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Amd Epyc With Openfoam For HPC
Amd Epyc With Openfoam For HPC
Exceptional Memory Bandwidth AMD EPYC: The right choice for Computational
OpenFOAM is a memory-intensive
workload that benefits from AMD EPYC’s Fluid Dynamics
8 channels of memory bandwidth and up
to 2TB of memory per processor. Designed from the ground up for a new generation of solutions, AMD
EPYC implements a philosophy of choice without restriction. Choose
Standards Based the number of cores and sockets that meet your needs without
AMD is committed to industry standards,
offering you a choice in x86 architecture
sacrificing key features like memory and I/O.
with design innovations that target the
Each EPYC processor can have from 8 to 32 cores with access to an
evolving needs of modern datacenters.
exceptional amount of I/O and memory regardless of the number of
High Density, Low Cost cores in use, including 128 PCIe lanes, and access to 2 TB of high speed
Compute requirements are increasing, memory per socket.
datacenter space is not. AMD’s EPYC
processor offers high core density with
full access to all features. Innovative
architecture means outstanding
performance at a low cost.
Partner Ecosystem
AMD’s broad partner ecosystem and
collaborative engineering provide tested
and validated solutions that help lower
your risk and total cost of ownership
AMD EPYC processors help enable more performance, flexibility, and security
PERFORMANCE. AMD EPYC processors bring a new balance to the datacenter. Utilizing an x86 architecture, the AMD EPYC
processor, brings together high core counts, large memory capacity, ample memory bandwidth and massive I/O with the right
ratios to help performance reach new heights.
FLEXIBILITY. Match core count with application needs without compromising processor features. EPYC’s balanced set of resources
means more freedom to right-size the server configuration to the workload.
SECURITY. AMD EPYC features the industry’s first dedicated security processor embedded in an x86-architecture server processor.
The processor manages secure boot, memory encryption, and secure virtualization on the processor itself. Encryption keys never
leave the processor where they can be exposed to intruders.
SCALABILITY. Scale-up or scale-out, AMD and its ecosystem partners offer high-performance network connectivity options for
applications at massive scale.
OpenFOAM Compilation:
OpenFOAM version 5.0 was compiled from source on RHEL 7.5 using the AOCC 1.2.1 compiler
(https://developer.amd.com/amd-aocc/) and OpenMPI 3.1.1. The optimization flag “-O3” was used. No
further compile time optimizations were done.
900 32 Cores
800
Elapsed Time in seconds (lower is better)
700
600
500
64 Cores
400
300
128 Cores
200
256 Cores
100 512 Cores
1024 Cores
0
0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34
# of Nodes
Figure 1
20
1024 Cores
Scaling normalized to single node performance
15
512 Cores
10
256 Cores
5
128 Cores
64 Cores
32 Cores
0
0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34
# of Nodes
Figure 2
1024 Cores
25
Scaling normalized to single node performance
20
15 512 Cores
10
256 Cores
5
128 Cores
64 Cores
32 Cores
0
0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34
# of Nodes
Figure 3
32 Cores
1800
1600
1400
1200
Seconds (lower is better)
1000
64 Cores
800
600
128 Cores
400
256 Cores
200
512 Cores
1024 Cores
0
0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34
# of Nodes
Figure 4
DISCLAIMER
The information contained herein is for informational purposes only and is subject to change without notice. While every precaution has been
taken in the preparation of this document, it may contain technical inaccuracies, omissions and typographical errors, and AMD is under no
obligation to update or otherwise correct this information. Advanced Micro Devices, Inc. makes no representations or warranties with respect
to the accuracy or completeness of the contents of this document, and assumes no liability of any kind, including the implied warranties of
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Advanced Micro Devices, Inc. Other product names used in this publication are for identification purposes only and may be trademarks of their
respective companies.
OPENFOAM® is a registered trade mark of OpenCFD Limited, producer and distributor of the OpenFOAM software via www.openfoam.com. This
offering is not approved or endorsed by OpenCFD Limited, owner of the OPENFOAM® and OpenCFD® trademarks.
Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies