ground connection.
Base
Package Drawing
1.04 0.50 1.60
0.80 0.30 1.40
3.10 4.60
2.90 4.40
0.48
0.36 2.60
2 PL 2.40
1.80
1.45
1.75
1.40
0.53
0.43 0.41
Dimensions in mm.
0.38
Shaded lead is pin 1.

RF3315
900MHz Data
Frequency (MHz) VCC (V) ICC (mA) PIN (dBm) POUT (dBm) Gain (dB) OIP3 (dBm) OP1dB (dBm)
900 5 149.49 -9.9 8 17.9 41.73 24.15
10:18:16 Sep 25, 2009

Sweep
Sweep Mode
Mkr1 900 MHz 2.281 dB 17.813 dB
Single Cont
9.000
Manual Meas
NFIG
Scale/
1.000 1
dB
-1.000
40.00
GAIN 1
Scale/
5.000
dB
-10.00
Start 800.00 MHz BW 4 MHz Points 51 Stop 1.00000 GHz
Tcold 301.65 K Avgs 4 Att 0/-- dB Loss Off Corr
User cal will be interpolated

RF3315
2GHz Data
2000 5 151.53 -4.88 8 12.89 41.4 24.76
16:24:45 Sep 24, 2009

Sweep
Sweep Mode
Mkr1 2 GHz 2.873 dB 12.692 dB
Single Cont
9.000
Manual Meas
NFIG
Scale/
1
1.000
dB
-1.000
40.00
GAIN
Scale/ 1
5.000
dB
-10.00
Start 1.90000 GHz BW 4 MHz Points 51 Stop 2.10000 GHz

RF3315
400MHz to 700MHz Data
400 5 147.12 -12.36 8 20.35 41.95 24.02
550 5 147.47 -11.64 8 19.62 40.54 24.22
700 5 147.62 -10.98 8 18.96 40.59 24.94
13:52:11 Sep 25, 2009

Sweep
Sweep Mode
Mkr1 400 MHz 3.396 dB 20.338 dB
Mkr2 550 MHz 2.719 dB 19.696 dB Single Cont
Mkr3 700 MHz 2.440 dB 18.999 dB
9.000
Manual Meas
NFIG
Scale/ 1
1.000 2 3
dB
-1.000
40.00
1 2 3
GAIN
Scale/
5.000
dB
-10.00
Start 350.00 MHz BW 4 MHz Points 51 Stop 750.00 MHz
User cal now valid

RF3315
800MHz to 1500MHz Data
800 5 148.52 -10.72 8 18.72 41.35 24.7
960 5 148.87 -9.42 8 17.42 42.29 25
1150 5 149.12 -8.4 8 16.39 42.8 25.16
1500 5 149 -6.22 8 14.21 42.85 24.61
08:30:43 Sep 28, 2009

Sweep
Sweep Mode
Mkr1 800 MHz 2.232 dB 18.454 dB
Mkr2 1.15 GHz 2.322 dB 16.570 dB Single Cont
Mkr3 1.5 GHz 2.793 dB 14.726 dB
9.000
Manual Meas
NFIG
Scale/
3
1.000 1 2
dB
-1.000
40.00
GAIN 1
2
3
Scale/
5.000
dB
-10.00
Start 725.00 MHz BW 4 MHz Points 51 Stop 1.57100 GHz

RF3315
Typical Application Schematic for 2GHz
4
C3
VCC
1 uF
C4
100 pF
1 2 3
C1 L1 L2 C2
68 pF 0Ω 82 nH 1.5 pF
RF IN RF OUT
L3 C5 L4
4.7 nH 2.2 pF 1.5 nH
Typical Application Schematic for 400MHz to 700MHz Broadband Match
4
C3
V CC
1 uF
C4
100 pF
1 2 3
C1 L1 L2 C2
10 pF 2.7 nH 100 nH 56 pF
RF IN RF OUT
L4
L3 C5 C6
4.7 nH
22 nH 6.8 pF 3.9 pF
Typical Application Schematic for 800MHz to 1500MHz Broadband Match
4
C3
V CC
1 uF
C4
100 pF
1 2 3
C1 L1 L2 C2
5.1 pF 0Ω 82 nH 39 pF
RF IN RF OUT
L4
L3 C5 C6
1.8 nH
8.2 nH 3.6 pF 1.8 pF

RF3315
Application Schematic for 900MHz
4
C2
VCC
6.8 pF
C4
100 pF
1 2 3
C1 L1 L2 C2
0Ω 4.7 pF 100 nH 6.8 pF
RF IN RF OUT
C5 L4
4.7 nH 5.6 nH
Evaluation Board Schematic for 900MHz
P1
4
P1-1 1 VCC C2
VCC
6.8 pF
2 GND
3 GND C4
100 pF
CON3 1 2 3
C1 L1 L2 C2
0Ω 4.7 pF 100 nH 6.8 pF
RF IN RF OUT
C5 L4
4.7 nH 5.6 nH

RF3315
Evaluation Board Layout for 900MHz
Board Size 1.195” x 1.000”
Board Thickness 0.033”, Board Material FR-4

RF3315
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD’s qualification process is electroless nickel, immersion gold. Typical thickness is 3μinch
to 8μinch gold over 180μinch nickel.
PCB Land Pattern Recommendation

PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested
for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly pro-
cesses. The PCB land pattern has been developed to accommodate lead and package tolerances.
PCB Metal Land Pattern

A = 1.27 x 0.86 (mm) Typ.
Dimensions in mm.
Pin 1
3.43
2.79
2.34
1.48
1.02 A
0.43
0.03
0.66 Typ.
1.88 Typ.
5.36
Figure 1. PCB Metal Land Pattern (Top View)

RF3315
PCB Solder Mask Pattern

Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB
metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The
center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be
provided in the master data or requested from the PCB fabrication supplier.
A = 1.37 x 0.96 (mm) Typ.

Dimensions in mm.
Pin 1
3.48
2.89
2.44
1.48
1.02 A
0.48
0.03
0.72 Typ.
1.88 Typ.
5.46
Figure 2. PCB Solder Mask Pattern (Top View)
Thermal Pad and Via Design

Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been
designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing
strategies.
The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a
0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the
quantity of vias be increased by a 4:1 ratio to achieve similar results.

RF3315
S11 S22
1.0
1.0
Swp Max Swp Max
0.8
0.8
0.6
3GHz 3GHz
0.6
2.0
2.0
4 4
0. 0.
3 GHz 3.0 3.0
4.0 4.0
5.0 5.0
0.2 0.2
10.0
3 GHz 10.0
300 MHz
10.0
10.0
0.2
0.4
0.6
0.8
1.0
2.0
3.0
4.0
5.0
0.2
0.4
0.6
0.8
1.0
2.0
3.0
4.0
5.0
300 MHz
0
0
-10.0 -10.0
-0.2 -0.2
-5.0 -5.0
0 0
-4 . -4.
.0 .0
-3 -3
.4 .4
-0 -0
.0
.0
-2
-2
6
6
-0 .
-0 .
Swp Min Swp Min
-0.8
-0.8
-1.0
-1.0
0.3GHz 0.3GHz

RF3315
Noise Figure versus Frequency Across Temperature Input VSWR versus Frequency Across Temperature
VCC=5.0V (900MHz Application Circuit) VCC=5.0V (900MHz Application Circuit)
7.0 3.5
6.0
3.0
5.0
Noise Figure (dB)
2.5
4.0
VSWR
3.0
2.0
2.0
1.5
1.0 -40°C -40°C
25°C 25°C
85°C 85°C
0.0 1.0
700.0 750.0 800.0 850.0 900.0 950.0 1000.0 1050.0 700.0 750.0 800.0 850.0 900.0 950.0 1000.0 1050.0
Frequency (MHz) Frequency (MHz)
Output VSWR versus Frequency Across Temperature, ICC versus VCC Across Temperature
VCC=5.0V (900MHz Application Circuit)
3.5 200.0
180.0
3.0
160.0
2.5
140.0
ICC (mA)
VSWR
120.0
2.0
100.0
1.5
80.0 -40°C
-40°C
25°C 25°C
85°C 85°C
1.0 60.0
700.0 750.0 800.0 850.0 900.0 950.0 1000.0 1050.0 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Frequency (MHz) VCC (V)
MTTF versus Junction Temperature,

(60% Confidence Interval)
1000000.0
100000.0
10000.0
MTTF (Years)
1000.0
100.0
10.0
1.0
100.0 125.0 150.0 175.0 200.0
Junction Temperature (°C)

RF3315
Input VSWR versus Frequency Across Temperature, Output VSWR versus Frequency Across Temperature,
VCC=5.0V (2GHz Application Circuit) VCC=5.0V (2GHz Application Circuit)
2.4 2.4
2.2 2.2
2.0 2.0
1.8 1.8
VSWR
VSWR
1.6 1.6
1.4 1.4
-40°C
-40°C
1.2 1.2 25°C
25°C
85°C 85°C
1.0 1.0
1750.0 1800.0 1850.0 1900.0 1950.0 2000.0 2050.0 2100.0 2150.0 2200.0 2250.0 1750.0 1800.0 1850.0 1900.0 1950.0 2000.0 2050.0 2100.0 2150.0 2200.0 2250.0
Gain versus Frequency Across Temperature, OIP3 versus Frequency Across Temperature
VCC=5.0V (900MHz Application Circuit) VCC=5.0V (900MHz Application Circuit)
20.0 48.0
19.0
45.0
18.0
17.0 42.0
16.0
OIP3 (dBm)
Gain (dB)
39.0
15.0
36.0
14.0
13.0 33.0
12.0
30.0 -40°C
-40°C
11.0 25°C 25°C
85°C 85°C
10.0 27.0
700.0 750.0 800.0 850.0 900.0 950.0 1000.0 1050.0 700.0 750.0 800.0 850.0 900.0 950.0 1000.0 1050.0
P1dB versus Frequency Across Temperature Reverse Isolation versus Frequency Across Temp,
VCC=5.0 (900MHz Application Circuit) VCC=5.0V (900MHz Application Circuit)
28.0 -10.0
27.0
26.0
-15.0
25.0
Reverse Isolation (dB)
24.0
P1dB (dBm)
23.0 -20.0
22.0
21.0
-25.0
20.0
-40°C
-40°C
19.0 25°C 25°C
85°C 85°C
18.0 -30.0
700.0 750.0 800.0 850.0 900.0 950.0 1000.0 1050.0 700.0 750.0 800.0 850.0 900.0 950.0 1000.0 1050.0

RF3315
Gain versus Frequency Across Temperature, OIP3 versus Frequency Across Temperature
VCC=5.0V (2GHz Application Frequency) VCC=5.0V (2GHz Application Frequency)
15.0 44.0
14.0 43.0
13.0 42.0
12.0 41.0
11.0 40.0
OIP3 (dBm)
Gain (dB)
10.0 39.0
9.0 38.0
8.0 37.0
7.0 36.0
-40°C -40°C
6.0 25°C 35.0 25°C
85°C 85°C
5.0 34.0
1750.0 1800.0 1850.0 1900.0 1950.0 2000.0 2050.0 2100.0 2150.0 2200.0 2250.0 1750.0 1800.0 1850.0 1900.0 1950.0 2000.0 2050.0 2100.0 2150.0 2200.0 2250.0
P1dB versus Frequency Across Temperature Reverse Isolation versus Frequency Across Temp
VCC=5.0V (2GHz Application Frequency) VCC=5.0V (2GHz Application Circuit)
26.0 -15.0
25.0 -16.0
24.0
-17.0
23.0
-18.0
22.0
Isolation (dB)
P1dB (dBm)
-19.0
21.0
-20.0
20.0
-21.0
19.0
-22.0
18.0
17.0 -23.0
-40°C -40°C
16.0 25°C -24.0 25°C
85°C 85°C
15.0 -25.0
1750.0 1800.0 1850.0 1900.0 1950.0 2000.0 2050.0 2100.0 2150.0 2200.0 2250.0 1750.0 1800.0 1850.0 1900.0 1950.0 2000.0 2050.0 2100.0 2150.0 2200.0 2250.0
Noise Figure versus Frequency Across Temperature

VCC=5.0V (2GHz Application Circuit)
6.0
5.0
4.0
Noise Figure (dB)
3.0
2.0
1.0 -40°C
25°C
85°C
0.0
1750.0 1800.0 1850.0 1900.0 1950.0 2000.0 2050.0 2100.0 2150.0 2200.0 2250.0
Frequency (MHz)


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RF3315Broad-

band High Lin-

Package Style: SOT89

 +41dBm Output IP3

Optimum Technology Matching® Applied

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

RoHS status based on EUDirective2002/95/EC (at time of this document revision).

VCC =5V, RFIN =-10dBm, Freq=900MHz, with

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

2 GND Ground connection.

4 GND Ground connection.

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

10:18:16 Sep 25, 2009

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

16:24:45 Sep 24, 2009

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

13:52:11 Sep 25, 2009

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

08:30:43 Sep 28, 2009

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

Typical Application Schematic for 400MHz to 700MHz Broadband Match

Typical Application Schematic for 800MHz to 1500MHz Broadband Match

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

Evaluation Board Schematic for 900MHz

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

PCB Land Pattern Recommendation

PCB Metal Land Pattern

Figure 1. PCB Metal Land Pattern (Top View)

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

PCB Solder Mask Pattern

A = 1.37 x 0.96 (mm) Typ.

Figure 2. PCB Solder Mask Pattern (Top View)

Thermal Pad and Via Design

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

MTTF versus Junction Temperature,

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

Noise Figure versus Frequency Across Temperature

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

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+41dBm Output IP3