60V N+P Dual Channel MOSFETs PDS6701

General Description
BVDSS RDSON ID
These N+P dual Channel enhancement mode power
field effect transistors are using trench DMOS 60V 30m 5.9A
technology. This advanced technology has been
especially tailored to minimize on-state resistance,
-60V 48m -4.7A
provide superior switching performance, and withstand
high energy pulse in the avalanche and commutation Features
mode. These devices are well suited for high efficiency  Fast switching
fast switching applications.  Green Device Available
 Suit for 4.5V Gate Drive Applications
SOP-8L Pin Configuration
D2 D1 D2
D2
D1 Applications
D1
 DC Fan
G2 G1 G2  Motor Drive Applications
S2  Networking
G1
S1  Half / Full Bridge Topology
S1 S2

Absolute Maximum Ratings Tc=25℃ unless otherwise noted

Symbol Parameter Rating Units

VDS Drain-Source Voltage 60 -60 V
VGS Gate-Source Voltage ±20 ±20 V
Drain Current – Continuous (TA=25℃) 5.9 -4.7 A
ID
Drain Current – Continuous (TA=70℃) 4.7 -3.8 A
IDM Drain Current – Pulsed 1
23.6 -18.8 A
EAS Single Pulse Avalanche Energy 2
26.4 54.4 mJ
IAS Single Pulse Avalanche Current 2
23 33 A
Power Dissipation (TA=25℃) 2.01 W
PD
Power Dissipation – Derate above 25℃ 0.02 W/℃
TSTG Storage Temperature Range -55 to 150 ℃
TJ Operating Junction Temperature Range -55 to 150 ℃

Thermal Characteristics

Symbol Parameter Typ. Max. Unit

RθJC Thermal Resistance Junction to Case --- 38 ℃/W
RθJA Thermal Resistance Junction to Ambient --- 62 ℃/W

Potens semiconductor corp. Ver.1.00

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60V N+P Dual Channel MOSFETs PDS6701
N-CH Electrical Characteristics (TJ=25 ℃, unless otherwise)
noted)
Off Characteristics
Symbol Parameter Conditions Min. Typ. Max. Unit
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=250uA 60 --- --- V
△BVDSS/△TJ BVDSS Temperature Coefficient Reference to 25℃ , ID=1mA --- 0.07 --- V/℃
VDS=60V , VGS=0V , TJ=25℃ --- --- 1 uA
IDSS Drain-Source Leakage Current
VDS=48V , VGS=0V , TJ=125℃ --- --- 10 uA
IGSS Gate-Source Leakage Current VGS=±20V , VDS=0V --- --- ±100 nA

On Characteristics
VGS=10V , ID=5A --- 25 30 m
RDS(ON) Static Drain-Source On-Resistance
VGS=4.5V , ID=3A --- 28 36 m
VGS(th) Gate Threshold Voltage 1.2 1.6 2.5 V
VGS=VDS , ID =250uA
△VGS(th) VGS(th) Temperature Coefficient --- -4.6 --- mV/℃
gfs Forward Transconductance VDS=10V , ID=3A --- 10 --- S

Dynamic and switching Characteristics

Qg Total Gate Charge 3 , 4 --- 16.6 24
Qgs Gate-Source Charge3 , 4 VDS=30V , VGS=10V , ID=5A --- 2.2 4.4 nC
Qgd Gate-Drain Charge3 , 4 --- 3.9 8
Td(on) Turn-On Delay Time3 , 4 --- 4.6 9
Tr Rise Time3 , 4 VDD=30V , VGS=10V , RG=6 --- 14.8 28
ns
Td(off) Turn-Off Delay Time3 , 4 ID=1A --- 27.2 52
Tf Fall Time3 , 4 --- 7.8 15
Ciss Input Capacitance --- 1180 1720
Coss Output Capacitance VDS=30V , VGS=0V , F=1MHz --- 68 100 pF
Crss Reverse Transfer Capacitance --- 45 70
Rg Gate resistance VGS=0V, VDS=0V, F=1MHz --- 2.1 4.2 

Drain-Source Diode Characteristics and Maximum Ratings

Symbol Parameter Conditions Min. Typ. Max. Unit
IS Continuous Source Current --- --- 5.9 A
VG=VD=0V , Force Current
ISM Pulsed Source Current --- --- 11.8 A
VSD Diode Forward Voltage VGS=0V , IS=1A , TJ=25℃ --- --- 1 V
Note :
1. Repetitive Rating : Pulsed width limited by maximum junction temperature.
2. VDD=25V,VGS=10V,L=0.1mH, N-CH IAS=23A., P-CH IAS=33A, RG=25,Starting TJ=25℃.
3. The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%.
4. Essentially independent of operating temperature.

Potens semiconductor corp. Ver.1.00

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60V N+P Dual Channel MOSFETs PDS6701
ID , Continuous Drain Current (A)

Normalized On Resistance (m)

TJ , Junction Temperature (℃) TJ , Junction Temperature (℃)
Fig.1 Continuous Drain Current vs. TC Fig.2 Normalized RDSON vs. TJ
Normalized Gate Threshold Voltage (V)

VGS , Gate to Source Voltage (V)

TJ , Junction Temperature (℃) Qg , Gate Charge (nC)

Fig.3 Normalized Vth vs. TJ Fig.4 Gate Charge Waveform
Normalized Thermal Response (RθJA)

ID , Continuous Drain Current (A)

Square Wave Pulse Duration (s) VDS , Drain to Source Voltage (V)
Fig.5 Normalized Transient Impedance Fig.6 Maximum Safe Operation Area

Potens semiconductor corp. Ver.1.00

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60V N+P Dual Channel MOSFETs PDS6701
P-CH Electrical Characteristics (TJ=25 ℃, unless otherwise
noted)
Off Characteristics
Symbol Parameter Conditions Min. Typ. Max. Unit
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=-250uA -60 --- --- V
△BVDSS/△TJ BVDSS Temperature Coefficient Reference to 25℃ , ID=-1mA --- -0.05 --- V/℃
VDS=-60V , VGS=0V , TJ=25℃ --- --- -1 uA
IDSS Drain-Source Leakage Current
VDS=-48V , VGS=0V , TJ=125℃ --- --- -10 uA
IGSS Gate-Source Leakage Current VGS=±20V , VDS=0V --- --- ±100 nA

On Characteristics
VGS=-10V , ID=-4A --- 40 48 m
RDS(ON) Static Drain-Source On-Resistance
VGS=-4.5V , ID=-3A --- 53 68 m
VGS(th) Gate Threshold Voltage -1.2 -1.6 -2.5 V
VGS=VDS , ID =-250uA
△VGS(th) VGS(th) Temperature Coefficient --- 5 --- mV/℃
gfs Forward Transconductance VDS=-10V , ID=-3A --- 10 --- S

Dynamic and switching Characteristics

Qg Total Gate Charge2 , 3 --- 22.4 31
Qgs Gate-Source Charge2 , 3 VDS=-30V , VGS=-10V , ID=-4A --- 4.1 6 nC
Qgd Gate-Drain Charge2 , 3 --- 5.2 7
Td(on) Turn-On Delay Time2 , 3 --- 13 25
Tr Rise Time2 , 3 VDD=-30V , VGS=-10V , RG=6 --- 42.4 81
ns
Td(off) Turn-Off Delay Time2 , 3 ID=-1A --- 64.6 123
Tf Fall Time2 , 3 --- 16.4 31
Ciss Input Capacitance --- 1250 1810
Coss Output Capacitance VDS=-30V , VGS=0V , F=1MHz --- 85 125 pF
Crss Reverse Transfer Capacitance --- 65 95
Rg Gate resistance VGS=0V, VDS=0V, F=1MHz 15 30 

Drain-Source Diode Characteristics and Maximum Ratings

Symbol Parameter Conditions Min. Typ. Max. Unit
IS Continuous Source Current
VG=VD=0V , Force Current
--- --- -4.7 A
ISM Pulsed Source Current --- --- -9.4 A
VSD Diode Forward Voltage VGS=0V , IS=-1A , TJ=25℃ --- --- -1 V

Note :
5. Repetitive Rating : Pulsed width limited by maximum junction temperature.
6. The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%.
7. Essentially independent of operating temperature.

Potens semiconductor corp. Ver.1.00

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60V N+P Dual Channel MOSFETs PDS6701
-ID , Continuous Drain Current (A)

Normalized On Resistance (m)

TJ , Junction Temperature (℃) TJ , Junction Temperature (℃)
Fig.7 Continuous Drain Current vs. TC Fig.8 Normalized RDSON vs. TJ
Normalized Gate Threshold Voltage (V)

-VGS , Gate to Source Voltage (V)

TJ , Junction Temperature (℃) Qg , Gate Charge (nC)

Fig.9 Normalized Vth vs. TJ Fig.10 Gate Charge Waveform
Normalized Thermal Response (RθJA)

-ID , Continuous Drain Current (A)

Square Wave Pulse Duration (s) -VDS , Drain to Source Voltage (V)
Fig.11 Normalized Transient Impedance Fig.12 Maximum Safe Operation Area

Potens semiconductor corp. Ver.1.00

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60V N+P Dual Channel MOSFETs PDS6701
SOP-8L PACKAGE INFORMATION

Dimensions In Millimeters Dimensions In Inches

Symbol
Min Max Min Max
A 1.350 1.750 0.053 0.068
A1 0.100 0.250 0.004 0.009
A2 1.300 1.500 0.052 0.059
A3 0.600 0.700 0.024 0.027
b 0.390 0.480 0.016 0.018
c 0.210 0.260 0.009 0.010
D 4.700 5.100 0.186 0.200
E 5.800 6.200 0.229 0.244
E1 3.700 4.100 0.146 0.161
e 1.270(BSC) 0.050(BSC)
h 0.250 0.500 0.010 0.019
L 0.500 0.800 0.019 0.031
L1 1.050(BSC) 0.041(BSC)
θ 0° 8° 0° 8°

Potens semiconductor corp. Ver.1.00