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VBG and Mos Current Mirror Sensitivity Calculation
VBG and Mos Current Mirror Sensitivity Calculation
2⋅ I
g m ( Q 3) = , where Vt=26mV at room temperature.
VT
I I I I
VT VT VT VT
g m(Q 4) = = = ≅ , so the ratio of Gm between Q3
1 + I ⋅ R1 2.75uA ⋅ 30k 1 + 3.17 4
VT 1 + 26mV
and Q4 is:
2I
g m ( Q 3) V
= T =8
g m(Q 4) 1 I
⋅
4 VT
A small voltage variation of Vbg will roughly equal to a small voltage variation on node
Vx, therefore the total current through R2 changes by:
∆VX ∆VBG
∆I R 2 = ≅ = ∆I C ( Q 3) + ∆I C ( Q 4) ,
R2 R2
Since Gm(Q3) is 8 times of Gm(Q4), so the 8/9 parts of the ∆I R 2 current flow through
Q3, and 1/9 parts of the ∆I R 2 current flow through Q4. The M9 to M10 is a 2:1 mirror,
therefore the output current is:
4 1 1 1 ∆V
∆I OUT = ( ∆I R 2 − ∆I R 2 ) = ∆I R 2 = ⋅ BG , So the trans-conductance of VBG to Iout
9 9 3 3 R2
is:
∆I 1
Gm (VBG ) = OUT =
∆VBG 3R2
The M10 PMOS device is running 2.75uA current and it’s 4 squares (W=L=8um, M=4),
so the current density is roughly 2.75/4=0.6875uA per square. For the typical 0.35um
technology this means that (Vgs-Vt)/2=75mV approximately, which means that the pmos
Gm is about 1/3 the Gm of a PNP running the same bias current. Also, remember that
V
I R 2 = 3I = 8.25uA = X , so, VX = 8.25uA × 63k = 519.75mV , the trans-conductance of
R2
M10 is:
I 1 V 1 519.75mV 6.93 7
Gm ( M 10 ) = = ⋅ X = ⋅ = ≅ , so the ratio of
(Vgs − Vt ( pmos ) ) 3R2 75mV 3R2 75mV 3R2 3R2
2
the trans-conductance of M10 to VBG is as follows:
7
Gm ( M 10 ) 3R2
= =7
Gm (VBG ) 1
3R2
This means that 1mV mis-match of M9 and M10 mirror causes 7mV changes in VBG
voltage.
(15 ~ 30)mV ⋅ µm
∆Vt ( M 10,M 9) = = 1 ~ 2mV
8 × 8 × 4 µm
So, the Bandgap voltage will change by 7~14mV. This voltage should be considered in
the design of bandgap voltage trimming range. More important is that the Vt mismatch
will cause a T.C. in the bandgap voltage over temperature.
VBGcore
M9 M10
W=8 W=8
L=8 L=8
M=8 M=4 Iout M10
W=8
L=1
2I I M=1
VBG
Q3 Q4
M=1 M=12
R1
V=30K
VX R3
R2
V=63K
GROUND
GND