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RT7296F C3
VIN VIN BOOT
C1 L1
SW VOUT
Enable EN/SYNC
R5 R1
PVCC FB
C2 R3
R2 C4
PG
GND
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1
RT7296F
Pin Configurations
(TOP VIEW)
EN/SYNC
BOOT
PVCC
FB
8 7 6 5
2 3 4
PG
VIN
SW
GND
TSOT-23-8 (FC)
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RT7296F
Function Block Diagram
PG PVCC VIN
Internal
Regulator Current
UVLO Sense
BOOT
Shutdown UVLO
Comparator BOOT
EN/SYNC -
1.4V + Logic & Power
Protection Stage &
Control Deadtime SW
0.4V + Control
- UV
Comparator
1pF HS Switch
Current
Current LS Switch Sense
50pF 400k Comparator Current
Comparator
FB - Slope GND
0.807V + EA Oscillator
Internal SS + Compensation
Operation
Under-Voltage Lockout Threshold Operating Frequency and Synchronization
The IC includes an input Under Voltage Lockout The internal oscillator runs at 500kHz (typ.) when the
Protection (UVLO). If the input voltage exceeds the EN/SYNC pin is at logic-high level (>1.6V). If the EN
UVLO rising threshold voltage (3.9V), the converter pin is pulled to low-level over 8s, the IC will shut down.
resets and prepares the PWM for operation. If the input The RT7296F can be synchronized with an external
voltage falls below the UVLO falling threshold voltage clock ranging from 200kHz to 2MHz applied to the
(3.25V) during normal operation, the device stops EN/SYNC pin. The external clock duty cycle must be
switching. The UVLO rising and falling threshold from 20% to 80% with logic-high level = 2V and
voltage includes a hysteresis to prevent noise caused logic-low level = 0.8V.
reset.
Internal Regulator
Chip Enable The internal regulator generates 5V power and drive
The EN pin is the chip enable input. Pulling the EN pin internal circuit. When VIN is below 5V, PVCC will drop
low (<1.1V) will shut down the device. During shutdown with VIN. A capacitor (>0.1F) between PVCC and
mode, the RT7296F’s quiescent current drops to lower GND is required.
than 1A. Driving the EN pin high (>1.6V) will turn on
Internal Soft-Start Function
the device.
The RT7296F provides internal soft-start function. The
soft-start function is used to prevent large inrush
current while converter is being powered-up. The
soft-start time (VFB from 0V to 0.8V) is 1.5ms.
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RT7296F
Absolute Maximum Ratings (Note 1)
Supply Input Voltage, VIN --------------------------------------------------------------------------------------------- 0.3V to 20V
Switch Voltage, SW ------------------------------------------------------------------------------------------------------ 0.3V to VIN + 0.3V
BOOT to SW, VBOOT – SW --------------------------------------------------------------------------------------------- 0.3V to 6V
Other Pins------------------------------------------------------------------------------------------------------------------- 0.3V to 6V
Power Dissipation, PD @ TA = 25C
TSOT-23-8 (FC) ---------------------------------------------------------------------------------------------------------- 1.428W
Package Thermal Resistance (Note 2)
TSOT-23-8 (FC), JA --------------------------------------------------------------------------------------------------- 70C/W
TSOT-23-8 (FC), JC --------------------------------------------------------------------------------------------------- 15C/W
Lead Temperature (Soldering, 10 sec.) --------------------------------------------------------------------------- 260C
Junction Temperature --------------------------------------------------------------------------------------------------- 40C to 150C
Storage Temperature Range ----------------------------------------------------------------------------------------- 65C to 150C
ESD Susceptibility (Note 3)
HBM (Human Body Model) ------------------------------------------------------------------------------------------- 2kV
Electrical Characteristics
(VIN = 12V, TA = 25C, unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Unit
Shutdown Supply Current VEN = 0V -- 7 -- A
Quiescent Current with no Load
VEN = 2V, VFB = 1V -- 0.8 1 mA
at DCDC Output
Feedback Voltage VFB 0.799 0.807 0.815 V
Feedback Current IFB VFB = 820mV -- 10 50 nA
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RT7296F
Parameter Symbol Test Conditions Min Typ Max Unit
Logic-High VIH 1.2 1.4 1.6
EN Input Voltage V
Logic-Low VIL 1.1 1.25 1.4
VEN = 2V -- 2 --
EN Input Current IEN A
VEN = 0V -- 0 --
EN Turn-off Delay ENtd-off -- 8 -- s
Power-Good Rising Threshol PGvth-Hi -- 0.9 -- VFB
Power-Good Falling Threshol PGvth-Lo -- 0.85 -- VFB
Power-Good Delay PGTd -- 0.4 -- ms
Power-Good Sink Current
VPG Sink 4mA -- -- 0.4 V
Capability
Power-Good Leakage Current IPG-LEAK -- -- 1 A
Input Under-Voltage VIN Rising VUVLO VIN Rising 3.7 3.9 4.1 V
Lockout Threshold Hysteresis VUVLO -- 650 -- mV
PVCC Regulator VCC -- 5 -- V
PVCC Load Regulation VLOAD IVCC = 5mA -- 3 -- %
Soft-Start Time tSS FB from 0V to 0.8V -- 1.5 -- ms
o
Thermal Shutdown Temperature TSD -- 150 -- C
Thermal Shutdown Hysteresis TSD -- 20 -- o
C
Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. JA is measured at TA = 25C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. JC is
measured at the exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
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RT7296F
Typical Application Circuit
C3
RT7296F 0.1μF
2 5
VIN VIN BOOT
4.5V to 17V C1
22μF R6
L1
10
4.7μH
6 3 VOUT
Enable EN/SYNC SW
Cff 15pF
7 FB
PVCC R5 R1
C2 R3
0.1μF 8 16k 40.2k
100k 1
PG
GND R2 C4
4 13k 44μF
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RT7296F
Typical Operating Characteristics
Efficiency vs. Output Current Output Voltage vs. Input Voltage
100 3.46
90 3.42
80 VIN = 4.5V
3.38
Output Voltage(V)
70 VIN = 12V
Efficiency (%)
50 3.30
40
3.26
30
3.22
20
10 3.18
VOUT = 3.3V IOUT = 3A
0 3.14
0 0.5 1 1.5 2 2.5 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
Output Current (A) Input Voltage (V)
0.83 3.42
Reference Voltage (V)
0.82 3.38
Output Voltage (V)
0.81 3.34
0.80 3.30
0.79 3.26
0.78 3.22
0.77 3.18
IOUT = 1A VIN = 12V, VOUT = 3.3V
0.76 3.14
-50 -25 0 25 50 75 100 125 0 0.5 1 1.5 2 2.5 3
Temperature (°C) Output Current (A)
4.20 1.45
UVLO Voltage (V)
EN Threshold (V)
3.60 1.30
3.40 1.25
Falling
Falling
3.20 1.20
VOUT = 3.3V, IOUT = 0A VOUT = 3.3V, IOUT = 0A
3.00 1.15
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)
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RT7296F
Load Transient Response Output Ripple Voltage
VOUT VOUT
(50mV/Div) (20mV/Div)
VLX
IOUT (5V/Div)
VIN = 12V, VOUT = 3.3V,
(1A/Div) IOUT = 1.5A to 3A to 1.5A, L = 4.7H VIN = 12V, VOUT = 3.3V, IOUT = 3A, L = 4.7H
VOUT VOUT
(2V/Div) (2V/Div)
VEN VEN
(2V/Div) (2V/Div)
VLX VLX
(10V/Div) (10V/Div)
ILX ILX
(3A/Div) (3A/Div)
VIN = 12V, VOUT = 3.3V, IOUT = 3A VIN = 12V, VOUT = 3.3V, IOUT = 3A
VOUT VOUT
(2V/Div) (2V/Div)
VIN VIN
(10V/Div) (10V/Div)
VLX VLX
(10V/Div) (10V/Div)
ILX ILX
(3A/Div) VIN = 12V, VOUT = 3.3V, IOUT = 3A (3A/Div) VIN = 12V, VOUT = 3.3V, IOUT = 3A
Copyright © 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
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RT7296F
Application Information
The RT7296F is a high voltage buck converter that can 5V
support the input voltage range from 4.5V to 17V and
the input voltage range from 4.5V to 17V and the output
BOOT
current can be up to 3A. RT7296F 100nF
SW
Output Voltage Selection
The resistive voltage divider allows the FB pin to sense
Figure 2. External Bootstrap Diode
a fraction of the output voltage as shown in Figure 1.
Inductor Selection
R5 R1
FB VOUT
The inductor value and operating frequency determine
RT7296F R2
GND
the ripple current according to a specific input and
output voltage. The ripple current ΔIL increases with
Figure 1. Output Voltage Setting higher VIN and decreases with higher inductance.
For adjustable voltage mode, the output voltage is set V V
IL OUT 1 OUT
by an external resistive voltage divider according to the f L VIN
following equation : Having a lower ripple current reduces not only the ESR
R1 losses in the output capacitors but also the output
VOUT VFB 1
R2 voltage ripple. High frequency with small ripple current
Where VFB is the feedback reference voltage (0.8V can achieve highest efficiency operation. However, it
typ.). Table 2 lists the recommended resistors value for requires a large inductor to achieve this goal.
common output voltages. For the ripple current selection, the value of IL = 0.3
Table 2. Recommended Resistors Value (IMAX) will be a reasonable starting point. The largest
VOUT (V) R1 (k) R2 (k) R5 (k) ripple current occurs at the highest VIN. To guarantee
1.0 20.5 84.5 82 that the ripple current stays below the specified
3.3 40.2 13 16 maximum, the inductor value should be chosen
5.0 40.2 7.68 16 according to the following equation :
VOUT VOUT
L 1
f IL(MAX)
External Bootstrap Diode
VIN(MAX)
Connect a 100nF low ESR ceramic capacitor between
The inductor's current rating (caused a 40°C
the BOOT pin and SW pin. This capacitor provides the
temperature rising from 25°C ambient) should be
gate driver voltage for the high side MOSFET. It is
greater than the maximum load current and its
recommended to add an external bootstrap diode
saturation current should be greater than the short
between an external 5V and BOOT pin, as shown as
circuit peak current limit.
Figure 2, for efficiency improvement when input voltage
is lower than 5.5V or duty ratio is higher than 65% .The CIN and COUT Selection
bootstrap diode can be a low cost one such as IN4148 The input capacitance, CIN, is needed to filter the
or BAT54. The external 5V can be a 5V fixed input from trapezoidal current at the source of the top MOSFET.
system or a 5V output (PVCC) of the RT7296F. To prevent large ripple current, a low ESR input
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RT7296F
capacitor sized for the maximum RMS current should ceramic capacitors with trace inductance can also lead
be used. The RMS current is given by : to significant ringing.
VOUT VIN
IRMS IOUT(MAX) 1 Thermal Considerations
VIN VOUT
For continuous operation, do not exceed absolute
This formula has a maximum at VIN = 2VOUT, where
maximum junction temperature. The maximum power
IRMS = IOUT / 2. This simple worst-case condition is
dissipation depends on the thermal resistance of the IC
commonly used for design because even significant
package, PCB layout, rate of surrounding airflow, and
deviations do not offer much relief.
difference between junction and ambient temperature.
Choose a capacitor rated at a higher temperature than
The maximum power dissipation can be calculated by
required. Several capacitors may also be paralleled to
the following formula :
meet size or height requirements in the design. The
PD(MAX) = (TJ(MAX) TA) / θJA
selection of COUT is determined by the required
where TJ(MAX) is the maximum junction temperature,
Effective Series Resistance (ESR) to minimize voltage
TA is the ambient temperature, and θJA is the junction
ripple. Moreover, the amount of bulk capacitance is
to ambient thermal resistance.
also a key for COUT selection to ensure that the control
For recommended operating condition specifications,
loop is stable. Loop stability can be checked by viewing
the maximum junction temperature is 125°C. The
the load transient response as described in a later
junction to ambient thermal resistance, θJA, is layout
section. The output ripple, VOUT, is determined by :
dependent. For TSOT-23-8 (FC) package, the thermal
1
VOUT IL ESR resistance, θJA, is 70°C/W on a standard four-layer
8fCOUT
thermal test board. The maximum power dissipation at
The output ripple will be highest at the maximum input
TA = 25°C can be calculated by the following formula :
voltage since IL increases with input voltage. Multiple
PD(MAX) = (125°C 25°C) / (70°C/W) = 1.428W for
capacitors placed in parallel may be needed to meet
TSOT-23-8 (FC) package
the ESR and RMS current handling requirement. Dry
The maximum power dissipation depends on the
tantalum, special polymer, aluminum electrolytic and
operating ambient temperature for fixed TJ(MAX) and
ceramic capacitors are all available in surface mount
thermal resistance, θJA. The derating curve in Figure 3
packages. Special polymer capacitors offer very low
allows the designer to see the effect of rising ambient
ESR value. However, it provides lower capacitance
temperature on the maximum power dissipation.
density than other types. Although Tantalum capacitors
have the highest capacitance density, it is important to
only use types that pass the surge test for use in
switching power supplies. Aluminum electrolytic
capacitors have significantly higher ESR. However, it
can be used in cost-sensitive applications for ripple
current rating and long term reliability considerations.
Ceramic capacitors have excellent low ESR
characteristics but can have a high voltage coefficient
and audible piezoelectric effects. The high Q of
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RT7296F
1.5
Layout Considerations
Maximum Power Dissipation (W)1
Four-Layer PCB
For best performance of the RT7296F, the following
1.2 layout guidelines must be strictly followed.
Input capacitor must be placed as close to the IC as
0.9
possible.
0.6 SW should be connected to inductor by wide and
short trace. Keep sensitive components away from
0.3
this trace.
0.0
Keep every trace connected to pin as wide as
0 25 50 75 100 125 possible for improving thermal dissipation.
Ambient Temperature (°C)
SW
EN/SYNC SW
6
PG
8
R1 FB
VOUT CIN
Via can help to reduce
R2 power trace and improve
PVCC GND
Css thermal dissipation.
The feedback components
must be connected as close Input capacitor must be placed as close
to the device as possible. to the IC as possible. Suggestion layout
trace wider for thermal.
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RT7296F
Outline Dimension