TLC-350XIV AUTOMATIC SOLDERING SYSTEM INSTRUCTION MANUAL Serial Number No. J1407222 > Manufacture SEICIPTEC SEITEC CO., LTD. Tokyo Office/Plant: 6-13 Hiyoshi Hachioji Tokyo 193-0836 TEL: 042-625-5161 (Switchboard) FAX: 042-622-9227Preface Thank you for buying our TLC-60XIV. This instruction manual is designed to provide necessary information for TLC-50XIV to perform as designed and ensure the safety of operators, Please contact your dealer of purchase or our customer service for further informat ion. TON-V— Instruction manual Table of contents I. Specifications 1. Dimensions of PCB I-14 2. Installation requirements I-14 3. System’ s specifications 1-2 I. Installation instruction 1. How to install r-1 2. How to connect power, exhaust air duct r-1 se cate oae II. Basic set values ‘l 1, Solder bath basic set value m-1 2.Preheater basic set value m1 3. Transport conveyor basic set value m1 [v. Caution a V. Preparation 1. What to prepare v1 2,Solder bath preparation v4 3.Proparation of finger cleaning v-5 VI. Handl ing procedures 1.Preparation of operation Wt 2.Operation of each unit vist __3.At the end of operation Ww VI. How to handle each unit 1.Calendar timer w-1 2.Solder bath unit wWI-9 3.Solder temperature regulator vI-10 4,Chip flow, finish flow w-145.Height adjustment of center plate and back plate for finish flow 6. Intermittent flow 7. Preheater 8. Transport conveyor 9. Entrance guide conveyor 10. Exit conveyor 11. Cool ing fan 12, Hoodl ight (option) 13. Finger cleaning 14, Emergency stop switch 15. Surface hot wind & heat shooting formula preheater Wl. Troubleshoot ing 1. Troubleshooting IX. User’ s maintenance T.Why maintenance is important 2.Solder bath 3. Preheater 4.Finger cleaning 5. Transport: conveyor 6. Torque |imiter Maintenance and inspection quick chart X. Guarantee 1, Duration of guarantee 2.Range of guarantee 3. Guarantee system XI. Parts list 1.Solder bath unit 2. Finger cleaning unit 3. Preheater unit 4. Conveyor unit [Accompanying information wW-16 w-18 w-21 w-24 wW-25 W-26 wW-26 wW-26 wW-26 wW-26 wW-27 XI-1 xI-1 xI-1 Electrical dataI. Specifications1. Dimensions of PCB Installation requirements — TLC-350xIV Width 50nn~350nm Length 100nm~350nm Hei ght tmm~ 2m Carrier hold Min, 2mm on both ends Lead on POB back side Max. Tom Part height on PCB surface Wax. 100mm 2. Installation requirements Dimensions of body — L260Onm x W1350nm x H1 650mm (When PCB loading height is 900mm, without exhaust air duct) Qe’ ght Approx. 1400Kg (without solder) @Power supply AC3B0V 3-phase @Pass line POB loading height is 900mm PCB transporting angle 4~6° (var iableness) ©PCB transporting direction Left--Right Carrier rail on near side is standard Paint color Body : Japan Paint Manufactures Association 440 @®lotal power consumption 27. SKVA -1-4—3. System’ s specifications @Calendar timer for automatic melting of solder @Speed variable transport conveyor @Radiant heating preheater with digital temperature regulator @Solder bath for Pb froo soldering Double solder jet nozzles for the restricted space @enter plate & back plate height adjusting mechanism for finish flow @Solder bath automatic UP/DOHN unit @Transport finger cleaning unit @ool ing fan @entrance guide conveyor @Exit conveyor @Intermittont flow mechanism Hood Hight ah aisI. Installation instruction1. How to instal! «Turn the six adjustment bolts until PCB loading height (PCB entrance) reaches 900rm above floor level. Then adjust the bolts so that the entire system levels, Check if all the adjustment bolts support the system evenly, and then lock the bolts with lock nuts. (Caution : Failure to maintain the main body in @ horizontal position will affect, soldering conditions. Always use a level to check to the system stays| horizontal 2. How to connect power, exhaust air duct Power connection + Put a power cable through a distribution hole located on the lover left side of control box and connect power supply of the capacity specified below with the primary end terminal (the terminal on the upper side of main breaker) Connect an earth cable with the earth cable terminal (the leftmost terminal on the terminal block) AC3B0V 3-phase 27. SKVA (Caution : Ensure that earth is comected. | 2. Exhaust air duct connection + This system is not equipped with exhaust power and requires a duct (flow rate specified below) to be connected. Please seek advice from ductwork specialists for the discharge flow rate of the duct, [Caution : Ensure that exhaust damper is connected to the exhaust air duct of the plant side 15m°/min or above Outer diameter 246mm 3% We regret to inform our customers that we cannot cover the cost of poner, exhaust air duct connection.Il. Basic set valuesSolder bath basic set value *Solder temperature 230°C~290°C (Solder ready temperature : set value+5°C) Preheater basic set value + Preheating temperature 80°C~120°C (PCB backside temperature) Transport conveyor basic set value “Conveyor speed 0. 8n/min~1, 5m/min [Caution : Note that these values are merely set values. Therefore they are not applicable to all the soldering operations. Please set proper values according to the actual PCB to be soldered.IV. CautionEnsure that the exhaust air duct is in operation before activating this system Warning : Failure to operate the exhaust air duct might cause fire due to vaporized flux or thinner as well as due to the heat highly charged in ‘the cabinet. Ensure that the system cones to a complete stop before carrying out maintenance work or lubricating for the drive unit. Warning : When maintenance work or lubricating is carried out while the system is in operation, there is a risk of worker’ s hand or clothes being caught or dragged, In conducting checking or maintenance work, do not remove the cover while solder is being melted. Narning : Danger of burning or injuries. Solder might spatter while solder is being melted. Maintenance work in solder bath needs to be carried out while solder is in molten state, Therefore carefully protect yourself from getting burned or injured by avoiding exposure of your skin and by wearing long sleeves, leather gloves, dustproof glasses, etc. It must be absolutely ensured that there are no inflamnables in the work area . Always operate the system with equipment cover. Alterations to the system should be made only by the manufacture or your dealer of purchase. [Caution : Our guarantee will not cover conditions caused by improper use or alterations given to the system even within the duration of the guarantee. | aV. Preparation1. What to prepare Finger cleaner Min. 2 litters (isopropyl! alcohol) @solder Min, 250 Ke (In case of Pb free solder) 2. Solder bath preparation 1, Pulling out the solder bath @Lower the pullout table for the solder bath. _| 3% Lover solder bath pullout table Use adjustment bolts to keep the pullout table for the solder bath in a horizontal position. 2% Even up solder bath pul lout table Pullout table edjustaont bolts Us \ eee i@Press the solder bath [DOWN] switch to bring the solder bath to its lower end. 3The solder bath lower end relates to the position that the solder bath stops its downward movement with the solder bath [DOWN] switch [ON] Warning : To pull out the solder bath without lowering the solder bath might damage not only fingers of the transport conveyor but also the conveyor system itself. @Press the solder bath [OUT] switch to bring the solder bath to its drawer end, 2The solder bath drawerr end relates to the position that the solder bath stops its downward movement with the solder bath [OUT] switch [ON] Warning : Carefully pull out the solder bath to avoid spills from the solder bath, 4 2 Pull out solder bath “vo@At the completion of the solder replacement and maintenance work, turn the solder bath pul lout handle clockwise and push the solder bath until it reaches the solder bath push-in position. > The solder bath push-in position is the position that the solder bath Pullout handle can nol be Lurned any further. 3 Puch in soldor bath Solder bath pullout hand caution : Ensure that the solder bath is securely pushed into its push-in position. Failure to locate the solder bath in its push-in position will affect meeting soldering conditions. Warning : Carefully push in the solder bath to avoid spills from the solder bath.Press the solder bath [UP] switch to lift the solder bath to the soldering position. 3KTo stop the solder bath, it is not required to reach the upper end of the solder bath (position that the solder bath stops its upward movenent with ‘the solder bath [UP] switch [ON]) Warning : Ensure that the solder bath is in its push-in position to lift the solder bath. @Place the solder bath pullout table in the cabinet. Put in solder bath pul lout table caution: It is important for the solder bath pullout table to be properly put back in to ensure operator’ s safety, ayaa2. Solder preparation @ Prepare molten solder in another solder bath and fill it in the solder bath of this system. Warning : Danger of burning or injuries in filling solder. Also ensure that Unere are no inf lamab les around, Caution : Never start heaters of the solder bath without filling solder past e Risk of the solder bath being overheated, @ Refer to the Figure below for the proper volume of the solder to be filled ‘Section view of solder bath | wSolder Level upper limit 3. Preparation of finger cleaning @ Pour 2 litters or more of cleaner into a container (Container with 18 litter cleaner can be used to carry out cleaning. ) @ First insert a suction hose of a finger cleaning pump into a filter pipe and ‘then insert the hose together with the drain hose of the finger cleaning tank (2 hoses in total) into the container. (Caution: Failure to insert the suction hose into the filter pipe will cause clogging in the hose due to foreign particle or debris sucked in and in the worst case it will cause damages to the finger cleaning pump. V6:VI. Handling procedures1. Preparation of operation 1. Power [ON} ® Turn [ON] the main breaker in the control box. 3X Poner light is then i | luminated. @ Turn [ON] Calendar Timer, > Then the heater in the solder bath is activated. Each unit is activated with the power switch [ON] 2. Operation of each unit 1, Solder bath heater + When power is ON, turn [ON] the calendar timer to activate the solder temperature regulator in order to contro! soldering temperatures according to the set values of the solder temperature regulator 3 Please enter preset values for the solder temperature regulator by referring to: 3. Solder temperature regulator 2. Transport. conveyor @ Turn [ON] a power switch of the conveyor: 3X Then a speed meter of the conveyor displays the speed. ® The transport conveyor is then activated. 3. Entrance guide conveyor ~The entrance guide conveyor is activated simultaneously with the transport conveyor. Therefore, when the transport conveyor is activated, the entrance guide conveyor is activated as well. 4, Exit conveyor +The exit conveyor is activated simultaneously with the transport conveyor. Therefore, when the transport conveyor is activated, the exit conveyor is activated as well 5. Preheater 2X Make sure to activate the transport conveyor when activating the preheater. @Turn [ON] a power switch of the preheater 2lhen working a conveyor, the preheater heating doesn’t start up. The preheater heating start-up switch blinks. @lhe preheater temperature regulator is activated and it controls the proheating tomporatures according to its set values, % Please enter preset values for the preheater tenperature regulator by referring to: VI. How to handle each unit | 8. Preheater V1 —6. chip flow < Ensure that “solder ready” ight illuminates. Chip flow is activated only when “solder ready” light is [ON] @Turn [ON] chip flow switch Chip flow is then activated. 7. Finish flow 9K Ensure that “solder ready” light illuminates. Finish flow is activated only when “solder ready” light is [ON]. @Turn [ON] “finish flow” switch. @Finish flow is then activated 8 Finish flow center plate & back plate height adjusting mechanism < Ensure that “solder ready” light illuminates. Never move the center plate & back plate up and down while solder is in solid state. Please refer to: ‘Wi. How to handle each unit 6. Height adjustment of center plate and back plate for finish flow 9. Solder intermittent flow @Activate the chip flow and the finish flow. @turn “intermittent flow” switch CON] @Then both the chip flow and the finish flow are switched to the standby flow state. 10. Finger cleaning @Turn [ON] “finger cleaning” switch. @Finger cleaning pump is activated and finger cleaner circulates. 11. Cool ing fan @Turn [ON] “cooling fan” switch. ool ing fan is activated. 12, Hood light (option) @Turn [ON] “Hood light” switch. @Ihe hood light i! luminates. Caution: AI units use alternating switch. Switch [ON] holds [ON] status. Press the switch one more time to turn it (OFF) —vi-2-3. At the end of operation 1. When using calendar timer to turn on the system on the following day Get the calendar timer for ON/OFF time. ) @Ensure that all the PCBs in the system have been carried out. @Stop the chip flow, finish flow, ultra wave, preheater, transport conveyor and finger cleaning and turn off the interior cabinet lighting. @alendar timer is set for OFF time. When the time comes, the calendar timer is switched [OFF] and the system will shut off. Another way to switch off the calendar timer is to turn [OFF] the “day” selection switch corresponding to the current day of the week Caution : When switching [OFF] the “day” selection switch and turning off the calendar timer, make sure to switch it [ON] the next day. Failure to do so prohibits calendar timer fron activating the system on the same day next week. 3€ Activate the chip flow, finish flow, ultra wave, preheater, transport conveyor and finger cleaning, turn on the interior cabinet lighting and open the main air regulator valve (foaming fluxer : when equipped as option) before starting work operations the next day. Caution : When activating the system with the calendar timer, do not shut off l mmain breaker or primary power supply. %& Please preset the calendar timer for ON/OFF time by referring to: va Hk 2. When activating the system manually on the next day: @Ensure that al! the PCBs in the system have been carried out. @stop the chip Flow and the Finish flow. @shut off the main breaker and primary power supply. handle each unit | 1. Calendar timer -vI-3—Vil. How to handle each unit1. Calendar timer (SSC-502) (1) Nanes and functions of front panel components (DDveplay pane! oor BB} } omc a OR toy nee svt a u q | cH bel bo) Cop Eke] — coroner maen @rwe key @set oy Boxy key = Betear hoy Onteste ey Acree key ON dspiey eo Baad | oF F display ee fi Toe deci ; ee cepey LONG espa — rc tay Dayeotwok——_te vv eh vv Display Displays current time, [ON] time, [OFF] time, ON/OFF status. @bay of the week selection sil Used to set-up ON/OFF according to day of the week. @lode switch + TIME : Set-up current time and day of the week. + AUTO : Run AUTO operation by program and day selection Si + PROG : Execute programming, @R-key Resets timer and selects DAY / PULS / LONG “DAY: Max. setting 24 hrs, Run same routine operation daily ~PULS : Pulsed operation by short time output LONG : Long hours of timer operation. Caution ! This system uses DAY mode only. SOutput sh ON: Manually hold ON status for output. + AUTO: Run AUTO operation by program and day selection SW “OFF —: Hold OFF status for output. —W-1-@Time key ‘Minute key Used to set-up current time and program time. Day key Used to set day of the week @et key Used to lock entered information @Clear key Used to clear preset program time. Check key Used to acknowledge program time. Press Time key, Minute key, Day key, Acknowledge key for 1 sec or more for continuous forwarding. (2) Setting current time (Example: current time is 10:35 a.m Monday) «Initial display (In case preset has been done, display shows current time and day.) DAY! SUN MON TUE WED THU FRI GAT @shift mode switch to [TIME] SUN MON TUE WED THU FRE SAT —w-2-