Professional Documents
Culture Documents
■ Memories
– 4, 8 or 16 Kbytes Program Memory: High
Density Flash (HDFlash) or ROM with Read-
out and Write Protection
– In-Application Programming (IAP) and In-Cir-
cuit programming (ICP) for HDFlash devices
– 384 or 512 bytes RAM memory (128-byte PSDIP32
stack)
■ Clock, Reset and Supply Management
– Run, Wait, Slow and Halt CPU modes
– 12 or 24 MHz Oscillator
– RAM Retention mode
– Optional Low Voltage Detector (LVD) SO34 (Shrink)
■ USB (Universal Serial Bus) Interface
■ 2 Communication Interfaces
– DMA for low speed applications compliant
with USB 1.5 Mbs (version 1.1) and HID spec- – Asynchronous Serial Communications Inter-
ifications (version 1.0) face (on K4 and K2 versions only)
– Integrated 3.3 V voltage regulator and trans-
ceivers – I²C Multi Master Interface up to 400 kHz
(on K4 versions only)
– Suspend and Resume operations ■ 1 Analog Peripheral
– 3 Endpoints with programmable In/Out config-
uration – 8-bit A/D Converter (ADC) with 8 channels
■ 19 I/O Ports ■ Instruction Set
– 8 high sink I/Os (10 mA at 1.3 V) – 63 basic instructions
– 2 very high sink true open drain I/Os (25 mA – 17 main addressing modes
at 1.5 V) – 8 x 8 unsigned multiply instruction
– 8 lines individually programmable as interrupt – True bit manipulation
inputs
■ Development Tools
■ 2 Timers
– Versatile Development Tools (under Win-
– Programmable Watchdog dows) including assembler, linker, C-compil-
– 16-bit Timer with 2 Input Captures, 2 Output er, archiver, source level debugger, software
Compares, PWM output and clock input library, hardware emulator, programming
boards and gang programmers
Table 1. Device Summary
Features ST72F63BK4 ST7263BK2 ST7263BK1
16K 8K 4K
Program Memory -bytes-
(Flash or FASTROM) (Flash, ROM or FASTROM) (Flash, ROM or FASTROM)
RAM (stack) - bytes 512 (128) 384 (128)
Watchdog timer, 16-bit tim- Watchdog timer, Watchdog, 16-bit timer, ADC,
Peripherals
er, SCI, I²C, ADC, USB 16-bit timer, SCI, ADC, USB USB
Operating Supply 4.0 V to 5.5 V
CPU frequency 8 MHz (with 24 MHz oscillator) or 4 MHz (with 12 MHz oscillator)
Operating temperature 0 °C to +70 °C
Packages SO34/SDIP32
Rev. 1.4
1
Table of Contents
1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2 PIN DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3 REGISTER & MEMORY MAP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4 FLASH PROGRAM MEMORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.2 MAIN FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.3 STRUCTURE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.4 ICC INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.5 ICP (IN-CIRCUIT PROGRAMMING) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.6 IAP (IN-APPLICATION PROGRAMMING) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5 CENTRAL PROCESSING UNIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.2 MAIN FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.3 CPU REGISTERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6 RESET AND CLOCK MANAGEMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.1 RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.2 CLOCK SYSTEM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
7 INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
7.1 INTERRUPT REGISTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
8 POWER SAVING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
8.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
8.2 HALT MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
8.3 SLOW MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
8.4 WAIT MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
9 I/O PORTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
9.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
9.2 FUNCTIONAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
9.3 I/O PORT IMPLEMENTATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
10 MISCELLANEOUS REGISTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
11 ON-CHIP PERIPHERALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
11.1 WATCHDOG TIMER (WDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
11.2 16-BIT TIMER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
11.3 SERIAL COMMUNICATIONS INTERFACE (SCI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
11.4 USB INTERFACE (USB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
11.5 I²C BUS INTERFACE (I²C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
11.6 8-BIT A/D CONVERTER (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
12 INSTRUCTION SET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
12.1 ST7 ADDRESSING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
12.2 INSTRUCTION GROUPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
13 ELECTRICAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
13.1 PARAMETER CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
. . . . 96
13.2 ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
2/132
Table of Contents
13.3 OPERATING CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
13.4 SUPPLY CURRENT CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
13.5 CLOCK AND TIMING CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
13.6 MEMORY CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
13.7 EMC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
13.8 I/O PORT PIN CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
13.9 CONTROL PIN CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
13.10COMMUNICATION INTERFACE CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . 116
13.118-BIT ADC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
14 PACKAGE CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
14.1 PACKAGE MECHANICAL DATA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
14.2 THERMAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
14.3 SOLDERING AND GLUEABILITY INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
15 DEVICE CONFIGURATION AND ORDERING INFORMATION . . . . . . . . . . . . . . . . . . . . . . . 124
15.1 OPTION BYTE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
15.2 DEVICE ORDERING INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
15.3 DEVELOPMENT TOOLS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
15.4 ST7 APPLICATION NOTES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
15.5 TO GET MORE INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
16 KNOWN LIMITATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
16.1 UNEXPECTED RESET FETCH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
16.2 HALT MODE POWER CONSUMPTION WITH ADC ON . . . . . . . . . . . . . . . . . . . . . . . . . 130
17 SUMMARY OF CHANGES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
3/132
ST7263B
1 INTRODUCTION
The ST7263B Microcontrollers form a sub-family – Industry standard asynchronous SCI serial inter-
of the ST7 MCUs dedicated to USB applications. face (not on all products - see Table 1 Device
The devices are based on an industry-standard 8- Summary)
bit core and feature an enhanced instruction set. – Watchdog
They operate at a 24 MHz or 12 MHz oscillator fre-
quency. Under software control, the ST7263B – 16-bit Timer featuring an External clock input, 2
MCUs may be placed in either Wait or Halt modes, Input Captures, 2 Output Compares with Pulse
thus reducing power consumption. The enhanced Generator capabilities
instruction set and addressing modes afford real – Fast I²C Multi Master interface (not on all prod-
programming potential. In addition to standard 8- ucts - see device summary)
bit data management, the ST7263B MCUs feature – Low voltage reset (LVD) ensuring proper power-
true bit manipulation, 8x8 unsigned multiplication
on or power-off of the device
and indirect addressing modes. The devices in-
clude an ST7 Core, up to 16 Kbytes of program The ST7263B devices are ROM versions.
memory, up to 512 bytes of RAM, 19 I/O lines and The ST72P63B devices are Factory Advanced
the following on-chip peripherals: Service Technique ROM (FASTROM) versions:
– USB low speed interface with 3 endpoints with they are factory-programmed and are not repro-
programmable in/out configuration using the grammable.
DMA architecture with embedded 3.3V voltage The ST72F63B devices are Flash versions. They
regulator and transceivers (no external compo- support programming in IAP mode (In-application
nents are needed). programming) via the on-chip USB interface.
– 8-bit Analog-to-Digital converter (ADC) with 8
multiplexed analog inputs
Figure 1. General Block Diagram
INTERNAL
CLOCK
OSCIN OSC/3
OSCILLATOR
OSCOUT
I²C*
OSC/4 or OSC/2
(for USB)
VDD PA[7:0]
POWER PORT A
(8 bits)
VSS SUPPLY
16-BIT TIMER
WATCHDOG
PORT B
ADDRESS AND DATA BUS
VSSA RAM
(384/512 Bytes)
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ST7263B
2 PIN DESCRIPTION
Figure 2. 34-Pin SO Package Pinout
VDD 34 VDDA
1
OSCOUT 33 USBVCC
2
OSCIN 32 USBDM
3
VSS 4 31 USBDP
PC2/USBOE 5 30 VSSA
PC1/TDO 6 29 PA0/MCO
PC0/RDI 7 28 PA1(25mA)/SDA/ICCDATA
RESET 8 27 NC
NC 9 26 NC
AIN7/IT8PB7(10mA) 10 25 NC
AIN6/PB6/IT7(10mA) 11 24 PA2(25mA)/SCL/ICCCLK
VPP/TEST 12 23 PA3/EXTCLK
AIN5/IT6/PB5(10mA) 13 22 PA4/ICAP1/IT1
AIN4/IT5/PB4(10mA) 14 21 PA5/ICAP2/IT2
AIN3/PB3(10mA) 15 20 PA6/OCMP1/IT3
AIN2/PB2(10mA) 16 19 PA7/OCMP2/IT4
AIN1/PB1(10mA) 17 18 PB0(10mA)/AIN0
VDD 1 VDDA
32
OSCOUT 2 31 USBVCC
OSCIN 3 30 USBDM
VSS 4 29 USBDP
PC2/USBOE 5 28 VSSA
PC1/TDO 6 27 PA0/MCO
PC0/RDI 7 26 PA1(25mA)/SDA/ICCDATA
RESET 8 25 NC
AIN7/IT8/PB7(10mA) 9 24 NC
AIN6/IT7/PB6(10mA) 10 23 PA2(25mA)/SCL/ICCCLK
VPP /TEST* 11 22 PA3/EXTCLK
AIN5/IT6/PB5(10mA) 12 21 PA4/ICAP1/IT1
AIN4/IT5/PB4(10mA) 13 20 PA5/ICAP2/IT2
AIN3/PB3(10mA) 14 19 PA6/COMP1/IT3
AIN2/PB2(10mA) 15 18 PA7/COMP2/IT4
AIN1/PB1/(10mA) 16 17 PB0(10mA)/AIN0
5/132
ST7263B
Input Output
SDIP32
Output
Input
(after reset)
float
wpu
ana
OD
PP
int
6/132
ST7263B
Type
Input Output
SDIP32
Output
Pin Name Function Alternate Function
SO34
Input
(after reset)
float
wpu
ana
OD
PP
int
22 23 PA3/EXTCLK I/O CT X X Port A3 Timer External Clock
23 24 PA2/SCL/ICCCLK I/O CT 25mA X T Port A2 I²C serial clock*, ICC Clock
-- 25 NC -- Not connected
24 26 NC -- Not connected
25 27 NC -- Not connected
26 28 PA1/SDA/ICCDATA I/O CT 25mA X T Port A1 I²C serial data*, ICC Data
27 29 PA0/MCO I/O CT X X Port A0 Main Clock Output
28 30 VSSA S Analog ground
29 31 USBDP I/O USB bidirectional data (data +)
30 32 USBDM I/O USB bidirectional data (data -)
31 33 USBVCC O USB power supply
32 34 VDDA S Analog supply voltage
Note (*): if the peripheral is present on the device (see Table 1, "Device Summary")
7/132
ST7263B
0000h 0040h
HW Registers
(See Table 4) Short Addressing
003Fh RAM (192 bytes)
0040h 00FFh
RAM 0100h
Stack
(384/512 Bytes)
(128 Bytes)
01BF/023Fh 017Fh
01C0/0240h 0180h
16-bit Addressing
Reserved
RAM
BFFFh 01BF/023Fh
C000h
Program Memory* C000h
(4/8/16 KBytes)
FFDFh 16 KBytes
FFE0h
Interrupt & Reset Vectors
(See Table 3)
FFFFh E000h
8 KBytes
F000h
4 KBytes
FFDFh
* Program memory and RAM sizes are product dependent (see Table 1, "Device Summary")
Table 3. Interrupt Vector Map
Vector Address Description Masked by Remarks Exit from Halt Mode
FFE0h-FFEDh Reserved Area
FFEEh-FFEFh USB Interrupt Vector I- bit Internal Interrupt No
FFF0h-FFF1h SCI Interrupt Vector I- bit Internal Interrupt No
FFF2h-FFF3h I²C Interrupt Vector I- bit Internal Interrupt No
FFF4h-FFF5h TIMER Interrupt Vector I- bit Internal Interrupt No
FFF6h-FFF7h IT1 to IT8 Interrupt Vector I- bit External Interrupt Yes
FFF8h-FFF9h USB End Suspend Mode Interrupt Vector I- bit External Interrupts Yes
FFFAh-FFFBh Flash Start Programming Interrupt Vector I- bit Internal Interrupt Yes
FFFCh-FFFDh TRAP (software) Interrupt Vector None CPU Interrupt No
FFFEh-FFFFh RESET Vector None Yes
8/132
ST7263B
9/132
ST7263B
Note 1. If the peripheral is present on the device (see Table 1, "Device Summary")
10/132
ST7263B
11/132
ST7263B
ICC Cable
APPLICATION BOARD
10 8 6 4 2
APPLICATION
RESET SOURCE
See Note 2
10kΩ
APPLICATION
RESET
ICCCLK
ICCDATA
OSC1
ICCSEL/VPP
VSS
OSC2
VDD
I/O
ST7
12/132
ST7263B
13/132
ST7263B
15 PCH 8 7 PCL 0
PROGRAM COUNTER
RESET VALUE = RESET VECTOR @ FFFEh-FFFFh
7 0
1 1 1 H I N Z C CONDITION CODE REGISTER
RESET VALUE = 1 1 1 X 1 X X X
15 8 7 0
STACK POINTER
RESET VALUE = STACK HIGHER ADDRESS
X = Undefined Value
14/132
ST7263B
Bit 2 = N Negative.
The 8-bit Condition Code register contains the in- This bit is set and cleared by hardware. It is repre-
terrupt mask and four flags representative of the sentative of the result sign of the last arithmetic,
result of the instruction just executed. This register logical or data manipulation. It is a copy of the 7th
can also be handled by the PUSH and POP in- bit of the result.
structions. 0: The result of the last operation is positive or null.
These bits can be individually tested and/or con- 1: The result of the last operation is negative
trolled by specific instructions. (i.e. the most significant bit is a logic 1).
This bit is accessed by the JRMI and JRPL instruc-
Bit 4 = H Half carry. tions.
This bit is set by hardware when a carry occurs be-
tween bits 3 and 4 of the ALU during an ADD or Bit 1 = Z Zero.
ADC instruction. It is reset by hardware during the
same instructions. This bit is set and cleared by hardware. This bit in-
0: No half carry has occurred. dicates that the result of the last arithmetic, logical
1: A half carry has occurred. or data manipulation is zero.
0: The result of the last operation is different from
This bit is tested using the JRH or JRNH instruc- zero.
tion. The H bit is useful in BCD arithmetic subrou- 1: The result of the last operation is zero.
tines.
This bit is accessed by the JREQ and JRNE test
instructions.
Bit 3 = I Interrupt mask.
This bit is set by hardware when entering in inter-
Bit 0 = C Carry/borrow.
rupt or by software to disable all interrupts except
the TRAP software interrupt. This bit is cleared by This bit is set and cleared by hardware and soft-
software. ware. It indicates an overflow or an underflow has
0: Interrupts are enabled. occurred during the last arithmetic operation.
1: Interrupts are disabled. 0: No overflow or underflow has occurred.
1: An overflow or underflow has occurred.
This bit is controlled by the RIM, SIM and IRET in-
structions and is tested by the JRM and JRNM in- This bit is driven by the SCF and RCF instructions
structions. and tested by the JRC and JRNC instructions. It is
also affected by the “bit test and branch”, shift and
Note: Interrupts requested while I is set are rotate instructions.
latched and can be processed when I is cleared.
By default an interrupt routine is not interruptable
15/132
ST7263B
@ 0100h
SP
SP SP
Y
CC CC CC
A A A
X X X
PCH PCH PCH
SP SP
PCL PCL PCL
PCH PCH PCH PCH PCH
SP
@ 017Fh PCL PCL PCL PCL PCL
16/132
ST7263B
6.1 RESET
The Reset procedure is used to provide an orderly 6.1.3 External Reset
software start-up or to exit low power modes. The external reset is an active low input signal ap-
Three reset modes are provided: a low voltage plied to the RESET pin of the MCU.
(LVD) reset, a watchdog reset and an external re- As shown in Figure 12, the RESET signal must
set at the RESET pin. stay low for a minimum of one and a half CPU
A reset causes the reset vector to be fetched from clock cycles.
addresses FFFEh and FFFFh in order to be loaded An internal Schmitt trigger at the RESET pin is pro-
into the PC and with program execution starting vided to improve noise immunity.
from this point. Figure 9. Low Voltage Detector functional Diagram
An internal circuitry provides a 4096 CPU clock cy-
cle delay from the time that the oscillator becomes RESET
active.
VDD LOW VOLTAGE
6.1.1 Low Voltage Detector (LVD) DETECTOR
INTERNAL
Low voltage reset circuitry generates a reset when RESET
VDD is: FROM
■ below VIT+ when VDD is rising, WATCHDOG
RESET
■ below VIT- when VDD is falling.
VIT+
VDD
Addresses $FFFE
17/132
ST7263B
RESET (Cont’d)
Figure 12. Reset Timing Diagram
tDDR
VDD
OSCIN
tOXOV
fCPU
PC FFFE FFFF
Note: Refer to Electrical Characteristics for values of tDDR, tOXOV, VIT+, VIT- and Vhys
18/132
ST7263B
19/132
ST7263B
7 INTERRUPTS
The ST7 core may be interrupted by one of two dif-
ferent methods: maskable hardware interrupts as Interrupts and Low Power Mode
listed in Table 7, "Interrupt Mapping" and a non-
maskable software interrupt (TRAP). The Interrupt All interrupts allow the processor to leave the Wait
processing flowchart is shown in Figure 16. low power mode. Only external and specific men-
tioned interrupts allow the processor to leave the
Halt low power mode (refer to the “Exit from HALT“
The maskable interrupts must be enabled clearing column in Table 7, "Interrupt Mapping").
the I bit in order to be serviced. However, disabled
interrupts may be latched and processed when
they are enabled (see external interrupts subsec- External Interrupts
tion).
The pins ITi/PAk and ITj/PBk (i=1,2; j= 5,6; k=4,5)
When an interrupt has to be serviced: can generate an interrupt when a rising edge oc-
– Normal processing is suspended at the end of curs on this pin. Conversely, the ITl/PAn and ITm/
the current instruction execution. PBn pins (l=3,4; m= 7,8; n=6,7) can generate an
interrupt when a falling edge occurs on this pin.
– The PC, X, A and CC registers are saved onto
the stack. Interrupt generation will occur if it is enabled with
the ITiE bit (i=1 to 8) in the ITRFRE register and if
– The I bit of the CC register is set to prevent addi- the I bit of the CCR is reset.
tional interrupts.
– The PC is then loaded with the interrupt vector of
the interrupt to service and the first instruction of Peripheral Interrupts
the interrupt service routine is fetched (refer to Different peripheral interrupt flags in the status
Table 7, "Interrupt Mapping" for vector address- register are able to cause an interrupt when they
es). are active if both:
The interrupt service routine should finish with the – The I bit of the CC register is cleared.
IRET instruction which causes the contents of the
– The corresponding enable bit is set in the control
saved registers to be recovered from the stack.
register.
Note: As a consequence of the IRET instruction,
If any of these two conditions is false, the interrupt
the I bit will be cleared and the main program will
is latched and thus remains pending.
resume.
Clearing an interrupt request is done by one of the
two following operations:
Priority Management – Writing “0” to the corresponding bit in the status
By default, a servicing interrupt cannot be inter- register.
rupted because the I bit is set by hardware enter- – Accessing the status register while the flag is set
ing in interrupt routine.
followed by a read or write of an associated reg-
In the case several interrupts are simultaneously ister.
pending, a hardware priority defines which one will
Notes:
be serviced first (see Table 7, "Interrupt Map-
ping"). 1. The clearing sequence resets the internal latch.
A pending interrupt (i.e. waiting to be enabled) will
therefore be lost if the clear sequence is executed.
Non-maskable Software Interrupts 2. All interrupts allow the processor to leave the
This interrupt is entered when the TRAP instruc- Wait low power mode.
tion is executed regardless of the state of the I bit. 3. Exit from Halt mode may only be triggered by an
It will be serviced according to the flowchart on
External Interrupt on one of the ITi ports (PA4-PA7
Figure 16.
and PB4-PB7), an end suspend mode Interrupt
coming from USB peripheral, or a reset.
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INTERRUPTS (Cont’d)
Figure 16. Interrupt Processing Flowchart
FROM RESET
N
BIT I SET
Y N
INTERRUPT
N
IRET
STACK PC, X, A, CC
Y SET I BIT
LOAD PC FROM INTERRUPT VECTOR
EXECUTE INSTRUCTION
Exit Vector
Source Register Priority
N° Description from Address
Block Label Order
HALT
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INTERRUPTS (Cont’d)
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8.1 Introduction
To give a large measure of flexibility to the applica- Figure 17. HALT Mode Flow Chart
tion in terms of power consumption, two main pow-
er saving modes are implemented in the ST7.
After a RESET, the normal operating mode is se- HALT INSTRUCTION
lected by default (RUN mode). This mode drives
the device (CPU and embedded peripherals) by
means of a master clock which is based on the
main oscillator frequency divided by 3 (f CPU). OSCILLATOR OFF
PERIPH. CLOCK OFF
From Run mode, the different power saving
modes may be selected by setting the relevant CPU CLOCK OFF
register bits or by calling the specific ST7 software I-BIT CLEARED
instruction whose action depends on the oscillator
status.
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IF RESET
4096 CPU CLOCK
CYCLES DELAY
OR SERVICE INTERRUPT
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9 I/O PORTS
9.1 Introduction
The I/O ports offer different functional modes: tivity is given independently according to the de-
– Transfer of data through digital inputs and out- scription mentioned in the ITRFRE interrupt regis-
puts and for specific pins ter.
– Analog signal input (ADC) Each pin can independently generate an Interrupt
request.
– Alternate signal input/output for the on-chip pe-
ripherals Each external interrupt vector is linked to a dedi-
cated group of I/O port pins (see Interrupts sec-
– External interrupt generation tion). If more than one input pin is selected simul-
An I/O port consists of up to 8 pins. Each pin can taneously as an interrupt source, this is logically
be programmed independently as a digital input ORed. For this reason if one of the interrupt pins is
(with or without interrupt generation) or a digital tied low, the other ones are masked.
output. Output Mode
The pin is configured in output mode by setting the
9.2 Functional description corresponding DDR register bit (see Table 7).
Each port is associated to 2 main registers: In this mode, writing “0” or “1” to the DR register
– Data Register (DR) applies this digital value to the I/O pin through the
latch. Therefore, the previously saved value is re-
– Data Direction Register (DDR) stored when the DR register is read.
Each I/O pin may be programmed using the corre- Note: The interrupt function is disabled in this
sponding register bits in DDR register: bit X corre- mode.
sponding to pin X of the port. The same corre-
spondence is used for the DR register.
Digital Alternate Function
Table 8. I/O Pin Functions
When an on-chip peripheral is configured to use a
DDR MODE
pin, the alternate function is automatically select-
ed. This alternate function takes priority over
0 Input standard I/O programming. When the signal is
1 Output coming from an on-chip peripheral, the I/O pin is
automatically configured in output mode (push-pull
or open drain according to the peripheral).
Input Modes
When the signal is going to an on-chip peripheral,
The input configuration is selected by clearing the the I/O pin has to be configured in input mode. In
corresponding DDR register bit. this case, the pin’s state is also digitally readable
In this case, reading the DR register returns the by addressing the DR register.
digital value applied to the external I/O pin. Notes:
Note 1: All the inputs are triggered by a Schmitt 1. Input pull-up configuration can cause an unex-
trigger. pected value at the input of the alternate peripher-
Note 2: When switching from input mode to output al input.
mode, the DR register should be written first to 2. When the on-chip peripheral uses a pin as input
output the correct value as soon as the port is con- and output, this pin must be configured as an input
figured as an output. (DDR = 0).
Interrupt function Warning: The alternate function must not be acti-
vated as long as the pin is configured as an input
When an I/O is configured as an Input with Inter-
rupt, an event on this I/O can generate an external with interrupt in order to avoid generating spurious
interrupts.
Interrupt request to the CPU. The interrupt sensi-
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ALTERNATE ENABLE
ALTERNATE 1 VDD
OUTPUT
0 P-BUFFER
DR VDD
PULL-UP
LATCH
DATA BUS
ALTERNATE ENABLE
DDR
LATCH PAD
DDR SEL
N-BUFFER
1 DIODES
DR SEL
ALTERNATE ENABLE
VSS
ALTERNATE INPUT 0
CMOS SCHMITT TRIGGER
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ALTERNATE ENABLE
ALTERNATE 1
OUTPUT
0
DR
LATCH
DDR
LATCH
DATA BUS
PAD
DDR SEL
N-BUFFER
DR SEL 1
ALTERNATE ENABLE
0 VSS
CMOS SCHMITT TRIGGER
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PB0 without pull-up push-pull Analog input (ADC) CH[2:0] = 000 (ADCCSR)
PB1 without pull-up push-pull Analog input (ADC) CH[2:0] = 001 (ADCCSR)
PB2 without pull-up push-pull Analog input (ADC) CH[2:0]= 010 (ADCCSR)
PB3 without pull-up push-pull Analog input (ADC) CH[2:0]= 011 (ADCCSR)
*Reset State
DDR
PAD
LATCH
COMMON ANALOG RAIL
ANALOG ENABLE
DATA BUS
(ADC)
1
DR SEL
ALTERNATE ENABLE
DIGITAL ENABLE
0 V SS
ALTERNATE INPUT
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ALTERNATE ENABLE
ALTERNATE 1 VDD
OUTPUT
0
P-BUFFER
DR VDD
PULL-UP
LATCH
ALTERNATE ENABLE
DATA BUS
DDR
LATCH PAD
DDR SEL
N-BUFFER
DR SEL 1 DIODES
ALTERNATE ENABLE
0 VSS
ALTERNATE INPUT
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10 MISCELLANEOUS REGISTER
Address: 0009h — Read/Write Bit 1 = USBOE USB enable.
Reset Value: 0000 0000 (00h) If this bit is set, the port PC2 outputs the USB out-
7 0 put enable signal (at “1” when the ST7 USB is
transmitting data).
- - - - - SMS USBOE MCO Unused bits 7-4 are set.
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11 ON-CHIP PERIPHERALS
RESET
WDGA T6 T5 T4 T3 T2 T1 T0
7-BIT DOWNCOUNTER
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Address Register
7 6 5 4 3 2 1 0
(Hex.) Label
WDGCR WDGA T6 T5 T4 T3 T2 T1 T0
0Ch
Reset Value 0 1 1 1 1 1 1 1
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fCPU
MCU-PERIPHERAL INTERFACE
8 high 8 low
8-bit 8 8 8 8 8 8 8 8
buffer
high
high
high
high
low
low
low
low
EXEDG
16
OVERFLOW
OUTPUT COMPARE EDGE DETECT ICAP1
DETECT
CIRCUIT CIRCUIT1 pin
CIRCUIT
LATCH1 OCMP1
pin
ICF1 OCF1 TOF ICF2 OCF2 TIMD 0 0
(Control/Status Register) LATCH2 OCMP2
CSR pin
ICIE OCIE TOIE FOLV2 FOLV1 OLVL2 IEDG1 OLVL1 OC1E OC2E OPM PWM CC1 CC0 IEDG2 EXEDG
(See note)
TIMER INTERRUPT Note: If IC, OC and TO interrupt requests have separate vectors
then the last OR is not present (See device Interrupt Vector Table)
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CPU CLOCK
INTERNAL RESET
TIMER CLOCK
CPU CLOCK
INTERNAL RESET
TIMER CLOCK
CPU CLOCK
INTERNAL RESET
TIMER CLOCK
Note: The MCU is in reset state when the internal reset signal is high, when it is low the MCU is running.
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TIMER CLOCK
ICAPi PIN
ICAPi FLAG
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TIMER CLOCK
TIMER CLOCK
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ICAP1
Figure 34. Pulse Width Modulation Mode Timing Example with 2 Output Compare Functions
OCMP1
OLVL2 OLVL1 OLVL2
compare2 compare1 compare2
Note: On timers with only 1 Output Compare register, a fixed frequency PWM signal can be generated us-
ing the output compare and the counter overflow to define the pulse length.
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11.2.5 Interrupts
Enable Exit Exit
Event
Interrupt Event Control from from
Flag
Bit Wait Halt
Input Capture 1 event/Counter reset in PWM mode ICF1 Yes No
ICIE
Input Capture 2 event ICF2 Yes No
Output Compare 1 event (not available in PWM mode) OCF1 Yes No
OCIE
Output Compare 2 event (not available in PWM mode) OCF2 Yes No
Timer Overflow event TOF TOIE Yes No
Note: The 16-bit Timer interrupt events are connected to the same interrupt vector (see Interrupts chap-
ter). These events generate an interrupt if the corresponding Enable Control Bit is set and the interrupt
mask in the CC register is reset (RIM instruction).
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MSB LSB
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■ Independently programmable transmit and – RDI: Receive Data Input is the serial data input.
receive baud rates up to 250K baud. Oversampling techniques are used for data re-
covery by discriminating between valid incoming
■ Programmable data word length (8 or 9 bits)
data and noise.
■ Receive buffer full, Transmit buffer empty and
Through these pins, serial data is transmitted and
End of Transmission flags received as frames comprising:
■ Two receiver wake-up modes:
– An Idle Line prior to transmission or reception
– Address bit (MSB)
– A start bit
– Idle line
– A data word (8 or 9 bits) least significant bit first
■ Muting function for multiprocessor configurations
– A Stop bit indicating that the frame is complete.
■ Separate enable bits for Transmitter and
Receiver
■ Four error detection flags:
– Overrun error
– Noise error
– Frame error
– Parity error
■ Five interrupt sources with flags:
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TDO
RDI
CR1
R8 T8 SCID M WAKE PCE PS PIE
WAKE
TRANSMIT UP RECEIVER RECEIVER
CONTROL UNIT CONTROL CLOCK
CR2 SR
TIE TCIE RIE ILIE TE RE RWU SBK TDRE TC RDRF IDLE OR NF FE PE
SCI
INTERRUPT
CONTROL
TRANSMITTER
CLOCK
TRANSMITTER RATE
CONTROL
fCPU
/16 /PR
BRR
SCP1 SCP0 SCT2 SCT1 SCT0 SCR2 SCR1SCR0
RECEIVER RATE
CONTROL
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Start
Idle Frame Bit
Start
Idle Frame Bit
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ENDPOINT
REGISTERS CPU
USBDM
Transceiver Address,
SIE DMA
USBDP data buses
and interrupts
3.3V
USBVCC Voltage INTERRUPT
Regulator REGISTERS MEMORY
USBGND
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101111
Endpoint 2 TX
101000
100111
Endpoint 2 RX
100000
011111
Endpoint 1 TX
011000
010111
Endpoint 1 RX
010000
001111
Endpoint 0 TX
001000
000111
Endpoint 0 RX
DA15-6,000000 000000
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7 0 7 0
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7 0
Bit 0 = FRES Force reset.
SUS DOV CTR ERR IOVR ESU RES SOF
This bit is set by software to force a reset of the
PM RM M M M SPM ETM M
USB interface, just as if a RESET sequence came
from the USB.
0: Reset not forced
Bits 7:0 = These bits are mask bits for all interrupt 1: USB interface reset forced.
condition bits included in the ISTR. Whenever one The USB is held in RESET state until software
of the IMR bits is set, if the corresponding ISTR bit clears this bit, at which point a “USB-RESET” in-
is set, and the I bit in the CC register is cleared, an terrupt will be generated if enabled.
interrupt request is generated. For an explanation
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Bits 6:0 = ADD[6:0] Device address, 7 bits. Bits 5:4 = STAT_TX[1:0] Status bits, for transmis-
Software must write into this register the address sion transfers.
sent by the host during enumeration. These bits contain the information about the end-
Note: This register is also reset when a USB reset point status, which are listed below:
is received from the USB bus or forced through bit STAT_TX1 STAT_TX0 Meaning
FRES in the CTLR register. DISABLED: transmission
0 0
transfers cannot be executed.
ENDPOINT n REGISTER A (EPnRA) STALL: the endpoint is stalled
0 1 and all transmission requests
Read / Write result in a STALL handshake.
Reset Value: 0000 xxxx (0xh) NAK: the endpoint is naked
1 0 and all transmission requests
7 0 result in a NAK handshake.
VALID: this endpoint is ena-
ST_ DTOG STAT STAT TBC TBC TBC TBC 1 1
bled for transmission.
OUT _TX _TX1 _TX0 3 2 1 0
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Bits 5:4 = STAT_RX [1:0] Status bits, for reception Bit 7 = Forced by hardware to 1.
transfers.
These bits contain the information about the end- Bits 6:4 = Refer to the EPnRB register for a de-
point status, which are listed below: scription of these bits.
STAT_RX1 STAT_RX0 Meaning
DISABLED: reception Bits 3:0 = Forced by hardware to 0.
0 0 transfers cannot be exe-
cuted.
STALL: the endpoint is
stalled and all reception
0 1
requests result in a
STALL handshake.
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SDA
MSB ACK
SCL
1 2 8 9
START STOP
CONDITION CONDITION
VR02119B
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SDAI
SDA DATA CONTROL
DATA SHIFT REGISTER
COMPARATOR
SCLI
SCL CLOCK CONTROL
INTERRUPT
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Slave Transmitter
Following the address reception and after the SR1
register has been read, the slave sends bytes from
the DR register to the SDA line via the internal shift
register.
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Slave Transmitter
S Address A Data1 A Data2 A DataN NA P
.....
EV1 EV3 EV3 EV3 EV3-1 EV4
Master Receiver
S Address A Data1 A Data2 A DataN NA P
.....
EV5 EV6 EV7 EV7 EV7
Master Transmitter
S Address A Data1 A Data2 A DataN A P
.....
EV5 EV6 EV8 EV8 EV8 EV8
Legend:
S=Start, P=Stop, A=Acknowledge, NA=Non-acknowledge
EVx=Event (with interrupt if ITE=1)
EV1: EVF=1, ADSL=1, cleared by reading the SR1 register.
EV2: EVF=1, BTF=1, cleared by reading the SR1 register followed by reading the DR register.
EV3: EVF=1, BTF=1, cleared by reading the SR1 register followed by writing the DR register.
EV3-1: EVF=1, AF=1, BTF=1; AF is cleared by reading the SR1 register. The BTF is cleared
by releasing the lines (STOP=1, STOP=0) or by writing the DR register (DR=FFh).
Note: If lines are released by STOP=1, STOP=0, the subsequent EV4 is not seen.
EV4: EVF=1, STOPF=1, cleared by reading the SR2 register.
EV5: EVF=1, SB=1, cleared by reading the SR1 register followed by writing the DR register.
EV6: EVF=1, cleared by reading the SR1 register followed by writing the CR register
(for example PE=1).
EV7: EVF=1, BTF=1, cleared by reading the SR1 register followed by reading the DR register.
EV8: EVF=1, BTF=1, cleared by reading the SR1 register followed by writing the DR register.
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11.5.6 Interrupts
Figure 42. Event Flags and Interrupt Generation
BTF ITE
ADSL
SB
AF INTERRUPT
STOPF
ARLO
BERR
EVF
*
* EVF can also be set by EV6 or an error from the SR2 register.
The I²C interrupt events are connected to the They generate an interrupt if the corresponding
same interrupt vector (see Interrupts chapter). Enable Control Bit is set and the I-bit in the CC
register is reset (RIM instruction).
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FM/SM CC6 CC5 CC4 CC3 CC2 CC1 CC0 ADD7 ADD6 ADD5 ADD4 ADD3 ADD2 ADD1 ADD0
Bits 6:0 = CC6-CC0 7-bit clock divider. Bit 0 = ADD0 Address direction bit.
These bits select the speed of the bus (FSCL) de- This bit is don’t care, the interface acknowledges
pending on the I²C mode. They are not cleared either 0 or 1. It is not cleared when the interface is
when the interface is disabled (PE=0). disabled (PE=0).
– Standard mode (FM/SM=0): FSCL <= 100kHz Note: Address 01h is always ignored.
FSCL = fCPU/(2x([CC6..CC0]+2))
– Fast mode (FM/SM=1): FSCL > 100kHz
FSCL = fCPU/(3x([CC6..CC0]+2))
Note: The programmed FSCL assumes no load on
SCL and SDA lines.
D7 D6 D5 D4 D3 D2 D1 D0
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fCPU fADC
DIV 4
AIN0
HOLD CONTROL
AIN1 RADC
ANALOG ANALOG TO DIGITAL
MUX CONVERTER
AINx CADC
ADCDR D7 D6 D5 D4 D3 D2 D1 D0
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7 0 7 0
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Address Register
7 6 5 4 3 2 1 0
(Hex.) Name
0Ah DR AD7 .. AD0
0Bh CSR COCO 0 ADON 0 0 CH2 CH1 CH0
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12 INSTRUCTION SET
12.1 ST7 ADDRESSING MODES so, most of the addressing modes may be subdi-
vided in two sub-modes called long and short:
The ST7 Core features 17 different addressing
modes which can be classified in 7 main groups: – Long addressing mode is more powerful be-
cause it can use the full 64 Kbyte address space,
Addressing Mode Example however it uses more bytes and more CPU cy-
Inherent nop cles.
Immediate ld A,#$55 – Short addressing mode is less powerful because
it can generally only access page zero (0000h -
Direct ld A,$55 00FFh range), but the instruction size is more
Indexed ld A,($55,X) compact, and faster. All memory to memory in-
Indirect ld A,([$55],X) structions use short addressing modes only
(CLR, CPL, NEG, BSET, BRES, BTJT, BTJF,
Relative jrne loop INC, DEC, RLC, RRC, SLL, SRL, SRA, SWAP)
Bit operation bset byte,#5 The ST7 Assembler optimizes the use of long and
short addressing modes.
The ST7 Instruction set is designed to minimize
the number of bytes required per instruction: To do
Table 23. ST7 Addressing Mode Overview
Pointer Pointer
Destination/ Length
Mode Syntax Address Size
Source (Bytes)
(Hex.) (Hex.)
Inherent nop +0
Immediate ld A,#$55 +1
Short Direct ld A,$10 00..FF +1
Long Direct ld A,$1000 0000..FFFF +2
+ 0 (with X register)
No Offset Direct Indexed ld A,(X) 00..FF
+ 1 (with Y register)
Short Direct Indexed ld A,($10,X) 00..1FE +1
Long Direct Indexed ld A,($1000,X) 0000..FFFF +2
Short Indirect ld A,[$10] 00..FF 00..FF byte +2
Long Indirect ld A,[$10.w] 0000..FFFF 00..FF word +2
Short Indirect Indexed ld A,([$10],X) 00..1FE 00..FF byte +2
Long Indirect Indexed ld A,([$10.w],X) 0000..FFFF 00..FF word +2
1)
Relative Direct jrne loop PC-128/PC+127 +1
Relative Indirect jrne [$10] PC-128/PC+1271) 00..FF byte +2
Bit Direct bset $10,#7 00..FF +1
Bit Indirect bset [$10],#7 00..FF 00..FF byte +2
Bit Direct Relative btjt $10,#7,skip 00..FF +2
Bit Indirect Relative btjt [$10],#7,skip 00..FF 00..FF byte +3
Note 1. At the time the instruction is executed, the Program Counter (PC) points to the instruction follow-
ing JRxx.
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Using a pre-byte
The instructions are described with one to four These prebytes enable instruction in Y as well as
bytes. indirect addressing modes to be implemented.
In order to extend the number of available op- They precede the opcode of the instruction in X or
codes for an 8-bit CPU (256 opcodes), three differ- the instruction using direct addressing mode. The
ent prebyte opcodes are defined. These prebytes prebytes are:
modify the meaning of the instruction they pre- PDY 90 Replace an X based instruction using
cede. immediate, direct, indexed, or inherent
The whole instruction becomes: addressing mode by a Y one.
PC-2 End of previous instruction PIX 92 Replace an instruction using direct, di-
rect bit, or direct relative addressing
PC-1 Prebyte mode to an instruction using the corre-
PC Opcode sponding indirect addressing mode.
It also changes an instruction using X
PC+1 Additional word (0 to 2) according to the
number of bytes required to compute the indexed addressing mode to an instruc-
tion using indirect X indexed addressing
effective address
mode.
PIY 91 Replace an instruction using X indirect
indexed addressing mode by a Y one.
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NOP No Operation
OR OR operation A=A+M A M N Z
pop CC CC M H I N Z C
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13 ELECTRICAL CHARACTERISTICS
ST7 PIN
CL
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Notes:
1. Directly connecting the RESET and I/O pins to VDD or VSS could damage the device if an unintentional internal reset
is generated or an unexpected change of the I/O configuration occurs (for example, due to a corrupted program counter).
To guarantee safe operation, this connection has to be done through a pull-up or pull-down resistor (typical: 4.7kΩ for
RESET, 10kΩ for I/Os). Unused I/O pins must be tied in the same way to VDD or VSS according to their reset configuration.
2. When the current limitation is not possible, the VIN absolute maximum rating must be respected, otherwise refer to
IINJ(PIN) specification. A positive injection is induced by VIN>VDD while a negative injection is induced by VIN<VSS.
3. All power (VDD) and ground (VSS) lines must always be connected to the external supply.
4. Negative injection disturbs the analog performance of the device. In particular, it induces leakage currents throughout
the device including the analog inputs. To avoid undesirable effects on the analog functions, care must be taken:
- Analog input pins must have a negative injection less than 0.8 mA (assuming that the impedance of the analog voltage
is lower than the specified limits)
- Pure digital pins must have a negative injection less than 1.6mA. In addition, it is recommended to inject the current as
far as possible from the analog input pins.
5. When several inputs are submitted to a current injection, the maximum ΣIINJ(PIN) is the absolute sum of the positive
and negative injected currents (instantaneous values). These results are based on characterisation with ΣIINJ(PIN) maxi-
mum current injection on four I/O port pins of the device.
6. True open drain I/O port pins do not accept positive injection.
13.2.3 Thermal Characteristics
Symbol Ratings Value Unit
TSTG Storage temperature range -65 to +150 °C
TJ Maximum junction temperature TBD
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Figure 47. fCPU Maximum Operating Frequency Versus VDD Supply Voltage
fCPU [MHz]
8
FUNCTIONALITY
GUARANTEED
FROM 4 TO 5.5 V
FUNCTIONALITY
NOT GUARANTEED 2
IN THIS AREA
0
2.5 3.0 3.5 4 4.5 5 5.5 SUPPLY VOLTAGE [V]
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Note 1: Typical data are based on TA=25°C and not tested in production
Note 2: Oscillator and watchdog running.
All others peripherals disabled.
Note 3: USB Transceiver and ADC are powered down.
Note 4: Low voltage reset function enabled.
CPU in HALT mode.
Current consumption of external pull-up (1.5Kohms to USBVCC) and pull-down (15Kohms to VSSA)
not included.
Figure 48. Typ. IDD in RUN at 4 and 8 MHz fCPU Figure 49. Typ. IDD in WAIT at 4 and 8 MHz fCPU
10
14
9
12
8
10 7
Idd wait (mA)
Idd run ( mA )
6
8
5
6 4
4 3
4 mHz 4 mHz
8 mHz 2
2 8 mHz
1
0 0
4 4.5 5 5.5 4 4.5 5 5.5
Vdd (V) Vdd (V)
100/132
ST7263B
Note 1: The minimum period t ILIL should not be less than the number of cycle times it takes to execute the
interrupt service routine plus 21 cycles.
101/132
ST7263B
90%
VOSCINH
10%
VOSCINL
OSCOUT
Not connected internally
fOSC
EXTERNAL
IL
CLOCK SOURCE
OSCIN
ST72XXX
Notes:
1. Data based on design simulation and/or technology characteristics, not tested in production.
i2
fOSC
CL1 OSCIN
RESONATOR RF
CL2
OSCOUT
ST72XXX
102/132
ST7263B
VPP VPP
PROGRAMMING
TOOL
10kΩ
ST72XXX ST72XXX
Note 1: When the ICP mode is not required by the application, VPP pin must be tied to VSS.
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ST7263B
ST72XXX
10µF 0.1µF VDD
ST7
DIGITAL NOISE
FILTERING
VSS
VDD
POWER VSSA
SUPPLY
SOURCE
EXTERNAL
NOISE
FILTERING VDDA
0.1µF
Notes:
1. Data based on characterization results, not tested in production.
2. The suggested 10µF and 0.1µF decoupling capacitors on the power supply lines are proposed as a good price vs. EMC
performance trade-off. They have to be put as close as possible to the device power supply pins. Other EMC recommen-
dations are given in other sections (I/Os, RESET, OSCx pin characteristics).
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ST7263B
S1 R=1500Ω
HIGH VOLTAGE
PULSE CL=100pF
ST7 S2
GENERATOR
Notes:
1. Data based on characterization results, not tested in production.
105/132
ST7263B
VSS
CS=150pF HV RELAY
ST7
ESD
GENERATOR 2) DISCHARGE
RETURN CONNECTION
Notes:
1. Class description: A Class is an STMicroelectronics internal specification. All its limits are higher than the JEDEC spec-
ifications, that means when a device belongs to Class A it exceeds the JEDEC standard. B Class strictly covers all the
JEDEC criteria (international standard).
2. Schaffner NSG435 with a pointed test finger.
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ST7263B
(3a) (2a)
(1)
OUT (4) IN
Main path
(3b) (2b)
Path to avoid
VSS VSS
(3a) (2a)
(1)
OUT (4) IN
Main path
(3b) (2b)
VSS VSS
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ST7263B
Main path
(1)
Path to avoid OUT (4) IN
VSS VSS
Figure 59. Negative Stress on a True Open Drain Pad vs. VDD
VDD VDD
Main path
(1)
OUT (4) IN
VSS VSS
VDDA
VSS
BACK TO BACK DIODE
BETWEEN GROUNDS
VSSA VSSA
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ST7263B
VDD ST72XXX
UNUSED I/O PORT
10kΩ 10kΩ
UNUSED I/O PORT
ST72XXX
Figure 62. Typical IPU vs. VDD with V IN=VSS Figure 63. Typical RPU vs. VDD with VIN=VSS
100
90 170
160
80
150
70 140
60 130
-45°C
R (kohms)
120
Ipu (µA)
50
25°C 110
40 75°C 100 -45°C
30 90 25°C
80 75°C
20
70
10 60
3.50
3.75
4.00
4.25
4.50
4.75
5.00
5.25
5.50
5.75
6.00
0
3.50
3.75
4.00
4.25
4.50
4.75
5.00
5.25
5.50
5.75
6.00
Notes:
1. Unless otherwise specified, typical data are based on TA=25°C and VDD=5V, not tested in production.
2. Configuration not recommended, all unused pins must be kept at a fixed voltage: using the output mode of the I/O for
example or an external pull-up or pull-down resistor (see Figure 61). Data based on design simulation and/or technology
characteristics, not tested in production.
3. The RPU pull-up equivalent resistor is based on a resistive transistor (corresponding IPU current characteristics de-
scribed in Figure 62). This data is based on characterization results.
4. To generate an external interrupt, a minimum pulse width has to be applied on an I/O port pin configured as an external
interrupt source.
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ST7263B
VDD=5V
IIO=+10mA 1.3
B(0:7)
(see Figure 65) V
Notes:
1. The IIO current sunk must always respect the absolute maximum rating specified in Section 13.2 and the sum of IIO (I/
O ports and control pins) must not exceed IVSS.
2. The IIO current sourced must always respect the absolute maximum rating specified in Section 13.2 and the sum of IIO
(I/O ports and control pins) must not exceed IVDD. True open drain I/O pins does not have VOH.
Figure 64. Typical VOL at VDD=5V (standard) Figure 65. Typical VOL at VDD=5V (high-sink)
0.3 3
0.25 2.5
0.2 2
Vol (V)
0.15 1.5
Vol
0.1 1
0.05 0.5
0 0
1.5 2 2.5 3 3.5 4 5 10 15 20 25
Iio (mA)
Iio (mA)
110/132
ST7263B
1.5
1
Vol
0.5
0
15 20 25 30 35 40
Iio (mA)
111/132
ST7263B
0.35 2.5
Vdd - Voh (V) at Vdd=5V (standard)
0.3
0.2 1.5
0.15
1
0.1
0.5
0.05
0 0
-4 -3.5 -3 -2.5 -2 -1.5 -1 -25 -20 -15 -10 -5
Iio (mA)
Iio (mA)
Figure 68. Typical VOL vs. VDD (standard I/Os) Figure 69. Typical VOL vs. VDD (high-sink I/Os)
0.134
0.75
0.132
0.7
0.130
Vol (V) vs Vdd at lio=1.6mA
0.65
0.128
0.126 0.6
0.124
0.55
0.122
0.5
0.120 4 4.25 4.5 4.75 5 5.25 5.5
4 4.25 4.5 4.75 5 5.25 5.5
Vdd (V )
Vdd ( V )
0.9
0.85
Vol (V) at Vdd=25mA
0.8
0.75
0.7
0.65
0.6
0.55
0.5
4 4.25 4.5 4.75 5 5.25 5.5
Vdd ( V )
112/132
ST7263B
0.165 0.9
0.85
0.16
Vdd - Voh ( V ) at lio=-1.6mA
0.15 0.7
0.65
0.145
0.6
0.14
0.55
0.135 0.5
4 4.25 4.5 4.75 5 5.25 5.5 4 4.25 4.5 4.75 5 5.25 5.5
Vdd ( V ) Vdd ( V )
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ST7263B
ST72XXX
VDD
L
NA
VDD VDD
IO
PT
INTERNAL
O
RON
RESET CONTROL
USER 0.1µF 4.7kΩ
EXTERNAL RESET
RESET
CIRCUIT 8)
0.1µF WATCHDOG RESET
LVD RESET
Notes:
1. Unless otherwise specified, typical data are based on TA=25°C and VDD=5V, not tested in production.
2. Data based on characterization results, not tested in production.
3. Hysteresis voltage between Schmitt trigger switching levels. Based on characterization results, not tested.
4. The IIO current sunk must always respect the absolute maximum rating specified in Section 13.2 and the sum of IIO (I/
O ports and control pins) must not exceed IVSS.
5. The RON pull-up equivalent resistor is based on a resistive transistor (corresponding ION current characteristics de-
scribed in Figure 73). This data is based on characterization results, not tested in production.
6. To guarantee the reset of the device, a minimum pulse has to be applied to RESET pin. All short pulses applied on
RESET pin with a duration below th(RSTL)in can be ignored.
7. The output of the external reset circuit must have an open-drain output to drive the ST7 reset pad. Otherwise the device
can be damaged when the ST7 generates an internal reset (LVD or watchdog).
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ST7263B
1.2
120
100 1
60 25°C
0.6
75°C
40
0.4
20
0.2
0
3.50
3.75
4.00
4.25
4.50
4.75
5.00
5.25
5.50
5.75
6.00
0
3.5 4 4.5 5 5.5 6 6.5 7 7.5
Vdd (V)
Iio (mA)
2
0.75
1.9
1.8
0.7
1.7
Vol (V) at lio=7.5mA
Vol (V) at lio=5mA
1.6
0.65
1.5
1.4
0.6
1.3
1.2
0.55
1.1
0.5 1
4 4.25 4.5 4.75 5 5.25 5.5 4 4.25 4.5 4.75 5 5.25 5.5
Vdd (V ) Vdd (V )
115/132
ST7263B
Differential
Data Lines Crossover
points
VCRS
VSS
tf tr
Note 1: Measured from 10% to 90% of the data signal. For more detailed informations, please refer to
Chapter 7 (Electrical) of the USB specification (version 1.1).
116/132
ST7263B
13.10.2 SCI - Serial Communications Interface Refer to I/O port characteristics for more details on
Subject to general operating condition for V DD, the input/output alternate function characteristics
fCPU, and TA unless otherwise specified. (RDI and TDO).
Conditions
Baud
Symbol Parameter Accuracy Standard Unit
fCPU Prescaler Rate
vs. Standard
Conventional Mode
TR (or RR)=128, PR=13 300 ~300.48
TR (or RR)= 32, PR=13 1200 ~1201.92
fTx TR (or RR)= 16, PR=13 2400 ~2403.84
Communication frequency 8MHz ~0.16% TR (or RR)= 8, PR=13 4800 ~4807.69 Hz
fRx TR (or RR)= 4, PR=13 9600 ~9615.38
TR (or RR)= 16, PR= 3 10400 ~10416.67
TR (or RR)= 2, PR=13 19200 ~19230.77
TR (or RR)= 1, PR=13 38400 ~38461.54
(Subject to general operating conditions for V DD, fOSC, and TA unless otherwise specified)
Standard mode I2C Fast mode I2C
Symbol Parameter Unit
Min 1) Max 1) Min 1) Max 1)
tw(SCLL) SCL clock low time 4.7 1.3
µs
tw(SCLH) SCL clock high time 4.0 0.6
tsu(SDA) SDA setup time 250 100
th(SDA) SDA data hold time 0 3) 0 2) 900 3)
tr(SDA) ns
SDA and SCL rise time 1000 20+0.1Cb 300
tr(SCL)
tf(SDA)
SDA and SCL fall time 300 20+0.1Cb 300
tf(SCL)
th(STA) START condition hold time 4.0 0.6
µs
tsu(STA) Repeated START condition setup time 4.7 0.6
tsu(STO) STOP condition setup time 4.0 0.6 ns
tw(STO:STA) STOP to START condition time (bus free) 4.7 1.3 ms
Cb Capacitive load for each bus line 400 400 pF
Notes:
1. Data based on standard I2C protocol requirement, not tested in production.
2. The device must internally provide a hold time of at least 300ns for the SDA signal in order to bridge the undefined
region of the falling edge of SCL.
3. The maximum hold time of the START condition has only to be met if the interface does not stretch the low period of
SCL signal.
117/132
ST7263B
Figure 77. Typical Application with I2C Bus and Timing Diagram 1)
VDD VDD
SCK
Note 1. Measurement points are done at CMOS levels: 0.3xVDD and 0.7xVDD.
118/132
ST7263B
VDD
VT
0.6V
RAIN AINx
VAIN ADC
VT
CIO 0.6V IL
~2pF ±1µA
VDD
VDDA
0.1µF
VSSA
ST72XXX
Notes:
1. Unless otherwise specified, typical data are based on TA=25°C and VDD-VSS=5V. They are given only as design guide-
lines and are not tested.
2. When VDDA and VSSA pins are not available on the pinout, the ADC refer to VDD and VSS.
3. Any added external serial resistor will downgrade the ADC accuracy (especially for resistance greater than 10kΩ). Data
based on characterization results, not tested in production.
4. The stabilization time of the AD converter is masked by the first tLOAD. The first conversion after the enable is then
always valid.
119/132
ST7263B
ADC Accuracy with V DD=5V, fCPU=8 MHz, fADC=4 MHz R AIN< 10kΩ
Symbol Parameter Min Max
|ET| Total unadjusted error 1) 2
EO Offset error 1) -0.5 1
EG Gain Error 1) -1.5 0
|ED| Differential linearity error 1) 1.5
|EL| Integral linearity error 1) 1.5
(2)
ET=Total Unadjusted Error: maximum deviation
ET between the actual and the ideal transfer curves.
7 (3) EO=Offset Error: deviation between the first actual
(1) transition and the first ideal one.
6
EG=Gain Error: deviation between the last ideal
5 transition and the last actual one.
EO EL ED=Differential Linearity Error: maximum deviation
4 between actual steps and the ideal one.
3 EL=Integral Linearity Error: maximum deviation
ED between any actual transition and the end point
2 correlation line.
1 LSBIDEAL
1
Vin (LSBIDEAL)
0 1 2 3 4 5 6 7 253 254 255 256
VSSA VDDA
Notes:
1. ADC Accuracy vs. Negative Injection Current:
For IINJ-=0.8mA, the typical leakage induced inside the die is 1.6µA and the effect on the ADC accuracy is a loss of 1 LSB
for each 10KΩ increase of the external analog source impedance. This effect on the ADC accuracy has been observed
under worst-case conditions for injection:
- negative injection
- injection to an Input with analog capability, adjacent to the enabled Analog Input
- at 5V VDD supply, and worst case temperature.
2. Data based on characterization results with TA=25°C.
3. Data based on characterization results over the whole temperature range, monitored in production.
120/132
ST7263B
14 PACKAGE CHARACTERISTICS
Figure 80. 34-Pin Shrink Plastic Small Outline Package, 300-mil Width
mm inches
Dim.
Min Typ Max Min Typ Max
A 2.46 2.64 0.097 0.104
A1 0.13 0.29 0.005 0.0115
B 0.36 0.48 0.014 0.019
0.10mm
C 0.23 0.32 0.0091 0.0125
.004
seating plane D 17.73 18.06 0.698 0.711
E 7.42 7.59 0.292 0.299
e 1.02 0.040
H 10.16 10.41 0.400 0.410
h 0.64 0.74 0.025 0.029
K 0° 8°
L 0.61 1.02 0.024 0.040
Number of Pins
N 34
SO34S
Figure 81. 32-Pin Shrink Plastic Dual in Line Package, 400-mil Width
E
mm inches
Dim.
See Lead Detail Min Typ Max Min Typ Max
A 3.56 3.76 5.08 0.140 0.148 0.200
A1 0.51 0.020
C A2 3.05 3.56 4.57 0.120 0.140 0.180
b1 eA
b b 0.36 0.46 0.58 0.014 0.018 0.023
eB b1 0.76 1.02 1.40 0.030 0.040 0.055
e3 C 0.20 0.25 0.36 0.008 0.010 0.014
D D 27.43 27.94 28.45 1.080 1.100 1.120
E 9.91 10.41 11.05 0.390 0.410 0.435
N A2
E1 7.62 8.89 9.40 0.300 0.350 0.370
A e 1.78 0.070
E1
A1 L eA 10.16 0.400
e eB 12.70 0.500
1 N/2 VR01725J L 2.54 3.05 3.81 0.100 0.120 0.150
Number of Pins
N 32
121/132
ST7263B
Notes:
1. The power dissipation is obtained from the formula PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD)
and PPORT is the port power dissipation determined by the user.
2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA.
122/132
ST7263B
Figure 82. Recommended Wave Soldering Profile (with 37% Sn and 63% Pb)
250
COOLING PHASE
200 5 sec (ROOM TEMPERATURE)
SOLDERING
150 80°C PHASE
Temp. [°C]
100
PREHEATING
PHASE
50
0 Time [sec]
20 40 60 80 100 120 140 160
250
Tmax=220+/-5°C
for 25 sec
200
0 Time [sec]
100 200 300 400
123/132
ST7263B
124/132
ST7263B
125/132
ST7263B
Note:
1. In-Circuit Programming (ICP) interface for FLASH devices.
Note:
1. Add Suffix /EU or /US for the power supply for your region.
126/132
ST7263B
Customer: ............................
Address: ............................
............................
Contact: ............................
Phone No: . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reference: . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ROM or FASTROM code must be sent in .S19 format. .Hex extension cannot be processed.
STMicroelectronics references:
Device Type/Memory Size/Package (check only one option):
----------------------------------------------------------------------------------------------------------------------
ROM DEVICE: | 4K | 8K | 16K
----------------------------------------------------------------------------------------------------------------------
PSDIP32: | [ ] ST7263BK1B1 | [ ] ST7263BK2B1 | [ ] ST72P63BK4B1
SO34: | [ ] ST7263BK1M1 | [ ] ST7263BK2M1 | [ ] ST72P63BK4M1
----------------------------------------------------------------------------------------------------------------------
FASTROM DEVICE: | 4K | 8K | 16K
----------------------------------------------------------------------------------------------------------------------
PSDIP32: | [ ] ST72P63BK1B1 | [ ] ST72P63BK2B1 | [ ] ST72P63BK4B1
SO34: | [ ] ST72P63BK1M1 | [ ] ST72P63BK2M1 | [ ] ST72P63BK4M1
----------------------------------------------------------------------------------------------------------------------
DIE FORM: | 4K | 8K | 16K
----------------------------------------------------------------------------------------------------------------------
32-pin: | [ ] (as K1B1) | [ ] (as K2B1) | [ ] (as K4B1)
34-pin: | [ ] (as K1M1) | [ ] (as K2M1) | [ ] (as K4M1)
Signature ............................
127/132
ST7263B
128/132
ST7263B
IDENTIFICATION DESCRIPTION
AN 982 USING ST7 WITH CERAMIC RENATOR
AN1014 HOW TO MINIMIZE THE ST7 POWER CONSUMPTION
AN1015 SOFTWARE TECHNIQUES FOR IMPROVING MICROCONTROLLER EMC PERFORMANCE
AN1040 MONITORING THE VBUS SIGNAL FOR USB SELF-POWERED DEVICES
AN1070 ST7 CHECKSUM SELF-CHECKING CAPABILITY
AN1324 CALIBRATING THE RC OSCILLATOR OF THE ST7FLITE0 MCU USING THE MAINS
AN1477 EMULATED DATA EEPROM WITH XFLASH MEMORY
AN1502 EMULATED DATA EEPROM WITH ST7 HDFLASH MEMORY
AN1529 EXTENDING THE CURRENT & VOLTAGE CAPABILITY ON THE ST7265 VDDF SUPPLY
ACCURATE TIMEBASE FOR LOW-COST ST7 APPLICATIONS WITH INTERNAL RC OSCIL-
AN1530
LATOR
PROGRAMMING AND TOOLS
AN 978 KEY FEATURES OF THE STVD7 ST7 VISUAL DEBUG PACKAGE
AN 983 KEY FEATURES OF THE COSMIC ST7 C-COMPILER PACKAGE
AN 985 EXECUTING CODE IN ST7 RAM
AN 986 USING THE INDIRECT ADDRESSING MODE WITH ST7
AN 987 ST7 SERIAL TEST CONTROLLER PROGRAMMING
AN 988 STARTING WITH ST7 ASSEMBLY TOOL CHAIN
AN 989 GETTING STARTED WITH THE ST7 HIWARE C TOOLCHAIN
AN1039 ST7 MATH UTILITY ROUTINES
AN1064 WRITING OPTIMIZED HIWARE C LANGUAGE FOR ST7
AN1071 HALF DUPLEX USB-TO-SERIAL BRIDGE USING THE ST72611 USB MICROCONTROLLER
AN1106 TRANSLATING ASSEMBLY CODE FROM HC05 TO ST7
PROGRAMMING ST7 FLASH MICROCONTROLLERS IN REMOTE ISP MODE (IN-SITU PRO-
AN1179
GRAMMING)
AN1446 USING THE ST72521 EMULATOR TO DEBUG A ST72324 TARGET APPLICATION
AN1478 PORTING AN ST7 PANTA PROJECT TO CODEWARRIOR IDE
AN1527 DEVELOPING A USB SMARTCARD READER WITH ST7SCR
AN1575 ON-BOARD PROGRAMMING METHODS FOR XFLASH AND HDFLASH ST7 MCUS
129/132
ST7263B
16 KNOWN LIMITATIONS
130/132
ST7263B
17 SUMMARY OF CHANGES
Description of the changes between the current release of the specification and the previous one. .
131/132
ST7263B
Notes:
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without the express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
2002 STMicroelectronics - All Rights Reserved.
Purchase of I2C Components by STMicroelectronics conveys a license under the Philips I2C Patent. Rights to use these components in an
I2C system is granted provided that the system conforms to the I2C Standard Specification as defined by Philips.
STMicroelectronics Group of Companies
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132/132
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