Slau 278 Ae

MSP430™ Hardware Tools
User's Guide
Literature Number: SLAU278AE

May 2009 – Revised November 2018
Contents
Preface ........................................................................................................................................ 9
1 Get Started Now! ................................................................................................................ 12
1.1 Kit Contents, MSP-TS430xx .............................................................................................. 13
1.2 Kit Contents, MSP-FET430xx ............................................................................................ 15
1.3 Kit Contents, MSP-FET .................................................................................................... 15
1.4 Kit Contents, MSP-FET430UIF ........................................................................................... 15
1.5 Kit Contents, MSP-FET430PIF ........................................................................................... 15
1.6 Kit Contents, eZ430-F2013 ............................................................................................... 15
1.7 Kit Contents, eZ430-T2012 ............................................................................................... 15
1.8 Kit Contents, eZ430-RF2500 ............................................................................................. 16
1.9 Kit Contents, eZ430-RF2500T ............................................................................................ 16
1.10 Kit Contents, eZ430-RF2500-SEH ....................................................................................... 16
1.11 Kit Contents, eZ430-Chronos-xxx ........................................................................................ 16
1.12 Kit Contents, FET430F6137RF900 ...................................................................................... 17
1.13 Kit Contents, EM430Fx1x7RF900 ....................................................................................... 17
1.14 Hardware Installation, MSP-FET and MSP-FET430UIF .............................................................. 17
1.15 Hardware Installation, MSP-TS430xxx, MSP-FET430Uxx, FET430F6137RF900, EM430Fx1x7RF900 ....... 18
1.16 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSPEXP430F5529........... 18
1.17 Important MSP430 Documents on the Web ............................................................................ 18
2 Design Considerations for In-Circuit Programming ................................................................ 19
2.1 Signal Connections for In-System Programming and Debugging ................................................... 20
2.2 External Power ............................................................................................................. 24
2.3 Bootloader (BSL) ........................................................................................................... 24
A Frequently Asked Questions and Known Issues .................................................................... 25
A.1 Hardware FAQs ............................................................................................................ 26
A.2 Known Issues ............................................................................................................... 28
B Hardware ........................................................................................................................... 29
B.1 MSP-TS430D8 .............................................................................................................. 31
B.2 MSP-TS430PW14 .......................................................................................................... 34
B.3 MSP-TS430L092 ........................................................................................................... 37
B.4 MSP-TS430L092 Active Cable ........................................................................................... 40
B.5 MSP-TS430PW20 .......................................................................................................... 43
B.6 MSP-TS430RHL20 ......................................................................................................... 47
B.7 MSP-TS430PW24 .......................................................................................................... 50
B.8 MSP-TS430RGE24A ...................................................................................................... 53
B.9 MSP-TS430DW28.......................................................................................................... 56
B.10 MSP-TS430PW28 .......................................................................................................... 59
B.11 MSP-TS430PW28A ........................................................................................................ 62
B.12 MSP-TS430RHB32A....................................................................................................... 65
B.13 MSP-TS430DA38 .......................................................................................................... 68
B.14 MSP-TS430QFN23x0...................................................................................................... 71
B.15 MSP-TS430RSB40......................................................................................................... 74
B.16 MSP-TS430RHA40A....................................................................................................... 77
B.17 MSP-TS430DL48 ........................................................................................................... 80
2 Contents SLAU278AE – May 2009 – Revised November 2018

Submit Documentation Feedback
Copyright © 2009–2018, Texas Instruments Incorporated
www.ti.com
B.18 MSP-TS430PT48 ........................................................................................................... 83

B.19 MSP-TS430PT48A ......................................................................................................... 87
B.20 MSP-TS430RGZ48B....................................................................................................... 91
B.21 MSP-TS430RGZ48C ...................................................................................................... 94
B.22 MSP-TS430PM64 .......................................................................................................... 97
B.23 MSP-TS430PM64A ....................................................................................................... 100
B.24 MSP-TS430PM64D....................................................................................................... 103
B.25 MSP-TS430PM64F ....................................................................................................... 106
B.26 MSP-TS430RGC64B ..................................................................................................... 109
B.27 MSP-TS430RGC64C ..................................................................................................... 112
B.28 MSP-TS430RGC64USB ................................................................................................. 116
B.29 MSP-TS430PN80 ......................................................................................................... 120
B.30 MSP-TS430PN80A ....................................................................................................... 123
B.31 MSP-TS430PN80B ....................................................................................................... 126
B.32 MSP-TS430PN80C ....................................................................................................... 129
B.33 MSP-TS430PN80USB ................................................................................................... 133
B.34 MSP-TS430PZ100 ........................................................................................................ 137
B.35 MSP-TS430PZ100A ...................................................................................................... 140
B.36 MSP-TS430PZ100B ...................................................................................................... 143
B.37 MSP-TS430PZ100C ...................................................................................................... 146
B.38 MSP-TS430PZ100D ...................................................................................................... 149
B.39 MSP-TS430PZ100E ...................................................................................................... 152
B.40 MSP-TS430PZ5x100 ..................................................................................................... 156
B.41 MSP-TS430PZ100USB .................................................................................................. 159
B.42 MSP-TS430PZ100AUSB ................................................................................................ 163
B.43 MSP-TS430PEU128...................................................................................................... 167
B.44 EM430F5137RF900 ...................................................................................................... 170
B.45 EM430F6137RF900 ...................................................................................................... 174
B.46 EM430F6147RF900 ...................................................................................................... 178
C Hardware Installation Guide ............................................................................................... 182
Revision History ........................................................................................................................ 183
SLAU278AE – May 2009 – Revised November 2018 Contents 3

www.ti.com
List of Figures
2-1. Signal Connections for 4-Wire JTAG Communication................................................................. 21
2-2. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F2xx,
MSP430G2xx, and MSP430F4xx Devices .............................................................................. 22
2-3. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by All MSP430 SBW-Capable
Devices That are Not Part of F2xx, G2xx, F4xx Families ............................................................. 23
B-1. MSP-TS430D8 Target Socket Module, Schematic .................................................................... 31
B-2. MSP-TS430D8 Target Socket Module, PCB ........................................................................... 32
B-3. MSP-TS430PW14 Target Socket Module, Schematic ................................................................ 34
B-4. MSP-TS430PW14 Target Socket Module, PCB ....................................................................... 35
B-5. MSP-TS430L092 Target Socket Module, Schematic .................................................................. 37
B-6. MSP-TS430L092 Target Socket Module, PCB ......................................................................... 38
B-7. MSP-TS430L092 Active Cable Target Socket Module, Schematic.................................................. 40
B-8. MSP-TS430L092 Active Cable Target Socket Module, PCB ......................................................... 41
B-9. UART BSL Signal Select .................................................................................................. 43
B-12. MSP-TS430RHL20 Target Socket Module, Schematic ............................................................... 47
B-13. MSP-TS430RHL20 Target Socket Module, PCB ...................................................................... 48
B-16. MSP-TS430RGE24A Target Socket Module, Schematic ............................................................. 53
B-17. MSP-TS430RGE24A Target Socket Module, PCB .................................................................... 54
B-18. MSP-TS430DW28 Target Socket Module, Schematic ................................................................ 56
B-19. MSP-TS430DW28 Target Socket Module, PCB ....................................................................... 57
B-22. MSP-TS430PW28A Target Socket Module, Schematic .............................................................. 62
B-23. MSP-TS430PW28A Target Socket Module, PCB (Red) .............................................................. 63
B-24. MSP-TS430RHB32A Target Socket Module, Schematic ............................................................. 65
B-25. MSP-TS430RHB32A Target Socket Module, PCB .................................................................... 66
B-26. MSP-TS430DA38 Target Socket Module, Schematic ................................................................. 68
B-27. MSP-TS430DA38 Target Socket Module, PCB ........................................................................ 69
B-28. MSP-TS430QFN23x0 Target Socket Module, Schematic ............................................................ 71
B-29. MSP-TS430QFN23x0 Target Socket Module, PCB ................................................................... 72
B-30. MSP-TS430RSB40 Target Socket Module, Schematic ............................................................... 74
B-31. MSP-TS430RSB40 Target Socket Module, PCB ...................................................................... 75
B-32. MSP-TS430RHA40A Target Socket Module, Schematic ............................................................. 77
B-33. MSP-TS430RHA40A Target Socket Module, PCB .................................................................... 78
B-34. MSP-TS430DL48 Target Socket Module, Schematic ................................................................. 80
B-35. MSP-TS430DL48 Target Socket Module, PCB ........................................................................ 81
B-36. MSP-TS430PT48 Target Socket Module, Schematic ................................................................. 83
B-37. MSP-TS430PT48 Target Socket Module, PCB ........................................................................ 84
B-38. MSP-TS430PT48A Target Socket Module, Schematic ............................................................... 87
B-39. MSP-TS430PT48A Target Socket Module, PCB ...................................................................... 88
B-40. MSP-TS430RGZ48B Target Socket Module, Schematic ............................................................. 91
B-41. MSP-TS430RGZ48B Target Socket Module, PCB .................................................................... 92
B-42. MSP-TS430RGZ48C Target Socket Module, Schematic ............................................................. 94
B-43. MSP-TS430RGZ48C Target Socket Module, PCB .................................................................... 95
4 List of Figures SLAU278AE – May 2009 – Revised November 2018

www.ti.com
B-44. MSP-TS430PM64 Target Socket Module, Schematic................................................................. 97

B-45. MSP-TS430PM64 Target Socket Module, PCB ........................................................................ 98
B-46. MSP-TS430PM64A Target Socket Module, Schematic ............................................................. 100
B-47. MSP-TS430PM64A Target Socket Module, PCB .................................................................... 101
B-48. MSP-TS430PM64D Target Socket Module, Schematic ............................................................. 103
B-49. MSP-TS430PM64D Target Socket Module, PCB .................................................................... 104
B-50. MSP-TS430PM64F Target Socket Module, Schematic ............................................................. 106
B-51. MSP-TS430PM64F Target Socket Module, PCB .................................................................... 107
B-52. MSP-TS430RGC64B Target Socket Module, Schematic ........................................................... 109
B-53. MSP-TS430RGC64B Target Socket Module, PCB .................................................................. 110
B-54. MSP-TS430RGC64C Target Socket Module, Schematic ........................................................... 113
B-55. MSP-TS430RGC64C Target Socket Module, PCB .................................................................. 114
B-56. MSP-TS430RGC64USB Target Socket Module, Schematic........................................................ 116
B-57. MSP-TS430RGC64USB Target Socket Module, PCB ............................................................... 117
B-58. MSP-TS430PN80 Target Socket Module, Schematic ............................................................... 120
B-59. MSP-TS430PN80 Target Socket Module, PCB ...................................................................... 121
B-60. MSP-TS430PN80A Target Socket Module, Schematic.............................................................. 123
B-61. MSP-TS430PN80A Target Socket Module, PCB ..................................................................... 124
B-62. MSP-TS430PN80B Target Socket Module, Schematic.............................................................. 126
B-63. MSP-TS430PN80B Target Socket Module, PCB ..................................................................... 127
B-64. MSP-TS430PN80C Target Socket Module, Schematic ............................................................. 129
B-65. MSP-TS430PN80C Target Socket Module, PCB .................................................................... 130
B-66. MSP-TS430PN80USB Target Socket Module, Schematic .......................................................... 133
B-67. MSP-TS430PN80USB Target Socket Module, PCB ................................................................. 134
B-68. MSP-TS430PZ100 Target Socket Module, Schematic .............................................................. 137
B-69. MSP-TS430PZ100 Target Socket Module, PCB ..................................................................... 138
B-70. MSP-TS430PZ100A Target Socket Module, Schematic ............................................................ 140
B-71. MSP-TS430PZ100A Target Socket Module, PCB ................................................................... 141
B-72. MSP-TS430PZ100B Target Socket Module, Schematic ............................................................ 143
B-73. MSP-TS430PZ100B Target Socket Module, PCB ................................................................... 144
B-74. MSP-TS430PZ100C Target Socket Module, Schematic ............................................................ 146
B-75. MSP-TS430PZ100C Target Socket Module, PCB ................................................................... 147
B-76. MSP-TS430PZ100D Target Socket Module, Schematic ............................................................ 149
B-77. MSP-TS430PZ100D Target Socket Module, PCB ................................................................... 150
B-78. MSP-TS430PZ100E Target Socket Module, Schematic ............................................................ 152
B-79. MSP-TS430PZ100E Target Socket Module, PCB ................................................................... 153
B-80. MSP-TS430PZ5x100 Target Socket Module, Schematic ........................................................... 156
B-81. MSP-TS430PZ5x100 Target Socket Module, PCB .................................................................. 157
B-82. MSP-TS430PZ100USB Target Socket Module, Schematic ......................................................... 159
B-83. MSP-TS430PZ100USB Target Socket Module, PCB ................................................................ 160
B-84. MSP-TS430PZ100AUSB Target Socket Module, Schematic ....................................................... 163
B-85. MSP-TS430PZ100AUSB Target Socket Module, PCB .............................................................. 164
B-86. MSP-TS430PEU128 Target Socket Module, Schematic ............................................................ 167
B-87. MSP-TS430PEU128 Target Socket Module, PCB ................................................................... 168
B-88. EM430F5137RF900 Target Board, Schematic ....................................................................... 170
B-89. EM430F5137RF900 Target board, PCB............................................................................... 171
B-91. EM430F6137RF900 Target Board, PCB .............................................................................. 175
SLAU278AE – May 2009 – Revised November 2018 List of Figures 5

www.ti.com
B-93. EM430F6147RF900 Target Board, PCB .............................................................................. 179
6 List of Figures SLAU278AE – May 2009 – Revised November 2018

www.ti.com
List of Tables
1-1. Individual Kit Contents, MSP-TS430xx .................................................................................. 13
B-1. MSP-TS430D8 Bill of Materials.......................................................................................... 33
B-2. MSP-TS430PW14 Bill of Materials....................................................................................... 36
B-3. MSP-TS430L092 Bill of Materials ........................................................................................ 39
B-4. MSP-TS430L092 JP1 Settings ........................................................................................... 41
B-5. MSP-TS430L092 Active Cable Bill of Materials ........................................................................ 42
B-7. MSP-TS430RHL20 Bill of Materials ..................................................................................... 49
B-9. MSP-TS430RGE24A Bill of Materials (BOM) .......................................................................... 55
B-10. MSP-TS430DW28 Bill of Materials ...................................................................................... 58
B-11. MSP-TS430PW28 Bill of Materials ...................................................................................... 61
B-12. MSP-TS430PW28A Bill of Materials ..................................................................................... 64
B-13. MSP-TS430RHB32A Bill of Materials ................................................................................... 67
B-14. MSP-TS430DA38 Bill of Materials ....................................................................................... 70
B-15. MSP-TS430QFN23x0 Bill of Materials .................................................................................. 73
B-16. MSP-TS430RSB40 Bill of Materials ..................................................................................... 76
B-17. MSP-TS430RHA40A Bill of Materials ................................................................................... 79
B-18. MSP-TS430DL48 Bill of Materials ....................................................................................... 82
B-19. MSP-TS430PT48 Bill of Materials ....................................................................................... 85
B-20. MSP-TS430PT48A Bill of Materials ...................................................................................... 89
B-21. MSP-TS430RGZ48B Bill of Materials ................................................................................... 93
B-22. MSP-TS430RGZ48C Bill of Materials ................................................................................... 96
B-23. MSP-TS430PM64 Bill of Materials ....................................................................................... 99
B-24. MSP-TS430PM64A Bill of Materials.................................................................................... 102
B-25. MSP-TS430PM64D Bill of Materials ................................................................................... 105
B-26. MSP-TS430PM64F Bill of Materials (BOM) ........................................................................... 108
B-27. MSP-TS430RGC64B Bill of Materials.................................................................................. 111
B-28. MSP-TS430RGC64C Bill of Materials ................................................................................. 115
B-29. MSP-TS430RGC64USB Bill of Materials .............................................................................. 118
B-30. MSP-TS430PN80 Bill of Materials ...................................................................................... 122
B-31. MSP-TS430PN80A Bill of Materials .................................................................................... 125
B-32. MSP-TS430PN80B Bill of Materials .................................................................................... 128
B-33. MSP-TS430PN80C Bill of Materials .................................................................................... 131
B-34. MSP-TS430PN80USB Bill of Materials ................................................................................ 135
B-35. MSP-TS430PZ100 Bill of Materials .................................................................................... 139
B-36. MSP-TS430PZ100A Bill of Materials ................................................................................... 142
B-37. MSP-TS430PZ100B Bill of Materials ................................................................................... 145
B-38. MSP-TS430PZ100C Bill of Materials .................................................................................. 148
B-39. MSP-TS430PZ100D Bill of Materials .................................................................................. 151
B-40. MSP-TS430PZ100E Bill of Materials ................................................................................... 154
B-41. MSP-TS430PZ5x100 Bill of Materials.................................................................................. 158
B-42. MSP-TS430PZ100USB Bill of Materials ............................................................................... 161
B-43. MSP-TS430PZ100AUSB Bill of Materials ............................................................................. 165
B-44. MSP-TS430PEU128 Bill of Materials .................................................................................. 169
B-45. EM430F5137RF900 Bill of Materials ................................................................................... 172
SLAU278AE – May 2009 – Revised November 2018 List of Tables 7

www.ti.com
8 List of Tables SLAU278AE – May 2009 – Revised November 2018

Preface
SLAU278AE – May 2009 – Revised November 2018
Read This First
This manual describes the hardware of the TI MSP-FET430 Flash Emulation Tool (FET). The FET is the
program development tool for the MSP430™ ultra-low-power microcontrollers. Both available interface
types, the parallel port interface and the USB interface, are described.
How to Use This Manual

Read and follow the instructions in Chapter 1. This section lists the contents of the FET and provides
instructions on installing the hardware and the software drivers. After you see how quick and easy it is to
use the development tools, TI recommends that you read all of this manual.
This manual describes the setup and operation of the FET but does not fully describe the MSP430
microcontrollers or the development software systems. For details of these items, see the appropriate TI
documents listed in Section 1.17.
This manual applies to the following tools:
• MSP-FET430PIF – debug interface with parallel port connection, for all MSP430 flash-based devices
• MSP-FET430UIF – debug interface with USB connection, for all MSP430 flash-based devices
• MSP-FET – successor to MSP-FET430UIF, debug interface with USB connection, for all MSP430
devices
• eZ430-F2013 – USB stick form factor interface with attached MSP430F2013 target, for all
MSP430F20xx, MSP430G2x01, MSP430G2x11, MSP430G2x21, and MSP430G2x31 devices
• eZ430-T2012 – three MSP430F2012 based target boards
• eZ430-RF2500 – USB stick form factor interface with attached MSP430F2274 and CC2500 target, for
all MSP430F20xx, MSP430F21x2, MSP430F22xx, MSP430G2x01, MSP430G2x11, MSP430G2x21,
and MSP430G2x31 devices
• eZ430-RF2500T – one MSP430F2274 and CC2500 target board including battery pack)
• eZ430-RF2500-SEH – USB stick form factor interface with attached MSP430F2274 and CC2500 target
and solar energy harvesting module
• eZ430-Chronos-xxx – USB stick form factor interface with CC430F6137 based development system
contained in a watch; includes <1 GHz RF USB access point
Stand-alone target-socket modules without debug interface are named as MSP-TS430TSxx.
Tools named as MSP-FET430Uxx contain the USB debug interface (MSP-FET430UIF) and the respective
target socket module MSP-TS430TSxx, where 'xx' is the same for both names. The following tools contain
also the USB debug interface (MSP-FET430UIF):
• FET430F5137RF900 – for CC430F513x devices in 48-pin RGZ packages (green PCB)
• FET430F6137RF900 – for CC430F612x and CC430F613x devices in 64-pin RGC packages (green
PCB)
These tools contain the most up-to-date materials available at the time of packaging. For the latest
materials (data sheets, user's guides, software, application information, and so on), visit the TI MSP430
website at www.ti.com/msp430 or contact your local TI sales office.
SLAU278AE – May 2009 – Revised November 2018 Read This First 9

Information About Cautions and Warnings www.ti.com
Information About Cautions and Warnings

This document may contain cautions and warnings.
CAUTION
This is an example of a caution statement.
A caution statement describes a situation that could potentially damage your
software or equipment.
WARNING
This is an example of a warning statement.
A warning statement describes a situation that could potentially
cause harm to you.
The information in a caution or a warning is provided for your protection. Read each caution and warning
carefully.
Related Documentation From Texas Instruments

MSP430 development tools documentation:
MSP Debuggers User's Guide
Code Composer Studio for MSP430 User's Guide
Code Composer Studio IDE
IAR Embedded Workbench for MSP430 User's Guide
IAR Embedded Workbench IDE
eZ430-F2013 Development Tool User's Guide
eZ430-RF2480 Demonstration Kit User's Guide
eZ430-RF2500 Development Tool User's Guide
eZ430-RF2500-SEH Development Tool User's Guide
eZ430-Chronos Development Tool User's Guide
Spectrum Analyzer (MSP-SA430-SUB1GHZ) User's Guide
MSP-EXP430F5529 Experimenter Board User's Guide
MSP-EXP430F5438 Experimenter Board User's Guide
MSP-EXP430G2 LaunchPad Development Kit User's Guide
MSP Gang Programmer (MSP-GANG) User's Guide
MSP430 Gang Programmer (MSP-GANG430) User's Guide
MSP430 device user's guides:
MSP430x1xx Family User's Guide
MSP430x5xx and MSP430x6xx Family User's Guide
10 Read This First SLAU278AE – May 2009 – Revised November 2018

www.ti.com If You Need Assistance
CC430 Family User's Guide

MSP430FR57xx Family User's Guide
MSP430FR58xx, MSP430FR59xx, and MSP430FR6xx Family User's Guide
If You Need Assistance

Support for the MSP430 devices and the FET development tools is provided by the Texas Instruments
Product Information Center (PIC). Contact information for the PIC can be found on the TI website at
www.ti.com/support. The Texas Instruments E2E™ Community support forums for the MSP430 provide
open interaction with peer engineers, TI engineers, and other experts. Additional device-specific
information can be found on the MSP430 website.
SLAU278AE – May 2009 – Revised November 2018 Read This First 11

Chapter 1
Get Started Now!
This chapter lists the contents of the FET and provides instruction on installing the hardware.
Topic ........................................................................................................................... Page
1.1 Kit Contents, MSP-TS430xx ................................................................................. 13

1.2 Kit Contents, MSP-FET430xx .............................................................................. 15
1.3 Kit Contents, MSP-FET ....................................................................................... 15
1.4 Kit Contents, MSP-FET430UIF .............................................................................. 15
1.5 Kit Contents, MSP-FET430PIF .............................................................................. 15
1.6 Kit Contents, eZ430-F2013 ................................................................................... 15
1.7 Kit Contents, eZ430-T2012 ................................................................................... 15
1.8 Kit Contents, eZ430-RF2500 ................................................................................ 16
1.9 Kit Contents, eZ430-RF2500T ............................................................................... 16
1.10 Kit Contents, eZ430-RF2500-SEH ......................................................................... 16
1.11 Kit Contents, eZ430-Chronos-xxx ......................................................................... 16
1.12 Kit Contents, FET430F6137RF900 ........................................................................ 17
1.13 Kit Contents, EM430Fx1x7RF900 .......................................................................... 17
1.14 Hardware Installation, MSP-FET and MSP-FET430UIF ............................................. 17
1.15 Hardware Installation, MSP-TS430xxx, MSP-FET430Uxx, FET430F6137RF900,
EM430Fx1x7RF900 ............................................................................................. 18
1.16 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739,
MSPEXP430F5529 .............................................................................................. 18
1.17 Important MSP430 Documents on the Web............................................................ 18
12 Get Started Now! SLAU278AE – May 2009 – Revised November 2018

www.ti.com Kit Contents, MSP-TS430xx
1.1 Kit Contents, MSP-TS430xx

• One READ ME FIRST document
• One 32.768-kHz crystal from Micro Crystal (except MSP-TS430PW24)
• One target socket module
• A 2×7-pin male JTAG connector is also present on the PCB (see different setup for L092)
• MSP430 device samples (see Table 1-1 for sample type)
Table 1-1. Individual Kit Contents, MSP-TS430xx

Part Number Socket Type Supported Devices Included Devices Headers and Comment
MSP-TS430D8 8-pin D 1 x MSP430G2210ID and Two PCB 1×4-pin headers
MSP430G2210, MSP430G2230
(green PCB) (TSSOP ZIF) 1 x MSP430G2230ID (two male and two female)
MSP430F20xx, MSP430G2x01,
MSP-TS430PW14 14-pin PW Four PCB 1×7-pin headers
MSP430G2x11, MSP430G2x21, 2 × MSP430F2013IPW
(green PCB) (TSSOP ZIF) (two male and two female)
MSP430G2x31
Four PCB 1×7-pin headers
(two male and two female)
A "Micro-MaTch" 10-pin female
MSP-TS430L092 14-pin PW connector is also present on the
MSP430L092 2 × MSP430L092IPW
(green PCB) (TSSOP ZIF) PCB which connects the kit with an
'Active Cable' PCB. This 'Active
Cable' PCB is connected by 14-pin
JTAG cable with the FET430UIF.
MSP-TS430PW20 20-pin PW MSP430FR2311IPW20, None. Free samples can be Four PCB 1×12-pin headers
(green PCB) (TSSOP ZIF) MSP430FR2311IPW16 ordered in the TI Store. (two male and two female)
MSP-TS430RHL20 20-pin RHL MSP430FR2522IRHL, None. Free samples can be Four PCB 1×10-pin headers
(green PCB) (VQFN ZIF) MSP430FR2422IRHL ordered in the TI Store. (two male and two female)
MSP430AFE2xx 2 × MSP430AFE253IPW
MSP-TS430RGE24A 24-pin RGE None. Free samples can be Four PCB 1×6-pin headers
MSP430FR2433IRGE
(red PCB) (QFN ZIF) ordered in the TI Store. (two male and two female)
MSP430F11x1, MSP430F11x2,
MSP430F12x, MSP430F12x2,
MSP-TS430DW28 28-pin DW Four PCB 1×12-pin headers
MSP430F21xx 2 × MSP430F123IDW
(green PCB) (SSOP ZIF) (two male and two female)
Supports devices in 20- and 28-pin DA
packages
MSP430F11x1, MSP430F11x2,
MSP430F12x, MSP430F12x2, 2 × MSP430F2132IPW
MSP430F21xx
MSP430F20xx, MSP430G2xxx in 14-, 20-,
MSP-TS430PW28A 28-pin PW Four PCB 1×12-pin headers
and 28-pin PW packages, MSP430TCH5E 2 × MSP430G2452IPW20
(red PCB) (TSSOP ZIF) (two male and two female)
in PW package
MSP-TS430RHB32A 32-pin RHB Eight PCB 1×8-pin headers
MSP430i204x 2 × MSP430i2041TRHB
(red PCB) (QFN ZIF) (four male and four female)
2 × MSP430F2274IDA
MSP-TS430DA38 38-pin DA MSP430F22xx, MSP430G2x44, Four PCB 1×19-pin headers
2 × MSP430G2744IDA
(green PCB) (TSSOP ZIF) MSP430G2x55 (two male and two female)
2 × MSP430G2955IDA
MSP-TS430QFN23x0 40-pin RHA Eight PCB 1×10-pin headers
MSP430F23x0 2 × MSP430F2370IRHA
(green PCB) (QFN ZIF) (four male and four female)
MSP-TS430RSB40 40-pin RSB Eight PCB 1×10-pin headers
MSP430F51x1, MSP430F51x2 2 × MSP430F5172IRSB
(green PCB) (QFN ZIF) (four male and four female)
MSP-TS430RHA40A 40-pin RHA Eight PCB 1×10-pin headers
MSP430FR572x, MSP430FR573x 2 × MSP430FR5739IRHA
(red PCB) (QFN ZIF) (four male and four female)
MSP-TS430DL48 48-pin DL Four PCB 2×12-pin headers
MSP430F42x0 2 × MSP430F4270IDL
MSP-TS430PT48 48-pin PT None. Free samples can be Eight PCB 1×12-pin headers
MSP430FR235x
(green PCB) (QFP ZIF) ordered in the TI Store. (four male and four female)
MSP-TS430PT48A 48-pin PT None. Free samples can be Eight PCB 1×12-pin headers
MSP430FR247x
(red PCB) (QFP ZIF) ordered in the TI Store. (four male and four female)
MSP-TS430RGZ48B 48-pin RGZ Eight PCB 1×12-pin headers
MSP430F534x 2 × MSP430F5342IRGZ
(blue PCB) (QFN ZIF) (four male and four female)
MSP-TS430RGZ48C 48-pin RGZ Eight PCB 1×12-pin headers
MSP430FR58xx and MSP430FR59xx 2 × MSP430FR5969IRGZ
(black PCB) (QFN ZIF) (four male and four female)
SLAU278AE – May 2009 – Revised November 2018 Get Started Now! 13

Kit Contents, MSP-TS430xx www.ti.com
Table 1-1. Individual Kit Contents, MSP-TS430xx (continued)

Part Number Socket Type Supported Devices Included Devices Headers and Comment
MSP430F13x, MSP430F14x,
MSP430F14x1, MSP430F15x,
MSP430F23x, MSP430F24x, TS Kit: 2 × MSP430F2618IPM;
MSP-TS430PM64 64-pin PM Eight PCB 1×16-pin headers
MSP430F24xx, MSP430F261x, FET Kit: 2 × MSP430F417IPM
(green PCB) (QFP ZIF) (four male and four female)
MSP430F41x, MSP430F42x, and 2 × MSP430F169IPM
MSP430F42xA, MSP430FE42x,
MSP430FE42xA, MSP430FE42x2,
MSP430FW42x
MSP-TS430PM64A 64-pin PM Eight PCB 1×16-pin headers
MSP430F41x2 2 × MSP430F4152IPM
(red PCB) (QFP ZIF) (four male and four female)
MSP-TS430PM64D 64-pin PM Eight PCB 1×16-pin headers
MSP430FR413x, MSP430FR203x 2 × MSP430FR4133IPM
(white PCB) (QFP ZIF) (four male and four female)
MSP-TS430PM64F 64-pin PM None. Free samples can be Eight PCB 1×16-pin headers
MSP430FR6972
(purple PCB) (QFP ZIF) ordered in the TI Store. (four male and four female)
MSP-TS430RGC64B 64-pin RGC Eight PCB 1×16-pin headers
MSP430F530x 2 × MSP430F5310IRGC
(blue PCB) (QFN ZIF) (four male and four female)
MSP-TS430RGC64C 64-pin RGC Eight PCB 1×16-pin headers
MSP430F523x, MSP430F524x, 2 × MSP430F5229IRGC
(black PCB) (QFN ZIF) (four male and four female)
MSP430F525x
MSP-TS430RGC64USB 64-pin RGC MSP430F550x, MSP430F551x, 2 × MSP430F5510IRGC or 2 Eight PCB 1×16-pin headers
(green PCB) (QFN ZIF) MSP430F552x × MSP430F5528IRGC (four male and four female)
MSP-TS430PN80 80-pin PN MSP430F43x, MSP430F43x1, Eight PCB 1×20-pin headers
2 × MSP430FG439IPN
(green PCB) (QFP ZIF) MSP430FG43x, MSP430F47x, (four male and four female)
MSP430FG47x
MSP-TS430PN80A 80-pin PN Eight PCB 1×20-pin headers
MSP430F532x 2 × MSP430F5329IPN
MSP-TS430PN80B 80-pin PN Eight PCB 1×20-pin headers
MSP430F599x 2 × MSP430F5994IPN
(blue PCB) (QFP ZIF) (four male and four female)
MSP-TS430PN80C 80-pin PN None. Free samples can be Eight PCB 1×20-pin headers
MSP430FR6043
(black PCB) (QFP ZIF) ordered in the TI Store. (four male and four female)
MSP-TS430PN80USB 80-pin PN Eight PCB 1×20-pin headers
MSP430F552x, MSP430F551x 2 × MSP430F5529IPN
MSP-TS430PZ100 100-pin PZ Eight PCB 1×25-pin headers
MSP430F44x, MSP430FG461x, 2 × MSP430FG4619IPZ
MSP430F47xx
MSP-TS430PZ100A 100-pin PZ Eight PCB 1×25-pin headers
MSP430F471xx 2 × MSP430F47197IPZ
MSP-TS430PZ100B 100-pin PZ Eight PCB 1×25-pin headers
MSP430F67xx 2 × MSP430F6733IPZ
(blue PCB) (QFP ZIF) (four male and four female)
MSP-TS430PZ100C 100-pin PZ MSP430F645x, MSP430F643x, Eight PCB 1×25-pin headers
2 × MSP430F6438IPZ
(black PCB) (QFP ZIF) MSP430F535x, MSP430F533x (four male and four female)
MSP-TS430PZ100D 100-pin PZ Eight PCB 1×25-pin headers
MSP430FR698x(1), MSP430FR688x(1) 2 × MSP430FR6989IPZ
(white PCB) (QFP ZIF) (four male and four female)
MSP-TS430PZ100E 100-pin PZ Eight PCB 1×25-pin headers
MSP430FR604x(1), MSP430FR603x(1) 2 × MSP430FR6047IPZ
(yellow PCB) (QFP ZIF) (four male and four female)
MSP-TS430PZ5x100 100-pin PZ MSP430F543x, MSP430BT5190, Eight PCB 1×25-pin headers
2 × MSP430F5438IPZ
(green PCB) (QFP ZIF) MSP430SL5438A (four male and four female)
MSP-TS430PZ100USB 100-pin PZ MSP430F665x, MSP430F663x, Eight PCB 1×25-pin headers
2 × MSP430F6638IPZ
(green PCB) (QFP ZIF) MSP430F563x (four male and four female)
MSP-TS430PZ100AUSB 100-pin PZ None. Free samples can be Eight PCB 1×25-pin headers
MSP430FG662x, MSP430FG642x
(blue PCB) (QFP ZIF) ordered in the TI Store. (four male and four female)
Four PCB 1x26-pin headers
MSP-TS430PEU128 128-pin PEU (two male and two female)
MSP430F674x, MSP430F677x1, 2 × MSP430F67791IPEU
(green PCB) (QFP ZIF) and four PCB 1x38-pin headers
MSP430F676x1, MSP430F674x1
(two male and two female)
See the device data sheets for device specifications. Device errata can be found in the respective device
product folder on the web provided as a PDF document. Depending on the device, errata may also be
found in the device bug database.

www.ti.com Kit Contents, MSP-FET430xx
1.2 Kit Contents, MSP-FET430xx

• One MSP-FET430UIF USB interface module. This is the unit that has a USB B-connector on one end
of the case, and a 2×7-pin male connector on the other end of the case.
• One USB cable
• One 32.768-kHz crystal from Micro Crystal, if the board has an option to use the quartz.
• A 2×7-pin male JTAG connector is also present on the PCB (see different setup for L092)
• One 14-Pin JTAG conductor cable
• One small box containing two MSP430 device samples (See table for Sample Type)
• One target socket module. To determine the devices used for each board and a summary of the board,
see Table 1-1. The name of MSP-TS430xx board can be derived from the name of the MSP-FET430xx
kit; for example, the MSP-FET430U28A kit contains the MSP-TS430PW28A board.
See the device data sheets for device specifications. Device errata can be found in the respective device
product folder on the web provided as a PDF document. Depending on the device, errata may also be
found in the device bug database at www.ti.com/sc/cgi-bin/buglist.cgi.
1.3 Kit Contents, MSP-FET

• One MSP-FET interface module
• One USB cable
• One 14-conductor cable
1.4 Kit Contents, MSP-FET430UIF

• One MSP-FET430UIF interface module
• One USB cable
1.5 Kit Contents, MSP-FET430PIF

• One MSP-FET430PIF interface module
NOTE: This part is obsolete and is not recommended to use in new design.
1.6 Kit Contents, eZ430-F2013

• One QUICK START GUIDE document
• One eZ430-F2013 development tool including one MSP430F2013 target board
1.7 Kit Contents, eZ430-T2012

• Three MSP430F2012-based target boards

Kit Contents, eZ430-RF2500 www.ti.com
1.8 Kit Contents, eZ430-RF2500

• One eZ430-RF2500 CD-ROM
• One eZ430-RF2500 development tool including one MSP430F2274 and CC2500 target board
• One eZ430-RF2500T target board
• One AAA battery pack with expansion board (batteries included)
1.9 Kit Contents, eZ430-RF2500T

• One eZ430-RF2500T target board
1.10 Kit Contents, eZ430-RF2500-SEH

• One MSP430 development tool CD containing documentation and development software
• One eZ430-RF USB debugging interface
• Two eZ430-RF2500T wireless target boards
• One SEH-01 solar energy harvester board
1.11 Kit Contents, eZ430-Chronos-xxx

'433, '868, '915
• One ez430-Chronos emulator
• One screwdriver
• Two spare screws
eZ430-Chronos-433:
– One 433-MHz eZ430-Chronos watch (battery included)
– One 433-MHz eZ430-Chronos access point
eZ430-Chronos-868:
eZ430-Chronos-915:

www.ti.com Kit Contents, FET430F6137RF900
1.12 Kit Contents, FET430F6137RF900

• One legal notice
• One MSP-FET430UIF interface module
• Two EM430F6137RF900 target socket modules. This is the PCB on which is soldered a CC430F6137
device in a 64-pin RGC package. A 2×7-pin male connector is also present on the PCB.
• Two CC430EM battery packs
• Four AAA batteries
• Two 868-MHz or 915-MHz antennas
• Two 32.768-kHz crystals
• 18 PCB 2x4-pin headers
• One USB cable
• One 14-pin JTAG conductor cable
1.13 Kit Contents, EM430Fx1x7RF900

• One legal notice
• Two target socket module
MSP-EM430F5137RF900: Two EM430F5137RF900 target socket modules. This is the PCB on which
is soldered a CC430F5137 device in a 48-pin RGZ package. A 2×7-pin male connector is also present
on the PCB
is soldered a CC430F6137 device in a 64-pin RGC package. A 2×7-pin male connector is also present
on the PCB
is soldered a CC430F6147 device in a 64-pin RGC package. A 2×7-pin male connector is also present
on the PCB
• Two CC430EM battery packs
• Four AAA batteries
• Two 868- or 915-MHz antennas
• Two 32.768-kHz crystals
• 18 PCB 2×4-pin headers
1.14 Hardware Installation, MSP-FET and MSP-FET430UIF

See the MSP Debuggers User’s Guide.

Hardware Installation, MSP-TS430xxx, MSP-FET430Uxx, FET430F6137RF900, EM430Fx1x7RF900 www.ti.com
1.15 Hardware Installation, MSP-TS430xxx, MSP-FET430Uxx, FET430F6137RF900,

EM430Fx1x7RF900
Follow these steps to install the hardware for the MSP-FET430Uxx and MSP-TS430xxx tools:
1. Install the IDE (CCS or IAR) you plan to use before connecting USB-FET interface to PC. The IDE
installation installs drivers automatically.
2. Use the USB cable to connect the USB-FET interface module to a USB port on the PC. The USB FET
should be recognized, as the USB device driver is installed automatically. If the driver has not been
installed yet, the install wizard starts. Follow the prompts and point the wizard to the driver files.
3. Connect the MSP-FET430PIF or MSP-FET430UIF debug interface to the appropriate port of the PC.
Use the 14-conductor cable to connect the FET interface module to the supplied target socket module.
4. Ensure that the MSP430 device is securely seated in the socket and that its pin 1 (indicated with a
circular indentation on the top surface) aligns with the "1" mark on the PCB.
5. Ensure that the two jumpers (LED and VCC) near the 2×7-pin male connector are in place. Appendix B
includes illustrations of the target socket modules and their parts.
1.16 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739,

MSPEXP430F5529
To install the eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSP-EXP430F5529 tools:
1. Install the IDE (CCS or IAR) you plan to use before connecting USB-FET interface to PC. The IDE
installation installs drivers automatically.
2. Use the USB cable to connect the USB-FET interface module to a USB port on the PC. The USB FET
should be recognized, as the USB device driver is installed automatically. If the driver has not been
installed yet, the install wizard starts. Follow the prompts and point the wizard to the driver files.
1.17 Important MSP430 Documents on the Web

The primary sources of MSP430 information are the device-specific data sheet and user's guide. The
MSP430 website (www.ti.com/msp430) contains the most recent version of these documents.
PDF documents describing the CCS tools (CCS IDE, the assembler, the C compiler, the linker, and the
librarian) are in the msp430\documentation folder. A Code Composer Studio specific Wiki page (FAQ) is
available, and the Texas Instruments E2E Community support forums for the MSP430 and Code
Composer Studio v5 provide additional help besides the product help and Welcome page.
PDF documents describing the IAR tools (Workbench C-SPY, the assembler, the C compiler, the linker,
and the librarian) are in the common\doc and 430\doc folders. Supplements to the documents (that is, the
latest information) are available in HTML format in the same directories. An IAR specific tool page is also
available.

Chapter 2
Design Considerations for In-Circuit Programming
This chapter presents signal requirements for in-circuit programming of the MSP430.
Topic ........................................................................................................................... Page
2.1 Signal Connections for In-System Programming and Debugging ............................. 20

2.2 External Power................................................................................................... 24
2.3 Bootloader (BSL)................................................................................................ 24
SLAU278AE – May 2009 – Revised November 2018 Design Considerations for In-Circuit Programming 19
Signal Connections for In-System Programming and Debugging www.ti.com
2.1 Signal Connections for In-System Programming and Debugging

MSP-FET430PIF, MSP-FET430UIF, MSP-GANG, MSP-GANG430, MSP-PRGS430
With the proper connections, the debugger and an FET hardware JTAG interface (such as the MSP-
FET430PIF and MSP-FET430UIF) can be used to program and debug code on the target board. In
addition, the connections also support the MSP-GANG430 or MSP-PRGS430 production programmers,
thus providing an easy way to program prototype boards, if desired.
Figure 2-1 shows the connections between the 14-pin FET interface module connector and the target
device required to support in-system programming and debugging for 4-wire JTAG communication.
Figure 2-2 shows the connections for 2-wire JTAG mode (Spy-Bi-Wire). The 4-wire JTAG mode is
supported on most MSP430 devices, except devices with low pin counts (for example, MSP430G2230).
The 2-wire JTAG mode is available on selected devices only. See the Code Composer Studio for MSP430
User's Guide or IAR Embedded Workbench Version 3+ for MSP430 User's Guide for information on which
interface method can be used on which device.
The connections for the FET interface module and the MSP-GANG, MSP-GANG430, or MSP-PRGS430
are identical. Both the FET interface module and MSP-GANG430 can supply VCC to the target board
(through pin 2). In addition, the FET interface module, MSP-GANG, and MSP-GANG430 have a VCC-
sense feature that, if used, requires an alternate connection (pin 4 instead of pin 2). The VCC-sense feature
senses the local VCC present on the target board (that is, a battery or other local power supply) and
adjusts the output signals accordingly. If the target board is to be powered by a local VCC, then the
connection to pin 4 on the JTAG should be made, and not the connection to pin 2. This uses the VCC-
sense feature and prevents any contention that might occur if the local on-board VCC were connected to
the VCC supplied from the FET interface module, MSP-GANG or the MSP-GANG430. If the VCC-sense
feature is not necessary (that is, if the target board is to be powered from the FET interface module, MSP-
GANG, or MSP-GANG430), the VCC connection is made to pin 2 on the JTAG header, and no connection
is made to pin 4. Figure 2-1 and Figure 2-2 show a jumper block that supports both scenarios of supplying
VCC to the target board. If this flexibility is not required, the desired VCC connections may be hard-wired to
eliminate the jumper block. Pins 2 and 4 must not be connected at the same time.
The connection to the JTAG connector RST pin of Figure 2-1 is required when programming or debugging
a device that supports 2-wire JTAG communication, even when using 4-wire JTAG communication mode
on these devices. However, this connection is optional on devices that do not support 2-wire JTAG
communication. The MSP430 development tools and device programmers perform a target reset by
issuing a JTAG command to gain control over the device. However, if this is unsuccessful, the RST signal
of the JTAG connector may be used by the development tool or device programmer as an additional way
to assert a device reset.
20 Design Considerations for In-Circuit Programming SLAU278AE – May 2009 – Revised November 2018
www.ti.com Signal Connections for In-System Programming and Debugging
Important to connect VCC

MSP430Fxxx
J1 (see Note A)
VCC/AVCC/DVCC
J2 (see Note A)
C2 C3
R1 10 µF 0.1 µF
47 kW
(see Note B)
JTAG
RST/NMI
VCC TOOL TDO/TDI TDO/TDI
2 1
VCC TARGET TDI/VPP TDI/VPP
4 3
TMS
6 5 TMS
TEST/VPP TCK
8 7 TCK
GND
10 9
RST (see Note D)
12 11
14 13
TEST/VPP (see Note C)

C1 VSS/AVSS/DVSS
10 nF/2.2 nF
(see Notes B and E)
A If a local target power supply is used, make connection J1. If power from the debug or programming adapter is used,
make connection J2.
B The configuration of R1 and C1 for the RST/NMI pin depends on the device family. See the respective MSP430 family
user's guide for the recommended configuration.
C The TEST pin is available only on MSP430 family members with multiplexed JTAG pins. See the device-specific data
sheet to determine if this pin is available.
D The connection to the JTAG connector RST pin is required when programming or debugging a device that supports
2-wire JTAG communication, even when using 4-wire JTAG communication mode on these devices. However, this
connection is optional on devices that do not support 2-wire JTAG communication.
E When using a device that supports 2-wire JTAG communication in 4-wire JTAG mode, the upper limit for C1 should
not exceed 2.2 nF. This applies to both TI FET interface modules (LPT and USB FET).
Some EVMs use a value of 1.1 nF to enable high-speed SBW communication.
Figure 2-1. Signal Connections for 4-Wire JTAG Communication
Signal Connections for In-System Programming and Debugging www.ti.com

MSP430Fxxx
J1 (see Note A)
VCC/AVCC/DVCC
J2 (see Note A)
C2 C3
10 µF 0.1 µF
R1
47 kΩ
JTAG
VCC TOOL TDO/TDI

2 1 RST/NMI/SBWTDIO
VCC TARGET
4 3
6 5
TEST/VPP TCK
8 7
GND
10 9
12 11 R2
14 13 330Ω
TEST/SBWTCK
C1
2.2 nF VSS/AVSS/DVSS
(See Note B)
A If a local target power supply is used, make connection J1. If power from the debug or programming adapter is used,
make connection J2.
B The device RST/NMI/SBWTDIO pin is used in 2-wire mode for bidirectional communication with the device during
JTAG access, and any capacitance that is attached to this signal may affect the ability to establish a connection with
the device. The upper limit for C1 is 2.2 nF when using current TI tools.
C R2 protects the JTAG debug interface TCK signal from the JTAG security fuse blow voltage that is supplied by the
TEST/VPP pin during the fuse blow process. If fuse blow functionality is not needed, R2 is not required (populate 0 Ω)
and do not connect TEST/VPP to TEST/SBWTCK.
Figure 2-2. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F2xx,
MSP430G2xx, and MSP430F4xx Devices
www.ti.com Signal Connections for In-System Programming and Debugging

MSP430Fxxx
J1 (see Note A)
VCC/AVCC/DVCC
J2 (see Note A)
C2 C3
R1 10 µF 0.1 µF
47 kΩ
JTAG
VCC TOOL TDO/TDI

2 1 RST/NMI/SBWTDIO
VCC TARGET
4 3
6 5
TCK
8 7
GND
10 9
12 11
14 13
TEST/SBWTCK
C1
2.2 nF VSS/AVSS/DVSS
(See Note B)
A Make connection J1 if a local target power supply is used, or make connection J2 if the target is powered from the
debug or programming adapter.
B The device RST/NMI/SBWTDIO pin is used in 2-wire mode for bidirectional communication with the device during
JTAG access, and any capacitance that is attached to this signal may affect the ability to establish a connection with
the device. The upper limit for C1 is 2.2 nF when using current TI tools.
Figure 2-3. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by All MSP430 SBW-
Capable Devices That are Not Part of F2xx, G2xx, F4xx Families
NOTE: On some Spy-Bi-Wire capable MSP430 devices, TEST/SBWTCK is very sensitive to rising
signal edges that can cause the test logic to enter a state where an entry sequence (either
2‑wire or 4-wire) is not recognized correctly and JTAG access stays disabled. Unintentional
edges on SBWTCK can occur when the JTAG connector is connected to the target device.
External Power www.ti.com
2.2 External Power

See the MSP Debuggers User’s Guide.
2.3 Bootloader (BSL)

The JTAG pins provide access to the memory of the MSP430 and CC430 devices. On some devices,
these pins are shared with the device port pins, and this sharing of pins can complicate a design (or
sharing may not be possible). As an alternative to using the JTAG pins, most MSP430Fxxx devices
contain a program (a "bootloader", formerly knows as the "bootstrap loader") that permits the flash
memory to be erased and programmed using a reduced set of signals. MSP430 Programming With the
Bootloader (BSL) describes this interface. See the MSP430 website for the application reports and a list of
MSP430 BSL tool developers.
TI suggests that MSP430Fxxx customers design their circuits with the BSL in mind (that is, TI suggests
providing access to these signals by, for example, a header).
See FAQ Hardware #10 for a second alternative to sharing the JTAG and port pins.
Appendix A
Frequently Asked Questions and Known Issues
This appendix presents solutions to frequently asked questions regarding the MSP-FET430 hardware.
Topic ........................................................................................................................... Page
A.1 Hardware FAQs .................................................................................................. 26

A.2 Known Issues .................................................................................................... 28
SLAU278AE – May 2009 – Revised November 2018 Frequently Asked Questions and Known Issues 25
Hardware FAQs www.ti.com
A.1 Hardware FAQs

1. MSP430F22xx Target Socket Module (MSP-TS430DA38) – Important Information
Due to the large capacitive coupling introduced by the device socket between the adjacent signals
XIN/P2.6 (socket pin 6) and RST/SBWTDIO (socket pin 7), in-system debugging can disturb the
LFXT1 low-frequency crystal oscillator operation (ACLK). This behavior applies only to the Spy-Bi-Wire
(2-wire) JTAG configuration and only to the period while a debug session is active.
Workarounds:
• Use the 4-wire JTAG mode debug configuration instead of the Spy-Bi-Wire (2-wire) JTAG
configuration. This can be achieved by placing jumpers JP4 through JP9 accordingly.
• Use the debugger option "Run Free" that can be selected from the Advanced Run drop-down
menu (at top of Debug View). This prevents the debugger from accessing the MSP430 device
while the application is running. Note that, in this mode, a manual halt is required to see if a
breakpoint was hit. See the IDE documentation for more information on this feature.
• Use an external clock source to drive XIN directly.
2. With current interface hardware and software, there is a weakness when adapting target boards
that are powered externally. This leads to an accidental fuse check in the MSP430 device. This is
valid for PIF and UIF but is seen most often on the UIF. A solution is being developed.
Workarounds:
• Connect the RST/NMI pin to the JTAG header (pin 11). LPT and USB tools are able to pull the
RST line, which also resets the device internal fuse logic.
• Use the debugger option "Release JTAG On Go" that can be selected from the IDE drop-down
menu. This prevents the debugger from accessing the MCU while the application is running. Note
that in this mode, a manual halt is required to see if a breakpoint was hit. See the IDE
documentation for more information on this feature.
• Use an external clock source to drive XIN directly.
3. The 14-conductor cable that connects the FET interface module and the target socket module must
not exceed 8 inches (20 centimeters) in length.
4. The signal assignment on the 14-conductor cable is identical for the parallel port interface and the
USB FET.
5. To use the on-chip ADC voltage references, the capacitor must be installed on the target socket
module. See the schematic of the target socket module to populate the capacitor according to the data
sheet of the device.
6. To use the charge pump on the devices with LCD+ Module, the capacitor must be installed on
the target socket module. See the schematic of the target socket module to populate the capacitor
according to the data sheet of the device.
7. Crystals or resonators Q1 and Q2 (if applicable) are not provided on the target socket module.
For MSP430 devices that contain user-selectable loading capacitors, see the device and crystal data
sheets for the value of capacitance.
8. Crystals or resonators have no effect upon the operation of the tool and the CCS debugger or
C-SPY (as any required clocking and timing is derived from the internal DCO and FLL).
9. On devices with multiplexed port or JTAG pins, to use these pin in their port capability:
For CCS: "Run Free" (in Run pulldown menu at top of Debug View) must be selected.
For C-SPY: "Release JTAG On Go" must be selected.
10. As an alternative to sharing the JTAG and port pins (on low pin count devices), consider using
an MSP430 device that is a "superset" of the smaller device. A very powerful feature of the
MSP430 is that the family members are code and architecturally compatible, so code developed on
one device (for example, one without shared JTAG and port pins) ports effortlessly to another
(assuming an equivalent set of peripherals).
26 Frequently Asked Questions and Known Issues SLAU278AE – May 2009 – Revised November 2018
www.ti.com Hardware FAQs
11. Information memory may not be blank (erased to 0xFF) when the device is delivered from TI.
Customers should erase the information memory before its first use. Main memory of packaged
devices is blank when the device is delivered from TI.
12. The device current is higher then expected. The device current measurement may not be accurate
with the debugger connected to the device. For accurate measurement, disconnect the debugger.
Additionally some unused pins of the device should be terminated. See the Connection of Unused Pins
table in the device's family user's guide.
13. MSP-FETv2 – SBW may have issues with some target socket boards. Check the capacitance of
the RST (SBWTDIO) line. If there is no capacitance, you may need to add at least 100 pF to the RST
signal. The additional capacity on the RST line ensures that the timing between the SBWTDIO and
SBWTCK signals is synchronized.
14. The following ZIF sockets are used in the FET tools and target socket modules:
• 8-pin device (D package): Yamaichi IC369-0082
• 14-pin device (PW package): Enplas OTS-14-065-01
• 14-pin package for 'L092 (PW package): Yamaichi IC189-0142-146
• 24-pin package (PW package): Enplas OTS-24(28)-0.65-02
• 28-pin device (DW package): Wells-CTI 652 D028
• 28-pin device (PW package): Enplas OTS-28-0.65-01
• 38-pin device (DA package): Yamaichi IC189-0382-037
• 40-pin device (RHA package): Enplas QFN-40B-0.5-01
• 40-pin device (RSB package): Enplas QFN-40B-0.4
• 48-pin device (RGZ package): Yamaichi QFN11T048-008 A101121-001
• 48-pin device (DL package): Yamaichi IC51-0482-1163
• 64-pin device (PM package): Yamaichi IC51-0644-807
• 64-pin device (RGC package): Yamaichi QFN11T064-006
• 80-pin device (PN package): Yamaichi IC201-0804-014
• 100-pin device (PZ package): Yamaichi IC201-1004-008
• 128-pin device (PEU package): Yamaichi IC500-1284-009P
Enplas: www.enplas.com
Wells-CTI (Sensata Technologies): www.sensata.com
Yamaichi: www.yeu.com
SLAU278AE – May 2009 – Revised November 2018 Frequently Asked Questions and Known Issues 27
Known Issues www.ti.com
A.2 Known Issues
MSP-FET430UIF Current detection algorithm of the UIF firmware
Problem Description If high current is detected, the ICC monitor algorithm stays in a loop of frequently
switching on and off the target power supply. This power switching puts some MSP430
devices such as the MSP430F5438 in a state that requires a power cycle to return the
device to JTAG control.
A side issue is that if the UIF firmware has entered this switch on and switch off loop, it
is not possible to turn off the power supply to the target by calling MSP430_VCC(0). A
power cycle is required to remove the device from this state.
Solution IAR KickStart and Code Composer Essentials that have the MSP430.dll version
2.04.00.003 and higher do not show this problem. Update the software development tool
to this version or higher to update the MSP-FET430UIF firmware.
MSP-FET430PIF Some PCs do not supply 5 V through the parallel port
Problem Description Device identification problems with modern PCs, because the parallel port often does not
deliver 5 V as was common with earlier hardware.
1. When connected to a laptop, the test signal is clamped to 2.5 V.
2. When the external VCC becomes less than 3 V, up to 10 mA is flowing in the adapter
through pin 4 (sense).
Solution Measure the voltage level of the parallel port. If it is too low, provide external 5 V to the
VCC pads of the interface. The jumper on a the target socket must be switched to
external power.
28 Frequently Asked Questions and Known Issues SLAU278AE – May 2009 – Revised November 2018
Appendix B
Hardware
This appendix contains information relating to the FET hardware, including schematics, PCB pictorials,
and bills of materials (BOMs). All other tools, such as the eZ430 series, are described in separate product-
specific user's guides.
Topic Section
MSP-TS430D8 Section B.1
MSP-TS430PW14 Section B.2
MSP-TS430L092 Section B.3
MSP-TS430L092 Active Cable Section B.4
MSP-TS430RHL20 Section B.6
MSP-TS430RGE24A Section B.8
MSP-TS430DW28 Section B.9
MSP-TS430PW28A Section B.11
MSP-TS430RHB32A Section B.12
MSP-TS430DA38 Section B.13
MSP-TS430QFN23x0 Section B.14
MSP-TS430RSB40 Section B.15
MSP-TS430RHA40A Section B.16
MSP-TS430DL48 Section B.17
MSP-TS430PT48 Section B.18
MSP-TS430PT48A Section B.19
MSP-TS430RGZ48B Section B.20
MSP-TS430RGZ48C Section B.21
MSP-TS430PM64 Section B.22
MSP-TS430PM64A Section B.23
MSP-TS430PM64D Section B.24
MSP-TS430PM64F Section B.25
MSP-TS430RGC64B Section B.26
MSP-TS430RGC64C Section B.27
MSP-TS430RGC64USB Section B.28
MSP-TS430PN80 Section B.29
MSP-TS430PN80A Section B.30
MSP-TS430PN80B Section B.31
MSP-TS430PN80C Section B.32
MSP-TS430PN80USB Section B.33
MSP-TS430PZ100 Section B.34
MSP-TS430PZ100A Section B.35
MSP-TS430PZ100B Section B.36
MSP-TS430PZ100C Section B.37
SLAU278AE – May 2009 – Revised November 2018 Hardware 29

Appendix B www.ti.com
Topic Section
MSP-TS430PZ100D Section B.38
MSP-TS430PZ100E Section B.39
MSP-TS430PZ5x100 Section B.40
MSP-TS430PZ100USB Section B.41
MSP-TS430PZ100AUSB Section B.42
MSP-TS430PEU128 Section B.43
EM430F5137RF900 Section B.44
30 Hardware SLAU278AE – May 2009 – Revised November 2018

31
MSP-TS430D8
Hardware
SBW
14 13 Ext_PWR
12 11
10 9
1
2
3
8 7 SBWTCK J3
6 5
4 3
2 1 RST/SBWTDIO
Figure B-1. MSP-TS430D8 Target Socket Module, Schematic

ext 3 TST/SBWTCK GND
Vcc 2 VCC
int 1
J5 R2 R5
47K
330R
GND
TST/SBWTCK RST/SBWTDIO

C8
2.2nF
2 to measure supply current DNP
1 J6 GND
C5
+
C7 100nF
10uF/10V
GND
FE4L FE4H
U1
1 VCC430 1 8 GND 8
DVCC DVSS
2 P1.2 2 7 TST/SBWTCK 7
P1.2/TA1/A2 TST/SBWTCK
3 P1.5 3 6 RST/SBWTDIO 6
P1.5/TA0/A5/SCLK RST/SBWTDIO
4 P1.6 4 5 P1.7 5
P1.6/TA1/A6/SDO/SCL P1.7/A7/SDI/SDA
J1 MSP-TS430D8 J2
Socket: YA MAICHI
Type: IC369-0082
R3

2
1
D1 330R
green
J4
GND

MSP-TS430D8 Ta rget Socket Board
MSP-TS430D8
TITLE: MSP-TS430D8
Document Number: REV:
1.0
Date: 28.07.201
1 11:03:35 Sheet: /11
www.ti.com
B.1
MSP-TS430D8 www.ti.com
Jumper J5
1-2 (int): Power supply from JTAG interface
14-pin connector for debugging 2-3 (ext): External power supply
in Spy-Bi-Wire mode only
(4-Wire JTAG not available)
D1
Connector J3
LED connected to P1.2
External power connector
Jumper J5 to “ext”
Jumper J4
Open to disconnect LED
Jumper J6
Orient Pin 1 of MSP430 device Open to measure current
Figure B-2. MSP-TS430D8 Target Socket Module, PCB

www.ti.com MSP-TS430D8
Table B-1. MSP-TS430D8 Bill of Materials

No. per
Position Ref Des Description Digi-Key Part No. Comment
Board
1 J4, J6 2 2-pin header, male, TH SAM1035-02-ND place jumper on header
2 J5 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2
3 SBW 1 10-pin connector, male, TH HRP10H-ND
4 J3 1 3-pin header, male, TH SAM1035-03-ND
5 C8 1 2.2nF, CSMD0805 Buerklin 53 D 292
6 C7 1 10uF, 10V, 1210ELKO 478-3875-1-ND
7 R5 1 47K, 0805 541-47000ATR-ND
8 C5 1 100nF, CSMD0805 311-1245-2-ND
9 R2, R3 2 330R, 0805 541-330ATR-ND
DNP: headers enclosed with kit.
10 J1, J2 2 4-pin header, TH SAM1029-04-ND
Keep vias free of solder.
10,1 J1, J2 1 4-pin socket, TH SAM1029-04-ND DNP: receptacles enclosed with kit.
11 U1 1 SO8 Socket: Type IC369-0082 Manuf.: Yamaichi
12 D1 1 red, LED 0603
DNP: enclosed with kit. Is supplied
13 MSP430 2 MSP430G2210, MSP430G2230
by TI
MSP-TS430D8 Rev.
14 PCB 1 50,0mmx44,5mm
1.0

www.ti.com

JTAG
14 13 Ext_PWR
12 11 RST/NMI
10 9
1
2
3
8 7 SBWTCK J3
6 5 TMS
4 3 TDI
2 1 TDO/SBWTDIO
Figure B-3. MSP-TS430PW14 Target Socket Module, Schematic

ext 3 TEST/SBWTCK GND
Vcc 2 VCC
int 1
J5 R2 R5
47K
330R
GND JTAG -> 3 3 3 3 3 3
2 TEST/SBWTCK 2 RST/SBWTDIO 2 P1.7/TDO 2 P1.6/TDI 2 P1.5/TMS 2 P1.4/TCK
1 1 1 1 1 1

SBW -> J7 J8 J9 J10 J11 J12
C8
2.2nF
2 to measure supply current DNP JTAG-Mode selection:
1 J6 GND
4-wire JTAG: Set jumpers J7 to J12 to position 2-3
2-wire "SpyBiWire": Set jumpers J7 to J12 to position 2-1
C5
+
C7 100nF
10uF/10V
1 VCC430 1 14 GND 14
2 P1.0 2 13 XIN 13
12pF C2 XOUT 3 P1.1 3 12 XOUT 12
DNP 4 P1.2 4 11 TEST/SBWTCK 11
5 P1.3 5 10 RST/SBWTDIO 10
Q1 6 P1.4/TCK 6 9 P1.7/TDO 9
DNP 7 P1.5/TMS 7 8 P1.6/TDI 8
12pF C1 XIN J1 C3 J2
DNP 100nF Socket: ENPLAS
DNP Type: OTS-14-065
R3
2
1
D1 330R
green GND
J4
GND
MSP-TS430PW14
MSP-TS430PW14 Target Socket Board

TITLE: MSP-TS430PW14
MSP-TS430PW14
2.0
Hardware
Date: 7/16/2007 8:22:36 AM Sheet: 1/1
B.2
34
www.ti.com MSP-TS430PW14
Jumper J5
Connector JTAG 1-2 (int): Power supply from JTAG interface
For JTAG Tool 2-3 (ext): External power supply
Connector J3
D1 Jumper J5 to "ext"
Jumpers J7 to J12
Jumper J4 Close 1-2 to debug in Spy-Bi-Wire mode.
Open to disconnect LED Close 2-3 to debug in 4-wire JTAG mode.
Orient Pin 1 of MSP430 device Jumper J6

Open to measure current
Figure B-4. MSP-TS430PW14 Target Socket Module, PCB

MSP-TS430PW14 www.ti.com
Table B-2. MSP-TS430PW14 Bill of Materials

No. per
Board
1 C1, C2 0 12pF, SMD0805 DNP
2 C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND
3 C3, C5 1 100nF, SMD0805 478-3351-2-ND DNP: C3
4 C8 0 2.2nF, SMD0805 DNP
5 D1 1 green LED, SMD0603 475-1056-2-ND
DNP: Headers and receptacles
enclosed with kit. Keep vias free of
solder
6 J1, J2 0 7-pin header, TH
SAM1029-07-ND : Header
SAM1213-07-ND : Receptacle
J3, J5, J7,
Place jumpers on headers J5, J7, J8,
7 J8, J9, J10, 8 3-pin header, male, TH SAM1035-03-ND
J9, J10, J11, J12; Pos 1-2
J11, J12
8 J4, J6 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
9 9 Jumper 15-38-1024-ND Place on: J5, J7-J12; Pos 1-2
14-pin connector, male,
10 JTAG 1 HRP14H-ND
TH
Micro Crystal MS1V-T1K
12 Q1 0 Crystal 32.768kHz, C(Load) = DNP: keep vias free of solder
12.5pF
13 R2, R3 2 330 Ω, SMD0805 541-330ATR-ND
15 R5 1 47k Ω, SMD0805 541-47000ATR-ND
16 U1 1 Socket: OTS-14-0.65-01 Manuf.: Enplas
17 PCB 1 56 x 53 mm 2 layers
For example, 3M
Adhesive Approximately 6mm width,
18 4 Bumpons Part No. SJ- Apply to corners at bottom side
plastic feet 2mm height
5302
19 MSP430 2 MSP430F2013IPW DNP: enclosed with kit, supplied by TI

www.ti.com MSP-TS430L092
B.3 MSP-TS430L092
Figure B-5. MSP-TS430L092 Target Socket Module, Schematic

MSP-TS430L092 www.ti.com
Settings of the MSP-TS430L092 Target Socket

Figure B-6 shows the PCB layout of the MSP-TS430L092 target socket. The following pinning is
recommended:
• JP1 is write enable for the EPROM. If this is not set, the EPROM can only be read.
• JP2 and JP3 connect device supply with boost converter. They can be opened to measure device
current consumption. For default operation, they should be closed.
Connector J3
Jumper JP1
Jumper JP3
Write enable for EPROM
Orient pin 1 of
MSP430 device
Figure B-6. MSP-TS430L092 Target Socket Module, PCB

www.ti.com MSP-TS430L092
Table B-3. MSP-TS430L092 Bill of Materials

No. Per
Pos. Ref Des No. Description Digi-Key Part No. Comment
Board
1 C1, C2 2 330nF, SMD0603
2 C5 1 100n, SMD0603
3 C6 1 10u, SMD0805
4 C10 1 100n, SMD0603
5 EEPROM1 1 M95512 SO08 (SO8) ST Micro M95160R Digikey: 497-8688-1-ND
DNP: headers and receptacles
enclosed with kit. Keep vias
free of solder.
9 J4, J5 2 FE4L, FE4H 4 pol. Stiftreihe DNP; Keep vias free of solder.
Reichelt: MicroMaTch-
11 J13 1 MICRO_STECKV_10
Connector: MM FL 10G
12 JP1, JP2,JP3 3 2-pin header, male, TH SAM1035-02-ND place jumper on header
15 L1 1 33uH, SMD0806 LQH2MCN330K02L Farnell: 151-5557
16 LED1, LED4 2 LEDCHIPLED_0603 Farnell: 1686065
17 Q2 1 BC817-16LT1SMD BC817-16LT1SMD SOT23-BEC
18 R0, R6, R7 3 2K7, SMD0603
19 R1 1 1k, SMD0603
20 R2 1 47k, SMD0603
R4,R5, R8,
21 6 10k, SMD0603
R10, RC, RD
22 RA 1 3.9k, SMD0603
23 RB 1 6.8k, SMD0603
14 Pin Socket - IC189-0142-
24 U1 1 Manuf. Yamaichi
146
DNP: Enclosed with kit. Is
22 MSP430 2 MSP430L092PWR
supplied by TI.

MSP-TS430L092 Active Cable www.ti.com
B.4 MSP-TS430L092 Active Cable
Figure B-7. MSP-TS430L092 Active Cable Target Socket Module, Schematic

www.ti.com MSP-TS430L092 Active Cable
Figure B-8 shows the PCB layout for the Active Cable. The following pinning is possible:
• JP1 has two jumpers (Jumper 1 and Jumper 2) that can be set as shown in Table B-4.
Table B-4. MSP-TS430L092 JP1 Settings

Jumper 1 Jumper 2 Description
Off Off The active cable has no power and does not function.
The active cable receives power from target socket. For this option, the
Off On
target socket must have its own power supply.
On Off The active cable receives power from the JTAG connector.
The JTAG connector powers the active cable and the target socket. For
On On this option, the target socket must not have its own power source, as this
would cause a not defined state.
• JP2 is for reset. For the standard MSP-TS430L092, this jumper must be set. It sets the reset pin to
high and can also control it. Without this jumper on the MSP-TS430L092, reset is set to zero.
JP2
Connector JTAG
For JTAG Tool
JP1
Figure B-8. MSP-TS430L092 Active Cable Target Socket Module, PCB

MSP-TS430L092 Active Cable www.ti.com
Table B-5. MSP-TS430L092 Active Cable Bill of Materials

No. Per
Pos. Ref Des Description Digi-Key Part No. Comment
Board
C1, C3, C5,
1 4 100nF, SMD0603
C6
2 C2, C4 2 1uF, SMD0805
3 R1, R10 2 10K, SMD0603
4 R2 1 4K7, SMD0603
R5, R6, R7,
5 4 100, SMD0603
R9
6 R8 1 680k, SMD0603
7 R11, R15 2 1K, SMD0603
8 R12 0 SMD0603 DNP
9 R13 0 SMD0603 DNP
10 R14 1 0, SMD0603
11 IC1 1 SN74AUC1G04DBVR Manu: TI
12 IC2, IC3, IC4 3 SN74AUC2G125DCTR Manu: TI
Reichelt: MicroMaTch-
13 J2 1 MICRO_STECKV_10
Connector: MM FL 10G
Put jumper on Position 1 and
14 JP1 1 2x2 Header JP2Q
2. Do not mix direction.
15 JP2 1 2-pin header, male, TH SAM1035-02-ND place jumper on header
16 JTAG 1 14-pin connector, male, TH HRP14H-ND
BC817-25LT1SMD, SOT23- Digi-Key: BC817-
17 Q1 1
BEC 25LT1GOSCT-ND
18 U1, U2 2 TLVH431IDBVR SOT23-5 Manu: TI

B.5 MSP-TS430PW20
The MSP-TS430PW20 microcontroller development board supports the MSP430FR23x and
MSP430FR21x FRAM devices in both 20-pin and 16-pin TSSOP (TI package code PW) packages. No
microcontroller devices are included in the MSP-TS430PW20 kit, but can be ordered from the TI Store.
The MSP-TS430PW20 microcontroller development board has two jumpers on header J11 that direct the
UART BSL signals, depending on which device is being used (see Figure B-9).
Figure B-9. UART BSL Signal Select
• GROUP2: Jumpers on 3-5 and 4-6 for MSP430FR231x PW16

• GROUP1: Jumpers on 1-3 and 2-4 for all other compatible devices, including MSP430FR231x PW20

www.ti.com

A B C D E F G H I
6 6

TP3
JTAG
RXD/SIMO 14 13 Jumpers JP3 to JP8 GND
TXD/SOMI/SDA12 11 RST/NMI Close 1-2 to debug in Spy-Bi-Wire mode.
SPICLK/SCL 10 9 Close 2-3 to debug in 4-wire JTAG mode.
8 7 TCK/SBWTCK
6 5 TMS
4 3 TDI BSL Tool Select: J2
3
2
1
2 1 TDO/SBWTDIO Open = BSL Connector
ext 3 Closed = JTAG Connector
5 Vcc
int
2
1
VCC Ext_PWR
5
J1 GND

TEST/SBWTCK1 JP13 DNP
JP3 JP4 SW1 JP5 JP6 JP7 JP8 BSL
1
2
2 3 3 EVQ11 3 3 3 3 SPICLK/SCL P1.3 9 10
R2
0R
1 JTAG -> 2 TEST/SBWTCK 2 RST/SBWTDIO DNP 2 PIN15 2 PIN16 2 P1.5/TMS 2 P1.4/TCK JP14 TEST/SBWTCK 7 8
JP1 1 1 1 1 1 1 5 6
SBW -> R4 C5
1
2
DVCC RXD/SIMO RXD 3 4
R3
0R
47k 1.1nF JP15 TXD/SOMI/SDA1 1 2
GND P1.3
1
2
TXD/SOMI/SDA GND
JP16
P1.2 1 I2C RST/SBWTDIO
2
TDX 3 UART
JP17
JP18
2 2
4 1 1 If external supply voltage:
remove R3 and add R2 (0 Ohm)
4
R7 R15
10k 10k
DVCC
C11
100nF
JP11
GND PW20
PIN15 1 2 PIN16
TDX 3 4 RXD
PIN14 5 6 PIN15
3 SAM1029-10-ND/1-10 U1 J4 PW16 3
1 P1.1 1 P1.2/UCB0SIMO/UCB0SDA/TB0TRG/OA0-/A2/VEREF-
P1.1/UCB0CLK/ACLK/C1/A1 20 P1.2 20
DVCC
DVSS 2 P1.0 2 P1.0/UCB0STE/SMCLK/C0/A0/VEREF+ P1.3/UCB0SOMI/UCB0SCL/OA0O/A319 P1.3 19

0R R13 3 TEST/SBWTCK 3 TEST/SBWTCK P1.4/UCA0STE/TCK/OA0+/A4 18 P1.4/TCK 18
DNP
4 RST/SBWTDIO 4 RST/NMI/SBWTDIO P1.5//UCA0CLK/TMS/TRI0O/A5 17 P1.5/TMS 17

TP1TP2
5 DVCC 5 DVCC 16
P1.6/UCA0RXD/UCA0SOMI/TB0.1/TDI/TCLK/TRI0-/A6 PIN16 16
6 DVSS 6 15 PIN15 15
SW2
DVSS P1.7/UCA0TXD/UCA0SIMO/TB2.0/TD0/TRI0+/A7/VREF+
7 XIN 7 P2.7/TB0CLK/XIN P2.0/TB1.1/CO 14 PIN14 14
8 XOUT 8 P2.6/MCLK/XOUT P2.1/TB1.2 13 13
R14DNP 9 9 IPW16
P1.3 P2.5/UCB0SOMI/UCB0SCL P2.2/UCB0STE/TB1CLK 12 12
10 10 P2.4/UCB0SIMO/UCB0SDA P2.3/UCB0CLK/TB1TRG 11 11
R1 330R IPW20
P1.0 J3 MSP430FR231XIPW20 Socket: Enplas OTS-20S-0.65-007 SAM1029-10-ND/11-20
D1
2
1
green
JP9 DNP 12p DVCC
1uF/10V
XOUT
2 DNP
R5 330R
P1.1 XIN C8 C6 C7 2
D2 DNP
2
1
yellow DNP 100nF

DNP
R9
0R
JP2
XTLGND
R6 330R
P1.2 DNP QUARZ5
Q2
R8
0R
DNP
D3 2
GND
1
red DNP C9
DNP 12p
JP10
GND
Title: MSP-TS430PW20
1 Target Socket Board for MSP430FR231x devices 1
File: MSP-TS430PW20
MSP-TS430PW20
Date: 11/27/2015 12:49:07 PM Rev.: 1.1 Page 1/1
Hardware
A3
A B C D E F G H I
44
Connector BSL Connector JTAG

For Bootloader Tool For JTAG Tool
10 14
1 1
2 2 Jumper J1
Connector J2 2-3 (ext): External power supply
Jumper J1 to "ext"
Jumper JP1
Open to measure current JP11
Jumpers JP3 to JP8
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Orient Pin 1 of MSP430 device
Jumpers JP9, JP2, JP10

Open to disconnect LEDs
D1 to D3
LEDs connected to P1.0 to P1.2
SW1
Close to reset


No. Per
Board
1 PCB 1 90.0 x 92.5 mm "MSP-TS430PW20" Rev. 1.1 2 layers, green solder mask
JP1, JP9,
2 JP13, JP14, 5 2-pin header, male, TH SAM1035-02-ND place jumper on header
JP15
3 JP17, JP18 2 2-pin header, male, TH SAM1035-02-ND place jumper on one pin only
4 JP2, JP10 2 2-pin header, male, TH SAM1035-02-ND DNP, keep pads free of solder
5 J1 1 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-2
JP3, JP4, JP5,
6 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-2
JP6, JP7, JP8
7 JP16 1 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3
PW20: Place jumpers on pins
1-3 and 2-4
9 JP11 1 2x3pin header, male, TH SAM1034-03-ND
PW16: Place jumpers on pins
3-5 and 4-6
10 R2, R8, R9 3 0R, 0805 541-0.0ATR-ND DNP
11 R3, R13 2 0R, 0805 541-0.0ATR-ND
12 C5 1 1.1nF, CSMD0805 490-1623-2-ND
13 C7 1 1uF/10V, CSMD0805 490-1702-2-ND
14 R7, R15 1 10k, 0805 541-10KATR-ND
15 R4 1 47k, 0805 541-47KATR-ND
16 C6, C11 2 100nF, CSMD0805 490-1666-1-ND
17 C8, C9 2 12p, DNP, CSMD0805 BC1257TR-ND DNP
18 R1 1 330R, 0805 541-330ATR-ND
19 R5, R6 2 330R, 0805 541-330ATR-ND DNP
20 R14 1 47k, 0805 541-47KATR-ND DNP
21 SW2 1 EVQ-11L05R P8079STB-ND DNP, Keep vias free of solder
22 SW1 1 EVQ-11L05R P8079STB-ND DNP, Keep vias free of solder
DNP: headers are enclosed
23 J3, J4 2 10-pin header, TH SAM1029-10-ND with kit.
DNP: Receptacles are
24 J3, J4 2 10-pin receptacle, TH SAM1213-10-ND enclosed with kit.
25 TP1, TP2, TP3 3 Test point DNP, keep pads free of solder
26 BSL 1 10-pin connector, male, TH HRP10H-ND
28 IC1 1 Socket: OTS-20S-0.65-007 Manuf. Enplas
DNP: Free samples can be
29 IC1 1 MSP430FR2311IPW20
ordered in the TI Store
DNP: Crystal is enclosed with
30 Q2 1 4MHz Crystal 4MHz Buerklin: 78D134
kit
MSV3V-T1R (32.768kHz / DNP: Crystal is enclosed with
31 Q2 1
20ppm / 12.5pF) kit
green LED, HSMG-C170
32 D1 1 516-1434-1-ND Avago, Farnell 5790852
DIODE0805
33 D3 1 red LED, DIODE0805 DNP
34 D2 1 yellow LED, DIODE0805 DNP
Rubber stand
35 4 Buerklin: 20H1724 apply to corners at bottom side
off

47
MSP-TS430RHL20
Hardware
1 2 3 4 5 6
Ext_PWR
VCC BSL If external supply voltage:
BSL_SCL 9 10 remove R3 and add R4 (0 ohm)
UART BSL Connection
3
2
1
BSL_RX R19 JTAG TEST/SBWTCK 7 8

0 R20 14 13 GND 5 6
3
BSL_SDA BSL_TX 12 11 RST/NMI BSL_RX 3 4 RST/SBWTDIO BSLRX 1 2 BSL_RX
0 10 9 J2 BSL_SDA BSL_TX 1 2 BSLTX 3 4 BSL_TX TP3
BSL_SCL R21 8 7 TCK/SBWTCK TSW-103-07-G-S R3
4 TP4
0 6 5 TMS AWHW-10G-0202-T 0 SW5
4 3 TDI
R4
Figure B-12. MSP-TS430RHL20 Target Socket Module, Schematic

2 1 TDO/SBWTDIO
GND DNP I2C BSL Connection
A SBH11-PBPC-D07-ST-BK A
1
J1 BSLSCL 1 2 BSL_SCL
ext 3 GND BSLSDA 3 4 BSL_SDA
TP1
2 VCC TP2
VCC 2
1 SW4
int TEST/SBWTCK1
TSW-103-07-G-S I2C Pullups
R17 BSLSDA
DVCC 1 2 4.7k
3 4
JP9 JP10 SW2 JP5 JP6 JP7 JP8 R16 BSLSCL
VCC Current
3 3 3 3 3 3 SW3 4.7k
Measurement JTAG ->
JP1 1 1 EVQ-11L05R 1 1 1 1
SBW -> By default the UART BSL is connected
1
2 DVCC TSW-103-07-G-S TSW-103-07-G-S C5 TSW-103-07-G-S TSW-103-07-G-S TSW-103-07-G-S TSW-103-07-G-S
R7 and the I2C BSL and the I2C pull-ups are disconnected
DVCC

TSW-102-07-G-S 47k
1100pF
DVSS
B B
C8
XOUT_ext R9 XOUT DVCC VREG
DNP
DNP C7 C6 C1
2
10µF 0.1µF 1µF

Q1
DNP
1
C9 DVSS DVSS
XIN_ext R8 XIN HFGND Connection by via
DNP
DNP
DVSS
IC1
1 P1.1/UCB0CLK/ACLK/A1/VREF+/CAP1.1 1 20 P1.2/UCB0SIMO/UCB0SDA/SMCLK/A2/Veref-/CAP1.2 BSLSDA 10
2 P1.0 P1.0/UCB0STE/A0/Veref+/CAP1.0 2 19 P1.3/UCB0SOMI/UCB0SCL/MCLK/A3/CAP1.3 BSLSCL 9
3 TEST/SBWTCK TEST/SBWTCK 3 18 VREG 8
4 RST/SBWTDIO RST/NMI/SBWTDIO 4 17 P1.4/UCA0TXD/UCA0SIMO/TA0.1/TCK/CAP0.0 P1.4/TCK BSLTX 7
5 DVCC DVCC 5 16 P1.5/UCA0RXD/UCA0SOMI/TA0.2/TMS/CAP0.1 P1.5/TMS BSLRX 6
6 DVSS DVSS 6 15 P1.6/UCA0CLK/TA0CLK/TDI/TCLK/CAP0.2 P1.6/TDI 5
7 XIN_ext XIN P2.1/UCA0RXD/XIN 7 14 P1.7/UCA0STE/TDO/CAP0.3 P1.7/TDO 4
C 8 XOUT_ext XOUT P2.0/UCA0TXD/XOUT 8 13 P2.2/TA1.1/SYNC/A4 P2.2 3 C
9 P2.6/UCB0SOMI/UCB0SCL 9 12 P2.3/TA1.2/UCB0STE/A5 P2.3 2
10 P2.5/UCB0SIMO/UCB0SDA/A7 10 11 P2.4/TA1CLK/UCB0CLK/A6 1
J3 J4

TP6
GND
DVCC
R10
0
SW1 R13
TP5
DNP
P2.2
EVQ-11L05R
D2
1 2 R2 P2.3
MSP-TS430RHL20
200
2
1

Blue
JP12
TSW-102-07-G-S
D D1 D
2 1 R1 P1.0
330
2
1
Green
DVSS JP11 Orderable: EVM_orderable Designed for:Public Release Mod. Date: 8/3/2017
TSW-102-07-G-S TID #: N/A Project Title: MSP-TS430RHL20
Number: Rev: 1.0 Sheet Title:
Texas Instruments and/or its licensors do not warrant curacy
the acor completeness of this specification or any tion
informa
contained therein. Texas Instruments and/or its
sors
licen
do not SVN Rev: Version control disabled Assembly Variant:[No Variations] Sheet:1 of 2
warrant that this design will meet the specifications,
be suitable
will for your application or fit for any particular
rpose, pu
or will operate in an implementation. Texas Instrume
nts and/or its Drawn By: File: MSP-TS430RHL20_V1.0.SchDoc Size: B http://www.ti.com
licensors do not warrant that the design is productiony. You
worth
should completely validate and test your design mentation
imple to confirm the system functionality for your
icatio
appl Engineer: M. Pridgen Contact: http://www.ti.com/support © Texas Instruments 2017
1 2 3 4 5 6
www.ti.com
B.6
MSP-TS430RHL20 www.ti.com
Jumper J1
1-2 (Debugger): Power supply from JTAG interface Connector JTAG For Connector BLS
2-3 (External): External power supply JTAG Tool For Bootloader Tool
Connector J2
Jumper J1 to External BSL Interface Switches
Select which BSL interface to
connect to connector BSL
Jumper JP1
Jumpers JP5 to JP10

Close 1-2 to debug in Spy-Bi Wire mode I2C pullup enable switch
Close 2-3 to debug in 4-wire JTAG mode Switch On to connect I2C pullup
resistors
Jumpers JP11, JP12

Open to disconnect LEDs D1 and D2
LEDs D1, D2
LEDs connector to P1.0 and P2.3
Figure B-13. MSP-TS430RHL20 Target Socket Module, PCB

www.ti.com MSP-TS430RHL20
Table B-7. MSP-TS430RHL20 Bill of Materials

Item No. Designator Quantity Description Supplier Part Number Note
1 !PCB 1 Printed Circuit Board
Header(Shrouded), 2.54mm,
2 BSL 1 AWHW-10G-0202-T-ND
5x2, Gold, TH
CAP, CERM, 1 µF, 10 V, ±10%,
3 C1 1 490-1695-1-ND
X7R, 0805
CAP, CERM, 1100 pF, 50 V,
4 C5 1 490-1623-1-ND
±5%, C0G/NP0, 0805
CAP, CERM, 0.1 µF, 50 V,
5 C6 1 490-1666-1-ND
±10%, X7R, 0805
CAP, CERM, 10 µF, 16 V,
6 C7 1 478-5165-1-ND
±10%, X5R, 0805
CAP, CERM, 22 pF, 50 V, ±5%,
7 C8, C9 0 490-3608-1-ND DNP
C0G/NP0, 0805
8 D1 1 LED, Green, SMD 754-1939-1-ND
9 D2 1 LED, Blue, SMD 732-4982-1-ND
Bumpon, Cylindrical, 0.312 X
10 H5, H6, H7, H8 4 SJ5746-0-ND
0.200, Black
11 IC1 1 Socket, QFN-20, 0.5 mm Pitch use IC564-020-130 socket
J1, J2, JP5, JP6, JP7,
12 8 Header, 100mil, 3x1, Gold, TH SAM1029-03-ND
JP8, JP9, JP10
DNP: Headers are enclosed
13 J3, J4 2 Header, 100mil, 10x1, Gold, TH SAM1029-10-ND
in kit. Keep vias free of solder
Receptacle, 100mil, 10x1, Gold,
14 J3, J4 2 SAM1213-12-ND enclosed in kit. Keep vias
TH
free of solder
15 JP1, JP11, JP12 3 Header, 100mil, 2x1, Gold, TH SAM1029-02-ND
Header (shrouded), 100 mil,
16 JTAG 1 S9170-ND
7x2, Gold, TH
Crystal, 32.768 KHz, 12.5 pF, DNP: One Epson Crystal
17 Q1 1 X1A0001410014
SMD Included in kit
18 R1 1 RES, 330, 5%, 0.125 W, 0805 541-330ACT-ND
19 R2 1 RES, 200, 5%, 0.125 W, 0805 541-200ACT-ND
R3, R10, R19, R20,
20 5 RES, 0, 5%, 0.125 W, 0805 541-0.0ACT-ND
R21
21 R4, R8, R9 0 RES, 0, 5%, 0.125 W, 0805 541-0.0ACT-ND DNP
22 R7 1 RES, 47 k, 5%, 0.125 W, 0805 541-47KACT-ND
23 R13 0 RES, 47 k, 5%, 0.125 W, 0805 541-47KACT-ND DNP
24 R16, R17 2 RES, 4.7 k, 5%, 0.125 W, 0805 541-4.7KACT-ND
SH‑J1, SH‑JP1,
J1: 1-2, JP1: 1-2, JP5: 2-3,
SH‑JP5, SH‑JP6,
Shunt, 100mil, Gold plated, JP6: 2-3, JP7: 2-3, JP8: 2-3,
25 SH‑JP7, SH‑JP8, 10 3M9580-ND
Black JP9: 2-3, JP10: 2-3, JP11: 1-
SH‑JP9, SH‑JP10,
2, JP12: 1-2
SH‑JP11, SH‑JP12
Switch Tactile SPST-NO 0.02A
26 SW1, SW2 2 P8079STB-ND
15V
Install with arrow on part
matching arrow on PCB.
Switch, DPST, Slide, Off-On, 1
27 SW3, SW4, SW5 3 GH7727-ND SW3 and SW4 should be in
Pos, 0.15A, 30V, TH
the OFF position, SW5
should be in the ON position
TP1, TP2, TP3, TP4,
28 0 Test Point, Miniature, Black, TH 36-5001-ND DNP
TP5, TP6

B.7 MSP-TS430PW24

Connector JTAG
For JTAG Tool
Connector J5
Jumper JP1 External power connector
1-2 (int): Power supply from JTAG interface Jumper JP1 to "ext"
2-3 (ext): External power supply
Jumper JP2 Jumpers JP4 to JP9

Open to measure current Close 1-2 to debug in Spy-Bi-Wire mode
D1
Jumper JP3


No. per
Board
1 C1, C2 0 12pF, SMD0805 DNP
2 C5 1 2.2nF, SMD0805
3 C3, C7 2 10uF, 10V, SMD0805
4 C4, C6, C8 3 100nF, SMD0805 478-3351-2-ND
5 D1 1 green LED, SMD0805 P516TR-ND
SAM1029-07-ND
6 J1, J2 0 12-pin header, TH enclosed with kit. Keep vias free of
SAM1213-07-ND
solder. (Header and Receptacle)
J5, JP1,
JP4, JP5, Place jumper on 1-2 of JP4-JP9
7 8 3-pin header, male, TH SAM1035-03-ND
JP6, JP7, Place on 1-2 on JP1
JP8, JP9
8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
9 9 Jumper 15-38-1024-ND see Pos 7 and 8
10 JTAG 1 HRP14H-ND
TH
11 Q1 0 Crystal DNP: keep vias free of solder
12 R1, R7 2 330 Ω, SMD0805 541-330ATR-ND
R5, R6, R8,
13 2 0 Ohm, SMD0805 541-000ATR-ND DNP R5, R6
R9,
14 R4 1 47k Ohm, SMD0805 541-47000ATR-ND
Socket: OTS 24(28)-065-
15 U1 1 Manuf.: Enplas
02-00
16 PCB 1 68.5 x 61 mm 2 layers
Adhesive Approximately 6mm width, for example, 3M Bumpons
17 4 Apply to corners at bottom side
plastic feet 2mm height Part No. SJ-5302
18 MSP430 2 MSP430AFE2xx DNP: enclosed with kit, supplied by TI

53
MSP-TS430RGE24A
Hardware
A B C D E F G H I
6 6
Figure B-16. MSP-TS430RGE24A Target Socket Module, Schematic

TP3
JTAG
RXD/SIMO 14 13 Jumpers JP3 to JP8 GND
8 7 TCK/SBWTCK
6 5 TMS
4 3 TDI BSL Tool Select: J2
3
2
1
5 Vcc
int
2
1
VCC Ext_PWR
5
J1 GND

1
2
2 3 3 EVQ11 3 3 3 3 SPICLK/SCL SPICLK/SCL1 9 10
R2
0R
1 JTAG -> 2 TEST/SBWTCK 2 RST/SBWTDIO DNP 2 P1.7/TDO 2 P1.6/TDI 2 P1.5/TMS 2 P1.4/TCK JP14 TEST/SBWTCK 7 8
JP1 1 1 1 1 1 1 5 6
SBW -> R4 C5
1
2
DVCC RXD/SIMO P1.5/TMS 3 4
R3
0R
47k 1.1nF JP15 TXD/SOMI/SDA1 1 2
GND P1.3
1
2
TXD/SOMI/SDA P1.5
SAM1029-06-ND19-24
DVCC GND
J6
JP16
XTLGND
C9
1uF/10V
P1.2 1 I2C RST/SBWTDIO

DNP 2
0R
R8
C7 C6
24
23
22
21
20
19
Q2 P1.4/TCK 3 UART
JP17
JP18
100nF QUARZ5 2 2
4 DNP
0R
1 1 If external supply voltage: 4
R9
DNP remove R3 and add R2 (0 Ohm)
DVCC
DVSS R7 R15
DNP
0R R13 GND C8 XIN 10k 10k
DNP
XOUT
TP1TP2
DNP DVCC
SW2
C11
DVCC
XOUT
DVSS
XIN
R14DNP 100nF
P1.3
SPICLK/SCL1
24
23
22
21
20
19
R1 330R
P1.0 IC1
D1 GND
2
1
P3.2
P2.7
DVSS
DVCC
P2.1/XIN
P2.0/XOUT
green
JP9
R5 330R
3 D2 DNP
P1.1
SAM1029-06-ND1-6 J5 3
2
1
yellow DNP 1 RST/SBWTDIO 1 18 DVSS 18

RST/NMI/SBWTDIO DVSS
2 TEST/SBWTCK 2 17 17
JP2 TEST/SBWTCK P2.6/UCA1TXD/UCA1SIMO
3 P1.4/TCK 3 16 16
R6 330R P1.4/UCA0TXD/UCA0SIMO/TA1.2/TCK/A4 P2.5/UCA1RXD/UCA1SOMI
P1.2 4 P1.5/TMS 4
P1.5/UCA0RXD/UCA0SOMI/TA1.1/TMS/A5 P2.4/UCA1CLK
15 15
DNP 5 P1.6/TDI 5 14 14
D3 P1.6/UCA0CLK/TA1CLK/TDI/TCLK/A6 P3.1/UCA1STE
2
1
P1.3/UCB0SOMI/UCB0SCL/MCLK/A3
P1.2/UCB0SIMO/UCB0SDA/TA0.2/A2
red DNP 6 P1.7/TDO 6 13 13
P1.7/UCA0STE/SMCLK/TDO/A7 P2.3
JP10 J3 SAM1029-06-ND13-18

GND
P1.0/UCB0STE/TA0CLK/A0
P1.1/UCB0CLK/TA0.1/A1
P2.2/ACLK
2 2
P3.0
MSP-TS430RGE24A
MSP430FR2433IRGE
7
8
9
10
11
12
Socket:
ENPLAS QFN-24B-0.5-0.1c
10 SPICLK/SCL1

SAM1029-06-ND7-12
7 P1.0
8 P1.1
9 P1.2
12
11
J4
Title: MSP-TS430RGE24A
1 Target Socket Board for MSP430FR2433 device 1
File: MSP-TS430RGE24A
Date: 4/28/2015 3:52:36 PM Rev.: 1.0 Page 1/1
A3
A B C D E F G H I
www.ti.com
B.8
MSP-TS430RGE24A www.ti.com

For bootloader tool For JTAG tool
Jumpers JP3 to JP8

Connector J2
External power connector Jumper J1
Jumper J1 to “ext” 1-2 (int): Power supply from JTAG interface
Figure B-17. MSP-TS430RGE24A Target Socket Module, PCB

www.ti.com MSP-TS430RGE24A
Table B-9. MSP-TS430RGE24A Bill of Materials (BOM)

No. per
Board
"MSP-TS430RGE24A" Rev.
1 PCB 1 90.0 x 92.5 mm 2 layers, red solder mask
1.0
JP1, JP9,
JP15
3 JP17, JP18 2 2-pin header, male, TH SAM1035-02-ND place jumper on one pin only
DNP, keep pads free of
4 JP2, JP10 2 2-pin header, male, TH SAM1035-02-ND
solder
JP3, JP4,
JP5, JP6,
JP7, JP8,
JP16
8 R2, R8, R9 3 0R, 0805 541-0.0ATR-ND DNP
9 R3, R13 2 0R, 0805 541-0.0ATR-ND
10 C5 1 1.1nF, CSMD0805 490-1623-2-ND
11 C7 1 1uF/10V, CSMD0805 490-1702-2-ND
12 R7, R15 1 10k, 0805 541-10KATR-ND
13 R4 1 47k, 0805 541-47KATR-ND
14 C6, C11 2 100nF, CSMD0805 490-1666-1-ND
15 R1 1 330R, 0805 541-330ATR-ND
16 R5, R6 2 330R, 0805 541-330ATR-ND DNP
17 R14 1 47k, 0805 541-47KATR-ND DNP
18 C8, C9 2 DNP, CSMD0805 DNP
DNP, Keep vias free of
19 SW2 1 EVQ-11L05R P8079STB-ND
solder. Lacon: 1251459
DNP, Keep vias free of
20 SW1 1 EVQ-11L05R P8079STB-ND
solder, Lacon: 1251459
DNP: headers enclosed in
21 J3, J4, J5, J6 4 6-pin header, TH SAM1029-06-ND kit.
DNP: receptacles enclosed in
22 J3, J4, J5, J6 4 6-pin receptacle, TH SAM1213-06-ND kit.
TP1, TP2, DNP, keep pads free of
23 3 Test point
TP3 solder
26 IC1 1 Socket:QFN-24B-0.5-0.1c Manuf. Enplas
27 IC1 1 MSP430FR2433IRGER
DNP: MS3V-TR1 DNP: Micro Crystal, enclosed
28 Q2 1 depends on application
(32,768kHz/ 20ppm/12,5pF) in kit. Keep vias free of solder
DIODE0805
30 D3 1 red (DNP), DIODE0805 DNP
31 D2 1 yellow (DNP), DIODE0805 DNP
Rubber stand Apply to corners at bottom
32 4 Buerklin: 20H1724
off side

www.ti.com

J3 Ext_PWR
1
2
3
Figure B-18. MSP-TS430DW28 Target Socket Module, Schematic

RST/NMI
JTAG
R5
14 13 C8 GND
12 11 50K
10nF
If external supply voltage: 10 9 VCC
remove R8 and add R9 (0 Ohm) 8 7 TCK
6 5 TMS
4 3 TDI
2 1 TDO
R9 R8 ML14 TST/VPP

- 0R
2
J5
JP1Q
R2
0R
1
Socket: Yamaichi
R1 Type: IC189-0282-042
C5
+
- C7 100nF SOCK28DW
FE14L FE14H
10uF/10V 1 TST/VPP TDO 28
1 28
2 VCC430 2 27 TDI 27
R1, C1, C2 GND 3 P2.5 TMS 26
3 26
not assembled C2 4 GND 4 25 TCK 25
5 XOUT 5 24 P1.3 24
BOOTST R10 -
QUARZ3
6 XIN 6 23 P1.2 23
12pF RST/NMI 7 RST/NMI P1.1 22 9 10
7 22
Q1 8 P2.0 8 21 P1.0 21 7 8
R11 0R
GND
9 P2.1 9 20 P2.4 20 5 6
C1 10 P2.2 10 19 P2.3 19 3 4 RST/NMI
11 P3.0 P3.7 18 R7 1 2
11 18
12 P3.1 12 17 P3.6 17 0R
12pF 13 P3.2 P3.5 16 ML10
JP1Q 13 16
D1 R3 2 1
14 P3.3 14 15 P3.4 15 not assembled
LED3 560R J1 U1 J2
J4
GND R6 If external supply voltage:
SMD-Footprint remove R11 and add R10 (0 Ohm)
F123 0R
TST/VPP 1 TST P1.7 28 TDO
VCC430 2 VCC P1.6 27 TDI
P2.5 3 P2.5 P1.5 26 TMS
GND 4 VSS P1.4 25 TCK
XOUT 5 24 P1.3
MSP-TS430DW28
XOUT P1.3
XIN 6 XIN P1.2 23 P1.2 MSP-TS430DW28 Target Socket DW28
RST/NMI 7 RST P1.1 22 P1.1
P2.0 8 P2.0 P1.0 21 P1.0
P2.1 9 20 P2.4
P2.2 10
P2.1 P2.4
19 P2.3 TITLE: MSP-TS430DW28
P2.2 P2.3
P3.0 11 P3.0 P3.7 18 P3.7
P3.1 12 17 P3.6
P3.2 13
P3.1 P3.6
16 P3.5 Document Number: REV:
P3.2 P3.5
MSP-TS430DW28
P3.3 14 P3.3 P3.4 15 P3.4 2.0
Hardware
U2 Date: 11/14/2006 1:26:04 PM Sheet: 1/1
B.9
56
www.ti.com MSP-TS430DW28
D1
Jumper J4 Jumper J5
Open to disconnect LED Open to measure current
Connector J3
Remove R8 and jumper R9 Connector JTAG
For JTAG Tool
Orient Pin 1 of
MSP430 device
Connector BOOTST
For Bootloader Tool
Figure B-19. MSP-TS430DW28 Target Socket Module, PCB

MSP-TS430DW28 www.ti.com
Table B-10. MSP-TS430DW28 Bill of Materials

No. per
Board
DNP: C1, C2, Cover holes while
1 C1, C2 0 12pF, SMD0805
soldering
2 C5 1 100nF, SMD0805
3 C7 1 10uF, 10V Tantal Elko B
4 C8 1 10nF SMD0805
5 D1 1 LED3 T1 3mm yellow RS: 228-4991
6 Q1 0 QUARZ, Crystal 32.768kHz, C(Load) = DNP: Cover holes while soldering
12.5pF
solder.
7 J1, J2 2 14-pin header, TH male
: Header
: Receptacle
solder.
7.1 2 14-pin header, TH female
: Header
: Receptacle
8 J3 1 3-Pin Connector, male
9 J4, J5 2 2-Pin Connector, male With jumper
10 BOOTST 0 ML10, 10-Pin Conn., m RS: 482-115 DNP, Cover holes while soldering
11 JTAG 1 ML14, 14-Pin Conn., m RS: 482-121
R1, R2, R6,
12 R7, R8,R9, 4 0R, SMD0805 DNP: R1, R2, R9, R10
R10, R11
13 R3 1 560R, SMD0805
14 R5 1 47K, SMD0805
Yamaichi: IC189-0282-
15 U1 1 SOP28DW socket
042
16 U2 0 TSSOP DNP

59
MSP-TS430PW28
Hardware
JTAG JTAG-Mode selection:
14 13 4-wire JTAG: Set jumpers JP4 to JP9 to position 2-3 GND
12 11 RST/NMI 2-wire "SpyBiWire": Set jumpers JP4 to JP9 to position 1-2
10 9
8 7 TCK/SBWTCK
6 5 TMS
3
2
1
4 3 TDI
2 1 TDO/SBWTDIO J5

Ext_PWR
ext 3 GND
Vcc 2 VCC
int 1
JP1
TEST/SBWTCK R7
330R
2 3 3 3 3 3 3
1 JTAG -> 2 TEST/SBWTCK 2 RST/SBWTDIO 2 P1.7/TDO 2 P1.6/TDI 2 P1.5/TMS 2 P1.4/TCK

JP2 1 1 1 1 1 1
SBW ->
JP4 JP5 C5
JP6 JP7 JP8 JP9
R4
47k
2.2nF GND
DNP
MSP430F12xx
J2
1 TEST/SBWTCK1 TST P1.7 28 P1.7/TDO 14
VCC430 2 VCC430 2 VCC P1.6 27 P1.6/TDI 13
3 P2.5 3 P2.5 P1.5 26 P1.5/TMS 12
4 GND 4 VSS P1.4 25 P1.4/TCK 11
5 XOUT/P2.75 24 P1.3 10 DNP
C3 XOUT P1.3
+
C4 6 XIN/P2.6 6 23 P1.2 9 -
DNP XIN P1.2 BOOTST R2
10uF/10V 100nF 7 RST/SBWTDIO7 RST P1.1 22 P1.1 8
R5 R6 8 P2.0 8 P2.0 P1.0 21 P1.0 7 9 10
9 P2.1 9 P2.1 P2.4 20 P2.4 6 TEST/SBWTCK 7 8
0R 0R 10 10 19 5 5 6 R3 0R
P2.2 P2.2 P2.3 P2.3
11 P3.0 11 P3.0 P3.7 18 P3.7 4 3 4
C2 12 12 17 3 1 2
XIN/P2.6 P3.1 P3.1 P3.6 P3.6 P1.1 DNP
12pF 13 P3.2 13 P3.2 P3.5 16 P3.5 2
DNP 14 P3.3 14 15 P3.4 1 DNP
2
P3.3 P3.4
Q1 RST/SBWTDIO
GND XTLGND J1

1
C1 DNP U1
XOUT/P2.7
12pF Socket: Enplas P2.2
DNP OTS-28-0.65-01
GND
If external supply voltage:
R1 330R remove R11 and add R10 (0 Ohm)
P1.0
D1
2
1
green MSP-TS430PW28:
B.10 MSP-TS430PW28

JP3 Target Socket Board for MSP430's in PW28 package
GND
3.1
www.ti.com
Connector JTAG Connector BOOTST

For JTAG Tool For Bootloader Tool
Jumper JP1
2-3 (ext): External power supply Connector J5
Jumper JP2
Jumper JP1 to “ext”
Jumper JP4 to JP9:
Orient Pin 1 of MSP430 device Close 1-2 to debug in Spy-Bi-Wire mode
Jumper JP3
D1

(1)
No. per
Board
DNP: C1, C2 , Cover holes
1 C1, C2 0 12pF, SMD0805
while soldering
2 C3 1 10uF, 10V Tantal Elko B
3 C4 1 100nF, SMD0805
4 C5 0 2.2nF, SMD0805 DNP
5 D1 1 LED green SMD0603
Micro Crystal MS1V-T1K DNP: Cover holes and
6 Q1 0 QUARZ, Crystal 32.768kHz, C(Load) = neighboring holes while
12.5pF soldering
DNP: Headers and
receptacles enclosed with
kit.Keep vias free of solder.
7 J1, J2 2 14-pin header, TH male
: Header
: Receptacle
DNP: headers and
7.1 2 14-pin header, TH female
: Header
: Receptacle
8 J5, IP1 1 3-Pin Connector , male
JP1, JP4,
JP5, JP6,
8a 7 3-Pin Connector , male Jumper on Pos 1-2
JP7, JP8,
JP9
9 JP2, JP3 2 2-Pin Connector , male with Jumper
DNP: Cover holes while
10 BOOTST 0 ML10, 10-Pin Conn. , m RS: 482-115
soldering
11 JTAG 1 ML14, 14-Pin Conn. , m RS: 482-121
12 R1, R7 2 330R, SMD0805
R2, R3, R5,
12 0 0R, SMD0805 DNP
R6
14 R4 1 47K, SMD0805
15 U1 1 SOP28PW socket Enplas: OTS-28-0.65-01
(1)
PCB 66 x 79 mm, two layers; Rubber stand off, four pieces

MSP-TS430PW28A www.ti.com
B.11 MSP-TS430PW28A
2-wire "SpyBiWire": Set jumpers J4 to J9 to position 2-1

JTAG Mode selection:
Figure B-22. MSP-TS430PW28A Target Socket Module, Schematic

www.ti.com MSP-TS430PW28A

Jumper JP1
Jumper JP1 to "ext"
Jumper JP2
Open to measure current Jumpers JP4 to JP9
Orient Pin 1 of MSP430 device Close 2-3 to debug in 4-wire JTAG mode
Jumper JP3
D1
Figure B-23. MSP-TS430PW28A Target Socket Module, PCB (Red)
NOTE: For bootloader use, the BSL connector and only one of the resistors R2 or R3 need to be
populated. If the board is supplied internally, R3 (0 Ω) must be assembled. If the board is
supplied externally, R2 (0 Ω) must be assembled, and R3 must be removed.

MSP-TS430PW28A www.ti.com
Table B-12. MSP-TS430PW28A Bill of Materials

No. per
Board
1 C1, C2 0 12pF, SMD0805 DNP
2 C5 1 2.2nF, SMD0805
3 C3 1 10uF, 10V, SMD0805
4 C4, C6, 2 100nF, SMD0805 478-3351-2-ND
6 J1, J2 0 14-pin header, TH enclosed with kit. Keep vias free of
solder: (Header and Receptacle)
J5, JP1,
JP4, JP5, Place jumper on 1-2 of JP4-JP9 Place
JP6, JP7, on 1-2 on JP1
JP8, JP9
9 9 Jumper 15-38-1024-ND see Pos 7 an 8
10 JTAG 1 HRP14H-ND
TH
11 BOOTST 0 DNP Keep vias free of solder
Micro Crystal MS3V
12 Q1 0 Crystal 32.768kHz, C(Load) = DNP: keep vias free of solder
12.5pF
13 R1, R7 2 330 Ω, SMD0805 541-330ATR-ND
R2, R3,R5,
14 0 0 Ohm, SMD0805 541-000ATR-ND DNP R2, R3,R5, R6
R6,
15 R4 1 47k Ω, SMD0805 541-47000ATR-ND
16 U1 1 Socket: OTS-28-0.65-01 Manuf.: Enplas
17 PCB 1 63.5 x 64.8 mm 2 layers
19 MSP430 2 MSP430G2553IPW28 DNP: enclosed with kit, supplied by TI

65
MSP-TS430RHB32A
Hardware
VCC
JP5
PWR3
JTAG TCK 1 JP4 TDO 1
JP9 1 JP8 1 JP7 1 JP6 1 <- SBW
1
2
3
14 13 TEST/SBWTCK 2 RST 2 C 2 M 2 I 2 O 2
J5
12 11 RST/NMI 3 RST/NMI 3 TCK 3 TMS 3 TDI 3 TDO 3 <- JTAG
Figure B-24. MSP-TS430RHB32A Target Socket Module, Schematic

10 9
8 7 TCK
6 5 TMS
ext 3 4 3 TDI
Vcc 2 2 1 TDO
1
int JP3
GND
DVCC
R5
47K
1 JP1

C8
2 RST
DVCC GND 2.2nF
DNP
10uF 100nF
J1 J4
C12 C13 GND
SAM1029-08-ND1-8 SAM1029-08-ND25-32
1 U1 32
DNP 10k R6 A0.0+ P2.7
GND 2 1 32 31
DNP 10k R8 A0.0- A0.0+ P2.7/TA0.2 P2.6
0R
R1
3 2 31 30
DNP 10k R9 A1.0+ A0.0- P2.6/TA0.1 P2.5
4 3 30 29
DNP 10k R10 A1.0- A1.0+ P2.5/TA0.0 P2.4
5 4 29 28
DNP 10k R11 A2.0+ A1.0- P2.4/TA1.0 P2.3
GND AVSS 6 5 28 27
JP2 DNP 10k R12 A2.0- A2.0+ P2.3/VMONIN P2.2
7 6 27 26
DNP 10k R13 A3.0+ A2.0- P2.2/TA1.2 P2.1
8 7 26 25
DNP 10k R14 A3.0- A3.0+ P2.1/TA1.1 P2.0
1
2
8 25
R3 A3.0- P2.0/TA1.0/CLKIN
P1.4 9 24
VREF VREF P1.7/UCB0SDA/UCB0SIMO/TA1CLK P1.7
330R 9 10 23 24
GND
D1 AVSS 100nF C14
10 AVSS 11
AVSS P1.6/UCB0SCL/UCB0SOMI/TA0.2
22 P1.6 23
ROSC ROSC P1.5/UCB0CLK/TA0.1 P1.5
11 12 21 22
GND
20k/0.1% R2 GND DVSS P1.4/UCB0STE/TA0.0 P1.4
12 13 20 21
DVCC VCC P1.3/UCA0TXD/UCA0SIMO/TA0CLK/TDO/TDI O
13 14 19 20
VCORE VCORE P1.2/UCA0RXD/UCA0SOMI/ACLK/TDI/TCLK I
14 15 18 19
RST RST/NMI/SBWTDIO P1.1/UCA0CLK/SMCLK/TMS M
15 16 17 18
0R R4 TEST/SBWTCK TEST/SBWTCK P1.0/UCA0STE/MCLK/TCK C
16 17
MSP430I2040TRHBQFN11T032-003

SAM1029-08-ND9-16 SAM1029-08-ND17-2417-24
C9 Socket:
J2 J3
470nF Yamaichi
QFN11T032-003
GND
B.12 MSP-TS430RHB32A
MSP430: Target-Socket MSP-TS430RHB32A

for MSP430i2040
1.0
www.ti.com
MSP-TS430RHB32A www.ti.com
Jumper JP3
Connector JTAG
For JTAG Tool
Connector J5
14 Vcc Jumper JP3 to “ext”
GND
GND
VCC
Jumper JP1 1 ext int
JTAG
3 2 1
JP3
J5
2
D1
Curr. Meas.
JP1
JP2
P1.4
Jumper JP4 to JP9
1
1
1
1
1
1
R3
SBW
D1
2
2
2
2
2
2
Close 2-3 to debug in 4-wire JTAG mode JTAG C13 Jumper JP2
MSP-TS430RHB32A
3
3
3
3
3
3
C12 Open to disconnect LED
JP9
JP7
JP5
JP6
JP8
JP4
Rev.: 1.0
C14
R4 C9
R2
J2
RoHS
16 R5 9
C8 R1
17
R14
8
R13
R12
20
R11
5
R10
R9
R8
24
R6
1
1
J1
J3
U1
25 30 32
J4 Orient Pin 1 of MSP430 device
Figure B-25. MSP-TS430RHB32A Target Socket Module, PCB

www.ti.com MSP-TS430RHB32A
Table B-13. MSP-TS430RHB32A Bill of Materials

No. per
Board
1 PCB 1 76.9 x 67.6 mm MSP-TS430RHB32A Rev. 1 2 layers, red solder mask
2 D1 1 green LED, DIODE0805 P516TR-ND
3 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND place jumper on header
4 JP3, JP4, 7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-2
JP5, JP6, (SBW)
JP7, JP8,
JP9
5 R1, R4 2 0R, 0805 541-0.0ATR-ND
6 C8 1 2.2nF, CSMD0805 490-1628-2-ND DNP
7 R6, R8, R9, 8 10k, 0805 311-10KARTR-ND DNP
R10, R11,
R12, R13,
R14
8 C12 1 10uF, CSMD0805 445-1371-2-ND
9 R2 1 20k/0.1%, 0805 P20KDACT-ND
10 R5 1 47K, 0805 311-47KARTR-ND
11 C13, C14 2 100nF, CSMD0805 311-1245-2-ND
12 R3 1 330R, 0805 541-330ATR-ND
13 C9 1 470nF, CSMD0805 445-1357-2-ND
14 J1, J2, J3, J4 1 8-pin header, TH SAM1029-08-ND DNP: headers and
receptacles, enclosed with
kit.
15 J1, J2, J3, J4 1 8-pin receptable, TH SAM1213-08-ND DNP: headers and
receptacles, enclosed with
kit.
17 U1 1 Socket QFN11T032-003 Manuf.: Yamaichi
18 U1 1 MSP430i2041TRHB DNP: enclosed with kit.
Is supplied by TI
20 Rubber stand 4 Buerklin: 20H1724 apply to corners at bottom
off side

www.ti.com

JTAG
14 13 JTAG-Mode selection: GND
12 11 RST/NMI 4-wire JTAG: Set jumpers JP4 to JP9 to position 2-3
10 9 2-wire "SpyBiWire":Set jumpers JP4 to JP9 to position 2-1
8 7 TCK/SBWTCK
6 5 TMS
4 3 TDI
3
2
1
2 1 TDO/SBWTDIO J3
Figure B-26. MSP-TS430DA38 Target Socket Module, Schematic

TEST/SBWTCK Ext_PWR
ext 3
Vcc 2 VCC
int 1
JP1
R1
GND R5
330R
2 47k C8
1 JTAG -> 3 3 3 3 3 3
10nF

JP2 2 TEST/SBWTCK 2 RST/SBWTDIO 2 P1.7/TDO 2 P1.6/TDI 2 P1.5/TMS 2 P1.4/TCK
SBW -> 1 1 1 1 1 1
JP5 DNP GND JP6 JP7 JP8 JP9
JP4
VCC430 MSP430F2274IDA
J2
1 TEST/SBWTCK1 38 P1.7/TDO 38
C7 TEST/SBWTCK P1.7/TDO
+
C5 2 VCC430 2 37 P1.6/TDI 37
DVCC P1.6/TDI
10uF/10V 100nF 3 P2.5 3 P2.5 P1.5/TMS 36 P1.5/TMS 36
4 GND 4 DVSS P1.4/TCK 35 P1.4/TCK 35
5 P2.7/XOUT 5 P2.7 P1.3 34 P1.3 34
6 P2.6/XIN 6 P2.6 P1.2 33 P1.2 33
7 RST/SBWTDIO7 32 P1.1 32 DNP
C2 RST/SBWDAT P1.1
P2.7/XOUT 8 P2.0 8 P2.0 P1.0 31 P1.0 31 BOOTST R10 -
12pF 9 P2.1 9 P2.1 P2.4 30 P2.4 30
9 10
DNP 10 P2.2 10 29 P2.3 29
P2.2 P2.3 TEST/SBWTCK 7 8
11 P3.0 11 28 P3.7 28 R11 0R
GND Q1 DNP
12 P3.1 12
P3.0 U1 P3.7
27 P3.6 27
5 6
P3.1 P3.6 3 4
13 P3.2 13 P3.2 P3.5 26 P3.5 26
C1 14 14 25 25 P1.1 1 2 DNP
P2.6/XIN P3.3 P3.3 P3.4 P3.4
15 GND 15 24 P4.7 24
12pF 16 16
AVSS P4.7
23 23 DNP
DNP VCC430 AVCC P4.6 P4.6 RST/SBWTDIO
17 P4.0 17 P4.0 Socket: P4.5 22 P4.5 22
18 P4.1 18 P4.1 Yamaichi P4.4 21 P4.4 21
19 P4.2 19 P4.2 IC189-0382-037P4.3 20 P4.3 20
R3 560R
P1.0 J1 P2.2
D1
2
1
yellow GND
JP3 If external supply voltage:
GND remove R11 and add R10 (0 Ohm)
MSP-TS430DA38:
B.13 MSP-TS430DA38
Target Socket Board for MSP430F2247IDA

TITLE: MSP-TS430DA38
1.3
MSP-TS430DA38
Hardware
Date: 6/18/2008 11:04:56 AM Sheet: 1/1
68
www.ti.com MSP-TS430DA38

Jumper JP1
Jumpers JP4 to JP9
D1
Jumper JP3 Orient pin 1 of MSP430 device

Jumper JP2
Connector J3
Jumper JP1 to "ext"
Figure B-27. MSP-TS430DA38 Target Socket Module, PCB

MSP-TS430DA38 www.ti.com
Table B-14. MSP-TS430DA38 Bill of Materials

No. per
Board
1 C1, C2 0 12pF, SMD0805 DNP
3 C5 1 100nF, SMD0805 478-3351-2-ND
4 C8 0 2.2nF, SMD0805 DNP
5 D1 1 green LED, SMD0603 475-1056-2-ND
DNP: headers and
"J3, JP1,
Place jumpers on headers
JP4, JP5,
7 8 3-pin header, male, TH SAM1035-03-ND JP1, JP4,JP5, JP6, JP7, JP8,
JP6, JP7,
JP9; Pos 1-2
JP8, JP9"
9 9 Jumper 15-38-1024-ND Place on: JP1 - JP9; Pos 1-2
DNP: Keep vias free of
11 BOOTST 0 10-pin connector, male, TH
solder
12 Q1 0 Crystal 32.768kHz, C(Load) =
solder
12.5pF
13 R1, R3 2 330 Ω, SMD0805 541-330ATR-ND
14 R10, R11 0 0 Ω, SMD0805 541-000ATR-ND DNP
15 R5 1 47k Ω, SMD0805 541-47000ATR-ND
16 U1 1 Socket: IC189-0382--037 Manuf.: Yamaichi
Adhesive for example, 3M Bumpons Apply to corners at bottom
18 4 ~6mm width, 2mm height
Plastic feet Part No. SJ-5302 side
DNP: enclosed with kit
19 MSP430 2 MSP430F2274IDA
supplied by TI

www.ti.com MSP-TS430QFN23x0
B.14 MSP-TS430QFN23x0
Figure B-28. MSP-TS430QFN23x0 Target Socket Module, Schematic

MSP-TS430QFN23x0 www.ti.com

Jumper JP1
Connector J5
Jumper JP2 Jumper JP1 to "ext"
Jumper JP3
D1
Figure B-29. MSP-TS430QFN23x0 Target Socket Module, PCB

www.ti.com MSP-TS430QFN23x0
Table B-15. MSP-TS430QFN23x0 Bill of Materials

No. per
Board
1 C1, C2 0 12pF, SMD0805 DNP
3 C4 1 100nF, SMD0805 478-3351-2-ND
4 C5 1 10nF, SMD0805 478-1383-2-ND
5 D1 1 green LED, SMD0603 475-1056-2-ND
DNP: headers and
6 J1, J2, J3, J4 0 10-pin header, TH
Place jumper on header JP1;
7 J5, JP1 2 3-pin header, male, TH SAM1035-03-ND
Pos 1-2.
9 3 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3
solder
solder
12.5pF
13 R1 1 330 Ω, SMD0805 541-330ATR-ND
14 R2, R3 0 0 Ω, SMD0805 541-000ATR-ND DNP
15 R4 1 47k Ω, SMD0805 541-47000ATR-ND
16 U1 1 Socket: QFN-40B-0.5-01 Manuf.: Enplas
19 MSP430 2 MSP430F2370IRHA
supplied by TI

MSP-TS430RSB40 www.ti.com
B.15 MSP-TS430RSB40
Figure B-30. MSP-TS430RSB40 Target Socket Module, Schematic

www.ti.com MSP-TS430RSB40

Jumper JP1
Jumper JP1 to "ext"
Jumper JP2 Jumpers JP4 to JP9

Open to measure current Close 1-2 to debug in Spy-Bi-Wire mode
Jumper JP3
D1
Figure B-31. MSP-TS430RSB40 Target Socket Module, PCB

MSP-TS430RSB40 www.ti.com
Table B-16. MSP-TS430RSB40 Bill of Materials

No. Per
Board
1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
C3, C7, C10,
2 3 10uF, 10V, SMD 0805 445-1371-1-ND DNP C12
C12
C4, C6, C8,
3 3 100nF, SMD0805 311-1245-2-ND DNP C11
C11
4 C5 1 2.2nF, SMD0805
5 C9 1 470nF, SMD0805
free of solder.
: Header
: Receptacle
free of solder.
7.1 4 10-pin header, TH
: Header
: Receptacle
JP1, JP4,JP5,
Jumper: 1-2 on JP1, JP10; 2-3
8 JP6, JP7, JP8, 9 3-pin header, male, TH SAM1035-03-ND
on JP4-JP9
JP9, J5, JP10
11 BOOTST 0 10-pin connector, male, TH DNP. Keep vias free of solder
QFN-40B-0.4_
12 U1 1 Enplas
ENPLAS_SOCKET
Micro Crystal MS3V-T1R DNP: Q1. Keep vias free of
13 Q1 0 Crystal
32.768kHz, C(Load) = 12.5pF solder
Place on: JP1, JP2, JP3, JP4,
15 10 Jumper 15-38-1024-ND
JP5, JP6, JP7, JP8, JP9, JP10
16 R1,R7 2 330R SMD0805
R2, R3, R5,
17 R6, R8, R9, 3 0R SMD0805 DNP R2, R3, R5, R6
R10
18 R4 1 47k SMD0805
DNP: enclosed with kit. Is
19 MSP430 2 MSP430F5132
supplied by TI
Rubber stand select appropriate; for example,
20 4 apply to corners at bottom side
off Buerklin: 20H1724

www.ti.com MSP-TS430RHA40A
B.16 MSP-TS430RHA40A
Figure B-32. MSP-TS430RHA40A Target Socket Module, Schematic

MSP-TS430RHA40A www.ti.com

Jumper JP1
Connector J5
Jumper JP2 Jumper JP1 to "ext"
Jumpers JP4 to JP9

D1
Jumper JP3
Figure B-33. MSP-TS430RHA40A Target Socket Module, PCB

www.ti.com MSP-TS430RHA40A
Table B-17. MSP-TS430RHA40A Bill of Materials

No. per
Board
1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
2 C5 0 2.2nF, SMD0805 DNP C12
3 C3, C7 2 10uF, 10V, SMD0805 5 DNP C11
4 C4, C6 2 100nF, SMD0805 478-3351-2-ND
5 C9 1 470nF, SMD0805
DNP: headers and receptacles enclosed
with kit. Keep vias free of solder.
J1, J2, J3,
7 4 10-pin header, TH
J4 : Header
: Receptacle
: Header
: Receptacle
J5, JP1,
JP4, JP5, Place jumper on 1-2 of JP4-JP9; Place
JP6, JP7, on 1-2 on JP1
JP8, JP9
10 9 Jumper 15-38-1024-ND see Pos 8 an 9
11 JTAG 1 HRP14H-ND
TH
12 BOOTST 0 DNP. Keep vias free of solder
TH
13 U1 1 Socket: QFN-40B-0.5-01 Manuf.: Enplas
Micro Crystal MS3V-T1R
14 Q1 0 Crystal 32.768kHz, C(Load) = DNP: Q1. Keep vias free of solder
12.5pF
15 R1,R7 2 330R SMD0805 541-330ATR-ND
R2, R3, R5,
16 2 0 Ohm, SMD0805 541-000ATR-ND DNP:R2, R3, R5, R6
R6, R8, R9,
17 R4 1 47k SMD0805
select appropriate; for
Rubber
19 4 example, Buerklin: apply to corners at bottom side
stand off
20H1724
20 MSP430 2 MSP430N5736IRHA DNP: enclosed with kit. Is supplied by TI

www.ti.com

J3 Ext_PWR
1
2
3
Figure B-34. MSP-TS430DL48 Target Socket Module, Schematic

RST/NMI
JTAG
R5
14 13 C8 GND
12 11 47K
10nF
10 9 VCC
8 7 TCK
6 5 TMS
4 3 TDI
2 1 TDO
ML14

ext 3
Vcc 2 C3
int 1
2
100nF
JP1 J5
R12
JP1Q IC51-1387.KS-15186
0R
1
TDO 1 TDO/TDI P5.4 48

R4 TDI 2 47
TDI/TCLK P5.3
+
C7 C5 0R TMS 3 TMS P5.2 46

100nF TCK 4 TCK COM0 45
10uF/10V GND RST/NMI 5 44 Vcc
RST/NMI P2.0
6 DVCC P2.1 43
1 2 GND 7 DVSS P2.2 42 1 2 ext int
Q1, C1, C2 GND 3 4 XIN 8 41 3 4
XIN P2.3
not assembled C2 5 6 XOUT 9 XOUT P2.4 40 5 6
JP2
1
2
3
XOUT 7 8 10 AVSS P2.5 39 7 8
9 10 11 38 9 10 BOOTST
12pF AVCC P2.6
QUARZ3
11 12 12 VREF+ P2.7 37 11 12 9 10
13 14 13 P6.0 S5 36 13 14 7 8
GND
Q1 15 16 14 35 15 16 5 6
P6.1 P5.7
C1 17 18 15 P6.2 P5.6 34 17 18 3 4 RST/NMI
XIN 19 20 16 P6.3 P5.5 33 19 20 1 2 TCK
21 22 17 P6.4 P5.0 32 21 22
12pF 23 24 18 31 23 24 ML10
JP1Q P6.5 P5.1 BSL_TX
D1 R3 19 P6.6 LCDCAP 30
2 1 P1.0 J1 20 P6.7 LCDREF 29 J2
560R 21 28 P1.0 R7 0R
LED3 J4 P1.7 P1.0 BSL_RX
22 P1.6 P1.1 27
GND 23 P1.5 P1.2 26 R6 0R
24 P1.4 P1.3 25
+
C4 10uF/10V
U1 GND
B.17 MSP-TS430DL48
MSP-TS430DL48 Target Socket DL48

TITLE: MSP-TS430DL48
1.3
MSP-TS430DL48
Hardware
Date: 11/14/2006 1:24:44 PM Sheet: 1/1
80
www.ti.com MSP-TS430DL48

Jumper JP2
Jumper J5
Connector J3 D1
External power connector LED connected to P1.0
Jumper JP2 to "ext"
Jumper J4
Orient pin 1 of MSP430 device
Figure B-35. MSP-TS430DL48 Target Socket Module, PCB

MSP-TS430DL48 www.ti.com
Table B-18. MSP-TS430DL48 Bill of Materials

No. per
Board
1 C1, C2 0 12pF, SMD0805 DNP
2 C4, C7 2 10uF, 10V, Tantal Size B 511-1463-2-ND
3 C3, C5 2 100nF, SMD0805 478-3351-2-ND
4 C8 1 10nF, SMD0805 478-1383-2-ND
5 D1 1 yellow LED, TH, 3mm, T1 511-1251-ND
DNP: Headers and
Place jumper on header JP1;
7 J3, JP1, JP2 2 3-pin header, male, TH SAM1035-03-ND
Pos 1-2. DNP: JP2
9 3 Jumper 15-38-1024-ND Place on: JP1, J4, J5
solder
solder
12.5pF
13 R3 1 560 Ω, SMD0805 541-560ATR-ND
R4, R6, R7,
14 2 0 Ω, SMD0805 541-000ATR-ND DNP: R6, R7
R12
15 R5 1 47k Ω, SMD0805 541-47000ATR-ND
16 U1 1 Socket: IC51-1387 KS-15186 Manuf.: Yamaichi
DNP: Enclosed with kit
19 MSP430 2 MSP430F4270IDL
supplied by TI

www.ti.com MSP-TS430PT48
B.18 MSP-TS430PT48
Figure B-36. MSP-TS430PT48 Target Socket Module, Schematic

MSP-TS430PT48 www.ti.com
Jumper J1
1-2 (Debugger): Power supply from JTAG interface Connector JTAGConnector BSL
2-3 (External): External power supply For JTAG tool For bootloader tool
Connector J2
Jumper J1 to External
Jumpers JP5 to JP10 BSL Interface Switches
Close 1-2 to debug in Spy-Bi-Wire mode Select which BSL interface to
Close 2-3 to debug in 4-wire JTAG mode connect to connector BSL
Jumper JP1 I2C pullup enable switch

Open to measure current Switch on to connect
I2C pullup resistors
Jumpers JP11 and JP12

D1, D2 Orient pin 1 of MSP430 device

LEDs connected to P1.0, P1.1
Figure B-37. MSP-TS430PT48 Target Socket Module, PCB

www.ti.com MSP-TS430PT48
Table B-19. MSP-TS430PT48 Bill of Materials

No. per Package
Ref Des Value Description Part Number Manufacturer
Board Reference
!PCB 1 Printed circuit board MCU061 Any
Header(Shrouded), Header, 2.54mm,
BSL 1 AWHW-10G-0202-T Assman WSW
2.54mm, 5x2, Gold, TH 5x2, TH
CAP, CERM, 1100 pF, 50
C5 1 1100pF 0805 GRM2165C1H112JA01D MuRata
V, +/- 5%, C0G/NP0, 0805
CAP, CERM, 0.1 µF, 50
C6 1 0.1uF 0805 GRM21BR71H104KA01L MuRata
V, +/- 10%, X7R, 0805
CAP, CERM, 10 µF, 16 V,
C7 1 10uF 0805 0805YD106KAT2A AVX
+/- 10%, X5R, 0805
D1 1 Green LED, Green, SMD LED_0805 APT2012LZGCK Kingbright
D2 1 Blue LED, Blue, SMD LED_0805 150080BS75000 Wurth Elektronik
H5, H6, H7, Bumpon, Cylindrical,
4 Black Bumpon SJ61A1 3M
H8 0.312 X 0.200, Black
Socket, QFP-48, 0.5 mm Socket, QFP-48, Yamaichi
IC1 1 IC357-0484-142P-2
Pitch 0.5 mm Pitch Electronics
J1, J2, JP5,
JP6, JP7, Header, 100mil, 3x1,
8 3x1 Header TSW-103-07-G-S Samtec
JP8, JP9, Gold, TH
JP10
J3, J4, J5, Header, 100mil, 12x1,
J6 Gold, TH
J3A, J4A, Receptacle, 2.54mm, Receptacle, Sullins Connector
4 PPPC121LFBN-RC
J5A, J6A 12x1, Gold, TH 2.54mm, 12x1, TH Solutions
JP12 Gold, TH
Header (shrouded), 100 7x2 Shrouded Sullins Connector
JTAG 1 SBH11-PBPC-D07-ST-BK
mil, 7x2, Gold, TH Header Solutions
RES, 330, 5%, 0.125 W,
R1 1 330 0805 CRCW0805330RJNEA Vishay-Dale
0805
RES, 200, 5%, 0.125 W,
0805
R3, R10,
RES, 0, 5%, 0.125 W,
R19, R20, 5 0 0805 CRCW08050000Z0EA Vishay-Dale
0805
R21
RES, 47 k, 5%, 0.125 W,
R7 1 47k 0805 CRCW080547K0JNEA Vishay-Dale
0805
RES, 4.7 k, 5%, 0.125 W,
R16, R17 2 4.7k 0805 CRCW08054K70JNEA Vishay-Dale
0805
SH-J1, SH-
JP1, SH-
JP5, SH-
JP6, SH-
SNT-100-BK-G
JP7, SH- Shunt, 100mil, Gold
10 1x2 Shunt Alternate part number: Samtec
JP8, SH- plated, Black
969102-0000-DA
JP9, SH-
JP10, SH-
JP11, SH-
JP12
Switch, SPST-NO, Off-
SW1, SW2 2 6x6mm EVQ-11A04M Panasonic
Mom, 0.02 A, 15 VDC, TH
Switch, DPST, Slide, Off-
SW3, SW4,
3 On, 1 Pos, 0.15A, 30V, 9.65x7.12mm 78F01T Grayhill
SW5
TH
C8, C9 0 12pF 0805 C0805C120J5GACTU Kemet
+/- 5%, C0G/NP0, 0805
FID1, FID2, Fiducial mark. There is
0 N/A N/A N/A
FID3 nothing to buy or mount.

MSP-TS430PT48 www.ti.com
Table B-19. MSP-TS430PT48 Bill of Materials (continued)

No. per Package
Ref Des Value Description Part Number Manufacturer
Board Reference
Q1A 0 Crystal, 4MHz, 18 pF, TH 11.5x5mm 9B-4.000MAAJ-B TXC Corporation
Crystal, 32.768 kHz, 1.4x1.4x5.0mm MS3V-T1R 32.768KHZ +/-
Q1B 0 Micro Crystal AG
12.5pF, SMD SMD 20PPM 12.5PF
RES, 0, 5%, 0.125 W,
R4, R8, R9 0 0 0805 CRCW08050000Z0EA Vishay-Dale
0805
RES, 47 k, 5%, 0.125 W,
0805
TP1, TP2, Test Point, Miniature, Black miniature
0 Black 5001 Keystone
TP3, TP4 Black, TH testpoint
Test Point, Miniature, Black miniature
TP5, TP6 0 5001 Keystone
Black, TH testpoint

87
MSP-TS430PT48A
Hardware
1 2 3 4 5 6
Ext_PWR
BSL_SCL 9 10 remove R3 and add R4 (0 ohm)
UART BSL Connection
3
2
1

0 14 13 GND 5 6 SW5
BSL_SDA BSL_TX R20 12 11 RST/NMI BSL_RX 3 4 RST/SBWTDIO BSLRX 1 2 BSL_RX
DNP
10 9 J2 BSL_SDA BSL_TX 1 2 BSLTX 3 4 BSL_TX TP3
BSL_SCL R21 0 8 7 TCK/SBWTCK R3 DNP
TP4
0 6 5 TMS 0
4 3 TDI
2 1 TDO/SBWTDIO R4
DNP
0 I2C BSL Connection
Figure B-38. MSP-TS430PT48A Target Socket Module, Schematic

GND
A SW4 A
J1 BSLSCL 1 2 BSL_SCL
DNP
ext 3 GND BSLSDA 3 4 BSL_SDA TP1
DNP
2 VCC TP2
VCC
1
int TEST/SBWTCK1
I2C Pullups
SW3 R17 BSLSDA
J6 DVCC 1 2 4.7k
3 4
JP9 JP10 JP5 JP6 JP7 JP8 R16 BSLSCL
VCC Current DNP
3 3 SW2 3 3 3 3 4.7k
Measurement JTAG ->
1
11
2
12
10
9
8
7
6
5
4
3
JP1 1 1 1 1 1 1
SBW -> By default the UART BSL is connected
XOUT_ext
XIN_ext
DVCC C5
DVSS
R7 and the I2C BSL and the I2C pull-ups are disconnected
DVCC
P4.7

47k
1100pF
DVSS
XIN
XOUT
44 P5.1/UCA0RXD/UCA0SOMI/TB0.3
45 P5.2/UCA0TXD/UCA0SIMO/TB0.4
38 P3.2/UCB1SIMO/UCB1SDA
39 P3.6/UCB1SOMI/UCB1SCL
37 P3.5/UCB1CLK/TB0TRG
43 P5.0/UCA0CLK/TB0.2
42 P4.7/UCA0STE/TB0.1
B B
40 P6.1/TB0CLK
46 P2.0/XOUT
41 P6.2/TB0.0
47 P2.1/XIN
48 DVSS
Customer Note
49
Customer Note CONN1-4 and CONN5-8 are male and female headers included loose
IC1
Populate either Q1A (High Speed) or in the kit and are intended to be populated on J3-6 as needed
Q1B (Low Speed, 32.768KHz) crystal
C8 J3 J5
XIN_ext R9 XIN 1 DVCC DVCC 1 36 P2.7/UCB1STE 12
DNP DNP
0 2 RST/SBWTDIO RST/NMI/SBWTDIO 2 35 P4.2/TA3CLK 11
Q1B 12pF 3 TEST/SBWTCK TEST/SBWTCK 3 34 P4.1/TA3.0 10
2 4 BSLTX P1.4/TCK P1.4/UCA0TXD/UCA0SIMO/TA1.2/TCK/A4/VREF+ 4 33 P4.0/TA3.1 P4.0 9
DNP 1 DNP 3 5 BSLRX P1.5/TMS P1.5/UCA0RXD/UCA0SOMI/TA1.1/TMS/A5 5 32 P3.7/TA3.2 8
GND
Q1A 6 P1.6/TDI P1.6/UCA0CLK/TA1CLK/TDI/TCLK/A6 6 31 DNC 7
32.768kHz C9 DNP7 P1.7/TDO P1.7/UCA0STE/SMCLK/TDO/A7 7 30 P2.6/UCA1TXD/UCA1SIMO 6DNP
XOUT_ext R8 XOUT HFGND Connection by via 8 P4.3/UCB1SOMI/UCB1SCL/TB0.5/A8 8 29 P2.5/UCA1RXD/UCA1SOMI 5
DNP DNP
0 9 P4.4/UCB1SIMO/UCB1SDA/TB0.6/A9 9 28 P2.4/UCA1CLK 4
12pF 10 P5.3/UCB1CLK/TA3.0/A10 10 27 P3.1/UCA1STE 3
DVSS 11 P5.4/UCB1STE/TA3CLK/A11 11 26 P3.4/TA2CLK/COMP0OUT 2
Customer Note
12 P1.0 P1.0/UCB0STE/TA0CLK/A0/Veref+ 12 25 P2.3/TA2.0 1
X1 on hardware page is included loose in the kit
and is intended to be populated on Q1B as needed
C C
21
13
14
15
17
20
22
23
16
18
19
24
P1.2/UCB0SIMO/UCB0SDA/TA0.2/A2/Veref-
P1.3/UCB0SOMI/UCB0SCL/MCLK/A3

P1.1/UCB0CLK/TA0.1/COMP0.0/A1
TP6
P4.6/UCB0SIMO/UCB0SDA/TA3.1
P4.5/UCB0SOMI/UCB0SCL/TA3.2
DNP
P5.5/UCB0CLK/TA2CLK
GND
P5.6/UCB0STE/TA2.0
P5.7/TA2.1/COMP0.2
P6.0/TA2.2/COMP0.3
P2.2/ACLK/COMP0.1
DVCC
R10 DVCC DNC

0
C7 C6 DNPC10
DNP
TP5 R13 10uF 0.1uF 1uF
P3.0/TA2.2
P3.3/TA2.1
DNP
SW1 47k
P4.0
DVSS DVSS
B.19 MSP-TS430PT48A
D2
R2 P4.7

2 BSLSDA
3 BSLSCL
200
Blue
10
12
11
1
4
5
6
7
8
9
D JP12 DNP D
D1
R1 P1.0 J4
330
Green Orderable: MSP-TS430PT48A Designed for: Public Release Mod. Date: 9/12/2018
TID #: N/A Project Title: MSP-TS430PT48A
DVSS JP11 Number: MCU046 Rev: A Sheet Title:
Texas Instruments and/or its licensors do not warrant the accuracy or completeness of this specification or any information contained therein. Texas Instruments and/or its licensors do not SVN Rev: Version control disabled Assembly Variant: 001 Sheet: 1 of 2
warrant that this design will meet the specifications, will be suitable for your application or fit for any particular purpose, or will operate in an implementation. Texas Instruments and/or its Drawn By: File: MCU046A_Schematic.SchDoc Size: B http://www.ti.com
licensors do not warrant that the design is production worthy. You should completely validate and test your design implementation to confirm the system functionality for your application. Engineer: M Pridgen Contact: http://www.ti.com/support © Texas Instruments 2018
1 2 3 4 5 6
www.ti.com
MSP-TS430PT48A www.ti.com
Jumper J1
1-2 (Debugger): Power supply from JTAG Interface Connector JTAG Connector BSL
2-3 (External): External power supply For JTAG Tool For Bootloader Tool
Connector J2
BSL Interface Switches

Jumpers JP5 to JP10 Select which BSL interface to
Close 1-2 to debug in Spy-Bi-Wire mode connect to connector BSL
Jumper JP1 I2C pullup enable switch

Open to measure current Switch On to connect
I2C pullup resistors
Orient Pin 1 of
MSP430 device

D1, D2
Figure B-39. MSP-TS430PT48A Target Socket Module, PCB

www.ti.com MSP-TS430PT48A
Table B-20. MSP-TS430PT48A Bill of Materials

Package
Ref Des Quantity Value Description Part Number Manufacturer
Reference
!PCB 1 Printed Circuit Board MCU046 Any
Header(Shrouded), Header, 2.54mm,
BSL 1 AWHW-10G-0202-T Assman WSW
2.54mm, 5x2, Gold, TH 5x2, TH
CAP, CERM, 1100 pF, 50
C5 1 1100pF 0805 GRM2165C1H112JA01D MuRata
V, +/- 5%, C0G/NP0, 0805
CAP, CERM, 0.1 uF, 16
C6 1 0.1uF 0603 C0603X104K4RACTU Kemet
V, +/- 10%, X7R, 0603
CAP, CERM, 10 uF, 16 V,
C7 1 10uF 0805 0805YD106KAT2A AVX
+/- 10%, X5R, 0805
CONN1,
CONN2, Header, 100mil, 12x1,
CONN3, Gold, TH
CONN4
CONN5,
CONN6, Receptacle, 2.54mm, Receptacle, Sullins Connector
4 PPPC121LFBN-RC
CONN7, 12x1, Gold, TH 2.54mm, 12x1, TH Solutions
CONN8
H4 0.312 X 0.200, Black
Socket, QFP-48, 0.5 mm Socket, QFP-48, Yamaichi
IC1 1 IC357-0484-142P-2
Pitch, www.yamaichi.com 0.5 mm Pitch Electronics
J1, J2, JP5,
JP8, JP9, Gold, TH
JP10
JP12 Gold, TH
Header (shrouded), 100 7x2 Shrouded Sullins Connector
JTAG 1 SBH11-PBPC-D07-ST-BK
mil, 7x2, Gold, TH Header Solutions
RES, 330, 5%, 0.125 W,
AEC-Q200 Grade 0, 0805
RES, 200, 5%, 0.125 W,
R3, R10,
RES, 0, 5%, 0.333 W,
R19, R20, 5 0 0805 CRCW08050000Z0EAHP Vishay-Dale
R21
RES, 47 k, 5%, 0.125 W,
RES, 4.7 k, 5%, 0.125 W,
SH-J1, SH-
JP1, SH-
JP5, SH-
JP6, SH-
SNT-100-BK-G
JP7, SH- Shunt, 100mil, Gold
10 1x2 Shunt Alternate part number: Samtec
JP8, SH- plated, Black
969102-0000-DA
JP9, SH-
JP10, SH-
JP11, SH-
JP12
Switch, SPST-NO, Off-
SW1, SW2 2 6x6mm EVQ-11A04M Panasonic
Mom, 0.02 A, 15 VDC, TH
Switch, DPST, Slide, Off-
SW3, SW4,
3 On, 1 Pos, 0.15A, 30V, 9.65x7.12mm 78F01T Grayhill
SW5
TH

MSP-TS430PT48A www.ti.com
Table B-20. MSP-TS430PT48A Bill of Materials (continued)

Package
Ref Des Quantity Value Description Part Number Manufacturer
Reference
X1 1 Micro Crystal AG
C8, C9 0 12pF 0805 C0805C120J5GACTU Kemet
+/- 5%, C0G/NP0, 0805
CAP, CERM, 1 uF, 50 V,
C10 0 1uF 0603 GRM188R61H105KAALD MuRata
+/- 10%, X5R, 0603
FID1, FID2, Fiducial mark. There is
0 N/A N/A N/A
FID3 nothing to buy or mount.
J3, J4, J5, Header, 100mil, 12x1,
J6 Gold, TH
Q1A 0 Crystal, 4 MHz, 18 pF, TH 11.5x5mm 9B-4.000MAAJ-B TXC Corporation
Q1B 0 Micro Crystal AG
RES, 0, 5%, 0.333 W,
R4, R8, R9 0 0 0805 CRCW08050000Z0EAHP Vishay-Dale
RES, 47 k, 5%, 0.125 W,
TP1, TP2,
Test Point, Miniature, Black Miniature
TP3, TP4, 0 5001 Keystone
Black, TH Testpoint
TP5, TP6

www.ti.com MSP-TS430RGZ48B
B.20 MSP-TS430RGZ48B
Figure B-40. MSP-TS430RGZ48B Target Socket Module, Schematic

MSP-TS430RGZ48B www.ti.com
Jumper JP3

Connector J5
Jumpers JP5 to JP10 External power connector
Close 1-2 to debug in Spy-Bi-Wire mode Jumper JP3 to "ext"
Jumper JP1
Jumper JP2
D1
Figure B-41. MSP-TS430RGZ48B Target Socket Module, PCB
NOTE: For bootloader use, the BSL connector and only one of the resistors R10 or R11 must be

www.ti.com MSP-TS430RGZ48B
Table B-21. MSP-TS430RGZ48B Bill of Materials

No. per
Board
1 C1, C2 0 12pF, SMD0805 DNP
2 C3, C4 0 47pF, SMD0805 DNP
3 C6, C7, C12 3 10uF, 6.3V, SMD0805
C5, C11,
4 4 100nF, SMD0805 311-1245-2-ND
C13, C14
5 C8 1 2.2nF, SMD0805
6 C9 1 470nF, SMD0805 478-1403-2-ND
SAM1029-12-ND DNP: Headers and receptacles
J1, J2, J3,
8 0 12-pin header, TH (Header) SAM1213-12- enclosed with kit. Keep vias free of
J4
ND (Receptacle) solder:
9 J5 1 3-pin header, male, TH
JP3, JP5,
place jumpers on pins 2-3 on JP5, JP6,
JP6, JP7,
10 7 3-pin header, male, TH SAM1035-03-ND JP7, JP8, JP9, JP10 place jumpers on
JP8, JP9,
pins 1-2 on JP3,
JP10
12 9 Jumper 15-38-1024-ND See Pos. 10and Pos. 11
13 JTAG 1 HRP14H-ND
TH
14 BOOTST 0 "DNP Keep vias free of solder"
TH
15 Q1 0 Crystal 32.768kHz, C(Load) = DNP: Q1 Keep vias free of solder
12.5pF
Q2: 4MHz Buerklin:
16 Q2 0 Crystal DNP: Q2 Keep vias free of solder
78D134
http://www.ettinger.de/Art_
Insulating
17 0 Insulating disk to Q2 Detail.cfm?ART_ARTNUM
disk to Q2
=70.08.121
18 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4,
R6, R8,
19 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12
R9,R10,
R11, R12
20 R5 1 47k Ω, SMD0805 541-47000ATR-ND
Socket: QFN11T048-
21 U1 1 Manuf.: Yamaichi
008_A101121_RGZ48
24 MSP430 2 MSP430F5342IRGZ DNP: enclosed with kit, supplied by TI

www.ti.com

10 9
8 7 TCK/SBWTCK
6 5 TMS
3
2
1
4 3 TDI J2
2 1 TDO/SBWTDIO
Figure B-42. MSP-TS430RGZ48C Target Socket Module, Schematic

ext 3 Ext_PWR
Vcc 2 VCC
int 1
J1 GND
TEST/SBWTCK1 R7
JP3 0R JP4 SW1 JP5 JP6 JP7 JP8
2 3 3 EVQ11 3 3 3 3
1 JTAG -> 2 TEST/SBWTCK 2 RST/SBWTDIO DNP 2 PJ.0/TDO 2 PJ.1/TDI 2 PJ.2/TMS 2 PJ.3/TCK
JP1 1 1 1 1 1 1
2 DVCC SBW -> R4 C5
1 AVCC 47k 1.1nF
C2 DNP
GND

JP2
DNP
0R
R6
R8
0R
C9
SV1
QUARZ5
C3 C4 Q1
LFGND QUARZ5 DVCC
1uF/10V 100nF HFGND
0R
R5
R9
0R
12
10
11
9
8
7
6
5
4
3
2
1
GND DNP
Q2
DNP C7 C6
DNP DNP
LFXIN HFXOUT 1uF/10V 100nF
C1 LFXOUT HFXIN DNP
37 DVCC
48 AVCC
47 AVSS
44 AVSS
41 AVSS
DNP C8
40 P2.4
39 P2.3
38 P2.7
connection by via GND
46
45
43
42
AVSS DNP
BOOTST
43_HFXOUT
46_LFXOUT
0R R12
42_HFXIN
37_DVCC
45_LFXIN
48_AVCC
47_AVSS
44_AVSS
41_AVSS
40_P2.4
39_P2.3
38_P2.7
9 10
R2
-
TEST/SBWTCK1 7 8
DNP
DVCC
DVSS P2.1 5 6
SV2 3 4
R3
0R
0R R13
DNP
1 P1.0 1 1_P1.0 36_DVSS 36 DVSS 12 P2.0 1 2

TP1TP2
2 P1.1 2 2_P1.1 35_P4.6 35 P4.6 11

3 P1.2 3 3_P1.2 34_P4.5 34 P4.5 10 DNP
SW2
4 P3.0 4 4_P3.0 33_P4.4 33 P4.4 9 RST/SBWTDIO

R14DNP
5 P3.1 5 5_P3.1 U1 32_P1.7 32 P1.7 8
P1.3 6 P3.2 6 6_P3.2 31_P1.6 31 P1.6 7
7 P3.3 7 7_P3.3 30_P3.7 30 P3.7 6
8 P4.7 8 8_P4.7 29_P3.6 29 P3.6 5
R11 DNP 9 9 28
P1.2 P1.3 9_P1.3 28_P3.5 P3.5 4
22_TEST/SBWTCK
23_RST/SBWTDIO
10 P1.4 10 27 P3.4 3 GND
D3 10_P1.4 27_P3.4
2
1
red (DNP) 11 P1.5 11 11_P1.5 26_P2.2 26 P2.2 2
14_PJ.2_TMS
12 PJ.0/TDO 12 25 P2.1 1 If external supply voltage:
15_PJ.3/TCK
13_PJ.1_TDI
JP11 12_PJ.0_TDO 25_P2.1
SV4
16_P4.0
17_P4.1
18_P4.2
19_P4.3
20_P2.5
21_P2.6
24_P2.0
R10DNP
P1.1
D2
2
1
B.21 MSP-TS430RGZ48C
yellow (DNP)
JP10
13
14
15
16
17
18
19
20
21
10 TEST/SBWTCK22
11 RST/SBWTDIO 23
24
R1 330R
P1.0 MSP-TS430RGZ48C
D1 Target Socket Board for MSP430FR58xx, FR59xx IRGZ
2
1
green
2 PJ.2/TMS
3 PJ.3/TCK
1 PJ.1/TDI
JP9
GND
4 P4.0
5 P4.1
6 P4.2
7 P4.3
8 P2.5
9 P2.6
12 P2.0
MSP-TS430RGZ48C
1.2
Hardware
SV3
94
www.ti.com MSP-TS430RGZ48C

BOOTST
14 10
Jumpers JP3 to JP8
JTAG
1 1
Close 1-2 to debug in Spy-Bi-Wire mode 2 2
J1 TCK TMS TDI TDO
Ext.
C5
R3
R2
ext JTAG
Pwr.
3
Jumper J1 Vcc Connector J2
Vcc
2
123
123
123
123
123
123
1-2 (int): Power supply from JTAG interface SBW
GND
1
int Jumper J1 to "ext"
2-3 (ext): External power supply JP8 JP7 JP6 JP5 JP4 JP3 R7 GND
JP2 JP1
PWR J2
RST/SBWTDIO TEST/SBWTCK
DVCC
Jumper JP1 AVCC MSP-TS430RGZ48C
R4
Open to measure current Rev. 1.2 RoHS
20 15
TP1
Jumper JP2
25 Clamshell GND
Analog/digital power
10
LEDs connected to
P1.2
P1.1
P1.0
P1.0, P1.1, P1.2 via
R11 D3
R10 D2
R1 D1
30 JP9, JP10, JP11
(only D1 assembled)
5
JP10
JP11
35
JP9
Switch SW1 QFN11T048-008 A101121
Device reset
U1 1
40 45 Orient Pin 1 of MSP430 device
P1.3
SW2
TP2
SW1
GND
R8
R9
R5
R6
Switch SW2
R13
C6
C7
Connected to P1.3
R12
C4
C3
R14
RESET
Q1
Q2
HF ands LF oscillators with capacitors

C1
C2
C9
C8
and resistors to connect pinheads
Figure B-43. MSP-TS430RGZ48C Target Socket Module, PCB
NOTE: LFOSC and HFOSC pins are swapped at SV1.

42_HFXIN (pin 42) → SV1 (pin 7)
43_HFXOUT (pin 43) → SV1 (pin 6)
45_LFXIN (pin 45) → SV1 (pin 10)
46_LFXOUT (pin 46) → SV1 (pin 9)

MSP-TS430RGZ48C www.ti.com
Table B-22. MSP-TS430RGZ48C Bill of Materials

Number
Pos Ref Des Per Description Digi-Key Part Number Comment
Board
1 SV1, SV2, SV3, 4 12-pin header, TH DNP: headers and receptacles enclosed with kit.
SV4 Keep vias free of solder.
: Receptacle
1.1 SV1, SV2, SV3, 4 12-pin receptable, TH DNP: headers and receptacles enclosed with kit.
SV4 Keep vias free of solder.
: Header
2 JP1, JP2, JP9 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header
3 JP10, JP11 2 2-pin header, male, TH SAM1035-02-ND DNP
4 J1, JP3, JP4, JP5, 7 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3
JP6, JP7, JP8
6 JP1, JP2, JP9, J1, 10 Jumper 15-38-1024-ND Place on: JP1, JP2, JP9, J1, JP3, JP4, JP5, JP6,
JP7, JP8
7 R2, R3, R5, R6, R8, 9 DNP, 0805 DNP
R9, R10, R11, R14
8 R12, R13, R7 3 0R, 0805 541-000ATR-ND
9 C5 1 1.1nF, CSMD0805 490-1623-2-ND
10 C3, C7 2 1uF, 10V, CSMD0805 490-1702-2-ND
11 R4 1 47k, 0805 541-47000ATR-ND
12 C4, C6 2 100nF, CSMD0805 311-1245-2-ND
13 R1 1 330R, 0805 541-330ATR-ND
14 C1, C2, C8, C9 4 DNP, CSMD0805 DNP
15 SW1, SW2 2 EVQ-11L05R P8079STB-ND DNP
16 BOOTST 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder
18 Q1 1 DNP: MS3V-TR1 (32768kHz, depends on application Micro Crystal, DNP, enclosed in kit, keep vias free of
20ppm, 12.5pF) solder
19 Q2 1 DNP, Christal depends on application DNP, keep vias free of solder
20 U1 1 Socket: QFN11T048-008 Manuf.: Yamaichi
A101121-001
20.1 U1 1 MSP430FR5969IRGZ DNP: enclosed with kit. Is supplied by TI.
24 TP1, TP2 2 Testpoint DNP, keep pads free of solder
25 Rubber stand off 4 Buerklin: 20H1724 apply to corners at bottom side
26 PCB 1 79.6 x 91.0 mm MSP-TS430RGZ48C 2 layers, black solder mask
Rev. 1.2

97
MSP-TS430PM64
Hardware
NOTE: Connections between the JTAG header and pins XOUT and XIN are no longer required and should not be
10nF
C8
RST/NMI
PWR3
Figure B-44. MSP-TS430PM64 Target Socket Module, Schematic

47K
R5
1
2
3
JTAG
J5
14 13
12 11
remove R8 and add R9 (0 Ohm) 10 9 VCC
If external supply voltage: 8 7 TCK
6 5 TMS
4 3 TDI
2 1 TDO
GND
ML14

R9
R8
0R
R1 0R
-
not assembled
C3
XTCLK
12pF
FE16-1-4
2
C7
10uF/10V
100nF
J4
JP1Q
GND
+
C5
C4
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
J7
12pF
0R
1
R2
not assembled
R4
C6
enhancement
reserved for
10uF/6,3V
AVCC
DVSS
AVSS
TMS
TDO
RST
TCK
+
TDI
61
60
59
53
52
51
50
49
future
R12
J1 J3
R11 0R
R10 -
1 1 48
-
0R
0R
DVCC 48
2 2 47 47
R13
R14
not assembled 3 3 46 46
12pF BOOTST
LFXTCLK
4 4 45 45
C2 5 5 U2 44 44 9 10
6 6 43 43 7 8
7 42 5 6
Q1
7 42
8 XIN 41 41 3 4
12pF 9 40 1 2
XOUT 40
C1 10 10 MSP64PM 39 39
R3
JP1Q 11 11 38 38 ML10
2 1 12 Socket: 37
0R
0R
12 37 not assembled
560R 13 13 Yamaichi 36 36
For BSL usage add:
LED3

D1
J6 14 IC51-0644-807 35
R6
R7
14 35
Open J6 if LCD 15 15 34 34
GND 16 33 R6 R7 R13 R14
is connected 16 33 MSP430F14x : 0 0 open open
FE16-1-3 MSP430F41x : open open 0 0
FE16-1-1
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
FE16-1-2
MSP-TS430PM64 Target Socket PM64
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
B.22 MSP-TS430PM64

for F14x and F41x
J2
TITLE: MSP-TS430PM64
made.
1.2
Date: 3/14/2006 10:46:30 AM Sheet: 1/1
www.ti.com
MSP-TS430PM64 www.ti.com

D1
LED connected to pin 12
Connector J5
External power connection
Remove R8 and jumper R9
Jumper J7
Jumper J6
Orient Pin 1 of
MSP430 device
Figure B-45. MSP-TS430PM64 Target Socket Module, PCB

www.ti.com MSP-TS430PM64
Table B-23. MSP-TS430PM64 Bill of Materials

No. per
Board
1 C1, C2 0 12pF, SMD0805 DNP
DNP: Only recommendation.
1.1 C3, C4 0 47pF, SMD0805
Check your crystal spec.
2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND DNP: C6
3 C5 1 100nF, SMD0805 478-3351-2-ND
4 C8 1 10nF, SMD0805 478-1383-2-ND
5 C9 1 470nF, SMD0805 478-1403-2-ND
enclosed with kit.Keep vias free
of solder.
11 2 Jumper 15-38-1024-ND Place on: J6, J7
13 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder
Q1: Micro Crystal MS1V-T1K
14 Q1, Q2 0 Crystal DNP: Keep vias free of solder
32.768kHz, C(Load) = 12.5pF
15 R3 1 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4,
R6, R7, R8, DNP: R4, R6, R7, R9, R10,
16 3 0 Ω, SMD0805 541-000ATR-ND
R9, R10, R11, R11, R12, R13, R14
R12, R13, R14
17 R5 1 47k Ω, SMD0805 541-47000ATR-ND
18 U1 1 Socket: IC51-0644-807 Manuf.: Yamaichi
Rubber
20 4 select appropriate Apply to corners at bottom side
standoff
MSP430F2619IPM DNP: Enclosed with kit supplied
21 MSP430 22
MSP430F417IPM by TI

www.ti.com

PWR3
1
2
3
JTAG
J5
14 13 GND
12 11 RST/NMI
10 9 VCC
Figure B-46. MSP-TS430PM64A Target Socket Module, Schematic

8 7 TCK/SBWTCK
6 5 TMS
4 3 TDI GND
2 1 TDO/SBWTDIO
Vcc 3 VCC430
ext 2 R6
1 330R R4
int
JP3 47k C3
JTAG -> 3 3 3 3 3 3
2.2nF
2

SBW -> 1 A 1 B 1 C 1 D 1 E 1 F
1
JP5 DNP GND JP6 JP7 JP8 JP9
JP2 JP4
0R
VCC430 AVCC
R2
J4
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
+
C5 C4
C6
10uF/6.3V 100nF 100nF
AVCC P1.0
D
C
A
B
E
F
R1 0R AVSS P1.1
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
AVSS R11
R10
0R 0R
R13 R14 DNP DNP
0R 0R BOOTST
VCC430 DNP DNP 9 10
TEST/SBWTCK 7 8
J1 J3 A 5 6
DNP
1 1 48 48 3 4 RST/SBWTDIO
0R 2 2 47 47 1 2 B
DNP R7 3 3 46 46
12pF XIN 4 4 45 45
C2 5 5 44 44 DNP
ADD LCD-CAP!
2
6 6 43 43 GND
XTLGND Q1 7 7 42 42 P5.1
DNP 8 8 41 41
1
12pF XOUT 9 9 40 40 If supplied by interface: populate R11 (0R), remove R10

C1 DNP
10 10 39 39 If supplied locally: populate R10 (0R), remove R11
DNP 0R 11 11 38 38
R5 12 12 37 37
13 13 36 36
14 14 Socket: 35 35
15 15 Yamaichi 34 34
16 16 IC51-0644-807 33 33
GND
B.23 MSP-TS430PM64A
GND MSP-TS430PM64A Target Socket

for F4152
R3 TITLE: MSP-TS430PM64A
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
1
2
P5.1
D1 330R JP1
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
MSP-TS430PM64A
Open JP1 if LCD

GND is connected J2 1.1
Hardware
Date: 3/29/2011 3:07:02 PM Sheet: 1/1
100
www.ti.com MSP-TS430PM64A
Jumper JP3
Connector JTAG 2-3 (ext): External power supply
For JTAG Tool
Connector BOOTST
Jumpers JP4 to JP9 For Bootloader Tool
Jumper JP2 Connector J5

Open to measure current External power connector
Jumper JP3 to "ext"
Jumper JP1
D1
Figure B-47. MSP-TS430PM64A Target Socket Module, PCB

MSP-TS430PM64A www.ti.com
Table B-24. MSP-TS430PM64A Bill of Materials

Pos. Ref Des No. per Board Description Digi-Key Part No. Comment
1 C1, C2, 0 12pF, SMD0805 DNP
2 C3 0 2.2nF, SMD0805 DNP
3 C6, 1 10uF, 10V, Tantal Size B 511-1463-2-ND
4 C4, C5 2 100nF, SMD0805 478-3351-2-ND
free of solder.
J5, JP3, JP4,
7 JP5, JP6, JP7, 8 3-pin header, male, TH SAM1035-03-ND
JP8, JP9
12 Q1 0 Crystal DNP: Keep vias free of solder
32.768kHz, C(Load) = 12.5pF
13 R3, R6 2 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R5,
DNP: R5, R7, R9, R10, R11,
14 R7, R9, R10, 2 0 Ω, SMD0805 541-000ATR-ND
R13, R14
R11, R13, R14
15 R4 1 47k Ω, SMD0805 541-47000ATR-ND
Rubber stand
18 4 select appropriate Apply to corners at bottom side
off
19 MSP430 2 MSP430F4152IPM
supplied by TI

103
MSP-TS430PM64D
Hardware
A B C D E F G H I
JTAG
14 13 Ext_PWR
12 11 RST/NMI
10 9
1
2
3
6 8
6
7
5
TCK
TMS
J5
6
4 3 TDI
2 1 TDO/SBWTDIO
Figure B-48. MSP-TS430PM64D Target Socket Module, Schematic

ext 3
Vcc 2 VCC
GND
int 1
JP1
RST/SBWTDIO
JTAG -> 3 3 SW1 3 3 3 3
2 to measure supply current 2 TEST/SBWTCK 2 EVQ11 2 P1.7/TDO 2 P1.6/TDI 2 P1.5/TMS 2 P1.4/TCK
1 1 1 DNP 1 1 1 1
JP2
SBW ->JP10 JP9 R4 JP8 JP7 JP6 JP5
VCC430
C3 JTAG-Mode selection:
1.1nF
JP4 before BSL use.

C5
SW2 47K
5
Disconnect JP3 and
C4
100nF
EVQ11
DNP
P1.3
2-wire "SpyBiWire": Set jumpers JP4 to JP9 to position 2-1 5
10uF/10V
R1
P1.0 BSL Interface

2
1
D1 330R
BSL
TP1 TP2
LED_Green DNP R10 0R

JP3 9 10
R5
P1.1 TEST/SBWTCK7 8
DNP R11 0R
5 6
2
1
D2 DNP 330R DNP

LED_Green P1.1 BSLRX 3 4 RST/SBWTDIO
R6 JP4 P1.0 BSLTX 1 2
J4
GND
P1.2
D3 DNP 330R DNP
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
LED_Green
12pF C2 XOUT
4
QUARZ5
4
Q1
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
U1
12pF C1 XIN
P3.2/L10
P3.4/L12
P3.5/L13
P3.6/L14
P3.7/L15
P3.3/L11
P7.0/L0
P7.1/L1
P7.2/L2
P7.3/L3
P7.4/L4
P7.5/L5
P7.6/L6
P7.7/L7
P3.0/L8
P3.1/L9
100nF C6 P4.7 J3
DNP 1 P4.7 1 48 48
C7 P4.7/R13 P6.0/L16
100nF P4.6 2 P4.6 2 P4.6/R23 P6.1/L17 47 47
DNP 3 P4.5 3 46 46
C8 P4.5/R33 P6.2/L18
100nF P4.5 4 P4.4 4 P4.4/LCDC2 P6.3/L19 45 45
DNP 5 P4.3 5 44 44
C9 P4.3/LCDC1 P6.4/L20
100nF P4.4 6 DNP XOUT 6
R3 0R P4.2/XOUT P6.5/L21 43 43
DNP 7 DNP XIN 7 42 42
R2 0R P4.1/XIN P6.6/L22
P4.3 8 GND 8 DVSS P6.7/L23 41 41
3 9 VCC430
10 RST/SBWTDIO
9
10
DVCC
RST/NMI/SBWTDIO
P2.0/L24
P2.1/L25
40
39
40
39 3
11 TEST/SBWTCK 11 TEST/SBWTCK1 P2.2/L26 38 38
12 12 P4.0/TA1.1 P2.3/L27 37 37
13 13 P8.3/TA1.2 P2.4/L28 36 36
14 14 35 35
P5.2/UCB0SIMO/UCB0SDA/L34
P5.3/UCB0SOMI/UCB0SCL/L35
P8.2/TA1CLK P2.5/L29
P1.1/UCA0RXD/UCA0SOMI/A1
P1.0/UCA0TXD/UCA0SIMO/A0
15 15 P8.1/A1CLK/A9 P2.6/L30 34 34
16 16 P8.0/SMCLK/A8 P2.7/L31 33 33
P1.6/TA0.2/TDI/TCLK/A6
J1

P1.5/TA0CLK/TMS/A5
P1.4/MCLK/TCK/A4
P5.1/UCB0CLK/L33
P5.0/UCB0STE/L32
P1.7/TA0.1/TDO/A7
P1.3/UCA0STE/A3
P1.2/UCA0CLK/A2
P5.7/L39
P5.6/L38
P5.5/L37
P5.4/L36
MSP430FR413xIPM / MSP430FR203xIPM
Socket: Yamaichi IC51-0644-807
2 2
P1.7/TDO 17
P1.6/TDI 18
P1.5/TMS 19
P1.4/TCK 20
21
22
23
24
25
26
27
28
29
30
31
32
B.24 MSP-TS430PM64D
P1.3
P1.2
P1.1
P1.0

17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
J2
Titel: MSP-TS430PM64D
1 Target Socket Board for MSP430FR413xIPM and MSP430FR203xIPM
1
File: MSP-TS430PM64D
Datum:9/3/2014 3:08:18 PM Rev.: 1.0 Seite 1/1
A3
A B C D E F G H I
www.ti.com
MSP-TS430PM64D www.ti.com

14 10
BSL
JTAG
Jumpers JP5 to JP10 1 1
Close 1-2 to debug in Spy-Bi-Wire mode 2 2
MSP-TS430PM64D
RoHS
R10
R11
ext Disconnect JP3 and
3
Jumper JP1
1
1
1
1
1
1
SBW-> JP4 before BSL use!
VCC
2
2
2
2
2
2
2
Rev. 1.0
JP1
JTAG-> R1 D1
int JP3
1
P1.0
3
3
3
3
3
3
2-3 (ext): External power supply R5 D2
JP10
JP4
JP9
JP5
JP6
JP7
JP8
P1.1
TP1 J2 R6 D3
P1.2
GND 32 30 25 20 17
Curr. Meas.
Switch SW2
16
JP2
Connected to P1.3
33
U1
SW2
Jumper JP2
J1
Open to measure current Clamshell
35
C4
C3
P1.3
GND
GND R4 C5
10
VCC Q1 Switch SW1
J5
R2 Device reset
40
SW1
Connector J5 C1
Jumper JP1 to "ext" C9 C2 RESET
5
R3
C8
45
C7
IC51-0644-807 C6
J3
1
48
TP2
Orient Pin 1 of
49 55 60 64
GND MSP430 device
J4
Figure B-49. MSP-TS430PM64D Target Socket Module, PCB

www.ti.com MSP-TS430PM64D
Table B-25. MSP-TS430PM64D Bill of Materials

No. per
Board
1 PCB 1 90x96 mm MSP-TS430PM64D Rev. 1.0 2 layers, 90x96mm, white solder
mask
2 BSL 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder
3 D1 1 Green LED, HSMG-C170, 516-1434-1-ND Avago, Farnell 5790852
DIODE0805
4 D2, D3 2 LED, DIODE0805 DNP
JP4
6 JP1, JP5, 7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3 (JTAG)
JP6, JP7,
JP8, JP9,
JP10
7 R1 1 330R, 0805 541-330ATR-ND
8 R5, R6 2 330R, 0805 541-330ATR-ND DNP
9 R2, R3, 4 0R, 0805 541-0.0ATR-ND DNP
R10, R11
10 R4 1 47K, 0805 311-47KARTR-ND
11 C1, C2 2 12pF, CSMD0805 709-1169-2-ND
12 C3 1 10uF/10V, CSMD0805 445-1371-2-ND
13 C4 1 100nF, CSMD0805 311-1245-2-ND
14 C6, C7, 4 100nF, CSMD0805 311-1245-2-ND DNP
C8, C9
15 C5 1 1.1nF, CSMD0805 490-1623-2-ND
16 J1, J2, J3, 1 16-pin header, TH SAM1029-16-ND DNP: headers and receptacles,
J4 enclosed with kit. Keep vias free
of solder.
17 J1, J2, J3, 1 16-pin receptable, TH SAM1213-16-ND DNP: headers and receptacles,
J4 enclosed with kit. Keep vias free
of solder.
19 U1 1 Socket IC51-0644-807 Manuf.: Yamaichi
20 U1 2 MSP430FR4133IPM DNP: enclosed with kit. Is
supplied by TI.
22 Q1 1 Microcrystal 32768Hz, MS3V-T1R
(32.768kHz, 20ppm, 12.5pF)
23 SW1, SW2 2 Panasonic EVQ11 P8079STB-ND DNP, Lacon: 1251459
24 Rubber 4 Buerklin: 20H1724 apply to corners at bottom side
stand off

www.ti.com

A B C D E F G H I
JTAG
RXD/SIMO 14 13 STE Jumpers JP3 to JP8 GND
8 7 TCK/SBWTCK
6 6
4
5
3
TMS
TDI BSL Tool Select: J2 6
3
2
1
Vcc 2 VCC Ext_PWR
Figure B-50. MSP-TS430PM64F Target Socket Module, Schematic

int 1
J1 GND
1
2
2 3 3 EVQ11 3 3 3 3 SPICLK/SCL SPICLK/SCL1 9 10 STE
R2
0R
1 JTAG -> 2 TEST/SBWTCK 2 RST/SBWTDIO DNP 2 PJ.0/TDO 2 PJ.1/TDI 2 PJ.2/TMS 2 PJ.3/TCK JP14 TEST/SBWTCK 7 8
JP1 1 1 1 1 1 1 5 6
SBW -> R4 C5
1
2
2 DVCC RXD/SIMO RXD/SIMO1 3 4
R3
0R
1 AVCC 47k 1.1nF JP15 TXD/SOMI/SDA1 1 2
JP2 GND P1.7
1
2
TXD/SOMI/SDA P2.1 GND
C3 C4 JP16
5 1uF/10V 100nF
P1.6 1
2
I2C RST/SBWTDIO
5
GND P2.0 3 UART
JP17
JP18
2 2
1 1

R7 R15
10k 10k If external supply voltage:
DVCC C9 DNP DVCC
1uF/10V
SAM1129-16-ND
DNP
0R
R8
R6
0R
J6
C7 C6 C2 C11
QUARZ5
100nF Q2 100nF
HFGND QUARZ5 DNP DNP
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
LFGND
0R
R9
R5
0R
DNP
Q1
DNP connection by via
DNP DNP
HFXIN LFXIN GND
4 GND C8 HFXOUT LFXOUT DNP 4
DNP DVCC C1
DVSS
AVCC
AVSS
AVSS
AVSS
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
U1
AVSS1
AVCC1
PJ.6/HFXIN
PJ.4/LFXIN
AVSS2
DVCC3
DVSS3
P4.7/UCB1SOMI/UCB1SCL/TA1.2/S6
PJ.0/TDO/TB0OUTH/SMCLK/SRSCG1P4.6/UCB1SIMO/UCB1SDA/TA1.1/S7
P5.7/UCA1STE/TB0CLK/S10
P4.5/UCB1CLK/TA1.0/S8
AVSS3
P4.4/UCB1STE/TA1CLK/S9
P4.2/UCA0SIMO/UCA0TXD/UCB1CLK/S5
PJ.7/HFXOUT
PJ.5/LFXOUT
J5
1 1 P4.3/UCA0SOMI/UCA0RXD/UCB1STE/S4 P9.7/A15/C15 48 48
3 2
3
2
3
P1.4/UCB0CLK/UCA0STE/TA1.0/S3
P1.5/UCB0STE/UCA0CLK/TA0.0/S2
P9.6/A14/C14
P9.5/A13/C13
47
46
47
46 3
4 P1.6 4 P1.6/UCB0SIMO/UCB0SDA/TA0.1/S1 P9.4/A12/C12 45 45
AVSS 5 SPICLK/SCL15 44 P1.0 44
SAM1129-16-ND
P1.7/UCB0SOMI/UCB0SCL/TA0.2/S0 P1.0/TA0.1/DMAE0/RTCCLK/A0/C0/VREF-/VEREF-
P2.1/UCA0SOMI/UCA0RXD/TB0.5/DMAE0/S17
6 LCDCAP 6 43 P1.1 43
SAM1129-16-ND
0R R12 R33/LCDCAP P1.1/TA0.2/TA1CLK/COUT/A1/C1/VREF+/VEREF+
7 7 P6.0/R23 P1.2/TA1.1/TA0CLK/COUT/A2/C2 42 P1.2 42
8 8 P6.1/R13/LCDREF P1.3/TA1.2/A3/C3 41 P1.3 41
DVCC
P3.5/UCA1SOMI/UCA1RXD/TB0.1/S22
DVSS 9 9 40 DVCC 40
P3.4/UCA1SIMO/UCA1TXD/TB0.0/S23
P6.2/COUT/R03 DVCC2
10 10 39 DVSS 39
P2.2/UCA0CLK/TB0.4/RTCCLK/S18
0R R13 P6.3/COM0 DVSS2
DNP
11 11 P6.4/TB0.0/COM1/S30 P7.4/SMCLK/S11 38 38
TP1TP2
PJ.1/TDI/TCLK/MCLK/SRSCG0
12 12 37 37
P2.3/UCA0STE/TB0OUTH/S19
P6.5/TB0.1/COM2/S29 P7.3/TA0.2/S12
PJ.3/TCK/COUT/SRCPUOFF
PJ.2/TMS/ACLK/SROSCOFF
13 13 36 36
SW2
P6.6/TB0.2/COM3/S28 P7.2/TA0.1/S13
P3.6/UCA1CLK/TB0.2/S21
P3.7/UCA1STE/TB0.3/S20
14 14 P3.0/UCB1CLK/TA3.2/S27 P7.1/TA0.0/S14 35 35
P3.3/TA1.1/TB0CLK/S24
15 15 P3.1/UCB1SIMO/UCB1SDA/TA3.3/S26 P7.0/TA0CLK/S15 34 34
R14DNP 16 16
P1.3 33 P2.0 33
RST/NMI/SBWTDIO
P3.2/UCB1SOMI/UCB1SCL/TA3.4/S25 P2.0/UCA0SIMO/UCA0TXD/TB0.6/TB0CLK/S16
J3
TEST/SBWTCK
R11 DNP
P1.2
2 D3 2
2
1
red (DNP)
DVCC1
DVSS1
JP11
R10DNP
P1.1 MSP430FR697XPM/RGC Socket:
B.25 MSP-TS430PM64F
17
18
19TEST/SBWTCK 19
20RST/SBWTDIO 20
21
22
23
24
25
26
27
28
29
30
31
32
D2 Yamaichi C51-0644-807
2
1
yellow (DNP)
32RXD/SIMO1
JP10 LCDCAP DVCC
21PJ.0/TDO
23PJ.2/TMS
24PJ.3/TCK
22PJ.1/TDI
18 DVCC
17 DVSS
R1 330R
P1.0 C15 C10
D1
2
1
green 4u7 100nF
25
26
27
28
29
30
31
JP9 DNP Title: MSP-TS430PM64F
GND
J4
Target Socket Board for MSP430FR697x/687x devices
1 GND GND
SAM1129-16-ND 1
MSP-TS430PM64F
File: MSP-TS430PM64F
Date: 10/20/2014 4:38:53 PM Rev.: 1.0 Page 1/1
Hardware
A3
A B C D E F G H I
106
www.ti.com MSP-TS430PM64F
BSL Tool Select Connector JTAG

Jumper JP13 to JP15 For JTAG Tool
Open = BSL Connector Close JP17 and JP18
Connector BSL Close = JTAG Connector to enable BSL pullups Jumper J1
For Bootloader 1-2 (int): Power supply from JTAG interface
BSL Interface Select

Jumper J16
2
Close 1-2 for I C 10 14
1 1
Close 2-3 for UART 2 2
R15 Jumper JP3 to JP8

Connector J2 Close 2-3 to debug in 4-wire JTAG mode
External power connector R7
Jumper J1 to “ext”
Switch SW1
Device reset
30 25 20 J4
Jumper JP1, JP2
J5
Open to measure U1
10 15
digital or analog current Clamshell
35
Switch SW2
C11
Connected to P1.3
40
5
45
LEDs connected to IC51-0644-807

D2R10
D3 R11
D1 R1
P1.0, P1.1, P1.2 from

1 J3
HF and LF oscillators with capacitors
JP9, JP10, JP11 and resistors to connect pinheads
(only D1 assembled)
50 55 60 J6
This target board supports UART or I2C BSL configuration. To select the configuration to use, set the
jumpers as shown in the following table.
2
Jumper Configuration UART BSL Configuration I C BSL Configuration
JP17 and JP18 Open Close
JP16 Close 2-3 (UART) Close 1-2 (I2C)
Figure B-51. MSP-TS430PM64F Target Socket Module, PCB

MSP-TS430PM64F www.ti.com
Table B-26. MSP-TS430PM64F Bill of Materials (BOM)

Number
Pos. Ref Des per Description DigiKey Part Number Comment
Board
1 PCB 1 90.0 x 92.5 mm MSP-TS430PM64F Rev. 1.0 2 layers, purple solder mask
JP1, JP2, JP9,
2 6 2-pin header, male, TH SAM1035-02-ND place jumper on header
JP13, JP14, JP15,
3 JP17, JP18 2 2-pin header, male, TH SAM1035-02-ND place jumper on header's pin1 only
JP3, JP4, JP5, JP6,
JP7, JP8, JP16
8 R2, R5, R6, R8, R9 5 0R, 0805 541-0.0ATR-ND DNP
9 R3, R12, R13 3 0R, 0805 541-0.0ATR-ND
10 C5 1 1.1nF, CSMD0805 490-1623-2-ND
11 C3, C7 2 1uF/10V, CSMD0805 490-1702-2-ND
12 C15 1 4u7, CSMD0805 445-1370-1-ND DNP
13 R7, R15 1 10k, 0805 541-10KATR-ND
14 R4 1 47k, 0805 541-47KATR-ND
15 C4, C6, C10, C11 4 100nF, CSMD0805 490-1666-1-ND
16 R1 1 330R, 0805 541-330ATR-ND
17 R10, R11 2 330R, 0805 541-330ATR-ND DNP
18 R14 1 47k, 0805 541-47KATR-ND DNP
19 C1, C2, C8, C9 4 DNP, CSMD0805 DNP
20 SW2 1 EVQ-11L05R P8079STB-ND DNP, Lacon: 1251459
21 SW1 1 EVQ-11L05R P8079STB-ND DNP, Lacon: 1251459
DNP: headers enclosed with kit.
22 J3, J4, J5, J6 4 16-pin header, TH SAM1029-16-ND
DNP: receptacles enclosed with kit.
23 J3, J4, J5, J6 4 16-pin receptacle, TH SAM1213-16-ND
27 U1 1 Socket:IC51-0644-807 Manuf. Yamaichi
DNP: enclosed with kit.
28 U1 2 MSP430FR6972IPMR
Is supplied by TI.
DNP: MS3V-TR1 Micro Crystal, DNP, enclosed in kit,
29 Q1 1 depends on application
(32,768kHz/ 20ppm/12,5pF) keep vias free of solder
30 Q2 1 DNP, Crystal depends on application DNP, keep vias free of solder
DIODE0805
34 Rubber stand off 4 Buerklin: 20H1724 apply to corners at bottom side

www.ti.com MSP-TS430RGC64B
B.26 MSP-TS430RGC64B
Figure B-52. MSP-TS430RGC64B Target Socket Module, Schematic

MSP-TS430RGC64B www.ti.com
Jumper JP3
1-2 (int): Power supply from JTAG interface Jumper JP1
2-3 (ext): External power supply Open to measure current

Connector J5
Jumpers JP5 to JP10 Jumper JP3 to "ext"
If the system should
be supplied from LDOI (J6),
close JP4 and set JP3 to "ext"
D1
Jumper JP2
Figure B-53. MSP-TS430RGC64B Target Socket Module, PCB

www.ti.com MSP-TS430RGC64B
Table B-27. MSP-TS430RGC64B Bill of Materials

No. per
Board
1 C1, C2 0 12pF, SMD0805 DNP
2 C3, C4 0 47pF, SMD0805 DNP
3 C6, C7, C10 3 10uF, 6.3V, SMD0805
C5, C11,
4 C13, C14, 5 100nF, SMD0805 311-1245-2-ND
C15
5 C8 1 2.2nF, SMD0805
6 C9 1 470nF, SMD0805 478-1403-2-ND
7 C16 1 4.7uF, SMD0805
8 C17 1 220nF, SMD0805
SAM1029-16-ND (Header)
DNP: Headers and receptacles enclosed
with kit. Keep vias free of solder:
(Receptacle)
11 J5 , J6 2 3-pin header, male, TH
JP3, JP5,
JP6, JP7,
JP8, JP9,
pins 1-2 on JP3,
JP10
JP1, JP2,
13 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header
JP4
14 10 Jumper 15-38-1024-ND See Pos. 12 and Pos. 13
16 BOOTST 0 10-pin connector, male, TH "DNP Keep vias free of solder"
12.5pF
Q2: 4MHz Buerklin:
78D134
Insulating
disk to Q2
=70.08.121
20 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4,
R6, R8,
R9,R10, R11,
R12
22 R5 1 47k Ω, SMD0805 541-47000ATR-ND
Socket: QFN11T064-006-
N-HSP
26 D3,D4
27 MSP430 2 MSP430F5310 RGC DNP: enclosed with kit, supplied by TI

MSP-TS430RGC64C www.ti.com
B.27 MSP-TS430RGC64C
The MSP-TS430RGC64C target board has been designed with the option to operate with the target
device DVIO input voltage supplied via header J6 (see Figure B-54). This development platform does not
supply the 1.8-V DVIO rail on board and it MUST be provided by external power supply for proper device
operation. For correct JTAG connection, programming, and debug operation, it is important to follow this
procedure:
1. Make sure that the VCC and DVIO voltage supplies are OFF and that the power rails are fully
discharged to 0 V.
2. Enable the 1.8-V external DVIO power supply.
3. Enable the 1.8-V to 3.6-V VCC power supply (alternatively, this supply can be provided from the MSP-
FET430UIF JTAG debugger interface).
4. Connect the MSP-FET430UIF JTAG connector to the target board.
5. Start the debug session using IAR or CCS IDE.
For more information on debugging the MSP430F522x and MSP430F525x, see the device-specific data
sheets (MSP430F522x and MSP430F525x) and Designing with MSP430F522x and MSP430F521x
Devices.
For debugging of devices (MSP430F524x and MSP430F523x) without use of the DVIO power domain,
short JP4 with the jumper.

113
MSP-TS430RGC64C
Hardware
1 2 3 4 5 6
JP5 JP6 JP7 JP8 JP9 JP10 J5
14 13 TCK 1 1 1 1 1 1 1
R7 TDO <-- SBW
12 11 330R 2 2 2 2 2 2 GND 2
RST/NMI RSTDVCC_SBWTDIO C M I O
10 9 GND 3 3 3 3 3 3 <-- JTAG 3
Figure B-54. MSP-TS430RGC64C Target Socket Module, Schematic

A RST/NMI TCK TMS TDI TDO A
8 7 TCK PINHEAD_1X3 PINHEAD_1X3 PINHEAD_1X3 PINHEAD_1X3 PINHEAD_1X3 PINHEAD_1X3 PINHEAD_1X3
6 5
TMS tbd C3 XTLGND2
4 3 GND
TDI
2 1 TEST/SBWTCK
26MHz/ASX53
TDO
QUARZ_4PIN
DVCC Q2
JTAG R9
0R
D3
R10 SHORTCUT2
3 0R C4
ext tbd
2
VCC
J4
R12
R11
1
int C8 BSL
0R 0R
16
15
14
13
12
10
9
8
7
6
5
4
3
2
1
11
JP3
R5

CN-ML10
2.2nF 47K 9 0 1
7 8
TEST/SBWTCK
M
5 6
O
C
JP1 3 4
RSTDVCC_SBWTDIO P1.2/TA0.1
1 1 2
P1.1/TA0.0
2
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
R2 BOOTST
B GND B
PINHEAD_1X2 0R
P5.3/XT2OUT
RST/NMI
PJ.0/TDO
RSTDVCC/SBWTDIO
PJ.2/TMS
BSLEN
TEST/SBWTCK
PJ.3/TCK
P7.5/TB0.5
P7.4/TB0.4
P7.3/TB0.3
P7.2/TB0.2
P7.1/TB0.1
P7.0/TB0.0
P5.2/XT2IN
PJ.1/TDI/TCLK
C6 C5
100nF 10uF J1 DVCC
1 1 P6.0/CB0/A0 P4.7/PM_NONE 48 16
10uF 2 2 47 15
R1
C10 3 3
P6.1/CB1/A1
P6.2/CB2/A2 P4.5/PM_UCA1RXD
P4.6/PM_NONE
46 14 DVIO Power Circle
0R
4 4 P6.3/CB3/A3 P4.4/PM_UCA1TXD 45 13
5 5 P6.4/CB4/A4 P4.3/PM_UCB1CLK 44 12
100nF 6 6 P4.2/PM_UCB1SOMI 43 11 PINHEAD_1X3
SHC1 P6.5/CB5/A5 GND
7 7 P4.1/PM_UCB1SIMO 42 10 3 JP4
C14 P6.6/CB6/A6
8 8 P6.7/CB7/A7 U1 P4.0/PM_UCB1STE 41 9 2 1
C1 12pF 9 9 DVIO 40 8 1 2
P5.0/A8/VEREF+
10 10 MSP430F5229 DVSS 39 7 C15 C16
P5.1/A9/VEREF-
J6 PINHEAD_1X2
11 11 AVCC P3.4/UCA0RXD/UCA0SOMI 38 6
12 12 P3.3/UCA0TXD/UCA0SIMO 37 5
XTLGND R6 P5.4/XIN
Q1 13 13 P3.2/UCB0CLK/UCA0STE 36 4 100nF 4.7uF
0R R8 P5.5/XOUT
14 AVSS 14 AVSS P3.1/UCB0SOMI/UCB0SCL 35 3
0R
15 DVCC 15 34 2
P2.6/RTCCLK/DMAE0
P3.0/UCB0SIMO/UCB0SDA
P1.6/TA1CLK/CBOUT
DVCC
P2.2/TA2CLK/SMCLK
C 33 C
P1.0/TA0CLK/ACLK
C2 16 16 DVSS P2.7/UCB0STE/UCA0CLK 1
12pF GND
DVCC J3
THERMAL_1
THERMAL_2
THERMAL_3
THERMAL_4
THERMAL_5
THERMAL_6
THERMAL_7
THERMAL_8
P1.1/TA0.0
P1.2/TA0.1
P1.3/TA0.2
P1.4/TA0.3
P1.5/TA0.4
P1.7/TA1.0
P2.0/TA1.1
P2.1/TA1.2
P2.3/TA2.0
P2.4/TA2.1
P2.5/TA2.2
VCORE

C7 C13
10uF 100nF
VCORE 17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
65
66
67
68
69
70
71
72
GND GND
D1
1 2
R3
P1.1/TA0.0
P1.2/TA0.1
1
2
330R R4
GND ???
JP2
0R

470nF
C9
MSP430
10
12
13
14
15
16
11
1
2
3
4
5
6
7
DVCC 8
9
D GND Tools D
J2
Comment: TI Friesing
Date: Name:
Design: 12/14/10 S.G. MSP-TS430RGC64C
Appr.: Title of Schematic
Rev.: Drawing#: Revision: 1.1
File: MSP-TS430RGC64C.sch Page: 1 of 1 Mentor Pads Logic V9 Size:
1 2 3 4 5 6
www.ti.com
MSP-TS430RGC64C www.ti.com
Jumper JP3
Connector J6
to supply DVIO
Jumper JP4
Jumpers JP5 to JP10 For F524x devices, close.
Close 1-2 to debug in Spy-Bi-Wire mode For F522x, F523x, and F525x devices,
Close 2-3 to debug in 4-wire JTAG mode close only if one power supply is used
for VCC and DVIO, and if VCC is not
higher then 1.98 V. Otherwise, supply
DVIO over J6.
Do not close if VCC > 1.98 V, as it may
damage the chip.
Connector J5
External power connector for DVCC
Set jumper JP3 to "ext"
IMPORTANT NOTE:
Rev1.0 of the board does not have
connection from pin 4 of BOOTST to
pin 64 of MCU. To use BSL, these pins
D1 should be connected by a wire.
Jumper JP2
Figure B-55. MSP-TS430RGC64C Target Socket Module, PCB

www.ti.com MSP-TS430RGC64C
Table B-28. MSP-TS430RGC64C Bill of Materials

Item Qty Reference Value Description Comment Supplier No.
1 0 C1, C2 12pF CAP, SMD, Ceramic, 0805 DNP C1 C2
2 0 C3, C4 CAP, SMD, Ceramic, 0805 DNP C3 C4
4 3 C5, C7, C10 10uF CAP, SMD, Ceramic, 0805
5 5 C8 C6 C13-15 100nF CAP, SMD, Ceramic, 0805 Digi-Key: 311-1245-2-ND
5 5 C8 2.2nF CAP, SMD, Ceramic, 0805
6 1 C9 470nF CAP, SMD, Ceramic, 0805 Digi-Key: 478-1403-2-ND
7 1 C16 4.7uF CAP, SMD, Ceramic, 0805
8 1 D1 Green LED LED, SMD, 0805
DNP: headers and
Pin header 1x16: Grid: 100mil
9 4 J1-J4 16-pin header kit. Keep vias free of solder.
(2.54 mm)
: Header SAM1029-16-ND
: Receptacle SAM1213-16-ND
10 2 J5, J6 3-pin header, male, TH SAM1035-03-ND
(2.54 mm)
JP5, JP6, JP7, Pinheader 1x3: Grid: 100mil
11 3-pin header, male, TH place jumpers on pins 2-3 SAM1035-03-ND
JP8, JP9, JP10 (2.54 mm)
12 JP3 3-pin header, male, TH place jumper on pins 1-2 SAM1035-03-ND
(2.54 mm)
Pin header 1x2; Grid: 100mil
13 JP1, JP2, JP4 2-pin header, male, TH place jumper on header SAM1035-02-ND
(2.54 mm)
Place on: JP1, JP2, JP3,
14 10 Jumper JP4, JP5, JP6, JP7, JP8, 15-38-1024-ND
JP9, JP10
Header, THD, Male 2x7 Pin,
15 1 JTAG 2x7Pin,Wanne HRP14H-ND
Wanne, 100mil spacing
Header, THD, Male 2x5 Pin,
16 0 BOOTST 2x5Pin,Wanne DNP
Wanne, 100mil spacing
17 1 Q1 26MHz/ASX53 CRYSTAL, SMD, 5x3MM, 26MHz Only Kit.
18 0 Q2 26MHz/ASX53 CRYSTAL, SMD, 5x3MM, 26MHz 300-8219-1-ND
19 1 D3 LL103A DIODE, SMD, SOD123, Schottky Buerklin: 24S3406
20 2 R3, R7 330 Ohm, SMD0805 541-330ATR-ND
21 1 R5 47k Ohm, SMD0805 RES, SMD, 0805, 1/8W, x% 541-47000ATR-ND
R1, R2, R4, R6,
DNP: R6, R8, R9, R10,
22 R8, R9, R10, 0 Ohm, SMD0805 RES, SMD, 0805, 1/8W, x% 541-000ATR-ND
R11,R12
R11, R12
23 1 U1 Socket: QFN11T064-006-N-HSP Manuf.: Yamaichi
IC, MCU, SMD, 9.15x9.15mm
24 2 MSP430 MSP430F5229IRGCR
Thermal Pad with Socket
apply to corners at bottom
25 4 Rubber stand off Rubber stand off Buerklin: 20H1724
side
26 1 PCB 84 x 76 mm 84 x 76 mm

MSP-TS430RGC64USB www.ti.com
B.28 MSP-TS430RGC64USB
Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately
0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for
example, to run the MCU at 3.0 V, set it to 3.3 V.
Figure B-56. MSP-TS430RGC64USB Target Socket Module, Schematic

www.ti.com MSP-TS430RGC64USB
Jumper JP3 Jumper JP1

1-2 (int): Power supply from JTAG interface Open to measure current
USB1
Connector JTAG USB connector
For JTAG Tool Vcc
USB1
14
ext int
JTAG
1 3 2 1
Connector J5
GND
GND
VCC
2
JP3 J5 External power connector
JP10
JP6
JP7
JP8
JP9
JP5
SBW -> JP4 Jumper JP3 to "ext"
R36
JP1
1
1
1
1
1
1
Jumpers JP5 to JP10
R7
D3
2
2
2
2
2
2
D2
R2
R5
Close 1-2 to debug in Spy-Bi-Wire mode C39
3
3
3
3
3
3
S3
JTAG ->
C40
IC7
R10
64 J4 49
R12
C4
C3
C36 D4
C38 R35
R9
R34
R11
48
1 J1
C8
C35
C33
R33
1
Q2
U1
C6
QFN11T064-006
R1
R6 C14 Q1
C2
C1
R8
D1 C9
R4
C7 +

C5
R3
D1
Jumper JP2
Clamshell
C10
C11
J3 33
C13
C12
JP2
16
3 2 1 17 J2 32
R15
R16
LED
R13
MSP-TS430RGC64USB
S1
S2
LED3
LED2
LED1
Rev.: 1.4 RoHS
Figure B-57. MSP-TS430RGC64USB Target Socket Module, PCB

MSP-TS430RGC64USB www.ti.com
Table B-29. MSP-TS430RGC64USB Bill of Materials

No. Per
Board
1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
1.1 C3, C4 2 47pF, SMD0805
2 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND
C5, C11, C13,
3 4 100nF, SMD0805 311-1245-2-ND
C14
3.1 C10, C12 0 10uF, SMD0805 DNP: C10, C12
4 C8 1 2.2nF, SMD0805
5 C9 1 470nF, SMD0805 478-1403-2-ND
free of solder.
JP5, JP6, JP7,
JP10
10 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND place jumper on header
11 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2
12 10 Jumper 15-38-1024-ND
Q1: Micro Crystal MS1V-T1K DNP: Q1
14 Q1 0 Crystal
32.768kHz, C(Load) = 12.5pF Keep vias free of solder
15 Q2 1 Crystal Q2: 4MHz Buerklin: 78D134
16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4,
17 R6, R8, R9, 2 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R9, R12
R12
18 R10 1 100 Ω, SMD0805 Buerklin: 07E500
18 R11 1 1M Ω, SMD0805
18 R5 1 47k Ω, SMD0805 541-47000ATR-ND
19 U1 1 Socket: QFN11T064-006 Manuf.: Yamaichi
Rubber stand
21 4 Buerklin: 20H1724 Apply to corners at bottom side
off
22 MSP430 2 MSP430F5509 RGC
supplied by TI
http://www.ettinger.de/Art_Deta
Insulating disk
23 1 Insulating disk to Q2 il.cfm?ART_ARTNUM=70.08.1
to Q2
21
27 C33 1 220n SMD0603 Buerklin: 53D2074
28 C35 1 10p SMD0603 Buerklin: 56D102
29 C36 1 10p SMD0603 Buerklin: 56D102
30 C38 1 220n SMD0603 Buerklin: 53D2074
31 C39 1 4u7 SMD0603 Buerklin: 53D2086
32 C40 1 0.1u SMD0603 Buerklin: 53D2068
33 D2, D3, D4 3 LL103A Buerklin: 24S3406
34 IC7 1 TPD4E004 Manu: TI
36 LED 0 JP3QE SAM1032-03-ND DNP

www.ti.com MSP-TS430RGC64USB
Table B-29. MSP-TS430RGC64USB Bill of Materials (continued)

No. Per
Board
37 LED1 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNP
40 R13, R15, R16 0 470R Buerklin: 07E564 DNP
41 R33 1 1k4 / 1k5 Buerklin: 07E612
42 R34 1 27R Buerklin: 07E444
43 R35 1 27R Buerklin: 07E444
44 R36 1 33k Buerklin: 07E740
45 S1 0 PB P12225STB-ND DNP
46 S3 1 PB P12225STB-ND
47 USB1 1 USB_RECEPTACLE FARNELL: 117-7885

MSP-TS430PN80 www.ti.com
B.29 MSP-TS430PN80
NOTE: For MSP430F47x and MSP430FG47x devices:

Connect pins 7 and 10 (GND) externally to DVSS (see data sheet).
Connect load capacitance on Vref pin 60 when SD16 is used (see data sheet).
For use of BSL: connect pin 1 of BOOST to pin 58 of U1 and pin 3 of BOOST to pin 57 of U1.
Figure B-58. MSP-TS430PN80 Target Socket Module, Schematic

www.ti.com MSP-TS430PN80
Jumper JP2
Connector BOOTST
Connector JTAG For Bootloader Tool
For JTAG Tool
Jumper JP1
D1 2-3 (ext): External power supply
LED connected to pin 12
Connector J5
Jumper J6
Jumper JP1 to "ext"
Orient Pin 1 of
MSP430 device
Figure B-59. MSP-TS430PN80 Target Socket Module, PCB

MSP-TS430PN80 www.ti.com
Table B-30. MSP-TS430PN80 Bill of Materials

Pos. Ref Des No. per Board Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
1.1 C3, C4 0 47pF, SMD0805
3 C5 1 100nF, SMD0805 478-3351-2-ND
4 C8 1 10nF, SMD0805 478-1383-2-ND
5 D1 1 green LED, SMD0603 475-1056-2-ND
enclosed with kit.Keep vias
free of solder.
7 J5, JP1 2 3-pin header, male, TH SAM1035-03-ND
8 J6, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
9 3 Jumper 15-38-1024-ND Place on: J6, JP2, JP1/Pos1-2
32.768kHz, C(Load) = 12.5pF
13 R3 1 560 Ω, SMD0805 541-560ATR-ND
R1, R2, R4,
DNP: R4, R6, R7, R10, R11,
14 R6, R7, R10, 2 0 Ω, SMD0805 541-000ATR-ND
R12
R11, R12
15 R5 1 47k Ω, SMD0805 541-47000ATR-ND
Adhesive for example, 3M Bumpons Part
18 4 ~6mm width, 2mm height Apply to corners at bottom side
Plastic feet No. SJ-5302
19 MSP430 2 MSP430FG439IPN
supplied by TI

www.ti.com MSP-TS430PN80A
B.30 MSP-TS430PN80A
Figure B-60. MSP-TS430PN80A Target Socket Module, Schematic

MSP-TS430PN80A www.ti.com
Jumper JP3

Connector J5
Jumpers JP5 to JP10 External power connector
Close 1-2 to debug in Spy-Bi-Wire mode Jumper JP3 to "ext"
Connector J6
If the system is supplied from LDOI,
close JP4 and set JP3 to external
Orient Pin 1 of
MSP430 device
Jumper JP2
D1
Figure B-61. MSP-TS430PN80A Target Socket Module, PCB

www.ti.com MSP-TS430PN80A
Table B-31. MSP-TS430PN80A Bill of Materials

No. per
Board
1 C1, C2 0 12pF, SMD0805 DNP
2 C3, C4 0 47pF, SMD0805 DNP
C6, C7,
3 3 10uF, 6.3V, SMD0805 DNP C10
C10, C12
C5, C11,
4 C13, C14, 5 100nF, SMD0805 311-1245-2-ND
C15
5 C8 1 2.2nF, SMD0805
6 C9 1 470nF, SMD0805 478-1403-2-ND
7 C16 1 4.7uF, SMD0805
8 C17 1 220nF, SMD0805
J1, J2, J3,
J4
11 J5 , J6 2 3-pin header, male, TH
JP3, JP5,
JP6, JP7,
JP8, JP9,
pins 1-2 on JP3,
JP10
JP1, JP2,
JP4
14 10 Jumper 15-38-1024-ND See Pos. 12 and Pos. 13
15 JTAG 1 HRP14H-ND
TH
TH
12.5pF
Q2: 4MHz Buerklin:
78D134
Insulating
disk to Q2
=70.08.121
20 D3,D4 2 LL103A Buerklin: 24S3406
21 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4,
R6, R8,
R9,R10,
R11, R12
23 R5 1 47k Ω, SMD0805 541-47000ATR-ND
24 U1 1 Socket:IC201-0804-014 Manuf.: Yamaichi
27 MSP430 2 MSP430F5329IPN DNP: enclosed with kit, supplied by TI

www.ti.com

A B C D E F G H I
JTAG
RXD/SIMO 14 13 STE Jumpers JP3 to JP8 GND
8 7 TCK/SBWTCK
6 6
4
5
3
TMS
TDI BSL Tool Select: J2 6
3
2
1
Vcc 2 VCC Ext_PWR
int 1
Figure B-62. MSP-TS430PN80B Target Socket Module, Schematic

J1 GND
1
2
2 3 3 EVQ11 3 3 3 3 SPICLK/SCL SPICLK/SCL1 9 10 STE
R2
0R
1 JTAG -> 2 TEST/SBWTCK 2 RST/SBWTDIO DNP 2 PJ.0/TDO 2 PJ.1/TDI 2 PJ.2/TMS 2 PJ.3/TCK JP14 TEST/SBWTCK 7 8
JP1 1 1 1 1 1 1 5 6
SBW -> R4 C5
1
2
2 DVCC RXD/SIMO RXD/SIMO1 3 4
R3
0R
1 AVCC 47k 1.1nF JP15 TXD/SOMI/SDA1 1 2
JP2 GND P1.7
1
2
1uF/10V
TXD/SOMI/SDA P2.1 GND

C3 C4 JP16
5 100nF
P1.6 1
2
I2C RST/SBWTDIO
5
P2.0 3 UART
JP17
JP18
2 2
GND DVCC DVCC 1 1

DNP C9
1uF/10V
SAM1029-20-ND DNP R7 R15
0R
R6
R8
0R
J6
C11 C2 C6 C7
10k 10k If external supply voltage:
100nF Q1 Q2 100nF remove R3 and add R2 (0 Ohm)
DNP DNP
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
LFGND QUARZ5 QUARZ5 HFGND DVCC
0R
R5
R9
0R
connection by via DNP
DNP DNP DNP
GND LFXIN HFXIN C8 GND
DNP LFXOUT HFXOUT
C1
HFXOUT
DNP
LFXOUT
HFXIN
LFXIN
DVCC
AVCC
AVSS
AVSS
AVSS
4 4
80
79
PJ.5/LFXOUT 78
PJ.4/LFXIN 77
76
PJ.7/HFXOUT 75
PJ.6/HFXIN 74
73
P6.7/UCB3STE 72
P6.6/UCB3CLK 71
P6.5/UCB3SOMI/UCB3SCL 70
P6.4/UCB3SIMO/UCB3SDA 69
P5.7/UCA2STE/TA4.1/MCLK 68
P5.6/UCA2CLK/TA4.0/SMCLK 67
P5.5/UCA2RXD/UCA2SOMI/ACLK 66
P5.4/UCA2TXD/UCA2SIMO/TB0OUTH65
P2.4/TA1.0/UCA1CLK/A7/C11 64
P2.3/TA0.0/UCA1STE/A6/C10 63
62
61
U1
DVCC
AVCC
AVSS
AVSS
AVSS
P2.7
J5
1 P1.0 1 P1.0/TA0.1/DMAE0/RTCCLK/A0/C0/VREF-/VEREF- DVSS 60 DVSS 60
2 P1.1 2 P1.1/TA0.2/TA1CLK/COUT/A1/C1/VREF+/VEREF+ P4.6 59 59
3 P1.2 3 P1.2/TA1.1/TA0CLK/COUT/A2/C2 P4.5 58 58
4 4 P3.0/A12/C12 P4.4/TB0.5 57 57
5 5 P3.1/A13/C13 P5.3/UCB1STE 56 56
6 6 P3.2/A14/C14 P5.2/UCB1CLK/TA4CLK 55 55
SAM1029-20-ND
3 7
8
7
8
P3.3/A15/C15 P5.1/UCB1SOMI/UCB1SCL 54
P5.0/UCB1SIMO/UCB1SDA 53
54
53 3
SAM1029-20-ND
P6.0/UCA3TXD/UCA3SIMO
9 9 P6.1/UCA3RXD/UCA3SOMI P1.7/TB0.4/UCB0SOMI/UCB0SCL/TA1.052 SPICLK/SCL1 52
AVSS 10 10 P6.2/UCA3CLK P1.6/TB0.3/UCB0SIMO/UCB0SDA/TA0.051 P1.6 51
0R R12 11 11 P6.3/UCA3STE P3.7/TB0.6 50 50
12 12 P4.7 P3.6/TB0.5 49 49
PJ.0/TDO/TB0OUTH/SMCLK/SRSCG1/C6
13 13 P7.0/UCB2SIMO/UCB2SDA P3.5/TB0.4/COUT 48 48
DVCC
DVSS 14 14 P7.1/UCB2SOMI/UCB2SCL P3.4/TB0.3/SMCLK 47 47

0R R13 15 15 P8.0 P8.3 46 46
PJ.1/TDI/TCLK/MCLK/SRSCG0/C7
DNP
16 P1.3 16 45 45
P2.6/TB0.1/UCA1RXD/UCA1SOMI
P2.5/TB0.0/UCA1TXD/UCA1SIMO
P1.3/TA1.2/UCB0STE/A3/C3 P8.2
TP1TP2
PJ.2/TMS/ACLK/SROSCOFF/C8
17 17 P1.4/TB0.1/UCA0STE/A4/C4 P8.1 44 44
18 18 P2.2/TB0.2/UCB0CLK 43 43
SW2
P1.5/TB0.2/UCA0CLK/A5/C5
19 DVSS 19 DVSS P2.1/TB0.0/UCA0RXD/UCA0SOMI 42 RXD/SIMO1 42
PJ.3/TCK/SRCPUOFF/C9
20 DVCC 20 DVCC P2.0/TB0.6/UCA0TXD/UCA0SIMO/TB0CLK/ACLK 41 P2.0 41
R14DNP
P1.3
P7.3/UCB2STE/TA4.1
J3
RST/NMI/SBWTDIO
R11 DNP
P1.2
TEST/SBWTCK
2
P7.4/TA4.0/A16
P7.2/UCB2CLK
D3 2
2
1
red (DNP)
P7.5/A17
P7.6/A18
P7.7/A19
P4.2/A10
P4.3/A11
P4.0/A8
P4.1/A9
JP11
DVCC
DVSS
DNP
B.31 MSP-TS430PN80B
R10DNP
P1.1 Socket:
Yamaichi IC201-0804-014
D2
2
1
yellow (DNP) MSP430FR59XXPN
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37TEST/SBWTCK37
38RST/SBWTDIO38
39
40
JP10 DVCC
DNP
R1 330R C10
P1.0
21PJ.0/TDO
23PJ.2/TMS
24PJ.3/TCK
22PJ.1/TDI
D1 100nF
2
1
40DVCC
39DVSS
green
JP9 Title: MSP-TS430PN80B
GND
25
26
27
28
29
30
31
32
33
34
35
36
MSP-TS430PN80B
GND Target socket board for MSP430FR5994IPN device

1 1
J4
File: MSP-TS430PN80B
Hardware
SAM1029-20-ND
Date: 10/5/2015 2:54:53 PM Rev.: 1.0 Page 1/1
A3
A B C D E F G H I
126
www.ti.com MSP-TS430PN80B
Jumper J1
For Bootloader Tool For JTAG Tool
10
1
14
1
Jumpers JP3 through JP8
2 2 Close 1-2 to debug in Spy-Bi-Wire mode
Connector J2
Jumper JP3 to "ext"
Jumpers JP1 and JP2

Orient Pin 1 of
MSP device
Jumpers JP9 through JP11
D1 through D3
LEDs connected to
P1.0 through P1.2
Figure B-63. MSP-TS430PN80B Target Socket Module, PCB

MSP-TS430PN80B www.ti.com
Table B-32. MSP-TS430PN80B Bill of Materials

No. per
Board
"MSP-TS430PN80B" Rev.
1 PCB 1 90.0 x 92.5 mm 2 layers, blue solder mask
1.0
JP1, JP2,
JP14, JP15
3 JP17, JP18 2 2-pin header, male, TH SAM1035-02-ND place jumper on one side of header
JP3, JP4,
JP5, JP6,
JP7, JP8,
JP16
R2, R5, R6,
8 5 0R, 0805 541-0.0ATR-ND DNP
R8, R9
R3, R12,
9 3 0R, 0805 541-0.0ATR-ND
R13
10 C5 1 1.1nF, CSMD0805 490-1623-2-ND
11 C3, C7 2 1uF/10V, CSMD0805 490-1702-2-ND
12 R7, R15 2 10k, 0805 541-10KATR-ND
13 R4 1 47k, 0805 541-47KATR-ND
C4, C6,
14 4 100nF, CSMD0805 490-1666-1-ND
C10, C11
15 R1 1 330R, 0805 541-330ATR-ND
16 R10, R11 2 330R, 0805 541-330ATR-ND DNP
17 R14 1 47k, 0805 541-47KATR-ND DNP
C1, C2, C8,
18 4 DNP, CSMD0805 DNP
C9
19 SW2 1 EVQ-11L05R P8079STB-ND DNP, keep pads free of solder
20 SW1 1 EVQ-11L05R P8079STB-ND DNP, keep pads free of solder
21 TP1, TP2 2 Test point DNP, keep pads free of solder
22 BSL 1 HRP10H-ND
TH
23 JTAG 1 HRP14H-ND
TH
24 U1 1 Socket IC201-0804-014 Manuf. Yamaichi
25 MSP device 1 MSP430FR5994 DNP: Not enclosed in kit
DNP: MS3V-TR1
Micro Crystal, DNP, enclosed in kit,
26 Q1 1 (32768kHz, 20ppm, depends on application
keep vias free of solder
12.5pF)

129
MSP-TS430PN80C
Hardware
1 2 3 4 5 6
Ext_PWR
BSL_SCL 9 10 remove R3 and add R4 (0 ohm) I2C BSL Connection
3
2
1

1
0 R20 14 13 GND 5 6 BSLSCL 1 2 BSL_SCL TP1
DNP
BSL_SDA BSL_TX 12 11 RST/NMI BSL_RX 3 4 RST/SBWTDIO BSLSDA 3 4 BSL_SDA TP2
R3 DNP
10 9 J2 BSL_SDA BSL_TX 1 2
BSL_SCL R21 0 8 7 TCK/SBWTCK R4 0 SW4
2
DNP
0
0 6 5 TMS
4 3 TDI
2 1 TDO/SBWTDIO GND UART BSL Connection
Figure B-64. MSP-TS430PN80C Target Socket Module, Schematic

VCC
A 3 A
BSLRX 1 2 BSL_RX TP3
DNP
J1 BSLTX 3 4 BSL_TX TP4
DNP
ext 3 GND J6
4
2 VCC SW5
VCC
1
int TEST/SBWTCK1
I2C Pullups
AVSS 20
USSXTOUT_ext 19
18
AVSS 17
16
15
Ch0IN 14
CH0_OUT13
PVSS 12
PVCC 10
PVSS 9
CH1_OUT 8
Ch1IN 7
6
5
4
3
2
LCDCAP1
PVCC 11
JP9 JP10 JP5 JP6 JP7 JP8 R17 BSLSDA
3 3 3 3 3 3 DVCC 1 2
USSXTIN_ext
JTAG -> SW2 4.7k
2 TEST/SBWTCK 2 RST/SBWTDIO 2 PJ.0/TDO 2 PJ.1/TDI 2 PJ.2/TMS 2 PJ.3/TCK 3 4
75 P3.6/UCB1SIMO/UCB1SDA/TB0.6/USSXT_BOUT/LCDS35
1 1 1 1 1 1 R16 BSLSCL
VCC Current SBW ->
SW3
76 P3.7/UCB1SOMI/UCB1SCL/TB0.2/TB0OUTH/LCDS36
Measurement 4.7k
C5
JP1 DVCC R7
2 47k TP7 TP8
VCC_Meas
1 1100pF
DVSS Ch0OUT R23 DNP DNPR24 Ch1OUT
DNP DNP

Populate either Q1 or Q1A if a crystal is needed 200 200
65 P3.4/SMCLK/COM6/DMAE0/LCDS27
DNPC17 C18 DNP
AVCC C1 JP14 1000pF 1000pF JP13
66 P3.5/ACLK/COM3/COUT/LCDS26
64 P3.3/MCLK/TB0.3/XPB1/LCDS25
LFXOUT R5 LFXOUT_ext 2 Ch0IN Ch1IN 2
DNP DNP
0 1 1
C11 12pF
63 P3.2/TA1.1/COM5/LCDS28
62 P6.7/TA0.1/COM4/LCDS29
Power Rail 0.1μF Q1 DNPQ1A
Connections
Connection by via PVSS
JP2 C2
Ground pad not used

2 AVSS LFXIN R6 LFXIN_ext
DNP DNP
B 1 DVCC 0 B
61 R33/LCDCAP
12pF
79 USSXTOUT
78 USSXTIN
73 Ch0OUT
68 Ch1OUT
74 CH0_IN
67 CH1_IN
80 AVSS1
77 AVSS4
71 PVCC
70 PVCC
72 PVSS
69 PVSS
Populate either Q2 or Q2A if a crystal is needed
81
JP3 IC1 J5
2 C8 J3 60 P6.3/COM7/R23 20
1 AVCC HFXOUT_ext R9 HFXOUT 1 AVCC AVCC1 1 59 DVCC3 DVCC 19
DNP DNP
0 2 P2.2/COUT/UCA0CLK/A14/C14 2 58 DVSS3 DVSS 18
C3 22pF 3 P2.3/TA0.0/UCA0STE/A15/C15 3 57 P6.2/TB0CLK/R13/LCDREF/LCDS32 17
1uF DNP DNP 4 P1.0 P1.0/UCA1CLK/TA1.0/A0/C0/VREF-/VeREF- 4 56 P6.1/RTCCLK/R03/LCDS33 16
Q2 Q2A 5 P1.1 P1.1/UCA1STE/TA4.0/A1/C1/VREF+/VeREF+ 5 55 P7.0/TA1.0/TA1.2/XPB0/LCDS30 15
C9 6 AVSS AVSS2 6 54 P6.6/ACLK/COM2/LCDS31 14
JP4 AVSS HFXIN_ext R8 HFXIN HFGND Connection by via 7 LFXIN_ext PJ.4/LFXIN LFXIN 7 53 P6.5/SMCLK/COM1/LCDS34 13
DNP DNP
2 0 8 LFXOUT_ext PJ.5/LFXOUT LFXOUT 8 52 P6.4/MCLK/COM0 12
1 PVCC 22pF 9 AVSS AVSS3 9 51 P6.0/TA0CLK/COUT/LCDS0 11
AVSS 10 HFXIN_ext PJ.6/HFXIN/USSXT_BOUT HFXIN 10 50 P5.7/TA0.2/UCB1STE/LCDS1 10
C16 C13 11 HFXOUT_ext PJ.7/HFXOUT HFXOUT 11 49 P5.6/TB0OUTH/UCB1SOMI/UCB1SCL/LCDS2 9
47μF 1000pF 12 P2.4/TA0CLK/TB0CLK/TA1CLK/LCDS24 12 48 P5.5/TA4.1/UCB1SIMO/UCB1SDA/LCDS3 8
13 P2.6/UCA0SIMO/UCA0TXD/TA1.2/TA1.2C/LCDS23 13 47 P5.4/TA0.0/UCB1CLK/TA4.0/LCDS4 7
C14 14 P2.7/UCA0SOMI/UCA0RXD/TA4.1/TA4.1C/LCDS22 14 46 P5.3/TB0.3/UCA2STE/LCDS5 6
PVSS USSXTIN R14 USSXTIN_ext 15 TEST/SBWTCK TEST/SBWTCK 15 45 P5.2/TB0.2/UCA2CLK/LCDS6 5
DNP
0 16 RST/SBWTDIO RST/NMI/SBWTDIO 16 44 P5.1/TB0.1/UCA2SOMI/UCA2RXD/LCDS7 4
27pF 17 PJ.0/TDO PJ.0/UCA2CLK/SRSCG1/DMAE0/C10/TDO 17 43 P5.0/TB0.0/UCA2SIMO/UCA2TXD/LCDS8 3
Connection by via 18 PJ.1/TDI PJ.1/UCA2STE/SRSCG0/TA4CLK/C11/TDI/TCLK 18 42 P4.7/DMAE0/LCDS9 2
Q3 19 PJ.2/TMS PJ.2/UCA2SIMO/UCA2TXD/SROSCOFF/TB0OUTH/C12/TMS 19 41 DVSS2 DVSS 1
C15 20 PJ.3/TCK PJ.3/UCA2SOMI/UCA2RXD/SRCPUOFF/TB0.6/C13/TCK 20
C TP6 AVSS USSXT_OUT R22 USSXTOUT R15 USSXTOUT_ext C
DNP
22
23
24
25
26
27
28
29
P1.7/USSTRG/UCA3CLK/UCB0SOMI/UCB0SCL/LCDS1630
31
32
33
34
P4.1/UCA0CLK/TB0.4/UCA3SOMI/UCA3RXD/LCDS15 35
P4.2/UCA0STE/TB0.5/UCA3SIMO/UCA3TXD/LCDS14 36
37
38
39
40
21
22 0 IC357-0804-096P-1
DNP R11 27pF
0
PVSS

P2.1/UCA1STE/UCA3SOMI/UCA3RXD/LCDS18
P1.6/UCA3STE/UCB0SIMO/UCB0SDA/LCDS17
P2.0/UCA1CLK/UCA3SIMO/UCA3TXD/LCDS19
R12
P1.3/UCA1SOMI/UCA1RXD/TA1.1/A9/C9
P1.2/UCA1SIMO/UCA1TXD/TA1.0/A8/C8
0
P4.4/UCA0SOMI/UCA0RXD/LCDS12
P4.3/UCA0SIMO/UCA0TXD/LCDS13
P4.0/RTCCLK/TA4.1/MTIF_PIN_EN
P3.1/TA1CLK/TB0.1/MTIF_OUT_IN
GND AVSS
DVCC
R10
P4.6/TB0CLK/TA4CLK/LCDS10
P4.5/TA0CLK/TA1CLK/LCDS11
0
P1.4/TB0.4/UCB0STE/A2/C2
P1.5/TB0.5/UCB0CLK/A3/C3
R18 C12 LCDCAP
P2.5/TA0.2/TA4.0/LCDS21
DNP R13
TP5 DNP Use LCD_C Module DNP 4.7uF
SW1 47k R18 DNPC12
P3.0/TB0.0/LCDS20
P1.3 0 4.7uF
No LCD_C Module 0 ohm DNP
DVCC
B.32 MSP-TS430PN80C
C7 C6
D2 DVSS 1uF 0.1μF
R2
DVCC1
DVSS1

1 2 P1.1
200
2
1
DVSS
Blue DVCC
9 BSLSDA
10 BSLSCL
8 BSLRX
7 BSLTX
2 DVCC
1 DVSS
JP12 C4
6 P1.3
D D
0.1μF
D1
12
13
14
15
16
17
18
19
20
11
3
4
5
2 1 R1 P1.0
330 DVSS
2
1
Green J4 Orderable: MSP-TS430PN80C Designed for: Public Release Mod. Date: 2/16/2018
TID #: N/A Project Title: MSP-TS430PN80C
DVSS JP11 Number: MCU022 Rev: A Sheet Title:
Texas Instruments and/or its licensors do not warrant the accuracy or completeness of this specification or any information contained therein. Texas Instruments and/or its licensors do not SVN Rev: Version control disabled Assembly Variant: 001 Sheet: 1 of 2
warrant that this design will meet the specifications, will be suitable for your application or fit for any particular purpose, or will operate in an implementation. Texas Instruments and/or its Drawn By: File: MCU022A_MSP-TS430PN80C_Schematic.SchDoc Size: B http://www.ti.com
licensors do not warrant that the design is production worthy. You should completely validate and test your design implementation to confirm the system functionality for your application. Engineer: Mike Pridgen Contact: http://www.ti.com/support © Texas Instruments 2017
1 2 3 4 5 6
www.ti.com
MSP-TS430PN80C www.ti.com
Jumper J1
1-2 (Debugger): Power supply from JTAG Interface Connector JTAG Connector BSL
Connector J2

Close 1-2 to debug in Spy-Bi-Wire mode Select which BSL interface to connect to
Close 2-3 to debug in 4-wire JTAG mode connector BSL
Jumpers JP1 to JP4 I2C pullup enable switch

Open to measure current Switch On to connect I2C pullup resistors

D1, D2
Figure B-65. MSP-TS430PN80C Target Socket Module, PCB

www.ti.com MSP-TS430PN80C
Table B-33. MSP-TS430PN80C Bill of Materials

Designator Quantity Value Description Package Reference Part Number Manufacturer Comments
!PCB 1 Printed Circuit Board MCU022 Any
Header(Shrouded),
Header, 2.54mm, 5x2,
BSL 1 2.54mm, 5x2, Gold, AWHW-10G-0202-T Assman WSW
TH
TH
CAP, CERM, 1 uF, 10
C3, C7 2 1uF 0805 GRM216R61A105KA01D MuRata
V, ±10%, X5R, 0805
CAP, CERM, 0.1 µF,
C4, C6, C11 3 0.1uF 50 V, ±10%, X7R, 0805 GRM21BR71H104KA01L MuRata
0805
CAP, CERM,
C5 1 1100pF 1100 pF, 50 V, ±5%, 0805 GRM2165C1H112JA01D MuRata
C0G/NP0, 0805
CAP, CERM,
1000 pF, 50 V, ±5%,
C13 1 1000pF 0805 GCM2165C1H102JA16D MuRata
C0G/NP0, AEC-Q200
Grade 1, 0805
CAP, CERM, 27 pF,
C14, C15 2 27pF 50 V, ±5%, C0G/NP0, 0603 GRM1885C1H270JA01D MuRata
0603
CAP, CERM, 47 µF,
C16 1 47uF 6.3 V, ±20%, X5R, 0805 GRM21BR60J476ME15L MuRata
0805
H4 0.312 X 0.200, Black
Socket, QFP-80, Socket, QFN-80,
IC1 1 IC357-0804-096P-1 Yamaichi Electronics
0.5 mm Pitch 0.5 mm Pitch
J1, J2, JP5,
JP8, JP9, Gold, TH
JP10
J3, J4, J5, Header, 100mil, 20x1, Not installed,
J6 Gold, TH included in kit
J3A, J4A, Receptacle, 2.54 mm, Receptacle, 2.54mm, Sullins Connector Not installed,
4 PPPC201LFBN-RC
J5A, J6A 20x1, Gold, TH 20x1, TH Solutions included in kit
JP1, JP2,
JP11, JP12, Gold, TH
JP13, JP14
Header (shrouded), Sullins Connector
JTAG 1 7x2 Shrouded Header SBH11-PBPC-D07-ST-BK
100 mil, 7x2, Gold, TH Solutions
Crystal, 32.768 kHz, MS3V-T1R 32.768KHZ Not installed,
Q1 1 1.4x1.4x5.0mm SMD Micro Crystal AG
12.5pF, SMD ±20PPM 12.5PF included in kit
R- 8,00M-ZTACS/MT-0,5-
Q3 1 Crystal, 8MHz, SMD 4.7x4.1mm Auris-GmbH
0,4-H-30/30-TR
RES, 330, 5%,
0.125 W, 0805
RES, 200, 5%,
0.125 W, 0805
R3, R10,
R11, R12, RES, 0, 5%, 0.125 W,
8 0 0805 CRCW08050000Z0EA Vishay-Dale
R18, R19, 0805
R20, R21
RES, 47 k, 5%,
0.125 W, 0805
RES, 4.7 k, 5%,
0.125 W, 0805
RES, 22, 5%, 0.1 W,
R22 1 22 0603 CRCW060322R0JNEA Vishay-Dale
0603

MSP-TS430PN80C www.ti.com
Table B-33. MSP-TS430PN80C Bill of Materials (continued)

Designator Quantity Value Description Package Reference Part Number Manufacturer Comments
SH‑J1,
SH‑JP1,
SH‑JP2,
SH‑JP3,
SH‑JP4,
SH‑JP5,
SH‑JP6, Alternate part
Shunt, 100mil, Gold
SH‑JP7, 15 1x2 Shunt SNT-100-BK-G Samtec number: 969102-
plated, Black
SH‑JP8, 0000-DA
SH‑JP9,
SH‑JP10,
SH‑JP11,
SH‑JP12,
SH‑JP13,
SH‑JP14
Switch, SPST-NO,
SW1, SW2 2 Off-Mom, 0.02 A, 15 6x6mm EVQ-11A04M Panasonic
VDC, TH
Switch, DPST, Slide,
SW3, SW4,
3 Off-On, 1 Pos, 0.15A, 9.65x7.12mm 78F01T Grayhill
SW5
30V, TH
CAP, CERM, 12 pF,
C1, C2 0 12pF 50 V, ±5%, C0G/NP0, 0805 CC0805JRNP09BN120 Yageo America
0805
CAP, CERM, 22 pF,
C8, C9 0 22pF 50 V, ±5%, C0G/NP0, 0805 GQM2195C1H220JB01D MuRata
0805
CAP, CERM, 4.7 µF,
C12 0 4.7uF 10 V, +80/-20%, Y5V, 0805 CC0805ZRY5V6BB475 Yageo America
0805
CAP, CERM,
C17, C18 0 1000pF 1000 pF, 50 V, ±1%, 0805 08055A102FAT2A AVX
C0G/NP0, 0805
FID1, FID2, Fiducial mark. There
FID3, FID4, 0 is nothing to buy or N/A N/A N/A
FID5, FID6 mount.
Crystal, 12 MHz,
Q1A, Q2A 0 11.5x5mm 9B-12.000MEEJ-B TXC Corporation
18 pF, TH
Crystal, 32.768 kHz, MS3V-T1R 32.768KHZ
Q2 0 1.4x1.4x5.0mm SMD Micro Crystal AG
12.5pF, SMD ±20PPM 12.5PF
R4, R5, R6, RES, 0, 5%, 0.125 W,
0 0 0805 CRCW08050000Z0EA Vishay-Dale
R8, R9 0805
RES, 47 k, 5%,
0.125 W, 0805
RES, 0, 5%, 0.1 W,
R14, R15 0 0 0603 CRCW06030000Z0EA Vishay-Dale
0603
RES, 200, 1%,
R23, R24 0 200 0805 CRCW0805200RFKEA Vishay-Dale
0.125 W, 0805
TP1, TP2, Test Point, Miniature, Black Miniature
0 Black 5001 Keystone
TP3, TP4 Black, TH Testpoint
TP5, TP6, Test Point, Miniature, Black Miniature
0 5001 Keystone
TP7, TP8 Black, TH Testpoint

www.ti.com MSP-TS430PN80USB
B.33 MSP-TS430PN80USB
NOTE: R11 should be populated.

Figure B-66. MSP-TS430PN80USB Target Socket Module, Schematic

MSP-TS430PN80USB www.ti.com
Jumper JP3
1-2 (int): Power supply from JTAG debug interface
Connector JTAG
For JTAG Tool USB Connector
Jumper JP1
Connector J5
Jumper JP3 to "ext"
Jumpers JP5 to JP10 Jumper JP4

Close 1-2 to debug in Spy-Bi-Wire mode Close for USB bus powered device
Button S3
BSL invoke
D1
Jumper JP2
Figure B-67. MSP-TS430PN80USB Target Socket Module, PCB

www.ti.com MSP-TS430PN80USB
Table B-34. MSP-TS430PN80USB Bill of Materials

No. per
Board
1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
1.1 C3, C4 2 47pF, SMD0805
C5, C11,
3 4 100nF, SMD0805 311-1245-2-ND
C13, C14
3.1 C10, C12 0 10uF, SMD0805 311-1245-2-ND DNP: C10, C12
4 C8 1 2.2nF, SMD0805
5 C9 1 470nF, SMD0805 478-1403-2-ND
DNP: headers and
7 J1, J2, J3, J4 4 20-pin header, TH SAM1029-20-ND receptacles enclosed with kit.
DNP: headers and
receptacles enclosed with kit.
: Receptacle
JP5, JP6,
JP7,
9 6 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3
JP8,JP9,
JP10
JP4 1 SAM1035-02-ND Place jumper only on one pin
11 JP3 1 3-pin header, male, TH SAM1035-03-ND Place jumper on pins 1-2
Place on: JP1, JP2, JP3,
12 10 Jumper 15-38-1024-ND JP4, JP5, JP6, JP7, JP8,
JP9, JP10
DNP: Q1 Keep vias free of
solder
12.5pF
15 Q2 1 Crystal "Q2: 4MHzBuerklin: 78D134"
16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4,
17 R6, R8, R9, 2 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R9, R12
R12
18 R10 1 100 Ω, SMD0805 Buerklin: 07E500
18 R11 0 1M Ω, SMD0805 DNP
18 R5 1 47k Ω, SMD0805 541-47000ATR-ND
Rubber Apply to corners at bottom
21 4 Buerklin: 20H1724
standoff side
22 MSP430 2 MSP430F5529
supplied by TI
http://www.ettinger.de/Art_De
Insulating
23 1 Insulating disk to Q2 tail.cfm?ART_ARTNUM=70.0
disk to Q2
8.121
27 C33 1 220n Buerklin: 53D2074
28 C35 1 10p Buerklin: 56D102
29 C36 1 10p Buerklin: 56D102
30 C38 1 220n Buerklin: 53D2074

MSP-TS430PN80USB www.ti.com
Table B-34. MSP-TS430PN80USB Bill of Materials (continued)

No. per
Board
31 C39 1 4u7 Buerklin: 53D2086
32 C40 1 0.1u Buerklin: 53D2068
R13, R15,
40 0 470R Buerklin: 07E564 DNP
R16
41 R33 1 1k4 Buerklin: 07E612
42 R34 1 27R Buerklin: 07E444
43 R35 1 27R Buerklin: 07E444
44 R36 1 33k Buerklin: 07E740
46 S3 1 PB P12225STB-ND

www.ti.com MSP-TS430PZ100
B.34 MSP-TS430PZ100
NOTE: Connections between the JTAG header and pins XOUT and XIN are no longer required and should not be
made.
Figure B-68. MSP-TS430PZ100 Target Socket Module, Schematic
MSP-TS430PZ100 www.ti.com
Jumper J6
Open to disconnect LED Jumper J7
Connector JTAG
For JTAG Tool
D1 Connector BOOTST
LED connected to pin 12 For Bootloader Tool
Connector J5
External power connection
Remove R8 and jumper R9
Figure B-69. MSP-TS430PZ100 Target Socket Module, PCB

www.ti.com MSP-TS430PZ100
Table B-35. MSP-TS430PZ100 Bill of Materials

No. per
Board
1 C1, C2 0 12pF, SMD0805 DNP
1b C3, C4 0 47pF, SMD0805
2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND DNP: C6
3 C5 1 100nF, SMD0805 478-3351-2-ND
4 C8 1 10nF, SMD0805 478-1383-2-ND
5 C9 1 470nF, SMD0805 478-1403-2-ND
6 D1 1 yellow LED, TH, 3mm, T1 511-1251-ND
DNP: Headers and
9 J6, J7 2 2-pin header, male, TH SAM1035-02-ND place jumper on header
solder
13 Q1, Q2 0 Crystal 32.768kHz, C(Load) =
solder
12.5pF
14 R3 1 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4,
15 R8, R9, R10, 3 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R9, R10, R12
R11, R12
16 R5 1 47k Ω, SMD0805 541-47000ATR-ND
Socket: IC201-1004-008 or
IC357-1004-53N
18 PCB 1 82 × 90 mm 2 layers
20 MSP430 2 MSP430FG4619IPZ
supplied by TI

MSP-TS430PZ100A www.ti.com
B.35 MSP-TS430PZ100A
Figure B-70. MSP-TS430PZ100A Target Socket Module, Schematic

www.ti.com MSP-TS430PZ100A
Jumper JP3
Jumper JP1
Connector JTAG Open to measure current
For JTAG Tool
Connector BOOTST
For Bootloader Tool
Jumper JP2
Connector J5 Open to disconnect LED
Jumper JP3 to "ext" D1
Orient Pin 1 of
MSP430 Device
Figure B-71. MSP-TS430PZ100A Target Socket Module, PCB

MSP-TS430PZ100A www.ti.com
Table B-36. MSP-TS430PZ100A Bill of Materials

No. per
Board
1 C1, C2 0 12pF, SMD0805 DNP
1b C3, C4 0 47pF, SMD0805
3 C5, C11, C14 3 100nF, SMD0805 311-1245-2-ND
4 C8 1 10nF, SMD0805 478-1358-1-ND
5 C6 0 470nF, SMD0805 478-1403-2-ND DNP
6 D1 1 green LED, SMD0805 67-1553-1-ND
DNP: Headers and
10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND pPlace jumper on header
12 3 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3
solder
15 Q1, Q2 0 Crystal 32.768kHz, C(Load) =
solder
12.5pF
16 R3 1 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4,
R6, R7, R8, DNP: R4, R6, R7, R8, R9,
17 2 0 Ω, SMD0805 541-000ATR-ND
R9, R10, R10, R11, R12
R11, R12
18 R5 1 47k Ω, SMD0805 541-47000ATR-ND
19 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi
Rubber Apply to corners at bottom
21 4 Select appropriate
standoff side
22 MSP430 2 MSP430F47197IPZ
supplied by TI

www.ti.com MSP-TS430PZ100B
B.36 MSP-TS430PZ100B
Figure B-72. MSP-TS430PZ100B Target Socket Module, Schematic

MSP-TS430PZ100B www.ti.com
Jumper JP3
Connector J5
Jumper JP3 to "ext"
Jumper JP1
JP11, JP12, JP13

Jumpers JP5 to JP10 Connect 1-2 to connect
Close 1-2 to debug in Spy-Bi-Wire mode AUXVCCx with DVCC
Close 2-3 to debug in 4-wire JTAG mode or drive AUXVCCx externally
D1
Jumper JP2
Figure B-73. MSP-TS430PZ100B Target Socket Module, PCB

www.ti.com MSP-TS430PZ100B
Table B-37. MSP-TS430PZ100B Bill of Materials

No. per
Board
1 C1, C2 0 12pF, SMD0805 DNP
C4, C5,
2 C6 , C7, 6 100nF, SMD0805 311-1245-2-ND
C8, C9
3 C10, C26 2 470 nF, SMD0805 478-1403-2-ND
4 C11, C12 1 10 uF / 6.3 V SMD0805 C12 DNP
C13, C14,
5 C16, C18, 6 4.7 uF SMD0805
C19, C29
J1, J2, J3,
J4
8 J5 1 3-pin header, male, TH
JP3, JP5,
JP6, JP7,
JP8, JP9,
pins 1-2 on JP3,
JP10
JP1, JP2,
JP4
JP11, JP12,
11 3 4-pin header, male, TH place jumper on header 1-2
JP13
12 13 Jumper 15-38-1024-ND See Pos. 9 and Pos. 10 and Pos. 11
15 JTAG 1 HRP14H-ND
TH
TH
21 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4,
22 R6, R8, 2 0 Ohm, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R10, R11
R10, R11
23 R5 1 47k Ω, SMD0805 541-47000ATR-ND
27 MSP430 2 MSP430F6733IPZ DNP: enclosed with kit, supplied by TI

www.ti.com

BSL Interface LDOI/LDOO Interface
VCC
VCC
Note: If the system should be 1 JP4

supplied via LDOI (J6) close JP4 2
BOOTST and set JP3 to external
DNP
LL103A
9 10 R10 0R
TEST/SBWTCK 7 8
Figure B-74. MSP-TS430PZ100C Target Socket Module, Schematic

D4
5 6 R11 0R LDOI 1 J6
P1.2 BSL-Rx3 4 DNP 2 LDOO
GND P1.1 BSL-Tx 1 2 3
4.7uF
C15
C20
100nF
DNP
C21
220nF
RST
GND
GND
GND

VCC
TCK
R7 330R 1 JP5 TDO 1
JP6 1 JP7 1 JP8 1 JP9 1 JP10<- SBW
JTAG 2 RST 2 C 2 M 2 I 2 O 2
14 13 TEST/SBWTCK 3 RST/NMI 3 TCK 3 TMS 3 TDI 3 TDO 3 <- JTAG
12 11 RST/NMI
10 9 C18 GND
PWR3
8 7 TCK 100nF DNP DNP
1
2
3
C3
C16
6 5 TMS R9 0R
J5
4 3 TDI C19
XTLGND2
HCTC_XTL_4
HCTC_XTL_4
JP3
VBAT
47pF
3
Q2G$1
Q2G$2
2 1 TDO 100nF XT2OUT
ext 3 GND
4.7n
Vcc
2 TEST/SBWTCK R12 0R C4
4
D3 47pF GND
1 XT2IN
int DVCC1 DNP
J4
LL103A DNP
R5
99
98
97
96
C 95
M 94
93
O 92
91
GND 90
DVCC1 89
88
VBAT 87
VBAK 86
85
84
AVSS 83
82
LDOO 81
LDOI 80
79
78
77
GND 76
100
C8 47K GND
RST
GND 4 GND
PU.1
PU.0
I
2.2nF
GND 3
10uF/6.3V
C5 R1
1 JP1 2 VBAT
0R
C7
2 1 DVCC1
100nF
+
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
100
JP11
J3
AVSS
DVCC1 1 75
1 75
2 74
2 74
3 73
3 73
10uF/6.3V
R2
C14
4 72
0R 4 72
5 71
5 71
C6
C17 6 70
6 70
+
U1
100nF
7 69
7 69 DNP
100nF 8 68 C10 100nF
DNP 8 68
9 67
9 67
DNP
AVCC
10
11
12
10
11
12
QFP100PZ 66
65
64
66
65
64 DVCC1
C11 100nF
C2 XIN R6 0R 13 63
13 63
HCTC_XTL_4
HCTC_XTL_4
14 62
XTLGND1
LFXTCLK
14 62
2
12pF 15 AVSS 61
Q1G$1
Q1G$2
R8 0R 15 61
16
16 60 P8.2 60
17 P8.1 59 GND
12pF
1
GND 17 59
XOUT 18 Socket: P8.0 58
18 58
C1 DNP 19 Yamaichi 57
DNP 19 57
20 IC201-1004-008 56
20 56
21 55
21 55
22 54
22 54
23 53
23 53
24 52
24 52
25 51
25 51
B.37 MSP-TS430PZ100C
J1
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
DVCC1
35 P1.1
36 P1.2
40 P1.6
41 P1.7
26
27
28
29
30
31
32
33
34
37
38
39
42
43
44
45
46
47
48
49
50
DNP MSP430: Ta rget-Socket MSP-TS430PZ100C
J2
C13 C12
100nF 100nF
330R D1
P1.0
MSP-TS430PZ100C
470nF
2
1
R3
JP2
GND GND
P516TR-ND
0R R4 C9 GND
1.1
Hardware
146
www.ti.com MSP-TS430PZ100C


For JTAG Tool JP11
For Bootloader Tool
14 JP3 10
1 Vcc 1 2 3 4 1
JTAG
3 2 1
GND
DVCC
VBAT
2 2
Connector J5
D3 JP5
ext
int
BOOTST
R7
JP10
R10
R11
J5
Jumpers JP5 to JP10
JP8
JP6
JP9
Jumper JP3 to "ext"
GND
GND
VCC
SBW JTAG
JP4
123
123
123
123
123
1 2 3
JP1
R2
R5 C8
D4
+
Close 2-3 to debug in 4-wire JTAG mode LDOI/LDOO
If the system should
C21
J6
C5 C7
C15
J4 JP7 C20 1 2 3
be supplied from LDOI (J6),
75
1
100 95 90 85 80 76 close JP4 and set JP3 to external
C4
C3
R12
R9
C10
Q2
5
0
C11
70
C16
1
11
Q1
5
C19
C18
R8
65
2
C1
C2
J3
R6
0
R1
C6
60
+
C17
C14
C12
C13
U1
55
C9
R4
26 30 3540 45 50
25
51
D1
J2
J1
LED connected to P1.0 D1 R3 JP2
Jumper JP2
Figure B-75. MSP-TS430PZ100C Target Socket Module, PCB

MSP-TS430PZ100C www.ti.com
Table B-38. MSP-TS430PZ100C Bill of Materials

Number
Pos. Ref Des Per Description Digi-Key Part No. Comment
Board
1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
1.1 C3, C4 2 47pF, SMD0805 DNP: C3, C4
C5, C11,
3 C13, C14, 6 100nF, SMD0805 311-1245-2-ND
C19, C20
C10, C12,
3.1 0 100nF, SMD0805 311-1245-2-ND DNP: C10, C12,C18, C17
C18,17
4 C8 1 2.2nF, SMD0805 Buerklin 53 D 292
5 C9 1 470nF, SMD0805 478-1403-2-ND
7.1 4 25-pin header, TH SAM1213-25-ND
8 J5, J6 2 3-pin header, male, TH SAM1035-03-ND
JP5, JP6,
JP7,
JP8,JP9,
JP10
10.1 JP4 1 2-pin header, male, TH SAM1035-02-ND place jumper on header
Place on: JP1, JP2, JP3, JP4, JP5, JP6,
12 10 Jumper 15-38-1024-ND
JP7, JP8, JP9, JP10
DNP: Q1
15 Q1 0 Crystal
Keep vias free of solder
17 R3, R7 2 330 Ohm, SMD0805 541-330ATR-ND
R1, R2, R4,
R6, R8, R9,
18 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11, R12
R10, R11,
R12
19 R5 1 47k Ohm, SMD0805 541-47000ATR-ND
21 PCB 1 79.5 x 99.5 mm MSP-TS430PZ100C Rev 1.0 2 layers
Rubber stand
off
23 MSP430 2 MSP430F643x DNP: enclosed with kit. Is supplied by TI.
24 C16 1 4.7 nF SMD0603 Buerklin 53 D 2042
26 D3, D4 2 LL103A Buerklin: 24S3406
27 JP11 1 4-pin header, male, TH SAM1035-04-ND Place jumper on Pin 1 and Pin 2
28 C15 1 4.7 uF, SMD0805 Buerklin 53 D 2430
29 C21 1 220nF, SMD0805 Buerklin 53 D 2381

149
MSP-TS430PZ100D
Hardware
A B C D E F G H I
10 9
8 7 TCK/SBWTCK
6 6
4
5
3
TMS
TDI J2 6
3
2
1
2 1 TDO/SBWTDIO
ext 3
Ext_PWR
Figure B-76. MSP-TS430PZ100D Target Socket Module, Schematic

Vcc 2 VCC
int 1
J1 GND
TEST/SBWTCK1 DNP
2 3 3 EVQ11 3 3 3 3 9 10
R2
-
1 JTAG -> 2 TEST/SBWTCK 2 RST/SBWTDIO DNP 2 PJ.0/TDO 2 PJ.1/TDI 2 PJ.2/TMS 2 PJ.3/TCK TEST/SBWTCK 7 8
1 1 1 1 1 1 BSLRX 5 6 DNP
JP1 SBW -> R4 C5
2 DVCC 3 4
R3
0R
1 AVCC 47k 1.1nF BSLTX 1 2
JP2 GND
DNP
C3 C4
5 1uF/10V 100nF
RST/SBWTDIO
5
GND

GND
DVCC C2 DNP
FE25-1A4
J6
DNP
0R
R6
R8
0R
C11 C9
QUARZ5
100
Q1
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
100nF DNP DNP DVCC
LFGND QUARZ5 HFGND
0R
R5
R9
0R
DNP
Q2
connection by via DNP C7 C6
DNP DNP
LFXIN HFXIN 1uF/10V 100nF
4 GND C1 LFXOUT HFXOUT DNP 4
ESICOM
ESIVSS
DNP DVCC C8
DVSS
AVCC
AVSS
AVSS
AVSS
GND
R7
0R
GND
P4.2/UCA0SIMO/UCA0TXD/UCB1CLK 100
99
98
P4.1/UCB1SOMI/UCB1SCL/ACLK/S2 97
P4.0/UCB1SIMO/UCB1SDA/MCLK/S3 96
P10.0/SMCLK/S4 95
P4.7/UCB1SOMI/UCB1SCL/TA1.2/S5 94
P4.6/UCB1SIMO/UCB1SDA/TA1.1/S6 93
P4.5/UCB1CLK/TA1.0/S7 92
P4.4/UCB1STE/TA1CLK/S8 91
P5.7/UCA1STE/TB0CLK/S9 90
P5.6/UCA1CLK/S10 89
P5.5/UCA1SOMI/UCA1RXD/S11 88
P5.4/UCA1SIMO/UCA1TXD/S12 87
86
PJ.5/LFXOUT 85
PJ.4/LFXIN 84
83
PJ.6/HFXIN 82
PJ.7/HFXOUT 81
80
79
78
77
76
IC1
DVCC 1 JP12
ESICOM
ESIVSS
DVCC3
AVCC1
DVSS3
AVSS2
AVSS1
AVSS3
ESICI
ESIVCC 2 DNP
FE25-1A1 J5
1 1 P4.3/UCA0SOMI/UCA0RXD/UCB1STE ESIVCC 75 ESIVCC 75 C13
2 2 C12
P1.4/UCB0CLK/UCA0STE/TA1.0/S1 P9.7/ESICI3/A15/C15 74 74
3 3 P1.5/UCB0STE/UCA0CLK/TA0.0/S0 P9.6/ESICI2/A14/C14 73 73
1uF/10V 100nF
4 4 P1.6/UCB0SIMO/USB0SDA/TA0.1 P9.5/ESICI1/A13/C13 72 72
5 5 DNP DNP
P1.7/UCB0SOMI/UCB0SCL/TA0.2 P9.4/ESICI0/A12/C12 71 71
6 LCDCAP 6 R33/LCDCAP P9.3/ESICH3/ESITEST3/A11/C11 70 70
3 7
8
7
8
P6.0/R23
P6.1/R13/LCDREF
P9.2/ESICH2/ESITEST2/A10/C10 69
P9.1/ESICH1/ESITEST1/A9/C9 68
69
68
GND
3
9 9 P6.2/COUT/R03 P9.0/ESICH0/ESITEST0/A8/C8 67 67
AVSS 10 10 P6.3/COM0 P1.0/TA0.1/DMAE0/RTCCLK/A0/C0/VREF-/VEREF66 P1.0 66 ESICOM
P2.1/UCA0SOMI/UCA0RXD/TB0.5/DMAE0
11 11 C14
0R R12 P6.4/TB0.0/COM1 P1.1/TA0.2/TA1CLK/COUT/A1/C1/VREF+/VEREF+65 P1.1 65
12 12 P1.2/TA1.1/TA0CLK/COUT/A2/C2 64 P1.2 64
P3.5/UCA1SOMI/UCA1RXD/TB0.1/S24
P3.4/UCA1SIMO/UCA1TXD/TB0.0/S25
470nF
PJ.0/TDO/TB0OUTH/SMCLK/SRSCG1
P6.5/TB0.1/COM2
13 13 P6.6/TB0.2/COM3 P1.3/ESITEST4/TA1.2/A3/C3 63 P1.3 63
DVCC
DVSS 14 14 P2.4/TB0.3/COM4/S43 P8.7/A4/C4 62 62 DNP

0R R13 15 15 P2.5/TB0.4/COM5/S42 P8.6/A5/C5 61 61
PJ.1/TDI/TCLK/MCLK/SRSCG0
P2.2/UCA0CLK/TB0.4/RTCCLK
DNP
16 16 P8.5/A6/C6 60 60

P2.6/TB0.5/COM6/S41
PJ.3/TCK/COUT/SRCPUOFF
PJ.2/TMS/ACLK/SROSCOFF
TP1TP2
17 17 P2.7/TB0.6/COM7/S40 P8.4/A7/C7 59 59 GND
P3.6/UCA1CLK/TB0.2/S23
P3.7/UCA1STE/TB0.3/S22
P7.7/TA1.2/TB0OUTH/S27
P2.3/UCA0STE/TB0OUTH
18 18 58 DVCC 58
SW2
P10.2/TA1.0/SMCLK/S39 DVCC2
P3.3/TA1.1/TB0CLK/S26
19 19 P5.0/TA1.1/MCLK/S38 DVSS2 57 DVSS 57
XRST/NMI/SBWTDIO
20 20 P5.1/TA1.2/S37 P7.4/SMCLK/S13 56 56
R14DNP 21 21
P8.0/RTCCLK/S21
P1.3 P7.3/TA0.2/S14 55 55
P6.7/TA0CLK/S31
P5.2/TA1.0/TA1CLK/ACLK/S36
P8.1/DMAE0/S20
P10.1/TA0.0/S28
22 22 P7.2/TA0.1/S15 54 54
P8.3/MCLK/S18
TEST/SBWTCK
P7.5/TA0.2/S30
P7.6/TA0.1/S29
P5.3/UCB1STE/S35
23 23 P3.0/UCB1CLK/S34 P7.1/TA0.0/S16 53 53
R11 DNP 24 24
P1.2 P7.0/TA0CLK/S17 52 52
2 25 25
P3.1/UCB1SIMO/UCB1SDA/S33
P2.0/UCA0SIMO/UCA0TXD/TB0.6/TB0CLK51 BSLTX51 2
P8.2/S19
D3 P3.2/UCB1SOMI/UCB1SCL/S32
2
1
DVCC1
DVSS1
red (DNP)
JP11 J3 FE25-1A3
B.38 MSP-TS430PZ100D
R10DNP
P1.1 MSP430FR698XPZ Socket:
26
27
28 TEST/SBWTCK28
29 RST/SBWTDIO29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
D2 Yamaichi IC201-1004-008
2
1

yellow (DNP)
JP10 LCDCAP DVCC
30 PJ.0/TDO
32 PJ.2/TMS
33 PJ.3/TCK
31 PJ.1/TDI
27 DVCC
26 DVSS
50 BSLRX
R1 330R
P1.0 C15 C10
FE25-1A2
D1
2
1
green 4u7 100nF
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
JP9 DNP Titel: MSP-TS430PZ100D Bearb.:Petersen
GND
J4
Target Socket Board for MSP430FR698xPZ, FR688xPZ
Dok: 1099/1/001/01.1
1 GND GND
1
File: MSP-TS430PZ100D
Datum:7/9/2013 5:23:25 PM Rev.: 1.2 Seite 1/1
A3
A B C D E F G H I
www.ti.com
MSP-TS430PZ100D www.ti.com
Jumper J1
Connector BSL Connector JTAG 1-2 (int): Power supply from JTAG interface
For Bootloader Tool For JTAG Tool 2-3 (ext): External power supply
RST/SBWTDIO
10 14
TMS
TDO
TCK
TDI
1 1
TEST/SBWTCK
2 2 JTAG
Jumper JP3 to JP8
BSL JTAG Close 1-2 to debug in Spy-Bi-Wire mode
PWR J1
Ext. 1 SBW
JP8 1
JP7 1
JP6 1
JP5 1
JP4 1
JP3 1
int
Pwr.
ext
R3
R2
Vcc
C10
Vcc
R13
Connector J2 GND
External power connector GND 50 45 40 35 30 J4 26
R4
Jumper J1 to “ext” J2 C5
SW1
J5 51 Switch SW1
25
TP2
Device reset
GND
RESET
Jumper JP1
55
RoHS
20
DVCC C6
MSP-TS430PZ100D
JP1
C7
Switch SW2 P1.3
60
Connected to P1.3
SW2
15
Rev. 1.2
IC1
C13
C12
R14
LEDs connected to
65
JP10
JP11
P1.0, P1.1, P1.2 through Orient Pin 1 of MSP430 device

JP9
10
C15
JP9, JP10, JP11
(only D1 assembled) 1
R12
D3 R11
D2 R10
D1 R1
70
C14 Q2 Q1 C11
HF and LF oscillators with
C3
C4
5
capacitors and resistors
P1.2
P1.1
P1.0
J3 TP1 to connect pinheads

ESIVCC
R8
R5
C1
R9
C2
R6
C9
C8
75
JP12
1
R7 GND
JP2
AVCC 76 J6 80 85 90 95 100
Figure B-77. MSP-TS430PZ100D Target Socket Module, PCB

www.ti.com MSP-TS430PZ100D
Table B-39. MSP-TS430PZ100D Bill of Materials

Number
Pos. Ref Des Per Description Digi-Key Part No. Comment
Board
1 PCB 1 90.0 x 100.0 mm MSP-TS430PZ100D 2 layers, white solder mask
Rev 1.2
JP9
3 JP10, JP11, 3 2-pin header, male, TH SAM1035-02-ND DNP, keep pads free of solder
JP12
JP5, JP6,
JP7, JP8
7 R2, R3, R5, 6 0R, 0805 541-0.0ATR-ND DNP
R6, R8, R9
8 R7, R12, R13 3 0R, 0805 541-0.0ATR-ND
9 C5 1 1.1nF, CSMD0805 490-1623-2-ND
10 C3, C7 2 1uF/10V, CSMD0805 490-1702-2-ND
11 C12 1 1uF/10V, CSMD0805 490-1702-2-ND DNP
12 R4 1 47k, 0805 541-47KATR-ND
13 C4, C6, C10, 4 100nF, CSMD0805 490-1666-1-ND
C11
14 C13 1 100nF, CSMD0805 490-1666-1-ND DNP
15 C15 1 4u7, CSMD0805 445-1370-1-ND DNP
16 R1 1 330R, 0805 541-330ATR-ND
17 C14 1 470nF, CSMD0805 587-1290-2-ND DNP
18 R10, R11 2 330R, 0805 541-330ATR-ND DNP
19 R14 1 47k, 0805 541-47KATR-ND DNP
20 C1, C2, C8, 4 DNP, CSMD0805 DNP
C9
21 SW2 1 EVQ-11L05R P8079STB-ND DNP
22 SW1 1 EVQ-11L05R P8079STB-ND DNP
23 J3, J4, J5, J6 4 25-pin header, TH DNP: headers and receptacles enclosed
24 J3, J4, J5, J6 4 25-pin receptacle, TH DNP: headers and receptacles enclosed
26 BSL 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder
28 IC1 1 Socket: IC201-1004-008 Manuf. Yamaichi
29 IC1 1 MSP430FR6989 DNP: enclosed with kit. Is supplied by TI
30 Q1 1 DNP: MS3V-TR1 depends on application Micro Crystal, DNP, enclosed in kit, keep
(32768kHz/20ppm/12,5pF) vias free of solder
31 Q2 1 DNP, Crystal depends on application DNP, keep vias free of solder
35 Rubber 4 Buerklin: 20H1724 apply to corners at bottom side
stand off

MSP-TS430PZ100E www.ti.com
B.39 MSP-TS430PZ100E
Figure B-78. MSP-TS430PZ100E Target Socket Module, Schematic

www.ti.com MSP-TS430PZ100E
Jumper J1
1-2 (Debugger): Power supply from JTAG interface Connector JTAG Connector BSL
Connector J2

Close 1-2 to debug in Spy-Bi-Wire mode Select which BSL interface to connect
Close 2-3 to debug in 4-wire JTAG mode to connector BSL
Jumpers JP1 to JP4

Open to measure current I2C pullup enable switch
Switch On to connect I2C pullup resistors
Jumpers JP11, JP12

D1, D2
Figure B-79. MSP-TS430PZ100E Target Socket Module, PCB

MSP-TS430PZ100E www.ti.com
Table B-40. MSP-TS430PZ100E Bill of Materials

2 layers, yellow solder
1 PCB1 1 PCB, 3.20" x 4.50"
mask
Header(Shrouded), 2.54mm, 5x2, AWHW-10G-0202-T-
2 BSL 1
Gold, TH ND
CAP, CERM, 12 pF, 50 V, ±5%,
3 C1, C2 2 311-1100-1-ND DNP
C0G/NP0, 0805
CAP, CERM, 1 µF, 10 V, ±10%,
4 C3, C7 2 490-1702-1-ND
X5R, 0805
CAP, CERM, 0.1 µF, 50 V, ±10%,
5 C4, C6, C10, C11 4 490-1666-1-ND
X7R, 0805
CAP, CERM, 1100 pF, 50 V, ±5%,
6 C5 1 490-1623-1-ND
C0G/NP0, 0805
CAP, CERM, 22 pF, 50 V, ±5%,
7 C8, C9 2 490-3608-1-ND DNP
C0G/NP0, 0805
CAP, CERM, 4.7 µF, 10 V, +80/-
8 C12 1 311-1371-2-ND DNP
20%, Y5V, 0805
CAP, CERM, 1000 pF, 50 V, ±5%,
9 C13 1 490-8032-1-ND
C0G/NP0, AEC-Q200 Grade 1, 0805
CAP, CERM, 27 pF, 50 V, ±5%,
10 C14, C15 2 490-1413-1-ND
C0G/NP0, 0603
CAP, CERM, 47 µF, 6.3 V, ±20%,
11 C16 1 490-9960-1-ND
X5R, 0805
12 D1 1 LED, Green, SMD 754-1939-1-ND
13 D2 1 LED, Blue, SMD 732-4982-1-ND
14 H1, H2, H3, H4 4 125mil Mounting Hole
Bumpon, Cylindrical, 0.312 X 0.200,
15 H5, H6, H7, H8 4 SJ5746-0-ND
Black
16 IC1 1 Socket, QFP-100, 0.5 mm Pitch
J1, J2, JP5, JP6, JP7,
17 8 Header, 100mil, 3x1, Gold, TH SAM1029-03-ND
JP8, JP9, JP10
DNP: Headers are
18 J3, J4, J5, J6 4 Header, 100mil, 25x1, Gold, TH SAM1029-25-ND enclosed in kit. Keep
vias free of solder
19 J3, J4, J5, J6 4 Receptacle, 100mil, 25x1, Gold, TH SAM1213-25-ND enclosed in kit. Keep
vias free of solder
JP1, JP2, JP3, JP4,
20 JP11, JP12, JP13, 8 Header, 100mil, 2x1, Gold, TH SAM1029-02-ND
JP14
Header (shrouded), 100 mil, 7x2,
21 JTAG 1 S9170-ND
Gold, TH
DNP: Keep holes free
22 Q1, Q2 2 32.768kHz ±20ppm 12.5pF 94M8466
of solder
23 Q3 1 ZTACS Crystal Resonator 77D9806 DNP
24 R1 1 RES, 330, 5%, 0.125 W, 0805 541-330ACT-ND
25 R2 1 RES, 200, 5%, 0.125 W, 0805 541-200ACT-ND
R3, R10, R11, R12,
26 8 RES, 0, 5%, 0.125 W, 0805 541-0.0ACT-ND
R18, R19, R20, R21
R4, R5, R6, R8, R9,
27 7 RES, 0, 5%, 0.1 W, 0603 541-0.0GCT-ND DNP
R14, R15
28 R7 1 RES, 47 k, 5%, 0.125 W, 0805 541-47KACT-ND
29 R13 1 RES, 47 k, 5%, 0.125 W, 0805 541-47KACT-ND DNP
30 R16, R17 2 RES, 4.7 k, 5%, 0.125 W, 0805 541-4.7KACT-ND
31 R22 1 RES, 22, 5%, 0.1 W, 0603 541-22GCT-ND

www.ti.com MSP-TS430PZ100E
Table B-40. MSP-TS430PZ100E Bill of Materials (continued)

SH‑J1, SH‑JP1,
J1: 1-2, JP1: 1-2, JP2:
SH‑JP2, SH‑JP3,
1-2, JP3: 1-2, JP4: 1-2,
SH‑JP4, SH‑JP5,
JP5: 2-3, JP6: 2-3, JP7:
SH‑JP6, SH‑JP7,
32 15 Shunt, 100mil, Gold plated, Black 3M9580-ND 2-3, JP8: 2-3, JP9: 2-3,
SH‑JP8, SH‑JP9,
JP10: 2-3, JP11: 1-2,
JP12: 1-2, JP13: 1-2,
JP14: 1-2
SH‑JP14
33 SW1, SW2 2 Switch Tactile SPST-NO 0.02A 15V P8079STB-ND
Install with arrow
matching arrow on
Switch, DPST, Slide, Off-On, 1 Pos,
34 SW3, SW4, SW5 3 GH7727-ND PCB. S5 should be
0.15A, 30V, TH
"ON", S3 and S4
should be "OFF"
TP1, TP2, TP3, TP4,
35 6 Test Point, Miniature, Black, TH 36-5001-ND DNP
TP5, TP6

MSP-TS430PZ5x100 www.ti.com
B.40 MSP-TS430PZ5x100
Figure B-80. MSP-TS430PZ5x100 Target Socket Module, Schematic

www.ti.com MSP-TS430PZ5x100
Jumper JP3
Connector JTAG 1-2 (int): Power supply from JTAG interface
For JTAG Tool 2-3 (ext): External power supply
Connector BOOTST
For Bootloader Tool
Connector J5
Jumper JP3 to "ext"
Jumper JP1
Jumpers JP5 to JP10

Orient Pin 1 ofMSP430 device

D1
Jumper JP2
Figure B-81. MSP-TS430PZ5x100 Target Socket Module, PCB

MSP-TS430PZ5x100 www.ti.com
Table B-41. MSP-TS430PZ5x100 Bill of Materials

No. Per
Board
1 C1, C2 0 12pF, SMD0805 DNP
1b C3, C4 47pF, SMD0805
C5, C10, C11,
3 4 100nF, SMD0805 311-1245-2-ND DNP: C12, C14
C12, C13, C14
4 C8 0 2.2nF, SMD0805 DNP
5 C9 1 470nF, SMD0805 478-1403-2-ND
6 D1 1 green LED, SMD0805 67-1553-1-ND
free of solder.
JP5, JP6, JP7,
9 JP8, JP9, 6 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3
JP10
Place on JP1, JP2, JP3, JP5,
12 9 Jumper 15-38-1024-ND
JP6, JP7, JP8, JP9, JP10
32.768kHz, C(Load) = 12.5pF
16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4,
DNP: R6, R8, R9, R10, R11,
17 R6, R8, R9, 3 0 Ω, SMD0805 541-000ATR-ND
R12
R10, R11, R12
18 R5 1 47k Ω, SMD0805 541-47000ATR-ND
Rubber
21 4 Select appropriate Apply to corners at bottom side
standoff
22 MSP430 2 MSP430F5438IPZ
supplied by TI

www.ti.com MSP-TS430PZ100USB
B.41 MSP-TS430PZ100USB
Figure B-82. MSP-TS430PZ100USB Target Socket Module, Schematic

MSP-TS430PZ100USB www.ti.com

USB1
For JTAG Tool
Connector J5
Jumper JP3 to "ext"
Jumpers JP5 to JP10
Jumper JP2
D1
LED1, LED2, LED3 Jumpers LED 1, 2, 3

LEDs connected to P8.0, P8.1, P8.2 Open to disconnect LED1, LED2, LED3
Figure B-83. MSP-TS430PZ100USB Target Socket Module, PCB

www.ti.com MSP-TS430PZ100USB
Table B-42. MSP-TS430PZ100USB Bill of Materials

No. Per
Board
1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
1.1 C3, C4 2 47pF, SMD0805
C5, C11, C13,
3 5 100nF, SMD0805 311-1245-2-ND
C14, C19
C10, C12,
3.1 0 100nF, SMD0805 311-1245-2-ND DNP: C10, C12,C18, C17
C18, C17
4 C8 1 2.2nF, SMD0805
5 C9 1 470nF, SMD0805 478-1403-2-ND
7 J1, J2, J3, J4 4 25-pin header, TH SAM1029-25-ND free of solder.
: Header
: Receptacle
7.1 4 25-pin header, TH SAM1213-25-ND free of solder.
: Header
: Receptacle
JP5, JP6, JP7,
JP10
12 10 Jumper 15-38-1024-ND
Micro Crystal MS1V-T1K DNP: Q1. Keep vias free of
14 Q1 0 Crystal
32.768kHz, C(Load) = 12.5pF solder
15 Q2 1 Crystal Q2: 4MHz, Buerklin: 78D134
16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4,
17 R6, R8, R9, 3 0 Ω, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R12
R12
18 R10 1 100 Ω, SMD0805 Buerklin: 07E500
18 R11 1 1M Ω, SMD0603 not existing in Rev 1.0
18 R5 1 47k Ω, SMD0805 541-47000ATR-ND
Rubber stand
off
22 MSP430 2 MSP430F6638IPZ
supplied by TI
http://www.ettinger.de/Art_Deta
Insulating disk
23 1 Insulating disk to Q2 il.cfm?ART_ARTNUM=70.08.1
to Q2
21
24 C16 1 4.7 nF SMD0603
27 C33 1 220n SMD0603 Buerklin: 53D2074
28 C35, C36 2 10p SMD0603 Buerklin: 56D102
30 C38 1 220n SMD0603 Buerklin: 53D2074
31 C39 1 4u7 SMD0603 Buerklin: 53D2086

MSP-TS430PZ100USB www.ti.com
Table B-42. MSP-TS430PZ100USB Bill of Materials (continued)

No. Per
Board
32 C40 1 0.1u SMD0603 Buerklin: 53D2068
LED1, LED2,
36 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNP
LED3
37 R13, R15, R16 0 470R SMD0603 Buerklin: 07E564 DNP
38 R33 1 1k4 / 1k5 SMD0603 Buerklin: 07E612
39 R34 1 27R SMD0603 Buerklin: 07E444
40 R35 1 27R SMD0603 Buerklin: 07E444
41 R36 1 33k SMD0603 Buerklin: 07E740
42 S1, S2, S3 1 PB P12225STB-ND DNP S1 and S2. (Only S3)
44 JP11 1 4-pin header, male, TH SAM1035-04-ND place jumper only on Pin 1

163
MSP-TS430PZ100AUSB
The development board MSP-TS430PZ100AUSB supports the MSP430FG662x and MSP430FG642x

flash devices in the 100-pin QFP package. MSP430FG6626IPZ devices are not included in the MSP-
Hardware
USB1
VBUS
R33 R35 27R
LL103A
D2
1
VBUS
P8.0 P8.1 P8.2
DNP
D- 2
VCC
1k4 D-
PUR LED-1 1 LED-2 3 LED-3 5
R34 27R
PU.0/DP D+ 3 D+ 2 4 6
Figure B-84. MSP-TS430PZ100AUSB Target Socket Module, Schematic

PU.1/DM C38
GND 4 1 JP4
6
GND
470R
R15
470R
R16
470R
R13
C39 2
220n
5 P1.6 P1.7
SHIELD
VCC
IO4
IO3
4u7 D4
TPD4E004
C40
100R
C35 C36 LL103A

R10
2
SHIELD1 GND
GND
R11
0.1u
1M
IO1
IO2
S1
S2
LED1
LED2
LED3
10p 10p
IC7
C33
1
PU.1/DM
PU.0/DP
R36
2
33k
220n
VUSB
VBUS
1
3
S3
GND
PUR
V18
1
GND GND GND

GND
VUSB GND GND
GND
GND GND
USB Interface GND Miscellaneous
VCC
JP10
JTAG TCK 1 JP5 TDO 1
JP6 1 JP7 1 JP8 1 JP9 1 <- SBW
14 13 2 RST 2 C 2 M 2 I 2 O 2

12 11 RST/NMI 3 DNP RST/NMI 3 TCK 3 TMS 3 TDI 3 TDO 3 <- JTAG
10 9
PWR3
8 7 DNP DVCC1
TCK 100nF C18
1
2
3
6 5 TMS VBAK
J5
4 3 TDI XT2OUT C3
2 1 TDO 100nF C19 XT2IN 4.7n
XTLGND2
47pF
3
ext 3 GND R9 0R
Q2G$1
Q2G$2
HCTC_XTL_4
HCTC_XTL_4
Vcc 2 TEST/SBWTCK TEST/SBWTCK1 C16
1 R12 0R C4
4
47pF GND
int JP3 DVCC1
J4
GND
2.2nF C8 R5
100
99
98
97
96
95
94
93
92
91
90
89 DVCC1 89
88
87 VBAT 87
86 VBAK 86
85
84
83 AVSS 83
82
81 VUSB 81
80 VBUS 80
79 PU.1/DM 79
78
77 PU.0/DP 77
76
GND 47K GND
DNP
TS430PZ100AUSB kit. Free samples can be ordered from
RST 4 GND
78 PUR
90 GND
76 GND
82 V18
C5 3
94 M
92 O
95 C
C7
10uF/6,3V
R1
1 JP1
93 I
2 VBAT
0R
100
99
98
97
96
91
88
85
84
2 100nF 1 DVCC1
+
U1 JP11
P6.3/CB3/A3/OA1IP0
P6.2/CB2/A2/OA0IP0
PJ.3/TCK
TEST/SBWTCK
DVSS3
DVCC3
P6.1/CB1/A1
P6.0/CB0/A0
PJ.2/TMS
PJ.1/TDI/TCLK
PJ.0/TDO
P5.7/DMAE0/RTCCLK
P7.3/XT2OUT
VBAK
V18
RST/NMI/SBWTDIO
VUSB
VBUS
PU.1/DM
VBAT
P7.2/XT2IN
AVSS2
PUR
VSSU
PU.0/DP
DVCC1 0R NR
R14
R2
0R 10uF/6,3V
AVSS
+
www.ti.com/product/MSP430FG6626/samplebuy.
C17 C6
TP2
AVCC
C14 100nF J3
100nF
1 1 75 75
P6.4/CB4/AD0+/OA0O P9.7/S0
TP1
2 2 74 74
P6.5/CB5/AD0-/OA0N P9.6/S1
3 3 73 73
P6.6/CB6/AD1+/GSW0A P9.5/S2
4 4 72 72
P6.7/CB7/AD1-/GSW0B P9.4/S3
5 5 MSP430FG6626IPZ 71 71
P7.4/CB8/AD2+/OA1O P9.3/S4
6 6 70 70
P7.5/CB9/AD2-/OA1N P9.2/S5
7 7 69 69
P7.6/CB10/AD3+/GSW1A P9.1/S6 DNP
DNP 8 8 68 68 C10 100nF
P7.7/CB11/AD3-/GSW1B P9.0/S7
12pF 9 9 67 67
P5.0/VREF+/VEREF+ P8.7/S8
C2 10 10 66 66
Q3 P5.1//A4/DAC0 P8.6/UCB1SOMI/UCB1SCL/S9
11 11 65 65 C11 100nF
GND QUARZ5 P5.6/A5/DAC1 P8.5/UCB1SIMO/UCB1SDA/S10 DVCC1
12 NR 12 64 64
XTLGND1
NR DVCC2
DNP 13 AVSS 13 63 63
XOUT R6 0R AVSS1 DVSS2
14 XOUT 14 62 62
XIN XOUT P8.4/UCB1CLK/UCA1STE/S11
15 XIN 15 61 61
XIN P8.3/UCA1RXD/UCA1SOMI/S12
12pF

R8 0R 16 AVCC 16 60 P8.2 60
AVCC P8.2/UCA1TXD/UCA1SIMO/S13 GND
C1 17 CPCAP 17 59 P8.1 59
GND DNP CPCAP P8.1/UCB1STE/UCA1CLK/S14
18 18 58 P8.0 58
P2.0/P2MAP0/DAC0 P8.0/TB0CLK/S15
19 19 57 57
P2.1/P2MAP1/DAC1 P4.7/TB0OUTH/SVMOUT/S16
20 20 56 56
P2.2/P2MAP2 P4.6/TB0.6/S17
21 21 55 55
P2.3/P2MAP3 P4.5/TB0.5/S18
22 22 54 54
P2.4/P2MAP4/R03 P4.4/TB0.4/S19
B.42 MSP-TS430PZ100AUSB
P3.0/TA1CLK/CBOUT/S31
P3.4/TA2CLK/SMCLK/S27
23 23 53 53
P2.5/P2MAP5 P4.3/TB0.3/S20
P1.0/TA0CLK/ACLK/S39
24 24 52 52
P2.6/P2MAP6/LCDREF/R13 P4.2/TB0.2/S21
25 25 51 51
P2.7/P2MAP7/R23 P4.1/TB0.1/S22
P5.3/COM1/S42
P5.4/COM2/S41
P5.5/COM3/S40
P4.0/TB0.0/S23
P1.1/TA0.0/S38
P1.2/TA0.1/S37
P1.3/TA0.2/S36
P1.4/TA0.3/S35
P1.5/TA0.4/S34
P1.6/TA0.1/S33
P1.7/TA0.2/S32
P3.1/TA1.0/S30
P3.2/TA1.1/S29
P3.3/TA1.2/S28
P3.5/TA2.0/S26
P3.6/TA2.1/S25
P3.7/TA2.2/S24
J1
LCDCAP/R33
AVSS 22nF
C15
VCORE
DVCC1
DVSS1
COM0
Socket:
Yamaichi

IC357-1004-053N
26
27
28
29
30
31
32
33
34 P1.0 34
35
36
37
38
39
40 P1.6 40
41 P1.7 41
42
43
44
45
46
47
48
49
50
DVCC1
Target socket board MSP-TS430PZ100AUSB
DNP
C13 C12
330R D1 for MSP430FG6626IPZ device
26
27
28
29
30
31
32
33
35
36
37
38
39
42
43
44
45
46
47
48
49
50
100nF 100nF P1.0
2
1
R3
JP2
J2
GND GND
470nF
0R R4 C9 GND
1.1
www.ti.com
MSP-TS430PZ100AUSB www.ti.com

USB1
For JTAG Tool
14
1 3 2 1 1 2 3 4
GND
GND
VCC
2 Connector J5
Jumper JP3 to "ext"
Jumpers JP5 to JP10 +
1
1
1
1
1
1
2
2
2
2
2
2
3
3
3
3
3
3
75
1
100 95 90 85 80 76
5
70
+
10
65
U1
15
60
Jumper JP2
20
55
D1
26 30 35 40 45 50
25
51
J1
J2
1 2 3
LED1, LED2, LED3 Jumpers LED 1, 2, 3

LEDs connected to P8.0, P8.1, P8.2 Open to disconnect LED1, LED2, LED3
Figure B-85. MSP-TS430PZ100AUSB Target Socket Module, PCB

www.ti.com MSP-TS430PZ100AUSB
Table B-43. MSP-TS430PZ100AUSB Bill of Materials

No. Per
Board
1 PCB Rev. 1.1 1 99.65mm x 79.54mm 2 layers, red solder mask
2 C1, C2 2 12pF, SMD0805 DNP: C1, C2
C10, C12,
3 9 100nF, SMD0805 311-1245-2-ND DNP: C10, C12,C18, C17
C17, C18
4 C15 1 22nF, CSMD0805 311-1242-1-ND
5 C16 1 4.7 nF SMD0603 311-1250-1-ND
6 C3, C4 2 47pF, CSMD0805 709-1337-1-ND
7 C33, C38 2 220n SMD0603 Buerklin: 53D2074
8 C35, C36 2 10p SMD0603 Buerklin: 56D102
9 C39 1 4u7 SMD0603 Buerklin: 53D2086
10 C40 1 0.1u SMD0603 Buerklin: 53D2068
C5, C11, C13,
11 5 100nF, SMD0805 311-1245-2-ND
C14, C19
12 C6, C7 2 10uF/6.3V, Tantal Size B 511-1463-2-ND
13 C8 1 2.2nF, CSMD0805 709-1339-1-ND
14 C9 1 470nF, SMD0805 478-1403-2-ND
DIODE0805
16 D2, D4 2 LL103A, SOD-80 Buerklin: 24S3406
17 IC7 1 TPD4E004DRYR 296-23618-1-ND Manu: TI
DNP: Headers enclosed in kit.
DNP: Receptacles enclosed in
19 J1, J2, J3, J4 4 25-pin receptacle, TH SAM1213-25-ND
kit. Keep vias free of solder.
22 JP11 1 4-pin header, male, TH SAM1035-04-ND Place jumper on Pin 1 and 2
JP5, JP6, JP7,
JP10
Jumpers for
JP1, JP2, JP3,
25 JP4, JP5, JP6, 11 Jumper 15-38-1024-ND
JP7, JP8, JP9,
JP10, JP11
LED1, LED2,
28 3 FARNELL: 852-9833 DNP
LED3
29 MSP430 2 MSP430FG6626IPZ
Q2: 4MHz
30 Q2 1 Crystal
Buerklin: 78D134
MS3V-T1R (32.768kHz/
31 Q3 1
20ppm/12.5pF)
32 R1, R2, R4 3 0 Ohm, SMD0805 541-0.0ATR-ND
33 R10 1 100R, R0603 541-100GCT-ND
34 R11 1 1M, R0603 541-1.0MGCT-ND
35 R13, R15, R16 3 470R SMD0603 Buerklin: 07E564 DNP
36 R14 1 0 Ohm, SMD0805 541-0.0ATR-ND
37 R3 1 330 Ohm, SMD0805 541-330ATR-ND

MSP-TS430PZ100AUSB www.ti.com
Table B-43. MSP-TS430PZ100AUSB Bill of Materials (continued)

No. Per
Board
38 R33 1 1k4 / 1k5 SMD0603 Buerklin: 07E612
39 R34, R35 2 27R SMD0603 Buerklin: 07E444
40 R36 1 33k SMD0603 Buerklin: 07E740
41 R5 1 47k Ohm, SMD0805 541-47000ATR-ND
R6, R8, R9,
42 4 0 Ohm, SMD0805 541-000ATR-ND DNP
R12
43 S1, S2 1 PB P12225STB-ND DNP
44 S3 1 PB P12225STB-ND
45 TP1, TP2 2 Test point DNP, Keep vias free of solder
47 USB1 1 USB Receptacle FARNELL: 117-7885
Insulating disk
48 1 Insulating disk for Q2 ettinger.de 70.08.121
for Q2
Rubber stand
49 4 Buerklin: 20H1724 Apply to corners at bottom side
off

167
MSP-TS430PEU128
Hardware
A B C D E F G H I
JTAG
VCC 14 13 JP10
6 Vcc 12 11 RST/NMI
TCK
R7 330R 1 JP5 TDO 1
JP6 1 JP7 1 JP8 1 JP9 1 <- SBW 6
GND
JP3 10 9
DVDSYS 2 RST 2 PJ.3 2 PJ.2 2 PJ.1 2 PJ.0 2
4 8 7 TCK
ext TEST/SBWTCK 3 RST/NMI 3 TCK 3 TMS 3 TDI 3 TDO 3 <- JTAG
Figure B-86. MSP-TS430PEU128 Target Socket Module, Schematic

3 6 5 TMS
2 4 3 TDI
int 1 2 1 TDO
VASYS1/2
FE04-1 TEST/SBWTCK VASYS1/2
1 JP1 DVDSYS
C15
C17
C16
2
C4
VCC1
100nF
R5
VREF
100nF
4.7uF
100nF
4.7uF
47K
RST VCC1
JP11 1
C7
GND
PWR3
DNP 2 GND
AUXVCC1
1
2
3
5 3
5
J5
J4
C3 2.2nF 4 C19 GND

128
127
126
125
124
123
122
121
120
109
108
107
106
105
104
103
VCC
119
118
117
116
115
114
113
112
110
111
GND 4.7uF

TP1 TP2
GND
0R
VCC1 GND
JP12 1
R4
2 AUXVCC2 470nF AUXVCC1

AUXVCC2
VASYS1/2
VASYS1/2
VCC1 JP4 DVCC AVCC 3 C18 C10 DVDSYS GND GND
VCORE
SD6N0
SD5N0
SD4N0
SD3N0
SD2N0
SD1N0
SD0N0
SD6P0
SD5P0
SD4P0
SD3P0
SD2P0
SD1P0
SD0P0
4 GND DVCC
VREF
AVCC
AVSS
AVSS
GND
R2 0R
1
2
4.7uF
GND
C5 C11 C8 C13
128
127
126
125
124
123
122
121
120
109
108
107
106
105
104
103
119
118
117
116
115
114
113
112
110
111
100nF DNP GND
10uF/6,3V 12pF XIN
100nF 4.7uF
C2
VCORE
DVSS1
AUXVCC1
AUXVCC2
VASYS1
AVSS1
DVCC
VDSYS
SD6N0
SD6P0
SD5N0
SD5P0
SD4N0
SD4P0
VREF
AVSS2
VASYS2
SD3N0
SD3P0
SD2N0
SD2P0
SD1N0
SD1P0
SD0N0
SD0P0
AVCC
R1 0R
4 DNP
4
Q1
QUARZ5
GND J3 VCC
AVSS
102 RST 102
LFXTCLK ~RST/NMI/SBWTDIO
GND 1 R6 0R 1 101 PJ.3 101
DNP
XIN PJ.3/TCK
12pFDNP 2 R8 0R 2 100 PJ.2 100 DNP
XOUT PJ.2/TMS R11
3 AUXVCC33 99 PJ.1 99 R10
C1 XOUT AUXVCC3 PJ.1/TDI/TCLK BOOTST 0R
VCC1 4 4 98 PJ.0 98 0R
JP13 1 RTCCAP1 PJ.0/TDO DNP
5 5 97 TEST/SBWTCK 97 9 10
RTCCAP0 TEST/SBWTCK
2 AUXVCC3 6 6 96 96 TEST/SBWTCK 7 8
P1.5/SMCLK/CB0/A5 P2.3/PM_TA1.0
3 7 7 95 95 5 6
P1.4/MCLK/SDCLK/CB1/A4 P2.2/PM_TA0.2
4 8 8 94 P2.1 94 P2.1 3 4 RST
P1.3/ADC10CLK/TACLK/RTCCLK/A3 P2.1/PM_TA0.1
470nF
C26
9 9 93 P2.0 93 P2.0 1 2
P1.2/ACLK/TA3.1/A2 P2.0/PM_TA0.0
GND VEREF+ 10 VEREF+ 10 92 92
P1.1/TA2.1/VEREF+/A1 P11.5/TACLK/RTCCLK
2 P1.0 11 P1.0 11 91 91
P1.0/TA1.1/TA0.0/VEREF-/A0 P11.4/CBOUT DNP
1 10uF/6,3V 12 12 90 90 GND
DNP P2.4/PM_TA2.0 P11.3/TA2.1
JP2 GND 13 13 89 89
P2.5/PM_UCB0SOMI/PM_UCB0SCL P11.2/TA1.1
C12 14 14 88 88
P2.6/PM_USB0SIMO/PM_UCB0SDA P11.1/TA3.1/CB3
3 15 15
P2.7/PM_UCB0CLK P11.0/S0
87 87
3
330R
16 16 86 86
P3.0/PM_UCA0RXD/PM_UCA0SOMI P10.7/S1
R3
AVSS 17 17 IC1 85 85
P3.1/PM_UCA0TXD/PM_UCA0SIMO P10.6/S2
18 18 84 84
P3.2/PM_UCA0CLK P10.5/S3
19 19 83 83
P3.3/PM_UCA1CLK P10.4/S4
D1
20 20 MSP430F677XIPEU# 82 82
21 21 81 81
P3.5/PM_UCA1TXD/PM_UCA1SIMO P10.2/S6
22 22 80 80
COM0 P10.1/S7
23 23 79 79
COM1 P10.0/S8
GND 24 24 78 78

P1.6/COM2 P9.7/S9
25 25 77 77
P1.7/COM3 P9.6/S10
26 26 76 76
P5.0/COM4 P9.5/S11
27 27 75 75
P5.1/COM5 P9.4/S12
28 28 74 74
P5.2/COM6 P9.3/S13
P4.1/PM_UCA3RXD/PM_UCA3SOMI
P4.5/PM_UCB1SIMO/PM_UCB1SDA
P4.2/PM_UCA3TXD/PM_UCA3SIMO
P4.4/PM_UCB1SOMI/PM_UCB1SCL
29 29 73 73
P5.3/COM7 P9.2/S14
30 LCDCAP 30 72 72
LCDCAP LCDCAP/R33 P9.1/S15
31 31 71 71
P5.4/SDCLK/R23 P9.0/S16
32 32 70 GND 70
2 C29 33
34
33
34
P5.5/SD0DIO/LCDREF/R13
P5.6/SD1DIO/R03
DVSS2
DVSYS
69
68
DVDSYS 69
68
DVDSYS
100nF 4.7uF 100nF
2
4.7uF P5.7/SD2DIO/CB2 P8.7/S17
35 35 67 67
P4.3/PM_UCA3CLK
P4.6/PM_UCB1CLK
P6.0/SD3DIO P8.6/S18
36 36 C6 C14 C9
P6.1/SD4DIO/S39
P6.2/SD5DIO/S38
P6.3/SD6DIO/S37
66 66
B.43 MSP-TS430PEU128
P4.7/PM_TA3.0
37 37 65 65
GND P3.7/PM_UCA2TXD/PM_UCA2SIMO P8.4/S20
38 38
P4.0/PM_UCA2CLK DNP
GND
P6.4/S36
P6.5/S35
P6.6/S34
P6.7/S33
P7.0/S32
P7.1/S31
P7.2/S30
P7.3/S29
P7.4/S28
P7.5/S27
P7.6/S26
P7.7/S25
P8.0/S24
P8.1/S23
P8.2/S22
P8.3/S21
J1

39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
Titel: MSP430: Target-Socket Bearb.: Petersen
1 MSP-TS430PEU128 for F6779 Dok: 1080/1/001/01.1
1
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
File: MSP-TS430PEU128
J2
Datum: 22.05.2012 09:37:33 Rev.: 1.1 Seite 1/1
A3
A B C D E F G H I
www.ti.com
MSP-TS430PEU128 www.ti.com
JP11, JP12, JP13

Connect 1-2 to connect AUXVCCx with DVCC or Jumper JP1
drive AUXVCCx externally Open to measure current
JP4
JP1
TP1
R1
R2
Connector J5
GND
GND
VCC
GND
J5 External power connector
J4
R5
J1 128 125 120 115 110 105 C3 3 2 1 Jumper JP3 to "ext"
R4
RST/NMI
AUXVCC3
AUXVCC2
AUXVCC1
3 2 1 JP6
C12
TCK 3 2 1 JP7
100
JP13
JP12
JP11
TMS
JP10 R7
3 2 1 JP8
GND
TDI 3 2 1 JP9 Jumpers JP5 to JP10
4
D1 TDO
5
3 2 1
3
TEST/SBWTCK JP5
LED connected to P1.0 P1.0 AUXVCC Close 2-3 to debug in 4-wire JTAG mode
2
1234
1234
JTAG
SBW
JP2 R3 D1
C9
C6
1
DVCC
95
Jumper JP2
C26
C10
C15
C17
C18
C19
C13
C16
C11
C7
C8
C4
C5
10
1 Connector JTAG
IC1
R8
For JTAG Tool
90
C1
14
Orient Pin 1 of
15
C2
MSP430 device R6
JTAG
2
1
85
20
Connector BOOTST
R11 R10
80
C14 For Bootloader Tool
10
25
C29
2
1
75
BOOTST
Jumper JP3
30
1
int
MSP-TS430PEU128 2-3 (ext): External power supply
70
ext
Rev. 1.1 RoHS DVDSYS
JP3
35
65
TP2
40 45 50 55 60 64 J3
GND
J2
Figure B-87. MSP-TS430PEU128 Target Socket Module, PCB
NOTE: The MSP-TS430PEU128 Rev 1.1 ships with the following modifications:
• R7 value is changed to 0 Ω instead of 330 Ω.
• JTAG pin 8 is connected only to JP5 pin 3, and not to pin 2.
• JP5 pin 2 is connected to IC1 pin 97.
• BOOTST pin 7 is connected to IC1 pin 97.

www.ti.com MSP-TS430PEU128
Table B-44. MSP-TS430PEU128 Bill of Materials

No. Per
Board
94x119.4mm, 4 layers MSP-TS430PEU128 4 layers, green solder mask
1 PCB 1
Rev. 1.1
2 D1 1 green LED, DIODE0805 516-1434-1-ND
3 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header
JP5, JP6, JP7, JP8, 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 1-2 (SBW)
4 6
JP9, JP10
5 JP11, JP12, JP13 3 4-pin header, male, TH SAM1035-04-ND Place jumpers on pins 1-2 (AVCC=VCC)
6 JP3 1 4-pin header, male, TH SAM1035-04-ND Place jumpers on pins 1-2
JP1, JP2, JP3, JP4, Jumper WM4592-ND
JP5, JP6, JP7, JP8,
7 13
JP9, JP10, JP11,
JP12, JP13
8 R1, R2, R4, R6, R8 5 0R, 0805 541-0.0ATR-ND
9 R10, R11 2 0R, 0805 541-0.0ATR-ND DNP
10 C3 1 2.2nF, CSMD0805 490-1628-2-ND DNP
C13, C14, C16, C17, 4.7uF, 6.3V, CSMD0805 587-1302-2-ND
11 7
C18, C19, C29
12 C11 1 10uF, 6.3V, CSMD0805 445-1372-2-ND
13 C12 1 10uF, 6.3V, CSMD0805 445-1372-2-ND DNP
14 C1, C2 2 12pF, CSMD0805 490-5531-2-ND DNP
15 R5 1 47K, 0805 311-47KARTR-ND
C4, C5, C6, C7, C8, 100nF, CSMD0805 311-1245-2-ND
16 6
C15
17 C9 1 100nF, CSMD0805 311-1245-2-ND DNP
18 R3, R7 2 330R, 0805 541-330ATR-ND
19 C10, C26 2 470nF, CSMD0805 587-1282-2-ND
22 IC1 Socket 1 Socket: IC500-1284-009P Manuf. Yamaichi
23 IC1 2 MSP430F67791IPEU DNP: enclosed with kit. Is supplied by TI
Crystal: MS3V-T1R 32.768kHz DNP: Crystal enclosed with kit. Keep vias free
25 Q1 1
12.5pF ±20ppm of solder
26 TP1, TP2 2 Test point DNP, keep vias free of solder
26-pin header, TH SAM1029-26-ND DNP: Headers enclosed with kit. Keep vias free
27 J2,J4 2
of solder.
26-pin receptable, TH SAM1213-26-ND DNP: Receptacles enclosed with kit. Keep vias
28 J2,J4 2
free of solder.
38-pin header, TH SAM1029-38-ND DNP: Headers enclosed with kit. Keep vias free
29 J1, J3 2
of solder.
38-pin receptable, TH SAM1213-38-ND DNP: Receptacles enclosed with kit. Keep vias
30 J1, J3 2
free of solder.
31 Rubber feet 4 Rubber feet Buerklin: 20H1724 apply to bottom side corners

EM430F5137RF900 www.ti.com
B.44 EM430F5137RF900
Figure B-88. EM430F5137RF900 Target Board, Schematic

www.ti.com EM430F5137RF900

Jumper JP2
Jumper JP3 Close INT for power supply from JTAG interface
Open to measure current Close EXT to external power supply (CON12)
CON12 VCC Jumper JP1

External power connector GND Close JTAG position to debug in 4-wire JTAG mode
Jumper JP2 to "EXT" GND
Close SBW position to debug in Spy-Bi-Wire mode
Jumper JP1 in Spy-Bi-Wire mode
Jumpers JP5, JP10
D2
LED (red) connected
Push-button S2
to P3.6 through JP10
D1 Connected to P1.7
LED (green) connected
to P1.0 through JP5
Q3
Footprint for 32-kHz crystal
R431 and R441

Crystal Q1 Use 0-W resistor to make XIN and XOUT
RF - 26 MHz available on connector Port 5
Button S1
Reset
X1
RF - Signal SMA
Figure B-89. EM430F5137RF900 Target board, PCB
The battery pack that is included with the EM430F5137RF900 kit may be connected to CON12. Ensure
correct battery insertion regarding the polarity as indicated in battery holder.

Table B-45. EM430F5137RF900 Bill of Materials

No. per Manufacturer's Part
Item Reference Description Value Manufacturer Comment
Board Number
( CUSTOMER SUPPLY ) AKER
1 Q1 1 26M ASX-531(CS)
CRYSTAL, SMT, 4P, 26MHz ELECTRONIC
C1-C5, C082,
C222, C271,
CAPACITOR, SMT, 0402, CER,
2 C281, C311, 14 0.1uF 0402YC104KAT2A AVX
16V, 10%, 0.1uF
C321, C341,
C412, C452
CAPACITOR, SMT, 0603,
3 C071 1 CERAMIC, 0.47uF, 16V, 10%, 0.47uF 0603YD474KAT2A AVX
X5R
4 R401 1 RES0402, 47.0K 47kΩ CRCW04024702F100 DALE
HEADER, THU, MALE, 14P,
5 CON11 1 09 18 514 6323 HARTING
2X7, 25.4x9.2x9.45mm
HEADER, THU, MALE, 10P,
6 CON10 0 09 18 510 6323 HARTING DNP
2X5, 20.32x9.2x9.45mm
7 D1 1 LED, SMT, 0603, GREEN, 2.1V active APT1608MGC KINGBRIGHT
8 D2 1 LED, SMT, 0603, RED, 2.0V active APT1608EC KINGBRIGHT
UNINSTALLED CRYSTAL, SMT, MICRO
9 Q3 0 32.768k MS1V-T1K (UN) DNP
3P, MS1V (Customer Supply) CRYSTAL
HEADER, THU, MALE, 3P, 1x3,
10 CON12 1 22-03-5035 MOLEX
9.9x4.9x5.9mm
11 C251, C261 2 50V, 5%, 27pF 27pF GRM36COG270J50 MURATA
FERRITE, SMT, 0402, 1.0kΩ,
12 L341 1 1kΩ BLM15HG102SN1D MURATA
250mA
13 C293 1 CERAMIC, 100pF, 50V, 0.25pF, 100pF GRM1555C1H101JZ01 MURATA
C0G(NP0)
INDUCTOR, SMT, 0402, 2.2nH, 0.0022u
14 L304 1 LQP15MN2N2B02 MURATA
0.1nH, 220mA, 500MHz H
INDUCTOR, SMT, 0402, 15nH,
15 L303, L305 2 0.015uH LQW15AN15NG00 MURATA
2%, 450mA, 250MHz
2%, 370mA, 250MHz
17 C291 1 CERAMIC, 1pF, 50V, 0.05pF, 1pF GRM1555C1H1R0WZ01 MURATA
C0G(NP0)
18 C303 1 CERAMIC, 8.2pF, 50V, 0.05pF, 8.2pF GRM1555C1H8R2WZ01 MURATA
C0G(NP0)
C292, C301-
19 4 CERAMIC, 1.5pF, 50V, 0.05pF, 1.5pF GRM1555C1H1R5WZ01 MURATA
C302, C304
C0G(NP0)
2%, 500mA, 250MHz
C282, C312, CAPACITOR, SMT, 0402,
21 C351, C361, 5 CERAMIC, 2pF, 50V, 0.1pF, 2.0pF GRM1555C1H2R0BZ01 Murata
C371 C0G
INDUCTOR, SMT, 0402, 6.2nH,
22 L1 1 6.2nH LQP15MN6N2B02 Murata
0.1nH, 130mA, 500MHz
ULTRA-SMALL TACTILE
23 S1-S2 2 SWITCH, SMT, 2P, SPST-NO, B3U-1000P OMRON
1.2x3x2.5mm, 0.05A, 12V
R4-R5, R051, UNINSTALLED
24 R061, R431, 0 RESISTOR/JUMPER, SMT, 0Ω ERJ-2GE0R00X PANASONIC DNP
R441 0402, 0 Ω, 5%, 1/16W
RESISTOR/JUMPER, SMT,
24a R7 1 0Ω ERJ-2GE0R00X PANASONIC
0402, 0 Ω, 5%, 1/16W

Table B-45. EM430F5137RF900 Bill of Materials (continued)

No. per Manufacturer's Part
Item Reference Description Value Manufacturer Comment
Board Number
RESISTOR, SMT, 0402, THICK
25 R2-R3, R6 3 330Ω ERJ-2GEJ331 PANASONIC
FILM, 5%, 1/16W, 330
26 C431, C441 0 12pF ECJ-0EC1H120J PANASONIC
12pF, 50V, 5%, NPO
27 C401 1 0.0022uF ECJ-0EB1H222K PANASONIC
2200pF, 50V, 10%, X7R
RESISTOR, SMT, THICK FILM,
28 R331 1 56kΩ ERJ-2GEJ563 PANASONIC
56K, 1/16W, 5%
C081, C221,
29 4 CERAMIC, 10uF, 6.3V, 20%, 10uF ECJ-1VB0J106M PANASONIC
C411, C451
X5R
RESISTOR/JUMPER, SMT,
30 R1 1 0Ω ERJ-2GE0R00X PANASONIC
0402, 0 Ω, 5%, 1/16W
UNINSTALLED CAP CERAMIC
31 C041 0 4.7uF ECJ-1VB0J475K Panasonic DNP
4.7UF 6.3V X5R 0603
32 X1 1 SMA STRIGHT JACK, SMT 32K10A-40ML5 ROSENBERGER
33 Q2 0 Crystal, SMT, 32.768 kHz 32.768k MS3V-T1R Micro Crystal DNP
DUT, SMT, PQFP, RGZ-48,
34 U1 1 0.5mmLS, 7.15x7.15x1mm, CC430F5137 TI
THRM.PAD
35 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH
36 CON1-CON9 0 Pin Connector 2x4pin 61300821121 WUERTH DNP
JP3, JP5,
38 3 Pin Connector 1x2pin 61300211121 WUERTH
JP10
38a JP7, CON13 0 Pin Connector 1x2pin 61300211121 WUERTH DNP
39 JP4 1 Pin Connector 2x2pin 61300421121 WUERTH DNP
40 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH

B.45 EM430F6137RF900


Jumper JP2
Close INT for power supply from JTAG interface
Jumper JP3 Close EXT to external power supply (CON12)
CON12 VCC Jumper JP1
External power connector GND Close JTAG position to debug in 4-wire JTAG mode
GND Close SBW position to debug in Spy-Bi-Wire mode
Jumper JP2 to "EXT"
Jumper JP1 in Spy-Bi-Wire mode
Jumpers JP5, JP10
D2
LED (red) connected
to P3.6 through JP10 Push-button S2
D1 Connected to P1.7
to P1.0 through JP5
Q2/Q3
Footprint for 32-kHz crystal
R541 and R551
Use 0-W resistor to make P5.0 and P5.1
available on connector Port 5
Crystal Q1
RF - 26 MHz Button S1
Reset
X1
RF - Signal SMA
C392
L451
C422
Figure B-91. EM430F6137RF900 Target Board, PCB
The battery pack that is included with the EM430F6137RF900 kit may be connected to CON12. Ensure


No. per
Pos. Ref Des Description Part No. Manufacturer
Board
( CUSTOMER SUPPLY ) CRYSTAL, SMT, 4P, AKER
1 Q1 1 ASX-531(CS)
26MHz ELECTRONIC
C1-C5, C112,
C252, C381,
CAPACITOR, SMT, 0402, CER, 16V, 10%,
2 C391, C421, 14 0402YC104KAT2A AVX
0.1uF
C431, C451,
C522, C562
CAPACITOR, SMT, 0603, CERAMIC, 0.47uF,
3 C101 1 0603YD474KAT2A AVX
16V, 10%, X5R
4 R511 1 RES0402, 47.0K CRCW04024702F100 DALE
HEADER, THU, MALE, 14P, 2X7,
5 CON11 1 09 18 514 6323 HARTING
25.4x9.2x9.45mm, 90deg
7 D1 1 LED, SMT, 0603, GREEN, 2.1V APT1608MGC KINGBRIGHT
8 D2 1 LED, SMT, 0603, RED, 2.0V APT1608EC KINGBRIGHT
10 CON12 1 HEADER, THU, MALE, 3P, 1x3, 9.9x4.9x5.9mm 22-03-5035 MOLEX
11 C361, C371 2 50V, ±5%, 27pF GRM36COG270J50 MURATA
12 L451 1 FERRITE, SMT, 0402, 1.0kΩ, 250mA BLM15HG102SN1D MURATA
CAPACITOR, SMT, 0402, CERAMIC, 100pF,
13 C403 1 GRM1555C1H101JZ01 MURATA
50V, ±0.25pF, C0G(NP0)
INDUCTOR, SMT, 0402, 2.2nH, ±0.2nH,
14 L414 1 LQW15AN2N2C10 MURATA
1000mA, 250MHz
INDUCTOR, SMT, 0402, 15nH, ±5%, 460mA,
15 L413, L415 2 LQW15AN15NJ00 MURATA
250MHz
250MHz
CAPACITOR, SMT, 0402, CER, 1pF, 50V,
17 C401 1 GJM1555C1H1R0CB01D MURATA
±0.25pF, NP0
CAPACITOR, SMT, 0402, CERAMIC, 8.2pF,
18 C413 1 GRM1555C1H8R2CZ01 MURATA
50V, ±0.25pF, C0G(NP0)
C402, C411- CAPACITOR, SMT, 0402, CERAMIC, 1.5pF,
19 4 GRM1555C1H1R5CZ01 MURATA
C412, C414 50V, ±0.25pF, C0G(NP0)
250MHz
C46-C48, C392, CAPACITOR, SMT, 0402, CERAMIC, 2.0pF,
21 5 GRM1555C1H2R0CZ01 Murata
C422 50V, ±0.25pF, C0G(NP0)
INDUCTOR, SMT, 0402, 6.2nH, ±0.1nH, 700mA,
22 L1 1 LQW15AN6N2D00 Murata
250MHz
ULTRA-SMALL TACTILE SWITCH, SMT, 2P,
23 S1-S2 2 B3U-1000P OMRON
SPST-NO, 1.2x3x2.5mm, 0.05A, 12V
RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%,
24 R7 1 ERJ-2GE0R00X (UN) PANASONIC
1/16W
RESISTOR, SMT, 0402, THICK FILM, 5%,
25 R2-R3, R6 3 ERJ-2GEJ331 PANASONIC
1/16W, 330
27 C511 1 ECJ-0EB1H222K PANASONIC
10%, X7R
C111, C251, CAPACITOR, SMT, 0603, CERAMIC, 10uF,
28 4 ECJ-1VB0J106M PANASONIC
C521, C561 6.3V, 20%, X5R
28a C041 1 CAP CERAMIC 4.7UF 6.3V X5R 0603 ECJ-1VB0J475M PANASONIC
29 R441 1 RESISTOR, SMT, THICK FILM, 56K, 1/16W, 1% ERJ-2RKF5602 PANASONIC
RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%,
30 R1 1 ERJ-2GE0R00X PANASONIC
1/16W
DUT, SMT, PQFP, RGC-64, 0.5mmLS,
33 U1 1 CC430F6137 TI
9.15x9.15x1mm, THRM.PAD


No. per
Board
36a JP3, JP5, JP10 3 Pin Connector 1x2pin 61300211121 WUERTH

B.46 EM430F6147RF900


Jumpers JP6 and JP8
Close 1-2 for Bypass mode
Jumper JP9 Close 2-3 for TPS mode
TPS status
TPS62730
Jumper JP3
CON12 Jumper JP2
External poser connector Close INT: Power supply from JTAG interface
Jumper JP2 to "EXT" Close EXT: External power supply
Jumpers JP5 and JP10 Jumper JP1

Open to disconnect LEDs Close JTAG position to debug in JTAG mode
Close SBW position to debug in Spy-BI-Wire mode
D2
LED (red) connected
to P3.6 through JP10
Button S2
D1
Connected to P1.7
to P1.0 through JP5
Orient pin 1 of MSP430 device
32-kHz crystal
Crystal Q1 R554 and R551

RF - 26 MHz Use 0-W resistor to make P5.0 and P5.1
available on connector Port 5
SMA1 Button S1
RF - Signal SMA Reset
Figure B-93. EM430F6147RF900 Target Board, PCB
The battery pack which comes with the EM430F6147RF900 kit may be connected to CON12. Ensure


No. per
Board
( CUSTOMER SUPPLY ) CRYSTAL, SMT, 4P, AKER
1 Q1 1 ASX-531(CS)
26MHz ELECTRONIC
C1-5 C112
C252 C381
CAPACITOR, SMT, 0402, CER, 16V, 10%,
2 C391 C421 14 0402YC104KAT2A AVX
0.1uF
C431 C451
C522 C562
CAPACITOR, SMT, 0603, CERAMIC, 0.47uF,
3 C101 1 0603YD474KAT2A AVX
16V, 10%, X5R
4 R511 1 RES0402, 47.0K CRCW04024702F100 DALE
HEADER, THU, MALE, 14P, 2X7,
5 CON11 1 09 18 514 6323 HARTING
25.4x9.2x9.45mm, 90deg
7 D1 1 LED, SMT, 0603, GREEN, 2.1V APT1608MGC KINGBRIGHT
8 D2 1 LED, SMT, 0603, RED, 2.0V APT1608EC KINGBRIGHT
10 CON12 1 HEADER, THU, MALE, 3P, 1x3, 9.9x4.9x5.9mm 22-03-5035 MOLEX
11 C361, C371 2 50V, ±5%, 27pF GRM36COG270J50 MURATA
12 L451 1 Inductor, SMD, 0402, 12nH, 5%, 370mA LQW15AN12NJ00 MURATA
CAPACITOR, SMT, 0402, CERAMIC, 100pF,
13 C403 1 GRM1555C1H101JZ01 MURATA
50V, ±0.25pF, C0G(NP0)
INDUCTOR, SMT, 0402, 2.2nH, ±0.2nH,
14 L414 1 LQW15AN2N2C10 MURATA
1000mA, 250MHz
Inductor, SMD, 0402, 15nH, 5%, 370mA,
15 L413 1 LQW15AN15NJ00 MURATA
250MHz
INDUCTOR,SMT,0402,15nH,±5%,460mA,250M
15 L415 1 LQW15AN15NJ00 MURATA
Hz
Inductor, SMD, 0402, 18nH, 5%, 460mA,
250MHz
17 C401 1 GJM1555C1H1R0CB01D MURATA
±0.25pF, NP0
18 C413 1 GRM1555C1H8R2CZ01 MURATA
50V, ±0.25pF, C0G(NP0)
C402, C411- CAPACITOR, SMT, 0402, CERAMIC, 1.5pF,
19 4 GRM1555C1H1R5CZ01 MURATA
C412, C414 50V, ±0.25pF, C0G(NP0)
20 L1, L401, L411 3 LQW15AN12NJ00 MURATA
250MHz
21 C46-C48, C392 4 GRM1555C1H2R0CZ01 MURATA
50V, ±0.25pF, C0G(NP0)
Inductor, SMD, 0805, 2.2uH, 20%, 600mA,
22 L2 1 LQM21PN2R2MC0 MURATA
50MHz
ULTRA-SMALL TACTILE SWITCH, SMT, 2P,
23 S1-S2 2 B3U-1000P OMRON
SPST-NO, 1.2x3x2.5mm, 0.05A, 12V
R1, R7, R551, RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%,
24 4 ERJ-2GE0R00X (UN) PANASONIC
R554 1/16W
RESISTOR, SMT, 0402, THICK FILM, 5%,
25 R2-R3, R6 3 ERJ-2GEJ331 PANASONIC
1/16W, 330
27 C511 1 ECJ-0EB1H222K PANASONIC
10%, X7R
C111, C251, CAPACITOR, SMT, 0603, CERAMIC, 1uF, 6.3V,
28 4 ECJ-1VB0J105K PANASONIC
C521, C561 20%, X5R
28a C041 1 CAP CERAMIC 4.7UF 6.3V X5R 0603 ECJ-1VB0J475M PANASONIC
29 R441 1 RESISTOR, SMT, THICK FILM, 56K, 1/16W, 1% ERJ-2RKF5602 PANASONIC
DUT, SMT, PQFP, RGC-64, 0.5mmLS,
31 U1 1 CC430F6147 TI
9.15x9.15x1mm, THRM.PAD


No. per
Board
IC, Step Down Converter with Bypass Mode for
33 U2 1 TPS62370 TI
Low Power Wireless
35 JP2, JP6, JP8 3 Pin Connector 1x3pin 61300311121 WUERTH
JP3, JP5, JP9,
36a 4 Pin Connector 1x2pin 61300211121 WUERTH
JP10
38 C7 1 Capacitor, Ceramic, 1206, 16V, X5R, 20% GRM31CR61C226ME15L MURATA
38 C8-9 2 CAP, SMD, Ceramic, 0402, 2.2uF, X5R GRM155R60J225ME15D MURATA
CAP, SMD, Ceramic, 0603, 4.7uF, 16V, 10%,
38 C041 1 MURATA
X5R

Appendix C
Hardware Installation Guide
For instructions on how to install the following USB debug interfaces on a PC, see the MSP Debuggers
User’s Guide.
• MSP-FET430UIF
• eZ430-F2013
• eZ430-RF2500
• eZ430-Chronos
• eZ430-RF2780
• eZ430-RF2560
• MSP-WDSxx "Metawatch"
• MSP-EXP430G2 LaunchPad development kit
• MSP-EXP430FR5739
• MSP-EXP430F5529
182 Hardware Installation Guide SLAU278AE – May 2009 – Revised November 2018
www.ti.com Revision History
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from June 20, 2018 to November 1, 2018 ........................................................................................................ Page
• Added MSP-TS430PT48A to Table 1-1, Individual Kit Contents, MSP-TS430xx ............................................... 13

• Added Section B.18, MSP-TS430PT48A ............................................................................................. 87
SLAU278AE – May 2009 – Revised November 2018 Revision History 183

STANDARD TERMS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2 Limited Warranty and Related Remedies/Disclaimers:

2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3 Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices

NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:

Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables

Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】開発キットの中には技術基準適合証明を受けて
いないものがあります。技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union

3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
4 EVM Use Restrictions and Warnings:

4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6. Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8. Limitations on Damages and Liability:

8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,
damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated

Slau 278 Ae

Uploaded by

Document Information

Original Title

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

Slau 278 Ae

Uploaded by

Copyright:

Available Formats

MSP430™ Hardware Tools

Literature Number: SLAU278AE

2 Contents SLAU278AE – May 2009 – Revised November 2018

B.18 MSP-TS430PT48 ........................................................................................................... 83

SLAU278AE – May 2009 – Revised November 2018 Contents 3

4 List of Figures SLAU278AE – May 2009 – Revised November 2018

B-44. MSP-TS430PM64 Target Socket Module, Schematic................................................................. 97

SLAU278AE – May 2009 – Revised November 2018 List of Figures 5

B-93. EM430F6147RF900 Target Board, PCB .............................................................................. 179

6 List of Figures SLAU278AE – May 2009 – Revised November 2018

SLAU278AE – May 2009 – Revised November 2018 List of Tables 7

B-47. EM430F6147RF900 Bill of Materials ................................................................................... 180

8 List of Tables SLAU278AE – May 2009 – Revised November 2018

Read This First

How to Use This Manual

SLAU278AE – May 2009 – Revised November 2018 Read This First 9

Information About Cautions and Warnings

Related Documentation From Texas Instruments

10 Read This First SLAU278AE – May 2009 – Revised November 2018

CC430 Family User's Guide

If You Need Assistance

SLAU278AE – May 2009 – Revised November 2018 Read This First 11

Get Started Now!

Topic ........................................................................................................................... Page

1.1 Kit Contents, MSP-TS430xx ................................................................................. 13

12 Get Started Now! SLAU278AE – May 2009 – Revised November 2018

1.1 Kit Contents, MSP-TS430xx

Table 1-1. Individual Kit Contents, MSP-TS430xx

SLAU278AE – May 2009 – Revised November 2018 Get Started Now! 13

Table 1-1. Individual Kit Contents, MSP-TS430xx (continued)

14 Get Started Now! SLAU278AE – May 2009 – Revised November 2018

1.2 Kit Contents, MSP-FET430xx

1.3 Kit Contents, MSP-FET

1.4 Kit Contents, MSP-FET430UIF

1.5 Kit Contents, MSP-FET430PIF

1.6 Kit Contents, eZ430-F2013

1.7 Kit Contents, eZ430-T2012

SLAU278AE – May 2009 – Revised November 2018 Get Started Now! 15

1.8 Kit Contents, eZ430-RF2500

1.9 Kit Contents, eZ430-RF2500T

1.10 Kit Contents, eZ430-RF2500-SEH

1.11 Kit Contents, eZ430-Chronos-xxx

16 Get Started Now! SLAU278AE – May 2009 – Revised November 2018

1.12 Kit Contents, FET430F6137RF900

1.13 Kit Contents, EM430Fx1x7RF900

1.14 Hardware Installation, MSP-FET and MSP-FET430UIF

SLAU278AE – May 2009 – Revised November 2018 Get Started Now! 17

1.15 Hardware Installation, MSP-TS430xxx, MSP-FET430Uxx, FET430F6137RF900,

1.16 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739,

1.17 Important MSP430 Documents on the Web

18 Get Started Now! SLAU278AE – May 2009 – Revised November 2018

Design Considerations for In-Circuit Programming

Topic ........................................................................................................................... Page

2.1 Signal Connections for In-System Programming and Debugging ............................. 20

2.1 Signal Connections for In-System Programming and Debugging

Important to connect VCC

TEST/VPP (see Note C)

Important to connect VCC

VCC TOOL TDO/TDI

Important to connect VCC

VCC TOOL TDO/TDI

2.2 External Power

2.3 Bootloader (BSL)