Quality Agreement_ Rev. 0 FOXCONN Confidential xiv. “FA” means Failure Analysis. Xv. 8D’s (8-Disciplines) Corrective Action report for problem solving. xvi. “MCD” means Material Composition Declaration. Party B shall as required by Party Amake a self-declaration on the composition and proportion of products. xvii. “RMA means Return Material Authorization xviii, “TAT” means Turn Around Time. Turn around period, the working days from Party B’sreceipt of RMA products to Party B's delivery of RMA products to Party A xix. ECN (Engineering Change Notice): Documents that records or approves changes in product design specifications, process conditions. xx, SOP (Standard Operating Procedures): The standard operating procedure describesthe standard operating steps and requirements of the product manufacturing process in a unified format to guide and standardize the work content. xxl, Process Flow: The diagram of the step by step to manufacture the product from the Parts receiving up-to the shipping of the Finished Good product. xxii, CTQ: means the Critical to Quality parameters that need to be controlled in each process in order to assure the Quality of the product. xxiii, PFMEA: Means Process Failure Mode Effect Analysis, the risk study for each step of the process, including the preventive measures embeded in the process to avoid making defects and shipping defects. xxiv. Control Plan: means, the method to control each CTQ for each step of the Process xxv. COPQ (Cost of Poor Quality) means cost Claim report for financial compensation. xxvi. DN: Debit Note, the accounting documents for financial compensation xxvii. PO: Purchase Order xxviii RBA: Responsibility Business Alliance, the Code of Conduct document. xxix. 8D's (8-Disciplines) Corrective Action report for problem solving,